JP3927180B2 - Semiconductor device manufacturing apparatus and manufacturing method - Google Patents

Description

  The present invention relates to an apparatus and method for manufacturing a semiconductor element such as a chip component, and more specifically, separates a semiconductor element from a lead frame, a tray, and an adhesive sheet on which a plurality of semiconductor elements are mounted. The present invention provides a semiconductor device manufacturing apparatus and a manufacturing method for performing a process while transporting a semiconductor element to a plurality of processing mechanisms in a manufacturing apparatus that performs each process such as a test and a packing (taping) process.

  Electronic components including semiconductor elements such as mini-mold transistors are manufactured in a batch using a strip-shaped lead frame, and these are divided into individual electronic components before shipment. In this case, after taking out the electronic components from the lead frame, they are transported using a transport mechanism, and in this transport process, after undergoing a series of process processing required for shipping such as measurement of external dimensions and electrical characteristics, and stamping, Inserted into packing tape.

  In recent years, the characteristics of leadless semiconductor elements such as CSP (Chip Size Package), which are in increasing demand due to the spread of portable computers, are also measured in the brazing process. After performing combined processing such as visual inspection and taping, it is shipped by taping according to quality rank. That is, in the brazing process of the leadless semiconductor element S, individual leadless semiconductors are formed by a brazing saw in a state in which a thin resin-molded substrate in which a plurality of leadless semiconductor elements are formed in series at a high density is attached to a wafer sheet. The element is subdivided into elements, and each of the leadless semiconductor elements S subdivided into millimeter sizes in this process is sent to the next composite process, and each process is performed.

Specifically, the holding mechanism holding the semiconductor element is subjected to a plurality of process processes while being sequentially transferred to the process processing mechanism disposed on the semiconductor element manufacturing apparatus by driving of the transfer mechanism. As a holding mechanism in such a semiconductor element manufacturing apparatus, there is a holding mechanism such as a vacuum suction type or a chuck type, and a process processing mechanism is generally a turntable type or a linear conveyance type conveyance. A unit is composed of one or a plurality of combinations, and a unit having a plurality of process processes on a turntable or a transport unit is used. The transport mechanism includes the holding mechanism as described above, and intermittently rotates the process processing unit provided in the process processing mechanism, thereby transporting the semiconductor element between the process processes. The process is stopped for each processing position, and a semiconductor element is inserted into the process processing mechanism to perform each process such as electrical characteristics and appearance inspection. After the process processing is completed, the transport mechanism pulls out the semiconductor element from the process processing mechanism and is driven again to transport the semiconductor element to the next process process (for example, Patent Documents 1 and 2 below).
Japanese Patent No. 2531006 Japanese Patent No. 2667712

  However, the conventional semiconductor element manufacturing apparatus has the following problems. That is, on the turntable, many process processes such as appearance inspection and electrical characteristic inspection are provided at the circumferentially equidistant positions, but each process of the process processing mechanism performs different process processes according to the purpose. Therefore, there is a difference in processing time for each process. For example, as shown in FIG. 7, when each process process of electrical characteristic measurement, alignment, and appearance inspection is performed at a certain stop position, the appearance inspection is less than half of the electrical characteristics inspection due to the characteristics of the process. In spite of the completion of the process in time, it is necessary to wait for the electrical characteristic inspection process to be completed even after the process is completed. That is, in a transport mechanism that performs intermittent rotation of the turntable and performs all processes at once, it is necessary to match the processing time of other processes with the process that requires the longest stoppage time. For this reason, in practice, work that has been completed in less than half of the stop time must be kept on standby for a time equivalent to the processing time, resulting in poor work efficiency and consequently reduced productivity. It was.

