CN110194290A - A kind of rotary type tower chip braider - Google Patents
A kind of rotary type tower chip braider Download PDFInfo
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- CN110194290A CN110194290A CN201910485751.XA CN201910485751A CN110194290A CN 110194290 A CN110194290 A CN 110194290A CN 201910485751 A CN201910485751 A CN 201910485751A CN 110194290 A CN110194290 A CN 110194290A
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- 238000001514 detection method Methods 0.000 claims abstract description 73
- 238000007789 sealing Methods 0.000 claims abstract description 40
- 230000002950 deficient Effects 0.000 claims abstract description 31
- 238000005538 encapsulation Methods 0.000 claims abstract description 22
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims abstract description 9
- 238000001914 filtration Methods 0.000 claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims description 35
- 230000033001 locomotion Effects 0.000 claims description 32
- 230000007246 mechanism Effects 0.000 claims description 28
- 238000004064 recycling Methods 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 239000008358 core component Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000013519 translation Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 238000004880 explosion Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/30—Arranging and feeding articles in groups
- B65B35/36—Arranging and feeding articles in groups by grippers
- B65B35/38—Arranging and feeding articles in groups by grippers by suction-operated grippers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of rotary type tower chip braiders, are related to chip manufacture field, including loading and unloading system, rectification building-out system, clamping and placing system, braid sealing system and detection system；Wherein, loading and unloading system is loaded with the wafer disks of chip to designated position for transporting, and vacant wafer disks is resetted, to load chip；Rectification building-out system for grabbing wafer disks, and finely tunes the position of wafer disks；Clamping and placing system carries out the transfer of chip position for picking up and transporting the chip in wafer disks；Braid sealing system receives the chip transported from clamping and placing system, carries out braid encapsulation；Detection system, for filtering out non-defective unit and defective products in chip, and reject defective products chip therein, the present invention uses plurality of pendulums arm, more nozzle structures, continuously crystalline substance can be accurately taken from the wafer disks of blue film, it is accurately put into carrier band simultaneously and carries out braid encapsulation, realizes the high-speed paster of chip high speed space transfer, greatlys save manpower.
Description
Technical field
The present invention relates to chip manufacture fields, and in particular to a kind of rotary type tower chip braider.
Background technique
Traditional bonder class equipment, using simple pendulum arm, single suction mouth structure, since plant machinery structure limits, operation
The chip of pickup can not be transferred to and carry out braid encapsulation by precision；However, conventional braider is due to mechanical structure and manufacture work
Skill limitation, and can not accomplish the crawl to chip class product.With the development of semiconductor chip (LED) class, and country is half-and-half
The support energetically of conductor industry, therefore demand of the market to semiconductor chip (LED) class wrapper class equipment is growing, while core
Piece (LED) external form increasingly minimizes or subminaturization, this some pairs of chip class that have just been born carries out the product of braid encapsulation,
High speed, high-precision, the high reliability of manufacturing technique requirent.The mode that some enterprises manually shift produces, precision and efficiency
It is beneath, and difficulty is brought for lower one of packaging process, influence package quality.It is not high to can be only applied to some precision, rate request
Equipment, but be not able to satisfy high speed, high-precision, the chip package product manufacturing skill of high reliability and require；However, external
The equipment price of import is expensive, big to medium-sized and small enterprises up-front investment, serious to constrain the development of medium-sized and small enterprises.
Summary of the invention
According to the above-mentioned deficiencies of the prior art, the technical problem to be solved by the present invention is to propose that a kind of rotary type tower chip is compiled
Band machine, using plurality of pendulums arm, more nozzle structures, rotary type tower chip braider in conjunction with DDR series direct driving motor can be from blue film
Wafer disks in continuously accurately take crystalline substance, while accurately be put into carrier band carry out braid encapsulation, realize chip high speed space transfer
High-speed paster, greatly save manpower.
