JP2667712B2 - Compound processing equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a mini-mold transistor (MM-Tr) using a hoop-shaped or strip-shaped lead frame.
The present invention relates to a combined processing device for semiconductor devices used for manufacturing semiconductor devices such as a semiconductor device.

[Conventional technology]

For example, semiconductor elements such as mini-mold transistors are
It is manufactured collectively using a hoop-shaped or strip-shaped lead frame. In the lead frame, a large number of lands and a plurality of leads whose free ends extend near the periphery of each of the lands are integrally connected with a tie bar in a band shape. Then, after mounting the semiconductor pellet on each of the lands and wire bonding between the electrode of the semiconductor pellet and the free end of the lead, the main part including the free end of the semiconductor pellet and the lead is sealed with resin. The stopper and the lead around the stop are separated from the lead frame, and then the lead is formed into a predetermined shape to obtain an individual semiconductor element. The semiconductor element thus obtained is subjected to characteristic measurement, stamped based on the result, and then taped and packaged on an embossed tape according to characteristic classification to be commercialized.

In the manufacture of the semiconductor device, a pellet mount,
Conventionally, three manufacturing devices have been used to cut a lead frame after the wire bonding and resin sealing operation steps, obtain individual semiconductor elements, and then tap and package them. That is, the lead frame is cut into individual pieces by a cutting / molding machine to form a lead, then the rank characteristics are measured by a rank characteristics measuring / classifying machine, classified by rank characteristics, and then stamped, stamped by a taping machine. Packing by taping.

[Problems to be solved by the invention]

By the way, the steps of obtaining individual semiconductor elements from a lead frame after completion of the steps of pellet mounting, wire bonding and resin encapsulation and packing them by taping are performed by three manufacturing apparatuses as in the related art. The semiconductor devices in the manufacturing equipment are stored loosely, and the semiconductor elements to the next manufacturing equipment are also loosely supplied by the parts feeder, etc. Chipping or cracking of the mold part due to impact There was a problem that there was a high possibility that defective products such as different types, defective products, and dusts were mixed.

Therefore, the present invention has been made in view of the above-described problems, and a semiconductor device is always obtained until a semiconductor element is obtained from a lead frame after the pellet mount / wire bonding and resin sealing operation steps are completed, and the semiconductor element is taped and packed. An object of the present invention is to provide a semiconductor manufacturing apparatus capable of ensuring high reliability by handling an element.

[Means for solving the problem]

In order to achieve the above object, the present invention provides a lead frame supply unit that supplies a lead frame after a pellet mounting, a wire bonding, and a resin sealing work process are completed, and a plurality of turntables are continuously arranged, and each turntable is A plurality of handling mechanisms adapted to hold the semiconductor element in accordance with each process at the peripheral portion circumferentially equidistant position, and a transfer unit capable of transferring the semiconductor element between the handling mechanisms of adjacent turntables, And a taping unit for taping and packing a semiconductor element that has been transported by a plurality of turntables and has undergone cutting, lead forming, characteristic measurement, and stamping processes.

[Action]

According to the present invention, the semiconductor elements can be handled at all times until the individual semiconductor elements are cut from the lead frame after the pellet mount / wire bonding and the resin sealing work steps are completed, and the semiconductor elements are taped and packed. Storage and bulk supply can be omitted.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows an embodiment applied to the case of manufacturing a mini-mold transistor. In this embodiment, a compound processing apparatus for a semiconductor device comprises a lead frame supply unit (A), a transport unit (B) and a taping unit (C). ).

The lead frame supply unit (A) rewinds the hoop-shaped lead frame after completion of the pellet mount / wire bonding and resin sealing operation steps from the hoop (1) and conveys it on the conveyance path (2) in the direction of the arrow. The lead frame is configured to be brushed during transportation to be cut into individual semiconductor elements.

The transport unit (B) includes, for example, a delivery table (3), a forming table (4), a stamping table (5), and an insertion table (6).

The delivery table (3) is a turntable that rotates intermittently in the direction of the arrow in the figure, and a handling mechanism, for example, a suction head (7) that suctions the lower surface of the semiconductor element is provided at a position on the periphery of the turntable. Yes 4 provided, the position U ₁ receives cut adsorption head (7), the presence or absence detecting position U _2, are made to correspond to the position U ₃ and the remaining detection position U ₄ is supplied to the forming table (4).

The forming table (4) is a turntable that rotates intermittently in the direction of the arrow in the figure, and has a handling mechanism, for example, a suction head (8) that suctions the upper surface of the semiconductor element at a position equidistantly arranged around its periphery. There are eight,
A position F _{1 for} receiving the suction head (8) from the delivery table (3), a forming position correction and presence / absence detection position F ₂ , a first forming position F ₃ , a second forming position F ₄ , a measurement position correction position F ₅ , and a rank. It corresponds to the measurement position F ₆ , the position F ₇ supplied to the marking table (5) and the residual detection position F ₈ .

