JP2001196444A - Method and apparatus for handling aligned components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for supplying aligned components to be handled by picking up all the components in a moving range of a small carrier. SOLUTION: Aligned components 2 carried to a carrier 6 are moved to a pick-up position C by moving the components 2 in perpendicular two aligning directions of the carrier. When the components 2 are lifted by a pushup pin 8 and picked up by a tool 3, unit regions D1 to D4 divided and set around a picking-up position are switched to a pick-up preparing position E by rotation of the carrier, and then the component in the region is moved in the component aligning direction of the carrier, and sequentially supplied to a pickup.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for handling an alignment component that supplies an alignment component, which is a plurality of aligned components, and more particularly, to a method and an apparatus for supplying an alignment component, and a transfer using the supply device. The present invention relates to a method and an apparatus for handling aligned components including a mounting device, a storage device, and the like, for example, a method and an apparatus for supplying aligned semiconductor elements for supplying a plurality of diced semiconductor elements arranged in rows and columns so that they can be picked up one by one. The present invention relates to a transfer device for transferring a picked-up semiconductor element to another device, and a storage device for storing the picked-up semiconductor element in various storage members so as to be in a predetermined packing form. As an example of the semiconductor element,
These are individual IC chips obtained by dicing a semiconductor wafer on which a plurality of integrated circuits are formed.

[0002]

2. Description of the Related Art Semiconductor wafers are manufactured in such a manner that a large number of semiconductor elements are arranged vertically and horizontally. Each semiconductor element is subjected to processing such as checking for defective products and marking thereof, and then separated by dicing to be handled individually. Is done. The semiconductor elements are regularly and densely arranged on the dicing sheet. Conventionally, these semiconductor elements are picked up one by one quickly and reliably so that they can be handled in various ways such as transfer and storage to other parts. Conventionally, as shown in FIG. The semiconductor device is collectively handled by the carrier 106 carried while being held at a predetermined position, and the semiconductor device is pushed up from below by the movement in the orthogonal XY2 direction in which the semiconductor elements are arranged at a predetermined position to assist the pickup. It is sequentially moved to a pickup position with a pin, with separation of each semiconductor element by expanding the dicing sheet, and pushing up from below with a pushing up pin,
The pick-up by the component handling tool 103 is provided.

Accordingly, one semiconductor element at the pickup position is lifted higher than the surrounding semiconductor elements in a state of being separated from the surrounding semiconductor elements when picking up, so that the one semiconductor element is obstructed by the surrounding semiconductor elements, The pick-up action by suction from the component handling tool 103 or the like is received independently and sufficiently without the semiconductor element being displaced in position, and picked up quickly and reliably.

[0004]

Incidentally, semiconductor wafers are increasing in size for further improving the efficiency of manufacturing and handling semiconductor devices. It is as large as 200mm in diameter. Around 300mm is planned in the future. However, in the manufacture of semiconductor devices,
In order to pick up and handle all of the semiconductor devices diced on the carrier 106 by the above method,
The required moving distance of the carrier 106 for positioning all of the semiconductor elements with respect to the position of the push-up pin set at the fixed position, and hence the pickup position, is the diameter of the semiconductor wafer in both the XY2 directions, that is, the carrier 106 The plane space required for this is twice the diameter of the semiconductor wafer in both the XY directions as shown in FIG. For this reason, the plane space of the apparatus for handling a semiconductor wafer having a large diameter and picking up a diced semiconductor element as described above becomes large.

[0005] Although the size of the apparatus becomes a cause of increased cost of the device itself is a matter of course, a clean room of device is used, necessary for photothermal monthly by area of 600 meters ² as an example The running cost is as high as 30 million yen, and the increase in the occupied area of the apparatus is a new major problem.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an alignment device capable of picking up and handling all of the alignment components within a smaller moving range of the support than the conventional case, with respect to the size of the region for holding the alignment components to be picked up such as diced semiconductor elements. An object of the present invention is to provide a method and an apparatus for supplying components, and a method and an apparatus for handling aligned components using the same.

[0007]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, each component carried on the carrier in a state of being aligned in two orthogonal directions is moved to the pickup position by the movement of the carrier in the two component alignment directions. In order to be moved sequentially and provided for pickup by the component handling tool, each of the unit areas divided and set around the center of the carrier in the component carrier area of the carrier is divided into a plurality of units around the center of the carrier. After the rotation, the unit is switched to the pickup preparation position, each unit area is positioned at the pickup preparation position, and each component in the located unit area is moved by moving the carrier in the two component alignment directions. The aligned parts are arranged in the two parts aligning direction by sequentially positioning the parts and sequentially supplying them to the pickup. To provide a handling method of aligning parts.

According to the second aspect of the present invention, the component is provided for pickup by the component handling tool with the component being pushed up by the push-up pin, and each unit area is located at the pickup preparation position and then to that position. The components in the unit area are sequentially positioned at the pickup position by relative movement of the carrier, the pickup position, and the push-up pin in the two component alignment directions, and sequentially provided to the pickup to align the two components. The method for handling an alignment component according to the first aspect, which supplies the alignment component aligned in a direction, is provided.

According to the third aspect of the present invention, the component is pushed up by the push-up pin and is used for pickup by the component handling tool. The pickup position and the push-up pin are sequentially associated with each of the unit areas divided and set around the center position, and after the pickup position and the push-up pin correspond to each unit area, the pickup position and the push-up pin are The components in the corresponding unit area are sequentially positioned at the pickup position by the relative movement of the pickup position and the push-up pin and the carrier in the two component alignment directions,
The method for handling an aligned component according to the first aspect, wherein the aligned components are sequentially supplied to the pickup to supply the aligned components aligned in the two component alignment directions.

According to a fourth aspect of the present invention, there is provided the method for handling an aligned component according to any one of the first to third aspects, wherein the unit area is divided into four at 90 degrees.

According to a fifth aspect of the present invention, a component receiving portion for receiving and holding a carrier carrying components arranged in two orthogonal directions, and a substantially center position of the carrier for receiving the component receiving portion Rotating around, the unit areas divided into a plurality of parts around the center of the carrier in the component carrier area of the carrier are switched to the pickup ready position around the center of the carrier. Part rotating device and the part receiving part
A two-way moving device for sequentially moving the components in the unit area located at the pickup preparation position on the carrier by moving the components in the two component alignment directions to the pickup position and subjecting the components to a pickup by a component handling tool. Of handling equipment.

According to a sixth aspect of the present invention, a fifth aspect further comprising a component transfer device for picking up the component by the component handling tool after the component is moved to the pickup position and transferring the component to another component. And a device for handling the aligned components according to (1).

According to a seventh aspect of the present invention, there is provided a component storage portion for allowing the above-mentioned components to be handled in a state of being received in a component storage member for next-stage handling, and the component is located at the pickup position. And a component transfer device for picking up the component by the component handling tool and transferring the component to the component storage member of the component storage portion. .

According to an eighth aspect of the present invention, a recognition device for recognizing an image by picking up the component at the pickup position, and a unit positioned at the pickup preparation position by rotation of the carrier by the receiving unit rotation device. The reference component switching device that switches a reference of the position recognition by the recognition device after the area is switched is provided, and the alignment component handling device according to any one of the fifth to seventh aspects is further provided.

According to a ninth aspect of the present invention, a tool rotating device for rotating the component handling tool about the center of the component picked up by the component handling tool, and the pickup preparation by rotating the carrier by the receiving portion rotating device. A control unit that controls the tool rotating device so that the orientation of the component picked up by the component handling tool is corrected by the rotation of the component handling tool by the tool rotating device after the unit area located at the position is switched. A handling device for an alignment component according to the seventh or eighth aspect, comprising:

According to the tenth aspect of the present invention, the component storage section can be provided with a plurality of component storage members, and the component storage tool can pick up the plurality of component storage members in accordance with the type recognized by the recognition device of the component picked up by the component handling tool. An apparatus for storing aligned components according to an eighth aspect, comprising: a control device that controls the operation of the component storage unit and the component handling tool so that the component storage members can be separately used and transferred and stored.

According to an eleventh aspect of the present invention, there is provided the apparatus for handling aligned components according to the tenth aspect, wherein the types of the components are quality ranks classified according to electrical characteristics and frequency characteristics of each component. .

According to a twelfth aspect of the present invention, one of the types of the components is a defective product, and the control device controls the component handling so that the component recognized as defective by the recognition device is discarded by a disposal unit. An apparatus for handling an aligned part according to an eleventh aspect, wherein the apparatus controls the operation of a tool.

According to a thirteenth aspect of the present invention, there is provided the device for handling aligned components according to any one of the seventh to twelfth aspects, wherein the component storage member is a tape member.

According to a fourteenth aspect of the present invention, there is provided an apparatus for handling aligned components according to any one of the fifth to thirteenth aspects, wherein the unit area is divided into four at 90 degrees.

According to a fifteenth aspect of the present invention, there is provided the apparatus for handling aligned parts according to any one of the fifth to thirteenth aspects, wherein the unit area is divided into two at 180 degrees.

According to a sixteenth aspect of the present invention, a carrier that carries a plurality of components arranged in two orthogonal directions is supplied to a component supply position, and the two components of the carrier at the component supply position are supplied. Each component is sequentially moved to a pickup position by a movement in the component alignment direction, the component moved to the pickup position is picked up by a component handling tool, and a component set so as to overlap above the carrier by the component handling tool. A method for handling an aligned component that transfers the aligned components aligned in the two component alignment directions by transferring the picked-up component to a transfer target position is provided.

According to a seventeenth aspect of the present invention, the component moved to the pick-up position is picked up by the component handling tool, and the component transfer target set so as to overlap above the carrier by the component handling tool. A method for handling an aligned part according to the first aspect, wherein the aligned part aligned in the two part alignment directions is transferred by transferring the picked-up part to a position.

According to an eighteenth aspect of the present invention, there is provided the method of handling an aligned part according to the first or seventeenth aspect, wherein the part picked up by the part handling tool is inverted and transferred.

According to a nineteenth aspect of the present invention, a component receiving portion that receives and holds a carrier that holds a plurality of components arranged in two orthogonal directions, and aligns the component receiving portion with the two component alignments. A two-way moving device for sequentially moving the component to the pickup position by moving the component in a direction, a component storage portion disposed at a position overlapping above the component receiving portion, and a component storage portion each time the component moves to the pickup position. And a component transfer device that picks up the component and transfers the component to the component storage unit.

According to a twentieth aspect of the present invention, the component storage sections are arranged in a plurality of rows at positions overlapping the component receiving section, and the component transfer device is configured to store the component at the pickup position. A handling apparatus for an aligned component according to a nineteenth aspect, wherein the component is picked up and transferred to each component storage portion each time the component moves.

According to a twenty-first aspect of the present invention, the component transfer apparatus further includes a component storage portion disposed above the component receiving portion, and the component transfer device moves the component to the pickup position. According to a sixth aspect of the present invention, there is provided an apparatus for handling aligned components, wherein the component is picked up and transferred to the component storage unit every time.

According to a twenty-second aspect of the present invention, the component storage portions are arranged in a plurality of rows at positions overlapping the component receiving portion, and the component transfer device is configured to store the component at the pickup position. 21. An apparatus for handling aligned components according to the twenty-first aspect, wherein the component is picked up and transferred to each component storage portion each time the component moves.

According to a twenty-third aspect of the present invention, the component is disposed between the transfer device and the component storage, receives the component from the transfer device, reverses the component, and reverses the component. The device for handling an aligned component according to any one of the nineteenth to twenty-second aspects, further comprising a front / back inverting device that selectively performs an operation of storing the component in the storage unit.

According to a twenty-fourth aspect of the present invention, there is further provided a second component transfer device that receives the component from the transfer device and sorts and transfers the component to the component storage units provided in a plurality of rows. A device for handling an alignment component according to the twentieth or twenty-second aspect, comprising:

According to a twenty-fifth aspect of the present invention, the component is received from the component transfer device, moved onto the component storage units arranged in a plurality of rows, and the front and back of the component are stored in each component storage unit. 20. The apparatus for handling an aligned component according to the twentieth or twenty-second aspect, further comprising a front / back inverting device that reverses and sorts and transfers.

According to the twenty-sixth aspect of the present invention, the concave portions of the component storage portions arranged in the plurality of rows are moved to the transfer target positions on the component receiving portion, and the component transfer device performs the transfer. 20. An apparatus for handling an aligned component according to the twentieth or twenty-second aspect, wherein the component is transferred to the concave portion of the component storage part moved to a target position.

According to the twenty-seventh aspect of the present invention, based on the data identifying the respective sections arranged on the carrier, each of the plurality of component storage sections arranged for each section of each part is supported. No. 20 to transfer the parts of the section
Or, an apparatus for handling an alignment component according to the twenty-second aspect is provided.

