JP2004238009A - Taping method and taping device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a taping method and a taping device which dispense with a separate electronic component feeder, simplify the structure of the taping device, and reduce the cost. <P>SOLUTION: In the taping method, firstly, a carrier tape with recessed portions capable of inserting electronic components therein is intermittently carried, electronic components are successively inserted in the recessed portions of the carrier tape by an insertion means having a suction nozzle at the insertion position, acceptance/rejection of the inserted electronic components is inspected, and the electronic components are sealed by a cover tape. Secondly, if the electronic component is determined to be rejected at a result of inspection, the carrier tape is carried in the reverse direction until the recessed portion with the rejected electronic component inserted therein reaches the insertion position. Thirdly, a new electronic component is inserted by the insertion means at the insertion position. Fourthly, the carrier tape is carried until the new electronic component reaches the inspection position. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an improvement in a taping method and a device for packing and packaging electronic parts in a concave portion of a carrier tape and sealing the electronic parts, and a method for discharging electronic parts determined to be defective mainly by inspection means. And a discharge mechanism.
[0002]
[Prior art]
In a conventional taping method or a testing device in a taping apparatus, after inserting an electronic component into a concave portion of a tape, the state of the electronic component (direction, presence / absence of a mark, chipping, etc.) is inspected by an inspection camera, and a defective electronic component is detected. In such a case, a mechanism for issuing an alarm was adopted. In this case, the warning causes the operator to stop the taping device, remove the defective electronic component, and manually insert a new electronic component.
[0003]
The above-described taping method and apparatus cannot respond to the demand for labor saving and cost reduction, and methods and apparatuses for automating the above-described operations as disclosed in Patent Documents 1 and 2 have been provided. However, these taping methods and apparatuses require a separate device for supplying a new electronic component to the position where the defective electronic component is discharged, and the structure of the taping device is complicated and expensive.
[0004]
[Patent Document 1] Japanese Patent Application Laid-Open No. 2001-228098 [Patent Document 2] Japanese Patent Application Laid-Open No. 11-59615 [0005]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION An object of the present invention is to provide a taping method and a taping device which can simplify the structure of a taping device and reduce costs without requiring a separate supply device for electronic components.
[0006]
[Means for Solving the Problems]
The first invention employs the following means in a taping method in order to solve the above problems.
First, a carrier tape having a concave portion into which an electronic component can be inserted is intermittently conveyed, and the electronic component is sequentially inserted into the concave portion of the carrier tape by an insertion unit having a suction nozzle at an insertion position. After inspection, a taping method of sealing with a cover tape is adopted.
Secondly, if the inspection results show that the carrier tape is defective, the carrier tape is transported in the reverse direction until the concave portion in which the defective electronic component has been inserted reaches the insertion position.
Third, a new electronic component is inserted by the insertion means at the insertion position.
Fourth, after that, the carrier tape is transported until a new electronic component reaches the inspection position.
[0007]
A second invention relates to an improvement of the first invention, and is a taping method in which a defective electronic component is discharged from a concave portion by the insertion means at the insertion position.
[0008]
The third invention relates to a device for realizing the first invention, and employs the following means in a taping device.
First, a tape transport unit for intermittently transporting a carrier tape having a concave portion into which an electronic component can be inserted, an insertion unit having a suction nozzle for sequentially inserting the electronic component into the concave portion of the carrier tape at the insertion position, In addition, the taping device includes an inspection means for judging the quality of the electronic component, and sequentially inserts the electronic component into the carrier tape and seals it with a cover tape.
Second, the tape transport means is configured to be able to transport the carrier tape in the forward and reverse directions.
Thirdly, when the inspection means determines that the carrier tape is defective, the carrier tape is transported in the reverse direction until the concave portion in which the defective electronic component is inserted reaches the insertion position.
Fourth, a new electronic component is inserted at the insertion position by the insertion means.
Fifth, thereafter, the carrier tape is transported in the forward direction until a new electronic component reaches the inspection position.
[0009]
The fourth and fifth inventions relate to an improvement of the third invention, and the fourth invention is a taping device configured to discharge a defective electronic component from a concave portion by the insertion means at the insertion position, A fifth invention is a taping device in which the insertion means has a plurality of suction nozzles on an outer peripheral portion of an index table which is intermittently driven.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described along with examples with reference to the drawings. FIG. 1 is a schematic explanatory view showing the entirety of a taping device according to this embodiment. The taping device has a carrier tape 1 (hereinafter abbreviated as a tape) having a chip-shaped electronic component (hereinafter abbreviated as a chip) having a concave portion. ), A device for accommodating, comprising a chip supply device 2, a pickup reversing device 3, an index device 4, a tape packaging device 5, and an inspection camera 6 for chips inserted into the concave portions.
