JP2531006B2 - Electronic component composite taping device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite taping device for electronic parts, and more particularly, to an electronic part manufactured by using a strip-shaped lead frame, inspecting mold appearance, measuring characteristics, imprinting and appearance inspection thereof. The present invention relates to a composite taping device for electronic parts that is packaged through a series of processes including the above.

[0002]

2. Description of the Related Art For example, a mini mold transistor is
It is manufactured collectively using a strip-shaped lead frame. This type of electronic component includes a pellet mounting step of mounting a semiconductor pellet on a lead frame, a wire bonding step of electrically connecting the pellet and the lead, a resin molding step of coating a major portion including the pellet with an exterior resin, etc. It is generally manufactured through. After that, each electronic component is cut and separated from the lead frame, and a series of processes such as appearance inspection of the exterior resin portion, electrical characteristic measurement, marking of product number and standard, and appearance inspection are performed, and then taping packaging. And then shipped [JP-A-3-
No. 30340].

[0003]

However, the conventional composite processing apparatus has the following problems.

First of all, there are various electronic parts manufactured by the lead frame, which differ in the outer dimensions of the outer resin part, the number of leads led out from the outer resin part, and the like. It was difficult to deal with.

Secondly, if a series of processes such as appearance inspection of the exterior resin portion, electrical characteristic measurement, marking of product number and standard, and appearance inspection are performed for each electronic component, it takes a very long time. As a result, there was a problem that the overall work index dropped significantly.

Thirdly, if the above-mentioned series of processing is performed for each of a plurality of parts, if electronic packaging is performed for each characteristic rank based on the result of the characteristic measurement, electronic components must be temporarily stored separately for each characteristic rank. Very difficult. Further, when they are stored in bulk, there is a problem that defective products frequently occur due to bending of leads, vibration and impact, mixing of dust, and the like.

[0007] Therefore, the present invention is proposed in view of the above problems, and an object of the present invention is to provide an electronic device capable of supporting a wide variety of electronic components, improving the work index, and reducing the occurrence of defective products. A composite taping device for parts is provided.

[0008]

The technical means for achieving the above object of the present invention is to provide a large number of electronic devices which have been cut-bent with leads led out from an exterior resin portion after pellet mounting, wire bonding and resin molding are completed. A lead frame supply unit for supplying a strip-shaped lead frame in which components are integrally arranged and a plurality of turntables are continuously arranged, and lead frames are arranged at equal positions around the periphery of the turntable following the lead frame supply unit. It has a pick-and-place mechanism that arranges a handling mechanism to hold electronic parts according to the product type and transfers electronic parts to the next turntable by uniaxial transfer. A plurality of electronic parts that perform each process such as mold appearance, measurement, and marking at the peripheral edge position are arranged side by side. A handling / holding mechanism that holds the state, and a transport / processing unit that has a shift mechanism that cuts the delivery of electronic parts to the final turntable one by one to the handling mechanism, and a plurality of units adjacent to the final turntable Lanes are arranged side by side, and a taping unit provided with a lane change mechanism for allocating a handling mechanism to each lane and packaging electronic components by taping.

Specifically, in a composite process of measuring, inspecting and marking individual mold parts from lead frame members carrying a plurality of mold parts, and layering and taping based on the measurement results, the lead frame member supply section. A transporting / processing unit having a plurality of turntables and a handling mechanism, and a taping unit having a lane change mechanism in which a plurality of lanes are juxtaposed and a molded component from the preceding stage is distributed to each lane, A plurality of molded parts are transferred by the pick-and-place mechanism when transferring from the beginning to the next table, and a pair of molded parts is mounted on the terminal side turntable after each processing of appearance inspection / characteristic inspection and marking display. A shift mechanism that cuts out an individual item is provided, and it is sorted according to the above characteristic measurement and distributed to each lane. Be packaged Te discloses a composite taping device for an electronic component characterized by.

[0010]

In the composite taping device for electronic parts according to the present invention, the handling mechanism for holding the electronic parts according to the kind of the lead frame is arranged at the circumferentially equidistant positions of the first turntable and the next turntable is arranged. Since it has a pick-and-place mechanism that transfers by uniaxial transfer, it is possible to handle a wide variety of products.

Further, the mold appearance, the characteristic measurement, and the marking display are performed at equal positions on the periphery of each turntable thereafter, and a handling mechanism for holding a plurality of electronic parts in a parallel state is arranged. A series of processing work index is improved.