According to a twenty-eighth aspect of the present invention, the component is a plurality of semiconductor elements obtained by dividing a semiconductor wafer by dicing, and accommodates a carrier that supports the component in a state of being aligned in two orthogonal directions. And a taping and wrapping section for arranging and housing the semiconductor elements in the direction of extension of the tape member and taping and wrapping the components,
The semiconductor device is provided between the component transfer device and the taping packaging unit, receives the semiconductor element from the component transfer device, turns over the semiconductor element, and selectively stores the semiconductor device in the taping packaging unit. The component receiving section receives and holds the carrier pulled out from the component supply section, and the two-way moving device aligns the component receiving section with the two components. The component is sequentially moved to the pickup position by moving the semiconductor element to the pickup position, and the component transfer device picks up and transfers the semiconductor element to the taping packaging part every time the semiconductor element moves to the pickup position. An apparatus for handling an alignment component according to an aspect of the invention is provided.

According to a twenty-ninth aspect of the present invention, there is provided the device for handling an aligned component according to the twenty-eighth aspect, wherein the taping and wrapping portion is disposed at a position overlapping the component receiving portion.

According to a thirtieth aspect of the present invention, the semiconductor devices arranged on the semiconductor wafer are classified based on data identified by quality ranks classified by electrical characteristics and frequency characteristics of the semiconductor devices. According to a twenty-eighth or twenty-ninth aspect, there is provided an apparatus for handling aligned components, wherein semiconductor devices having quality ranks corresponding to a plurality of taping packaging parts arranged for each quality rank are transferred.

[0038]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(First Embodiment) Hereinafter, a method and an apparatus for handling aligned components according to a first embodiment of the present invention, specifically, a method and an apparatus for supplying aligned components, and a transfer using an apparatus for supplying aligned components will be described. The loading device and the storage device for the aligned components will be described in detail with reference to FIGS. As shown in FIG. 19, each operation of the device for handling aligned components according to the first embodiment is performed by the control device 4.
8 is controlled.

In the first embodiment, a semiconductor element 1 is divided into individual pieces by dicing a semiconductor wafer 1 as shown in FIGS. 1 and 3 on a dicing sheet 4 and aligned in two orthogonal directions. 2 is an example of a case in which the component 2 is handled as an example of an aligned component, and a component handling tool that holds and releases the component such as the suction nozzle 3 is picked up one by one and transferred to another. However, the present invention is not limited to this, and a component handling tool of another holding method such as a chuck may be employed depending on the type of component to be handled.

The dicing sheet 4 has a non-directional elasticity, is supported in an extended state by an annular support member 5, and after the semiconductor wafer 1 is subjected to dicing, the semiconductor elements 2 as diced alignment components are stably held. This is an example of a carrier 6 that can be handled and supplied. When handling a component (for example, a substrate) other than the semiconductor element 2, a material suitable for the type of the component may be adopted as the carrier 6.

In the method of supplying the aligned components according to the first embodiment, the semiconductor elements 2 supported on the carrier 6 in a state of being aligned in the two orthogonal directions as described above are mounted on the base 15 of the carrier 6. The pickup is moved sequentially to a predetermined pickup position C by the movement in the XY directions along the two component alignment directions at the upper predetermined position, for example, the component supply position, and the pickup by the suction nozzle 3 with the push-up pin 8 pushing up from below. In the component carrying region D of the carrier 6
, Each unit area D divided into a plurality of parts around a substantially center position of the carrier 6, for example, a pickup position C.
Are switched to the pickup preparation position, that is, the pickup preparation position E shown by hatching in FIG. 1 by rotation of the carrier 6 around the pickup position C, and the unit areas D1, D2,. At the pickup preparation position E, and then the unit area D1,
For example, each semiconductor element 2 in the region indicated by hatching in FIG.
By the movement in the direction, the suction nozzle 3 sequentially provides the pickup.

As described above, the moving range in which the semiconductor elements 2 of the carrier 6 are moved in the X and Y directions in which the semiconductor elements 2 are aligned and the semiconductor elements 2 are picked up by the suction nozzles 3 is from the reference position 61 of the carrier 6 in FIG. Maximum movement position 62 in the X direction,
This is a range indicated by a maximum movement position 63 in the Y direction and a maximum movement position 64 viewed in the XY synthesis direction. This is the carrier 6
The size range of one unit area divided and set around the pickup position C in the component carrying area D in the component carrying area D when viewed in the two component alignment directions.
This is smaller than the case where the whole is the movement range (see FIG. 18).

For example, in the setting of the unit areas D1 to D4 by 90-degree division into four as in the handling apparatus according to the first embodiment of the present invention shown in FIG. , D4, the maximum movement ranges in the two component alignment directions XY along the directions adjacent to each other are halved as compared with the conventional case. As shown in FIGS. 16 and 17, even when the unit area is set by two divisions at 180 degrees, the maximum movement range in one component alignment direction X or Y along the direction in which the two divided unit areas are arranged is reduced by half. I do. That is, FIG. 16 shows a case where the unit area is set by two divisions at 180 degrees in the X direction, and the maximum movement range in one component alignment direction X along the X direction in which the two unit areas related to the division are arranged. Is halved. FIG. 17 shows a case where the unit area is set by two divisions at 180 degrees in the Y direction, and the maximum movement range in one component alignment direction Y along the Y direction in which the two unit areas related to the division are arranged is halved. I do. In principle, any other number of divisions may be used. However, since the direction of movement of the carrier 6 and the direction of alignment of the semiconductor elements 2 do not coincide with each other, the position setting when each semiconductor element 2 is moved to the pickup position C is not necessary. It gets complicated. This is shown in FIG.
If the arrangement is made to match not only the XY2 direction but also the alignment direction of the semiconductor element 2, the required moving direction of the carrier 6 is increased, and the device becomes complicated.

On the other hand, the plurality of divided unit areas D1, D2,... On the carrier 6 are substantially fixed around the central position of the carrier 6 in the component carrying area D of the carrier 6 at a fixed position.
In the first embodiment, by rotation around the pickup position C,
A pickup preparation position E where each semiconductor element 2 is picked up by the suction nozzle 3 by the movement of the carrier 6.
, Each semiconductor element 2 can be used for pickup, so that each unit area D1, D2,.
It is not necessary to move the carrier 6 out of the movement range indicated by the positions 61 to 64 in order to provide all the semiconductor elements 2 in the above-mentioned movement for the pickup by the movement.

Accordingly, it is possible to achieve space saving corresponding to the division around the pickup position C with respect to the component carrying area D of the carrier 6, and the space required can be greatly reduced by a small division such as a 90 ° division, which is preferable. . In addition, the pickup position does not fluctuate.
According to the division at 0 degrees, the relationship between the alignment direction of the components and the moving direction of the carrier can be kept from changing, so that even if the position is switched by rotation, the positioning for supplying each semiconductor element 2 to the pickup can be easily performed. Yes, it doesn't take long.

As an apparatus for supplying an alignment component according to the first embodiment for realizing the above-described method, a carrier 6 carrying a semiconductor device 2 which has been diced and which is aligned in orthogonal XY directions is received and held. Figure 1 to state
A component receiving section 7 as shown in FIGS. 3 and 5 is provided on the machine base 15. The component receiving portion 7 is provided with a push-up pin 8 which pushes up one semiconductor element 2 at the pickup position C from below to facilitate pickup. At the same time, the supply device for the aligned components includes the component receiving unit 7.
Is rotated around the pickup position C, and each of the unit areas D1 to D4 divided and set around the pickup position C in the component carrying area D of the carrier 6 received in the component receiving portion 7 is divided around the pickup position C. The receiving unit rotating device 9 as shown in FIG. 2 which is switched to the pickup preparation position E, and the component receiving unit 7 are moved in the two component alignment directions XY to be positioned at the pickup preparation position E on the carrier 6. FIG. 2 in which the semiconductor elements 2 in the unit area are sequentially positioned one by one at a predetermined pickup position C and are picked up by the suction nozzle 3.
A two-way moving device 10 as shown in FIG. 4 is provided.

The component receiving section 7 is provided on the mounting table 1 for mounting the carrier 6 as shown in FIGS. 1 and 3 as shown in FIGS.
2 and a two-part pressing plate 11 provided so as to press the support metal 5 of the carrier 6 placed on the supporting member 5 from above. Actuator 13 such as a solenoid
Thus, the holding plate 11 is moved up and down.
In the component receiving section 7, the holding member 6 is received from the side and is placed on the mounting table 12 in a state where the holding plate 11 is raised. The portion exposed from 5 is supported from below by the mounting table 12, and the carrier 6 supporting the dicing sheet 4 is taken out to the side.

The holding plate 11 is mounted on the mounting table 12
Is received and the dicing sheet 4 is supported and then lowered, thereby pushing down the support metal 5 around the dicing sheet 4 supported by the mounting table 12 by a predetermined amount as shown in FIG. As a result, the dicing sheet 4 is expanded substantially evenly in the respective directions from the center on the mounting table 12, and the arrangement pitch of the semiconductor elements 2 carried thereon is extended to separate the semiconductor elements 2 from each other. In this state, each semiconductor element 2 is provided for pickup by the suction nozzle 3 as described above. When the pickup of the semiconductor element 2 is completed, the holding plate 11 is raised to release the dicing sheet 4 from the expanded state,
The carrier 6 is released. As a result, the picked-up carrier 6 of the semiconductor element 2 can be taken out, and the required number of semiconductor elements 2 can be continuously provided for pick-up by replacing the carrier with a new carrier 6.

The push-up pin 8 is supported by a frame 16 installed on a machine base 15 as shown in FIG. 2, and can be moved up and down at a pickup position C by an actuator 17 such as a solenoid. Thrust pin 8
Is moved up after one of the semiconductor elements 2 on the carrier 6, in other words, on the dicing sheet 4 is positioned at the pickup position C, so that the semiconductor element 2 positioned at the pickup position C and provided for the pickup is moved. It is lifted by a predetermined amount and positioned higher than the other semiconductor elements 2.

By separating the semiconductor elements 2 from each other by expanding the dicing sheet 4 and pushing up the semiconductor elements 2 at the pickup position C, each semiconductor element 2 positioned at the pickup position C is obstructed by the surrounding semiconductor elements 2 or Conversely, the semiconductor nozzles 2 can be easily and reliably sucked and picked up by the suction nozzles 3 one by one without displacing the surrounding semiconductor elements 2.

The two-way moving device 10 is constituted by an XY table, and may be installed on the machine base 15 so as not to interfere with the frame 16 of the push-up pins 8 as shown in FIGS. An X table 22 is moved in the X direction on the machine base 15 by a drive motor 21, and a Y table 24 is moved in the Y direction on the X table 22 by a Y direction drive motor 23. The component receiving portion 7 is supported so that it can be moved in the XY2 directions described above.

On the other hand, the receiving unit rotating device 9 is newly provided in the supply device of the aligned components, and is pushed up onto the two-way moving device 10 by moving the frame 16 such as the XY direction as shown in FIG. The component receiving portion 7 is supported via a bearing 27 so that the component receiving portion 7 can rotate about the pickup position C by a frame 26 that does not interfere with the pin 8 and its supporting mechanism, and the supported component receiving portion 7 is moved in two directions. The XY on the device 10
Push-up pins 8 such as frame 16 by moving
The motor 28 and the gear mechanism 29 are provided so as not to interfere with the supporting mechanism, and are appropriately rotated and driven. That is, the drive gear 29a is fixed to the rotation shaft of the motor 28. The rotary table 38 of the component receiving section 7 to which the mounting table 12 is fixed is rotatably supported by the bearing 27 with respect to the frame 26, and has a gear 29b on the outer peripheral portion inside the lower surface.
b meshes with the drive gear 29a. Therefore, the rotation of the motor 28 drives the drive gear 29 of the motor 28.
a rotates, and the gear 29b meshed with the drive gear 29a is rotated, whereby the turntable 38 of the component receiving portion 7 rotates with respect to the frame 26 via the bearing 27,
The mounting table 12 on the turntable 38 rotates.

The receiving section rotating device 9 rotates the component receiving section 7 about the pickup position C, thereby converting each of the unit areas D1 to D4 in the component carrying area D on the carrier 6 received in the component receiving section 7. The semiconductor device 2 can be sequentially switched to the above-described pickup preparation position E for use in the pickup, and the two-way moving device 10 can be used after the one of the unit areas D1 to D4 is switched to the pickup preparation position E. By moving the component receiving section 7 in the XY directions, all of the semiconductor elements 2 in one unit area switched to the pickup preparation position E are moved to the pickup position C as described above.
In order to be sequentially picked up by the suction nozzle 3.

