JP4503969B2 - Transfer equipment - Google Patents

Description

  The present invention includes a reversing device in which a plurality of suction / extraction nozzles for taking out chip components from the chip component supply unit are arranged at a peripheral portion with a predetermined interval, and the suction / extraction nozzles are turned upside down after taking out the chip components. A plurality of suction loading nozzles that transfer the chip components from the first rotating disk and the suction take-out nozzles that have been reversed by the reversing device to the chip component storage portion with a predetermined interval at the peripheral portion. The present invention relates to a transfer apparatus including a second rotating disk disposed.

A transfer device that takes out a chip component from the chip component supply unit and transfers it to the chip component storage unit is widely known in Japanese Patent Application Laid-Open No. 2002-240802. A plurality of take-out nozzles are arranged at predetermined intervals on the peripheral edge, and the suction take-out nozzle is inverted by the reversing device, and is reversed by the reversing device. A transfer plate provided with a plurality of second rotating discs each having a plurality of suction loading nozzles arranged at predetermined intervals on the periphery thereof, which inherits the chip components from the suction pickup nozzle in a state and transfers them to the chip component storage unit. Mounting devices are also in practical use.
Japanese Patent Laid-Open No. 2002-240802

  However, when the chip component sucked and held by the suction take-out nozzle provided on the first turntable is transferred from the suction take-out nozzle to the suction loading nozzle provided on the second turntable, the chip component is picked up by suction. If the nozzle is adsorbed while being displaced in the plane direction, a situation occurs in which the nozzle cannot be delivered to the adsorption loading nozzle.

  Therefore, the present invention can reliably transfer the chip component sucked and held by the suction / extraction nozzle provided on the first rotating disk to the suction loading nozzle provided on the second rotating disk. An object is to provide a transfer device.

For this reason, the present invention provides a reversing device in which a plurality of suction take-out nozzles for taking out chip components from the chip component supply section are arranged at a peripheral portion with a predetermined interval, and the suction take-out nozzles are turned upside down after taking out the chip components. A suction loading nozzle that inherits a chip component from the suction take-out nozzle that has been reversed by the reversing device and transfers the chip component to the chip component storage unit at a predetermined interval in the peripheral portion. In a transfer apparatus comprising a plurality of second rotating disks arranged in a plurality, the chip component adsorbed and held by the adsorption / removal nozzle is imaged in a recognition station stopped by intermittent rotation of the first rotating disk. And a recognition processing device for recognizing the position of the chip component sucked and held by the suction nozzle based on an image captured by the component recognition camera. The recognition processor the θ-axis drive motor of the chip component of the delivery above for deviation in the plane direction in the station the second rotating disk to provided the nozzle axis of the suction loading nozzle from the suction extraction nozzle based on the recognition processing result of The nozzle shaft body is controlled to rotate, the suction loading nozzle provided at an eccentric position of the nozzle shaft body is corrected and rotated, and the rotation driving motor of the second rotating disk is controlled to control the second And a control device for correcting and rotating the rotary disk .

According to the present invention, the control device includes a nozzle shaft body provided on the second rotating disk for a displacement in a planar direction at a chip component delivery station from the suction take-out nozzle to the suction loading nozzle based on the recognition processing result of the recognition processing device. By controlling the θ-axis drive motor to rotate the nozzle shaft body, the suction loading nozzle provided at an eccentric position of the nozzle shaft body is corrected and rotated, and the rotation drive motor of the second rotating disk is controlled to be the second. Since the rotating disk of the second rotating disk is corrected and rotated, the chip component sucked and held by the sucking and extracting nozzle provided on the first rotating disk is provided at an eccentric position of the nozzle shaft body of the second rotating disk from the sucking and extracting nozzle . We can provide a transfer device that can be reliably delivered to the suction loading nozzle.

  Hereinafter, an embodiment of a taping device as a transfer device of the present invention will be described with reference to the drawings. First, the taping device will be described with reference to the plan view of the taping device in FIG. 1, the same front view in FIG. 2, and the right side view in FIG. Reference numeral 1 denotes a taping device main body. A carrier tape supply reel 3 is rotatably locked to a pin 2 erected on a side wall portion of the main body 1, and a tape main body (also referred to as a carrier tape) wound around the tape supply reel 3. The take-up and storage reel 9 is provided via a transport rail 8 having a transport path such as a pulley 5, feed pulleys 6 and 7, and a tape body 4A for applying a proper tension to the tape body 4A. It is fixed to.

