JP4465247B2 - Electronic component insertion method - Google Patents

Description

  The present invention relates to an electronic component insertion method in which the lead wire of an electronic component with a lead wire is inserted into an insertion hole formed at a component insertion position of a substrate, and the electronic component is inserted into the substrate.

  Conventionally, various electronic component insertion methods for sequentially inserting this type of electronic component with lead wires into a substrate are known. In an electronic component insertion apparatus in which such an electronic component insertion method is performed, an electronic component with a lead wire is held, the lead wire is inserted into an insertion hole formed at the insertion position of the substrate, and the electronic component is mounted on the substrate. A component insertion head device that is fixed to the electronic component supply device, an electronic component supply device that accommodates a plurality of electronic components in a supplyable manner, and a plurality of carriers that individually hold the electronic components supplied from the electronic component supply device. The electronic component held by the circulating member transporting part and the transporting member positioned at the component transfer position in the circulating component transporting unit, and the electronic component is placed in the component inserting head device. The transfer chuck for transferring and the substrate can be held, and the substrate is moved along its surface for alignment between the held substrate and the component insertion head device. That and a substrate moving device (e.g., see Patent Document 1).

  The continuous insertion operation of each electronic component performed in such an electronic component insertion apparatus will be specifically described with reference to schematic diagrams shown in FIGS. In addition, these schematic explanatory drawings are diagrams for the purpose of grasping which electronic component is located at which position of each component in the electronic component insertion device.

  First, in the electronic component insertion device 500 in the state shown in FIG. 19, the electronic component 1 is not yet held on the respective transport bodies 521 provided in the circulating component transport unit 520. The substrate moving device 550 is in a state where the first substrate 5-1 into which the plurality of electronic components 1 are inserted is held.

  In addition, the plurality of tape-shaped component supply units 511 provided in the electronic component supply device 510 accommodate a plurality of electronic components 1 of the same type fixed to a series of taping members, and supply electrons to the individual conveyance bodies 521. When the component 1 is supplied, the taping member is cut so that the component 1 can be supplied as an individual electronic component 1. For example, as shown in FIG. 19, the electronic component supply apparatus 510 includes 12 tape-shaped component supply units 511, and the tape-shaped component supply unit 511-1 disposed at the left end in the drawing is the first electronic component. 1A can be supplied, and the tape-shaped component supply unit 511-2 arranged sequentially in the right direction can supply the second electronic component 1B, and the tape-shaped component supply unit 511-3 The electronic component 1C can be supplied, the tape-shaped component supply unit 511-4 can supply the fourth electronic component 1D, and the tape-shaped component supply unit 511-12 is the twelfth electronic component. 1L can be supplied.

  In such a situation, as shown in FIG. 20, in the electronic component insertion device 500, the electronic component 1 inserted into the substrate 5 is supplied to each of the tape-shaped components based on preset information such as NC data. Each of the electronic components 1 is supplied to the transport body 521 by being selected from the unit 511. Specifically, the first electronic component 1A to the fourth electronic component 1D inserted into the first substrate 5-1 are supplied to the four transport bodies 521 that are sequentially arranged according to the insertion order. . The supply of the electronic component 1 is performed in the circulation type component conveyance unit 520 while each conveyance body 521 is pitch-fed in the counterclockwise direction in the drawing.

  When the supply of the respective electronic components 1 inserted into the first substrate 5-1 to the carrier 521 is completed, as shown in FIG. 21, the first electronic components inserted into the second substrate 5-2 From 4A to 4th electronic components 1D, in accordance with the order of insertion, four transporting bodies 521 arranged successively following the transporting body 521 holding the electronic components 1 inserted into the first substrate 5-1. Supplied. At this time, without leaving a gap with respect to the last carrier 521 that holds the electronic component 1 inserted into the first substrate 5-1, from the next carrier 521 of the last carrier 521, The electronic component 1 to be inserted into the second substrate 5-2 is supplied.

  Subsequently, similarly, as shown in FIG. 22, the supply of each electronic component 1 inserted into the third substrate 5-3 to the carrier 521 is inserted into the second substrate 5-2. This is performed without a gap after the last carrier 521 that holds 1.

  After that, as shown in FIG. 23, in the circulation-type component transport unit 520, each row of transport bodies 521 is moved in the counterclockwise direction in the figure to hold the electronic component 1 inserted into the first substrate 5-1. The leading transport body 521 to be carried out, that is, the transport body 521 that holds the first electronic component 1A is positioned at the component transfer position P.

  Further, as shown in FIG. 24, the first electronic component 1A positioned at the component transfer position P is held by the transfer chuck 530, and each carrier 521 is moved by one pitch. The conveyance body 521 that holds the second electronic component 1B is positioned at the component transfer position P. Then, as shown in FIG. 25, the first electronic component 1A held by the transfer chuck 530 is delivered to and held by the component insertion head device 540, and the first electronic component 1A is positioned at the component transfer position P. The second electronic component 1B is held by the transfer chuck 530, the respective transfer bodies 521 are moved by one pitch, and the transfer body 521 holding the third electronic component 1C is positioned at the component transfer position P. . The first electronic component 1A held by the component insertion head device 540 is inserted and fixed at a predetermined position on the first substrate 5-1.