As is clear from the above, the dicing on the carrier 6 received in the component receiving portion 7 is not particularly necessary for providing the receiving portion rotating device 9 for rotating the component receiving portion 7, while providing an extra plane space. All of the completed semiconductor elements 2 can be used for pickup under the same conditions as the conventional one without impairing the space saving of the above method including the expanding process. Advantageously, space saving of the device can be achieved.

The supply device for such an aligned component also includes:
As shown in FIG. 5, a semiconductor device 2 positioned at the pickup position C is picked up by the suction nozzle 3 and combined with a component transfer device 31 for transferring the semiconductor device 2 to another device to constitute a device for transferring aligned components. The specific work of transfer is being performed. As shown in FIG. 5, the component transfer device 31 is equipped with the suction nozzle 3 so as to be moved up and down by the actuator 30 such as an elevating cylinder on the transfer head 33. It is configured to be supported on a Y table 35 that reciprocates in the Y direction between the pickup position C and a component transfer target position F where the component storage section 32 and the like are set.

As a result, each of the diced semiconductor elements 2 aligned on the carrier 6 is supplied to the pickup position C in a space-saving manner as described above, and is supplied to the component transfer device 31. Is picked up by the downward movement, suction and upward movement of the suction nozzle 3, the picked-up semiconductor element 2 is carried to a predetermined position, and then moved down to the transfer target position F by the downward movement, suction release and upward movement of the suction nozzle 3. Transferred,
It can be used for subsequent handling.

The apparatus for transferring aligned parts according to the first embodiment includes a recognition device 36 including a recognition camera 36a for picking up an image of the semiconductor element 2 at the pickup position C as shown in FIGS. A reference position switching device 37 is provided for switching the position recognition reference by the recognition device 36 after the unit area located at the pickup preparation position E is switched by the rotation of the carrier 6 by the receiving unit rotation device 9.

Normally, the semiconductor elements 2 on the carrier 6 are arranged in the same direction with the same components, and are used for recognizing the directions and positions in various handlings such as processing, assembly, storage, and mounting after the pickup. Have a common position reference. This position reference is, for example, as shown in FIG.
Two points A and B at two diagonal positions of the semiconductor element 2 as shown in (A), (B), (C) and (D). This is used to specify the orientation and the position around the center G, regardless of whether the semiconductor element 2 is square or rectangular.

Now, for the sake of simplicity, the case of a rectangular semiconductor element 2 is shown, and each unit area D shown in FIG.
Looking at the semiconductor elements 2D1 to 2D4 that are almost at the same position at the pickup preparation position E in 1 to D4,
The orientation when they arrive at the pickup preparation position E and the positions of the position reference points A and B are shown in FIGS.
As shown in (C) and (D), they are different from each other. This difference is specified by the rotation angle of the carrier 6 and, depending on which of the unit areas D1 to D4 is at the pickup preparation position E, from the reference position of the position reference points A and B of the semiconductor element 2 at that position. Is known.

Utilizing this, the reference position switching device 37
Is a semiconductor element for each unit area located at the pickup preparation position E after receiving a position switching signal at which each unit area D1 to D4 is switched to the pickup preparation position E by rotation about the pickup position C. The direction of the position 2 and thus the directions of the position reference points A and B are shifted by a predetermined angle around the center of the component according to the rotation amount of the carrier 6 by changing the position recognition reference of the recognition device 36. In response to such an angle shift, it is possible to prevent the orientation and the position of the semiconductor element 2 from being unable to be recognized and the recognition accuracy from being lowered.

In the first embodiment, a tool rotating device 41 as shown in FIG. 5 for rotating the suction nozzle 3 around the center of the semiconductor element 2 picked up by the nozzle is provided. The tool rotating device 41 is constituted by a motor, and after the control device 48 receives a position switching signal for switching the unit area located at the pickup preparation position E by the rotation of the carrier 6 by the receiving portion rotating device 9, as shown in FIG. Based on the known data on the orientation and position stored in the memory 300 connected to the control device 48, the control device 48
Under the above control, the direction of the semiconductor element 2 picked up by the suction nozzle 3 is corrected by rotating the suction nozzle 3. Therefore, even if the direction of the semiconductor element 2 in each of the unit regions D1 to D4 located at the pickup preparation position E is shifted by a predetermined angle around the center of the component according to the rotation amount of the carrier 6 as described above. The semiconductor device 2 can be transferred to the transfer target position F in a fixed direction, and there is no inconvenience or problem when the semiconductor element 2 is handled in a fixed direction after the transfer.

The device for transferring aligned components as described above further includes a component storage unit 3 for storing the semiconductor element 2 picked up at the transfer target position F as described above as shown in FIG.
2 constitutes a storage device for aligned components. The component storage unit 32 can use various storage members including a pallet member, a tape member, and the like, which are conventionally known to store components and hold them in an aligned state. In the first embodiment shown in FIG.
As an example, the semiconductor element 2 as shown in FIG.
2a, then the top tape 4 as shown in FIG.
The tape member 42 is used as an example of a component storage member that is completed by storing with the lid 2b. For this reason, in the component storage section 32, a tape member supply section 43 for supplying the tape member 42 to the component storage position H guided by the drive control of the motor so as to receive the component so as to receive the semiconductor element 2 is provided. , A top tape supply unit 44, a top tape bonding unit 45, and a winding unit 46 that winds the storage completed portion of the semiconductor element 2 by drive control of a motor or the like.

As described above, the semiconductor element 2 picked up by the suction nozzle 3 and transferred by the component transfer device 31 is received in the concave portion 42a of the tape member 42 provided and supplied in the component storage portion 32. The tape member 42 can be stored and supplied in the form of a taping component suitable for handling in the next stage by utilizing the necessary features of the above-mentioned transfer.

For example, as for the tape member 42, the perforations 42c on one side shown in FIG. 2, the distance from the position of the perforations 42c to the center of the recess 42a and the position of the recess 42a in the feed direction are set with high precision. The semiconductor element 2 is received in the recess 42a with a clearance of about 0.2 mm on both sides between the semiconductor element 2 and the recess 42a.
When the tape member 42 is handled with high precision to provide the next processing, mounting, etc., the amount of displacement of each semiconductor element 2 with respect to the tape member 42 is suppressed small, and each semiconductor element 2 is aligned in a certain direction. In conjunction with this, it has been practiced to easily handle each semiconductor element 2 with high positional accuracy.

To cope with this, if the component transfer device 31 does not handle the semiconductor element 2 picked up by the suction nozzle 3 with high positional accuracy, the component transfer device 31 quickly and reliably enters the concave portion 42a set as described above. Cannot be transferred and stored. However, in addition to the function of switching the recognition reference of the reference position switching device 37 in the device for transferring aligned components and the function of correcting the angle of the semiconductor element 2 by the tool rotation device 41, the operation is normally performed in the component transfer device.
Based on the recognition result of the position and orientation of the semiconductor element 2 positioned at the pickup position C recognized by the recognition device 36,
The controller 48 corrects the suction position by the suction nozzle 3 or, alternatively, corrects the position at which the semiconductor element 2 picked up by the suction nozzle 3 is transferred to the transfer target position F.
The above requirements can be satisfied by the component transfer device 31 performing the control under the above control. As an example, the semiconductor element 2 has a size of about 1 to 20 mm square, and the concave portion 42 a
However, such a problem can be prevented by satisfying a positional accuracy of about ± 50 μm. If necessary, the semiconductor element 2 can be handled with higher positional accuracy.

In the apparatus for storing aligned components according to the first embodiment shown in FIG. 1, the component storage portion 32 can further arrange three tape members 42 side by side as shown in FIG. 9A of the third embodiment, for example. According to the type recognized by the recognition device 36 of the semiconductor element 2 picked up by the suction nozzle 3, the three tape members 42 are controlled so as to be selectively used, transferred and stored, as shown in FIGS. A control device 48 is provided as an example of the control means.

After the semiconductor elements 2 are formed on the semiconductor wafer 1 and diced, the quality of the semiconductor elements 2 is usually determined as described above, and the defective semiconductor elements 2 are displayed with markings or the like to indicate that. . In this determination, the quality rank of each semiconductor element 2 is determined, and rank display can be performed on each semiconductor element 2. Here, the quality rank means, for example, a characteristic in which even if a similar circuit is formed for each semiconductor element 2 of one wafer, the electrical characteristics and frequency characteristics are different for each semiconductor element 2. Refers to the rank divided for each.

Therefore, even in the case where different types of semiconductor elements 2 are formed on one semiconductor wafer 1, different types of parts having different quality ranks and the like are mixed in the semiconductor elements 2 on the carrier 6. At this time, it is determined by the control device 48 based on the result of the recognition device 36, and under the control of the control device 48, the component transfer device 31 and the component Storage section 3
2 is driven to house the semiconductor element 2. This allows
Utilizing the recognition function of the recognition device 36, it is possible to use each semiconductor element 2 transferred to the component storage section 32 for use or handling corresponding to the type such as its rank.

In the above description, the quality of the semiconductor element 2 and the quality rank are determined by the control device 48 based on the result of the recognition device 36. However, the control device 48 is determined based on the result of the recognition device 36.
May be used to perform a pass / fail inspection. In addition, the recognition device 36 may recognize a product whose quality rank has already been marked in the inspection process in the preceding process.

One of the types of the semiconductor elements 2 is defective, and the semiconductor element 2 determined to be defective by the control device 48 based on the recognition result of the recognition device 36 is replaced by the component transfer device by the control device 48. 31 is driven to be discarded by a predetermined discarding unit 49 shown in FIGS. As a result, the processing of defective products can be achieved without difficulty using the transfer cycle, and a special operation process is not required.

The carriers 6 carrying the diced semiconductor elements 2 are usually stored in a predetermined number of stages in a wafer storage cassette 50 as shown in FIGS. Handled. Correspondingly, the storage device for aligned components according to the first embodiment shown in FIG. 5 includes a supply unit that constitutes a lifting mechanism for the carrier 6 that holds and raises and lowers the wafer storage cassette 50 on one side surface of the machine base 15. 51 are provided,
The held carrier 6 is moved up and down by an amount corresponding to the storage pitch of the carrier 6 so that one carrier 6 is positioned at a position for taking in and out of the component receiving section 7, and a mechanism (not shown) such as a third embodiment. The carrier 6 at the loading / unloading position is pulled out by the wafer unloading unit 80) and sent to the component receiving section 7 to supply the semiconductor element 2, and the supply of the semiconductor element 2 is completed. After the wafer carrier 50 is stored in the original position and then the next carrier 6 is repeatedly positioned at the loading / unloading position, and all carriers 6 are supplied for supplying the semiconductor elements 2, the wafer storage cassette 50 is replaced with a new one. The semiconductor element 2 is replaced and supplied as necessary so that it is stored.

By the way, as an example, the semiconductor wafer 1 has a diameter of about 300 mm. If the semiconductor wafers 1 are stored in the wafer storage cassette 50 in about 10 steps and handled in a lump as usual, the total weight becomes about 20 kg, and the handling becomes difficult. It is expected to be. In this case, when the supplied wafer storage cassette 50 is taken in and out of the supply unit 51,
It is desirable that the flow line and operation when the worker moves around the device and works is simpler. For example, FIG.
When storage devices for aligned components as shown in (1) are arranged adjacently on the left and right as viewed from the front with the operation panel 52,
The transfer line for supplying the wafer storage cassette 50 to each device is in the direction and position indicated by an arrow J in front of the device. On the other hand, when the supply unit 51 is located on one of the left and right sides of the machine base 15 as shown in the figure, the worker lifts the wafer storage cassette 50 that has been transferred, and lifts the supply unit 51 from the transfer line J. It is inconvenient to replace the wafer storage cassette 50, which has finished supplying the semiconductor element 2 in the supply unit 51, only by depressing to the position shown in FIG. This is disadvantageous in terms of space saving. These problems do not change even when the neighboring devices are of different types.

Therefore, when the supply unit 51 is provided on the front of the machine base 15 as shown by a virtual line in FIG. 5, the operator can perform the above exchange on the transfer line J or between the transfer line J and the apparatus. The operation can be simplified, and a stepping space for an exchange operation with an adjacent device is not required, which is advantageous for space saving.

(Second Embodiment) A second embodiment of the present invention shown in FIG.
The method and apparatus for handling aligned components according to the embodiment, specifically, the method and apparatus for supplying aligned components, the transfer device using the supply device for aligned components, and the storage device for aligned components, use a method in which the push-up pin 8 is mounted on the frame 16. The push-up pin 8 is moved in the X and Y directions by supporting the push-up pin 8 in the X and Y directions. The push-up pin two-way moving device 71 is constituted by an XY table, and may be installed on the frame 16 so as not to interfere with the two-way moving device 10 and the frame 26 as shown in FIG. An X table 73 is moved on the frame 16 in the X direction by a motor, and a Y table 75 is moved on the X table 73 in the Y direction by the Y direction driving motor 74. An actuator 17 for a push-up pin such as a solenoid is supported so that it can be moved in the XY2 directions.

