JP4202102B2 - Taping device for semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing apparatus for semiconductor devices such as chip parts, and more specifically, separates a semiconductor device from a lead frame, a tray, and an adhesive sheet on which a plurality of semiconductor devices are mounted, and performs a characteristic test and packaging. In the manufacturing apparatus for performing the (taping) process, the means for transferring the separated individual semiconductor devices is improved.
[0002]
In particular, the present invention eliminates an insertion error and simplifies the operation by reliably positioning the semiconductor device and the concave insertion pocket of the carrier tape when inserting the semiconductor device into the taping device. A taping device for a semiconductor device capable of dramatically improving the operating rate of the semiconductor device is provided.
[0003]
[Prior art]
Electronic components including semiconductor elements such as mini-mold transistors are manufactured in a batch using a strip-shaped lead frame, and these are divided into individual electronic components before shipment. In this case, after taking out the electronic components from the lead frame, it is typically transported using a rotary transport mechanism consisting of a rotary table, and in this transport process, it is necessary for shipping such as measurement of external dimensions and electrical characteristics, and stamping. After a series of processing is performed, it is inserted into the packing tape.
[0004]
Recently, the characteristics of leadless semiconductor elements manufactured by dividing into individual brazing processes, such as CSP (Chip Size Package), whose demand is increasing due to the widespread use of portable computers. After performing combined processing such as visual inspection and taping, it is shipped by taping according to quality rank. That is, in the brazing process of the leadless semiconductor element, individual leadless semiconductor elements are formed with a brazing saw in a state in which a thin plate-shaped resin mold substrate in which a plurality of leadless semiconductor elements are formed in series at a high density is adhered to a wafer sheet. Each of the leadless semiconductor elements subdivided into millimeter sizes in this process is sent to the next combined processing facility and finally taped and packed.
[0005]
In this packing tape insertion process, an electronic component is picked up and held by a holding mechanism such as suction or chucking from a rotary transport mechanism, and inserted into a carrier tape having a plurality of concave insertion pockets. Is done. At that time, if there is a deviation between the position of the electronic component held by the holding means and the position of the insertion pocket, the electronic component will not be inserted at the correct position, causing damage to the electronic component and a significant decrease in manufacturing efficiency. It will be.
[0006]
There are two possible causes for this displacement. One is the error between the holding position of the electronic component and the concave insertion pocket position when the electronic component is inserted into the carrier tape, and the other is the pocket molding position in the insertion pocket molding process of the carrier tape. It is an error. In order to solve such problems, the following techniques have been proposed as taping devices for semiconductor devices.
[0007]
For example, Patent Document 1 discloses a technique for preventing the positional deviation of the carrier tape on the taping device due to the vibration of the drive motor in the electronic component insertion step. That is, the taping device 70 as shown in FIG. 9 is provided with an insertion side sprocket 72 provided with a speed reduction mechanism 71 and a packing side sprocket 73, and the insertion side sprocket 72 is connected to an intermittent rotation mechanism 75 via a belt 74. The carrier tape 77 is transported by intermittently rotating with the power of the drive motor 76. The electronic component supply station 78 is arranged on a vertical straight line through the shaft 79 of the insertion-side sprocket 72.
[0008]
In the taping device 70 having such a configuration, the vibration of the drive motor 76 can be attenuated by the intermittent rotation mechanism 75, and the rotation of the insertion side sprocket 72 connected to the intermittent rotation mechanism 75 is reduced by the speed reduction mechanism 71. Therefore, the rotation stop position of the insertion side sprocket 72 can be adjusted. And since the electronic component supply station 78 is provided on the vertical straight line of the shaft 79 of such an insertion side sprocket 72, the electronic component can be accurately inserted into the insertion pocket of the carrier tape 77, and The positioning accuracy between the carrier tape 77 and the electronic component can be increased.
[0009]
Patent Document 2 discloses a carrier tape positioning means as a technique for preventing displacement of the insertion pocket in the carrier tape manufacturing process. That is, in the carrier tape manufacturing apparatus 80 shown in FIG. 10, the front tension sprocket 81 and the back tension sprocket 82 apply front tension and back tension to the carrier tape 83, respectively, thereby correcting the position of the carrier tape in the reverse feed direction. This enables the punching position of the carrier tape 81, that is, the insertion pocket molding position to be accurately positioned.
[0010]
[Patent Document 1]
JP 2001-130508 A
[Patent Document 2]
JP-A-8-293527
[0011]
[Problems to be solved by the invention]
By the way, as the leadless semiconductor element described above, in recent years, the semiconductor device has been reduced in size and thickness, and accordingly, the insertion pocket and the semiconductor device when the semiconductor device is inserted into the concave insertion pocket of the carrier tape, The clearance between is getting very little.