  Then, the tape body 4A is stored while the tape body 4A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up storage reel 9 by a rotation driving system (not shown). After the chip component A is inserted into the groove 4B and further conveyed to a predetermined position and the opening on the upper surface of the storage groove 4B is covered with the cover tape 4C supplied from the cover tape supply reel 10, the winding storage reel 9 It will be wound up. As described above, the storage tape 4 is formed by the tape body 4A provided with the storage grooves 4B at a predetermined interval and the cover tape (top tape) 4C that is pressure-bonded to the upper surface thereof. The tape body 4A is formed of a bottom tape and a spacer.

  The feed pulleys 6 and 7, the transport rail 8, the cover tape supply reel 10 and the like are provided on the mounting plate 11. A Y table 15 that is driven by a Y-axis drive motor 13 and is guided by a guide 14 to move in the Y direction is provided on a fixed plate 12 that is fixed to the taping device main body 1. An X table 18 that is driven by an X-axis drive motor 16 and is guided by a guide 17 to move in the X direction is provided, and the mounting plate 11 is fixed to the X table 18.

  Therefore, when the X table 18 and the Y table 15 are moved by driving the X axis drive motor 16 and the Y axis drive motor 13, the transport rail 8 and the tape that moves along the transport rail 8 via the mounting plate 11 are moved. The main body 4A and the like can move in the XY directions.

  A Y table 21 that can be moved in the Y direction by a Y axis drive motor 20 is provided on the taping device main body 1, and can be moved in the X direction by an X axis drive motor 22 on the Y table 21. A chip component supply table 24 is provided via the X moving body 23. A wafer affixed to the sheet is diced on the supply table 24 and is divided into individual dies (hereinafter referred to as “chip parts A”), and fixed with the surface having terminals as the upper surface. The chip component A is picked up and taken out by a suction pick-up nozzle 26 described later while being pushed up by a push-up pin (not shown) from the back surface.

  The upper mounting plate 25 fixed to the taping device main body 1 is provided with, for example, eight suction take-out nozzles 26 for taking out the chip components A from the chip component supply table 24 at a predetermined interval on the peripheral portion. An XY table that is provided with a first rotating disk 27 that rotates intermittently through the indexing cam unit 30 by driving 19A, and is moved in the XY directions by an X-axis driving motor 88 and a Y-axis driving motor 89 on the upper mounting plate 25. For example, eight suction loading nozzles 28 for loading the chip component A into the storage groove 4B via a (not shown) are arranged at a peripheral portion at a predetermined interval, and the indexing cam unit is driven by the drive motor 19B. A second rotating disk 29 that rotates intermittently through 31 is provided.

  The first rotating disk 27 and the second rotating disk 29 rotate intermittently synchronously, and the nozzles 26 and 28 of the two rotating disks 27 and 29 can be made to correspond to each other. It can be delivered from the suction extraction nozzle 26 to the suction loading nozzle 28. Further, by making the rotation radii of both the rotating disks the same, the rotation indexing accuracy (resolution) can be made the same.

  Next, the component take-out mechanism 35 will be described in detail with reference to FIG. For example, eight suction / extraction nozzles 26 are arranged on the peripheral portion of the first rotating disk 27 at a predetermined interval, and each suction / extraction nozzle 26 is provided by each reversing device 36 so as to be vertically inverted. . That is, when the drive shaft 39 is rotated via the coupling 38 by the driving of the reverse drive motor 37, the attachment body 40 fixed to the drive shaft 39 is also rotated, and the take-out nozzle 26 is inverted upside down.

  Further, since the guide 42 can move up and down along the guide 41 provided on the mounting body 40, the take-out nozzle 26 attached to the nozzle mounting body 43 fixed to the guide 42 can move up and down. The upper body 40A of the mounting body 40 and the lower side 43A of the nozzle mounting body 43 are always urged upward by a spring 44, but the stopper 45 is locked to the upper side 40A of the mounting body 40. This limits the upper limit.

