JP2004079227A - Ic socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a peeling mechanism capable of easily and forcefully peeling contact of an IC socket and a pad of an IC package stuck on together. <P>SOLUTION: The IC socket comprises a socket main part, a cover which freely moves up and down on the socket main part through a spring, at least a pair of latches which open and close by a vertical movement of the cover, a floating plate which freely moves up and down on the socket main part through a spring and clips the IC package between itself and the latch, and a contact of which the contact part for contacting the pad of the IC package is arranged in the aperture provided on the floating plate and which electrically connects the IC package and the test board, and the latch has a push-up member for pushing up the floating plate. The above contact may be a pogo pin. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an IC socket, and more particularly, to an IC socket provided with a peeling mechanism for coping with sticking of a contact of the IC socket to an IC package.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in an open-top type IC socket on which a BGA type IC package is mounted, when the IC package is taken out by an automatic machine or the like after a high-temperature test such as a burn-in test, the contact of the IC socket is connected to a solder ball (pad) ), And cannot be easily removed, damaging the pads and hindering the progress of the test.
[0003]
The reason why the contact of the IC socket sticks to the solder ball of the IC package is that the solder ball is exposed to a high temperature to be softened, and that the contact is connected to the pad in order to guarantee the electrical connection between the contact and the pad. Is pressed at a predetermined pressure. Therefore, the sticking itself cannot be avoided as long as solder is used for the pad.
[0004]
The sticking will be specifically described with reference to FIGS.
[0005]
FIG. 8 shows a state when the IC package is completely mounted on the IC socket, and FIG. 9 shows a state when the IC package is opened and the IC package is taken out.
[0006]
8 and 9, an IC socket 100 is implanted in a socket main body 101, an operation member 102 which can move up and down on the socket main body 101 via a spring (not shown), and a vertical direction. The contacts 103 are urged upward to electrically connect the pads 111 of the IC package 110 and the contact portions 131 thereof, the floating plate 104 on which the IC package 110 is mounted, and the opening and closing by the movement of the operation member 102. When in the closed state, the IC package 110 is pushed down to protect the latch 106 and the terminal portion 134 of the contact 103, which can press and contact the pad 111 of the IC package 11 with the contact 103, and protect the terminal portion of the contact 103. 134 to a test board (not shown). When includes terminal alignment plate 107 which acts as a guide.
[0007]
In order to mount the IC package 110 on the IC socket 100, first, the operating member 102 of the IC socket 100 in a free state is pushed down, thereby opening the latch 106. In this state, the IC package 110 is placed on the floating plate 104. At this time, the IC package 110 is positioned at a predetermined position by a positioning mechanism provided on the floating plate 104.
[0008]
Next, when the pressing force of the operation member 102 is released, the latch 106 returns to the original state. At this time, the IC package 110 is sandwiched between the latch 106 and the floating plate 104, and is further pushed down together with the floating plate 104 by the latch 106 which is going to return to the original position, thereby giving an elastic force. The contact portion 131 of the contact 103 is elastically contacted. Therefore, the IC package 110 is electrically connected to the contact 103 under a predetermined pressing force (see FIG. 8).
[0009]
As shown in FIG. 8, the IC socket 100 has the IC package 110 mounted thereon and is mounted on a test board in a closed state, and a burn-in test of the IC package 110 is executed. At this time, the IC package 110 is exposed to a high temperature, and the solder balls 111 constituting the pads are softened.
[0010]
As described above, since the pads 111 of the IC package 110 are in contact with the contacts 103 under a predetermined pressing force and the pads 111 of the IC package 110 are softened at a high temperature, the contact of the contacts 103 during the test is reduced. The portion 131 bites into the pad 111, and is cooled after the test, so that the contact portion 131 and the pad 111 are in a state of being stuck.
[0011]
[Problems to be solved by the invention]
As described above, with the pad 111 of the IC package 110 and the contact portion 131 of the contact 103 adhered to each other, even if the operating member 102 is pressed down to open the latch 106 to remove the IC package 110 from the IC socket 100, If the sticking force between the contact portion 131 and the pad 111 is large, the two are not easily separated from each other, and the floating plate 104 does not rise (see FIG. 9). Even if an external force is applied forcibly removing the IC package, it is difficult to apply an upward force to the IC package on average, and there is a possibility that the IC package may be damaged.