  Further, in order to improve the processing efficiency due to the problems as described above, in the prior art, the process processing mechanism is provided with as many processes as possible, and a plurality of transfer mechanisms (turntables) are provided. In this case, the process processing mechanism and the conveyance mechanism itself are not enlarged, complicated, or expensive, and it is difficult to cope with the miniaturization of the semiconductor element as the stop position accuracy decreases. Also, coupled with the increase in size of the device, a drive source with a large output and a stop mechanism with a large braking force are required, which further increases the weight of the device, resulting in increased trouble in the transport mechanism and increased vibration of the entire device. Furthermore, there are concerns about an increase in troubles in the entire apparatus and an increase in required strength of the apparatus installation floor.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and the object thereof is a semiconductor element that performs process processing while transporting the semiconductor element to a mechanism that performs each process process on the semiconductor element. By increasing the number of process steps per stop for the transport mechanism that transports semiconductor elements, the transport mechanism can be reduced in size and weight, and can be used for miniaturization of semiconductor elements. Thus, the present invention provides a semiconductor device manufacturing apparatus and a manufacturing method with high work efficiency and high productivity.

In order to achieve the above object, the invention of claim 1 includes a turntable type transport mechanism that rotates intermittently, a holding mechanism that holds a plurality of semiconductor elements provided at circumferentially equidistant positions of the transport mechanism, The holding mechanism is provided at a position that coincides with a stop position at which the holding mechanism is intermittently stopped, and includes a plurality of types of process processing mechanisms that perform predetermined process processing on the semiconductor element. On the other hand, in the semiconductor element manufacturing apparatus that performs a predetermined process on the semiconductor element by moving the holding mechanism in the direction of the rotation axis of the transport mechanism and supplying the semiconductor element to the process processing unit of the process processing mechanism, At least one of the plurality of types of process processing mechanisms includes a process processing group in which different types of process processing units are provided side by side with respect to the movement direction of the holding mechanism. Wherein the multiple step processing unit to move in the rotational axis direction of the transport mechanism forming the step treatment groups and supplies a semiconductor device.

The invention of claim 4 captures the invention of claim 1 from the viewpoint of the method, and a plurality of turntable transport mechanisms that rotate intermittently and a plurality of circumferentially equidistant positions of the transport mechanism are provided. A control device controls a holding mechanism that holds the semiconductor element and a plurality of process processing mechanisms that are provided at positions that coincide with a stop position at which the holding mechanism stops intermittently and that performs predetermined process processing on the semiconductor element. The semiconductor element is moved by the holding mechanism in the direction of the rotation axis of the transfer mechanism with respect to the semiconductor element transferred by the intermittent rotation of the transfer mechanism, and the semiconductor element is supplied to the process processing unit of the process processing mechanism. In the method of manufacturing a semiconductor device in which a predetermined process is performed, at least one of the plurality of types of process processing mechanisms includes different types of process processing units arranged in the moving direction of the holding mechanism. A plurality of process processing units that form the process processing group by moving the holding mechanism in the direction of the rotation axis of the transport mechanism by the control device. And

  According to the invention of claim 1 or 4 having the above-described configuration, a semiconductor element is formed by forming a process processing group in which two or more process processing parts for performing predetermined process processing are provided on the semiconductor element. A plurality of processing steps with a short processing time can be performed per one stop of the transport mechanism, and the number of stops of the transport mechanism can be reduced. Further, it is possible to improve work efficiency and productivity by providing a processing step unit having a long processing time and providing a processing step group in which a plurality of processing step units having a short processing time are combined.

  Further, since the number of holding mechanisms provided in the transport mechanism can be reduced as the stop position of the transport mechanism decreases, the transport mechanism can be reduced in size and weight. Thereby, the accuracy of the stop position of the transport mechanism is improved, and it becomes easy to cope with the miniaturization of the semiconductor element. Furthermore, the drive source of the transport mechanism can be simplified and the stop mechanism can be reduced in weight, so that the energy consumption of the entire device can be reduced and the trouble of the transport mechanism can be reduced by reducing the weight. It is possible to reduce the trouble and the required strength of the equipment installation floor.

According to a second aspect of the present invention, in the first aspect of the invention, the plurality of types of process processing mechanisms include process processes each having a different processing time, and a process processing mechanism including a single process processing unit, and the process processing. The processing time of the process processing mechanism provided with the group is configured to be substantially the same. In the invention of claim 2 as described above, a plurality of process processing units are combined according to the processing time, and the processing time of each process processing group or the processing time of a single process processing unit is made substantially the same. There is no need for a process with a short process processing time to be combined with a process with a long process processing time as in the case of an apparatus constituted only by the process processing section. Since it becomes possible to adjust the processing time of the group, it is possible to significantly improve work efficiency and productivity.