  Further, the suction take-out nozzle 26 can be lowered when the operating portion 48A of the operating body 48 that can be moved up and down by the guide 47 by driving the Z-axis drive motor 46 presses the head of the nozzle mounting body 43, For example, the chip part A on the chip part supply table 24 can be taken out.

  Next, the component loading mechanism 50 will be described in detail with reference to FIG. For example, eight suction loading nozzles 28 are provided at a peripheral portion of the second rotating disk 29 at a predetermined interval, and the nozzles provided at positions where the suction loading nozzles 28 are eccentric by the rotating devices 51. The shaft body 28A is provided to be rotatable about the axial direction. That is, the transmission belt 55 is stretched between a pulley 53 provided on the drive shaft of the θ-axis drive motor 52 and a pulley 54 fixed around the cylindrical body 62, and the cylindrical body 62 is interposed via the bearing 56. The second turntable 29 is rotatably provided. The suction loading nozzle 28 is guided by the guide 61 when the operating portion 59A of the operating body 59 that can be moved up and down by the guide 58 by the drive of the Z-axis drive motor 57 presses the projection 60A of the nozzle mounting body 60. The chip component A that is sucked and held can be loaded into the storage groove 4B of the tape body 4A on the transport rail 8. That is, since the nozzle shaft body 28A can move up and down in the cylindrical body 62 and can rotate θ with the cylindrical body 62, the suction loading nozzle 28 provided at an eccentric position below the nozzle shaft body 28A also moves up and down. And can be rotated by θ.

  Here, based on FIG. 12, the control block diagram of the taping device will be described. 91 is a CPU as a control device that controls the operation related to loading of the chip component A of the taping device, and 92 is for each type of chip component A. The RAM (Random Access Memory) and 93 are ROM (Read Only Memory) for storing the thickness data of each, the height level data for each suction take-out nozzle 26, and the like. Based on the data stored in the RAM 92, the CPU 21 controls the operation related to the loading of the chip part A of the taping device in accordance with the program stored in the ROM 93. That is, the CPU 91 controls the driving of each driving motor via the driving circuit 94 and the interface 95.

  A recognition processing device 96 is connected to the CPU 91 via the interface 95. The recognition processing device 96 performs recognition processing of an image captured by each recognition camera. Is sent out. That is, the CPU 91 outputs an instruction to the recognition processing device 96 so as to perform recognition processing (calculation of the amount of displacement) of the images captured by each recognition camera, and receives the recognition processing result from the recognition processing device 96. is there.

  Next, as shown in FIGS. 6 and 7, the station located at 12:00 of the first rotating disk 27 is a suction extraction station where the suction extraction nozzle 26 sucks and extracts the chip component A from the chip component supply table 24. is there. In this suction take-out station, the chip part A to be taken out next on the chip part supply table 24 is picked up by the part recognition camera 63 while the first turntable 27 is swung, and the position of the chip part A is recognized. A recognition process is performed at 96, and the CPU 91 drives the Y-axis drive motor 20 and the X-axis drive motor 22 so as to be positioned immediately below the suction extraction nozzle 26 from which the chip component A to be extracted is moved to supply the chip components. The table 24 is moved, and at this suction and extraction station, the chip component A on the chip component supply table 24 is driven by the Z-axis drive motor 46 so that the suction loading nozzle 28 is lowered and sucked out.

  Next, the second rotating disk 29 is intermittently rotated clockwise through the indexing cam unit 31 by driving the driving motor 19B, and the first rotating disk 27 is moved through the indexing cam unit 30 by driving the driving motor 19A. Synchronously rotate counterclockwise. The station of the first rotating disk 27 that rotates intermittently in the counterclockwise direction and stops is the reversing station that vertically flips the chip part A held by the suction take-out nozzle 26 by the reversing device 36. The station is a recognition station in which the position of the inverted chip component A is imaged by the component recognition camera 65 and recognized by the recognition processing device 96.

  Next, a printing station which is reversed by the reversing device 36 and prints by the printing device 66 on the chip part A having the printing surface as the upper surface and the surface having the terminal as the lower surface will be described below with reference to FIG. An X table 70 that is movable in the X direction via a guide 69 is provided by an X axis drive motor 68 fixed to the mounting plate 67. Further, a Y axis drive motor 71 passes a guide 72 over the X table 70. A Y table 73 that is movable in the Y direction is provided. An ink jet printing unit 78 is provided on a Z moving body 77 that moves in the Z direction by a Z-axis drive motor 74 via a guide 76 provided on a fixed plate 75 on the lower surface of the Y table 73.