  Thereafter, the feeding operation of each electronic component 1 is similarly repeated, and the second electronic component 1B is inserted into the first substrate 5-1 by the component insertion head device 540 (see FIG. 26), and the third electronic The component 1C is inserted (see FIG. 27), and the fourth electronic component 1D is inserted (see FIG. 28).

  When the insertion operation of all the electronic components 1 from the first electronic component 1A to the fourth electronic component 1D is completed, the holding of the first substrate 5-1 by the substrate moving device 550 is released, and then The second substrate 5-2 is held, and the insertion operation of the first electronic component 1A that is first inserted into the second substrate 5-2 is started.

JP 2001-36294 A

  In the electronic component insertion apparatus 500 configured as described above, in the circulation-type component conveyance unit 520, the conveyance next to the conveyance body 521 that holds the fourth electronic component 1D that is finally inserted into the first substrate 5-1. Since the first electronic component 1A that is first inserted into the second substrate 5-2 is continuously held in the body 521 without a gap, as shown in FIG. When the fourth electronic component 1D is inserted into the first substrate 5-1 by the device 540, the second holding member 521 held at the component transfer position P is used. The first electronic component 1 </ b> A that is first inserted into the second substrate 5-2 is transferred to and held in the transfer chuck 530.

  Therefore, for example, when an insertion error occurs in any one of the electronic components 1 inserted into the first substrate 5-1, it is already held by the transfer chuck 530. The first electronic component 1A to be inserted into the second substrate 5-2 is discarded, and the electronic component 1 is not held by the transfer chuck 530, and the circulating component conveying unit 520 is disposed. , And the vacant carrier 521 supplies the electronic component 1 of the same type as the electronic component 1 in which the insertion error has occurred, that is, the alternative electronic component, is supplied from the electronic component supply device 510 and is held. Thereafter, the transfer body 521 holding the substitute electronic component is positioned at the component transfer position P, the substitute electronic component is held by the transfer chuck 530, and the substitute electronic component is further transferred to the component insertion head device 540. By delivering, the recovery operation of the insertion error that the replacement electronic component is inserted into the first substrate 5-1 is performed.

  However, before the insertion operation of the fourth electronic component 1D that is finally inserted into the first substrate 5-1 is completed, the transfer chuck 530 is inserted into the second substrate 5-2 first. Since one electronic component 1A is held, in order to perform the recovery operation, it is necessary to discard the electronic component 1 already held in the transfer chuck 530, and waste a good electronic component 1 There is a problem that.

  Further, for the recovery operation of the electronic component 1 with respect to the first substrate 5-1, the electronic component 1 with respect to the second substrate 5-2 is discarded, so that the electronic component 1 with respect to the second substrate 5-2 is disposed. In order to perform the insertion operation, there is a problem in that it is necessary to pick up the electronic component 1 of the same type as the discarded electronic component 1 to the electronic component supply device 510 again.

  Accordingly, an object of the present invention is to solve the above-described problem. The lead wire of the electronic component with a lead wire is inserted into the insertion hole formed at the component insertion position of the substrate, and the substrate To provide an electronic component insertion method capable of smoothly performing the recovery operation of the electronic component insertion operation mistake and realizing an efficient electronic component insertion operation in inserting the electronic component. It is in.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, each of the electronic components with lead wires from the component supply unit is continuously arranged in the circulation type component transport unit in a predetermined insertion order to hold the individual electronic components. The electronic parts that are sequentially supplied to the conveyance body and are held by the conveyance body positioned at the component transfer position in the circulation type component conveyance unit are held by the transfer chuck, and further the component insertion head from the transfer chuck When the electronic component is inserted into the substrate by inserting the lead wire into the insertion hole formed at the insertion position in the substrate in the component insertion head device, the component replacement is performed. the following of the electronic component following the transfer body that is located in a position to hold, that is held by said transfer chuck after completion of the transfer of the electronic component, the above respective The child parts in the electronic component insertion method for sequentially inserted into the substrate,
A plurality of first board electronic components to be inserted into the first substrate are continuously held by the respective transport bodies of the circulation type component transport unit, and then a plurality of second parts to be inserted into the second substrate are inserted. When the electronic components for two substrates are continuously held, between the carrier for holding the last electronic component for the first substrate and the carrier for holding the first electronic component for the second substrate. , Arrange the carrier that does not hold the electronic component (that is, arrange the carrier in an empty state),
The last electronic circuit component for the first board is held by the transfer chuck from the carrier positioned at the component transfer position and delivered to the component insertion head device. An electronic component insertion method is provided, wherein when the first substrate electronic component is held and the insertion operation to the substrate is performed, the transfer chuck is not held. .