[00011]
The chips are supplied to the chip supply device 2 in the embodiment in a state where the semiconductor wafer held on the dicing sheet is separated into individual chips by dicing. The chip supply device 2 is provided with an XY table 7, and the diced wafer can be moved by the XY table 7. A push-up pin 8 for pushing up a chip is provided below the chip holding position and below the XY table 7 of the chip supply device 2.
[0012]
The pickup reversing device 3 has a pickup nozzle 9 for sucking and holding the chip pushed up by the push-up pin 8 of the chip supply device 2 at the chip holding position, and the pickup nozzle 9 has a rotating shaft provided horizontally. This is a device that is reversible to the center, inverts the front and back of the chip sucked and held by the pickup nozzle 9, and transfers the chip to the index device 4 at the transfer position. Therefore, the pickup nozzle 9 can reciprocate between the chip holding position and the delivery position.
[0013]
The index device 4 has a plurality of suction nozzles 11 arranged at equal intervals in the circumferential direction as holding means for holding and transferring chips on the index table 10, and the index table 10 is connected to a rotating device (not shown). It is mounted so that it can be rotated intermittently and forward and reverse. Each suction nozzle 11 is configured so that its tip is lowered when receiving a chip from the pickup nozzle 9 or when inserting the chip into the concave portion of the tape.
[0014]
The index table 10 is rotated by a rotating device at every one pitch (the interval between the suction nozzle 11 and the next suction nozzle 11) in the clockwise direction in the drawing and stopped in the counterclockwise direction. It is possible. The stop position includes a transfer position 16 where chips are transferred from the pickup nozzle 9 of the pickup reversing device 3 to the suction nozzle 11, positions 21 and 22 for inspecting the appearance and electrical characteristics, and chip pickup at the suction nozzle 11. A position 23 for checking the presence / absence, a position 24 for discharging a defective product by the inspection at the inspection positions 21 and 22, an insertion position 17 where a chip is inserted into the concave portion of the tape 1, and a defective chip based on a state inspection after the chip is inserted. A discharge position 18 where the discarding is performed is set. Discharge boxes 25, 20 are provided below the discharge positions 24, 18, respectively.
[0015]
The tape packaging device 5 includes a supply reel 12 for supplying a tape 1 having recesses A, B, C, and D formed at equal pitches into which chips as electronic components can be inserted, a cover tape 13, a heat seal unit 14, It has a take-up reel 15.
[0016]
Note that a chip inspection camera 6 is provided above the vicinity of the insertion position between the chip insertion position of the tape packaging device 5 and the heat seal unit 14.
[0017]
Hereinafter, the operation of the present embodiment will be described. First, in the chip supply device 2, the chips are sequentially pushed up by the push-up pins 8, and the chips are suction-held by the pickup nozzle 9 of the pickup reversing device 3.
[0018]
The pickup nozzle 9 holding the chip by suction is turned upside down and transported to the transfer position 16 of the index table 10. The suction nozzle 11 of the index device 4 receives the data.
[0019]
When the suction nozzle 11 sucks and holds the chip, the tip portion of the suction nozzle 11 rises to the original position, the index table 10 rotates in the positive direction by one pitch, and the next empty suction nozzle 11 moves above the transfer position 16. And stop. After that, the chips a, b, c, and d are sequentially delivered to the suction nozzle 11.
[0020]
At the stop position of the index table 10, the respective processes are performed at predetermined positions. At the insertion position 17, the chips a, b, c, and d are sent from the suction nozzle 11 to the concave portions A, B, and C of the tape 1. , D. The tape 1 is transported in the forward direction, and the chips a, b, c, and d are inspected by the inspection camera 6 at the inspection position.
[0021]
The operation when the chips a and b, which are electronic components, are inserted into the recesses A and B of the tape 1 and the chip a is recognized as defective by the inspection with the inspection camera will be described with reference to FIGS.
[0022]
First, the tip a is inserted into the recess A at the insertion position 17. The index table 10 rotates one pitch forward (rotates clockwise in FIG. 3), and conveys the tape 1 in the positive direction (rightward in the figure). Next, the chip b is inserted into the concave portion B, and the suction nozzle 11 holding the chip b by suction becomes empty. The index table 10 rotates one pitch forward (rotates clockwise in FIG. 3), and conveys the tape 1 in the positive direction (rightward in the figure).
[0023]
In this state, the recess A into which the chip a is inserted is located at the inspection position, that is, below the inspection camera 6, as shown in FIG. Here, the chip a inserted into the recess A is recognized as defective. At this time, the chip c has not been inserted into the recess C, and the chip c remains held by the suction nozzle 11.
[0024]
Second, as shown in FIG. 4, the tape 1 is transported in the reverse direction until the recess A reaches the insertion position 17. Third, the index table 10 is reversed by one pitch. Since the chip c at the insertion position 17 has not been inserted, the suction nozzle 11 is in a state of holding the chip c by suction. Therefore, the empty suction nozzle 11 into which the chip b has been inserted is positioned above the insertion position 17.