Furthermore, since the shift mechanism for cutting out the electronic components to the final turntable one by one is arranged in the handling mechanism, it is possible to continuously package the electronic components while selecting them.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a composite taping device for electronic parts according to the present invention will be described with reference to FIGS. The electronic component (1) described below is, for example, SSOP [Super Small
Package type such as "Outline Package"
As shown in (a) and (b), a large number of leads (3) are led out from both side surfaces of the exterior resin part (2), and each lead (3) is bent into a predetermined shape for surface mounting.

As shown in FIG. 1, the composite taping device of the present invention comprises a lead frame supply section (4), a conveyance / processing section (5), and a taping section (6).

The lead frame supply section (4) is a CBS [Cut (not shown) as a pretreatment device for composite taping.
Bending System] unit is connected, and a strip-shaped lead frame (7) in which a large number of electronic components that have been pellet-mounted, wire-bonded, and resin-molded are integrally aligned are arranged by the CBS unit. ) After cutting and separating the lead (3) derived from the exterior resin part (2) of (1) from the lead frame (7),
It is bent into a predetermined shape so that it can be surface-mounted. The electronic component (1) cut and bent in this manner is integrated with the lead frame (7) only by the hanging pins, and the lead frame (7) is supplied in this state.

On the other hand, the transfer / processing section (5) has a plurality of turntables (five in the figure) that rotate intermittently, that is, a delivery table (8), a mold appearance table (9), a measurement table (10), and a marking table. (11) and the insertion table (12) are continuously installed in a predetermined arrangement pattern.

First, the delivery table (8) is provided with a handling mechanism for holding the electronic component (1) at the four-divided positions which are equidistantly arranged around the delivery table (8). As the handling mechanism, specifically, a predetermined number of suction nozzles (13a) to (13c) that suction the lower surface of the electronic component (1) are arranged in the radial direction of the table (8). For example, if there are three electronic components (1) arranged in the width direction of the lead frame (7), three suction nozzles (13a) to (13c) will be provided correspondingly.

In practice, although not shown, the handling mechanism is provided at the 12-division position, and the handling mechanism at the 4-division position described above has one type of handling mechanism and two other types of handling mechanisms. They are placed at 30 ° offsets. This corresponds to the different types of electronic components (1) as shown in FIG. 3, and the lead frame (7) has the same outer dimensions and the same feed hole diameter and pitch, whereas When the outer shape of the exterior resin part (2) of the component (1), that is, the width and thickness of the exterior resin part (2) are the same but the lengths are different, they are arranged in the width direction of the lead frame (7). The arrangement pitch and the number of electronic components (1) [two, two, three, four, four, six from the left side in the figure] differ. In order to deal with this, as described above, in each of the three types of handling mechanisms arranged at the 12-division position, that is, the 4-division position shifted by 30 °, the electronic parts ( A suction nozzle for suctioning the lower surface of each electronic component (1) corresponding to the arrangement pitch and number of 1) is provided.

At each of the four divided positions (U1) to (U4) of the delivery table (8), the hanging pin cut (U1),
The presence / absence detection of parts (U2), the delivery of parts (U3), and the remaining part detection (U4) are executed.

In each of the tables (9) to (12) after the delivery table (8), the two electronic components (1) are handled with the center of the exterior resin portion (2) as a reference, as described later. A pick-and-place mechanism (14) is provided between the delivery table (8) and the mold appearance table (9) so as to be compatible with a wide variety of products.

This pick and place mechanism (14)
The electronic component (1) at the position (U3) of the delivery table (8) has a suction nozzle (not shown) that sucks the upper surface of the electronic component (1) and the position (G1) of the mold appearance table (9). One by one. At this time, even if the product type is different, the electronic component (1) at the position (G1) in the mold appearance table (9) is always set to its reference position simply by changing the transfer stroke in one axis of the suction nozzle. Can be placed.

The mold appearance table (9), the measurement table (10), and the marking table (11) are provided with a handling mechanism for holding the electronic component (1) at eight divided positions which are equal positions on the periphery. Each of the handling mechanisms of the mold appearance table (9) and the marking table (11) has suction nozzles (15a) (15b) and (17a) (17b) that suck the lower surface of the electronic component (1), and a measurement table ( In the handling mechanism of 10), the suction nozzles (16a) and (16b) for sucking the upper surface of the electronic component (1) are mounted on the tables (9) to (1), respectively.
Plural, for example, two are arranged in the radial direction of 1). As a handling mechanism for the marking table (11), a chuck (not shown) is additionally provided in addition to the suction nozzles (17a) and (17b). This allows each table (9) ~ (1
The series of processes in 1) will be performed two by two at the same time.

