JP2005294018A - Socket for electric component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electric component for facilitating separation of the electric component sticking to a contact means of the socket for the electric component. <P>SOLUTION: This socket for an electric component is provided with: a housing part 20 formed on the upper surface of a socket body part for housing an IC package and having contact means capable of contacting terminals of the IC package arranged; a floating plate 16 installed vertically movably with respect to the housing part 20; helical springs 15 mounted on the socket body part for energizing the floating plate 16 upward; and a pressing means 26 for pressing the upper surface of the IC package housed in the housing part 20 to electrically connect the terminals of the IC package to the contact means. The floating plate 16 is equipped with support parts 17 for supporting the bottom face of the IC package in edge parts of an opening 16a formed corresponding to the housing part 20; and the support parts 17 are each formed of a metal plate 21 having rigidity higher than that of the floating plate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electrical component socket for inspecting an electrical component, and more specifically, includes a support means for supporting a bottom surface of an electrical component corresponding to an opening formed in the floating plate, and biasing the floating plate upward. The present invention relates to a socket for an electrical component that causes the urging force of the urging means to act upward on the bottom surface of the electrical component via the support means so that the electrical component attached to the contact means can be easily peeled off.

  For example, as shown in FIG. 15, a conventional socket for electric parts is provided with a base plate 2 on which contact pins 1 are arranged, and terminals of electric parts (hereinafter referred to as IC package 3) arranged on the base plate 2. A tab film 4 for electrically connecting the contact pin 1 and the contact film 1, and a middle provided on the tab film 4 so as to be detachable from the base plate 2 and provided with a socket cover 5 so as to be rotatable at one end. It has a member 6 and an alignment plate 7 that is detachably engaged with an opening 6a provided in the intermediate member 6 and has an opening 7a formed at the center, and closes the socket cover 5 by lying down. By pressing the IC package 3 accommodated in the opening 7 a of the alignment plate 7 with the pad 8 provided on the socket cover 5, Has a terminal contact pin 1 of the cage 3 so as to be electrically connected (e.g., see Patent Document 1).

In FIG. 15, reference numeral 9 indicates a reliable electrical connection between the electrode pattern (hereinafter referred to as contact electrode 4 a) of the tab film 4 and the terminals of the IC package 3 by elastically supporting the tab film 4 from below. The elastic sheet which consists of silicone rubber etc. provided in order to ensure is shown. Reference numeral 10 denotes a stopper provided so that the terminals of the IC package 3 are not crushed beyond a predetermined level. Further, reference numeral 11 indicates another elastic sheet that is pressed by the intermediate member 6 to maintain a reliable electrical connection between the connection electrode 4 b of the tab film 4 and the contact pin 1. Reference numeral 12 denotes locking means that is locked to the side surface 6b of the intermediate member to maintain the closed state of the socket cover. Each element is assembled into an electrical component socket by fastening a bolt 13 and a nut 14.
JP 2003-272786 A

  However, in such a conventional socket for electrical parts, the IC package 3 is pressed to ensure electrical connection between the solder balls as the terminals of the IC package 3 and the contact electrodes 4a of the tab film 4. Therefore, for example, in a burn-in test performed at a high temperature, the solder ball may be softened and stuck to the contact electrode 4a. In this case, when the IC package 3 is removed from the electrical component socket after the test is completed, it may not be easily removed.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a socket for an electrical component that addresses such problems and facilitates the peeling off of the electrical component attached to the contact means.

  To achieve the above object, the electrical component socket according to the first invention is formed on the upper surface of the socket body, accommodates the electrical component, and accommodates the contact means that can contact the terminal of the electrical component. A floating plate that is arranged to be movable up and down with respect to the housing portion and supports the electrical component, a biasing means that is provided in the socket body portion and biases the floating plate upward, and the housing An electrical component socket, comprising: a pressing means that presses an upper surface of the electrical component housed in the portion to electrically connect a terminal of the electrical component and the contact means; The plate includes a support portion that supports a bottom surface of the electrical component at an edge portion of the opening formed corresponding to the housing portion, and the support portion is more than the floating plate. It is obtained by forming a high sexual material.