[0025]
Fourth, the defective chip a coming to the insertion position 17 is sucked and held by the empty suction nozzle 11 and taken out from the recess A. Fifth, the index table 10 is rotated one pitch forward. At this time, since the suction nozzle 11 at the insertion position 17 holds the chip c by suction, sixthly, the next chip c is inserted into the recess A as shown in FIG.
[0026]
Seventh, the tape 1 is transported in the forward direction, and the chip c is transported to the inspection position. Eighth, the chip c is inspected by the inspection camera 6. Next, ninth, if the chip c is determined to be a non-defective product as a result of the inspection, the tape 1 is transported in the forward direction, and the index table 10 is rotated forward (this operation is a normal routine). Due to the normal rotation of the index table 10, the suction nozzle 11 that has suctioned and held the defective chip a is located above the discharge box 20, and discharges the defective chip a to the discharge box 20.
[0027]
The chips c, b, d, e, f, and g determined to be appropriate by the inspection are conveyed while being inserted into the recesses A, B, C, D, E, and F of the tape 1 and covered with the cover tape 13. Then, it is sealed by the heat seal unit 14 and wound up on a take-up reel 15.
[0028]
【The invention's effect】
The present invention conveys the carrier tape in the reverse direction until the concave portion in which the defective electronic component is inserted reaches the insertion position when the inspection device determines that the electronic component is defective, and the insertion device having the suction nozzle at the insertion position. Since the taping method and its device are characterized by inserting a new electronic component and then transporting the carrier tape until the new electronic component reaches the inspection position, there is no need for a separate electronic component supply device, The taping method and the taping device simplify the structure of the taping device and reduce the cost.
[Brief description of the drawings]
FIG. 1 is a schematic explanatory view showing the entire taping device according to the present embodiment. FIG. 2 is an enlarged explanatory view of an indexing device in the taping device. FIG. 3 is a plan view showing a relationship between a tape and an index table when a defect is detected. FIG. 4 is a plan view showing the relationship between the tape and the index table when removing the defective chip; FIG. 5 is a plan view showing the relationship between the tape and the index table when replacing the chip; FIG. Plan view showing the relationship between the index table
1. . . . . . Embossed tape2. . . . . . 2. Chip supply device . . . . . 3. Pickup reversing device . . . . . Indexing device 5. . . . . . 5. Tape packaging device . . . . . Inspection camera 7. . . . . . 7. XY table . . . . . 8. Push-up pin . . . . . Pickup nozzle10. . . . . Index table 11. . . . . Suction nozzle 12. . . . . Supply reel 13. . . . . Cover tape 14. . . . . Heat seal part 15. . . . . Take-up reel 16. . . . . Delivery position 17. . . . . Insertion position . . . . Discharge positions 20, 25. . Discharge boxes A, B, C, D, E, F, G. . . . . Recesses a, b, c, d, e, f, g. . . . . Chips

Claims (5)

After intermittently transporting the carrier tape in which the concave portion into which the electronic component can be inserted is inserted, the electronic component is sequentially inserted into the concave portion of the carrier tape by an insertion unit having a suction nozzle at the insertion position, and after the inserted electronic component is inspected for quality. In the taping method of sealing with a cover tape, when the inspection result is determined to be defective, the carrier tape is conveyed in the reverse direction until the concave portion in which the defective electronic component is inserted reaches the insertion position, and the carrier tape is transferred at the insertion position. A taping method, wherein a new electronic component is inserted by the insertion means, and then the carrier tape is transported until the new electronic component reaches an inspection position. 2. The taping method according to claim 1, wherein the defective electronic component is discharged from the concave portion by the insertion means at the insertion position. Tape transport means for intermittently transporting a carrier tape having a concave portion into which an electronic component can be inserted; insertion means having a suction nozzle for sequentially inserting the electronic component into the concave portion of the carrier tape at the insertion position; In a taping device comprising inspection means for judging pass / fail, and sequentially inserting electronic components into a carrier tape, and sealing with a cover tape, the tape transport means is configured to be able to transport the carrier tape in a forward / reverse direction. When it is determined that the carrier tape is conveyed in the reverse direction until the recess in which the defective electronic component is inserted reaches the insertion position, a new electronic component is inserted at the insertion position by the insertion means, and then a new electronic component is inserted. A taping device for transporting a carrier tape in a forward direction until a simple electronic component reaches an inspection position. 4. The taping device according to claim 3, wherein the defective electronic component is discharged from the concave portion by the insertion means at the insertion position. 5. The taping device according to claim 3, wherein the insertion unit has a plurality of suction nozzles on an outer peripheral portion of the index table that is intermittently driven.

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