At each of the eight positions (G1) to (G8) of the mold appearance table (9), the parts are delivered (G1).
1), mold appearance recognition and mold appearance measurement position correction (G2), parts delivery (G4), mold appearance defect discharge (G
7) Mold residual detection (G8) is executed, and other positions (G3) (G5) (G6) are in a clear state.

At each of the eight divided positions (T1) to (T8) of the measurement table (10), the parts are delivered (T1), the first measurement (T2), the measurement position correction (T3), and the second measurement. (T4),
Measurement position correction (T5), third measurement (T6), component delivery (T7), and measurement residual detection (T8) are executed. At each of the eight divided positions (N1) to (N8) of the marking table (11), delivery of parts (N1), detection of presence / absence of parts (N2), laser marking (N3), mold brushing (N4), appearance of marking Recognition (N5), delivery of parts (N6), and presence / absence detection of parts (N8) are executed, and other positions (N7) are in a clear state.

The mold appearance table (9) position (G4) and the measurement table (10) position (T1),
Also, the position (T7) of the measurement table (10) and the position (N1) of the marking table (11) have a superposed positional relationship, and the electronic component (1) adsorbs the bottom surface of the positions (G4) and (T1). From the suction nozzles (15a) (15b), the suction nozzles (16a) (16b) that suck the upper surface of the suction nozzle (16a) (16b) are transferred, and at positions (T7) and (N1), the electronic component (1) sucks the upper surface of the suction nozzle (16). 16a) and (16b) are transferred to suction nozzles (17a) and (17b) that suck the lower surface thereof.

The insertion table (12) located at the end is provided with a handling mechanism for holding the electronic component (1) at the eight-divided positions, which are equal positions on the periphery of the insertion table. Each handling mechanism of the insertion table (12) is provided with one suction nozzle (18) for sucking the upper surface of the electronic component (1). The processing in the insertion table (12) is performed for one part.

At each of the eight divided positions (S1) to (S8) of the insertion table (12), component delivery and nozzle shift (S1), lead pitch appearance recognition (S2), and insertion position correction reversal (S3). , Lane change (S4), part insertion (S5), lane change (S6), and part remaining detection (S7) are executed, and other positions (S8) are in a clear state.

At the position (S1), when the suction nozzle (18) enters the position (S1), the suction nozzle (18) is moved to the position (N6) of the marking table (11).
There is a shift mechanism (19) consisting of a plate cam that guides to the inside position in (1) and a screw cam that slides from the inside position in position (N6) to the position (S1) in the insertion table (12) at position (S1). It is arranged.

Further, in the position (S3), a reversing mechanism (20) for reversing the electronic component (1) by 180 ° in order to align the polarities of the electronic component (1) when the tape is packed.
Is arranged.

Further, in the positions (S4) and (S6), the electronic parts (1) are distributed to a plurality of lanes which will be described later at the time of taping packaging, and thereafter, the electronic parts (1) are returned to the initial position,
Lane change mechanisms (21, 22) for sliding the suction nozzle (18) in the radial direction of the table (12) are provided.

The taping section (6) is provided with an insertion table (1
2) Multiple lanes (23A) adjacent to position (S5)
~ (23D) are arranged at regular pitch intervals, and each lane (23A)
At (23D), an embossed tape (not shown) fed from the tape supply reel and wound on the tape storage reel runs. The embossed tapes of the lanes (23A) to (23D) are formed with recesses for accommodating the selected electronic components (1), and the cover tape is attached after the components are accommodated.

Next, the operation of the composite taping device having the above structure will be described below.

First, for a lead frame (7) having a large number of electronic components (1) on which pellet mounting, wire bonding, and resin molding have been completed, as a pretreatment, C
The parts are cut and bent by the BS unit, integrated with only the hanging pins, and then supplied to the delivery table (8). At this time, in the lead frame (7) of the type as shown in FIG. 1, the electronic parts (1) are arranged in the width direction of the lead frame (7) in groups of three at the delivery table (8) position (U).
1), the three parts are simultaneously cut and separated from the lead frame (7) by cutting the hanging pins, and the lower surface is sucked and held by the suction nozzles (13a) to (13c).