  That is, the printing unit 78 is movable in the XY direction and the Z direction, and the position of the chip part A that has been imaged by the part recognition camera 65 and recognized by the recognition processing device 96 is captured by the part recognition camera 65. On the basis of the recognition result, the CPU 91 controls the X-axis drive motor 68 and the Y-axis drive motor 71 to correct in the XY directions during the turning movement of the first rotating disk 27 from the recognition station. A serial number or the like is printed on the chip part A by the printing unit 78 lowered by the Z-axis drive motor 74 at the printing station.

  Accordingly, since the printing is performed on the chip component A in the position-corrected state, the printing accuracy can be improved, and the thickness data for each type of chip component stored in the RAM 92 and each suction take-out nozzle 26 can be improved. If the movement level of the printing unit by the Z-axis drive motor 74 is controlled by the CPU 91 in accordance with the data using the height level data, the distance between the picked-up chip component and the printing unit 78 at the time of printing is constant. It is adjusted and printing accuracy can be improved.

  The next curing station 79 is a station that dries the ink printed by the printing unit 78 with warm air from a warm air device (not shown).

  The sixth station rotated counterclockwise with the suction extraction station as the first is a delivery station, and the chip part A of the suction extraction nozzle 26 turned upside down by the reversing device 36 is replaced with the suction loading nozzle of the second rotary disk 29. Pass to 28. At the delivery station of the first turntable 27, in other words, at the transfer station of the second turntable 29, the component recognition camera 65 takes an image of the chip part A sucked and held by the suction take-out nozzle 26 and performs recognition processing. The deviation in the X direction and the Y direction as a result of the recognition processing by the device 96 is eliminated by correcting the rotation angle of the second rotating disk 29 and correcting the position of the suction loading nozzle 28 which is eccentric due to the rotation of the nozzle shaft 28A.

  That is, based on the recognition processing result of the recognition processing device 96 based on the image picked up by the component recognition camera 65, the CPU 91 drives the drive motor 19B for rotating the second rotating disk 29 and the θ-axis drive for rotating the nozzle shaft body 28A. By controlling the motor 52, the deviation in the X direction and the Y direction can be corrected. Therefore, the position of the chip component A sucked and held by the delivered suction / extraction nozzle 26 and the position of the suction loading nozzle 28 is made as close as possible to be sucked and held by the suction / outtake nozzle 26 provided on the first rotating disk 27. The chip component A can be reliably delivered from the suction take-out nozzle 26 to the suction loading nozzle 28 provided on the second rotating disk 29.

  Then, the transfer is performed at the transfer station of the second turntable 29, and the second turntable 29 rotates in the clockwise direction so that the mounting station and the recovery loading station (the transfer station is the first and the sixth and seventh). The rotary disks 27 and 29 are disposed so that the suction loading nozzle 28 is positioned above the tape body 4A of the tape 4.

  That is, when the second rotating disk 29 is disposed so that the two suction loading nozzles 28 are positioned above the tape body 4A of the tape 4, the rotating disks 27 and 29 rotate intermittently in 8 divisions. The angle formed by the center of the second rotating disk 29 in the station, the line connected to the suction loading nozzle 28 and the traveling line of the tape 4 is 67.5, and the delivery station of the first rotating disk 27 and the second rotating disk Both rotary disks 27 and 29 are arranged so as to be shifted by 22.5 degrees from the 29 transfer stations.

  The next station after the inheriting station of the second turntable 29 is an inspection station that inspects the characteristics of the chip component by the characteristic inspection device 81. For example, the current value flowing through the chip component is inspected, and the current value Is in the predetermined range stored in the RAM 92. Here, if it is not within the predetermined range, the CPU 91 controls not to load the tape body 4A but to store it in a dedicated tray (not shown) described later.

