JP4202053B2 - Taping device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a taping device in which chip parts are sequentially loaded in each storage groove in a storage tape, and an opening on the upper surface of the storage groove is closed with a cover tape.
[0002]
[Prior art]
In this type of conventional taping device, chip parts are sequentially loaded into the respective storage grooves in the storage tape at one fixed loading position. The loaded chip part is inspected with an inspection device, and if it is found to be defective, the chip part is taken out by a dedicated take-out nozzle and stored in the part storage tray, or the operator takes it out by hand. In order to perform recovery loading, the storage tape is returned to the loading position again, and chip components are loaded by suction loading nozzles or manually loaded.
[0003]
[Problems to be solved by the invention]
However, in the recovery method as described above, a mechanism for returning the storage tape to the loading position again is required, the structure becomes complicated, and if the operator manually recovers, a burden is imposed on the operator.
[0004]
Accordingly, an object of the present invention is to provide a taping device capable of performing recovery loading automatically and without returning the storage tape to the loading position.
[0006]
[Means for Solving the Problems]
For this reason, the first invention is a taping device in which chip parts are sequentially loaded in the respective storage grooves in the storage tape, and the opening on the upper surface of the storage groove is closed with a cover tape. A plurality of suction loading nozzles that are placed in the storage groove are disposed at a predetermined interval and intermittently rotate and stop when two suction loading nozzles are positioned above the storage tape; An inspection device for inspecting a chip component inserted into the storage groove, and when it is judged as defective by the inspection by the inspection device, the preceding suction of the two suction loading nozzles The chip component is taken out from the storage groove by a loading nozzle, and the chip component is loaded into the taken-out storage groove by a subsequent suction loading nozzle.
[0007]
According to a second aspect of the present invention, there is provided a taping apparatus in which chip parts are sequentially loaded in each storage groove in the storage tape, and an opening on the upper surface of the storage groove is closed with a cover tape. A plurality of take-out nozzles are disposed at a predetermined interval and a plurality of suction loading nozzles are disposed at a predetermined interval. A reversing device that includes a second rotating plate that rotates intermittently, and that reverses the suction take-out nozzle after taking out the chip component. The reversing device is provided on the first rotating plate, and the suction take-out nozzle is turned upside down by the reversing device. When the suction loading nozzle of the second rotating disk takes over the parts, and when the second rotating disk is intermittently rotated and stopped, the two suction loading nozzles are located above the storage tape. That.
[0008]
According to a third aspect of the present invention, there is provided a taping device in which chip parts are sequentially loaded into each storage groove in the storage tape, and the opening on the upper surface of the storage groove is closed with a cover tape. A plurality of take-out nozzles are disposed at a predetermined interval and a plurality of suction loading nozzles are disposed at a predetermined interval. A reversing device that includes a second rotating plate that rotates intermittently, and that reverses the suction take-out nozzle after taking out the chip component. The reversing device is provided on the first rotating plate, and the suction take-out nozzle is turned upside down by the reversing device. When the suction loading nozzle of the second rotating disk takes over the parts, and when the second rotating disk is intermittently rotated and stopped, the two suction loading nozzles are located above the storage tape. That.
[0009]
A fourth invention is characterized in that, in the first to fourth inventions, the suction loading nozzle is rotatable about its axial direction by a rotating device.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a taping device of the present invention will be described with reference to the drawings. First, the taping device will be described with reference to the plan view of the taping device in FIG. 1, the same front view in FIG. 2, and the right side view in FIG. Reference numeral 1 denotes a taping device main body. A carrier tape supply reel 3 is rotatably locked to a pin 2 erected on a side wall portion of the main body 1, and a tape main body (also referred to as a carrier tape) wound around the tape supply reel 3. The take-up and storage reel 9 is provided via a transport rail 8 having a transport path such as a pulley 5, feed pulleys 6 and 7, and a tape body 4A for applying a proper tension to the tape body 4A. It is fixed to.