  With such a configuration, the electrical component is guided to the housing portion of the socket body by the opening formed in the floating plate, and the bottom surface of the electrical component is supported by the support portion provided at the edge of the opening and having rigidity higher than that of the floating plate. The floating plate is biased upward by the biasing means. Thereby, the urging force of the urging means is caused to act upward on the bottom surface of the electrical component by the support portion provided at the edge of the opening, thereby facilitating the peeling off of the electrical component attached to the contact means.

  Further, the support portion is provided so as to protrude from the wall portion forming the opening portion to the inside of the opening portion. As a result, the bottom surface of the electrical component is supported by the support portion that protrudes from the inside of the opening.

  Further, the support portion is made of a metal plate insert-molded on the floating plate. Thus, the bottom surface of the electrical component is supported by the metal plate that is insert-molded on the floating plate.

Further, the electrical component socket according to the second invention is formed on the upper surface of the socket main body, accommodates the electrical component, and accommodates the contact means that can contact the terminal of the electrical component;
A floating plate that is arranged to be movable up and down with respect to the housing part, supports the electrical component, a biasing means that is provided in the socket body part and biases the floating plate upward, and is housed in the housing part. An electrical component socket comprising: pressing means for pressing an upper surface of the electrical component to electrically connect a terminal of the electrical component and the contact means, wherein the floating plate includes: A support plate that is stretched over the entire area of the opening formed corresponding to the housing portion and supports the bottom surface of the electrical component, and the terminal of the electrical component is introduced into the support plate by introducing the terminal and the terminal An introduction hole that enables connection with the contact means is formed.

  With such a configuration, the electrical component is guided to the socket body housing portion through the opening formed in the floating plate, and the bottom surface of the electrical component is supported and supported by the support plate stretched across the entire opening. A terminal of an electrical component is introduced through an introduction hole formed in the plate to enable connection between the terminal and the contact means, and the floating plate is urged upward by the urging means. Thereby, the urging force of the urging means is caused to act upward on the bottom surface of the electric component by the support plate stretched over the entire area of the opening, and the electric component adhered to the contact means is easily peeled off.

  The support plate is formed of a polyimide resin. Thereby, a support plate is formed with a polyimide resin.

  According to the first aspect of the present invention, by providing the support portion for supporting the bottom surface of the electrical component at the opening of the floating plate biased upward by the biasing means, the biasing means of the biasing means is provided via the support portion. The urging force can be lifted by acting upward on the bottom surface of the electrical component. Therefore, for example, in a high temperature test such as a burn-in test, it is possible to easily peel off the electrical component attached to the contact means of the electrical component socket. In addition, since the support portion is formed of a material having higher rigidity than the floating plate, it is possible to suppress a damage accident of the support portion that occurs at the time of peeling. Furthermore, since the support portion is formed of a material different from that of the floating plate, the moldability of the floating plate is improved.

  According to the second aspect of the present invention, the narrow portion near the edge of the electrical component can be locked by providing the support portion so as to protrude from the wall portion forming the opening portion to the inside of the opening portion. . Therefore, it is possible to narrow the generation area of the flaws on the electric parts so that the flaws are not noticeable, and to prevent the quality deterioration of the product.

  Furthermore, according to the invention which concerns on Claim 3, since the support part was formed with the metal plate insert-molded by the floating plate, a thin support part can be formed easily. Therefore, even if the integration degree of the terminals of the electrical component is increased and the height of the terminals is lowered, it can be easily handled. Further, the strength can be maintained even if the support portion is thinned.

  According to the invention of claim 4, the support plate in which the introduction hole for introducing the terminal of the electrical component and enabling connection with the contact means is formed over the entire area of the opening formed in the floating plate. By attaching and supporting the bottom surface of the electrical component, a stopper that prevents the terminal of the electrical component from being deformed more than a predetermined amount simultaneously with the peeling function of the electrical component attached to the contact means on the support plate. It can also function. Therefore, the number of parts is reduced, and the cost of the socket for electrical parts can be reduced.

  According to the fifth aspect of the present invention, the support plate is formed of polyimide resin, so that the introduction hole for introducing the terminal of the electrical component can be easily formed by exposure and development processing. Therefore, it is possible to easily cope with terminals of electrical parts with high processing accuracy and high integration.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a plan view showing a first embodiment of an electrical component socket according to the first invention, and FIG. 2 is a sectional view taken along line XX of FIG. This socket for electrical parts is a clamshell type electrical part socket used for product inspection such as burn-in test of an IC package, and includes a socket body 18, contact means 19, a floating plate 16, and a socket cover 5. And.