According to a third aspect of the present invention, in the first or second aspect of the invention, the plurality of holding mechanisms are moved at independent movement timings for each of the process processing mechanisms, and are moved to the process processing position of the process processing mechanism. It is characterized by supplying.

In the invention of claim 3 as described above , the plurality of holding mechanisms are combined with each other according to the processing time by moving each of the process processing mechanisms at an independent movement timing, and each process It is possible to control the processing time of the processing group or the processing time of the single process processing unit to be substantially the same, and it is possible to significantly improve work efficiency and productivity.

  According to the semiconductor element manufacturing apparatus of the present invention, by increasing the number of process steps per stop of the transport mechanism that transports the semiconductor element, the transport mechanism can be reduced in size and weight, and the semiconductor element can be miniaturized. Therefore, it is possible to provide a semiconductor device manufacturing apparatus and a manufacturing method with high work efficiency and high productivity.

(1) Present Embodiment Hereinafter, the best mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be specifically described with reference to the drawings. First, the overall configuration of a semiconductor element manufacturing apparatus D (hereinafter referred to as apparatus D) including the semiconductor element S according to the present embodiment will be described with reference to FIGS.

[1. Configuration of this embodiment]
[1-1. overall structure]
FIG. 1 is a front view and a side view schematically showing the overall configuration of the apparatus D. In FIG. 1, for convenience of explanation, the scale of each member is shown in a simplified manner and is different from the actual scale. Further, in FIG. 1B, illustration of some members is omitted for convenience.

  As shown in these drawings, the device D in the present embodiment includes a turntable transport mechanism 1 and a plurality of holding mechanism sections 2 arranged at regular intervals at circumferentially equidistant positions of the transport mechanism 1. And. In addition, the semiconductor element S is subjected to processing such as position correction, appearance inspection, electrical characteristic inspection, stamping, defective product discharge, taping, and residual element inspection at a position that matches the holding mechanism portion 2 below the transport mechanism 1. A process processing mechanism 3 including a process processing unit is provided. The apparatus D further includes a parts feeder 4 in the vicinity of the transport mechanism 1 that automatically aligns the semiconductor elements and feeds them to the transport mechanism 1 side. Between the parts feeder 4 and the transport mechanism 1, the parts feeder 4 A transport path 5 is provided for individually feeding the sent semiconductor element to each holding mechanism section 2 of the transport mechanism 1.

As described above, the transport mechanism 1 is a turntable type, and transmits a driving force of a driving motor (not shown) by a timing belt (not shown), whereby a constant interval (here, 60 ° interval) in the direction of the arrow in the drawing. And intermittently rotate in the clockwise direction. And the conveyance mechanism 1 rotates by setting the delivery position of the semiconductor element S of the process processing mechanism 3 and the conveyance path 5 provided in the lower part as a stop position. In the present embodiment, the passing position of the semiconductor element S and the stop position T _1, a stop position corresponding to the step processing mechanism 3, is referred to as T ₂ through T ₆ along the direction of rotation.

  A plurality of holding mechanism sections 2 are provided in a suspended state along the intermittent rotation interval of the conveyance mechanism 1 at the circumferentially equidistant positions of the conveyance mechanism 1 as described above (here, six at 60 ° intervals). The semiconductor element is held by vacuum suction with a suction nozzle. In addition, a moving mechanism 6 that moves the holding mechanism unit 2 up and down is provided between the holding mechanism unit 2 and the transport mechanism 1. The moving mechanism 6 lowers the holding mechanism unit 2 toward each process processing unit when the holding mechanism unit 2 stops on the process processing unit of the process processing mechanism 3 due to the intermittent rotation of the transport mechanism 1. The semiconductor element is inserted into the position where each process in each process processing unit is performed, and is raised again after the process is completed. Here, in the present embodiment, the position in the horizontal direction of the semiconductor element S attracted and held by the holding mechanism unit 2 at the stop position of the transfer mechanism 1 is referred to as a transfer position H. The position where each process is performed is called a processing position P.