[0011]
Then, the tape body 4A is stored while the tape body 4A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up storage reel 9 by a rotation driving system (not shown). After the chip component A is inserted into the groove 4B and further conveyed to a predetermined position and the opening on the upper surface of the storage groove 4B is covered with the cover tape 4C supplied from the cover tape supply reel 10, the winding storage reel 9 It will be wound up. As described above, the storage tape 4 is formed by the tape body 4A provided with the storage grooves 4B at a predetermined interval and the cover tape (top tape) 4C that is pressure-bonded to the upper surface thereof. The tape body 4A is formed of a bottom tape and a spacer.
[0012]
The feed pulleys 6 and 7, the transport rail 8, the cover tape supply reel 10 and the like are provided on the mounting plate 11. A Y table 15 that is driven by a Y-axis drive motor 13 and is guided by a guide 14 to move in the Y direction is provided on a fixed plate 12 that is fixed to the taping device main body 1. An X table 18 that is driven by an X-axis drive motor 16 and is guided by a guide 17 to move in the X direction is provided, and the mounting plate 11 is fixed to the X table 18. Therefore, when the X table 18 and the Y table 15 are moved by driving the X axis drive motor 16 and the Y axis drive motor 13, the transport rail 8 and the tape that moves along the transport rail 8 via the mounting plate 11 are moved. The main body 4A and the like can move in the XY directions.
[0013]
A Y table 21 that can be moved in the Y direction by a Y axis drive motor 20 is provided on the taping device main body 1, and can be moved in the X direction by an X axis drive motor 22 on the Y table 21. A chip component supply table 24 is provided via the X moving body 23. A wafer affixed to the sheet is diced on the supply table 24 and is divided into individual dies (hereinafter referred to as “chip parts A”), and fixed with the surface having terminals as the upper surface. The chip component A is picked up and taken out by a suction pick-up nozzle 26 described later while being pushed up by a push-up pin (not shown) from the back surface.
[0014]
On the upper mounting plate 25 fixed to the taping device main body 1, for example, eight suction extraction nozzles 26 for taking out the chip components A from the chip component supply table 24 are arranged at a peripheral portion at a predetermined interval. A first rotating disk 27 intermittently rotated by the cam unit 30 and eight suction loading nozzles 28 for loading the chip component A into the storage groove 4B are provided at a peripheral portion with, for example, eight indexing cams. A second rotating disk 29 that is intermittently rotated by the unit 31 is provided.
[0015]
In addition, as shown in FIG. 4, a synchronous intermittent rotation device for synchronously rotating the first and second rotary disks 27 and 29 is provided. That is, the second rotating disk 29 is intermittently rotated by the indexing cam unit 31 via the coupling 32 and the drive shaft 19A by driving the drive motor 19, and the pulley 33A provided at the end of the drive shaft 19A and the like. Since the timing belt 33C is stretched between the pulley 33B and the pulley 33B, the drive of the drive shaft 19 is transmitted to the driven shaft 34 via the timing belt 33C and is driven by the indexing cam unit 30 via the driven shaft 34. The first rotating disk 27 is rotated intermittently synchronously. That is, since the first and second rotary disks 27 and 29 having the same number of indexes can be synchronously and intermittently rotated by driving the drive motor 19, the rotation does not shift. Therefore, since the nozzles 26 and 28 of the two rotary disks 27 and 29 can be made to correspond reliably, the chip component A can be reliably delivered. Further, by making the rotation radii of both the rotating disks the same, the rotation indexing accuracy (resolution) can be made the same. Further, the drive motor 19 can be used for intermittent rotation of both the first and second rotating disks 27 and 29, and the mechanism or rotation control of the synchronous intermittent rotation device can be simplified.
[0016]
Next, the component take-out mechanism 35 will be described in detail based on FIG. For example, eight suction / extraction nozzles 26 are arranged on the peripheral portion of the first rotating disk 27 at a predetermined interval, and each suction / extraction nozzle 26 is provided by each reversing device 36 so as to be vertically inverted. . That is, when the drive shaft 39 is rotated via the coupling 38 by the driving of the reverse drive motor 37, the attachment body 40 fixed to the drive shaft 39 is also rotated, and the take-out nozzle 26 is inverted upside down. Further, since the guide 42 can move up and down along the guide 41 provided on the mounting body 40, the take-out nozzle 26 attached to the nozzle mounting body 43 fixed to the guide 42 can move up and down. The upper body 40A of the mounting body 40 and the lower side 43A of the nozzle mounting body 43 are always urged upward by a spring 44, but the stopper 45 is locked to the upper side 40A of the mounting body 40. This limits the upper limit.