The marking table (5) is a turntable that rotates intermittently in the direction of the arrow in the figure, and a handling mechanism, for example, a suction chuck head that sucks and chucks a semiconductor element from its lower surface at a position equally circumferentially around its periphery. Eight (9) are provided, the position N _{1 for} receiving the chuck chuck head (9) from the forming table (4), the presence / absence detection position
N ₂ , laser marking position N ₃ , brushing position N ₄ , marking recognition position N ₅ , position N ₆ to supply to the insertion table (6), empty position N _7, and remaining detection position N ₈ .

The insertion table (6) is a turntable that rotates intermittently in the direction of the arrow in the figure, and a handling mechanism, for example, a suction head (10) adapted to suction the upper surface of the semiconductor element at a position equally spaced around the periphery thereof. 8 are provided, and the position S _{1 for} receiving the suction head (10) from the marking table (5),
Storage and measurement position correction position S ₂ according to rank characteristics, rank measurement position S ₃ , NG semiconductor element discharge and insertion angle position correction position S ₄ , empty position S ₅ , tape insertion position S ₆ , empty position S _{7 in} rank measurement and are made to correspond to the remaining detection position S _8.

The taping unit (C) changes the embossing step from the tape supply reel (11) (11) to the tape storage reel (12).
In the course of winding on (12), the semiconductor element supplied from the emboss insertion table (6) of the emboss tape is inserted and then taped to produce a product.

 Next, the operation of the present invention will be described.

First, the suction in the lower surface of the suction head of the semiconductor device of the conveyance unit (B) of the delivery table (3) is piece cut from the lead frame by a lead frame supply unit (A) in the cut receiving position U ₁ (7) Hold and receive the semiconductor element from the lead frame supply unit (A).
Semiconductor elements received in the delivery table (3) is led to the supply position U ₃ through the presence or absence detecting position U ₂ with the intermittent rotation of the receiving pass table (3), wherein, receiving a forming table (4) Position the suction head is located in the F ₁ (8) is the delivery from the held by suction from the upper surface by transfer table (3) on the forming table (4). Semiconductor element delivery into the forming table (4) is the first forming position through a forming position correction and presence detection position F ₂ in accordance with the intermittent rotation of the forming table (4)
It led to F _3, wherein the first lead forming is performed, followed by a second lead forming in the second forming position U ₄ of the following is performed. The semiconductor element on which the first and second lead molding have been performed is
With the intermittent rotation of the forming table (4) through a measurement position correction position F ₅ led to rank measurement position F _6, wherein the rank measurement is performed, followed by stamping table at the next supply position F ₇ (5) is delivery in marking table from being adsorbed and chuck the lower surface by the suction chuck head located at position N ₁ receives the (9) forming the table (4) (5). Semiconductor element delivery into marking table (5) is led to the laser marking position N ₃ through the presence or absence detecting position N ₂ in accordance with the intermittent rotation of該捺mark table (5), wherein the forming table described above (4) based on the results of the rank measurements performed in rank measurement position F ₆ is laser marking is performed by rank characteristics, followed by brushing to remove the resin layer during the laser marking in the next brushing position N ₄ is carried out. Thereafter, the semiconductor device is led to the supply position N ₆ through the stamping recognition position N _5, wherein the insertion table (6) by receiving the suction head located in the position S ₁ (10) held by suction the upper surface inserted table ( It is passed to 6). Performs rank characteristics different storage taping covered element in inserted table (6) semiconductor element delivery into the said insertion table (6) measurement position correction position S ₂ in accordance with the intermittent rotation of the measurement for the taping target element After the position is corrected, the rank measurement position S ₃
In performed again rank properties as the second test immediately before taping, with characteristic failure of the product is discharged at the position correction position S ₄ on the basis of this result, it corrects the insertion angle position other things. At this time, the semiconductor element is inserted into the embossed embossed tape of the taping unit (C) in the tape insertion position S _6, it is taped to the product by taping unit.

〔The invention's effect〕

According to the present invention, the semiconductor device is always individually sucked and held until the semiconductor device is cut into individual pieces from the lead frame after the pellet mount / wire bonding and resin sealing steps and then packaged by taping. Since delivery and handling are performed, it is possible to omit the conventional storage and supply of loose pieces, thereby ensuring high reliability of product quality. In addition, since the devices that were conventionally divided into three units can be integrated into one unit, not only can a series of operations be automated, but also significant labor saving can be achieved and high productivity can be secured.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing one embodiment of a semiconductor device according to the present invention. (A) ... Lead frame supply unit, (B) ... transport unit, (C) ... taping unit, (3) ... delivery table, (4) ... forming table, (5) ... stamping table, (6) ... insertion table.

Claims (1)

(57) [Claims] 1. A lead frame supply unit for supplying a lead frame that has completed pellet mounting, wire bonding, and resin sealing operations, and a plurality of turntables are continuously arranged, and the circumference of each turntable is evenly distributed around the periphery. A plurality of handling mechanisms for holding a semiconductor element in accordance with each operation step at a position, a transfer unit capable of transferring semiconductor elements between handling mechanisms of adjacent turntables, and the plurality of turntables And a taping unit for taping and packing the semiconductor element which has been conveyed by the above and has undergone a cutting / lead forming / characteristic measurement and marking step.