According to the second aspect of the present invention, when an abnormality occurs in the insertion operation of the electronic component for the first board by the component insertion head device,
The insertion operation of the other electronic component for the first board is completed, and the same substitute electronic component as the first board electronic component in which the abnormality has occurred is transferred from the component supply unit to the transfer body of the circulating component transfer unit. To supply
Position the carrier at the component transfer position, and pass the substitute electronic component to the component insertion head device via the transfer chuck in a state where the electronic component is not held.
The electronic component insertion method according to the first aspect, in which the substitute electronic component is inserted into the first substrate by the component insertion head device.

According to the third aspect of the present invention, when the insertion operation of each of the first board electronic components by the component insertion head device is performed normally, the object of the insertion operation by the component insertion head device is determined. Changing from the first substrate to the second substrate,
During the changing operation, the first electronic component for the second board is positioned at the component transfer position, and the electronic component for the second board is transferred to the component insertion head device via the transfer chuck. The electronic component insertion method according to the first aspect or the second aspect for preparing for the insertion operation is provided.

  According to the present invention, in the electronic component insertion method using the circulating component transport unit, a plurality of first board electronic components fixed to the first substrate on the respective transport bodies of the circulating component transport unit. When the plurality of second substrate electronic components fixed to the second substrate are continuously held, the carrier for holding the last first substrate electronic component and The carrier that does not hold the first electronic component for the second substrate and the carrier that does not hold the electronic component between them (that is, the carrier in the empty state). When the electronic component for the first substrate is held by the component insertion head device and the insertion operation to the substrate is performed, the transfer chuck is not held by the electronic component. (Ie empty) It is possible.

  In this way, when the final electronic component for the first substrate is inserted, the transfer chuck is in an empty state without holding the next electronic component for the second substrate. Accordingly, when an abnormality (insertion error) occurs in the insertion operation of any of the first board electronic components, the replacement electronic component of the electronic component in which the insertion error has occurred is conveyed by the carrier, and Then, the replacement electronic component can be transferred to the substrate by the component insertion head device.

  Therefore, unlike the conventional case, when performing the insertion error recovery operation, it is possible to eliminate the need to discard the electronic component held in the transfer chuck, and to perform an efficient electronic component insertion operation without waste. be able to.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a schematic diagram partially showing a main configuration of an electronic component insertion apparatus 100 that performs an electronic component insertion method according to an embodiment of the present invention.

  As shown in FIG. 1, an electronic component insertion apparatus 100 holds an electronic component 1 with a lead wire, and inserts the lead wire into an insertion hole 5a formed at an insertion position of the substrate 5 to place the electronic component 1 on the substrate. A component insertion head device 40 that performs component insertion operation to be fixed to 5, an electronic component supply device 10 that accommodates a plurality of electronic components 1 in a supplyable manner, and each electronic component 1 that is supplied from the electronic component supply device 10. A circulating component transport unit 20 including a plurality of transport bodies 21 that are individually held and arranged continuously, and an electronic component that is held by the transport body 21 that is positioned at a component transfer position P in the circulating component transport unit 20 1 and the transfer chuck 30 for transferring the held electronic component 1 to the component insertion head device 40, the substrate 5 can be held, and the insertion position and components of the held substrate 5 are held. And a slide table 50 which is an example of a substrate moving device for moving the substrate 5 on the surface thereof for alignment with an inlet head 40.

  Here, the electronic component 1 is an electronic component in which a plurality of lead wires 3 for board connection are formed in the element portion 2. For example, a resistor having a lead wire, a capacitor, a tantalum capacitor, a light emitting diode, a diode, etc. It is an electronic component. The substrate 5 includes a circuit substrate such as a resin substrate, a paper-phenol substrate, a ceramic substrate, a glass / epoxy (glass epoxy) substrate, or a film substrate.

  In addition, the electronic component supply apparatus 10 includes a plurality of tape-shaped component supply units 11 that house a plurality of electronic components 1 of the same type in a state of being fixed to a taping member in series. 11 are arranged adjacent to each other in a row. When the electronic component 1 is supplied from the tape-shaped component supply unit 11 to the individual conveyance bodies 21, it is possible to supply the electronic component 1 as an individual electronic component 1 by cutting the taping member. Yes. In addition, the arrangement | positioning space | interval of each tape-shaped component supply part 11 is made the same as the arrangement | positioning space | interval of each conveyance body 21 with which the circulation type component conveyance part 20 is equipped, and one conveyance body 21 is one tape. When positioned in front of the sheet-shaped component supply unit 11, the transport body 21 can be positioned in front of each other tape-shaped component supply unit 11.

