JP5051713B2 - Electronic component measuring device - Google Patents

Description

  The present invention relates to an apparatus for measuring characteristics of electronic components, and more particularly, to an apparatus for measuring small electronic components that require a long time to measure a semiconductor element or the like.

  A number of semiconductor elements are produced on a Si wafer in a process called a pre-process, and then separated into individual pieces in a process called a post-process, and then subjected to steps such as electrical property testing, property classification, marking, and appearance inspection. After that, they are packed in a tape or container tube and shipped.

  Such a semiconductor element is held by a holding mechanism and transported by a transport mechanism in a process after being separated into individual pieces, and various processes are performed in each process processing unit provided along the transport path. The As the transfer method by the transfer mechanism, linear transfer, turntable transfer, etc. are used. In any case, the step of moving the holding mechanism according to a predetermined process order and the end of the process of the semiconductor element in each process processing unit In many cases, so-called intermittent conveyance is used in which the step of stopping the holding mechanism is repeated.

  By the way, the process processing by intermittent conveyance as described above has a problem that it is difficult to cope with a long processing time and to increase the speed. First, 1 transport cycle time = transport time + transport stop time, and stop time> maximum process processing time + delivery time. Here, if the maximum process processing time is 70 ms and the delivery time during the stop time is 20 ms, the lower limit of the stop time is 90 ms. If the transport time is 30 ms, the lower limit of one transport cycle time is 120 ms, and it is difficult to increase the speed further.

As described above, the reasons why it is difficult to increase the speed include the following.
(1) Due to mechanical limitations, it is necessary to simultaneously carry and stop the entire carrying mechanism. For this reason, the stop time must be determined by the maximum process processing time, and the transport stop time is limited.
(2) Although productivity has been improved by speeding up the transfer, it is reaching its limit.
(3) For example, when a process that requires a long process is included, such as an electrical characteristic inspection that requires a complicated test cycle, the maximum processing time becomes longer and the one transport cycle time becomes longer.

  In particular, with regard to (3), a relatively long test time of 1 to 10 seconds is required when measuring electrical characteristics of molded electronic components such as ICs and power devices. Therefore, the conveyance time is very long due to this.

  In order to cope with this, Patent Document 1 discloses a suction nozzle that holds an electronic component and a plurality of processing mechanisms (hereinafter referred to as measuring devices) that measure the electrical characteristics of the electronic component, in the direction in which the electronic component is conveyed. A plurality of devices have been proposed. In this apparatus, after one of the suction nozzles passes the electronic component to the measurement device and passes through, the other suction nozzle receives the electronic component from the measurement device. In such an apparatus, it is possible to ensure a long measurement time by increasing the number of measurement apparatuses.

International Publication WO05 / 015630 JP 2003-90849 A JP-A-7-151806

  By the way, when measuring the electrical characteristics of an electronic component as described above, the terminal is used as a contact in order to accurately position the electronic component on the measuring device and reduce the contact resistance between the terminal of the electronic component and the contact. It is necessary to make contact with an appropriate contact pressure. However, when the measurement time is extended as in the invention of Patent Document 1 described above, the suction nozzle that holds the electronic component leaves the electronic component after passing the electronic component to the measuring device. The upper part is released. For this reason, it becomes difficult to ensure positioning with respect to the measuring apparatus and appropriate contact pressure.

  As means for securing such positioning and contact pressure, those shown in Patent Documents 2 and 3 have been proposed. However, it is difficult for any means to secure a space for passing the suction nozzle that delivers the electronic component above or below the electronic component. As shown in Patent Document 1, the measurement time should be extended. Is not expected.

  In addition, in order to extend the measurement time, the suction nozzle holding the electronic component passes the electronic component to the measuring device and then passes over the measuring device so that the buffer with the measuring device does not occur. It is necessary to ensure a long lifting distance (stroke) of the suction nozzle. However, in such a case, it takes a long time for the suction nozzle to move up and down, and the conveying time is prolonged.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and its purpose is to hold the electronic component on the measuring means while accurately positioning and ensuring the contact pressure. An object of the present invention is to provide an electronic component measuring apparatus that can keep the lifting time of the means short.