Thus, when the component receiving section 7 moves the carrier 6 in the XY directions and moves each semiconductor element 2 to the pickup position, the push-up pins 8 are moved in the direction opposite to the moving direction. By moving the semiconductor device 2 with the push-up pin 8 halfway by moving the semiconductor device 2 by the direction moving device 71, the position where they coincide with each other is set to the pickup position C, and the semiconductor device 2 is moved by the suction nozzle 3. The required moving range and moving time of the carrier 6 for providing the semiconductor elements 2 in the unit regions D1 to D4 which can be used for the pickup are shown in FIGS. 1 to 7 according to the first embodiment. Is also halved. In this case, the pickup position C fluctuates, but the fluctuating position is known, so that it is possible to easily cope with the fluctuation. Other configurations and functions to be performed are not particularly different from those of the first embodiment, and therefore, duplicated illustration and description are omitted.

Note that, in principle, the support pins 6 are not rotated, and the push-up pins 8 are moved to the center positions of the unit areas D1 to D4 serving as division reference points instead of the pickup positions C in the first embodiment. The unit areas D1 to D4 are sequentially moved to be set at the pickup position C, and each of the unit areas D1 to D4 is set for each of the pickup positions C set corresponding to the unit areas D1 to D4.
Even if the corresponding one of D4 is used for picking up the semiconductor element 2 with the movement of the carrier 6 in the X and Y directions, the same space saving as in the first embodiment can be achieved. In this case, the movement of the push-up pin 8 is not limited to the XY2 direction, and a method of turning around the division reference point of each of the unit areas D1 to D4 can be adopted. However, if control is performed using the movement in the X and Y directions so that the push-up pin 8 picks up the semiconductor element 2 that has been moved toward the pickup position C, the method of this modified example is different from that of the second embodiment. Similarly, further space saving and time reduction can be achieved.
In addition, the rotation of the carrier 6 and hence the rotation mechanism of the component receiving section 7 are not required.

According to the first and second embodiments of the present invention, as is apparent from the above description, the space saving corresponding to the division around the pickup position with respect to the component carrying area of the carrier and the miniaturization of the apparatus are achieved. Therefore, it is possible to reduce the cost and the cost of running a clean room and reduce the running cost of the clean room, which is suitable for dealing with a large-sized semiconductor wafer.

(Third Embodiment) Hereinafter, referring to the attached drawings, a method and an apparatus for handling an aligned part according to a third embodiment of the present invention, specifically, a method and an apparatus for supplying an aligned part, and an apparatus for aligning the part will be described. A transfer device using a supply device and a storage device for aligned components will be described to facilitate understanding of the present invention. It should be noted that the third embodiment described below is an example embodying the present invention, and does not limit the technical scope of the present invention. Since the third embodiment has many portions common to the first embodiment, the third embodiment will be described with reference to the drawings and description of the first embodiment as appropriate.

First, before describing the third embodiment of the present invention, its background will be described.

A large number of semiconductor elements, for example, IC chips, are formed vertically and horizontally on a semiconductor wafer as integrated circuits, and are formed by dicing into individual integrated circuits. This IC chip is an IC packaged by mounting, bonding, molding, etc.
In addition to being processed into parts, it is also provided for mounting on a circuit board in the state of a bare IC. In any case, it is necessary to transfer the IC chip from the diced state to another state in order to make the IC chip suitable for the purpose.

By the above dicing, the IC chip is held in a state of being aligned on the dicing sheet in two directions of X and Y orthogonal to the XY plane, and the dicing sheet is supported by the supporting member to stably hold the IC chip. It is composed of a carrier that can be handled. This carrier is
By moving the IC chips sequentially to the pickup position by moving them in the X-Y direction where the C chips are aligned, and pushing up the IC chips from below the dicing sheet at the pickup position, the dicing sheet having non-directional elasticity is expanded. Thus, the IC chip pushed up can be easily picked up by the component handling tool. The IC chip is transferred to a predetermined position by a component handling tool that picks up the IC chip.

The IC chips thus individually separated from the semiconductor wafer are bare chips that are not covered by a resin mold or the like. By mounting the bare chips on a circuit board, high-density mounting can be achieved. Can be. In order to be mounted on a circuit board, it is necessary to perform component packaging that can be supplied to an electronic component mounting apparatus. It has been the mainstream to supply a gel pack that is adhesively arranged on a gel surface to an electronic component mounting apparatus.

The carrier carrying a large number of IC chips arranged as described above is moved in the direction in which the IC chips are arranged.
When the C chips are moved one by one to the pickup position, and the IC chips picked up by the component handling tool are moved from the pickup position to the transfer destination, when the diameter of the semiconductor wafer increases, the distance from the pickup position to the transfer destination increases. Will increase. Semiconductor wafers tend to be large, and some have a diameter of 300 mm. When handling such a large semiconductor wafer, there is a problem that the moving distance of the component handling tool becomes large, and the transfer tact when transferring a large number of IC chips is reduced.

In order to mount the IC chip on the circuit board, taping packaging is effective as a packaging form for supplying the IC chip to the electronic component mounting apparatus. As described above, the conventional packaging form of the IC chip is a tray. They are packs and gel packs, and have been required to be supplied in taping packaging.

Further, when packaging the IC chip, a storage state in which the active surface of the IC chip is directed upward and a storage state in which the active surface is directed downward are required depending on the mounting form on the circuit board. It is necessary to selectively reverse the front and back of the IC chip at the time of transfer from the component handling tool in order to pack it in a suitable storage state.

An object of the third embodiment of the present invention is to suppress an increase in the planar space of the apparatus in handling a semiconductor wafer having a large diameter, suppress a reduction in transfer tact time, and align semiconductor elements and the like. A method and an apparatus for supplying an aligned component, which enables taping and packaging of components and enables selection of a front and back direction of a semiconductor element at the time of storage, a transfer device using the supply device, a method and an apparatus for handling an aligned component including a storage device and the like. Is to provide.

The third embodiment is similar to the first embodiment,
As shown in FIGS. 1 and 3, a large number of integrated circuits formed in the vertical and horizontal directions of the semiconductor wafer 1 are diced on a dicing sheet 4 so as to be divided into individual semiconductor elements 2 such as IC chips. This shows an example in which semiconductor elements 2 arranged in a direction are arranged as aligned components, and these are picked up one by one by a component handling tool and are taped and packaged.

The taping packaging of electronic parts is well known as a packaging form of electronic parts in which a tape containing chip parts such as resistors and capacitors is wound on a reel.
It is known as a form suitable for supplying an electronic component to an electronic component mounting apparatus that manufactures an electronic circuit board by surface mounting. The taping standard for taping packaging has been established and can be applied not only to the above-mentioned chip components but also to IC components, and is the mainstream of component packaging for mounting electronic components. However, the state in which the semiconductor element 2 is divided from the semiconductor wafer 1 by dicing is a bare state in which resin molding is not performed, that is, a bare chip state. Conventionally, the semiconductor chip 1 is housed in a parts tray or an electronic component mounting apparatus as a gel pack. Had been supplied. The transfer method and apparatus according to the third embodiment enable taping and packaging of this bare IC.

FIGS. 9 (A) and 9 (B) show the external appearance of an alignment component transfer apparatus 60 according to the third embodiment. An operation panel 16 for setting and monitoring the operation of the apparatus is provided on the front side.
1, a display 162 and the like are arranged, and a wafer storage cassette (an example of a component supply unit) 50 that houses a plurality of semiconductor wafers 1 is detachably arranged on the back side. If the wafer storage cassette 50 can be replaced by a transfer robot traveling on a transfer path provided on the back side of the apparatus, it becomes easy to handle the large-sized semiconductor wafer 1, and the semiconductor wafer 1 can be automatically replaced. Become. FIG.
1 shows an internal configuration of the aligning component transfer device 60, in which a plurality of semiconductor wafers 1 stored in the wafer storage cassette 50 are taken out one by one, and the semiconductor elements 2 are taken out one by one from the semiconductor wafers 1. The tape is transferred onto the tape member 42 for taping and packaging. In addition, as shown in FIG. 20, each operation of the device for handling aligned components according to the third embodiment is controlled by a control device 48.

The semiconductor wafers 1 stored in the wafer storage cassette 50 are diced on the dicing sheet 4 to be divided into individual semiconductor elements 2, and are aligned in two orthogonal directions. The above dicing sheet 4
Has a non-directional elasticity, is supported in an extended state by an annular support fitting 5, and forms a carrier 6 that can be stably handled and supplied. The carrier 6 in which a plurality of wafers are accommodated in the wafer accommodating cassette 50 is pulled out to a predetermined position, and as shown in FIGS. 1 and 2 of the first embodiment, is picked up by movement in the XY directions along the alignment direction of the semiconductor elements 2 The semiconductor element 2 is sequentially moved to the position C, and the semiconductor element 2 located at the pickup position C is pushed up by the push-up pins 8 arranged on the lower surface of the pickup position C.
Only the semiconductor element 2 projects from the other semiconductor element 2, and only the semiconductor element 2 is sucked by a suction nozzle (an example of a component transfer device).
3 can be picked up. The suction nozzle 3 sucking the semiconductor element 2 moves onto the tape member 42 and stores the semiconductor element 2 in the tape member 42.

As described above, the size of the semiconductor wafer 1 tends to increase. When the diameter of the semiconductor wafer 1 is large, the distance for moving each semiconductor element 2 to the pickup position C increases, which not only leads to an increase in the size of the apparatus. In addition, production efficiency is reduced due to an increase in the time required for moving. In order to cope with such a large semiconductor wafer 1, the moving distance of the suction nozzle 3 is reduced by arranging the tape member 42, which is the transfer destination of the semiconductor element 2, at a position overlapping the carrier 6. The moving distance of the carrier 6 in the X and Y directions is reduced by allowing the carrier 6 to rotate.
When the diameter of the semiconductor wafer 1 to be handled is small, the rotation of the carrier 6 may not be necessary. However, it is preferable that the tape member 42 is disposed above the carrier 6 closer to the pickup position C.

As shown in FIG. 11, the tape member 42 is connected to the supply reel 173 of the taping unit 70, which also functions as an example of a taping and wrapping section, from the take-up reel 17.
4 is supplied intermittently by drive control of a motor (not shown). As shown in FIG. 7 of the first embodiment, a concave portion 42 a for accommodating the semiconductor element 2 and a perforation 42 c are formed on the tape member 42.
Are formed, and the distance from the position of the perforation 42c to the center position of the concave portion 42a is set with high accuracy. The perforations 42c mesh with sprockets (not shown) of the taping unit 70 to intermittently feed the tape members 42 at a predetermined pitch with high precision. Also,
The concave portion 42a is formed so as to have a small gap in accordance with the size and shape of the semiconductor element 2 to be housed, and the positional deviation amount of the housing position is reduced to secure the positional accuracy at the time of taking out. The tape member 42 is sent from the supply reel 173 and the semiconductor element 2 sucked by the suction nozzle 3
Is transferred via the front and back device 171 to be described later or directly into the concave portion 42a, and the concave portion 42a on which the semiconductor element 2 is transferred is covered with the top tape 42b supplied from the top tape reel 172, and the tape member 42 The semiconductor element 2 is stored and held therein. The tape member 42 accommodating the semiconductor element 2 and covered with the top tape 75 is wound on a take-up reel 174, and when the necessary amount of the semiconductor element 2 has been accommodated, the taping unit 70 is replaced.

In the third embodiment, the taping units 70 are arranged in three rows as shown in FIGS. 9A, 9B and 10. The provision of a plurality of taping units 70 in this manner can be applied to the case where a plurality of taping packages are simultaneously performed. However, the main purpose is as follows.
The semiconductor elements 2 are sorted according to their quality ranks and transferred to the taping unit 70 for each quality rank. Here, the semiconductor elements 2 are sorted into three quality ranks. Here, the quality rank means, for example, a characteristic in which even if a similar circuit is formed for each semiconductor element 2 of one wafer, the electrical characteristics and frequency characteristics are different for each semiconductor element 2. Refers to the rank divided for each.