  A loading part recognition camera 83 is arranged at the recognition station next to the inspection station. The chip part A sucked and held by the suction loading nozzle 28 is imaged by the loading part recognition camera 83, and the chip is picked up by the recognition processing device 96. The position of the component A with respect to the nozzle is recognized, and an appearance inspection (whether a predetermined number of bumps are present) is performed. If a defective chip component is determined by this appearance inspection, the CPU 91 controls the tape body 4A to be stored in the dedicated tray without being loaded.

  The next next station is a loading station for loading the chip component held by the suction loading nozzle 28 into the storage groove 4B of the storage tape 4, and the chip component A held by the suction loading nozzle 28 by the loading component recognition camera 83. Is loaded and chip components are loaded in a state where the deviation in the θ direction (angle in the plane direction) and the deviation in the plane direction (XY direction) are corrected based on the result of the recognition processing performed by the recognition processing device 96.

  That is, the CPU 91 corrects and controls the θ-axis drive motor 52 for the deviation in the θ direction and rotates the suction loading nozzle 28 provided at a position eccentric to the shaft body 28A via the cylindrical body 62 and the nozzle shaft body 28A. The X-axis drive motor 16 and the Y-axis drive motor 13 are corrected and controlled to correct and move the X table 18 and the Y table 15 with respect to the displacement in the plane direction. The tape body 4A moving along the rail 8 is corrected and moved in the X direction and the Y direction.

  In this case, when the suction loading nozzle 28 moved to the loading station is in the recognition station, the chip component A held by the suction extraction nozzle 26 in the printing station of the first rotary disk 27 is moved to the next next. In consideration of the rotation correction amount of the second rotating disk 29 corrected at the delivery station (in addition to the recognition processing result at the recognition station of the electronic component), the CPU 91 performs θ in the loading station of the second rotating disk 29. The axis drive motor 52, the X axis drive motor 16, and the Y axis drive motor 13 are corrected and controlled.

  For this reason, the chip component A can be loaded into the appropriate position in the storage groove 4B by the suction loading nozzle 28 that is lowered by the drive of the Z-axis drive motor 57. Accordingly, since the correction operation in the plane direction is performed on the tape body 4A side and the correction operation in the angular direction (θ) is performed on the suction loading nozzle 28 side, the movable portion is compared with the structure in which all is performed on the suction loading nozzle 28 side. It can be reduced in weight, and can cope with higher speed and more functions.

  The chip part A scraping operation at the loading station will be described with reference to FIGS. As described above, the suction loading nozzle 28 is lowered by driving the Z-axis drive motor 57, and the chip component A is loaded into the storage groove 4B of the tape body 4A. At this loading, a vacuum path is connected to a vacuum source (not shown). The suction loading nozzle 28 communicated via the vacuum valve releases the vacuum by the switching operation of the solenoid valve and conversely drops the chip part A onto the bottom surface of the storage groove 4B by blowing air from the suction hole formed in the nozzle 28. Let Further, a vacuum suction hole 87 is formed in the transport rail 8 immediately below the storage groove 4B in which the chip component A is loaded, and this suction hole 87 is communicated with a vacuum source (not shown) for loading. The tape body 4A is sucked and held on the upper surface of the rail 8, and the chip component A is positioned in the space in the storage groove 4B by the lowering of the suction loading nozzle 28, and the tape body 4A is moved in the transport direction of the tape body 4A. The chip part A in a state of being located in the space in the storage groove 4B is brought into contact with the wall surface 4D forming the storage groove 4B, thereby being scraped off from the suction loading nozzle 28 and loaded and stored in the storage groove 4B.

  That is, the CPU 91 controls and drives the X-axis drive motor 16 in a state where the lower end of the suction loading nozzle 28 is lowered so as to be slightly above the upper surface level of the tape body 4A (lower limit level). The main body 4A is moved and brought into contact with the wall surface 4D forming the storage groove 4B, whereby the suction hole of the nozzle 28 is scraped off so as to communicate with the atmosphere, and is loaded and stored in the storage groove 4B. Accordingly, since the chip component A is scraped off and loaded in the storage groove 4B by moving not the suction loading nozzle 28 side but the tape body 4A side, the movable part for loading can be reduced in weight. In addition, the scraping operation is performed in a stable state since the suction hole 87 is communicated with a vacuum source and the tape body 4A is sucked and held on the upper surface of the transport rail 8.

