JP6057303B2 - Electronic component process processing apparatus, process processing method, and process processing program - Google Patents

Description

  The present invention relates to a process processing apparatus, a process processing method, and a process processing program for performing process processing, for example, in the process of transporting an electronic component such as a semiconductor element.

  A number of semiconductor elements are produced on a Si wafer in a process called a pre-process, and then separated into individual pieces in a process called a post-process, and then subjected to steps such as electrical property testing, property classification, marking, and appearance inspection. After that, they are packed in a tape or container tube and shipped.

  Such a semiconductor element is held by a holding mechanism and transported by a transport mechanism in a process after being separated into individual pieces, and various processes are performed in each process processing unit provided along the transport path. The As the transfer method by the transfer mechanism, linear transfer, turntable transfer, etc. are used. In any case, the step of moving the holding mechanism according to a predetermined process order and the end of the process of the semiconductor element in each process processing unit In many cases, so-called intermittent conveyance is used in which the step of stopping the holding mechanism is repeated.

  By the way, the process processing by intermittent conveyance as described above has a problem that it is difficult to cope with a long processing time and to increase the speed. First, 1 transport cycle time = transport time + transport stop time, and stop time> maximum process processing time + delivery time. Here, if the maximum process processing time is 70 ms and the delivery time during the stop time is 20 ms, the lower limit of the stop time is 90 ms. If the transport time is 30 ms, the lower limit of one transport cycle time is 120 ms, and it is difficult to increase the speed further.

As described above, the reasons why it is difficult to increase the speed include the following.
(1) Due to mechanical limitations, it is necessary to simultaneously carry and stop the entire carrying mechanism. For this reason, the stop time must be determined by the maximum process processing time, and the transport stop time is limited.
(2) Although productivity has been improved by speeding up the transfer, it is reaching its limit.
(3) For example, when a process that requires a long process is included, such as an electrical characteristic inspection that requires a complicated test cycle, the maximum processing time becomes longer and the one transport cycle time becomes longer.

  In order to cope with this, a process processing apparatus as disclosed in Patent Document 1 has been proposed. This is an apparatus for carrying out process processing in parallel while carrying a plurality of semiconductor elements in parallel, and carrying out and carrying out process processing in parallel increases productivity as a whole. Also, a method of arranging a plurality of processing mechanisms for the same process on the transport path and performing process processing in parallel, that is, a method of performing transport = one by one and process processing = parallel, can be considered.

  Patent Document 2 discloses the following process technology. In this process processing technique, a plurality of processing mechanisms are provided in a process processing unit, and after transferring a semiconductor element from a holding mechanism to one of the processing mechanisms, the process is performed by moving the semiconductor element to a place different from the delivery place. Thereby, the delivery from the holding mechanism of the semiconductor element to the processing mechanism and the delivery from the processing mechanism to the holding mechanism can be performed in different cycles. According to such a conventional technique, since the moving time of the processing mechanism can be made shorter than the conveying time of the conveying mechanism, it is possible to make the process processing time longer than in the prior art even with the same cycle time.

  Further, in Patent Document 3, a plurality of processing mechanisms and holding mechanisms are provided in the electronic component transport direction, and the electronic component is transferred from one holding mechanism to the processing mechanism, and any other holding mechanism performs processing. A process processing apparatus that receives an electronic component from a mechanism has been proposed. In such an apparatus, by increasing the number of processing mechanisms, it is possible to secure a long process time for the processing mechanisms.

For example, in the example shown in FIG. 9 of Patent Document 3, three processing mechanisms are provided, and one of three adjacent holding mechanisms is transported in a state of holding an electronic component, and is one out of nine stop times. Electronic parts can be delivered and received in proportion. In the example shown in FIG. 10, four processing mechanisms are provided, two of the four holding mechanisms adjacent to each other are transported in a state in which the electronic component is held, and the electronic component is divided by one out of four stop times. Can be delivered and received.
JP-A-5-229509 International Publication WO02 / 0665824 International Publication WO05 / 015630

  However, the prior art as described above has the following problems. That is, in the technology for performing parallel processing as disclosed in Patent Document 1, even in a process that requires a short processing time, the same number of processing mechanisms as in a process with a long process must be arranged, which is wasteful. Will increase the cost of the device. In addition to the increase in cost for such parallel processing, the transport mechanism may be complicated for parallel transport, leading to a decrease in reliability of apparatus operation. And it leads to an increase in driving force and an increase in running cost due to an increase in inertial mass of the transport mechanism.