[0012]
In order to remove the sticking, it is conceivable to increase the upward biasing force of a spring (not shown) interposed between the floating plate 104 and the substrate 101. In order to ensure the contact force between the portion 131 and the pad 111 of the IC package 110, the urging force of a spring (not shown) between the operation member 102 and the substrate 101 must be increased. As a result, a large force is required to open the IC socket 100, and it becomes difficult to mount and remove the IC package 110.
[0013]
SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a peeling mechanism capable of forcibly and easily peeling off a contact of an attached IC socket and a pad of an IC package in a series of operations for taking out an IC package from an IC socket. It is intended to provide.
[0014]
[Means for Solving the Problems]
In order to achieve the above object, an IC socket according to the present invention includes a socket body, a floating plate on which an IC package is mounted, which is vertically movable via a spring on the socket body, and which is fixed to the socket body. A contact portion disposed in a through hole provided in the floating plate, the contact being elastically deformable in a vertical direction; a pressing member for pressing an IC package on the floating plate into contact with the contact; A push-up member for pushing up the floating plate.
[0015]
One IC socket of the present invention further includes an operating member vertically movable via a spring with respect to the socket body, and a latch that opens and closes with the vertical movement of the operating member, wherein the latch includes: It may include the pressing member and the lifting member.
[0016]
Further, another IC socket of the present invention may further include a cover that opens and closes rotatably with respect to the socket body, and the cover may include the pressing member and the push-up member.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
(First embodiment)
Hereinafter, a first embodiment of an IC socket according to the present invention will be described with reference to FIGS.
[0018]
FIG. 1 is a schematic plan view of an IC socket with a closed latch when the open-top type IC socket according to the first embodiment is free, that is, when an IC package is not mounted. FIG. 1 is a sectional view taken along line AA of FIG. 3A and 3B are diagrams for explaining mounting or removal of an IC package from or into an IC socket. FIG. 3A is a cross-sectional view illustrating a state in which a latch of the IC socket is opened and an IC package is mounted. (b) is a partially enlarged sectional view in a circle B of (a). 4A and 4B show the IC socket in a state where the latch is closed after the IC package is mounted. FIG. 4A is a cross-sectional view of the IC socket, and FIG. It is sectional drawing.
[0019]
The open-top type IC socket 100 shown in the drawing has basically the same structure as the above-described conventional IC socket. That is, the open-top type IC socket 100 according to the first embodiment generally includes a socket body 1, an operating member 2, a contact 3, a floating plate 4, a positioning member 5, a latch 6, a terminal alignment plate 7, and the like.
[0020]
The operation member 2 is vertically movable with respect to the socket body 1 with a spring 12 interposed therebetween, and opens and closes the latch 6 by its vertical movement. The up and down movement of the operation member 2 is performed manually or by an automatic machine or the like.
[0021]
One end of the contact 3 forms a contact portion 31 that is electrically connected to the pad 10a of the IC package 10. The other end of the contact 3 protrudes from the bottom of the socket body 1 and is inserted into a through-hole of the test board using the terminal alignment plate 7 as a guide to form a terminal section 34 electrically connected to the test board. . The contacts 3 are press-fitted into through-holes 41 formed in a predetermined matrix in the socket main body 1 and fixed to the socket main body 1, and the contact portion 31 is vertically (up and down). An elastic force is applied by a spring or the like (not shown). In the first embodiment, the contact 3 is exemplified by a pogo pin (registered trademark) type, but is not limited to this.
[0022]
The contact portion 31 of the contact 3 is located in a through hole 41 formed in the floating plate 4 corresponding to the contact portion 31, and its tip is slightly spaced from the upper surface of the floating plate 4 (strictly speaking, t). 3 (b), the amount of protrusion of the pad 10a of the IC package 10 is added.), And the inside of the through hole 41 is moved up and down. It is arranged so that it can be moved.
[0023]
The floating plate 4 has a substantially quadrangular shape, and a positioning mechanism 5 for positioning the IC package 10 is provided at the four corners. The floating plate 4 is configured to be vertically movable with respect to the socket body 1 via a spring (not shown). A side wall 42 as a guide member for guiding the vertical movement of the floating plate 4 is formed below the four side edges of the floating plate 4, and a locking portion 44 is formed at the lowermost end of the side wall 42. The locking portion 44 is engaged with the engaging portion 11 formed on the socket body 1 by the urging force of the spring. Further, an opening 43 is formed in the side wall 42 of the floating plate 4 so that a push-up member 61 provided in the latch 6 described later can enter and exit.