  Further, a print inspection camera 85 is provided at the next recovery loading station, and the chip component A in the storage groove 4B located at this station is imaged while the second turntable 29 is swung, and the recognition processing device 96 The chip component A loaded on the tape 4 through the recognition process is inspected for printing and the direction of printing.

  If the CPU 91 determines that the CPU 91 is defective based on the recognition result of the recognition processing device 96, the suction loading nozzle 28 that has finished loading at the loading station takes out the chip part A from the storage groove 4B located at the recovery loading station. At this time, the suction loading nozzle 28 to be loaded at the loading station is controlled to stand by without being loaded. In this state, the CPU 91 intermittently rotates the second rotating disk 29 without moving the tape body 4A, and the next suction loading nozzle 28 is held in the storage groove 4B which has been taken out and emptied as described above. Control is performed so that the chip part A that has been used is loaded.

  Then, as described above, after the chip component A is inserted into the storage groove 4B of the tape body 4A by the component loading mechanism 50, the tape body 4A and the cover tape 4C are crimped by the tape crimping mechanism 86 and wound up. It is wound up on the storage reel 9.

  As described in detail, the present embodiment is an embodiment in which the chip component A is loaded on the storage tape 4 by the suction loading nozzle 29. However, the present invention is not limited to this, and a tray in which a plurality of rows of storage recesses are formed vertically and horizontally ( The present invention can also be applied to a form in which it is transferred to and stored in (not shown). In this case, the tray is configured to be movable in the XY directions by driving the X-axis drive motor and the Y-axis drive motor.

  Further, in the present embodiment, based on the recognition processing result of the recognition processing device 96 based on the image picked up by the component recognition camera 65, the CPU 91 rotates the drive motor 19B that rotates the second turntable 29 and the nozzle shaft body 28A. By controlling the θ axis drive motor 52 to be moved, the position of the chip component A sucked and held by the suction suction nozzle 26 delivered and the position of the suction loading nozzle 28 is made to coincide with each other. The suction take-out nozzle 26 provided on the rotary disk 27 is provided eccentric to the nozzle shaft body, and the CPU 91 rotates the first rotary disk 27 by the CPU 91 and the nozzle shaft body provided on the first rotary disk 27. The rotating θ-axis drive motor may be controlled to coincide with each other as described above.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view which shows a taping apparatus. It is a front view of a taping device. It is a right view of a taping device. It is a figure for demonstrating a components extraction mechanism. It is a figure for demonstrating a component loading mechanism. It is a top view of the stop state of the 1st and 2nd turntable. It is a top view during the turning movement of the 1st and 2nd turntable. It is a side view of a printing mechanism. It is a vertical front view of a conveyance rail. It is a vertical side view of a conveyance rail. It is a vertical front view of the conveyance rail which moved to the X direction. It is a control block diagram of this taping apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 8 Conveyance rail 24 Chip component supply table 26 Adsorption take-out nozzle 27 1st rotation board 28 Adsorption loading nozzle 28A Nozzle shaft body 29 2nd rotation board 62 Cylindrical body 65 Component recognition camera 91 CPU
96 Parts recognition processing device

Claims (1)

A plurality of suction take-out nozzles for taking out chip components from the chip component supply unit are arranged at a peripheral portion with a predetermined interval, and a first reversing device is provided that reverses the suction take-out nozzles up and down after taking out the chip components. A plurality of suction loading nozzles, which transfer chip components to the chip component storage unit by transferring the chip components from the rotary disk and the suction take-out nozzles reversed by the reversing device, are arranged at predetermined intervals on the periphery. A component recognition camera for imaging a chip component sucked and held by the suction take-off nozzle at a recognition station stopped by intermittent rotation of the first turntable in a transfer device comprising a second turntable; A recognition processing device for recognizing the position of the chip component sucked and held by the suction nozzle based on an image captured by the component recognition camera, and the recognition processing device The nozzle by controlling the θ-axis driving motor of the nozzle shaft body provided for displacement in the planar direction to the second rotating disk at transfer station of the chip component to the adsorption loading nozzle from the suction extraction nozzle based on the recognition processing result rotate the shaft by controlling the second rotating disk of the rotary drive motor causes the corrected rotating the suction loading nozzle provided at an eccentric position of the nozzle shaft body corrects the second rotating disk A transfer device comprising a control device for rotating.

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