A kind of rotary type tower chip braider, including loading and unloading system, rectification building-out system, clamping and placing system, braid sealing system
System and detection system；
Wherein, the loading and unloading system is loaded with the wafer disks of chip to designated position for transporting, and will be vacant
Wafer disks reset, to load chip；
The rectification building-out system for grabbing the wafer disks, and finely tunes the position of wafer disks；
The clamping and placing system carries out the transfer of chip position for picking up and transporting the chip in wafer disks；
The braid sealing system receives the chip transported from clamping and placing system, carries out braid encapsulation；
Detection system for filtering out non-defective unit and defective products in chip, and rejects defective products chip therein.
Optionally, the loading and unloading system includes wafer disks hand basket lifting device, the wafer disks hand basket lifting device packet
Wafer disks hand basket, supporting platform, tensioning apparatus, lifting base and lifting drive are included, the lifting base is equipped with described
Lifting drive, lifting drive include the first driving motor, the first synchronous belt and drive lead screw, the first driving electricity
The output shaft drive connection of machine has the first driving wheel, first driving wheel by first toothed belt transmission connection first from
Driving wheel, first driven wheel are fixedly connected with the drive lead screw, and drive lead screw nut, institute are threaded on drive lead screw
It states drive lead screw nut and is fixedly connected with slide plate, the slide plate is fixedly connected with the supporting platform, and the wafer disks hand basket is set
It sets on the upper surface of supporting platform, one end of supporting platform is equipped with the tensioning apparatus.
Optionally, the rectification building-out system includes that wafer compensation device, self-correcting push pin device and wafer disks crawl are removed
Shipping unit, wherein；
The wafer compensation device includes X-axis movement mould group, Y-axis movement mould group and θ axis movement mould group, the X-axis movement
Mould group drives the Y-axis movement mould group to be displaced in the X-axis direction, and Y-axis moves mould group and drives the θ axis movement mould group in Z
The enterprising line position of axis direction is moved, and θ axis movement mould group includes θ axis supporting platform, the 4th driving motor, pulley group, wafer disks mother load
Ring carries ring pallet, wafer plate load ring, carries ring guiding device, carries ring guide wheel device and carry ring pressing device, the θ axis support
Microscope carrier is equipped with the wafer plate and carries ring, is additionally provided with the 4th driving motor on θ axis supporting platform, the 4th driving motor
Output shaft runs through the θ axis supporting platform and the belt pulley set that is sequentially connected, and for belt pulley set for adjusting, the wafer disks are female
Carry ring and wafer plate and carry ring matching and merges and is set in wafer plate and carries ring outer end, wafer disks mother carry ring and wafer plate load ring it
Between be additionally provided with the load ring pallet, the load ring guiding device and the load ring guide wheel device to wafer disks mother carry ring be installed into
Line position sets guiding, and the ring pressing device that carries is used to carry out wafer disks mother load ring, load ring pallet and wafer plate load ring position
It is relatively fixed；
The self-correcting push pin device includes X-axis self-correcting holotype group, Y-axis self-correcting holotype group, Z axis self-correcting holotype group and thimble
Mould group is moved, the X-axis self-correcting holotype group drives the Y-axis self-correcting holotype group to be displaced in the X-axis direction, Y-axis self-correcting
Mould group drives the Z axis self-correcting holotype group to be displaced in the Y-axis direction, and Z axis self-correcting holotype group drives the thimble to move mould
Group be displaced in the Z-axis direction, thimble move mould group include the 8th driving motor, the 8th eccentric wheel drive mechanism, thimble and
Thimble anticollision device, collision-prevention device, output shaft transmission connection the 8th eccentric wheel drive mechanism of the 8th driving motor, the 8th is eccentric
Wheel drive mechanism drives the thimble to move reciprocatingly in the Z-axis direction, and the thimble anticollision device, collision-prevention device is equipped at the thimble；
The wafer disks grasp handling device includes the 9th driving motor, carries screw rod, transmission support plate, Pneumatic elevation dress
It sets and snap finger, the output shaft transmission connection carrying screw rod of the 9th driving motor is carried to be threadedly coupled on screw rod and be carried
Feed screw nut, the carrying feed screw nut are fixedly connected with the transmission support plate, and the lower end of transmission support plate is equipped with the gas
Dynamic lifting device, the output shaft of Pneumatic power elevator apparatus are connected with the snap finger.