[0017]
Further, the suction take-out nozzle 26 can be lowered when the operating portion 48A of the operating body 48 that can be moved up and down by the guide 47 by driving the Z-axis drive motor 46 presses the head of the nozzle mounting body 43, For example, the chip part A on the chip part supply table 24 can be taken out.
[0018]
Next, the component loading mechanism 50 will be described in detail with reference to FIG. For example, eight suction loading nozzles 28 are arranged on the peripheral edge of the second rotating disk 29 at a predetermined interval, and the suction loading nozzles 28 are rotated about the axial direction by each rotating device 51. Provided possible. That is, a transmission belt 55 is stretched between a pulley 53 provided on the drive shaft of the θ-axis drive motor 52 and a pulley 54 provided around the suction loading nozzle 28, and the suction loading nozzle 28 and a hollow cylinder described later. The body 62 is rotatably provided on the second rotating disk 29 via a bearing 56. The suction loading nozzle 28 is guided by the guide 61 when the operating portion 59A of the operating body 59 that can be moved up and down by the guide 58 by the drive of the Z-axis drive motor 57 presses the projection 60A of the nozzle mounting body 60. The chip component A that is sucked and held can be loaded into the storage groove 4B of the tape body 4A on the transport rail 8. That is, the suction loading nozzle 28 can move up and down in the hollow cylindrical body 62 around it, and can rotate θ together with the hollow cylindrical body 62.
[0019]
Here, based on FIG. 14, a control block diagram of the taping device will be described. 91 is a CPU as a control device that controls the operation related to loading of the chip component A of the taping device, and 92 is for each type of chip component A. The RAM (Random Access Memory) and 93 are ROM (Read Only Memory) for storing the thickness data of each, the height level data for each suction take-out nozzle 26, and the like. Based on the data stored in the RAM 22, the CPU 21 controls the operation related to the loading of the chip component A of the taping device according to the program stored in the ROM 23. That is, the CPU 91 controls the driving of each driving motor via the driving circuit 94 and the interface 95.
[0020]
A recognition processing device 96 is connected to the CPU 91 via the interface 95. The recognition processing device 96 performs recognition processing of an image captured by each recognition camera. Is sent out. That is, the CPU 91 outputs an instruction to the recognition processing device 96 so as to perform recognition processing (calculation of the amount of displacement) of the images captured by each recognition camera, and receives the recognition processing result from the recognition processing device 96. is there.
[0021]
Next, as shown in FIGS. 7 and 8, the station located at 12:00 of the first rotating disk 27 is a suction extraction station where the suction extraction nozzle 26 sucks and extracts the chip component A from the chip component supply table 24. is there. In this suction take-out station, the chip part A to be taken out next on the chip part supply table 24 is picked up by the part recognition camera 63 while the first turntable 27 is swung, and the position of the chip part A is recognized. A recognition process is performed at 96, and the CPU 91 drives the Y-axis drive motor 20 and the X-axis drive motor 22 so as to be positioned immediately below the suction extraction nozzle 26 from which the chip component A to be extracted is moved to supply the chip components. The table 24 is moved, and at this suction and extraction station, the chip component A on the chip component supply table 24 is driven by the Z-axis drive motor 46 so that the suction loading nozzle 28 is lowered and sucked out.
[0022]
Next, when the drive motor 19 is driven, the second rotating disk 29 is intermittently rotated clockwise by the indexing cam unit 31 and the first rotating disk 27 is synchronously intermittently rotated counterclockwise by the indexing cam unit 30. The station of the first rotating disk 27 that rotates intermittently in the counterclockwise direction and stops is the reversing station that vertically flips the chip part A held by the suction take-out nozzle 26 by the reversing device 36, and the next is This is a recognition station in which the position of the inverted chip component A is imaged by the component recognition camera 65 and recognized by the recognition processing device 96.