[0024]
In place of the side wall 42 formed below the four side edges of the floating plate 4, a plurality of leg-shaped (column-shaped) members are provided at appropriate locations (for example, a total of eight members are provided near one end of each side). ) It may be hung. In this case, the locking portion 44 is similarly formed at the lowermost end of each leg-shaped member. In this case, the formation of the opening 43 can be omitted.
[0025]
Since the floating plate 4 has the above structure, the IC package 10 is mounted on the floating plate 4, and when the latch 6 is closed, the floating plate 4 can be lowered. Due to the lowering of the floating plate 4, the contact portion 31 of the contact 3 relatively rises in the through hole 41 of the floating plate 4, and the pad 10a of the IC package 10 fixed on the floating plate 4 by the latch 6; The contact portion 31 of the contact 3 corresponding to the pad 10a comes into contact.
[0026]
The latch 6 is opened when the operating member 2 is pressed down, and is closed by the elastic force of the spring 12 when released from the pressing force. The latch 6 has a push-up member 61 on a flat plate configured to push up the floating plate 4 to a predetermined position through an opening 43 formed in the floating plate 4 when opened, and an IC package when closed. There is provided a pressing member 62 configured so as to be able to pinch 10 with the upper surface of the floating plate 4. In the present embodiment, the shape of the push-up member 61 is a flat plate, but it may be a curved plate or a rod.
[0027]
Further, when the IC socket is in a free state (a state in which the IC package is not mounted), the distance h between the surface of the latch 6 that presses the IC package 10 of the pressing member 62 and the upper surface of the floating plate 4 is equal to or smaller than the IC package 10. Is set smaller than the thickness (height) H of. Here, the height H of the IC package, the distance h between the pressing member 62 and the floating plate 4, and the amount t of the contact portion 31 of the contact 3 drawn from the upper surface of the floating plate 4 are substantially in a relationship of Hh ≧ t. . In this embodiment, two pairs of the latches 6 are provided on each of the opposite sides, but it is sufficient that at least one pair of the latches 6 is provided on the opposite side.
[0028]
The mounting and unloading of the IC package 10 in the open-top type IC socket 100 having such a configuration will be described below.
[0029]
The mounting of the IC package 10 is performed in the same manner as in the conventional example. That is, in the IC socket in the free state shown in FIG. 2, when the operating member 2 is pressed down, the latch 6 is opened, and the IC package 10 is placed on the floating plate 4 at a predetermined position (FIG. 3). (A)). At this time, the pad 10a of the IC package 10 is positioned by the positioning mechanism 5 corresponding to the through hole 41 formed in the following plate 4. Further, as described above, since the contact portion 31 of the contact 3 is located at a position where the contact portion 31 is retracted within the through hole 41 of the floating plate 4 by a small interval t, the pad 10a does not contact the contact portion 31 but separates. (See FIG. 3B).
[0030]
Subsequently, when the pressing force of the operation member 2 is released, the latch 6 is closed by the returning force of the spring 12. The IC package 10 is sandwiched between the pressing member 62 of the latch 6 and the floating plate 4, and the latch 6 that attempts to return to the original position by the return force of the spring 12 pushes down the floating plate 4. As a result, the contact portion 31 of the contact 3 comes into contact with the pad 10a of the IC package 10, and finally, the elastic force of the contact and the spring of a spring (not shown) interposed between the floating plate 4 and the socket body 1. At a position where the sum of the forces and the spring force of the spring 12 are balanced, the pad 10a of the IC package 10 and the contact portion 31 of the contact 3 make pressure contact (see FIG. 4).
[0031]
In this state, the IC socket 100 is mounted on the test board, and the IC package 10 is subjected to a high-temperature test such as a burn-in test.
[0032]
After the test, the operating member 2 is pressed down again to remove the IC package 10, and the latch 6 is opened. At this time, the lifting member 61 of the latch 6 pushes the floating plate 4 up to the original predetermined position, so that the pad 10a of the IC package 10 and the contact portion 31 of the contact 3 are forcibly separated by the interval t (FIG. a)). As a result, even if the contact portion 31 of the contact 3 is attached to the pad 10a of the IC package 10, the attachment can be easily peeled off without applying any particular force.