Optionally, the clamping and placing system includes capstan head clamping and placing system, the capstan head clamping and placing system include swing arm drive motor,
Chip picks and places swing arm set, suction nozzle, swing arm linear guide, Z axis wafer hold-down devices, Z axis braid hold-down devices and vacuum point
With device, chip described in the output axis connection of the swing arm drive motor picks and places swing arm set, and the chip picks and places swing arm set and includes
Multiple swing arms of circle distribution, the front end of each swing arm are equipped with the suction nozzle, and the vacuum distribution and suction nozzle connect
It is logical, and provide adsorption capacity for suction nozzle, in each swing arm on be additionally provided with swing arm linear guide, at the both ends of swing arm drive motor
Respectively symmetrically it is equipped with the Z axis wafer hold-down devices and the Z axis braid hold-down devices.
Optionally, the swing arm drive motor is DDR series direct driving motor.
Optionally, it includes braid transmission device, lid V belt translation that the braid sealing system, which includes chip braid sealing device,
Device, sealing device and finished product closing quotation device, the braid transmission device includes braid driving motor, live-roller and braid, institute
It states braid driving motor and the live-roller rotation is driven by braid drive coordination band, the braid drives the braid transmission,
The lid belt driver includes lid tep reel, rocking bar relieving mechanism, lid band tensioning apparatus and lid band, is wound on the lid tep reel
The lid band, the rocking bar relieving mechanism are used for from release cap band on lid tep reel, and the lid band tensioning apparatus is for adjusting lid band
Tightness so that lid band is contacted with the braid for having transplanted the chip, the sealing device is heating sealing device,
For braid, lid band and chip to be packaged, the finished product closing quotation device includes finished disk, and one end of braid is on live-roller
Transmission, the other end are gradually wrapped on finished disk.
Optionally, the braid sealing system further includes braid feeding inlet, cassette tape warning device and carrier band cleaning mechanism, institute
Braid feeding inlet is stated for supplying the braid, the cassette tape warning device is photoelectric sensor, for detecting braid card
It alarms when band, the carrier band cleaning mechanism is used to clean the chip that encapsulation is completed.
Optionally, the detection system includes wafer video detection device, braid video detection device and the inspection of bottom video
Device is surveyed, the core component of the wafer video detection device, braid video detection device and bottom video detection device is
Technical grade CCD camera.
Optionally, the wafer video detection device, the braid video detection device are pushed with the Z axis wafer respectively
Device, the Z axis braid hold-down devices are electrically connected, and control Z axis wafer hold-down devices, Z axis braid hold-down devices respectively.
Optionally, it is also spaced to be provided with below the swing arm linear guide and abandons recycling magazine and defective product recycling
Magazine.
The present invention has the advantages that the rotary type tower using plurality of pendulums arm, more nozzle structures, in conjunction with DDR series direct driving motor
Chip braider continuously can accurately take crystalline substance from the wafer disks of blue film, while being accurately put into carrier band and carrying out braid encapsulation,
The high-speed paster for realizing chip high speed space transfer can be realized and continuously take the works such as brilliant, detection, braid encapsulation from wafer disks
Sequence can satisfy semiconductor chip high speed, high-precision, the requirement of the chip class production packaging technology of high reliability, meanwhile,
The equipment has wafer hand basket automatic loading/unloading, realizes that wafer automatically supplies and recycles function automatically, greatlys save manpower, improve
Production efficiency；In addition in terms of equipment cost, manufacturing cost is lower with respect to overseas equipment, can be suitable for middle-size and small-size system
Production demand is opened up in the fund tolerance range for making enterprise, the development for being conducive to medium-sized and small enterprises.