  Here, as shown in FIG. 3, the IC package 3 has a BGA (terminal 3a made of a large number of substantially spherical solder balls arranged in a matrix in columns and rows on a bottom surface 3b of a rectangular package body, for example. Ball Grid Array) type.

  As shown in FIG. 2, the socket body 18 is for housing and holding the IC package 3 in the housing portion 20 formed in the center portion, and forming a rectangular groove 2 a corresponding to the housing portion 20. The groove portion 2a has an outer shape square base plate 2 provided with an elastic sheet 9 such as silicone rubber, and has an opening 6a corresponding to the accommodating portion 20 (see FIG. 1), and is formed in substantially the same outer shape. An intermediate member 6 is provided.

  Contact means 19 is provided on the base plate 2. The contact means 19 electrically connects the terminal 3a of the IC package 3 accommodated in the accommodating portion 20 and the electric circuit board disposed below the base plate 2, and as shown in FIG. A pin 1 and a tab film 4 are provided.

  Here, the contact pins 1 are formed by, for example, pressing a conductive metal plate material, and a large number of the contact pins 1 are implanted along the four sides of the peripheral portion of the base plate 2 (four rows in FIG. 2). It is formed as a contact portion 1a that protrudes from the upper surface side of the base plate 2 and comes into contact with the connection electrode 4b (see FIG. 15) of the tab film 4, and a lower end portion is formed as a lead portion 1b that protrudes from the lower surface side of the base plate 2 and is not shown. The lead portion 1b is inserted into the through hole of the electric circuit board to be electrically connected.

  The tab film 4 is a quadrilateral flexible printed circuit board in which, for example, a polyimide film is provided with a wiring that fan-outs from the central portion toward the peripheral portion, and the contact portion 1a of the contact pin 1 and A plurality of contact electrodes 4b (see FIG. 15) are formed, and a plurality of contact electrodes 4a that contact the terminals 3a of the IC package 3 accommodated in the accommodating portion 20 as shown in FIG. The terminals 3a of the densely arranged IC packages 3 and the contact pins 1 can be electrically connected. The tab film 4 is disposed on an elastic sheet 9 disposed at the center of the base plate 2, and the elastic force of the elastic sheet 9 causes the terminals 3 a of the IC package 3 and the contact electrodes 4 a formed on the tab film 4 to be connected. The electrical connection can be made reliably.

  Further, a stopper 10 is disposed on the upper surface of the tab film 4. The stopper 10 is used for positioning the terminal 3a of the IC package 3 and the contact electrode 4a of the tab film 4 and minimizing deformation of the terminal 3a of the IC package 3 due to a high-temperature burn-in test or the like. For example, a polyimide resin having a heat resistance, an insulating property, and a predetermined hardness is formed in a square shape, and a plurality of introduction holes 10a for introducing the terminals 3a of the IC package 3 are formed in the center portion. The height of the stopper 10 is slightly lower than the height of the terminal 3a of the IC package 3. Even if the solder ball of the terminal 3a is softened and deformed in a high-temperature test, the bottom surface 3b of the IC package 3 remains on the stopper 10 By being in contact with, the deformation is prevented from proceeding more than a predetermined amount.

  Further, as shown in FIG. 1, a floating plate 16 is accommodated in the opening 6 a of the intermediate member 6 above the base plate 2. The floating plate 16 has a function of guiding the IC package 3 to the housing portion 20 and, after completion of the test, peeling off the IC package 3 having the terminals 3a attached to the contact electrodes 4a of the tab film 4. 5, the opening 16a is formed corresponding to the housing portion 20, and the wall surface 16b of the opening 16a is formed in a slope shape as shown in FIG. As shown in FIG. 5, for example, at the four corners of the opening 16a below the wall surface 16b, a support portion 17 that protrudes inside the opening 16a and supports the bottom surface 3b of the IC package 3 is formed. ing.