  As shown in FIG. 1, the circulation-type component transport unit 20 is stretched by a plurality of pulleys and the like provided on the upper surface of a machine base (not shown) of the electronic component insertion device 100, and is, for example, an annular formed of rubber or synthetic resin The conveyor belt 22 is provided, and a plurality of conveying bodies 21 are fixed to the conveyor belt 22 at the above-described arrangement intervals. Each carrier 21 can hold the electronic component 1 by releasably holding the lead wire 3 of the electronic component 1. Further, the circulating component conveying unit 20 is provided with an intermittent drive motor (not shown) that intermittently drives the conveyor belt 22 by rotating the pulleys and the like intermittently, that is, pitch feed. By driving the intermittent drive motor, the electronic components 1 held by the respective transport bodies 21 can be transported while being pitch-fed.

  As shown in FIG. 1, the transfer chuck 30 is an electronic device held by a transfer body 21 positioned at a component transfer position P, which is one position in the travel path of the conveyor belt 22 of the circulating component transfer unit 20. The component 1 is held by gripping the lead wire 3 and is moved to the component delivery position Q, which is a substantially central position of the component insertion head device 40, and the electronic component 1 is held by the component insertion head device 40. The transfer operation of the electronic component 1 to be performed can be performed. Specifically, the transfer chuck 30 grips the lead wire 3 of the electronic component 1 at one tip, and the one tip is at the component transfer position P with the other end as the center of rotation. It is possible to reciprocate between the parts delivery position Q.

  The component insertion head device 40 is disposed on the machine table adjacent to the transfer chuck 30. Further, a slide table 50 is provided on the machine base for releasably fixing the substrate 5 supplied to the electronic component inserting device 100 and moving the substrate 5 along the surface of the substrate 5. The component insertion head device 40 is installed above the substrate 5 fixed to the slide table 50, and performs an insertion operation of each electronic component 1 to each insertion position on the substrate 5. The component insertion head device 40 also includes a component insertion guide portion 80 that guides the lead wire 3 of the electronic component 1 to the insertion hole 5a when the electronic component 1 is inserted into the insertion hole 5a formed in the substrate 5. Is installed on the machine base below the slide table 50.

  The component insertion head device 40 includes an insertion chuck 62 that is an example of a pair of gripping members that grip the element portion 2 of the electronic component 1 at the component delivery position Q, and a pusher that pushes the element portion 2 of the electronic component 1 downward. A pusher 64 as an example of a member and a guide chuck 66 that guides and holds the tip of the lead wire 3 and the guide pin 81 in the component insertion guide portion 80 when the electronic component 1 is inserted into the substrate 5. I have.

  Since the component insertion head device 40 has such a configuration, the element portion 2 is attached to the electronic component 1 moved from the component transfer position P to the component delivery position Q by the transfer chuck 30. Then, the electronic component is lowered in a direction substantially perpendicular to the surface of the substrate 5, and the tip of the lead wire 3 of the electronic component 1 and the tip of the guide pin 81 of the component insertion guide portion 80 are lowered. Positioning is performed via the guide chuck 66, and further, the pusher 64, the electronic component 1, and the guide pin 81 are lowered in an integrated state while the pusher 64 is brought into contact with the upper end of the element portion 2. The lead wire 3 of the component 1 can be inserted into the insertion hole 5 a of the substrate 5. The electronic component 1 is fixed on the substrate 5 by cutting the lead wire 3 inserted in this way with an appropriate length and performing a clinching process so as to bend the tip portion of the lead wire 3. It will be.

  In addition, the electronic component insertion device 100 includes a control device (not shown). The control device supplies the electronic component 1 by the electronic component supply device 10 and the recirculating component transport unit 20 respectively. Pitch feeding operation of the conveyance body 21, movement operation of the electronic component 1 from the component transfer position P to the component delivery position Q by the transfer chuck 30, insertion operation of the electronic component 1 by the component insertion head device 40, and the slide table 50 It is possible to perform overall control while associating the respective operations of the alignment operations of the substrate 5 and the component insertion head device 40 with each other.

  In particular, the control device can perform a specific control operation based on NC data that is set and input in advance. Data such as in what order the electronic components 1 of such kind are inserted is included, and specific electronic components can be obtained by performing the above-described operation control based on such NC data. 1 insertion operation can be performed.

  Here, an example of NC data related to the insertion order of the electronic component 1 is shown in the table format of FIG. In the table of FIG. 2, the numbers of a series of conveyance bodies 21 provided in the circulating component conveyance unit 20 are indicated by serial numbers from 1 to 16, for example, and are held as NC step numbers corresponding to the individual conveyance bodies 21. The type of the electronic component 1 to be displayed is displayed. Specifically, the first carrier 21 holds the first electronic component 1A (indicated by the NC step number “1A”), and the second carrier 21 holds the second electronic component 1B (NC). Step number “1B”) is held, and the third carrier 21 holds the third electronic component 1C (indicated by NC step number “1C”), and the fourth carrier 21 The fourth electronic component 1D (indicated by the NC step number “1D”) is held, and no electronic component 1 is held by the fifth carrier 21 (indicated by the NC step number “empty”). Is set.