The quality rank and defect of each semiconductor element 2 of the semiconductor wafer 1 are determined by inspection, and the quality rank and defect of each semiconductor element 2 for each position address on the semiconductor wafer 1 are mapped. The semiconductor wafer 1 is provided with an identification device such as a bar code, and the mapping data for each semiconductor wafer 1 identified by the identification device is stored in a storage device such as a floppy (registered trademark) disk in an alignment component transfer device. Will be entered. Accordingly, the semiconductor element 2 that has moved to the pickup position C is referred to by the quality rank and the defect data corresponding to the position address stored in the mapping data of the semiconductor wafer 1 identified by the identification device, and each semiconductor element 2 The defective semiconductor element 2 is transferred onto the tape member 42 corresponding to each quality rank, and is discarded by the discard unit 49 (see FIG. 1 of the first embodiment).

The method of transferring the semiconductor element 2 from the carrier 6 stored in the wafer storage cassette 50 to the tape member 42 and the configuration of the apparatus will be described below.

As shown in FIG. 10 and FIGS. 1 and 2 of the first embodiment, the wafer storage cassette 50 is supplied from the back side of the apparatus, held by the supply section 51 constituting the elevating mechanism, and vertically moved. Go up and down. A plurality of semiconductor elements 2 which are divided by dicing and aligned in two orthogonal directions are held in a wafer storage cassette 50 in a state where the semiconductor elements 2 are supported by a support body 6. The carrier 6 that has been moved to the height position is pulled out by the wafer pull-out unit 80, and as shown in FIG. 12. The holding plate 11 is moved up and down by the actuator 13, and is lowered when the carrier 6 is placed on the mounting table 12, and as shown in FIG. 2 of the first embodiment, the support metal 5 around the dicing sheet 4. Is pressed down by a predetermined amount. As a result, the dicing sheet 4 is expanded substantially evenly in the respective directions from the central portion on the mounting table 12, and the arrangement pitch of the semiconductor elements 2 carried thereon is extended to separate the semiconductor elements 2 from each other. In this state, the component receiving section 7 is moved, and the semiconductor element 2 moved to the pickup position C is provided for pickup by the suction nozzle 3.

As shown in FIG. 2 of the first embodiment, the machine 1
5, a two-way moving device 10 is installed. The X table 22 is moved in the X direction by an X direction driving motor 21, and the X table 2 is moved by a Y direction driving motor 23.
And a Y table 24 that is moved in the Y direction on the
The component receiving section 7 is supported on the table 24, and is configured by an XY table that moves the component receiving section 7 in the XY2 directions. A receiving unit rotating device 9 is provided so as to be able to cope with the large-sized semiconductor wafer 1. 28 and a gear mechanism 29 are appropriately rotated and driven. That is, similarly to the first embodiment, the drive gear 29a is fixed to the rotation shaft of the motor 28. The rotary table 38 of the component receiving section 7 to which the mounting table 12 is fixed is rotatably supported by the bearing 27 with respect to the frame 26, and has a gear 29b on the outer peripheral portion inside the lower surface.
b meshes with the drive gear 29a. Therefore, the rotation of the motor 28 drives the drive gear 29 of the motor 28.
a rotates, and the gear 29b meshed with the drive gear 29a is rotated, whereby the turntable 38 of the component receiving portion 7 rotates with respect to the frame 26 via the bearing 27,
The mounting table 12 on the turntable 38 rotates.

With the above configuration, the semiconductor element 2 is moved to the pickup position C by moving the carrier 6 in the X and Y directions. The push-up pin 8 is configured to be driven up and down on the machine base 15 by an actuator 17 supported by a frame 16, and the semiconductor element 2 that has moved to the pickup position C is moved up by another push-up pin 8. The pickup nozzles 3 are easily pushed up one by one by the suction nozzles 3 without being disturbed by the surrounding semiconductor elements 2 or causing a position shift of the surrounding semiconductor elements 2. As shown in FIG. 10, the suction nozzle 3 is vertically and rotatably operated by the transfer head 133 of the component transfer device 131.
The transfer head 133 can be moved in the X direction on the X-axis rail 81 by driving the motor 81a for driving in the X-axis direction, and further moved in the Y direction by the Y-axis rail (not shown), thereby moving in the Y direction. Is also possible.

As shown in FIG. 10 and FIGS. 1 and 2 of the first embodiment, the taping unit 70 as an example of the component storage section is arranged so that the tape member 42 is positioned so as to overlap above the component receiving section 7. The transfer head 133, which has the semiconductor element 2 sucked and held by the suction nozzle 3 from the pickup position C by the suction nozzle 3, moves on the X-axis rail 81 to move the suction nozzle 3 above the tape member 42.
Is moved, and the lowering of the suction nozzle 3 causes the tape member 42 to move.
The semiconductor element 2 is housed in the concave portion 42a formed in the semiconductor device.
By arranging the tape member 42 of the taping unit 70 so as to overlap above the component receiving portion 7 in this manner, the moving distance of the transfer head 133 from the pickup position C to the tape member 42 is reduced, and The transfer efficiency when handling the semiconductor wafer 1 can be improved.

As described above, since each semiconductor element 2 is mapped so that the quality rank is determined by inspection, the quality rank of the semiconductor element 2 sucked by the suction nozzle 3 can be known from its mapping address. Numeral 48 controls the moving distance of the transfer head 133 in the X direction according to the quality rank, and stores the semiconductor element 2 on the tape member 42 of the taping unit 70 corresponding to the quality rank. Now, when the quality rank is classified into three stages of a, b, and c, the taping units 70 are arranged in three rows correspondingly. When the moving distance of the transfer head 133 in the X direction is controlled according to the quality rank, the semiconductor element 2 having the quality rank a is in the taping unit 70a, and the semiconductor element 2 having the quality rank b is in the taping unit 70b.
Next, the semiconductor element 2 having the quality rank c is stored in the taping unit 70c, and the semiconductor element 2 is taped and packaged according to the quality rank.

The taping unit 70 includes
As shown in FIG. 0, a front / back reversing device 171 is provided. By operating the front / back reversing device 171, the semiconductor device 2 can be reversed and stored on the tape member 42. The semiconductor element 2 formed on the semiconductor wafer 1 is basically in a state in which the active surface faces upward. When the semiconductor element 2 is transferred to the tape member 42, the active surface is in a state in which the active surface faces upward. Is stored. Therefore, when the semiconductor element 2 packaged by taping is mounted on a circuit board by an electronic component mounting apparatus, the semiconductor element 2 is mounted on the circuit board with the active surface facing upward, and the electrode portion of the active surface is bonded to the circuit board of the circuit board by bonding. It is electrically connected to the pattern. However, the method of mounting on the circuit board is left to the mounting method of the user using the semiconductor element 2,
There is a case where a mounting method of mounting on a circuit board with the active surface facing down is required. This storage with the active surface facing down is realized by the front / back reversing device 171.

As shown in FIGS. 21 to 22, the front / reverse device 171 is supported so that the front / reverse device main body 171a can be turned 180 degrees around a central axis 171r. Suction hole 171 of hole
b is formed, and the suction passage 171 is formed by the suction hole 171b.
By suctioning through the g, the surface of the semiconductor element 2 held by the transfer head 133 on the opposite side to the active surface is sucked and held by the front / reverse device main body 171a. The main body 171a of the front / reverse device is connected so as to rotate integrally with a small gear 171e disposed on the side of the front / reverse device 171. Small gear 171e
Is engaged with a large gear 171f, and one end of a link 171h rotatable around a fulcrum 171p is connected to the large gear 171f. The other end of the link 171h is connected to a tip 171j of a drive rod of an air cylinder 171k. I have. Therefore, when the tip 171j of the drive rod moves leftward in FIG. 23 by driving the air cylinder 171k,
The link 171h rotates counterclockwise around the fulcrum 171p, the large gear 171f rotates clockwise, and the small gear 1
71e rotates in the anti-rotational direction, and
23 is rotated 180 degrees from the solid line position on the right side to the chain line position on the left side in FIG. I have. When the front / back reversing device main body 171a is returned to the original position, the front end of the drive rod is driven by reverse driving of the air cylinder 171k.
When 71j moves rightward in FIG. 23, the link 171h
Rotates clockwise around the fulcrum 171p, and the large gear 1
71f rotates counterclockwise, the small gear 171e rotates in the rotation direction, and the front / back reversing device main body 171a rotates 180 degrees from the chain line position on the left in FIG. 23 to the solid line position on the right. At the time of inversion, when the proximity sensor 171m detects that the main body 171a is located at the inversion position, the suction operation of the main body 171a is stopped to thereby hold the main body 171a. Is released and the semiconductor element 2 held by suction is housed in the recess so that the active surface thereof faces down.
Note that another proximity sensor 171n detects that the main body 171a returns to the original position and the next semiconductor element 2 can be transferred.

Hereinafter, the front / back reversing device 17 according to the above configuration will be described.
The method of using No. 1 will be specifically described. When transferring the semiconductor element 2 to the tape member 42 with the active surface of the semiconductor element 2 facing upward, the transfer head 133 is moved to a position on the tape member 42 where the front / back reversing device 171 is not disposed. In this state, the semiconductor element 2 can be directly stored in the tape member 42 at a position where the front / back inversion device 171 does not exist. On the other hand, when the semiconductor element 2 is transferred to the tape member 42 with the active surface of the semiconductor element 2 facing downward, the position of the transfer head 133 in the Y direction is set to the position in the Y direction where the front / back reversing device 171 is provided. I do. In this state, the transfer head 133 sucking the semiconductor element 2 from the pickup position C
Is moved in the X direction, the suction nozzle 3 is located above the front / back inverting device main body 171a of the front / back inverting device 171. The suction nozzle 3 is moved down to transfer the semiconductor element 2 to the front / back inversion device main body 171a of the front / back inversion device 171.
The semiconductor element 2 is sucked through the suction passage 171g by the suction hole 171b to be held by suction on the body 171a. Next, after the suction holding by the suction nozzle 3 is released, the suction nozzle 3 is lifted and moved from above the front / reverse device main body 171a to another position. Next, air cylinder 1
When 71k is driven for the reversing operation, the link 171 is driven.
h, via the large gear 171f and the small gear 171e, the main body 171a of the front / reverse inversion device 171 of the front / reverse inversion device 171 is moved from the rotation shaft supported by the tape support rail 76 to the center shaft 171r.
The main body 171 is turned around by 180 degrees.
a is 1 from the right solid line position to the left chain line position in FIG.
The active surface of the semiconductor element 2 sucked and held by the front / back inversion device main body 171a is inverted by 80 degrees,
The concave portion 4 of the tape member 42 exposed in the first opening 171d
2a. At this time, when the proximity sensor 171m detects that the front / back inverting device main body 171a is located at the reversing position, the suction operation of the front / back inverting device main body 171a is stopped, and the suction holding by the front / back inverting device main body 171a is released. Then, the concave portion 4 of the tape member 42 is placed such that the semiconductor element 2 held by suction is placed with its active surface facing down.
2a. With this operation, the front and back of the semiconductor element 2 are turned over and stored in the tape member 42.

When the taping unit 70 is movable in the Y direction and the reversing device 171 is used, the reversing device 171 is positioned on an extension of the pickup position C in the X direction. 1
When the pickup 71 is not used, the concave portion 42a of the tape member 42 may be located on an extension of the pickup position C in the X direction.

Further, the front / back reversing device 171 shown in FIG. 12 does not depend on the structure shown in FIGS.
As shown in FIG. 8, it is also possible to arrange a plurality of suction portions 78b on the peripheral side of the intermittently rotating cylindrical portion 78a, and to dispose them on each tape member 42. The suction nozzle 3 transfers the semiconductor element 2 to the suction portion 78b located above the cylindrical portion 78a. When the suction portion 78b, which has sucked the semiconductor element 2 and is positioned on the tape member 42, is rotated by rotating the cylindrical portion 78a, the semiconductor element 2 is removed and the concave portion 4 of the tape member 42 is removed.
2a.

As shown in FIG. 13, the transfer of the semiconductor element 2 onto each tape member 42 by the transfer head 133 is performed by the second transfer head 90 as an example of the second component transfer apparatus. Can be arranged to improve efficiency. That is, the transfer head 133 is connected to the relay table 9 disposed above the carrier 6.
The semiconductor element 2 is transferred on the first transfer member 1, and the second transfer head 90 separates and transfers the semiconductor element 2 onto each tape member 42 from the relay stand 91.
In this configuration, the moving distance of the transfer head 133 is a fixed short distance, and the second transfer head 90
In this case, the transfer tact time can be improved, and the more the number of separations and the number of the taping units 70, the more efficient the separation and transfer.