  The support portion 17 is formed by projecting a part of a rectangular metal plate 21 having a thickness substantially the same as that of the stopper 10, for example, at both ends of one long side of the metal plate 21 as shown in FIG. 6. It is provided at a portion corresponding to the corner portion of the opening 16a. In this case, as shown in FIG. 7, the metal plate 21 is bent into a rectangular shape at the short side portion in the vicinity of the support portion 17 and is insert-molded into the floating plate 16 so that it does not easily fall off. .

  Further, as shown in FIG. 7, the floating plate 16 is provided with a recess 16 c at the center of the side of each side of the opening 16 a, and an upper end portion is inserted into the recess 16 c so as to be provided on the base plate 2. It is always biased upward by a string spring (biasing means) 15 (see FIG. 4).

  As shown in FIG. 1 or 2, the socket cover 5 is rotatably provided at one end of the intermediate member 6 of the socket body 18. The socket cover 5 is pivotally supported on one side end portion of the intermediate member 6 so as to be rotatable by a rotation shaft 22, is wound around the rotation shaft 22, and one end portion is an upper surface of the intermediate member 6. 2 and is always urged in the direction of arrow A (opening direction) in FIG. 2 by a coiled spring 23 having the other end engaged with the inner surface of the socket cover 5.

  On the other end of the socket cover 5, the locking means 12 is pivotally supported by a pivot shaft 24. This locking means 12 is to lock the socket cover 5 to the side surface 6b of the intermediate member 6 when the socket cover 5 falls down in the direction of arrow B in FIG. The inside of the socket cover 5 is wound around the rotary shaft 24 by a string spring 25 having one end locked to the upper surface of the socket cover 5 and the other end locked to the inner surface of the upper end of the locking means 12. Always energized towards.

  A pressing means 26 is provided in the central portion of the socket cover 5 on the side facing the housing portion 20. When the socket cover 5 is in a closed state, the IC package accommodated in the housing portion 20 by the pressing means 26. By pressing the upper surface of 3, the electrical connection between the terminal 3 a of the IC package 3 and the contact means 19 can be ensured.

  As shown in FIG. 4, the pressing means 26 includes a pusher 27 and a pad 8. The pusher 27 is elastically supported by a coiled spring 29 built in a concave portion 28 formed in the central portion of the surface of the socket cover 5 facing the accommodating portion 20, and is accommodated in the concave portion 28. A long hole 30 that is long in the vertical direction is formed at the end, and two shafts 31 supported on the inner surface of the recessed part 28 are inserted into the long hole 30 so as to be vertically movable.

  On the other hand, the pad 8 is formed in a substantially inverted trapezoidal shape with a lower surface 8a narrower than the upper surface 8b in FIG. 4, and is pressed against the upper surface of the IC package 3 with the lower surface 8a. Further, a flange portion 8c protruding to both sides is provided on the upper surface 8b side, and protrudes above the flange portion 8c to form a protrusion portion 8d. The protrusion portion 8d corresponds to the long hole 30 of the pusher 27. A long hole 32 that is long in the vertical direction is formed, and the two shafts 31 provided in the recessed portion 28 are held so as to be movable up and down together with the pusher 27. The pad 8 is provided on its upper surface with a recess 34 that fits with a hemispherical projection 33 formed at the center of the lower surface of the pusher 27 so as to be swingable with respect to the pusher 27. The upper surface of the package 3 can be made to act uniformly.

  The pad 8 has a flange portion 8c and a floating plate 16 corresponding to the flange portion 8c when the socket cover 5 is closed and the lower surface 8a is in contact with the upper surface of the IC package 3 accommodated in the accommodating portion 20. It is formed so that a slight gap may be formed between the upper end surface of each other (see FIG. 9). Thereby, the thickness variation of the IC package 3 can be absorbed and the pressing force of the elastic means 15 can be reliably transmitted to the IC package 3.

Next, the operation of the first embodiment of the electrical component socket configured as described above according to the first invention will be described with reference to FIGS.
First, an electrical component socket is disposed on an electrical circuit board (not shown). Next, as shown in FIG. 8, the IC package 3 is dropped in the direction of the arrow C with respect to the opening 16 a of the floating plate 16 in the open state of the socket cover 5. The IC package 3 is guided to the accommodating portion 20 at the center of the opening 16a at the center of the opening 16a by a guide portion in which the wall surface 16b of the opening 16a is formed in a slope shape. At this time, the bottom surface 3b of the IC package 3 is supported by the support portion 17 provided so as to protrude from the inside of the opening portion 16a at the four corners below the wall surface 16b of the opening portion 16a.