[0023]
Next, a printing station which is reversed by the reversing device 36 and prints by the printing device 66 on the chip part A having the printing surface as the upper surface and the surface having the terminals as the lower surface will be described below with reference to FIG. An X table 70 that is movable in the X direction via a guide 69 is provided by an X axis drive motor 68 fixed to the mounting plate 67. Further, a Y axis drive motor 71 passes a guide 72 over the X table 70. A Y table 73 that is movable in the Y direction is provided. An ink jet printing unit 78 is provided on a Z moving body 77 that moves in the Z direction by a Z-axis drive motor 74 via a guide 76 provided on a fixed plate 75 on the lower surface of the Y table 73.
[0024]
That is, the printing unit 78 is movable in the XY direction and the Z direction, and the CPU 91 performs the X-axis drive motor 68 and the Y-axis drive motor 71 based on the position recognition result of the chip component A by the recognition processing device 96 in the recognition station. In the state in which the XY direction is corrected during the turning movement of the first rotary disk 27 from the recognition station, the chip component is moved by the printing unit 78 lowered by the Z-axis drive motor 74 at the next printing station. A serial number etc. is printed on A. Accordingly, since the printing is performed on the chip component A in the position-corrected state, the printing accuracy can be improved, and the thickness data for each type of chip component stored in the RAM 92 and each suction take-out nozzle 26 can be improved. If the CPU 91 controls the movement stroke of the printing unit by the Z-axis drive motor 74 in accordance with the data using the height level data, the distance between the sucked chip component and the printing unit 78 during printing is constant. The printing accuracy can be improved. The stroke control may be performed based on the thickness data or height level data, or based on both data.
[0025]
As described above, after the chip part A is sucked and taken out from the chip part supply table 24 by the suction pick-up nozzle 26, it is turned upside down by the reversing device 36 and printed by the printing unit 78 with the chip surface facing upward. Since it is a thing, reduction of the man-hour etc. of sheet replacement can be aimed at.
[0026]
The next curing station 79 is a station that dries the ink printed by the printing unit 78 with warm air from a warm air device (not shown).
[0027]
The sixth station rotated counterclockwise with the suction extraction station as the first is a delivery station, and the chip part A of the suction extraction nozzle 26 turned upside down by the reversing device 36 is replaced with the suction loading nozzle of the second rotary disk 29. Pass to 28. In other words, the second turntable 29 is handed over at the transfer station of the second turntable 29, and the second turntable 29 rotates in the clockwise direction so that the mounting station and the recovery loading station (the transfer station is the first and the sixth and seventh positions). The rotary disks 27 and 29 are disposed so that the suction loading nozzle 28 is positioned above the tape body 4A of the tape 4.
[0028]
That is, when the second rotating disk 29 is disposed so that the two suction loading nozzles 28 are positioned above the tape body 4A of the tape 4, the rotating disks 27 and 29 rotate intermittently in 8 divisions. The angle formed by the center of the second rotating disk 29 in the station, the line connected to the suction loading nozzle 28 and the traveling line of the tape 4 is 67.5, and the delivery station of the first rotating disk 27 and the second rotating disk Both rotary disks 27 and 29 are arranged so as to be shifted by 22.5 degrees from the 29 transfer stations.
[0029]
The next station after the inheriting station of the second turntable 29 is a first inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, Whether or not the current value is within a predetermined range stored in the RAM 92 is checked. Here, if it is not within the predetermined range, the CPU 91 controls not to load the tape body 4A but to store it in a dedicated tray (not shown) described later.
[0030]
The next station after the first inspection station is a second inspection station that inspects the characteristics of the chip component by the characteristic inspection device 82, and is a station that conducts a continuity inspection to check whether a current flows through the chip component, for example. Here, if it is inspected by the characteristic inspection device 82 that no current flows, the CPU 91 performs control so that it is not loaded in the tape body 4A but is stored in the dedicated tray.