[0012]
Therefore, it is necessary to accurately position the semiconductor device and the insertion pocket more than before, and in order to do so, as shown in the above cited reference 1, the length direction of the carrier tape is the XX ′ direction ( Positioning only YY ′ (symbol in FIG. *), Which is the width direction of the carrier tape, is necessary because only the positioning of symbol (in the figure *) alone may cause an insertion error.
[0013]
Also, carrier tapes generally have different specifications for each production lot, and naturally the position of the insertion pocket also differs for each tape. Therefore, when using a carrier tape of a different lot in one semiconductor manufacturing apparatus, the position of the insertion pocket of the tape is shifted from front to back and from side to side for each carrier tape. It was necessary to make adjustments, which hindered the improvement of work efficiency. This is a problem that cannot be solved no matter how the manufacturing accuracy of the carrier tape itself is improved, as disclosed in Citation 1.
[0014]
The present invention has been proposed in order to solve the above-described problems of the prior art, and its purpose is to provide a concave insertion pocket provided in a carrier tape when a semiconductor device is inserted into a taping device. The present invention provides a taping device for a semiconductor device that can eliminate mistakes in inserting a semiconductor device, simplify operations, and dramatically improve the operation rate of the entire device by reliably performing positioning.
[0015]
[Means for Solving the Problems]
  In order to achieve the above object, a first aspect of the present invention relates to a taping device for a semiconductor device in which a semiconductor device transferred from a semiconductor device transfer device is housed in a recess provided in a carrier tape and packed. Is stopped at the semiconductor device insertion position by the semiconductor transfer device, and the carrier tape drive device that intermittently transfers, and a position detection device that detects the position of the recess of the carrier tape stopped at the semiconductor device insertion position, A position deviation amount determination device for comparing the position of the recess detected by the position detection device with the insertion position of the semiconductor device inserted from the transfer device to determine the amount of position deviation between the two, and the position deviation amount In accordance with the amount of positional deviation determined by the determination device, the carrier test is performed so that the position of the recess matches the insertion position of the semiconductor device. And a concave portion position correcting device for moving the driving device flopThe concave position correcting device is provided with an operating mechanism for moving the entire carrier tape driving device in the width direction of the carrier tape in accordance with the positional deviation amount, and the operating mechanism is a cam driven by a motor. And a cam follower plate provided on the carrier tape drive side and pressed by the cam.
[0016]
  According to a second aspect of the present invention, there is provided a taping device for a semiconductor device in which a semiconductor device transferred from a semiconductor device transfer device is accommodated in a recess provided in a carrier tape and packed, and the carrier tape is a semiconductor by the semiconductor transfer device. A carrier tape drive device that intermittently transfers while stopping at the insertion position of the device, a position detection device that detects the position of the concave portion of the carrier tape stopped at the insertion position of the semiconductor device, and the position detection device The position shift amount determination device for comparing the position of the recessed portion and the insertion position of the semiconductor device inserted from the transfer device to determine the amount of position shift between the two and the position shift determined by the position shift amount determination device According to the amount, the carrier tape drive device is moved so that the position of the recess matches the insertion position of the semiconductor device. A part position correcting device, and the concave portion position correcting device includes the carrier tape driving device as a whole, a table that moves in the carrier tape width direction, and an operating mechanism that moves the table in accordance with the amount of positional deviation. It is provided.
[0017]
  In the above aspect,In a state where the carrier tape is stopped at the insertion position of the semiconductor device, the position of the concave portion of the carrier tape is detected by the position detection device, and the position of the concave portion detected from the position detection device by the positional deviation amount determination device. Compared with a normal position based on the insertion position of the semiconductor device transferred from the transfer device, the amount of misalignment between the two is determined, and the position of the recess is matched with the normal position by the recess position correction device. It is possible to move the carrier tape drive. Accordingly, the amount of positional deviation between the carrier tape and the semiconductor device can be accurately grasped, and the position of the semiconductor device and the concave portion of the carrier tape can be accurately matched, so that the semiconductor device can be inserted into the carrier tape. It is possible to prevent mistakes and improve work efficiency.
[0018]
  Even if the position of the concave portion of the tape is different for each carrier tape, the position can be accurately grasped by the position detecting device and the positional deviation amount determining device, and the concave portion is corrected by the concave portion correcting device. Since the position can be corrected, it is not necessary to readjust the taping device for each carrier tape even when using a different lot of carrier tape in a single semiconductor manufacturing device. The operating rate of the taping device can be improved.
[0020]
  in addition,It is possible to move the entire carrier tape drive when the position of the carrier tape recess and the position of the semiconductor device in the width direction of the carrier tape do not match due to differences in the production lot of the carrier tape. Therefore, in addition to the first aspect of the invention, the carrier tape can be positioned in accordance with the difference in the recess position for each carrier tape.