  Next, the socket cover 5 is laid down in the direction of arrow A in FIG. When the socket cover 5 is closed, first, as shown in FIG. 9, the lower surface 8a of the pad 8 of the pressing means 26 comes into contact with the upper surface of the IC package 3 inserted into the opening 16a, and the socket cover 5 is closed. Accordingly, the IC package 3 is pressed in the direction of arrow D against the urging force of the string spring 15 and pushed down. As a result, the floating plate 16 is pressed against the support portion 17 by the bottom surface 3 b of the IC package 3 and descends as the IC package 3 descends.

  Further, the closing operation of the socket cover 5 proceeds, and as shown in FIG. 10, the coiled spring 15 is compressed and the floating plate 16 is lowered to the lowest point, and when it comes into contact with the upper surface of the tab film 4, the lowering stops. The pressing force F of the pressing means 26 acts on the IC package 3 by the pad 8. As a result, the terminal 3a of the IC package 3 is guided by the stopper 10 and comes into contact with the contact electrode 4a of the tab film 4 for electrical connection.

  In this state, the locking means 12 of the socket cover 5 is locked to the side surface 6b of the intermediate member 6 (see FIG. 2), and the closing operation of the socket cover 5 is completed. And the socket for electrical components which accommodated IC package 3 is used for product inspections, such as a burn-in test, for example.

  Since this burn-in test is performed under a high temperature, the solder ball of the terminal 3 a of the IC package 3 may be softened and stuck to the contact electrode 4 a of the tab film 4. The IC package 3 attached in this way is easily peeled off when the socket cover 5 described below is opened.

Next, the opening operation of the socket cover 5 will be described.
First, when the product inspection of the IC package 3 is completed, the locking of the intermediate member 6 to the side surface 6b by the locking means 12 is released (see FIG. 2). As a result, the socket cover 5 rotates about the rotation shaft 22 by the elastic restoring force of the string spring 23 provided at the side end portion thereof, and starts the opening operation in the direction of arrow B in FIG. By this opening operation, the pressing force F applied to the IC package 3 by the pressing means 26 shown in FIG. 10 is released, and the floating plate 16 is pushed upward by the urging force f of the string spring 15. At the same time, the biasing force f of the string spring 15 acts as an upward peeling force on the bottom surface 3 b of the IC package 3 via the support portion 17 of the floating plate 16. In this case, if the urging force f of the string winding spring 15 is set sufficiently larger than the adhesion force of the IC package 3, the IC package 3 adhered to the contact electrode 4 a of the tab film 4 is It is easily peeled off by the urging force f. This facilitates removal of the IC package 3 from the electrical component socket after product inspection.

  Thus, according to 1st Embodiment of the socket for electrical components by 1st invention, it is made to protrude inside the opening part 16a on the wall part 16b of the opening part 16a provided in the floating plate 16, and the support part 17 is made to protrude. By forming and supporting the IC package 3 on the support portion 17, the biasing force f of the chord spring 15 that supports the floating plate 16 acts on the bottom surface 3 b of the IC package 3 when the socket cover 5 is opened. Can be made. Therefore, it is possible to easily peel off the terminal 3a that has been softened in a high-temperature test such as a burn-in test and adhered to the contact electrode 4a of the tab film 4. Thereby, the IC package 3 can be easily taken out from the socket for electric parts after the test.

  In addition, since the support portion 17 is formed of a material having higher rigidity than the floating plate 16, it is possible to suppress a damage accident of the support portion 17 that occurs at the time of peeling. Furthermore, since the support portion 17 is formed of a material different from that of the floating plate 16, the moldability of the floating plate 16 is improved.

  And if the support part 17 is formed by insert-molding the metal plate 21 to the floating plate 16, the thin support part 17 can be formed easily. Therefore, even if the integration degree of the terminals 3a of the IC package 3 is increased and the height of the terminals 3a is lowered, it can be easily handled. Moreover, even if the support part 17 becomes thin, the intensity | strength can be maintained.