The relay stand 91 and the second transfer head 90
As shown in FIG. 14, the front and back reversing device 92 may also be configured so as to serve also. In this configuration, the front and back reversing device 92 moves on a rod 93 whose main body traverses over each tape member 42 by driving of a driving device 92a having a rod moving motor or an air cylinder and a rotating motor or an air cylinder. It is configured to be able to reciprocate,
When the main body receives the semiconductor element 2 from the transfer head 133 and sucks and holds the semiconductor element 2 on the main body by driving the suction device 92b, the driving device 92a drives the driving device 92a on the rod 93 up to the tape member 42 corresponding to the quality rank of the semiconductor element 2. As a result, the main body is moved, and the main body is inverted around the rod 93 as a rotation axis by driving of the driving device 92a, and the semiconductor element 2 sucked and held by the main body is housed in the tape member 42. In this configuration, the semiconductor element 2 is inverted and the tape member 4
This is effective in the case of storing in two, and the more the number of separations and the number of the taping units 70, the more efficient the sorting and transfer can be performed.

Further, by configuring each taping unit 70 to be movable in the X direction, the transfer head 13 can be moved.
The transfer distance can also be improved by reducing the moving distance of (3). That is, as shown in FIG.
The taping unit 70 is moved in the X direction so that the tape member 42 corresponding to the quality rank of the semiconductor element 2 picked up at the predetermined position is located in the X direction, and the semiconductor element 2 is moved from the transfer head 133 moved to the predetermined position. It is transferred onto the tape member 42.

When the large semiconductor wafer 1 is handled, it is effective to position the tape member 42 above the component receiving portion 7 as described above. The transfer efficiency can be further improved by reducing the moving distance for performing the transfer.

As described above, since the component receiving portion 7 is configured to be rotatable by the receiving portion rotating device 9, as shown in FIG. The position, for example, each of the unit areas D1, D2, D3, and D4 divided and set around the pickup position C is rotated around the substantially center position of the carrier 6, and the pickup preparation position indicated by hatching in FIG. 1 of the first embodiment. E, the unit areas D1, D2,... Are positioned at the pickup preparation position E, and then the unit area D
The component receiving unit 7 is moved by the two-way moving device 10 so that 1, D2... Move in the XY directions. The unit area D moved to the pickup preparation position E by this rotational movement
When the semiconductor element 2 is sequentially moved to the pickup position C by performing two-way movement only on the D1,..., D2,..., The moving distance of the component receiving section 7 in the X and Y directions is reduced. In combination with the arrangement above, the time required for transfer is shortened, and the transfer efficiency can be improved by reducing the transfer tact.

Further, as shown in FIG. 10 and FIG. 2 of the first embodiment, a recognizing camera for picking up an image of a semiconductor element 2 at a pickup position C as shown in FIG. A reference position switching device 37 for switching the reference for position recognition by the recognition device 36 after the unit area located at the pickup preparation position E is switched by the rotation of the carrier 6 by the receiving unit rotation device 9 including the recognition device 36 including the recognition device 36a. Is provided.

Normally, the semiconductor elements 2 on the carrier 6 are formed so as to be aligned in the same direction with the same model, and are used for recognizing the direction and position when picked up and transferred to the tape member 42. Has a reference position. The position reference is, for example, two points A and B at two diagonal positions of the semiconductor element 2 as shown in FIG. This is used to specify the direction and the position around the center G, regardless of whether the semiconductor element 2 is square or rectangular.

Here, for the sake of simplicity, the case of a rectangular semiconductor element 2 is shown, and is substantially the same at the pickup preparation position E in each of the unit regions D1 to D4 of the first embodiment shown in FIG. Semiconductor elements 2D1-2 that come to the position
Looking at D4, they are in the pickup ready position E
6 and the positions of the position reference points A and B are different from each other as shown in FIGS. 6A, 6B, 6C and 6D of the first embodiment. This difference is specified by the rotation angle of the carrier 6 and, depending on which of the unit areas D1 to D4 is at the pickup preparation position E, from the reference position of the position reference points A and B of the semiconductor element 2 at that position. Is known.

By utilizing this, the reference position switching device 37 is used.
Each unit located at the pickup preparation position E after receiving a position switching signal in which each unit area D1 to D4 is switched to the pickup preparation position E by rotation about the substantially center position of the carrier 6. The fact that the orientation of the semiconductor element 2 in each area, that is, the orientation of the position reference points A and B, deviates by a predetermined angle around the center of the semiconductor element 2 in accordance with the rotation amount of the carrier 6 is determined by the position recognition of the recognition device 36. By switching the reference, it is possible to cope with such an angle shift and prevent the direction and the position of the semiconductor element 2 from being recognized or the recognition accuracy from being lowered.

In the third embodiment, the tool rotating device 141 for rotating the suction nozzle 3 around the center of the semiconductor element 2 picked up by the tool (the tool rotating device 41 similar to the tool rotating device 41 of the first embodiment shown in FIG. 5). Device). After receiving the position switching signal for switching the unit area located at the pickup preparation position E by the rotation of the carrier 6, the suction nozzle 3 determines the direction of the semiconductor element 2 picked up by the suction nozzle 3 based on the known data on the direction and position. 3 is controlled by the tool rotation device 141 by the control device 48.
Is corrected by rotating under the control of. Therefore,
Each unit area D1 located at the pickup preparation position E
Even if the direction of the semiconductor element 2 for each D4 is shifted by a predetermined angle according to the amount of rotation of the carrier 6, the semiconductor element 2 can be transferred to the movement target position F in a fixed direction, and the semiconductor element 2 Transferred in

With the configuration described above, not only the transfer efficiency is improved, but also the plane space of the transfer device is reduced,
The installation space for the transfer device installed in the clean room is also reduced, and an increase in the running cost of the clean room can be suppressed.

Further, with this configuration, taping and packaging of the semiconductor element 2 which has not been realized conventionally can be performed, and the supply form of the semiconductor element 2 when mounting the semiconductor element 2 on a circuit board can be variously selected. Regardless of this taping packaging, if the parts tray is arranged at the same position,
A tray pack of the semiconductor element 2 is possible, and the present invention is similarly applicable to a gel pack.

As shown in FIGS. 9A and 9B,
In the apparatus for transferring aligned components according to the third embodiment, the supply of the wafer storage cassette 50 is set on the back side of the apparatus. For example, the semiconductor wafer 1 has a diameter of 300 mm, and the semiconductor wafer 1 is formed into a form of about ten support members 6 to form a wafer storage cassette 5.
The total weight when stored in 0 is about 20kg,
It is not easy for an operator to carry this and set it on the device. In addition, it is desirable that such a refilling and replacing operation be automated. Therefore, when the supply of the wafer storage cassette 50 is set on the rear side, a running space such as a transfer robot is provided on the rear side, and the wafer storage cassette 50 can be automatically replaced. The operator can simplify the work flow line using only the front side as the work flow line, and can specify the operation such as the operation setting operation of the apparatus and the replacement of the taping unit 70.

[0120]

According to the present invention, as is apparent from the above description, the space saving corresponding to the division around the pickup position with respect to the component carrying area of the carrier results in a reduction in the size and cost of the apparatus and in a clean room. This can reduce the expensive running cost of the semiconductor device, and is suitable for dealing with a semiconductor wafer that becomes larger.

Further, according to the present invention, the semiconductor element can be taped and wrapped, and the active surface of the semiconductor element can be selectively upwardly or downwardly transferred. In addition, the space for transfer is reduced, and even when applied to handling a large semiconductor wafer, the size of the apparatus is reduced.
As a device for transferring aligned components installed in a clean room, the running cost can be reduced by suppressing the installation space.

More specifically, the method for handling the aligned components of the present invention comprises the steps of: aligning each component carried on the carrier in a state where the components are aligned in two orthogonal directions; Each unit area divided and set around a substantially center position of the carrier in the component carrier area of the carrier is sequentially moved to a predetermined pickup position by the movement of the carrier and used for pickup by the component handling tool. After being switched to the pickup preparation position by rotation about the center position, each unit area is positioned at the pickup preparation position, and each component in the unit area thus positioned is moved by the carrier in the two component alignment directions. , Which are sequentially positioned at the pickup position and sequentially supplied to the pickup.

In such a configuration, the moving range in which the aligned components carried by the carrier move in the two orthogonal directions in which they are aligned and the aligned components are picked up by the component handling tool is limited to the component carrying area of the carrier. Is the size range in one unit area divided and set around the pickup position in the above two component alignment directions, and is smaller than the case where the entire component carrying area is set as the movement range. For example, in the setting of the unit area by two divisions at 180 degrees, the maximum movement range in one component alignment direction along the direction in which the two unit areas are arranged is halved, and in the setting of the unit area by four divisions at 90 degrees. First, the maximum movement range in two component alignment directions along a direction in which one unit area is adjacent to the unit areas on both sides is halved. On the other hand, the plurality of divided unit areas on the carrier are rotated at a position about the center of the carrier in the component carrier area of the carrier, and a pickup preparation position for supplying each aligned component to the pickup by moving the carrier. In order to supply all the components in each unit area to the pickup, it is not necessary to move the carrier out of the movement range. Therefore, space saving can be achieved in accordance with the division of the carrier around the center position of the component with respect to the component carrying area, and the required space can be greatly reduced by a small division such as 90-degree division. In addition, the pickup position does not fluctuate.
According to the division at 90 degrees, the relationship between the alignment direction of the parts and the moving direction of the carrier can be kept unchanged, so that even if the position is switched by rotation, it is easy to position each part for pickup. Yes, it doesn't take long.

When the components are to be picked up by the push-up pins, the components are easily and reliably picked up without being disturbed by the surrounding components or displacing the surrounding components. You can make it.

In this case, each part carried on the carrier in a state of being aligned in two orthogonal directions is sequentially moved to a predetermined pickup position by the movement of the two parts at a predetermined position of the carrier in the direction of alignment. To move and provide the pick-up by the component handling tool with the push-up of the component by the push-up pin, a method of handling one aligned component,
In particular, as a method of supplying aligned components, each unit area divided and set around a substantially central position of the carrier in the component carrying area of the carrier is switched to a pickup preparation position by rotation about the substantially central position of the carrier. After each unit area is positioned at the pickup preparation position, the components located in the positioned unit area are moved one by one by the relative movement of the carrier, the pickup position, and the push-up pin in the two component alignment directions. In the case of sequentially positioning the pickup position and the pickup, the same operation as in the above-described method can be achieved regardless of the use of the push-up pin. When the relative movement in the two component alignment directions is performed in a direction in which the two parts approach each other,
The moving distance and moving time of the component to the pickup position are shortened, and the productivity is improved.

Instead, the pickup position and the push-up pin are sequentially associated with, for example, substantially the center position of each of the plurality of unit areas divided and set around the substantially center position of the support member in the component support region of the support member. After the push-up pin corresponds to, for example, approximately the center position of each unit area, the pickup position and the component located in the unit area corresponding to the push-up pin are moved one by one to the pickup position and the two component alignment directions of the push-up pin and the carrier. Even if they are sequentially positioned at the pickup position by the relative movement of and are sequentially provided to the pickup, the same operation is exerted, and the rotation of the carrier becomes unnecessary.

A device for handling aligned components according to the present invention, particularly a device for supplying aligned components, comprises a component receiving portion for receiving and holding a carrier carrying components such as semiconductor elements aligned in two orthogonal directions, and a component receiving portion. Is rotated about the center position of the carrier that has received the portion, and each unit area divided and set around the center position of the carrier in the component carrying area of the carrier is divided into a plurality of units around the center position of the carrier. A receiving unit rotating device for switching to a pickup preparation position, and a component receiving unit being moved in the two component alignment directions so as to sequentially place components one by one in a unit area located at the pickup preparation position on the carrier to the pickup position. It is sufficient to have a two-way moving device for moving and providing a pick-up by a component handling tool, and a receiving portion for rotating a receiving portion. No extra flat space is required to provide the rotating device, and all the components including the semiconductor element on the carrier received in the receiving portion can be used under the same conditions as before without impairing the space saving of the above method. In this case, the semiconductor wafer as an example of a component can be advantageously used in terms of space saving.

The device for handling aligned components of the present invention, in particular, the device for transferring aligned components, comprises a component receiving portion for receiving and holding a carrier carrying components such as semiconductor elements aligned in two orthogonal directions, By rotating the receiving portion about the center position of the received carrier, the unit area divided into a plurality of parts around the center position of the carrier in the component holding area of the carrier is picked up around the center position of the carrier. A receiving unit rotating device that is switched to a preparation position, and a component receiving unit that is moved in the two component alignment directions to sequentially move components one by one in a unit area located at a pickup preparation position on a carrier to a pickup position. A two-way moving device that moves and picks up each time a part is moved to the pick-up position using a part handling tool and transfers it to another It is characterized in that a that component placing apparatus.