[0022]
  Furthermore, in the first or second aspect of the invention, the operation mechanism comprises a cam driven by a motor and a cam follower plate provided on the table side and pressed by the cam. By adding the configuration of claim 3,As a mechanism for moving the entire carrier tape driving device, positioning in the carrier tape width direction can be performed by a simple mechanism in which the cam is simply rotated by a motor.
[0023]
  Claim4The invention of claim 1 to claim 13In the invention according to any one of claims 1 to 3, the concave position correction device uses the carrier tape drive device to set the carrier tape stop position to a positional deviation amount determined by the positional deviation amount determination device with respect to the length direction of the carrier tape. It is characterized by being shifted considerably.
[0024]
  Claims having such a configuration4According to the invention, the positional deviation amount with respect to the length direction of the carrier tape can be accurately grasped by the position detecting device and the positional deviation amount judging device, and the concave portion position can be corrected by the concave portion position correcting device. Even if a single semiconductor manufacturing device uses carrier tapes of different lots, there is no need to readjust the taping device for each carrier tape, improving work efficiency and improving the operating rate of the taping device. Can be achieved.
[0025]
  In particular,Since the position of the carrier tape can be corrected in both the length direction and the width direction, the carrier tape can be positioned more accurately, so that the positioning accuracy can be significantly improved. become.
[0026]
  Claim5The invention of claim4In this invention, the carrier tape driving device includes a sprocket pin that meshes with a perforation provided in the length direction of the carrier tape, and a motor for driving the sprocket that includes the sprocket pin on the circumference, and the motor for driving the sprocket. The stop position of the carrier tape is shifted by an amount corresponding to the position shift amount by the position shift amount determination device.
[0027]
  Claims having such a configuration5According to the invention of claim4The position correction with respect to the length direction of the carrier tape described in 1 is performed more securely by fixing the carrier tape with a sprocket pin that meshes with the perforation of the carrier tape and driving the motor for driving the sprocket. Will be able to.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. First, the overall configuration of a semiconductor manufacturing apparatus D (hereinafter referred to as apparatus D) including the taping apparatus C according to the present embodiment will be described with reference to FIGS. In this embodiment, the concave portion in the claims is exemplified as a concave insertion pocket 2 provided in the carrier tape of the taping device C, and the semiconductor transfer device is a semiconductor device provided on the index table. Illustrated as the holding unit 20. In addition, the insertion position in the claims means that the semiconductor device holding unit 20 holds the semiconductor device W in the process of transferring the semiconductor device from the semiconductor device holding unit to the insertion pocket 2 of the taping device C. Refers to the spatial position of the state. Further, the carrier tape driving device in the claims refers to two sprockets 3a and 3b, which will be described later, and the concave position correcting device refers to the driving motor 4, the position correcting instruction device 8 and the cam mechanism 5 serving as an operating mechanism. Is included.
[0029]
[1-1. Configuration of this embodiment]
[overall structure]
1 and 2 are a plan view and a cross-sectional view schematically showing the overall configuration of the device D. FIG. As shown in these drawings, the device D according to the present embodiment includes an index table 10 and a plurality of semiconductor device holding units arranged on the index table 10 at a predetermined interval (angle) along the peripheral edge thereof. 20. The index table 10 is intermittently rotated at regular intervals by transmitting the driving force of the driving motor 11 by the timing belt 12.
[0030]
In the vicinity of the outer periphery of the index table 10, a semiconductor device supply device 30 that individually supplies a predetermined number (one in the illustrated example) of semiconductor devices to each holding unit 20 of the index table 10, a holding unit 20 is provided with a position correction device 40 for correcting the position of the semiconductor device held on the semiconductor device 20, a characteristic test device 50 for the semiconductor device, and a taping device C of the present embodiment for packing the semiconductor device that has undergone processing such as the characteristic test. Yes. In the figure, 51 is a probe of the characteristic test apparatus 50.
[0031]
Although not shown, in addition to the characteristic test device 5, various devices such as a marking device and a non-defective product / defective product sorting device are provided around each index table 10 during the intermittent rotation of the index table 10. It can arrange | position corresponding to a stop position.
[0032]
As shown in FIG. 2, the supply device 30 includes a wafer ring holding unit 31, push-up pins 32 that push up and separate individual semiconductor devices W from the wafer sheet held on the wafer ring holding unit 31, A transfer device 30 is provided that sucks the semiconductor device lifted by the push-up pin 32 and conveys it to the holding unit 20 on the index table 10.
[0033]
The peripheral portion of the wafer sheet is fixed by a wafer ring, and the semiconductor element is separated by extending the wafer sheet using the wafer ring. That is, a peripheral portion of a wafer sheet is fixed to a metal wafer ring, and a plurality of leadless semiconductor devices are divided and adhered to a central portion of the wafer sheet. Further, the wafer ring holding unit 31 is an XY table that can move and rotate in the horizontal plane in the front, rear, left, and right directions. An arbitrary semiconductor device W is attracted to the transfer device 33 and supplied to the index table 10.