[0033]
In the first embodiment, the predetermined position of the floating plate 4 is a position at which the locking portion 44 engages with the engaging portion 11 of the socket main body. However, the present invention is not limited to this. For example, all other configurations are the same as those of the above-described embodiment, and only at a predetermined position of the floating plate 4, the locking portion 44 is located below the engagement portion 11 by an appropriate distance a (provided that the contact 3 At least a part of the contact portion 31 must always be in the through hole 41 of the floating plate 4). In this case, the pad 10a of the IC package and the contact portion 31 of the contact 3 can be separated by (t + a), and the sticking of both can be more reliably peeled off.
[0034]
(Second embodiment)
Next, a second embodiment of the IC socket according to the present invention will be described with reference to FIGS.
[0035]
FIG. 5 is a schematic plan view of the IC socket with the cover open when the clamshell type IC socket according to the second embodiment is free, that is, when the IC package is not mounted. FIGS. 6A and 6B are diagrams for explaining mounting or taking out of an IC package in a clamshell type IC socket according to a second embodiment of the present invention. FIG. FIG. 2B is a cross-sectional view showing a mounted state, and FIG. 2B is a partially enlarged cross-sectional view within a circle B in FIG. 7 shows a state in which the cover of the IC socket is closed after the IC package is mounted, (a) is a cross-sectional view thereof, and (b) is a partially enlarged view of a circle B in (a). It is sectional drawing.
[0036]
The clamshell type IC socket 200 shown in the figure generally includes a socket body 210, a cover 220, a contact 230, a floating plate 240, a positioning member 250, a terminal alignment plate 260, and the like.
[0037]
An operation member 210 is rotatably attached to the socket body 210, a plurality of contacts 230 are fixed so as to be arranged in a predetermined matrix, and a floating plate 240 is attached to be vertically movable.
[0038]
The cover 220 includes a pair of protrusions 214 formed on the socket body 210, a pair of legs 223 formed on the cover 220, a pair of protrusions 214, and a shaft 215 passing through the pair of legs 223. It is rotatably attached to the socket body 210 via a hinge mechanism. The cover 220 is also urged in the opening direction (counterclockwise in FIG. 7A) by a torsion compression spring 216 wound around the shaft 215. Further, the cover 220 has a locking portion 222 formed along the side on the free end side. By engaging the engaging portion 222 with the engaging claw 211 formed on the socket body 210, the cover 220 can be maintained in a closed state against the urging force of the spring 216.
[0039]
As shown in FIGS. 6A and 7A, the cover 220 further applies a predetermined force to the contact 230 when the cover 220 is closed. And a pressing member 221 that acts so as to be able to make a pressure contact. The pressing member 221 is swingably attached to the cover 220 via the shaft 221a as shown in the figure, so that the back surface of the IC package 270 can be pressed uniformly. It is.
[0040]
As shown in FIG. 6 (a), each of the pair of legs 223 of the cover 220 has a projection 224 as a floating plate 240 push-up member according to the present invention, and when the cover 220 is opened, the floating plate 240 Are formed integrally so as to abut against and push up the bottom surface of the. In the second embodiment, the protruding body 224 protrudes from the leg 223 along the outer peripheral edge of the leg 223 in a direction substantially perpendicular to the upper flat surface 220a of the cover 220. By forming the protruding body 224 in this way, when the cover 220 opens 90 degrees around the axis 215, the protruding body 224 comes into contact with the bottom surface of the floating plate 240. Further, by opening the cover 220, the floating plate 240 can be pushed upward. In the second embodiment, as a preferable example, the protruding body 224 protrudes in a direction perpendicular to the cover 220 (at an angle of 90 degrees), but is not limited thereto. Absent.
[0041]
In the second embodiment, the contact 230 includes a contact portion 231, an arc-shaped elastic portion 232, a fixing portion 233, and a terminal portion 234.
[0042]
The contact portion 231 is electrically connected to the pad 271 of the IC package 270 to be mounted. As in the first embodiment, the contact portion 231 is arranged so as to be drawn down from the upper surface of the floating plate 240 by an interval t and to face the inside of the through hole 241 formed in the floating plate 240. As shown in FIGS. 6B and 7B, the tip of the contact portion 231 is bent in a U-shape, and the two opposing pieces extend further upward to form a solder ball as the pad 271. Together, they are opened in a C-shape, and the pads 271 of the IC package 270 are formed so as to be sandwiched and contacted between the two pieces. The tip shape of the contact portion 231 is not limited to this, and may be, for example, a pin shape, or a concave portion may be formed according to the shape of the pad 271.