  In addition, information “final” is set as a final component flag in the transport bodies 21 of No. 4, No. 9, and No. 14, and this is a plurality of electronic components 1 inserted into the same substrate 5. It shows that the electronic component 1 is inserted at the end. That is, each of the electronic components 1 inserted into the first substrate 5-1 is held in order by the transport bodies 21 from No. 1 to No. 4, and the transport bodies 21 from No. 6 to No. 9 have The electronic components 1 inserted into the second substrate 5-2 different from the first substrate 5-1 are held in order, and the transport bodies 21 from No. 11 to No. 14 NC data is set so that the respective electronic components 1 inserted into the third substrate 5-3 are held in order.

  The procedure for inserting each electronic component 1 into the substrate 5 in the electronic component insertion apparatus 100 having such a configuration will be specifically described with reference to schematic diagrams of the electronic component insertion apparatus 100 shown in FIGS. These schematic views are diagrams for the purpose of easily grasping which electronic component is located at which position of each component in the electronic component insertion device 100. The subsequent control of the insertion operation of the electronic component 1 is performed based on NC data set (input) in the control device. Moreover, the schematic diagram of the board | substrate 5 supplied to such an electronic component insertion apparatus 100 is shown in FIG. The configuration of the substrate 5 shown in FIG. 3 is common to a first substrate 5-1, a second substrate 5-2, and the like which will be described later.

  As shown in FIG. 3, four electronic components 1 are to be inserted into the substrate 5, and an insertion position R1 into which the first electronic component 1A is inserted is arranged in the lower left area of the figure. The insertion position R2 into which the second electronic component 1B is inserted is arranged in the upper left area in the figure, and the insertion position R3 into which the third electronic component 1C is inserted in the upper right area in the figure. Is disposed, and an insertion position R4 into which the fourth electronic component 1D is inserted is disposed in the lower right region of the drawing.

  First, in the electronic component insertion apparatus 100 shown in FIG. 4, the supplied first substrate 5-1 is held on the slide table 50. At the same time, the conveyor belt 22 is intermittently driven in the counterclockwise direction in the figure in the circulation type component conveyance unit 20, and the predetermined conveyance body 21 is positioned in front of the predetermined tape-shaped component supply unit 11 in the electronic component supply apparatus 10. . Specifically, based on the NC data shown in FIG. 2, the first transport body 21 is positioned in front of the tape-shaped component supply unit 11 that accommodates the first electronic component 1A. In the electronic component supply apparatus 10 of FIG. 4, the tape-shaped component supply unit 11-1 positioned at the left end in the drawing can supply the first electronic component 1A, and the tape-shaped component arranged on the right side thereof. The supply unit 11-2 can supply the second electronic component 1B, and the tape-shaped component supply unit 11-3 disposed on the right side of the supply unit 11-2 can supply the third electronic component 1C. Can supply the fourth electronic component 1D, and the tape-shaped component supply unit 11-12 located at the right end in the drawing is the twelfth electronic component. 1L can be supplied.

  As shown in FIG. 4, when the first transport body 21 is positioned in front of the tape-shaped component supply unit 11-1, the second transport body 21 is connected to the tape-shaped component supply unit 11-2. Positioned in front, the third transport body 21 is positioned in front of the tape-shaped component supply unit 11-3, and the fourth transport body 21 is positioned in front of the tape-shaped component supply unit 11-4. It becomes. Therefore, according to the NC data, the first electronic component 1A to the fourth electronic component 1D are held on the first to fourth transport bodies 21. Each electronic component 1 held in this way becomes a first substrate electronic component.

  Thereafter, the respective conveying bodies 21 of the circulation type component conveying section 20 are intermittently driven and run in the counterclockwise direction in the drawing, and the next conveying body 21 is positioned in front of the predetermined tape-shaped component supplying section 11. It becomes. At this time, according to the NC data in FIG. 2, since the electronic component 1 is set not to be held on the No. 5 carrier 21, the No. 6 carrier 21 is tape-shaped as shown in FIG. The transport body 21 from No. 7 to No. 9 is positioned in front of the component supply unit 11-1, and is positioned in front of the tape-shaped component supply unit 11-2k and 11-4. The fourth electronic component 1D is held. Each electronic component 1 held in this way becomes a second substrate electronic component. The transport body 21 positioned between the transport body 21 that holds the last electronic component 1D of the first board electronic component and the transport body 21 that holds the first electronic component 1A of the second board electronic component. The electronic component 1 is not held and is left empty.

  Thereafter, as shown in FIG. 6, in the circulation type component conveyance unit 20, each conveyance body 21 is intermittently driven in the counterclockwise direction, and the first electronic component 1 among the electronic components for the first board is the first one. The transport body 1 holding one electronic component 1A is positioned at the component transfer position P. Further, as shown in FIG. 7, when intermittent feeding is performed by one pitch, the first electronic component 1A is held and taken out by the transfer chuck 30 from the component transfer position P, and the next second electronic component The conveyance body 21 that holds 1B is positioned at the component transfer position P. At the same time, the transport body 21 from No. 11 to No. 14 is positioned in front of the tape-like component supply units 11-1 to 11-4, and the supply of the first electronic component 1A to the fourth electronic component 1D is performed. Done. These electronic components 1 are the third substrate electronic components. In addition, based on NC data, the 10th conveyance body 21 is left empty without the electronic component 1 being supplied.