[0034]
[Configuration of taping device C]
Next, the structure of the taping apparatus C in this embodiment is demonstrated using FIGS. Here, FIG. 3 is a top view showing the overall configuration of the taping device C in the present embodiment, and FIG. 4 is a side view showing the overall configuration of the taping device C in the present embodiment.
[0035]
In FIG. 3, the taping device C includes a carrier tape 1 having a plurality of concave insertion pockets 2 in the length direction into which the semiconductor device W is inserted, and a packing device P direction in which the carrier tape 1 is packaged by thermocompression bonding of the semiconductor device W. Two insertion-side sprockets 3a and packing-side sprockets 3b, a drive motor 4 serving as a rotational drive source for the insertion-side sprockets 3a, and a cam mechanism 5 provided on a side surface of the insertion-side sprocket 3a. . Further, a position detection device 6 provided on the upper portion of the carrier tape 1 on the vertical straight line of the central axis S of the insertion side sprocket 3a, a positional deviation amount determination device 7 electrically connected to the position detection device 6, and a position correction. And a pointing device 8. Note that an insertion position is provided on the packing device P side of the position detection device 6 so that the semiconductor device holding portion 20 delivers the semiconductor device W to the insertion pocket 2 with an interval of the insertion pocket 2. .
[0036]
Among these, the carrier tape 1 has a plurality of insertion pockets 2 on the length direction XX ′ axis, which are approximately the volume of the semiconductor device W that is the object to be inserted, and either one of the right and left sides (here, the X direction). On the right side, a perforation 1a is provided. This perforation 1a is provided in the XX ′ direction at the same interval as sprocket pins 3c and 3d (3d not shown) provided on the circumferences of the sprockets 3a and 3b. The carrier tape 1 is fixed on the sprockets 3a and 3b by the sprocket pins 3c and 3d passing through the perforation 1a.
[0037]
As shown in FIG. 4, the insertion-side sprocket 3 a has a cylindrical roll shape and is configured to be rotatable via a central central axis S, and with respect to the YY ′ direction that is the width direction of the carrier tape 1. Is also slid, and is biased to the Y side by the spring B at the arrow Y ′ side rotation shaft S portion. In addition, as described above, the drive motor 4 is connected to the central axis S, and the rotation of the drive motor 4 mainly rotates clockwise so as to send the carrier tape 1 in the X direction in which the packaging device P is present. It is also configured to rotate counterclockwise in accordance with the action of the position correction instruction device 8.
[0038]
On the other hand, the packing-side sprocket 3b is provided on the opposite side of the insertion-side sprocket 3a via the packing device P, has the same size and the same shape as the insertion-side sprocket 3a, and is rotatable via the central axis S ′. It is configured. Unlike the insertion-side sprocket 3a, this packing-side sprocket 3b does not have a drive source, but rotates in synchronization with the rotation of the insertion-side sprocket 3a, and the carrier tape 1 conveyed from the sprocket 3a side is indicated by an arrow X. Send out in the direction.
[0039]
As shown in FIGS. 3 and 4, the cam mechanism 5 is provided on one side surface portion of the insertion-side sprocket 3a as described above, and includes an eccentric cam 5a and a cam motor 5b for rotating the eccentric cam 5a. Consists of. As shown in the enlarged view of FIG. 5, on the basis of the state in which the eccentric cam 5a is in contact with the side surface of the insertion-side sprocket 3a on the shortest radius r side (FIG. 5A), either left or right is driven by driving the cam motor 5b. It is configured to rotate in either direction. Accordingly, the eccentric cam 5a presses the side surface of the insertion-side sprocket 3a toward the contact point Q having the longest radius R, and the pressing force overcomes the urging force of the spring B, so that the insertion-side sprocket 3a moves in the direction of arrow Y ′. (Figs. 5B to 5C).
[0040]
As described above, the position detection device 6 is provided on the upper portion of the carrier tape 1 on the vertical straight line S of the central axis of the insertion-side sprocket 3a, and includes image recognition means such as a CCD camera. This position detection device 6 is a device for detecting a displacement of the insertion pocket 2, and as shown in FIGS. 6A and 6B, the insertion pocket provided on the carrier tape 1 by the internal camera 6a. The difference between the actual position 2 and the regular position is imaged. Here, the regular position means an insertion position I which is a spatial position where the semiconductor device W is transferred from the semiconductor device holding unit 20 to the insertion pocket 2.
[0041]
The positional deviation amount determination device 7 is connected to the position detection device 6, and the deviation amount α in the XX ′ direction and the deviation in the YY ′ direction based on the image V captured by the position detection device 6. The amount β is configured to be determined. That is, the position deviation amount determination device 7 is input in advance with the position (regular position) of the semiconductor device W supplied to the taping device C by the holding unit 20. The positional deviation amount α or β is determined by comparing the position of the insertion pocket 2 obtained from the captured image V.