[0031]
At the next recognition station, a loaded component recognition camera 83 is disposed. The chip component A sucked and held by the suction loading nozzle 28 is imaged by the loaded component recognition camera 83, and the nozzle of the chip component A is picked up by the recognition processing device 96. And the appearance inspection (whether there are a predetermined number of bumps, etc.). If a defective chip component is determined by this appearance inspection, the CPU 91 controls the tape body 4A to be stored in the dedicated tray without being loaded.
[0032]
The next loading station is provided with a loading position recognition camera 84 for recognizing the position of the storage groove 4B of the tape body 4A on the transport rail 8, and is to be loaded while the second turntable 29 is swung. The storage groove 4 </ b> B is imaged and the position is recognized by the recognition processing device 96.
[0033]
Accordingly, after the chip part A is imaged by the loading part recognition camera 83 and the storage groove 4B is imaged by the loading position recognition camera 84, the position of the chip part A sucked and held by the suction loading nozzle 28 by the recognition processing device 96 is recognized. Based on the result, the CPU 91 corrects and controls the Y-axis drive motor 13 and the X-axis drive motor 16 in the XY direction, and the θ direction, that is, the plane direction. The θ-axis drive motor 52 is corrected and controlled for the angle at. For this reason, the chip component A can be loaded into the appropriate position in the storage groove 4B by the suction loading nozzle 28 that is lowered by the drive of the Z-axis drive motor 57. Accordingly, since the correction operation in the X and Y directions is performed on the tape body 4A side and the θ correction operation is performed on the suction loading nozzle 28 side, the movable portion can be reduced in weight and high speed compared to the structure in which all is performed on the suction loading nozzle 28 side. It can cope with the increase in functionality and multifunction.
[0034]
The scraping operation of the chip part A at this loading station will be described with reference to FIGS. As described above, the suction loading nozzle 28 is lowered by driving the Z-axis drive motor 57, and the chip component A is loaded into the storage groove 4B of the tape body 4A. At this loading, a vacuum path is connected to a vacuum source (not shown). The suction loading nozzle 28 communicated via the vacuum valve releases the vacuum by the switching operation of the solenoid valve and conversely drops the chip part A onto the bottom surface of the storage groove 4B by blowing air from the suction hole formed in the nozzle 28. Let Further, a vacuum suction hole 87 is formed in the transport rail 8 immediately below the storage groove 4B in which the chip component A is loaded, and this suction hole 87 is communicated with a vacuum source (not shown) for loading. The tape body 4A is sucked and held on the upper surface of the rail 8, and the chip component A is positioned in the space in the storage groove 4B by the lowering of the suction loading nozzle 28, and the tape body 4A is moved in the transport direction of the tape body 4A. The chip part A in a state of being located in the space in the storage groove 4B is brought into contact with the wall surface 4D forming the storage groove 4B, thereby being scraped off from the suction loading nozzle 28 and loaded and stored in the storage groove 4B.
[0035]
That is, the CPU 91 controls and drives the X-axis drive motor 16 in a state where the lower end of the suction loading nozzle 28 is lowered so as to be slightly above the upper surface level of the tape body 4A (lower limit level). The main body 4A is moved and brought into contact with the wall surface 4D forming the storage groove 4B, whereby the suction hole of the nozzle 28 is scraped off so as to communicate with the atmosphere, and is loaded and stored in the storage groove 4B. Accordingly, since the chip component A is scraped off and loaded in the storage groove 4B by moving not the suction loading nozzle 28 side but the tape body 4A side, the movable part for loading can be reduced in weight. In addition, the scraping operation is performed in a stable state since the suction hole 87 is communicated with a vacuum source and the tape body 4A is sucked and held on the upper surface of the transport rail 8.
[0036]
Further, a print inspection camera 85 is provided at the next recovery loading station, and the chip component A in the storage groove 4B located at this station is imaged while the second turntable 29 is swung, and the recognition processing device 96 The chip component A loaded on the tape 4 through the recognition process is inspected for printing and the direction of printing.