  Next, in the invention disclosed in Patent Document 2, there is a problem that the process processing mechanism is complicated as described above, the apparatus operation reliability is lowered, and the cost is increased, and the processing mechanism is moved in the process processing unit. In addition, the processing conditions become unstable and the accuracy of high-frequency characteristic measurement is reduced due to impedance fluctuations during electrical characteristic measurement, and the process processing time is shortened by the movement time of the processing mechanism. Further, when the process processing mechanism is enlarged, a plurality of process processing mechanisms cannot be arranged along the transport path, and it becomes difficult to further improve productivity.

  Further, in the invention disclosed in Patent Document 3, in the case of the example of FIG. 9, one of the three holding mechanisms carries the electronic component while being held. Also in the example of FIG. 10, one of the two holding mechanisms carries the electronic component in a held state. For this reason, in these examples, the holding | maintenance mechanisms which are vacant without holding an electronic component increase, and conveyance efficiency is not good.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and its purpose is to reduce the number of additional mechanisms and to reduce the cost, and to ensure a long process time, An object of the present invention is to provide a process processing apparatus, a process processing method, and a process processing program for an electronic component that are excellent in parts conveyance efficiency and processing efficiency.

In order to achieve the above object, the electronic component process processing apparatus of the present invention includes a plurality of holding mechanisms for holding electronic components, and repeats a cycle for advancing and stopping the holding mechanisms at each stop position on the conveyance path. A transport unit that transports the electronic component, a processing mechanism that performs a process on the electronic component, a processing unit in which the processing mechanism is arranged at a position corresponding to the stop position, and a drive that moves the holding mechanism up and down individually And the processing unit includes a plurality of processing mechanisms other than the same processing mechanism and the processing mechanism other than the same processing mechanism, and the drive mechanism is installed by simultaneously crimping electronic components to all the same processing mechanisms. In addition, after the processing of the electronic component is finished by pressing during the process processing by the same type of processing mechanism, the electronic components are simultaneously released from all the same type of processing mechanisms, and the processing machines other than the same type of processing mechanism Performs processing to the transport stop time of the same type of processing mechanism, wherein the drive mechanism includes a holding mechanism at a position corresponding to the processing mechanism of the same type, the position corresponding to the processing mechanism other than the processing mechanisms of the same type The holding mechanism is moved up and down in different operation patterns, and before the raising of each holding mechanism with respect to the same type of processing mechanism is started, the raising of the holding mechanism with respect to a processing mechanism other than the same type of processing mechanism is started. Features.

According to the electronic component process processing method of the present invention, the plurality of holding mechanisms for holding the electronic components convey the electronic components while repeating the cycle of advancement and stop, and individually raise and lower the holding mechanisms, thereby processing the processing mechanism of the processing unit. In the electronic component process processing method for performing an electronic component process, the processing unit includes a plurality of similar processing mechanisms and a processing mechanism other than the same processing mechanism, and comes to a position corresponding to the same processing mechanism. The holding mechanism is installed by pressing and bonding electronic parts to all the same type of processing mechanisms at the same time, and pressing during the process processing by the same type of processing mechanism. released from the processing mechanism of electronic parts simultaneously processing mechanism other than the processing mechanisms of the same type, it performs the processing to the transfer stopping time of the same type of processing mechanism, and the position of the holding mechanism corresponding to the processing mechanism of the same kind, The position of the holding mechanism corresponding to the serial processing mechanism other than the processing mechanisms of the same type, a control for elevating at different operating patterns, to increase before the start of each holding mechanism for processing mechanism of the same type, the same type of processing mechanism The raising of the holding mechanism with respect to other processing mechanisms is started .