The invention according to claim 1 is an electronic component measuring apparatus including a measuring unit that measures characteristics by bringing a contactor into contact with a terminal of an electronic component passed from above. A socket that is movably provided between the upper side and the measuring means side, and can accommodate an electronic component so that its periphery is regulated and positioned, and a delivery position at which the socket can deliver the electronic component First urging means for urging the socket upward, and a plurality of guide members inserted through the socket , wherein the socket is positioned on the measuring means along the guide member means and is conveyed in the conveying direction while holding the electronic component, and the delivery position for delivering the electronic component to the socket, so that movement in the conveying direction is allowed, above the said measuring means Movably provided between a retracted position retracted to, at the time when seated was held electronic component to the socket rises to the delivery position, retracted to the retracted position without depressing the socket, the Holding means that does not descend below the delivery position, and the electronic parts that are passed from the holding means to the socket and whose periphery is regulated and positioned are biased and lowered along the guide member, thereby the measurement And a second urging means for transferring the socket to the means side.

In the invention as described above, by interposing the socket between the upper side for passing the electronic component and the measuring means, the moving distance of the means for passing the electronic component can be shortened and the required time can be shortened. When the electronic component is delivered from above to the socket that is urged upward by the first urging means, the moving distance of the holding means for delivering the electronic component can be further shortened to shorten the required time. In addition, since a plurality of guide members are inserted into the socket , and the socket is positioned by positioning means that is a guide member , the socket and electronic components are not misaligned or displaced due to movement , and accurate positioning is possible. It becomes. Therefore, accurate positioning reproducibility when replacing the socket can be expected. Further, the electronic component accommodated in the socket is urged toward the measuring means by the second urging means, so that the contact pressure between the terminal and the contact is ensured. Further, since the socket is accurately positioned by the positioning means, accurate positioning reproducibility can be expected even when the socket is replaced to measure different electronic components. Furthermore, since the holding means delivers the electronic component via the movable socket as described above, the moving distance for delivery of the electronic component in the holding means can be further shortened, and the conveyance time can be shortened.

According to a second aspect of the present invention, in the electronic component measuring apparatus according to the first aspect, the second urging means has a contact portion that contacts the electronic component, and the contact portion is contacted and separated from the electronic member by rotation. It is a clamp to be made.
In the invention as described above, the rotating clamp can avoid the buffer with the socket, and can securely press the electronic component to ensure the contact pressure between the terminal and the contact.

According to a third aspect of the present invention, in the electronic component measuring apparatus according to the first or second aspect , the first biasing means includes an elastic member.
In the invention as described above, the urging force received from the second urging means can be relaxed by the elastic member, and the influence on the electronic component can be reduced.

According to a fourth aspect of the present invention, in the electronic component measuring apparatus according to any one of the first to third aspects, the first urging means includes an elevating member that is moved up and down by a drive mechanism.
In the invention as described above, the moving distance of the means for delivering the electronic component can be adjusted by the raised position of the elevating member.

  As described above, according to the present invention, it is possible to accurately position the electronic component with respect to the measuring unit and to ensure the contact pressure, and to reduce the ascending / descending time of the holding unit.

  Next, the best mode for carrying out the present invention (hereinafter referred to as an embodiment) will be described with reference to FIGS. 1-9 is a figure which shows the principal part structure of the electronic component measuring apparatus of this embodiment.

[Configuration of the embodiment]
As shown in FIG. 1, the electronic component measuring apparatus according to the present embodiment includes a suction nozzle 10, a support base 11, a socket 12, a spring 13, and a clamp 14. The suction nozzle 10 is connected to a vacuum source (not shown), and is a holding mechanism that sucks and releases the leadless electronic components S one by one in accordance with this switching.

  The suction nozzle 10 is provided so as to be movable up and down by a driving mechanism (not shown). When the suction nozzle 10 is lowered with respect to the socket 12, the electronic component S is picked up and released to receive the electronic component S from the socket 12. And it is configured so that delivery is possible.