Detailed description of the invention
Fig. 1 and Fig. 2 is respectively the structural schematic diagram at two visual angles of the specific embodiment of the invention；
Fig. 3 is the top view of the specific embodiment of the invention；
Fig. 4 is the structural schematic diagram of wafer disks hand basket lifting device in the specific embodiment of the invention；
Fig. 5 is the perspective view of the explosion of wafer disks hand basket lifting device in the specific embodiment of the invention
Fig. 6 is the structural schematic diagram of wafer compensation device in the specific embodiment of the invention；
Fig. 7 is the perspective view of the explosion of wafer compensation device in the specific embodiment of the invention；
Fig. 8 is the structural schematic diagram of self-correcting push pin device in the specific embodiment of the invention；
Fig. 9 is the perspective view of the explosion of self-correcting push pin device in the specific embodiment of the invention；
Figure 10 is the top view of wafer disks grasp handling device in the specific embodiment of the invention；
Figure 11 is the perspective view of the explosion of wafer disks grasp handling device in the specific embodiment of the invention；
Figure 12 is capstan head fetching device in the specific embodiment of the invention, wafer video detection device, braid video detection dress
The structural schematic diagram set；
Figure 13 is capstan head fetching device in the specific embodiment of the invention, wafer video detection device, braid video detection dress
The formal figure set；
Figure 14 is the structural schematic diagram of bottom video detection device in the specific embodiment of the invention；
Figure 15 is the perspective view of the explosion of bottom video detection device in the specific embodiment of the invention；
Figure 16 is the structural schematic diagram of chip braid sealing device in the specific embodiment of the invention；
Figure 17 is the formal figure of chip braid sealing device in the specific embodiment of the invention；
Figure 18 is the operation principle schematic diagram of the specific embodiment of the invention；
Figure 19 is the workflow schematic diagram of the specific embodiment of the invention；
Figure 20 is the workflow simple diagram of the specific embodiment of the invention；
Figure 21 is the sectional view of thimble anticollision device, collision-prevention device in the specific embodiment of the invention.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
As one embodiment, the present invention proposes a kind of rotary type tower chip braider, including loading and unloading system, rectification building-out
System, clamping and placing system, braid sealing system and detection system；
Wherein, the loading and unloading system is loaded with the wafer disks of chip to designated position for transporting, and will be vacant
Wafer disks reset, to load chip；
The rectification building-out system for grabbing the wafer disks, and finely tunes the position of wafer disks；
The clamping and placing system carries out the (transfer of chip position for picking up and transporting the chip in wafer disks；
The braid sealing system receives the chip transported from clamping and placing system, carries out braid encapsulation；
Detection system for filtering out non-defective unit and defective products in chip, and rejects defective products chip therein.
Through the rotary type tower chip braider, using plurality of pendulums arm, more nozzle structures, in conjunction with DDR series direct driving motor
Rotary type tower chip braider continuously can accurately take crystalline substance from the wafer disks of blue film, while accurately be put into carrier band and be compiled
Band encapsulation, realizes the high-speed paster of chip high speed space transfer, can be realized and continuously takes brilliant, detection, braid envelope from wafer disks
The processes such as dress, can satisfy semiconductor chip high speed, high-precision, the chip class production packaging technology of high reliability and want
It asks, meanwhile, which has wafer hand basket automatic loading/unloading, realizes that wafer automatically supplies and recycles function automatically, greatlys save
Manpower improves production efficiency；In addition in terms of equipment cost, manufacturing cost is lower with respect to overseas equipment, can be applicable in
In the fund tolerance range of Small and Medium Manufacturing Enterprises, production demand is opened up in the development for being conducive to medium-sized and small enterprises.