The electronic component process processing program of the present invention includes a control for transporting an electronic component to a plurality of holding mechanisms for holding the electronic component while repeating a cycle of proceeding and stopping, and a control for individually raising and lowering the holding mechanism, In the electronic component process processing program for causing the computer to perform control of causing the processing mechanism of the processing unit to process the electronic component, the processing unit includes a plurality of processing mechanisms other than the same processing mechanism. A holding mechanism provided with a mechanism and located at a position corresponding to the same type of processing mechanism is configured to press and install electronic components simultaneously on all the same type of processing mechanisms and to be pressed even during process processing by the same type of processing mechanism. control and, after the processing of the electronic component is completed, a control to release all of the same type of processing mechanism electronic components from the same time, the inside conveyance stop time of the same type of processing mechanism A control for performing processing of a processing mechanism other than a processing mechanism of a kind, a holding mechanism at a position corresponding to the processing mechanism of the same type, and a holding mechanism at a position corresponding to a processing mechanism other than the processing mechanism of the same type are operated differently. A control for moving up and down by a pattern, and causing a computer to perform control to start raising of a holding mechanism for a processing mechanism other than the same type of processing mechanism before starting to raise each holding mechanism for the same type of processing mechanism. It is characterized by.

The invention of the electronic component process processing apparatus, the electronic component process processing method, or the electronic component process processing program may comprise the following configuration.
(1) The electronic component is a semiconductor element, and the processing mechanism of the same kind performs a measurement process of voltage, current, or frequency on the semiconductor element.
(2) The plurality of holding mechanisms are set so as to hold the electronic component continuously.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to ensure long process processing time with few additional mechanisms and low cost, the electronic component process processing apparatus, the process processing method, and the process processing which were excellent in the conveyance efficiency and processing efficiency of an electronic component Program can be provided.

It is a block diagram which shows one Embodiment of this invention. It is process drawing (1)-(4) which shows the conveyance procedure of the electronic component by embodiment of FIG. It is process drawing (5)-(8) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. It is process drawing (9)-(12) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. It is process drawing (13)-(16) which shows the conveyance and inspection procedure of the electronic component by embodiment of FIG. It is a time chart corresponding to the process drawing of FIGS. It is a flowchart which shows the process sequence in embodiment of FIG.

[Configuration of the embodiment]
Embodiments of the present invention will be described with reference to the drawings. That is, the present embodiment includes a transport unit 100 and a processing unit 200 as shown in FIG. The transport unit 100 includes, for example, 18 suction nozzles 110 arranged on the turntable T at regular intervals. The suction nozzle 110 is connected to a vacuum source (not shown), and is a holding mechanism that sucks and releases the electronic components S one by one in accordance with this switching. The suction nozzle 110 is provided so as to be movable up and down by a driving mechanism (not shown). When the suction nozzle 110 is lowered with respect to the processing unit 200, the electronic component S is pressed against the processing unit 200 and processed. The component S is configured to be released from the processing unit 200.

  Further, the suction nozzle 110 advances from the left to the right shown in FIGS. 2 to 5 at intervals corresponding to the processing mechanisms 1A to 4A described later by intermittently rotating the turntable T by a driving mechanism (not shown). Thereafter, the sucked electronic component S is transported while repeating a transport cycle of temporarily stopping. Note that the mechanism for moving the suction nozzle 110 does not have to be the turntable T, and for example, any known technique such as a straight-line conveyance or a curved-line conveyance can be applied.

  The processing unit 200 includes four processing mechanisms 1A, 2A, 3A, and 4A disposed below the suction nozzle 110 in the transport line. Each processing mechanism 1A to 4A performs an electrical test of the electronic component (device) S. In other words, each of the processing mechanisms 1A to 4A is a test station that measures electrical characteristics such as voltage, current, resistance, or frequency of the device by contacting the electrode of the device. These processing mechanisms 1 </ b> A to 4 </ b> A are installed at positions corresponding to the stop positions of the respective suction nozzles 110, and constitute a test contact process at this position.