  As shown in FIG. 8, the first electronic component 1 </ b> A held by the transfer chuck 30 is moved to the component delivery position Q and delivered to the component insertion head device 40. In the component insertion head device 40, an operation of inserting the delivered first electronic component 1A into the first board is performed. Prior to the delivery operation of the first electronic component 1A to the component insertion head device 40, the insertion position R1 of the substrate 5 and the component mounting head device 40 are aligned by the slide table 50.

  While the insertion operation of the first electronic component 1A is being performed, the transfer chuck 30 returns to the component transfer position P, holds the second electronic component 1B, and each carrier 21 The transport body 21 that is intermittently fed by one pitch and holds the third electronic component 1C is positioned at the component transfer position P.

  Thereafter, as shown in FIG. 9, the second electronic component 1 </ b> B held by the transfer chuck 30 is delivered to the component insertion head device 40, and the second electronic component 1 </ b> B is transferred to the component insertion head device 40. Is inserted into the substrate 5. Further, while this insertion operation is being performed, the third electronic component 1C is held by the transfer chuck 30, and the transport body 21 holding the fourth electronic component 1D is positioned at the component transfer position P. Is done. In a similar procedure, the third electronic component 1C is inserted into the first substrate 5-1 (see FIG. 10), and the fourth electronic component 1D is inserted into the first substrate 5-1 (FIG. 11). reference).

  In FIG. 10, the carrier 21 that holds the last fourth electronic component 1D among the first board electronic components and the first first electronic component 1A among the second board electronic components are held. The electronic component 1 is not held in the conveyance body 21 arranged between the conveyance body 21 and is in an empty state. Therefore, as shown in FIG. 11, while the fourth electronic component 1 </ b> D is held by the component insertion head device 40 and the insertion operation is performed, the transfer chuck 30 is in an empty state without holding the electronic component 1. It can be made.

  As described above, while the insertion operation of the fourth electronic component 1D finally inserted into the first substrate 5-1 is performed by the component insertion head device 40, the transfer chuck 30 performs the second substrate 5-. Since the electronic component 1 inserted into 2 is in an empty state without being held, for example, a recovery operation for an insertion error as described below can be performed.

  Specifically, some abnormality occurs in the insertion operation of the first electronic component 1A to the fourth electronic component 1D to be inserted into the first substrate 5-1, and these abnormalities occur on the first substrate 5-1. When it is detected by the detection sensor of the lead wire 3 provided in the clinch mechanism of the component insertion guide portion 80 that any one of the electronic components 1 is not normally inserted, for example, In the state where the carrier 21 holding the first electronic component 1 to be inserted into the second board 5-2 is located at the component transfer position P, the insertion operation of the electronic component 1 performed temporarily is temporarily performed. Interrupted. An example of such a detection sensor is a strain detection sensor provided in a clinch cutter (that is, a lead wire cutting device) in the clinch mechanism. Such a strain detection sensor can detect that the electronic component 1 has been normally inserted by detecting the distortion of the clinch cutter that occurs when the lead wire is cut. If it is not detected, it can be determined that normal insertion has not been performed.

  For example, in the case where the electronic component 1 in which the normal insertion operation has not been performed normally (an insertion error has occurred) is the third electronic component 1C, the respective transports included in the circulation-type component transport unit 20 A tape-shaped component supply unit that accommodates the electronic component 1 of the same type as the third electronic component 1C in which the insertion error has occurred in the transport body 21 that is not holding the electronic component 1 in the body 21 Located before 11-3. Such movement of the transport body 21 is preferably performed efficiently with minimum movement, and as shown in FIG. 12, the transport body 21 already positioned in front of the tape-shaped component supply unit 11-3. Is in an empty state, it is preferable to use the carrier 21. As a result, a new third electronic component 1C is supplied as an alternative electronic component 1C from the tape-shaped component supply unit 11-3 to the carrier 21.

  Thereafter, each of the transport bodies 21 is moved in the circulating component transport section 20, and the transport body 21 that holds the alternative electronic component 1 </ b> C is positioned at the component transfer position P as shown in FIG. 13. Further, as shown in FIG. 14, the alternative electronic component 1 </ b> C positioned at the component transfer position P is held by the transfer chuck 30 and moved to the component transfer position Q, so that it is transferred to the component insertion head device 40. Then, the substitute electronic component 1C is inserted into the first substrate 5-1 by the component insertion head device 40. By such each operation, the recovery operation of the insertion error is completed.