Even if the type of the lead frame (7) is changed and the outer shape of the exterior resin part (2) of the electronic component (1) and the number of leads (3) are different [see FIG. 3], If the number of parts lined up in the width direction of the frame (7) is placed in the position (U1), the delivery table (8) will give 30
The suction nozzle of the handling mechanism corresponding to each product, which is shifted by °, is placed at position (U1), and then hanging pin cutting and suction holding are performed. This makes it possible to handle a variety of lead frames (7) as well as a pick-and-place mechanism (14) between the delivery table (8) and the mold appearance table (9).

Then, the delivery table (8) is intermittently rotated as shown by the arrow in the drawing to move to the position (U
After the presence / absence of parts is detected in 2), three parts are placed in position (U3). When placed in this position (U3), the upper surface of the electronic component (1) is suction-held one by one by the suction nozzle by the pick-and-place mechanism (14), and the electronic nozzle is moved by moving the suction nozzle in one axis direction. 1) Mold position table (9) (G)
Transfer to 1). This transfer by the suction nozzle is repeated twice to arrange the two parts at the position (G1). still,
At this time, when the type of the lead frame (7) is changed as described above, it can be easily dealt with by only changing the transfer stroke of the suction nozzle in only one axis direction.

The lower surfaces of the two parts arranged at the position (G1) of the mold appearance table (9) are sucked by the suction nozzles (15a) and (15b), and the mold appearance table (9) and the subsequent measurements are performed. , Seal, insertion table (1
At each position of (0) to (12), it is held by the suction nozzle at the center of the exterior resin part (2). Further, in the mold appearance, measurement and marking tables (9) to (11), a series of two electronic components (1) are simultaneously processed at each of these positions, so that the overall work index can be improved.

First, the mold appearance table (9) is intermittently rotated as shown by the arrow in the figure to inspect the appearance of the exterior resin portion (2) at the position (G2), and
Prior to the first measurement at the position (T2) in the next measurement table (10), the position of the electronic component (1) is corrected to correct the posture. And position (G4),
That is, when the position (T1) of the measurement table (10) is reached, the electronic component (1) whose lower surface is sucked by the suction nozzles (15a) (15b) is sucked by the upper surface of the electronic component (1) (16a) (16b).
Deliver by adsorption at.

In the measurement table (10), the position (T2) is set for the electronic component (1) whose upper surface is sucked by the suction nozzles (16a) (16b) by intermittent rotation as shown by the arrow in the figure.
The first measurement is performed at. During this first measurement, the electronic component (1) may be displaced with respect to the suction nozzles (16a) (16b), so the position of the electronic component (1) is corrected again at the next position (T3). After correcting the posture to a normal posture, perform the second measurement at position (T4). Since the electronic component (1) may be displaced during the second measurement, the position is corrected at the next position (T5) to correct the electronic component (1) to a normal posture. Then, the third measurement is performed at the position (T6). The above first to first
The characteristic rank of the electronic component (1) is determined based on the third measurement. Position (T7), that is, the marking table (1
When the position (N1) of 1) is reached, the suction nozzle (16a)
The electronic component (1) whose upper surface is sucked by (16b) is transferred by sucking the lower surface by suction nozzles (17a) (17b).

In the marking table (11), the presence or absence of a component is detected at position (N2) by intermittent rotation as shown by the arrow in the figure, and laser marking is performed at the next position (N3). This laser marking is the first to the first on the measurement table (10).
Information such as the characteristic rank determined by the measurement result based on the third measurement is displayed on the surface of the exterior resin part (2). Since resin scraps are generated by this laser marking, the position (N
The resin waste is removed by brushing the electronic component (1) in 4). Then, after the appearance of the exterior resin portion (2) imprinted at the position (N5) is inspected, it is placed at the position (N6).

At this position (N6), that is, at the position (S1) of the insertion table (12), the insertion table (12)
By the intermittent rotation, the plate nozzle of the shift mechanism (19) guides the suction nozzle (18) to the inside position at the position (N6) of the marking table (11), and the outside of the suction nozzle (18) with the screw cam. ) Position (S1)], the suction nozzle (18) sucks the upper surface of the component located outside the marking table (11) [position (S1) in the insertion table (12)]. The next suction nozzle (18) is positioned inside the marking table (11) when guided by the plate cam of the shift mechanism (19) inside the position (N6) of the marking table (11). After sucking the upper surface of the component, slide it to the outside with a screw cam. In this way, the stamp table (1
At the position (N6) of 1), the two parts located inside and outside are transferred by the shift mechanism (19) one by one to the insertion table (12). This makes it possible to carry out a series of processing of two electronic components (1) and then sequentially package the electronic components (1) one by one without individually storing them.