  Further, a plurality of suction nozzles 10 are arranged at equal intervals on a turntable (not shown), and when the turntable rotates intermittently, FIG. 1 (B), FIG. 5 (B), FIG. 6 (B), FIG. It is configured to transport the adsorbed electronic component S while repeating a transport cycle of moving forward from left to right as shown in B) and then temporarily stopping. Note that the mechanism that moves the suction nozzle 10 to convey the electronic component S can be applied to any known technique such as a linear conveyance or a curved conveyance, in addition to a turntable or the like.

  The support base 11 is a base that constitutes a part of a measuring device disposed under the suction nozzle 10. The measuring apparatus is not shown, but means for conducting an electrical test of the electronic component (device) S, for example, an electronic circuit, a switch, a keyboard, a touch panel including a computer that performs processing such as energization and calculation necessary for the test Input means such as a display, output means such as a display and a lamp. By these means, a test station is constructed which measures electrical characteristics such as voltage, current, resistance or frequency of the device connected to the electrode of the device.

  As shown in FIG. 2, the electronic component S is set on the measuring device via a socket 12 provided on the support base 11. The socket 12 is a box-shaped member having a receiving portion 12a for receiving the electronic component S. The socket 12 is in contact with a contact pad of the leadless electronic component S so that the measuring device and the electronic component S are connected to each other. A contact (not shown) for electrical connection is provided.

  The connection between the circuit of the measuring device and the contact is realized by connecting a lead wire derived from the contact to the circuit of the measuring device. The conductive member led out of the socket 12 from the contact and the conductive member led out from the circuit of the measuring device and provided on the support base 11 side may be brought into contact with each other. Further, the electronic component S is accommodated in the receiving portion 12a of the socket 12 so that its periphery is regulated and positioned.

  Further, the four guide rods 11a fixed to the support base 11 are inserted into the socket 12 in the vicinity of the four corners thereof, so that the socket 12 can be moved up and down along the guide rod 11a. Thus, the socket 12 is positioned with its horizontal movement restricted. In addition, the socket 12 is provided so that replacement | exchange is possible according to the electronic component S to be used.

  The spring 13 is an elastic member disposed between the support base 11 and the socket 12. Due to the urging force of the spring 13, the socket 12 during standby is raised to a position where the suction nozzle 10 is lowered and the electronic component S can be put into the receiving portion as shown in FIG.

  A pair of clamps 14 are disposed on both sides of the socket 12, and are pivoted about a shaft 14 a by a driving mechanism (not shown) so that a contact portion 14 b at the tip thereof presses the electronic component S from above. . When the electronic component S is urged by the clamp 14, the socket 12 descends against the urging force of the spring 13 and is pressed and positioned on the support base 11.

  The turntable, the suction nozzle 10, the drive mechanism of the clamp 14, the vacuum source of the suction nozzle 10, the measuring device, etc. are operated from a computer or a dedicated circuit that operates according to a predetermined program so as to operate according to the procedure described below. Controlled by a control device.

[Operation of the embodiment]
The operation of the present embodiment configured as described above is as follows. First, the electronic component S is conveyed from the previous process to the upper part of the measuring device while being sucked and held by the suction nozzle 10. As shown in FIGS. 1A and 1B, when the suction nozzle 10 comes to the top of the socket 12 and stops, the electronic component S is accommodated in the receiving portion in the socket 12 as shown in FIG. .

  Next, as shown in FIGS. 3A and 3B, the suction nozzle 10 releases the suction, and the clamp 14 rotates, and the contact portion 14b presses the electronic component S downward. Then, the socket 12 is lowered and fixed on the support base 11 together with the electronic component S. Thereby, the contact in the socket 12 and the contact pad of the electronic component S are reliably connected.

  The suction nozzle 10 that has released the electronic component S moves up and retracts as shown in FIGS. 4A and 4B, and moves as shown in FIGS. 5A and 5B according to the rotation of the turntable. Then, an electrical test by the measuring device is performed until the suction nozzle 10 that receives the electronic component S next comes on the socket 12.