[0037]
If the CPU 91 determines that the CPU 91 is defective based on the recognition result of the recognition processing device 96, the suction loading nozzle 28 that has finished loading at the loading station takes out the chip part A from the storage groove 4B located at the recovery loading station. At this time, the suction loading nozzle 28 to be loaded at the loading station is controlled to stand by without being loaded. In this state, the CPU 91 intermittently rotates the second rotating disk 29 without moving the tape body 4A, and the next suction loading nozzle 28 is held in the storage groove 4B which has been taken out and emptied as described above. Control is performed so as to load the chip part A which has been performed, and the defective chip part is stored in an XY movable dedicated tray (not shown) at the next station. When the chip part A held by the suction loading nozzle 28 is loaded into the storage groove 4B, the scraping operation is performed as described above.
[0038]
As described above, since the two suction loading nozzles 28 can be positioned above the tape body 4A when the second rotating disk 29 is intermittently rotated and stopped, one is used as a loading station and the other as a loading station. The recovery loading station can be used, and recovery loading can be performed automatically without bothering the operator and without returning the storage groove 4B of the tape body 4A to the loading position.
[0039]
After the chip component A is inserted into the storage groove 4B of the tape main body 4A by the component loading mechanism 50, the tape main body 4A and the cover tape 4C are pressure-bonded by the tape crimping mechanism 86 and wound around the take-up storage reel 9. Will be taken.
[0040]
As described above, since each suction take-out nozzle 26 can be turned upside down by the reversing device 36 on the first rotating disk 27, it is downward when taking out the chip part A from the chip part supply table 24, and in the delivery at the delivery station. The work can be done in an upward orientation and at other work stations as needed. In addition, since the suction loading nozzle 28 is provided on the second turntable 29 so as to be rotatable about the axial direction by each rotating device 51, when the tape is loaded into the storage groove 4B of the tape body 4A, it is transferred to the dedicated tray. During the storage, the suction loading nozzle 28 can be rotated around the axial direction as necessary during other operations.
[0041]
Next, an embodiment in which two rows of transport rails 8 are provided will be described with reference to FIG. First, the transfer is performed at the transfer station of the second turntable 29, and when the second turntable 29 is rotated in the clockwise direction so that the transfer station is set to the first position, the fifth is set on the transport rail 8 in the first row. The seventh loading station is the recovery loading station as the first loading station for the tape body 4A, and the sixth loading station is the second loading station for the tape body 4A on the other transport rail 8A.
[0042]
That is, the two suction loading nozzles 28 are positioned above the tape body 4A in one row, and the suction loading nozzles 28 between the two suction loading nozzles 28 are positioned above the tape body 4A tape in the other row. The second turntable 29 is disposed on the first turntable 27, and the first turntable 27 is placed so that the suction takeout station of the first turntable 27 is the first and the fifth position rotated counterclockwise is the delivery station. Set up. Therefore, the two turntables 27 and 29 are arranged so that the delivery station of the first turntable 27 and the transfer station of the second turntable 29 are inherited without any deviation.
[0043]
Thus, the reason why the tape main bodies 4A are arranged in two rows is to classify the characteristics of the chip parts into two types and store them in each tape main body 4A corresponding to the rank. For example, the station next to the transfer station is a first inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, and the current value is stored in the RAM 92. The CPU 91 checks whether it is within the range and, if it is within the predetermined range, ranks the CPU 91 as to which of the two ranks it belongs according to the current value. Control is performed so that the storage groove 4B of the tape body 4A on the rail 8 is loaded into the storage groove 4B of the tape body 4A on the transport rail 8A when belonging to the other rank. If it is not within the predetermined range, the CPU 91 performs control so as not to load the tape main body 4A but to store it in a dedicated tray (not shown) that is not shown in the drawing. Note that each range of current values for each rank in the case of ranking is stored in the RAM 92.
[0044]
The recovery loading station is provided with a print inspection camera 85. During the turning movement of the second rotating disk 29, the chip component A in the storage groove 4B located in this station is imaged and recognized by the recognition processing device 96. The chip component A processed and inspected for the presence or absence of printing of the chip part A and the direction of printing are checked, and if the CPU 91 determines that the recognition processing unit 96 recognizes a failure, loading is performed at the first loading station. The completed suction loading nozzle 28 takes out the chip part A from the storage groove 4B located at the recovery loading station, and at this time, the suction loading nozzle 28 which was about to be loaded at the first loading station is controlled to wait without being loaded. Is done. In this state, the CPU 91 does not move the tape body 4A, but intermittently rotates the second rotating disk 29 by two pitches, and the next suction loading nozzle is placed in the storage groove 4B which has been taken out and emptied as described above. The chip part A held by the control unit 28 is controlled to be loaded, and the defective chip part is stored in the dedicated tray at the next station.