  Further, after such a recovery operation is performed, the first substrate 5-1 held on the slide table 50 of the electronic component insertion apparatus 100 is discharged and the second substrate 5-2 is carried in. Are held on the slide table 50. At the same time, the first electronic component 1A that is the second board electronic component held by the carrier 21 positioned at the component transfer position P is held by the transfer chuck 30 to the component delivery position Q. It is moved and delivered to the component insertion head device 40. Thereafter, the insertion operation of each electronic component 1 with respect to the second substrate 5-2 is sequentially performed in the same manner as the insertion operation of each electronic component 1 with respect to the first substrate 5-1.

  In addition, when an insertion error occurs during the insertion operation of each electronic component 1 with respect to the second substrate 5-2, the first electronic component 1A to the fourth electronic component 1D are used. After completing the entire insertion operation of the electronic component 1 (only the insertion operation of the electronic component 1 in which the insertion error has occurred cannot be completed), using the transfer chuck 30 that is in an empty state, The insertion operation (recovery operation) of the alternative electronic component 1 for the electronic component 1 in which the insertion error has occurred can be performed in the same procedure as described above.

  In addition, in the insertion operation of each electronic component 1 with respect to one board 5, if the insertion operation is normally performed without causing an insertion error, the electronic component 1 inserted last is inserted. When the insertion operation is completed, the transfer chuck 30 is in an empty state, and the next electronic component 1 cannot be immediately delivered to the component insertion head device 40, but is held by the slide table 50. For example, it is necessary to replace the substrate 1 that has been replaced, for example, from the first substrate 5-1 to the second substrate 5-2, and by using the time for performing the replacement operation of the substrate 5, the component transfer is performed. The first electronic component 1 </ b> A held by the transport body 21 positioned at the replacement position P can be transferred to the component insertion head device 40 via the transfer chuck 30 to prepare for insertion. Therefore, even when the transfer chuck 30 is in an empty state in this way, the efficiency of the insertion operation of the electronic component 1 is not hindered.

  In the above-described method for inserting the electronic component 1, the carrier 21 that holds the electronic component 1 that is finally inserted into one substrate 5 and the substrate 5 that is next to the one substrate 5 are inserted first. Although the description has been given of the case where only one transport body 21 that is in an empty state is disposed between the transport body 21 that holds the electronic component 1, the present embodiment is not limited to such a case. Absent.

  Instead of such a case, for example, as shown in FIGS. 15 to 18, a transport body 21 that holds the electronic component 1 that is finally inserted into one substrate 5, and a substrate next to the one substrate 5. In this case, two empty transport bodies 21 may be disposed between the transport body 21 and the transport body 21 that holds the electronic component 1 that is inserted first.

  In such a case where the two transport bodies 21 are left empty, for example, depending on the size and shape of the electronic component 1, the two transport bodies 21 are used to hold the electronic component 1. Therefore, it is possible to obtain an advantage that it is possible to flexibly cope with the recovery operation of the insertion error of the electronic component 1 having such a special shape.

  Further, in the electronic component insertion method of the present embodiment, a case has been described in which the transport body 21 that is made empty is provided in units of one substrate 5 that is replaced by the slide table 50. Instead of this, the electronic component 1 inserted into one board 5 may be divided into a plurality of groups and provided with a transport body 21 that makes the above-mentioned empty state in units of groups. In such a case, there is an advantage that the recovery operation can be effectively performed especially when the number of electronic components 1 inserted into one substrate 5 is large.

  According to the embodiment, the last transport body 21 among the transport bodies 21 holding the plurality of electronic components 1 to be inserted into one substrate 5 and the plurality of electronic components 1 to be inserted into the next substrate 5. By placing a carrier 21 in an “empty state” that does not hold any electronic component 1 between the first carrier 21 of the carriers 21 that hold the At the time when the insertion operation of the electronic component 1 is completed, the transfer chuck 30 can be in an “empty state” in which no electronic component 1 is held.

  As described above, when the transfer chuck 30 is in an empty state at the above time point, for example, when an insertion error occurs in the insertion operation of the electronic component 1 inserted into the previous substrate 5, the insertion is performed. The replacement electronic component 1 of the electronic component 1 in which a mistake has occurred is transferred by the transfer body 21, the replacement electronic component 1 is delivered to the transfer chuck 30 that is in the empty state, and the component insertion head is further transferred from the transfer chuck 30. It is possible to perform an insertion error recovery operation in which the substitute electronic component 1 is inserted into the substrate 5 after being transferred to the device 40.