As described above, the process processing mechanism 3 is provided at a position that coincides with the holding mechanism portion 2 below the transport mechanism 1, and corrects the position of the semiconductor element S, appearance inspection, electrical characteristic inspection, stamping, defective product discharge, taping, residual Each process such as element inspection is performed. Electrical properties In particular, the stop position T _2, provided the position correction apparatus 3a and the appearance inspection device 3b to perform the position correction and visual inspection, the stop position T _3, to perform electrical testing of the semiconductor device S inspection device 3c is provided, marking devices and the defective discharge unit is provided in the stop position T _4, taping device is provided in the stop position T _5. Further, the stop position T _6, the residual element detecting device is provided to check the residual of the semiconductor element S.

Parts feeders 4, the semiconductor element is automatically aligned, which feeds the transport mechanism 1 side, is provided in the vicinity of the stop position T ₁ in the intermittent rotation of the conveyance mechanism 1. Further, between the parts feeder 4 and the transport mechanism 1, there is provided a transport path 5 for individually supplying the semiconductor elements sent from the parts feeder 4 to each holding mechanism section 2 of the transport mechanism 1. . Then, by the conveying path 5, the semiconductor device S conveyed to the stop position T ₁ transport mechanism 1 is adapted to be picked up and held by the suction nozzle of the holding device 2 in this position.

[1-2. Configuration of process processing mechanism and holding mechanism]
Next, specific configurations of the holding mechanism unit 2, the process processing mechanism 3, and the moving mechanism 6 of the present invention will be described with reference to FIG.

Of the process processing mechanisms 3 in the semiconductor element manufacturing apparatus D having the above-described configuration, a part of the process processing mechanism 3 includes a process processing group having a plurality of process processing units. Specifically, T _2, which is one of the stop positions conveying mechanism 1 in the step processing mechanism 3, as shown in FIG. 2 (a), 2 two-step treatment with the position correction apparatus 3a and the appearance inspection device 3b The process process group provided with the part is formed. On the other hand, as shown in FIG. 2 (b), as another step processing mechanism, here, take up electrical characteristic test device 3c stop position T ₃ which is one step processing unit.

Of the stop position T ₂ step processing mechanism 3, as described above, the position correcting unit 3a, and the appearance inspection apparatus 3b is provided. That is, two process processes of alignment and appearance inspection are provided at one stop position. The position correction device 3a is a device that corrects the positional deviation in the front-rear and left-right directions in the suction state of the semiconductor element S delivered from the parts feeder 4 to the holding mechanism unit 2 via the transport path 5, and is shown in FIG. As shown in a), correction members X and Y are provided on both the left and right sides of the semiconductor element S at substantially the same interval as the width of the semiconductor element S, and the upper portion thereof is tapered. The position of the semiconductor element S is corrected by inserting the semiconductor element S from above into the position correction device 3a.

  The position correction method is not limited to the method of inserting the semiconductor element S as described above. For example, as shown in FIG. 3A, the correction member of the position correction device 3a is moved in the left-right direction, It is also possible to adopt a configuration in which the position is corrected by sandwiching the semiconductor element from the left and right directions. Also, the position correction direction is not limited to the left and right directions, for example, a method of sandwiching from four directions as shown in FIG. 3B, or the four sides are surrounded as shown in FIG. It may be a method of inserting into a tapered concave recess.

  Further, the appearance inspection apparatus 3b inspects the appearance defects of the semiconductor element S supplied from the parts feeder 4, such as breakage, chip presence / absence, dirt, slit missing due to sealing resin voids, and the like. In this embodiment, there are an inspection of an external appearance taken as an image by a camera, an optical inspection performed by irradiating light, and an X-ray inspection performed by irradiating X-rays. You may comprise in any thing.

As shown in FIG. 3A, the position correction device 3a and the appearance inspection device 3b are installed in an upper portion and a lower portion in the device D in the present embodiment, so that one process processing group is formed. It is forming. Specifically, the position correction device 3a is provided in the upper part, and the appearance inspection device 3b is provided in the lower part. Then, the transport mechanism 1 holding the semiconductor element via a holding mechanism 2 is intermittently rotated from the stop position T _1, when stopped at the stop position T ₂ are, the moving mechanism 6 lowers the holding mechanism 2 First, when stopping at the position of the position correction device 3a that is the first stop position, position correction is performed, and the position is further lowered and stopped on the appearance inspection device 3b that is the second stop position. Configured to be done.