In such a configuration, each of the components including the semiconductor elements arranged on the carrier is supplied to the pickup position in a space-saving manner as described above. Then, it can be picked up by a component handling tool of a component transfer device similar to that described above, transferred to a predetermined location, and provided for subsequent handling.

In this case, a recognition device is provided for recognizing an image by picking up the component at the pickup position. Each time the unit area located at the pickup preparation position is switched by the rotation of the carrier by the receiving unit rotation device, the position recognition by the recognition device is performed. When the reference position switching device for switching the reference is provided, the parts on the carrier are usually aligned in the same direction with the same parts, and processing, assembly, storage, mounting, and the like after the pickup are performed. When each unit area has a common position reference for recognizing the orientation and position in various kinds of handling, each unit area is switched to the pickup preparation position by rotation about the pickup position, but the pickup preparation position is not changed. Orientation of components including semiconductor elements for each unit area located in
Therefore, the direction of the position reference is shifted by a predetermined angle around the center of the component according to the amount of rotation of the carrier, but every time the unit area located at the pickup preparation position is switched, the position recognition reference of the recognition device is switched. In response to such an angle shift, it is possible to prevent the orientation or position from being unrecognizable or the recognition accuracy from being reduced.

A unit rotation device for rotating a component handling tool around the center of a component such as a semiconductor element picked up by the component rotation tool is provided, and a unit area positioned at a pickup preparation position by rotation of a carrier by a receiving portion rotation device. Each time is switched, if a control device that controls the direction of the component picked up by the component handling tool to be corrected by the rotation of the component handling tool by the tool rotating device is provided, the pickup preparation position is set as described above. Even if the direction of the component such as the semiconductor element in each unit area is shifted by a predetermined angle around the center of the component according to the rotation amount of the carrier, the control device operates the tool rotation device. After correcting by rotating the component handling tool that picked up the component, it was transferred Unisuru we can, parts including the semiconductor element does not result in the inconvenience and problems to be dealt with in a certain direction after the transfer.

The device for handling aligned components of the present invention, in particular, the storage device for aligned components, comprises a component receiving portion for receiving and holding a carrier carrying components such as semiconductor elements aligned in two orthogonal directions, and a component receiving portion. The unit area is rotated about the center of the carrier that has received the unit, and each unit area divided and set around the center of the carrier in the component carrier area of the carrier is picked up around the center of the carrier. A receiving unit rotating device that is switched to a preparation position, and a component receiving unit that is moved in the two component alignment directions to sequentially move components one by one in a unit area located at a pickup preparation position on a carrier to a pickup position. A two-way moving device for moving the parts, and a parts storage part for receiving the parts in the parts storage member for next-stage handling so that the parts can be handled in a predetermined package. It is characterized in that a component placing apparatus each time a component pickup position is located which was picked up by the component handling tool for transferring to the component housing member of the component housing section.

In such a configuration, the components such as the semiconductor element picked up and transferred to the component storage member provided in the component storage portion are received, so that the type of the component storage member such as tape or pallet can be selected. It is possible to store and supply in a package suitable for the next handling,
This can be achieved by utilizing the necessary features of the above-mentioned transfer.

In this case, a plurality of component storage members can be juxtaposed in the component storage section, and the plurality of component storage members are selectively used and transferred according to the type recognized by the component recognition tool by the component recognition tool. If it is equipped with a component transfer device or a control device that controls the operation of the component storage unit so that it can be stored, it is possible to mix heterogeneous components with different quality ranks etc. in the components such as semiconductor elements on the carrier. Occasionally, it is possible to use different types of storage members for different types of storage and use them for different purposes and handlings by utilizing the recognition function of the recognition device. Is a defective product, and when the control device controls the discard unit to discard the component determined to be defective based on the result of the recognition device, Effortlessly can achieve management is using the transfer cycle, a special work process becomes unnecessary.

[0135] Further, the apparatus for handling aligned components according to the present invention, in particular, the method for transferring aligned components, supplies a carrier, which carries a plurality of components in a state of being aligned in two orthogonal directions, to a predetermined position.
Each component is sequentially moved to a predetermined pick-up position by the movement of the carrier at a predetermined position in the two component alignment directions, the component moved to the pickup position is picked up by a component handling tool, and the carrier is moved by the component handling tool. The picked-up component is transferred to a transfer position set so as to be overlapped above the component.

According to the transfer method, the components picked up by the component handling tool are transferred to the transfer position provided at a position overlapping the carrier for moving the carrier in the component alignment direction. Can be reduced. The moving range of the carrier becomes larger as the component carrying area becomes larger, and if there is a transfer position on the same plane, a moving distance exceeding the diameter of the carrier at the maximum is required, but the carrier moves. When the transfer position is provided above, the transfer distance is shortened, the time required for transfer is reduced, and an efficient transfer operation is performed.

In the above transfer method, each of the plurality of unit areas divided and set around the center of the carrier in the component holding area of the carrier is switched to the pickup preparation position by rotating about the center of the carrier. Each time each unit area is located at the pickup preparation position, each component in the located unit area is sequentially moved to a predetermined pickup position by moving the carrier in the two component alignment directions. Even when the diameter of the carrier is large, the transfer operation can be performed more efficiently. In other words, the divided unit area is moved to the specific area by rotation, and the unit area is moved in the two component alignment directions for each unit area moved to the specific area. In addition, the moving distance for moving each component is reduced, and the transfer distance is shortened in combination with the provision of the transfer position above the moving of the carrier, so that the time required for the transfer is reduced and the efficient transfer operation is performed. It can be carried out.

[0138] By reversing the components picked up by the component handling tool and transferring the components, it is possible to perform the transfer suitable for the handling state of the components after the transfer.

[0139] Further, the device for handling aligned components according to the present invention, in particular, the device for transferring aligned components, comprises: a component receiving portion for receiving and holding a carrier that carries a plurality of components aligned in two orthogonal directions; A two-way moving device for moving a component receiving unit in the two component alignment directions and sequentially moving one component at a time to a predetermined pickup position, and a component storage unit disposed at a position overlapping above the component receiving unit. And a component transfer device that picks up the component every time the component moves to the pickup position and transfers the component to the component storage unit.

According to this configuration, since the component storage section is disposed at a position overlapping the component reception section, the moving distance of the component transfer device from the component reception section to the component storage section can be reduced. . In other words, the moving range of the component receiving section becomes larger as the carrying area of the components of the carrier becomes larger. When the component storage unit is provided above where the component receiving unit moves, the transfer distance of the component transfer device is shortened, and the time required for the transfer is shortened, and an efficient transfer operation is performed.

Further, the device for handling aligned components according to the present invention, in particular, the device for transferring aligned components, comprises: a component receiving portion for receiving and holding a carrier which carries a plurality of components aligned in two orthogonal directions; A two-way moving device for moving a component receiving portion in the two component alignment directions and sequentially moving one component at a time to a predetermined pickup position, and components arranged in a plurality of rows at positions overlapping above the component receiving portion It is characterized by comprising a storage section, and a component transfer device that picks up the component and transfers it to each component storage section each time the component moves to the pickup position.

In this configuration, since the component storage units are provided in a plurality of rows, each component can be sorted and transferred to the corresponding component storage unit according to its quality rank or the like.

In the configuration of the present invention described above, the receiving part rotation for switching the unit receiving part, in which the component receiving part is divided into a plurality of parts around the center of the carrier, to the pickup ready position about the center of the carrier, is switched. By providing the device, the transfer operation can be performed more efficiently even when the diameter of the carrier is large. In other words, the divided unit area is moved to a specific area by rotation, and movement in two component alignment directions is performed for each unit area moved to the specific area. The moving distance for moving each component is reduced, and the transfer distance is shortened in combination with the provision of the component storage section above the component receiving section, thereby shortening the time required for the transfer and performing an efficient transfer operation. be able to.

Further, between the component transfer device and the component storage unit, there is provided a front / back reversing device for receiving a component from the component transfer device, inverting the front and back of the component, and selectively storing the component in the component storage unit. With this arrangement, the front and back of the component to be transferred to the component storage unit can be selected, and the component stored in the component storage unit can be stored in a direction suitable for a state when the component is used.

In the configuration of the present invention, a second component transfer device for receiving components from the component transfer device and sorting and transferring the components to component storage units provided in a plurality of rows is provided. It is possible to improve the transfer efficiency of separating and transferring components to a plurality of component storage units.

[0146] Also, a part is received from the part transfer device,
By providing a front and back reversing device that moves over the component storage units arranged in multiple rows and reverses the front and back of components in each component storage unit and separates and transfers them, the efficiency of the transfer operation involving front and back reversal is improved. Can be planned.

Further, by moving each of the component storage units arranged in a plurality of rows to a predetermined position on the component receiving unit, and transferring the components to the component storage unit moved to the predetermined position by the component transfer device, the components can be moved. It is possible to improve the transfer efficiency of separating and transferring to the storage section.

[0148] Separation of components into a plurality of component storage sections corresponds to the plurality of component storage sections arranged for each section based on data identifying the section of each component arranged on the carrier. This can be done by transferring the parts of the section.

Further, the apparatus for handling aligned components according to the present invention, in particular, the apparatus for transferring aligned components, accommodates a carrier that carries a plurality of semiconductor elements obtained by dividing a semiconductor wafer by dicing and aligned in two orthogonal directions. A component supply unit that supplies the carrier to a predetermined supply position, a component receiving unit that receives and holds the carrier pulled out from the component supply unit, and a semiconductor device that moves the component reception unit in the two component alignment directions. A moving device for sequentially moving the elements one by one to a predetermined pick-up position, a taping and wrapping section for arranging and storing semiconductor elements in the tape extending direction and taping and wrapping, and picking up each time the semiconductor element moves to the pick-up position And a transfer device for sequentially transferring to the taping packaging portion, and disposed between the transfer device and the taping packaging portion,
A reversing device for receiving a component from the transfer device, selectively reversing the component, and storing the component in the component storage unit.

According to this configuration, the semiconductor element picked up by the transfer device from the component receiving section is transferred to the taping and wrapping section and is wrapped by taping, so that the semiconductor element is suitable for mounting on a circuit board. And can be shipped. When mounting semiconductor elements on a circuit board, there is a request to mount the semiconductor element with the active surface facing upward, and a request to mount the semiconductor element with the active surface pointing down. When operated in an arbitrary manner, the front and back directions of the semiconductor element stored in the component storage section can be freely set.

In the above configuration, if the taping and wrapping portion is disposed at a position overlapping the component receiving portion, the moving distance of the transfer device can be reduced, and efficient transfer can be performed even when handling a large semiconductor wafer. Actions can be taken. Furthermore, when a receiving unit rotating device is provided for switching the unit receiving area, in which the component receiving unit is divided into a plurality of parts around the center of the carrier, to a pickup preparation position around the center of the carrier, a large semiconductor wafer is provided. It is possible to promote the efficiency of the handling of materials.

Further, based on the data obtained by identifying each semiconductor element arranged on the semiconductor wafer by quality rank, each semiconductor element having a quality rank corresponding to each of the plurality of taping packaging sections arranged by quality rank is transferred. By mounting the semiconductor elements, the semiconductor elements can be separated and transferred to the respective taping packaging sections according to the type such as the quality rank.

Each of the above-mentioned features of the present invention can be used alone or in combination in various combinations as much as possible.

[Brief description of the drawings]

FIG. 1 is a plan view showing an apparatus for supplying, transferring, and storing aligned components according to a first embodiment of the present invention.

FIG. 2 is a front view of a part of the apparatus of FIG. 1;

FIG. 3 is a perspective view of a component receiving portion of the apparatus of FIG. 1;

FIG. 4 is a perspective view of a two-way moving device in a component receiving section of the device of FIG. 1;

FIG. 5 is a perspective view showing the configuration of the entire device as the storage device of FIG. 1;

6 (A), (B), (C), and (D) show changes in the position and orientation of the carrier semiconductor element and its position reference point due to the rotation of the carrier by the apparatus of FIG. 1, respectively. FIG.

FIG. 7 is a plan view showing a tape member used in the component storage section of the apparatus of FIG.

FIG. 8 is a front view of a part of an apparatus for supplying, transferring, and storing aligned components according to a second embodiment of the present invention.

9A is a perspective view showing the appearance of the front side of a transfer device according to a third embodiment of the present invention, and FIG.
It is a perspective view which shows the external appearance on the back side of the transfer apparatus of (A).

FIG. 10 is a perspective view showing an internal configuration of the transfer device of FIG. 9 (A).

FIG. 11 is a perspective view showing a configuration of a taping unit used in the transfer device of FIG. 9A.

FIG. 12 is a schematic view showing another embodiment of the front / reverse device.

FIG. 13 is a schematic diagram showing another mode of performing a transfer operation to a plurality of tapes.