  In particular, during this recovery operation, the transfer chuck 30 is not in a state of already holding the electronic component 1 to be inserted next as in the conventional method, but in an empty state. Thus, the recovery operation can be smoothly performed without performing a wasteful operation of discarding the electronic component 1. Therefore, it is possible to perform an efficient electronic component insertion operation that can smoothly cope with an electronic component insertion error.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

It is a schematic diagram which shows the main structures of the electronic component insertion apparatus concerning one Embodiment of this invention. It is a figure of a table format which shows the content of NC data used for control operation of the electronic component insertion apparatus of FIG. It is a schematic diagram of the board | substrate handled with the electronic component insertion apparatus of FIG. It is a schematic explanatory drawing which shows the insertion operation of the electronic component in the said electronic component insertion apparatus, and is a figure of the state by which the electronic component for 1st substrates was supplied to the conveyance body. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state by which the electronic component for 2nd substrates was supplied to the conveyance body. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state in which the first electronic component among the electronic components for 1st boards was located in the component transfer position. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state by which the electronic component for 3rd boards was supplied to the conveyance body. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state in which the insertion operation | movement of the top electronic component is performed among the electronic components for 1st boards. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state in which the insertion operation | movement of the 2nd electronic component among the electronic components for 1st boards is performed. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state in which the insertion operation | movement of the 3rd electronic component among the electronic components for 1st substrates is performed. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state in which the insertion operation of the last electronic component among the electronic components for 1st boards is performed. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state by which the alternative electronic component is supplied to the conveyance body as a recovery operation with respect to an insertion mistake. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state by which the alternative electronic component was located in the component transfer position as a recovery operation with respect to an insertion mistake. It is a schematic explanatory drawing which shows the said insertion operation | movement, and is a figure of the state in which the insertion operation | movement of an alternative electronic component is performed as a recovery operation with respect to an insertion mistake. It is a schematic explanatory drawing which shows the insertion operation | movement concerning the modification of the said embodiment, and is a figure of the state in which the insertion operation | movement of the top electronic component among the electronic components for 1st boards is performed. It is a schematic explanatory drawing of the modification of the said insertion operation | movement, and is a figure of the state in which the insertion operation | movement of the 2nd electronic component among the electronic components for 1st boards is performed. It is a schematic explanatory drawing of the modification of the said insertion operation | movement, and is a figure of the state in which the insertion operation of the 3rd electronic component among the electronic components for 1st boards is performed. It is a schematic explanatory drawing of the modification of the said insertion operation | movement, and is a figure of the state by which the transfer chuck | zipper and the conveyance body of a component transfer position are made into the empty state. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement. It is a schematic diagram which shows the conventional electronic component insertion operation | movement.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Element part 3 Lead wire 5 Board | substrate 10 Electronic component supply apparatus 11 Tape-shaped component supply part 20 Circulating-type component conveyance part 21 Conveyance body 22 Conveyor belt 30 Transfer chuck 40 Component insertion head apparatus 50 Slide table 100 Electronic component insertion Device P Parts transfer position Q Parts delivery position

Claims (3)

The electronic components with lead wires are sequentially supplied from the component supply unit in a predetermined insertion order to the respective conveyance bodies that are continuously arranged in the circulation type component conveyance unit and hold the individual electronic components, and the circulation type The electronic component held by the transfer body positioned at the component transfer position in the component transfer unit is held by a transfer chuck, and the electronic component is further transferred from the transfer chuck to the component insertion head device. In the insertion head device, when the electronic component is inserted into the substrate by inserting the lead wire into an insertion hole formed at the insertion position in the substrate, the next transport body positioned at the component transfer position following the electronic components, that is held by the transfer chuck completing the transfer of the electronic components sequentially inserted each electronic component above the substrate but to retain In the electronic component insertion how to,
A plurality of first board electronic components to be inserted into the first substrate are continuously held by the respective transport bodies of the circulation type component transport unit, and then a plurality of second parts to be inserted into the second substrate are inserted. When the electronic components for two substrates are continuously held, between the carrier for holding the last electronic component for the first substrate and the carrier for holding the first electronic component for the second substrate. , Arrange the carrier that does not hold the electronic component,
The last electronic circuit component for the first board is held by the transfer chuck from the carrier positioned at the component transfer position and delivered to the component insertion head device. A method of inserting an electronic component, wherein when the electronic component for the first substrate is held and the insertion operation to the substrate is performed, the transfer chuck is not held. When an abnormality occurs in the insertion operation of the electronic component for the first board by the component insertion head device,
The insertion operation of the other electronic component for the first board is completed, and the same substitute electronic component as the first board electronic component in which the abnormality has occurred is transferred from the component supply unit to the transfer body of the circulating component transfer unit. To supply
Position the carrier at the component transfer position, and pass the substitute electronic component to the component insertion head device via the transfer chuck in a state where the electronic component is not held.
The electronic component insertion method according to claim 1, wherein the substitute electronic component is inserted into the first substrate by the component insertion head device. When the insertion operation of each of the electronic components for the first board by the component insertion head device is normally performed, the object of the insertion operation by the component insertion head device is changed from the first substrate to the second. Change the board to
During the changing operation, the first electronic component for the second board is positioned at the component transfer position, and the electronic component for the second board is transferred to the component insertion head device via the transfer chuck. The electronic component insertion method according to claim 1 or 2, wherein preparation for insertion operation is performed.

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