  Further, a supply device 300 for supplying the electronic component S to each suction nozzle 110 and a polarity determination for determining the polarity of the electronic component S at a position corresponding to the stop position upstream of the processing unit 200 in the turntable T. A device 400 and a reversing device 500 for reversing the electronic component S in accordance with polarity determination are arranged. Each device is horizontally disposed apart from the turntable T, and can perform a predetermined process on the electronic component S held by the lowered suction nozzle 110.

  The supply device 300 constitutes an escape process in which the electronic components S aligned and conveyed from the ball feeder 310 and the linear feeder 320 are delivered from the escape to the suction nozzle 110. The polarity discriminating apparatus 400 constitutes a polarity discriminating step for discriminating the polarity of the electronic component S. The reversing device 500 constitutes a left / right reversing process in which the polarity of the electronic component S is rotated based on polarity determination.

  Each of these devices is merely an example of a device other than the processing mechanisms 1A to 4A. Which device is to be arranged, which stop position is to be placed, or whether it is upstream of the processing unit 200. Whether it is downstream or the like is free. For example, various devices such as a marking device, an appearance inspection device, a taping device, and a defective product removal device can be applied, and these can be arranged at a desired location.

  The drive mechanism of the turntable T, the drive mechanism that raises and lowers the suction nozzle 110, the vacuum source of the suction nozzle 110, the processing mechanisms 1A to 4A of the processing unit 200, the supply device 300, the polarity determination device 400, the reversing device 500, etc. It is controlled by a control device comprising a computer or a dedicated circuit that operates according to a predetermined program so as to operate according to the procedure described below.

[Operation of the embodiment]
The operation of the present embodiment having the above configuration will be described with reference to the process diagrams of FIGS. 2 to 5, the time chart of FIG. 6, and the flowchart of FIG. Note that the turntable T moves by one position at the time of conveyance, but in the test contact process shown in FIGS. 3 (7) and 5 (14), it is stopped for a time required for the test. Further, (5) to (16) in FIG. 6 correspond to (5) to (16) in FIGS.

  First, as shown in FIG. 2 and FIG. 6B, the electronic components S supplied by the supply device 300 are successively sucked one by one by the suction nozzle 110 (in FIGS. The serial numbers 0, 1, 2, and 3 are assigned in order from the electronic component S). And the suction nozzle 110 conveys the electronic component S by carrying out the intermittent rotation which the turntable T repeats rotation and a stop for every position. In this process, as shown in FIGS. 6C and 6D, for each position, polarity determination by the polarity determination device 400 and reversal processing for aligning the polarity by the reversing device 500 are performed.

  As shown in FIGS. 2 (1) to (4), in the process in which the electronic component S is conveyed by the suction nozzle 110 being repeatedly moved and stopped (steps 01 and 02), as shown in FIG. 3 (5). When the four suction nozzles 110 that have sucked the electronic component S come to the processing mechanisms 1A, 2A, 3A, and 4A and stop (step 03), the electronic component S is lowered as shown in FIG. Are pressure-bonded to the processing mechanisms 1A, 2A, 3A, 4A (step 04). Then, as shown in FIG. 3 (7), the electronic component S is mounted on the processing mechanisms 1A, 2A, 3A, and 4A, and the inspection of the electronic component S is started (step 05).

  Next, when the computer detects the elapse of a predetermined inspection time preset in the storage means (step 06), the four suction nozzles 110 are raised as shown in FIG. The electronic component S thus released is released from the processing mechanisms 1A, 2A, 3A, and 4A (step 07).