  FIG. 11 is an enlarged cross-sectional view of a main part showing a second embodiment of the socket for electrical parts according to the first invention. In FIG. 11, the floating plate 16 is formed with a substantially conical through hole 16d penetrating in the vertical direction at the lateral center of each side of the opening 16a, and a release member 35 is inserted into the through hole 16d. Yes. The release member 35 releases the bias of the chord spring 15 that is pressed down by the pad 8 and biases the floating plate 16 upward, and has a truncated cone shape substantially equal to the through hole 16d. An upper end portion protrudes from the upper surface of the floating plate 16. In this case, the upper end surface of the string spring 15 is in contact with the lower surface of the release member 35, and the urging force is transmitted to the floating plate 16 through the release member 35.

  Further, as shown in FIG. 11, the metal plate 21 forming the support portion 17 forms a hole portion 21a in a portion corresponding to the through hole 16d formed in the floating plate 16, and the hole portion 21a and the through hole 16d are formed. The floating plate 16 is insert-molded so as to match.

Next, the operation of the second embodiment of the electrical component socket according to the first invention constructed as described above will be explained with reference to FIGS. Here, a description will be given from the middle of the closing operation of the socket cover 5.
First, as shown in FIG. 12, the flange portion 8c of the pad 8 of the pressing means 26 is formed on the upper end portion of the release member 35 inserted into the through hole 16d provided in the central portion of each side of the opening portion 16a of the floating plate 16. In contact with the closing operation of the socket cover 5, the release member 35 is pressed in the direction of arrow E, and the coiled spring 15 disposed on the lower surface of the release member 35 is pushed down. As a result, the locking of the release member 35 with respect to the through hole 16d is released, and the urging of the string spring 15 that urges the floating plate 16 upward is released. Therefore, the floating plate 16 descends by its own weight. At the same time, the IC package 3 supported by the support portion 17 in the opening portion 16a of the floating plate 16 is also lowered. At this time, the pad 8 is not yet in contact with the upper surface of the IC package 3.

  Further, the closing operation of the socket cover 5 proceeds, and as shown in FIG. 13, when the coiled spring 15 is compressed and the floating plate 16 is lowered to the lowest point and contacts the upper surface of the tab film 4, the pad 8 becomes IC Abutting on the upper surface of the package 3, the pressing force F of the pressing means 26 acts on the IC package 3. As a result, the terminal 3a of the IC package 3 is guided by the stopper 10 and contacts the contact electrode 4a of the tab film 4 to ensure electrical connection.

  Next, when the socket cover 5 is opened, the pressing force F applied to the IC package 3 by the pressing means 26 is released, and the floating plate 16 is pushed upward by the biasing force f of the coiled spring 15 as shown in FIG. At the same time, the biasing force f of the string spring 15 acts as an upward peeling force on the bottom surface 3 b of the IC package 3 via the support portion 17 of the floating plate 16. As a result, the IC package 3 attached to the contact electrode 4 a of the tab film 4 is easily peeled off by the biasing force f of the chord spring 15.

  As described above, according to the second embodiment of the socket for electrical parts according to the first invention, the terminal 3a of the IC package 3 attached to the contact electrode 4a of the tab film 4 is connected as in the first embodiment. The support portion 17 can be easily peeled off, and when the socket cover 5 is closed, the biasing force of the coiled spring 15 that biases the floating plate 16 upward is pressed before the IC package 3 is pressed. Thus, during the closing operation of the socket cover 5, the urging force f of the string spring 15 does not act on the IC package 3, and damage to the IC package 3 can be suppressed.

  As described above, the support portion 17 is not limited to the one that protrudes from the four corners of the opening portion 16a of the floating plate, and protrudes inward from the at least two opposing walls of the opening portion 16a horizontally inside the opening portion 16a. It may be provided.

  Further, in the electrical component socket according to the first invention, the support portion 17 is not limited to the metal plate 21 as described above, and may be, for example, ceramic or the like as long as the material is higher in rigidity than the floating plate 16. .

  FIG. 14 is a cross-sectional view showing an embodiment of a floating plate of an electrical component socket according to the second invention. The floating plate 16 includes a support plate 36 that is stretched over the entire area of the opening 16a formed corresponding to the accommodating portion 20 and supports the bottom surface 3b of the IC package 3. The support plate 36 includes an IC package. The third terminal 3a is introduced, and an introduction hole 36a that enables connection between the terminal 3a and the contact means 19 is formed. In this case, if the thickness of the support plate 36 is the same as that of the stopper 10, the stopper 10 can be omitted. The support plate 36 is preferably formed in a film shape with a polyimide resin. Thereby, the introduction hole 36a can be easily formed by exposure and development processing.