  Further, as shown in FIGS. 6A and 6B, when the suction nozzle 10 that receives the electronic component S stops on the socket 12, the clamp 14 rotates as shown in FIGS. 7A and 7B. Thus, the electronic component S is released and the socket 12 is also raised by the biasing force of the spring 13. At this time, the suction nozzle 10 descends to suck the electronic component S in the socket 12. Then, as shown in FIGS. 8A and 8B, when the suction nozzle 10 is raised, the electronic component S is also lifted away from the socket 12.

  As shown in FIGS. 9A and 9B, the suction nozzle 10 that sucks the electronic component S moves according to the rotation of the turntable. Then, the socket 12 waits at the raised position until the suction nozzle 10 that passes the electronic component S next comes on the socket 12.

[Effect of the embodiment]
According to the present embodiment as described above, the suction nozzle 10 delivers the electronic component S to the socket 12 rising by the spring 13, thereby shortening the lifting distance of the suction nozzle 10 and shortening the lifting time. The conveyance time can be shortened. The lifting distance of the suction nozzle 10 can be adjusted by the standby position of the socket 12 by the spring 13. Therefore, the elevating distance of the suction nozzle 10 can be further shortened by making the socket 12 stand by at a higher position.

  The socket 12 that has received the electronic component S is lowered by the electronic component S being urged against the urging force of the spring 13 by the clamp 14 and positioned on the support base 11. The contact pressure between the contact pad of S and the contact of the socket 12 is ensured. And the urging | biasing force received from the clamp 14 by the spring 13 can be relieve | moderated, and the influence which it has on an electronic component can be reduced.

  Further, the socket 12 is moved up and down along the guide rod 11a, so that the socket 12 and the electronic component S are not displaced during movement. Further, even when the socket 12 is replaced in order to test a different electronic component S, it is possible to prevent misalignment by inserting the guide rod 11a in the same manner, so that accurate positioning reproducibility can be expected. Further, the clamp 14 provided around the socket 12 can avoid the buffering with the socket 12 and can securely press the electronic component S.

[Other Embodiments]
The present invention is not limited to the embodiment described above, and the specific structure, arrangement, size, shape, number, material, type, and the like of each member can be changed as appropriate. That is, the number of measuring devices and suction nozzles, the number of stop positions of the turntable, the number of guide rods, etc. are arbitrary.

  Further, the holding mechanism is not limited to the suction nozzle, and any known method such as mechanical holding, electrostatic chucking, Bernoulli chuck, or the like may be used. The movement control method of the holding mechanism by the drive mechanism and the movement path (whether linear or curved) are not limited to specific ones. The movement timing can be controlled by computer control or mechanically.

  Whether the holding mechanism that passes the electronic component is on the socket that receives the electronic component or whether the holding mechanism that receives the electronic component is on the socket that passes the electronic component is determined simply by counting the number of moved positions. However, it may be detected by a sensor or the like.

  In addition, as the means for urging the socket 12 and the means for driving the clamp 14 in the above-described embodiment, any known technique such as a cylinder, a solenoid, a cam mechanism using a motor, or a gear mechanism can be applied.

  For example, as shown in FIG. 10 (A), the hold pin 20 driven by the cylinder 21 may be configured to pass through the support base 11 and urge the socket 12, or FIG. 10 (B). As shown, the urging force by the spring 22 may be transmitted to the socket 12 via the hold pin 20. Furthermore, as shown in FIG. 10C, an elastic member such as a spring 22 may be interposed between the hold pin 20 and a drive mechanism such as a cylinder 21.

  Moreover, as a drive mechanism of the clamp 14, what is shown to FIG. 11, FIG. 12 can be considered. That is, in this drive mechanism, the clamp 14 is rotated by the arm 30 continuously formed on the clamp 14 being urged by the cam follower 31 on the upper portion of the block 32 provided so as to be movable up and down in the measuring device. It is configured.

  The drive of the block 32 can be realized by an elliptical cam 35 that is rotated by a motor 34 that is a driving source urging a circular cam follower 36 that is rotatably provided at the lower portion of the block 32. In the figure, reference numeral 33 denotes a cam follower that holds the fixing plate 37 to which the support base 11 is fixed from below when the block 32 is raised.