On the other hand, the electrical characteristic test device 3c stop position T _3, the transport mechanism 1 holding the semiconductor element via a holding mechanism 2 is intermittently rotated from the stop position T _2, stopped at the second stop position T ₃ In this case, the electric characteristics of the semiconductor element S are inspected when the moving mechanism 6 lowers the holding mechanism portion 2 and stops on the electric characteristic inspection apparatus 3c.

Here, the position correction process in the stop position T ₂ (the first stop position) and appearance inspection step (the second stop position), the time required for processing the electrical characteristic inspection process in the stop position T _3, 4 As shown in FIG. 5, the sum of the processing times of the position correction process and the appearance inspection process is configured to be substantially the same as the processing time of the electrical characteristic inspection process. In other words, the time required for insertion from the transfer position H to the position correction device, position correction, descent to the appearance inspection process, stop, inspection, rise and return to the transfer position H, and electrical property inspection from the transfer position H The time required for insertion into the apparatus, completion of the electrical characteristic inspection, rising and returning to the transport position H again is substantially the same without any stagnation at any position.

[2. Operation of this embodiment]
The semiconductor element manufacturing apparatus D of the present embodiment having the above-described configuration specifically operates as follows.

[2-1. Operation of entire semiconductor element manufacturing apparatus D]
First, an outline of the operation of the entire semiconductor element manufacturing apparatus D will be described. In FIG. 1, the semiconductor elements S aligned and sent out from the parts feeder 4 are individually supplied to each holding mechanism portion 2 provided in the transport mechanism 1 that rotates intermittently via the transport path 5 (stop). Position TT ₁ ). The semiconductor element S sucked and held by the holding mechanism unit 2 is transported by the transport mechanism 1 onto the process processing mechanism 3 including a plurality of process processing units provided at the stop positions T _{2 to} T _6. Each process is performed in each process processing unit such as an inspection device, an electrical characteristic inspection device, a stamping device, and a defective product discharge mechanism. Further, the semiconductor device S ended these steps process, taping is performed by taping device 7 provided at the stop position T _5, so that the series of processes are completed.

[2-2. Action of process processing mechanism and holding mechanism]
Next, the operation of the process processing mechanism and the holding mechanism of the present invention will be specifically described with reference to FIGS. As described above, picked up from the conveying path 5 is discharged from the parts feeder 4 by the holding mechanism portion 2 of the transfer mechanism 1, the semiconductor device S held is conveyed to the stop position T ₂ while intermittently rotated come. If you stop the stop position T _2, as shown in FIG. 2 (a), lowering the moving mechanism 6 is holding mechanism 2 provided on the holding mechanism 2 to perform alignment, the semiconductor element and the first stop position Is inserted into the position correction position of the position correction device 3a.

  In this position correction device 3a, the position of the semiconductor element S is corrected by being inserted from above the correction plates X and Y whose upper portions are tapered and inserted to the lower portions of the correction plates X and Y. Then, it further descends and stops at the processing position P on the appearance inspection apparatus 3b provided at the lower part of the position correction apparatus 3a, that is, at the second stop position. Then, in this appearance inspection apparatus 3b, the presence or absence of defects on the appearance of the semiconductor element S is inspected. After the appearance inspection is completed, the moving mechanism 6 raises the holding mechanism unit 2 to the upper part of the position correction device 3a, and the semiconductor element S is returned to the transport position H.

On the other hand, the electrical characteristic test device 3c stop position T _3, the semiconductor device S has been stopped is conveyed from the stop position T ₂ by intermittent rotation of the conveying mechanism 1, the holding mechanism 2 is lowered by the moving mechanism 6, the electrical characteristics test It is inserted into the device port 3d. Then, the electrical characteristics of the semiconductor element S are inspected. After completion of the inspection, the moving mechanism 6 pulls the holding mechanism portion 2 up to the upper part of the electrical characteristic inspection apparatus 3c and the semiconductor element S is returned to the transport position H as described above.