FIG. 14 is a perspective view showing a configuration of separation and transfer to a plurality of tapes by a front / reverse device.

FIG. 15 is a schematic diagram showing a configuration in which a plurality of tapes can be moved.

FIG. 16 is an explanatory diagram showing a setting of a unit area in the case of dividing into two at 180 degrees in the X direction as a modification of the first embodiment of the present invention.

FIG. 17 is an explanatory diagram showing the setting of a unit area in the case of dividing into two at 180 degrees in the Y direction as another modification of the first embodiment of the present invention.

FIG. 18 is an explanatory diagram showing a range of a region when moving in the conventional X and Y directions.

FIG. 19 is a block diagram showing a relationship between a control device of a device for handling aligned components and other devices according to the first and second embodiments of the present invention.

FIG. 20 is a block diagram illustrating a relationship between a control device of a device for handling aligned components according to a third embodiment of the present invention and other devices.

FIG. 21 is an enlarged perspective view of a front / back reversing device of the aligned component handling device of the third embodiment.

FIG. 22 is an enlarged plan view of the front / reverse device of FIG. 21;

FIG. 23 is an enlarged side view of the front / reverse device of FIG. 21;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer, 2 ... Semiconductor element, 3 ... Suction nozzle,
4 ... Dicing sheet, 5 ... Support bracket, 6 ... Carrier, 7
... part receiving part, 8 ... push-up pin, 9 ... receiving part rotating device, 10 ... two-way moving device, 11 ... holding plate, 12 ...
Mounting table, 13: Actuator, 15: Machine stand, 16: Frame, 17: Actuator, 21: X direction drive motor, 22: X table, 23: Y direction drive motor,
24 ... Y table, 26 ... frame, 27 ... bearing, 28 ... motor, 29 ... gear mechanism, 29a ... drive gear, 29b ... gear, 30 ... actuator, 31 ... parts transfer device, 32 ... parts storage part, 33 ... Transfer head, 34
... Y direction drive motor, 35 ... Y table, 36 ... recognition device, 37 ... reference position switching device, 38 ... turntable, 3
41: tool rotating device, 42: tape member, 42a: concave portion, 48: control device, 49: discard portion, 50: wafer storage cassette, 61: reference position, 62: maximum movement position in the X direction, 63: Y direction , The maximum movement position as viewed in the XY synthesis direction, 70, a taping unit (taping wrapping part, component storage unit), 90, a second component transfer device, 131, a component transfer device, 141 ... Tool rotation device, 171 ... Flip device, A, B ... Position reference point, C
... Pickup position, D ... Parts carrying area, D1-D4 ...
Unit area, E: pickup preparation position, F: component transfer target position.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Takashi Shimizu, Inventor 1006, Kazuma Kadoma, Kadoma City, Osaka Prefecture, Japan Matsushita Electric Industrial Co., Ltd. 72) Inventor Ryoji Inuzuka 1006 Kadoma, Kazuma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroyuki Yoshida 1006 Kadoma, Kadoma, Osaka Pref. DA15 DA20 EA11 FA05 FA07 FA11 FA21 GA23 GA47 GA48 GA49 HA25 HA28 HA29 HA53 HA59 JA01 JA04 JA28 JA29 JA32 JA38 JA49 JA51 KA06 LA14 MA16 MA40 5F047 FA01 FA02 FA03 FA04

Claims (30)

[Claims] 1. Each part (2) carried on a carrier (6) in a state of being aligned in two orthogonal directions (X, Y) is moved by the movement of the carrier in the two component alignment directions. Each unit divided and set around a substantially center position of the carrier in the component carrying area (D) of the carrier to be sequentially moved to the pickup position (C) and provided for pickup by the component handling tool (3). Region (D1, D
2) is switched to the pickup preparation position (E) by rotating the carrier about the center position, and after each unit area is located at the pickup preparation position, each component in the unit area thus located is positioned. A method of handling an alignment component that supplies the alignment components aligned in the two component alignment directions by sequentially positioning the carrier in the pickup position by moving the carrier in the two component alignment directions and sequentially applying the pickup components to the pickup. 2. The method according to claim 1, wherein the component is lifted up by a push-up pin (8) and used for pickup by the component handling tool, and after each unit area is located at the pickup preparation position, the unit area is located in the located unit area. The components were sequentially positioned at the pickup position by relative movement of the carrier, the pickup position, and the push-up pin in the two component alignment directions, and were sequentially applied to the pickup so that they were aligned in the two component alignment directions. The method of claim 1, wherein the aligning component is supplied. 3. A component is provided for pick-up by the component handling tool with the component being pushed up by a push-up pin, and is divided into a plurality of parts around a substantially center position of the carrier in a component carrying area of the carrier when being provided for the pickup. The pickup position and the push-up pin are sequentially associated with each of the unit areas, and after the pickup position and the push-up pin correspond to each unit area, the component in the unit area where the pickup position and the push-up pin correspond. Are sequentially positioned at the pickup position by the relative movement of the pickup position and the push-up pin and the carrier in the two component alignment directions, and are sequentially provided to the pickup so as to be aligned in the two component alignment directions. Supply alignment parts Handling alignment component according to claim 1 that. 4. The method according to claim 1, wherein the unit area is divided into four at 90 degrees. 5. A component receiving portion (7) for receiving and holding a carrier (6) carrying components (2) aligned in two orthogonal directions (X, Y), and the component receiving portion receiving the component receiving portion. Each of the unit areas (D1, D2) divided into a plurality of parts around the substantially center position of the carrier in the component carrying area (D) of the carrier is rotated by rotating about the center position of the carrier. Pickup preparation position (E) around the center of
A receiving unit rotating device (9) for switching the position to a position, and moving the component receiving unit in the two component alignment directions to pick up the component in the unit area located at the pickup preparation position on the carrier at the pickup position ( C) a two-way moving device (10) for sequentially moving to (C) and picking up by a component handling tool (3). 6. A component transfer device according to claim 5, further comprising a component transfer device for picking up the component by the component handling tool and transferring the component to another after the component is moved to the pickup position. Handling equipment. 7. A component storage part (32) for allowing the component to be handled in a state of being received in a component storage member (42) for next-stage handling, and after the component is positioned at the pickup position. 7. The device according to claim 5, further comprising: a component transfer device (31) that picks up the component by the component handling tool and transfers the component to the component storage member of the component storage unit. 8. A recognition device (36) for picking up an image of the component at the pickup position and recognizing the image, and after a unit area located at the pickup preparation position is switched by rotation of the carrier by the receiving unit rotation device. A reference position switching device (37) for switching a reference of position recognition by the recognition device.
8. The device for handling aligned components according to any one of claims 7 to 7. 9. A tool rotating device (41) for rotating the component handling tool around a center of the component picked up by the component handling tool, and a unit positioned at the pickup preparation position by rotation of the carrier by the receiving unit rotating device. A control device (48) for controlling the tool rotating device so that the orientation of the component picked up by the component handling tool is corrected by the rotation of the component handling tool by the tool rotating device after the area is switched. Item 7 or 8
An apparatus for handling aligned parts according to item 1. 10. The component storage section, in which a plurality of component storage members can be juxtaposed, and the plurality of component storage members are selectively used and transferred according to the type of the component picked up by the component handling tool recognized by the recognition device. The apparatus for storing aligned components according to claim 8, further comprising a control device (48) for controlling the operation of the component storage section and the component handling tool so as to be mounted and stored. 11. The apparatus according to claim 10, wherein the type of the component is a quality rank divided according to an electrical characteristic and a frequency characteristic of each component. 12. One of the component types is defective, and the control device controls the operation of the component handling tool so that the component recognized as defective by the recognition device is discarded by a discarding section (49). An apparatus for handling aligned components according to claim 11. 13. The component storage member, wherein the tape member (4
The apparatus for handling an aligned component according to any one of claims 7 to 12, which is (2). 14. The apparatus according to claim 5, wherein the unit area is divided into four at 90 degrees. 15. The apparatus according to claim 5, wherein the unit area is divided into two at 180 degrees. 16. A carrier (6) carrying a plurality of components (2) aligned in two orthogonal directions (X, Y) is supplied to a component supply position. The components are sequentially moved to a pickup position (C) by the movement in the two component alignment directions, the components moved to the pickup position are picked up by a component handling tool (3), and the carrier is moved by the component handling tool. A method of handling an aligned component, in which the picked-up component is transferred to a component transfer target position (F) set so as to be overlapped above the above, so that the aligned components aligned in the two component alignment directions are transferred. 17. The component moved to the pickup position is picked up by the component handling tool, and is picked up by the component handling tool to a component transfer target position (F) set so as to overlap above the carrier. The method for handling aligned components according to claim 1, wherein the aligned components aligned in the two component alignment directions are transferred by transferring the components. 18. The method for handling aligned components according to claim 1, wherein the component picked up by the component handling tool is transferred with the front and back reversed. 19. A component receiving portion (7) for receiving and holding a carrier (6) that carries a plurality of components (2) aligned in two orthogonal directions (X, Y), and the component receiving portion. A two-way moving device (10) for moving the components in the two component alignment directions to sequentially move the components to the pickup position (C); and a component storage portion (70) disposed at a position overlapping above the component receiving portion. And a component transfer device (131) that picks up the component and transfers it to the component storage portion each time the component moves to the pickup position. 20. The component storage section is arranged in a plurality of rows at a position overlapping above the component receiving section, and the component transfer device transfers the component each time the component moves to the pickup position. 20. The apparatus for handling aligned components according to claim 19, wherein the devices are picked up and transferred to each component storage unit. 21. The apparatus according to claim 21, further comprising: a component storage portion disposed above the component receiving portion, wherein the component transfer device is configured to move the component to the pickup position each time. 7. The apparatus according to claim 6, wherein the component is picked up and transferred to the component storage unit. 22. The component storage section is arranged in a plurality of rows at a position overlapping above the component receiving section, and the component transfer device transfers the component each time the component moves to the pickup position. 22. The apparatus for handling aligned components according to claim 21, wherein the components are picked up and transferred to each component storage unit. 23. An operation which is disposed between the transfer device and the component storage unit, receives the component from the transfer device, reverses the front and back of the component, and stores the component in the component storage unit. 23. The device according to claim 19, further comprising a reversing device (171) for performing a reverse operation. 24. The apparatus according to claim 20, further comprising a second component transfer device (90) that receives the component from the transfer device and sorts and transfers the component to the component storage units provided in a plurality of rows. 23. An apparatus for handling aligned parts according to 22. 25. Front and back for receiving the components from the component transfer device, moving the components on the component storage units arranged in a plurality of rows, reversing the front and back of the components in each component storage unit, and sorting and transferring the components. 23. The device according to claim 20, further comprising a reversing device (171). 26. The concave portion (42a) of each of the component storage portions arranged in the plurality of rows is moved to a transfer target position (F) on the component receiving portion, and the component transfer device moves the transfer target position. 23. The device for handling aligned components according to claim 20, wherein the component is transferred to the concave portion of the component storage portion that has been moved to the position. 27. Based on data identifying each section of each part arranged on the carrier, the parts in the corresponding sections are transferred to the plurality of component storage sections arranged for each section of each part. An apparatus for handling aligned parts according to claim 20. 28. The component is a plurality of semiconductor elements (2) obtained by dividing a semiconductor wafer (1) by dicing, and a carrier that carries the component in a state of being aligned in two orthogonal directions (X, Y). A component supply unit (50) for accommodating (6) and supplying it to the supply position; and a taping packaging unit (70) for arranging and accommodating the semiconductor elements in an extending direction of the tape member (42) and taping and packaging.
And disposing between the component transfer device and the taping packaging unit, receiving the semiconductor element from the component transfer device, turning the semiconductor element upside down, and storing the semiconductor device in the taping packaging unit. Selective reversing device (1
71), wherein the component receiving section (7) receives and holds the carrier pulled out from the component supply section, and the two-way moving device (10) sets the component receiving section to the 2nd position. The semiconductor device is sequentially moved to the pickup position by moving the semiconductor device to the two component alignment directions. The component transfer device (3) picks up the semiconductor device every time the semiconductor device moves to the pickup position and places the semiconductor device in the taping packaging part. 7. The device for handling aligned parts according to claim 6, which is sequentially transferred. 29. The taping and wrapping portion is disposed at a position overlapping above the component receiving portion.
An apparatus for handling aligned parts according to item 1. 30. A plurality of semiconductor devices arranged on a semiconductor wafer, each of which is arranged by quality rank based on data identified by quality rank divided by electrical characteristics and frequency characteristics of each semiconductor device. 30. The device according to claim 28, wherein semiconductor devices having quality ranks corresponding to the respective taping packaging portions are transferred.