  Further, as shown in FIGS. 4 (9) to (12), the suction nozzle 110 is again advanced and stopped (steps 01 and 02). Then, as shown in FIG. 5 (13), when the four suction nozzles 110 that have picked up the next electronic component S come over the processing mechanisms 1A, 2A, 3A, and 4A (step 03), FIG. 14), the electronic component S is lowered and pressed against the processing mechanisms 1A, 2A, 3A, 4A (step 04). Then, as shown in FIG. 5 (15), the electronic component S is mounted on the processing mechanisms 1A, 2A, 3A, and 4A, and the inspection of the electronic component S is started (step 05).

  Next, when the computer detects the elapse of a predetermined inspection time preset in the storage means (step 06), the four suction nozzles 110 are raised as shown in FIG. The electronic component S thus released is released from the processing mechanisms 1A, 2A, 3A, and 4A (step 07). After the inspection is performed as described above, the electronic components S continuously sucked one by one by the suction nozzle 110 are sequentially transported to the next process.

[Effect of the embodiment]
According to the present embodiment as described above, the suction nozzle 110 inspects the electronic components S one by one by repeating the inspection of the four processing mechanisms 1A to 4A at the same time and performing the idle feeding for four positions. Compared to the case, the average processing time per electronic component S is shortened, and the processing efficiency is improved. Therefore, even with the electronic component S that requires a relatively long inspection time, high productivity can be achieved.

  Also, other short processes can be performed in the unit time of the advance and stop cycles and the stop time for inspection. As shown in FIGS. 6B to 6D, an escape process, a polarity determination process, and a left / right reversal process are performed in one stop time and one inspection stop time in one transport cycle time. It is clear from that. Therefore, it is not necessary to increase the number of processing mechanisms for completing the process in a short time, and an increase in apparatus cost and a decrease in reliability of apparatus operation can be minimized.

  Further, according to the present embodiment, the processing mechanism of the processing unit 200 is added to the stop position of the holding mechanism (such as the suction nozzle 110) of the conventional process processing apparatus without changing the transport unit 100, and the control program Or it can be realized only by changing the software. For this reason, it is not necessary to change the design of the conventional apparatus, in particular, the transport unit 100 and the holding mechanism. Further, the compatibility of the conventional apparatus with the apparatus configuration is high, and the modification from the conventional apparatus to the present embodiment is easy. For example, the processing time by the processing unit 200 can be easily adjusted by changing the stop time of the turntable T.

  It is also easy to operate the apparatus in the form of a conventional apparatus as required. Furthermore, since there are few design changes, the compatibility of components and units can be maintained, and the reliability of device operation can be improved and the device cost can be reduced by using proven components and units.

  Furthermore, in this embodiment, the electronic component S is supplied to the processing mechanisms 1A to 4A in a state in which the electronic component S is continuously sucked by all the suction nozzles 110, and the processed electronic component S is changed to the next process. Therefore, the suction nozzle 110 to be used is not wasted and transport efficiency is improved as compared with the case where the electronic component S is intermittently sucked and transported to the suction nozzle 110 as in Patent Document 3. In addition, it becomes easy to process in the next step.

[Other Embodiments]
The present invention is not limited to the embodiment described above, and the specific structure, arrangement, size, shape, number, material, type, and the like of each member can be changed as appropriate. That is, there may be a plurality of processing mechanisms, and there may be fewer or more than the above embodiment. Further, the number of suction nozzles and the number of stop positions of the turntable are not limited to those exemplified in the above embodiment. Regarding the method of installing the electronic component on the processing mechanism, even if it is a method of pressing on the processing mechanism by the suction nozzle that descends as described above, it is a method of releasing from the suction nozzle and placing it on the processing mechanism. May be.

  Further, the holding mechanism is not limited to the suction nozzle, and any known method such as mechanical holding, electrostatic chucking, Bernoulli chuck, or the like may be used. The movement control method of the holding mechanism by the drive mechanism and the movement path (whether linear or curved) are not limited to specific ones. The control of the movement timing can be performed as in the above embodiment, or can be realized mechanically. Whether the holding mechanism that has attracted the electronic component to be inspected has come on the processing mechanism can be determined simply by counting the number of moved positions, but may be determined by detecting it with a sensor or the like. .