Here, as shown in FIG. 4, the position correction and visual inspection at the stop position T _2, the processing time required for electrical testing at the stop position T _3, it is configured to be substantially the same, also, other steps processor The processing time is substantially the same. Therefore, the operations from insertion of the semiconductor element S to the process processing unit to pulling up and transfer to the next process are performed without any loss in any process processing unit.

[3. Effects of this embodiment]
The semiconductor element manufacturing apparatus D of the present embodiment that operates as described above specifically has the following effects. That is, of the process unit step processing mechanism 3, and a position correcting unit 3a and the visual inspection apparatus 3b, constituting the one stop position T ₂ as step treatment group, that the position correction and visual inspection in the stop position By performing the two process steps, the semiconductor element S can be subjected to a plurality of process steps by one stop of the intermittent rotation operation of the transport mechanism 1 of the semiconductor element S. Accordingly, it is possible to reduce the number of stops of the transport mechanism 1. Also, an electrical property inspection device 3c that performs electrical property inspection with a long processing time is provided alone, and a position correction device 3a that performs position correction, which is a processing step with a short processing time, is combined with an appearance inspection device 3b that performs visual inspection. By providing, it is possible to shorten the processing time as a whole, so that it is possible to improve work efficiency and productivity.

  Further, by combining the position correction device 3a and the appearance inspection device 3b, which are processing steps having a short processing time, the processing time of the electrical property inspection device 3c having a long processing time and the processing time by the above combination are made substantially the same. be able to. Therefore, for example, in the case of an apparatus composed of only a single process processing unit as in the prior art, unless a long process process is completed, the transport mechanism cannot be rotated to advance to the next process, Although the process having a short time has finished the process, the process has to be stopped until the process of the process having a long process time is completed. However, in this embodiment, such a process is not necessary and the process time is long. Since the position correction and the appearance inspection with a short processing time can be performed before the electrical characteristic inspection is completed, it is possible to significantly improve work efficiency and productivity.

  In addition, as described above, the holding mechanism unit provided in the transport mechanism 1 is provided by reducing the stop position of the transport mechanism 1 by providing the position correction device 3a and the appearance inspection device 3b of the process processing mechanism 3 in combination. Since the number of 2 can be reduced, the transport mechanism 1 can be reduced in size and weight, and the mechanism can be simplified. This makes it possible to improve the accuracy of the stop position of the transport mechanism 1 and facilitate the handling of the minute semiconductor element S. Further, the drive source of the transport mechanism 1 can be simplified and the stop mechanism can be reduced in weight, so that the energy consumption of the entire apparatus D can be reduced and troubles in the transport mechanism can be reduced due to the weight reduction. It is possible to reduce vibrations and troubles, and to reduce the required strength of the equipment installation floor.

(2) Other Embodiments The present invention is not limited to the above-described embodiments, and includes the following embodiments.

  In the present embodiment, the process processing group is formed by combining the position correction apparatus 3a and the appearance inspection apparatus 3b on the basis of the process processing time in the electrical property inspection apparatus 3c of the process processing mechanism 3. It is not limited to such a combination, and a plurality of process processes having different process times can be combined in various ways depending on the purpose or process time to form a process process group. This makes it possible to freely combine them according to the purpose and processing time of the process processing unit possessed by the semiconductor device manufacturing apparatus having various purposes, and also to shorten the processing time of the entire apparatus. it can.

For example, although not included in the process shown in FIG. 1, the entire apparatus is the same as described above even when a step of visually inspecting characters stamped on a semiconductor package is performed on the basis of a processing time for electrical characteristic inspection. It is possible to shorten the processing time. That is, depending on the semiconductor manufacturing process, the semiconductor element may be supplied to this apparatus that performs various inspections and taping processes after the semiconductor element is first stamped. In such a case, the marking of the semiconductor element is performed on the upper surface portion. However, as described above, the suction nozzle sucks and conveys the upper surface portion of the semiconductor element, so that the stamp character is hidden by the suction nozzle and is printed as it is. The appearance inspection of the characters could not be performed. As a method of avoiding this, as shown in FIG. 6A or FIG. 6B, the semiconductor device S held by the suction nozzle of the holding mechanism unit 2 is transferred to another transfer mechanism E such as a turntable at the release position T. ₄ , the transport mechanism E transported to the appearance inspection position T ₆ for processing. That is, in this apparatus, in addition to providing the transport apparatus E separately, the transport apparatus 1 also requires two stop positions of the semiconductor element S release position T ₄ and reception position T ₇ .