[0045]
As described above, the recovery loading function and rank loading function for chip parts can be performed without moving the suction loading nozzle and the transport rail, and the moving parts can be reduced as much as possible, contributing to energy saving. it can.
[0046]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0047]
【The invention's effect】
As described above, the present invention can provide a taping device capable of performing recovery loading automatically and without returning the storage tape to the loading position.
[Brief description of the drawings]
FIG. 1 is a plan view showing a taping device.
FIG. 2 is a front view of the taping device.
FIG. 3 is a right side view of the taping device.
FIG. 4 is a plan view for explaining synchronous rotation of the first and second turntables.
FIG. 5 is a diagram for explaining a component take-out mechanism.
FIG. 6 is a diagram for explaining a component loading mechanism.
FIG. 7 is a plan view of a stopped state of the first and second rotating disks.
FIG. 8 is a plan view of the first and second rotating discs during a turning movement.
FIG. 9 is a side view of the printing mechanism.
FIG. 10 is a longitudinal front view of a transport rail.
FIG. 11 is a vertical side view of a transport rail.
FIG. 12 is a longitudinal front view of the transport rail moved in the X direction.
FIG. 13 is a plan view of a taping device showing an embodiment in which two rows of transport rails are provided.
FIG. 14 is a control block diagram of the taping device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 4 Storage tape 4A Tape main body 4B Storage groove 4C Cover tape 8, 8A Conveying rail 24 Chip component supply table 26 Adsorption take-out nozzle 27 First turntable 28 Adsorption loading nozzle 29 Second turntable

Claims (4)

In a taping device in which chip parts are sequentially loaded into each storage groove in the storage tape and the opening on the upper surface of the storage groove is closed with a cover tape, the chip part from the chip part supply unit is loaded into the storage groove. When a plurality of loading nozzles are arranged at predetermined intervals and intermittently rotate and stopped, two suction loading nozzles are provided with a rotating disk positioned above the storage tape and inserted into the storage groove An inspection device for inspecting a chip component in a state, and when the inspection device makes a defect, the chip is inserted from the storage groove by the preceding suction loading nozzle of the two suction loading nozzles. A taping apparatus characterized in that a part is taken out and a chip part is loaded into the taken-out storage groove by a subsequent suction loading nozzle . In a taping device in which chip parts are sequentially loaded into each storage groove in the storage tape and the opening on the upper surface of the storage groove is closed with a cover tape, the storage tapes are arranged in two rows, When a plurality of suction loading nozzles for loading chip parts into the storage groove are intermittently rotated and stopped, two suction loading nozzles are stored in the one row. A taping device, wherein the taping device is located above the tape and the suction loading nozzle between the two suction loading nozzles is located above the storage tape of the other row . In a taping device in which chip parts are sequentially loaded into the respective storage grooves in the storage tape and the opening on the upper surface of the storage groove is closed with a cover tape, the suction take-out nozzle for taking out the chip parts from the chip part supply unit has a predetermined interval. A plurality of first rotating disks that are intermittently rotated and a plurality of suction loading nozzles that are loaded with chip components in the storage groove are disposed at a predetermined interval to rotate intermittently. And a reversing device that reverses the suction take-out nozzle up and down after taking out the chip component. The reversing device is provided with a reversing device, and the chip component is removed from the suction take-out nozzle in a state reversed by the reversing device. by adsorption loading nozzle of the rotating disk is inherited, taping the second two adsorption loading nozzles when the rotary disc stops intermittently rotated, characterized in that positioned in the storage tape upper Location. The taping device according to any one of claims 1 to 3, wherein the suction loading nozzle is rotatable about its axial direction by a rotating device.

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