Relatively good implementation of the present invention is described in detail below.
Please refer to Fig. 1, Fig. 2 and Fig. 3, the rotary type tower chip braider, including be arranged on the rack loading and unloading system, school
Positive compensation system, clamping and placing system, braid sealing system and detection system, can apparently understand, be equipped in rack 13 negative
Duty controls the electric-control system of loading and unloading system, rectification building-out system, clamping and placing system, braid sealing system and detection system；
Wherein, loading and unloading system, including wafer disks hand basket lifting device 2 are loaded with the wafer disks of chip extremely for transporting
Designated position, and vacant wafer disks are resetted, to load chip；
Rectification building-out system, including wafer compensation device 3, self-correcting push pin device 4 and wafer disks grasp handling device 5,
For grabbing wafer disks, and finely tune position of the chip in wafer disks；
Clamping and placing system, including capstan head clamping and placing system 6 carry out chip position for picking up and transporting the chip in wafer disks
Transfer；
Braid sealing system, including chip braid sealing device 7 include braid transmission device, lid belt driver, sealing
Device 76 and finished product closing quotation device, receive the chip transported from clamping and placing system, carry out braid encapsulation；
Detection system, including wafer video detection device 8, braid video detection device 9,10 and of bottom video detection device
Video detection device 79 is encapsulated, for filtering out non-defective unit and defective products in chip, and rejects defective products chip therein.
Fig. 4 and Fig. 5 are please referred to, wafer disks hand basket lifting device 2 includes wafer disks hand basket 21, supporting platform 22, tensioning dress
Set 23, lifting base 24 and lifting drive, lifting base 24 is equipped with lifting drive, and lifting drive includes the
The output shaft drive connection of one driving motor 25, the first synchronous belt 26 and drive lead screw 27, the first driving motor 25 has the first master
Driving wheel, for the first driving wheel by the first synchronous belt 26 the first driven wheel of transmission connection, the first driven wheel and drive lead screw 27 are fixed
It connects, drive lead screw nut is threaded on drive lead screw 27, drive lead screw nut is fixedly connected with slide plate, slide plate and support
Microscope carrier 22 is fixedly connected, and the first sliding rail is additionally provided on lifting base 24, for constraining the running track of sliding block, and sliding block is kept to transport
Dynamic stability is similarly provided with the position sensor limited to lifting position, in lifting base 24 in order to perceive crystalline substance
Disk can be equipped with photoelectric sensor whether in place to detect wafer disks on being supported on platform 22, and the setting of wafer disks hand basket 21 exists
On the upper surface of supporting platform 22, one end of supporting platform 22 is equipped with tensioning apparatus 23.
When the first driving motor 25 is started to work, the rotation of the first driving wheel is driven, the first driving wheel drives first to synchronize
Band 26 rotates, and then drives the rotation of the first driven wheel, to will drive the rotation of drive lead screw 27 again, drive lead screw 27 is in rotation
In the process, the drive lead screw nut being threadedly engaged with drive lead screw 27 is driven to move up and down, and then with movable slider in the first sliding rail
Place slides up and down, to realize moving up and down for supporting platform 22, that is, has driven moving up and down for wafer disks hand basket 21, lifting
The position sensor that pedestal 24 is provided with plays the restriction effect of lifting upper and lower position.
It is responsible for placing wafer disks on wafer disks hand basket 21, wafer can be loaded in wafer disks, be arranged on supporting platform 22
For installing the wafer disks limiting devices 28 of wafer disks, the corner of supporting platform 22 is arranged in limiting device 28, and is arranged
To be multiple, and tensioning apparatus 23 uses spring structure, when placing wafer disks every time, by the effect of tensioning apparatus 23,
Wafer disks are rested firmly against at limiting device 28, the position of each wafer disks can be consistent.