The lead pitch appearance of the electronic component (1) delivered to the insertion table (12) as described above is inspected at the position (S2), and at the next position (S3), when the tape is packed. In order to make the polarities of the parts uniform, the reversing mechanism (20) reverses the electronic part (1) by 180 ° as appropriate. Then, at the position (S4), the electronic components (1) are sorted according to their characteristic ranks, and the suction nozzle (18) is slid outward in the radial direction of the table (12) by the lane change mechanism (21) to move to the position (S5). ) In the lanes (23A) to (23D) corresponding to the above characteristic ranks. In this way, the electronic components (1) sorted according to the characteristic ranks are sequentially stored in the recesses of the embossed tape running in the lanes (23A) to (23D). In position (S6),
The suction nozzle (18) is slid inward in the radial direction of the table (12) by the lane change mechanism (22) and returned to the initial position. The embossed tape containing the electronic component (1) is attached with a cover tape to complete the taping packaging.

[0042]

According to the composite taping apparatus of the present invention, even when a wide variety of electronic components are used, handling can be performed according to the type of product, so that the type of product can be easily handled and a series of processes can be performed. Since it is executed for a plurality of electronic components at the same time, the overall work index is significantly improved, and when processing electronic components one by one and then taping and packaging them, the electronic components can be consecutively stored one by one without being stored separately. Since they can be cut out one by one, it is possible to significantly reduce the occurrence of defective products. In this way, it becomes easy to implement efficiently and smoothly a series of complex processes from separation of electronic components from the lead frame to taping packaging.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a composite taping device for electronic parts according to the present invention.

2A is a plan view showing an example of an electronic component, FIG.
Is its front view

FIG. 3 is a plan view showing lead frames having different types of electronic components.

[Explanation of symbols]

 1 Electronic parts 2 Exterior resin part 3 Lead 4 Lead frame supply part 5 Conveying / processing part 6 Taping part 7 Lead frame 8 to 12 Turntable 13a, 13b Handling mechanism (Suction nozzle) 14 Pick and place mechanism (Suction nozzle) 15a, 15b Handling mechanism (Suction nozzle) 16a, 16b Handling mechanism (Suction nozzle) 17a, 17b Handling mechanism (Suction nozzle) 18 Handling mechanism (Suction nozzle) 19 Shift mechanism 20 Inversion mechanism 21, 22 Lane change mechanism 23A-23D Taping lane

Claims (2)

(57) [Claims] 1. A lead frame supply for supplying a strip-shaped lead frame in which a large number of electronic components, which have been cut and bent with leads led from an exterior resin portion, are integrally aligned after pellet mounting, wire bonding and resin molding are completed. Section and a plurality of turntables are continuously arranged, and a handling mechanism for holding electronic components according to the type of the lead frame is arranged at equal positions on the periphery of the turntable following the lead frame supply section. An electronic device that has a pick-and-place mechanism that transfers electronic components to the turntable by uniaxial transfer, and performs subsequent processing such as mold appearance, measurement, and marking on the peripheral edge positions of each turntable. A handling mechanism that holds multiple parts in parallel is installed to the final turntable. The transfer / processing unit is equipped with a shift mechanism that cuts the delivery of child parts to the handling mechanism one by one, and multiple lanes are arranged in parallel adjacent to the final turntable, and the handling mechanism is distributed to each lane and packed. A composite taping device for electronic parts, comprising: a taping section provided with a lane change mechanism. 2. A lead frame member supply section and a plurality of lead frame member supply sections in a composite process of measuring, inspecting and imprinting individual lead parts from a lead frame member on which a plurality of mold parts are mounted, and layering them based on the measurement results. A turntable and a handling unit having a handling mechanism, and a taping unit having a lane change mechanism for arranging a plurality of lanes side by side and allocating mold components from the preceding stage to each lane, A plurality of molded parts are transferred by the pick-and-place mechanism for transfer to the next table, and a pair of molded parts are individually sold on the terminal side turntable after each processing of appearance inspection / characteristic inspection and marking display. A shift mechanism that cuts out is provided, sorted by the characteristic measurement, sorted into each lane, and packed. Composite taping apparatus of electronic components, characterized in that.