[0042]
Further, the position correction instruction device 8 is configured to instruct the drive motor 4 and the cam motor 5b to perform the displacement correction based on the determination result of the position shift amount determination device 7. Specifically, a correction instruction for the deviation α in the XX ′ direction is instructed to the drive motor 4, and a correction instruction for the deviation β in the YY ′ direction is instructed to the cam motor 5b. In response to this instruction, as described above, the insertion side sprocket 3a and the eccentric cam 5a are configured to perform either a clockwise or counterclockwise rotational movement.
[0043]
[1-2. Operation of this embodiment]
The taping device C and the semiconductor manufacturing device D including the semiconductor device according to the present embodiment having the above-described configuration specifically operate as follows.
[0044]
[Operation of device D as a whole]
First, an outline of the operation of the entire semiconductor manufacturing apparatus D will be described. In FIG. 1, the semiconductor device W supported on the wafer ring holding unit 31 of the semiconductor device supply device 30 moves each wafer device W on the holding unit 31 by moving the wafer ring holding unit 31 in the direction of the arrow in the figure. Are sequentially pushed up and moved to the position of the pin 32. The semiconductor device W that has reached the position of the push-up pin 32 is pushed up from the wafer ring by the push-up pin 32, is attracted by the transfer device 33 that is waiting above it, and is transferred to the index table 10 side. In this case, in this embodiment, the electrode terminal T provided in the semiconductor device W is transferred in a state where it is exposed upward.
[0045]
The semiconductor device W transferred to the index table 10 side is placed on the vacuum suction device 23 of the semiconductor device holding unit 20 stopped at the delivery position of the index table 10 with the electrode terminal T exposed upward. The vacuum suction device 23 is held so as not to move inadvertently on the holding unit 20.
[0046]
After the semiconductor device W is placed on the holding unit 20 stopped at the delivery position, as shown in FIG. 2, when the index table 10 rotates intermittently, the holding unit 20 reaches the next correction position. Then, the correction arm of the position correction device 40 provided at the correction position approaches the holding unit 20 and presses the semiconductor device W on the holding unit 20 from one side direction. Then, the semiconductor device W is pressed on the vacuum suction device 23 of the holding unit 20 to a position where the center of the semiconductor device W coincides with the center of the holding unit 20. At this time, since the semiconductor device W is sucked and held by the vacuum suction device 23, when it is pressed by the correction arm with a force larger than the suction force, the semiconductor device W moves so as to slide on the vacuum suction device 23 and is regulated by the correction arm. It is positioned at the position to be done.
[0047]
The semiconductor device W positioned in this way is sent to the next stop position, that is, the position of the characteristic test apparatus 50 as the index table 10 rotates. In this characteristic test apparatus 50, the probe 51 of the test apparatus 50 contacts the electrode terminal T of the semiconductor device W and performs a predetermined test. In this case, accurate detection of the position of the semiconductor element and positioning of the probe 51 are performed using a CCD camera or the like so that the probe 51 comes into contact with each other.
[0048]
After the characteristic test is completed in this way, other necessary processing is performed for each stop position associated with the intermittent rotation of the index table 10, and finally the semiconductor device W performs the next packing process from the index table 10. It is transferred to the taping device C according to the present embodiment. That is, when the holding unit 20 holding the semiconductor device W reaches the transfer position Z to the taping device C on the index table 10 and stops, the holding unit 20 is reversed while holding the semiconductor device W. As a result, the semiconductor device W is positioned at the insertion position I for delivering the semiconductor device W to the insertion pocket 2 shown in FIG. It should be noted that the semiconductor device W remains sucked and held by the holding unit 20 until a series of processing such as position detection in the device C described later is completed.
[0049]
[Operation of taping device C]
Next, after the semiconductor device W is positioned at the insertion position I, operations of the position detection device 6, the positional deviation amount determination device 7, and the position correction instruction device 8 will be described with reference to FIGS.
[0050]
As described above, when the semiconductor device W is located at the insertion position I, the amount of deviation between the actual position of the insertion pocket 2 provided on the carrier tape 1 and the normal position is detected by the internal camera 6a of the position detection device 6. Is imaged (FIG. 6B). Then, the positional deviation amount determination device 7 adjacent to and connected to the position detection device 6 is based on the image V picked up by the position detection device 6, and the positional deviation amount α in the XX ′ direction and the YY ′ direction. The shift amount β is determined.
[0051]
The determination result is transmitted to the position correction instruction device 8, and based on this result, the position correction instruction device 8 instructs the drive motor 4 and the cam motor 5b to perform deviation correction. Specifically, for the deviation α in the XX ′ direction, a signal is sent to the drive motor 4 so as to rotate in the clockwise direction by correcting the deviation amount α, and the deviation β in the YY ′ direction is set. On the other hand, a signal is sent to the cam motor 5b in the state shown in FIG. 5A so as to rotate in the left or right direction by correcting the shift amount β.