  Note that the above is an example, and it is free to adopt another structure as the drive mechanism. Further, the first urging means and the second urging means are not limited to the clamp 14 or the spring 13 as long as a desired urging force can be obtained. For example, instead of the spring 13, an elastic resin or the like may be used.

  Further, the socket does not necessarily need to be movable. In this case, the structure of the positioning means may be any structure as long as the socket can be accurately positioned. You may make it insert the pin fixed to the support stand etc. in the hole formed in the socket, and may provide the member holding the circumference | surroundings of a socket. Even when the socket is not moved in this way, when the socket is replaced, the above-mentioned positioning reproducibility can be expected, and a certain height can be obtained depending on the thickness of the socket. The moving distance of the holding means can be shortened.

  Furthermore, leadless electronic components are representative of the measurement object of the present invention, but are not limited thereto, and any known element, member, electronic / electrical component that can be housed in a socket and can measure electrical characteristics. Etc. are applicable.

It is the front view (A) and side view (B) which show the time of standby in the principal part structure of the electronic component measuring apparatus of one Embodiment of this invention. It is the front view (A) and side view (B) which show the time of accommodation of the electronic component in the socket in embodiment of FIG. It is the front view (A) and side view (B) which show the time of positioning of the socket in embodiment of FIG. It is the front view (A) and side view (B) which show at the time of retracting | sucking of the suction nozzle in embodiment of FIG. It is the front view (A) and side view (B) which show the time of advancing of the adsorption nozzle in embodiment of FIG. It is the front view (A) and side view (B) which show the time of arrival of the suction nozzle in embodiment of FIG. It is the front view (A) and side view (B) which show the time of adsorption | suction of the adsorption nozzle in embodiment of FIG. It is the front view (A) and side view (B) which show the time of the raise of the suction nozzle in embodiment of FIG. It is the front view (A) and side view (B) which show the time of advancing of the adsorption nozzle in embodiment of FIG. It is a figure which shows the example of the urging means of the hold pin in embodiment of FIG. 1, (A) is a cylinder, (B) is a spring, (C) shows what used the cylinder and the spring together. It is a front view which shows an example of the drive mechanism of the clamp in embodiment of FIG. It is a principal part front view of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Adsorption nozzle 11 ... Support stand 11a ... Guide rod 12 ... Socket 12a ... Receiving part 13,22 ... Spring 14 ... Clamp 14a ... Shaft 14b ... Contact part 20 ... Hold pin 21 ... Cylinder 30 ... Arm 31, 33, 36 ... cam follower 32 ... block 34 ... motor 35 ... cam 37 ... fixed plate

Claims (4)

In the electronic component measuring apparatus equipped with the measuring means for measuring the characteristics by contacting the contact to the terminal of the electronic component passed from above,
A socket provided with the contact , provided so as to be movable between the upper side of the measuring means and the measuring means side, and capable of accommodating an electronic component so that its periphery is regulated and positioned ;
First urging means for urging the socket upward to a delivery position at which the socket can deliver electronic components;
A plurality of guide members inserted through the socket, the positioning means for positioning the socket on the measuring means along the guide member ;
Transported to the transport direction while holding the electronic component, and the delivery position for delivering the electronic component to the socket, so that movement in the conveying direction is allowed, and a retracted position retracted from the measuring means upward The electronic component is movably provided, and when the held electronic component is seated on the socket raised to the delivery position, the socket is retracted to the withdrawal position without pushing down the socket, and is not lowered below the delivery position. Holding means;
A second part for transferring the socket to the measuring means side by urging an electronic component which is passed from the holding means to the socket and whose periphery is regulated and positioned and lowered along the guide member . Biasing means;
An electronic component measuring apparatus comprising:   2. The electronic component measurement according to claim 1, wherein the second biasing means is a clamp that has a contact portion that comes into contact with the electronic component, and that makes the contact portion contact and separate from the electronic member by rotation. apparatus. It said first biasing means, the electronic component measurement apparatus according to claim 1 or claim 2, characterized in that it comprises an elastic member. It said first biasing means, the electronic component measurement apparatus according to claim 1 to 3 any one which comprises a lifting member for lifting by a drive mechanism.

Images