Fig. 6 and Fig. 7 are please referred to, wafer compensation device 3 includes X-axis movement mould group 31, Y-axis movement mould group 32 and the movement of θ axis
Mould group 33, X-axis movement mould group 31 drive Y-axis movement mould group 32 to be displaced in the X-axis direction, and Y-axis moves mould group 32 and drives θ axis
Movement mould group 33 is displaced in the Z-axis direction.
In the present embodiment, X-axis movement mould group 31 is similar with Y-axis movement 32 structure of mould group, and X-axis moves mould group 31 by second
Driving motor 311, the second screw rod, the second feed screw nut and X-axis moving plate 312 are constituted, and Y-axis moves mould group 32 and drives electricity by third
Machine 321, third screw rod, third feed screw nut and Y-axis moving plate 322 are constituted, and X-axis moves mould group 31 and Y-axis movement mould group 32 is logical
Cross motor lead screw structure drives Y-axis movement mould group 32 and θ axis movement mould group 33 to be displaced respectively.
It includes θ axis supporting platform 331, the 4th driving motor 332, belt pulley set 333, wafer disks mother that θ axis, which moves mould group 33,
Ring 334, load ring pallet 335, wafer plate is carried to carry ring 336, carry ring guiding device 337, carry ring guide wheel device 338 and carry ring compression
Device 339, θ axis supporting platform 331 are equipped with wafer plate and carry ring 336, and the 4th transmission electricity is additionally provided on θ axis supporting platform 331
The output shaft of machine 332, the 4th driving motor 332 runs through θ axis supporting platform 331 and the belt pulley set 333 that is sequentially connected, belt pulley set
333 for adjusting, and wafer disks mother load ring 334 merges with the load matching of ring 336 of wafer plate to be set in outside wafer plate load ring 336
End, wafer disks mother carries ring 334 and wafer plate carries to be additionally provided between ring 336 and carries ring pallet 335, carries ring guiding device 337 and carries
The line position that is installed into that ring guide wheel device 338 carries ring 334 to wafer disks mother sets guiding, carries ring pressing device 339 for carrying out wafer
Disk mother carries ring 334, load ring pallet 335 and wafer plate and carries the relatively fixed of 336 position of ring.
Wafer disks mother is quickly carried into ring 334, load ring pallet by carrying ring guiding device 337 and carrying ring guide wheel device 338
335 and wafer plate carry ring 336 and fit together, and they are locked by carrying ring pressing device 339, and the 4th driving motor
332 at work, and belt pulley set 333 is driven to be driven, and then adjusting wafer disks mother carries ring 334 and wafer plate carries ring 336 and assembles
The tightness of load ring together, the load ring fitted together are clamped folder for installing wafer disks, and clamping wafer disks
It holds, under the action of X-axis moves mould group 31 and Y-axis movement mould group 32, carries out the fine tuning of X-axis and Y-axis position, realization takes crystalline substance before crystalline substance
The compensation correction of disk position.
Corresponding photoelectric sensor can be also arranged in wafer compensation device 3, when detecting wafer disks, first carry out wafer disks
Clamping fastener.
Fig. 8 and Fig. 9 are please referred to, self-correcting push pin device 4 includes X-axis self-correcting holotype group 41, Y-axis self-correcting holotype group 42, Z axis
Self-correcting holotype group 43 and thimble move mould group 44, X-axis self-correcting holotype group 41 drive Y-axis self-correcting holotype group 42 in the X-axis direction into
Line position is moved, and Y-axis self-correcting holotype group 42 drives Z axis self-correcting holotype group 43 to be displaced in the Y-axis direction, Z axis self-correcting holotype group 43
Thimble movement mould group 44 is driven to be displaced in the Z-axis direction.