  Thus, according to the electrical component socket of the second invention, simultaneously with the peeling function of the IC package 3 attached to the contact means 19 on the support plate 36 stretched over the entire area of the opening 16a, It can also serve as the stopper 10. Therefore, the number of parts is reduced, and the cost of the socket for electrical parts can be reduced.

  In addition, the socket for electrical components of this invention is not restricted to a clamshell type, You may apply to an open top type.

It is a top view which shows 1st Embodiment of the socket for electrical components by 1st invention, an upper half shows the open state of a socket cover with respect to XX line, and a lower half shows the closed state of a socket cover . It is the XX sectional view taken on the line of FIG. The IC package applied to the said socket for electrical components is shown, (a) is the front view, (b) is the bottom view. It is a conceptual diagram of the socket cover open state which expands and shows the principal part of FIG. It is a top view which shows the floating plate of 1st Embodiment. It is a bottom view of said floating plate. It is centerline sectional drawing of said floating plate. It is explanatory drawing which shows the state which accommodated the electrical component in the said socket for electrical components in the socket cover open state. It is explanatory drawing which shows the closing operation initial state of the socket cover of 1st Embodiment. It is explanatory drawing which shows the socket cover closing operation completion state of 1st Embodiment. It is a principal part expanded vertical sectional view which shows 2nd Embodiment of the socket for electrical components by 1st invention. It is explanatory drawing which shows the closing operation initial state of the socket cover of 2nd Embodiment. It is explanatory drawing which shows the socket cover closing operation completion state of 2nd Embodiment. It is sectional drawing which shows embodiment of the floating plate of the socket for electrical components by 2nd invention. It is a disassembled perspective view of the conventional socket for electrical components.

Explanation of symbols

3 ... IC package (electric parts)
3a ... terminal 3b ... bottom surface 10 ... stopper 15 ... string spring (biasing means)
DESCRIPTION OF SYMBOLS 16 ... Floating plate 16a ... Opening part 16b ... Wall part 16c ... Through-hole 17 ... Support part 18 ... Socket main body part 19 ... Contact means 20 ... Accommodating part 21 ... Metal plate 26 ... Pressing means 27 ... Pusher 29 ... String winding spring (pressing) Element)
36 ... support plate 36a ... introduction hole

Claims (5)

A housing portion formed on the upper surface of the socket body portion, housing electrical components, and provided with contact means capable of contacting the terminals of the electrical components;
A floating plate arranged to be movable up and down with respect to the housing portion and supporting the electrical component;
An urging means provided in the socket main body for urging the floating plate upward;
A pressing unit that presses the upper surface of the electrical component housed in the housing unit to electrically connect the terminal of the electrical component and the contact unit;
A socket for electrical parts comprising:
The floating plate is provided with a support portion for supporting the bottom surface of the electrical component at the edge of the opening formed corresponding to the housing portion, and the support portion is formed of a material having rigidity higher than that of the floating plate. A socket for electrical parts.   The socket for an electrical component according to claim 1, wherein the support portion is provided so as to protrude from the wall portion forming the opening portion to the inside of the opening portion.   The socket for an electrical component according to claim 1 or 2, wherein the support portion is made of a metal plate that is insert-molded in the floating plate. A housing portion formed on the upper surface of the socket body portion, housing electrical components, and provided with contact means capable of contacting the terminals of the electrical components;
A floating plate arranged to be movable up and down with respect to the housing portion and supporting the electrical component;
A biasing means provided in the socket main body for biasing the floating plate upward;
A pressing unit that presses the upper surface of the electrical component housed in the housing unit to electrically connect the terminal of the electrical component and the contact unit;
A socket for electrical parts comprising:
The floating plate includes a support plate that is stretched across the entire opening formed to correspond to the housing portion and supports the bottom surface of the electrical component, and the terminal of the electrical component is introduced into the support plate. A socket for an electrical component, characterized in that an introduction hole that enables connection between the terminal and the contact means is formed.   The electrical component socket according to claim 4, wherein the support plate is made of polyimide resin.

Images