  Further, the processing performed by the processing unit is not limited to measuring electrical characteristics, and widely includes processing for performing predetermined processing on electronic components. Furthermore, the processing target of the present invention is typically a semiconductor element, but is not limited thereto, and can be applied to all known elements, members, electronic / electrical parts, mechanical parts, and the like.

  In addition, the electronic component process processing apparatus of the present invention includes a holding mechanism for holding the electronic component, and transports the electronic component while repeating a cycle for advancing and stopping the holding mechanism, and performs processing on the electronic component. In an electronic component process processing apparatus having a processing unit having a processing mechanism to be applied, a plurality of the holding mechanisms and the processing mechanisms are provided in a conveyance direction of the electronic component and are held at positions corresponding to the plurality of processing mechanisms. The mechanism may be set to simultaneously release the electronic components from all the processing mechanisms after the electronic components are installed simultaneously for all the processing mechanisms and the processing of the electronic components is completed.

  In addition, the electronic component process processing method of the present invention is an electronic component process in which the holding mechanism for holding the electronic component conveys the electronic component while repeating a cycle of progressing and stopping, and the processing mechanism processes the electronic component. In the processing method, a plurality of the holding mechanisms and the processing mechanisms are provided in the conveying direction of the electronic component, and the holding mechanism that comes to a position corresponding to the plurality of processing mechanisms simultaneously installs the electronic components for all the processing mechanisms. Then, after the processing of the electronic component is completed, the electronic component may be released simultaneously from all the processing mechanisms.

  In addition, the electronic component process processing program according to the present invention includes a control for causing the holding mechanism for holding the electronic component to convey the electronic component while repeating a cycle of advancement and stop, and a control for causing the processing mechanism to process the electronic component. In the electronic component process processing program to be executed by the computer, a plurality of the holding mechanisms and the processing mechanisms are provided in the conveying direction of the electronic components, and the holding mechanism comes to a position corresponding to the plurality of processing mechanisms. The computer may perform control for simultaneously installing electronic components for all processing mechanisms and control for simultaneously releasing electronic components from all processing mechanisms after the processing of the electronic components is completed.

  In the invention as described above, by processing a plurality of electronic components simultaneously in a plurality of processing mechanisms, the average processing time per electronic component is shortened as compared with the case of processing each electronic component one by one. , Processing efficiency is improved. Therefore, high productivity can be achieved even for an electronic component that requires a relatively long processing time. In addition, other short processes can be completed in the unit time of the progress and stop cycles and the processing time by the processing mechanism.

  Moreover, in the invention of the electronic component process processing apparatus, the electronic component process processing method, or the electronic component process processing program, the plurality of holding mechanisms may be set so as to hold the electronic components continuously. . Thereby, since the holding mechanism for holding the electronic component is continuous, the holding mechanism to be used is not wasted, the conveyance efficiency is improved, and the processing in the next process is easy.

DESCRIPTION OF SYMBOLS 100 ... Conveyance part 110 ... Adsorption nozzle 200 ... Processing part 300 ... Supply apparatus 310 ... Ball feeder 320 ... Linear feeder 400 ... Polarity discrimination apparatus 500 ... Inversion apparatus 1A, 2A, 3A, 4A ... Processing mechanism

Claims (9)