  However, according to the present invention, one stop as shown in FIG. 5A is performed by performing an appearance inspection of the characters stamped on the semiconductor element S in accordance with the processing time based on the processing time of the electrical characteristic inspection. Processing can be performed at the position. In other words, at the character inspection stop position where the appearance camera C is installed, the semiconductor element S is once released from the suction nozzle of the holding mechanism unit 2 and the upper surface portion of the semiconductor element S can be imaged by the appearance camera C for inspection. After the inspection is completed, the suction nozzle of the holding mechanism unit 2 is lowered again, and the semiconductor element S can be re-sucked. As a result, it is possible to reduce the receiving position and the separate transport mechanism, and to improve the overall production efficiency.

Also, similar to the above visual inspection, by the reference processing time of electric characteristic inspection, marking process has been performed while moving the conventional two stop positions also processed in one place of the processing position T ₄ shown in FIG. 1 It becomes possible to do. That is, marking steps definitive conventional semiconductor device manufacturing apparatus, as shown in FIG. 6 (a) or (c), separately provided conveyance device E, and conveyed the conveying mechanism E until stamping processing position T ₅ treatment There is a need to provide two stop positions, a release position T ₄ of the semiconductor element S and a receiving position T ₇ .

However, in the present invention, as shown in FIG. 5 (b), the stamping process can be performed at one stop position by performing the stamping process in accordance with the processing time of the electrical characteristic inspection as a reference. It becomes like this. That is, at the marking position T ₄ where the marking device N is installed, the semiconductor element S is released from the suction nozzle of the holding mechanism unit 2 on the bed B, and the bed B can be marked on the upper surface of the semiconductor element S by the marking device N. Move to the end and perform the marking process. Then, after the marking is completed, the suction nozzle of the holding mechanism unit 2 is lowered again to re-suck the semiconductor element S. As a result, the marking process, which has conventionally been required to be performed with two stop positions, can be performed at one stop position T ₄ for the release position and the receiving position of the semiconductor element S. The number of transport mechanisms can be reduced, and the overall production efficiency can be improved.

  In this way, a plurality of transfer devices conventionally formed by turntables are provided, and the processing that had to be delivered between turntables can be performed at one stop position without this delivery work. As compared with the prior art, there is a remarkable effect in simplifying the device configuration. In the present invention, by performing the appearance inspection process or the stamping process by the above-described method, for example, the other processing steps shown in the above embodiment, for example, the position correction device 3a and the appearance are performed on the basis of these processing times. It is also possible to perform a processing process in a process processing group combined with the inspection apparatus 3b. As a result, it goes without saying that the same effect as in the case where the processing time of the electrical characteristic inspection is used as a reference in the above embodiment can be obtained.

  In the present embodiment, the transport mechanism is configured using a turntable. However, the present invention is not limited to such a configuration, and for example, a linear transport or any other known transport mechanism may be used. The same effects as the case can be achieved.

  In addition, as a method for holding the semiconductor element in the present embodiment, a configuration is adopted in which a suction nozzle is provided in the holding mechanism and held by vacuum suction. However, the present invention is limited to such a configuration. However, any other known holding method can be used, for example, by chucking mechanically.

  In this embodiment, processing such as position correction, appearance inspection, electrical property inspection, stamping, defective product elimination, taping, and residual inspection is provided in the process processing section, but these are merely examples, and in the present invention, a semiconductor is used. Similar effects can be realized by using any process used in the element manufacturing process. Further, in the present embodiment, the position correction and the appearance inspection are set as one process processing group, and the electrical characteristic inspection is taken up as the other process processing, and the processing time is made the same. Without limitation, it is possible to adjust the processing time by combining any other process. For example, by combining the stamping process and the defective product exclusion process, it is possible to perform the process of pressing the stamp only on the elements that are not excluded as defective products at one stop position.