[0043]
The elastic portion 232 of the contact 230 is formed in an arc shape or a V-shape in order to apply an elastic force to the contact 230 to enable the contact portion 231 to move up and down. The fixing portions 233 are press-fitted into a large number of through holes formed in the socket body 210 in a matrix corresponding to the pads 271 of the IC package 270. Thus, the plurality of contacts 230 are fixed to the socket body 210 in a matrix corresponding to the pads 271 of the IC package 270. The terminal portion 234 protrudes downward from the bottom surface of the socket main body 210, is inserted into a through hole of the test board using the terminal alignment plate 260 as a guide, and is electrically connected to a printed circuit of the test board. The contact 230 may be of the pogo pin (trade name) type shown in the first embodiment.
[0044]
The floating plate 240 has a substantially square shape, as in the first embodiment, and has a large number of through holes 241 arranged in a matrix at the same pitch as the pitch of the pads 271 of the IC package 270 to be mounted. I have.
[0045]
The floating plate 240 is vertically movably attached to the socket main body 210 via a compression spring 217 in a housing chamber 211 formed by opening the upper part of the socket main body 210. In the second embodiment, as a guide member for guiding the vertical movement of the floating plate 240, a leg 242 having a vertically long slot 243 formed below four corners of the floating plate 240 is provided. A guide member for the floating plate 240 is formed by a long pin 219 fixed to the socket body 210 penetrating through two long holes 243 formed in the two opposing legs 242. Note that the length of the long hole 243 may or may not limit the vertical movement stroke of the floating plate 240 to a predetermined length.
[0046]
As shown in FIG. 6A, when the cover 220 is fully opened, the floating plate 240 is at the highest position by the compression spring 217. At this time, even when the IC package 270 is mounted on the floating plate 240, the contact portion 231 of the contact 230 is pulled from the upper surface of the floating plate 240 by a distance t and penetrates through the floating plate 240, as in the first embodiment. Since the contact portion 231 of the contact 230 corresponding to the pad 271 of the IC package 270 is in a non-contact state since the contact portion 231 faces below the hole 241.
[0047]
The positioning member 250 is mounted on the floating plate 240 in the second embodiment. That is, in the second embodiment, unlike the first embodiment, the floating plate 240 and the positioning member 250 are formed separately. The positioning member 250 has a substantially rectangular opening 251 slightly larger than the size of an IC package placed in the center, and a positioning mechanism 252 having a conventionally known structure is provided near four corners of the opening 251. Have been. By forming the positioning member separately as described above, the same IC socket can be used simply by replacing the positioning member, for example, for testing IC packages having the same pad pitch but different sizes of mounted IC packages. Can be used.
[0048]
The terminal alignment plate 260 is formed corresponding to the matrix arrangement of the plurality of contacts 230, has a plurality of through holes through which the terminal portions 234 of the plurality of contacts 230 pass, and is attached to the bottom surface of the socket substrate 210 so as to be able to move forward and backward. Have been. When the IC socket 200 is mounted on a test board (not shown), the terminal alignment plate 260 is advanced from the bottom surface of the IC socket 210, supports the terminal 234 of the terminal of the contact 230, and retreats to the bottom surface of the IC socket 210. Meanwhile, it helps to insert the terminal 234 of the contact 230 into the through hole formed in the test board.
[0049]
The mounting and taking out of the IC package 270 in the clamshell type IC socket 200 having such a configuration will be described below.
[0050]
As shown in FIG. 6A, when the cover 220 of the IC socket 200 is in a fully opened state, the IC package 270 is guided by the positioning mechanism 272 and is placed at a predetermined position on the floating plate 240. Is done. That is, pads 271 of IC package 270 are positioned on corresponding through holes 241 provided in floating plate 240. When the IC package 270 is simply placed on the floating plate 240 at the predetermined position in this manner, the pad 271 of the IC package 270 does not contact the contact portion of the contact 230 as described above (FIG. 6). (B)).
[0051]
Next, the cover 220 is closed against the urging force of the torsion compression spring 216. With the closing operation of the cover 220, the pressing member 221 rotatably attached to the cover 220 comes into contact with the back surface of the IC package 270. Subsequently, the pressing member 221 presses down the floating plate 240 while pressing the IC package 270 against the floating plate 240. Accordingly, the contact portion 231 of the contact 230 relatively rises in the through hole 241, and the contact portion 231 contacts the pad 271 of the IC package 270. In this state, the cover 220 has not been completely closed yet.