[0052]
When the drive motor 4 and the cam motor 5b rotate based on the above instructions, the insertion-side sprocket 3a rotates clockwise about the central axis S, while the eccentric cam 5a has the shortest radius r portion. To the position of the appropriate radius r ′. Here, the appropriate radius r ′ is a value where r′−r becomes the shift amount β, and this rotation amount is instructed from the position correction instruction device 8. By this rotation, the carrier tape 1 fixed from the perforation 1a via the sprocket pin 3c on the insertion side sprocket 3a moves in the direction of the arrow X by the amount of deviation α. Further, when the side surface of the arrow Y ′ of the insertion-side sprocket 3a is pressed by the eccentric cam 5a, this pressing force overcomes the urging force of the spring B in the Y ′ direction, and the insertion-side sprocket 3a serving as the drive device is displaced. It will move in the direction of arrow Y by β (see FIG. 3).
[0053]
With the above operation, the carrier tape 1, particularly the insertion pocket 2, moves in the directions of arrows X and Y in the figure. Here, the above operation is repeated again by the position detection device 6 and the position deviation determination means 7, and it is determined whether or not the actual position of the insertion pocket 2 matches the normal position. The series of processing by the position deviation determination means 7 and the position correction means of the position correction instruction device 8 is terminated, and if not matched, the above processing is repeated.
[0054]
When the position correction process is completed, the semiconductor device W held in the semiconductor device holding unit 20 is inserted into the insertion pocket 2 from the holding unit 20. Then, the drive motor 4 rotates in the direction in which the carrier tape 1 is conveyed in the arrow X direction by the interval of the insertion pocket 2. Further, since the packing-side sprocket 3b also rotates in synchronization with the rotation of the insertion-side sprocket 3a, the carrier tape 1 is conveyed in the direction of the packing device P accordingly.
[0055]
Note that the above-described operation in the present embodiment may be performed every time the semiconductor device W is held by the holding unit 20 at the insertion position I, or manufactured when the carrier tape is replaced. You may comprise so that it may carry out only when the shift | offset | difference appears in the position of the insertion pocket 2 from the difference of a lot, ie, the beginning of work. Further, in order to improve the insertion accuracy of the semiconductor device W into the insertion pocket 2 and eliminate an insertion error, only the position detection by the two devices of the position detection device 6 and the positional deviation amount determination device 7 is performed for each insertion pocket 2 or Further, it is also possible to configure such that each of the plurality of insertion pockets 2 acts with a certain interval.
[0056]
Further, in order to prevent the carrier tape 1 from being distorted or twisted between the sprockets 3a and 3b as the insertion side sprocket 3a is moved in the Y-axis direction, the cams are also formed on the side surface of the packing side sprocket 3b. It is also possible to provide a cam mechanism 5 ′ and a spring B ′ having the same configuration and action as the mechanism 5 and the spring B so as to synchronize the sliding operations of both sprockets.
[0057]
[1-3. Effects of this embodiment]
The present embodiment acting as described above has the following effects. That is, in a state where the carrier tape 1 is stopped at the insertion position I of the semiconductor device W, the position detection device 6 detects the position of the insertion pocket 2 of the carrier tape 1 and the positional deviation amount determination device 7 detects this position. The actual position of the insertion pocket detected from the detection device 7 is compared with the normal position to determine the amount of displacement between the two, and the position correction device 8 matches the position of the insertion pocket 2 with the normal position. Thus, the sprocket 3a, which is a carrier tape drive, can be moved. Accordingly, it is possible to accurately grasp the amount of positional deviation between the carrier tape 1 and the semiconductor device W, and to accurately match the position of the semiconductor device W and the position of the insertion pocket 2, so that the insertion pocket of the semiconductor device W 2 can be prevented from being mistaken for insertion, and work efficiency can be improved.
[0058]
In general, the carrier tape 1 has a positional relationship between the position of the insertion pocket 2 of the tape and the perforation 1a for each production lot. Regardless of the difference in the positional relationship, the positional deviation β between the regular position and the actual position of the insertion pocket 2 can be accurately grasped, and the position of the insertion pocket 2 can be corrected by the position correction device 8. Even when a plurality of carrier tapes of different lots are used in one semiconductor manufacturing apparatus D, it is not necessary to readjust the taping apparatus C for each carrier tape, improving work efficiency and operating the taping apparatus. The rate can be improved.
[0059]
In particular, in the present embodiment, when there is a deviation between the normal position and the actual position of the insertion pocket 2, the insertion sprocket that is the carrier tape drive device with respect to the Y-axis direction that is the width direction of the carrier tape. Since the entire 3a can be moved, it is suitable for dealing with the difference in the positional relationship between the position of the insertion pocket 2 and the perforation 1a due to the difference in the production lot of the carrier tape.