A plurality of holding mechanisms for holding electronic components, a transport unit that transports the electronic components to each stop position on a transport path while repeating a cycle for advancing and stopping the holding mechanism,
A processing unit that performs processing on the electronic component, and a processing unit in which the processing mechanism is disposed at a position corresponding to the stop position;
A drive mechanism that individually raises and lowers the holding mechanism;
With
The processing unit includes a plurality of processing mechanisms other than the same processing mechanism and the same processing mechanism.
The drive mechanism is installed by pressing and bonding electronic components to all the same type of processing mechanisms at the same time, and pressing during the process processing by the same type of processing mechanism, and after the processing of the electronic components is completed, Release electronic components from the processing mechanism at the same time,
A processing mechanism other than the same type of processing mechanism performs processing within the conveyance stop time of the same type of processing mechanism,
The drive mechanism includes a holding mechanism at a position corresponding to the processing mechanism of the same type, the position of the holding mechanism corresponding to the processing mechanism other than the processing mechanisms of the same kind, which raises and lowers at different operating patterns, the same type Starting the raising of the holding mechanism for the processing mechanisms other than the same type of processing mechanism before starting the raising of each holding mechanism for the processing mechanism of
An electronic component process processing apparatus characterized by the above. The electronic component is a semiconductor element,
The same type of processing mechanism performs a measurement process of voltage, current, or frequency on the semiconductor element,
The electronic component process processing apparatus according to claim 1. A plurality of the holding mechanisms are set so as to hold the electronic component continuously;
The process processing apparatus for an electronic component according to claim 1, wherein A plurality of holding mechanisms for holding the electronic components convey the electronic components while repeating a cycle of progressing and stopping, individually raising and lowering the holding mechanisms, and the processing mechanism of the processing unit performs processing on the electronic components. In the process processing method,
The processing unit includes a plurality of processing mechanisms other than the same processing mechanism and the same processing mechanism.
The holding mechanism that has come to a position corresponding to the same type of processing mechanism is installed by pressing and bonding electronic components to all the same type of processing mechanisms at the same time, and is also pressed during process processing by the same type of processing mechanism. After processing is completed, electronic components are released simultaneously from all similar processing mechanisms,
A processing mechanism other than the same type of processing mechanism performs processing within the conveyance stop time of the same type of processing mechanism,
Control for raising and lowering a holding mechanism at a position corresponding to the processing mechanism of the same type and a holding mechanism at a position corresponding to a processing mechanism other than the processing mechanism of the same type with different operation patterns, with respect to the processing mechanism of the same type Before starting the raising of each holding mechanism, starting the raising of the holding mechanism with respect to a processing mechanism other than the same type of processing mechanism ;
An electronic component process processing method characterized by the above. The electronic component is a semiconductor element,
The same type of processing mechanism performs a voltage, current, or frequency measurement process on the semiconductor element,
The method of processing a process for an electronic component according to claim 4. A plurality of the holding mechanisms continuously hold electronic components;
The process processing method of the electronic component of Claim 4 or 5 characterized by these. Control that conveys electronic components to a plurality of holding mechanisms that hold electronic components while repeating a cycle of advancement and stop, control that raises and lowers the holding mechanisms individually, and processing processing of electronic components in the processing mechanism of the processing unit In a program for electronic component process processing to be performed by a computer,
The processing unit includes a plurality of processing mechanisms other than the same processing mechanism and the same processing mechanism.
To the holding mechanism that came to the position corresponding to the same type of processing mechanism,
Control that electronic parts are simultaneously crimped and installed in all the same type of processing mechanisms, and pressed during process processing by the same type of processing mechanisms, and
After the processing of electronic parts is finished, control to release the electronic parts from all the same type of processing mechanism at the same time,
Control for processing a processing mechanism other than the same type of processing mechanism within the conveyance stop time of the same type of processing mechanism;
Control for raising and lowering a holding mechanism at a position corresponding to the processing mechanism of the same type and a holding mechanism at a position corresponding to a processing mechanism other than the processing mechanism of the same type with different operation patterns, with respect to the processing mechanism of the same type Before starting the raising of each holding mechanism, a control for starting the raising of the holding mechanism with respect to a processing mechanism other than the same type of processing mechanism ;
A process processing program for electronic parts, characterized by causing a computer to perform the above. The electronic component is a semiconductor element,
Causing the computer to perform control to cause the semiconductor processing element to perform voltage, current, or frequency measurement processing on the semiconductor element;
The electronic component process processing program according to claim 7. Causing a computer to perform control for continuously holding electronic components by the plurality of holding mechanisms;
The electronic component process processing program according to claim 7 or 8,

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