  In the present embodiment, the holding mechanism portion is configured to move up and down by the moving mechanism while holding the semiconductor element, but the present invention is not limited to such a configuration, and the holding mechanism portion is It can also be movable in any direction depending on the arrangement of the process processing mechanism. For example, the process processing units in the process processing group of the present invention can be arranged in parallel from the center of the transport mechanism toward the outside, and the holding mechanism can be moved in the diameter direction. Further, the drive source of the holding mechanism section may be driven by any known drive means such as a linear motor, a rotary motor, a solenoid coil, a cylinder or the like. Further, any known driving force transmission mechanism such as a gear, a lever, a cam, a belt, and a ball screw may be combined.

Schematic (a) and (b) which shows the whole structure of the semiconductor element manufacturing apparatus which concerns on embodiment of this invention. The schematic diagram which shows the effect | action of the holding mechanism part and process processing mechanism which concern on embodiment of this invention. The front view (a), perspective view (b), and (c) which show other composition of the maintenance mechanism part and process processing mechanism concerning the embodiment of the present invention. The figure which shows the process process and its time in the semiconductor element manufacturing apparatus which concerns on embodiment of this invention. The schematic diagram which shows the effect | action of the holding mechanism part and process processing mechanism which concern on other embodiment of this invention. The schematic diagram which shows an example of the process process in the conventional semiconductor element manufacturing apparatus. The figure which shows the process processing and its time in the conventional semiconductor element manufacturing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Conveyance mechanism 2 ... Holding mechanism part 3 ... Process processing mechanism 3a ... Position correction apparatus 3b ... Appearance inspection apparatus 3c ... Electrical characteristic inspection apparatus 3d ... Electrical characteristic inspection apparatus port 4 ... Parts feeder 5 ... Conveyance path 6 ... Movement mechanism 7 ... Taping device B ... Bed C ... Appearance camera D ... Semiconductor element manufacturing device E ... Conveying device N ... Stamping device S ... Semiconductor element X, Y ... Correction member

Claims (4)

A turntable transport mechanism that rotates intermittently, a holding mechanism that holds a plurality of semiconductor elements provided at circumferentially equidistant positions of the transport mechanism, and a position that matches a stop position at which the holding mechanism stops intermittently A plurality of types of process processing mechanisms that perform predetermined process processing on the semiconductor elements, and the holding mechanism is arranged in the direction of the rotation axis of the transport mechanism with respect to the semiconductor elements transported by the intermittent rotation of the transport mechanism. In a semiconductor device manufacturing apparatus that performs a predetermined process process on a semiconductor element by moving and supplying the semiconductor element to a process processing unit of the process processing mechanism,
At least one of the plurality of types of process processing mechanisms includes a process processing group in which different types of process processing units are provided side by side with respect to the movement direction of the holding mechanism,
The holding mechanism supplies a semiconductor element to a plurality of process processing units that move in the direction of the rotation axis of the transport mechanism to form the process processing group. The plurality of types of process processing mechanisms each include process processes with different processing times,
2. The semiconductor device according to claim 1, wherein a processing time of a process processing mechanism including a single process processing unit and a process processing mechanism including the process processing group are substantially the same. Manufacturing equipment. 3. The plurality of holding mechanisms move at an independent movement timing for each of the process processing mechanisms and supply semiconductor elements to a process processing position of the process processing mechanism. Semiconductor device manufacturing equipment. A turntable transport mechanism that rotates intermittently, a holding mechanism that holds a plurality of semiconductor elements provided at circumferentially equidistant positions of the transport mechanism, and a position that matches a stop position at which the holding mechanism stops intermittently And a plurality of types of process processing mechanisms that perform predetermined process processing on the semiconductor element, and are controlled by the control device, and the semiconductor element transported by intermittent rotation of the transport mechanism is transported by the holding mechanism In a semiconductor element manufacturing method for performing a predetermined process on a semiconductor element by moving the mechanism in a rotational axis direction and supplying the semiconductor element to a process processing unit of the process processing mechanism,
At least one of the plurality of types of process processing mechanisms includes a process processing group in which different types of process processing units are provided side by side with respect to the movement direction of the holding mechanism,
A method of manufacturing a semiconductor device, comprising: supplying a semiconductor element to a plurality of process processing units forming the process processing group by moving the holding mechanism in a direction of a rotation axis of the transport mechanism by the control device.

Images