[0060]
Further, as a mechanism for moving the entire sprocket 3a as described above, the carrier tape 1 can be moved by a simple mechanism in which the cam motor 5b and the eccentric cam 5a of the cam mechanism 5 are moved by the biasing force of the spring B. Positioning in the width direction can be easily performed.
[0061]
On the other hand, the positional deviation amount α with respect to the length direction of the carrier tape 1, that is, the X-axis direction in the drawing, can be accurately grasped by the position detecting device 6 and the positional deviation amount determining device 7 and inserted by the position correcting device 8. It is possible to correct the position of the pocket 2 and improve the working efficiency and the operating rate of the taping device.
In particular, in the present embodiment, the position correction in the X-axis direction can be performed by driving the sprocket driving motor 4 while fixing the carrier tape 1 with the sprocket pin 3c meshing with the perforation 1a. Correction can be performed reliably.
[0062]
As described above, in the present embodiment, the position correction in the X-axis direction and the position correction in the Y-axis width direction of the carrier tape 1 can be performed simultaneously by the rotation of the insertion side sprocket 3a and the rotation of the eccentric cam 5a. Furthermore, accurate positioning of the carrier tape 1 is possible. Therefore, it is possible to significantly improve the positioning accuracy that is not found in the prior art.
[0063]
[2. Other Embodiments]
In addition, this invention is not limited to the said embodiment, The following other embodiment is also included.
[0064]
(1) For example, it is also possible to configure as a taping device 60 as shown in FIG. That is, the taping device 60 is provided with the sprockets 3a and 3b according to the present embodiment on the table U that moves in the Y-axis direction that is the carrier tape width direction, and the cam mechanism 5 that moves the table U in the Y-axis direction. The eccentric cam 5a is in contact with the Y ′ side surface portion of U, and further, the Y side surface of the table U is provided with a biasing means such as a spring for biasing the table U toward the Y ′ side. . Other configurations and operations are the same as those in the present embodiment.
[0065]
Even with the taping device 60 as described above, as in the present embodiment, the position shift of the insertion pocket 2 of the carrier tape 1 is not only in the X-axis direction which is the tape length direction but also in the Y-axis direction which is the tape width direction. Therefore, it is possible to remarkably improve the positioning accuracy of the carrier tape, and it is possible to easily cope with a plurality of carrier tapes with different production lots using a single semiconductor manufacturing apparatus. is there. Further, since both the sprockets 3a and 3b are installed on the table U, the movement in the Y-axis direction can be performed synchronously by both sprockets, so that the carrier tape 1 is distorted or twisted between the sprockets 3a and 3b. In addition, it is not necessary to provide cam mechanisms and springs on both the sprockets 3a and 3b as in the above-described embodiment, and a simpler configuration can be achieved.
[0066]
(2) In addition to using the cam mechanism 5 as an apparatus for moving the table U, an electromagnetic cylinder or a plunger or a linear motor can be used.
[0067]
(3) Further, in the present embodiment, there is a problem with position correction for the regular position and the actual position of the insertion pocket 2, but the present invention is not limited to such a case, and As described above, position correction can be performed even by a difference in semiconductor devices. That is, when the position of the semiconductor device transferred to the taping device C changes depending on the type or lot of the semiconductor device or the state of the characteristic test, instead of setting the semiconductor device position in the determination device in advance, The position of the semiconductor device to be transferred is detected each time using a CCD camera or the like, and the detected position of the semiconductor device is compared with the position of the insertion pocket 2 detected by the position detection device 6 in the same way. It is also possible to determine the amount.
[0068]
(4) In the present embodiment, the index table 10 is used as a device for transferring the semiconductor device W to the taping device C. However, the present invention is limited to a device using such a transfer means. Instead, for example, it is possible to use a linearly configured transfer means such as a handling device or a conveyor, and any device may be used as long as it has a configuration for transferring and inserting the semiconductor device into the taping device. .
[0069]
(5) Furthermore, the taping device of the present invention can be constructed using any known taping packaging technique.
[0069]
【The invention's effect】
As described above, according to the taping device for a semiconductor device of the present invention, when the semiconductor device is inserted into the taping device, the concave insertion pocket provided on the carrier tape is reliably positioned, thereby It is possible to eliminate the insertion mistake and simplify the operation, and to dramatically improve the operation rate of the entire apparatus.
[Brief description of the drawings]
FIG. 1 is a side view showing an overall configuration of a semiconductor manufacturing apparatus including a taping apparatus according to an embodiment of the present invention.
FIG. 2 is a top view showing an overall configuration of a semiconductor manufacturing apparatus including a taping apparatus according to an embodiment of the present invention.
FIG. 3 is a top view showing the overall configuration of the taping device according to the embodiment of the present invention.