[0052]
When the cover 220 is completely closed as shown in FIG. 7A, the pressing member 221 further pushes down the IC package 270 together with the floating plate 240. Accordingly, the contact portion 231 of the contact 230 is pushed down by the elastic portion 232 being elastically deformed. As a result, the contact portion 231 of the contact 230 and the pad 271 of the IC package 270 come into contact under a predetermined pressure. This contact provides reliable and stable electrical contact between the contact portion 231 and the pad 271 (see FIG. 7B).
[0053]
With the cover 220 completely closed in this way, the locking portion 222 of the cover 220 is locked by engaging with the engaging claw 212 of the socket body 210 as shown in FIG. In this state, the IC socket 200 is mounted on the test board, and the IC package 270 is subjected to a high-temperature test such as a burn-in test.
[0054]
After the test, in order to take out the IC package 270 from the IC socket 200, the engaging claw 212 may be removed from the locking portion 222 and the cover 220 may be opened. At this time, the protruding body 224 formed on the leg portion 223 of the cover 220 rotates with the rotation of the cover 220, abuts against the lower surface of the floating plate 240, and further pushes it up (see FIG. 6A). . Accordingly, the IC package 270 placed on the floating plate 230 is also pushed up, so that even if the pad 271 of the IC package 270 and the contact portion 231 of the contact 230 are stuck, this sticking can be easily pulled. Can be peeled off.
[0055]
【The invention's effect】
As described above, according to the present invention, the member that opens and closes when the IC package is mounted on and removed from the floating plate is provided with the push-up member as a peeling mechanism that pushes up the floating plate as the member is opened and closed. The bonding between the pads of the IC package and the contacts of the IC socket after the high-temperature test can be easily peeled off without damaging the pads of the IC package.
[Brief description of the drawings]
FIG. 1 is a schematic plan view of an IC socket according to the present invention when the IC socket is closed and free, that is, when an IC package is not mounted.
FIG. 2 is a sectional view taken along line AA of FIG.
FIGS. 3A and 3B are diagrams for explaining how to mount or take out an IC package on an IC socket; FIG. 3A is a cross-sectional view showing an open state of an IC socket (latch); FIG. FIG.
4A and 4B show an IC socket when an IC package is mounted, wherein FIG. 4A is a cross-sectional view thereof, and FIG. 4B is an enlarged cross-sectional view of a part of a circle B in FIG.
FIG. 5 is a schematic plan view of the IC socket with an open cover when the clamshell type IC socket according to the second embodiment is free, that is, when no IC package is mounted.
FIGS. 6A and 6B are diagrams for explaining mounting or taking out of an IC package in a clamshell type IC socket according to a second embodiment of the present invention. FIG. FIG. 3B is a cross-sectional view showing a mounted state, and FIG. 4B is a partially enlarged cross-sectional view in a circle B of FIG.
FIGS. 7A and 7B show a state in which the cover of the IC socket is completely closed after the IC package is mounted, wherein FIG. 7A is a cross-sectional view thereof, and FIG. FIG.
FIG. 8 is a diagram showing a state when mounting of an IC package is completed in a conventional IC socket.
FIG. 9 is a view showing a state where a conventional IC socket is opened and an IC package is taken out.
[Explanation of symbols]
1, 101, 210 Socket body
2,102 operation members
3, 103, 230 contacts
4,104,240 Floating plate
5, 105, 252 Positioning mechanism
6, 106 latch
7, 107, 260 Terminal alignment plate
10,270 IC package
10a, 111, 271 pad (solder ball)
11 Engagement part
31, 131, 231 contact part
34, 134, 234 terminal
41,241 Through hole
42 Side wall
43 opening
44 Locking part
61 Push-up member
62 pressing member
100, 270 IC socket
232 elastic part
233 fixing part

Claims (3)

A socket body,
A floating plate which is vertically movable via a spring in the socket body and on which an IC package is mounted;
A contact fixed to the socket main body, the contact portion of which is arranged in a through hole provided in the floating plate, and elastically deformable in a vertical direction,
A pressing member that presses the IC package on the floating plate into contact with the contact;
A lifting member that pushes up the floating plate,
An IC socket comprising: Further, an operating member that can move up and down with respect to the socket body via a spring,
A latch that opens and closes with the vertical movement of the operating member;
With
The IC socket according to claim 1, wherein the latch includes the pressing member and the lifting member. Furthermore, a cover is provided that opens and closes rotatably with respect to the socket body,
The IC socket according to claim 1, wherein the cover has the pressing member and the lifting member.

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