FIG. 4 is a side view showing the overall configuration of the taping device according to the embodiment of the present invention.
FIG. 5 is a schematic diagram showing the configuration and operation of a cam mechanism according to an embodiment of the present invention.
FIG. 6A is a side view showing the configuration of the position detection device according to the embodiment of the present invention, and FIG.
FIG. 7 is a block diagram showing a configuration of position correction means according to the embodiment of the present invention.
FIGS. 8A and 8B are a top view and a side view showing an overall configuration of a taping device according to another embodiment of the present invention. FIGS.
FIG. 9 is a side view showing a taping device for a semiconductor device in the prior art.
FIG. 10 is a perspective view showing a taping device for a semiconductor device in the prior art.
[Explanation of symbols]
1, 77, 83 ... carrier tape
1a ... Perforation
2 ... Insert pocket
3a, 72 ... insertion side sprocket
3b, 73 ... packing side sprocket
3c, 3d ... Sprocket pin
4, 11, 76 ... drive motor
5 ... Cam mechanism
5 ... Characteristics test equipment
5a ... Eccentric cam
5b ... Cam motor
6 ... Position detecting device
6a ... Internal camera
7: Deviation amount determination device
8. Position correction instruction device
10 ... Index table
12. Timing belt
20 ... Semiconductor device holding part
23 ... Vacuum suction device
30 ... Semiconductor device supply device
31 ... Wafer ring holder
32 ... pin
33 ... Transfer device
40. Position correction device
50 ... characteristic test equipment
51 ... Probe
71 ... Deceleration mechanism
74 ... Belt
75: Intermittent rotation mechanism
78 ... Electronic component supply station
79 ... axis
80 ... Carrier tape manufacturing apparatus
81 ... Front tension sprocket
82 ... Back tension sprocket
B, B '... Spring
C, 60, 70 ... Taping device
D ... Semiconductor manufacturing equipment
P ... Packing equipment
S ... Center axis
T ... Electrode terminal
U ... Table
V ... Image
W ... Semiconductor device
W ... Semiconductor element

Claims (5)

In a taping device of a semiconductor device for storing and packing a semiconductor device transferred from a semiconductor device transfer device in a recess provided in a carrier tape,
A carrier tape driving device that intermittently transfers the carrier tape while stopping at the insertion position of the semiconductor device by the semiconductor transfer device;
A position detection device for detecting the position of the concave portion of the carrier tape stopped at the insertion position of the semiconductor device;
A positional deviation amount determination device that compares the position of the concave portion detected by the position detection device with the insertion position of the semiconductor device inserted from the transfer device and determines the positional deviation amount between the two,
A concave position correcting device that moves the carrier tape driving device so as to match the position of the concave portion and the insertion position of the semiconductor device according to the positional deviation amount determined by the positional deviation amount determining device ;
The concave position correcting device is provided with an operation mechanism for moving the entire carrier tape driving device in the width direction of the carrier tape according to the amount of positional deviation.
2. The taping device for a semiconductor device according to claim 1, wherein the operating mechanism includes a cam driven by a motor and a cam follower plate provided on the carrier tape driving device side and pressed by the cam. In a taping device of a semiconductor device for storing and packing a semiconductor device transferred from a semiconductor device transfer device in a recess provided in a carrier tape,
A carrier tape driving device that intermittently transfers the carrier tape while stopping at the insertion position of the semiconductor device by the semiconductor transfer device;
A position detection device for detecting the position of the concave portion of the carrier tape stopped at the insertion position of the semiconductor device;
A positional deviation amount determination device that compares the position of the concave portion detected by the position detection device with the insertion position of the semiconductor device inserted from the transfer device and determines the positional deviation amount between the two,
A concave position correcting device that moves the carrier tape driving device so as to match the position of the concave portion and the insertion position of the semiconductor device according to the positional deviation amount determined by the positional deviation amount determining device ;
The recess position correction device includes the entire carrier tape driving device, and a table that moves in the carrier tape width direction;
A taping device for a semiconductor device, characterized in that an operating mechanism for moving the table according to the amount of positional deviation is provided. 3. The taping device for a semiconductor device according to claim 2 , wherein the operation mechanism includes a cam driven by a motor and a cam follower plate provided on the table side and pressed by the cam. The concave position correcting device shifts the stop position of the carrier tape by the carrier tape driving device by an amount corresponding to the positional deviation amount by the positional deviation amount judging device with respect to the length direction of the carrier tape. taping apparatus for a semiconductor device according to any one of 1 to 3. The carrier tape drive device includes a sprocket pin that meshes with a perforation provided in the length direction of the carrier tape, and a sprocket drive motor that includes the sprocket pin on the circumference, and the carrier tape is driven by the sprocket drive motor. 5. The taping device for a semiconductor device according to claim 4 , wherein the stop position is shifted by an amount corresponding to the amount of misalignment by the misalignment amount determination device.

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