In the present embodiment, X-axis self-correcting holotype group 41, Y-axis self-correcting holotype 42 structures of group are similar, X-axis self-correcting holotype group 41
It is made of the 5th driving motor 411, the 5th eccentric wheel drive mechanism, the 5th sized cross roller bearings 412 and X-axis movable plate 413, Y
Axis self-correcting holotype group 42 is by the 6th driving motor 421, the 6th eccentric wheel drive mechanism 422, the 6th sized cross roller bearings 423 and Y
Axis movable plate 424 is constituted, and X-axis self-correcting holotype group 41 and Y-axis self-correcting holotype group 42 pass through eccentric wheel structure and decussation roller axis
It holds and Y-axis self-correcting holotype group 42 and Z axis movement mould group 43 is driven to be displaced respectively.
Z axis movement mould group 43 is made of thimble movement the 7th driving motor 431, the 7th drive block 432 and the 7th sliding rail 433
Mould group 44 include the 8th driving motor 441, the 8th eccentric wheel drive mechanism 442, thimble 443 and thimble anticollision device, collision-prevention device 444, the 8th
Output shaft the 8th eccentric wheel drive mechanism 442 of transmission connection of driving motor 441, passes through the 7th sliding rail 433 and the 8th eccentric wheel
The cooperation of transmission mechanism 442 drives thimble 443 to move reciprocatingly in the Z-axis direction, is also provided at thimble 43 and the 7th sliding rail
433 the 7th sliding blocks 445 being slidably matched realize stable motion of the thimble 43 when moving reciprocatingly, correspondingly, the 7th
The side of sliding rail, which is provided with, moves back and forth the position sensor limited to thimble 43, is equipped with thimble anticollision at thimble 443 and fills
Set 444.
Figure 21 is please referred to, thimble 443 includes thimble cap 4431, thimble cap mounting base 4432, thimble guide rod 4433, fastening spiral shell
Cap 4434, thimble clamping jaw 4435 and syringe needle 4436, thimble cap mounting base 4432 are mounted on the top of the 7th sliding block 445, thimble cap
4431 fix with 4432 phase of thimble cap mounting base, and thimble guide rod 4433 slides up and down in thimble cap 4431, thimble guide rod 4433
Top syringe needle 4436 is fixed with by fastening nut 4434 and thimble clamping jaw 4435, be equipped at thimble cap 4431 for syringe needle 4436
The eyelet for stretching out or bouncing back under the driving of the 8th driving motor 441.Thimble anticollision device, collision-prevention device 444 include outer impact shell 4441,
Outer conducting ring 4442, interior conducting ring 4443, dead ring 4444 and vacuum tube joint 4445 are installed in thimble cap 4431 and thimble cap
The periphery of seat 4432 is equipped with outer impact shell 4441, and thimble cap mounting base 4432 and the upper and lower ends of outer impact shell 4441 all have one
Fixed gap, the outer wall of the upper part thimble cap mounting base 4432 of the two are covered with interior 4443. outer impact shell 4441 of conducting ring
Inner wall is covered with outer conducting ring 4432, and the end portion of the two is attached by dead ring 4444, and is also installed in thimble cap
The outer wall of seat 4432 is provided with spring stack 4446, under normal condition, spring stack 4446 and outer impact shell 4441 not in contact with.Thimble
Cap mounting base 4432 and outer impact shell 4441 all connect lead respectively, are one under the action of dead ring 4445 under normal state
Breaking positive outer impact shell 4441 plays the protective effect to thimble 443, and when thimble 443 is by external impacts, thimble cap
443 are subjected to displacement, and outer conducting ring 4442 and interior conducting ring 4443 will contact, and the two is connected to form a closed loop, pass through
It is electrically connected with warning device, carries out warning note, spring stack 4446 plays the role of buffering external force.Vacuum nozzle connector 4445
It is logical vacuum always in working condition, absorption chip ensures to be close to thimble cap 4431, can smoothly push up when syringe needle 4436 ejects
Chip out.
When the 7th driving motor 431 and the 8th driving motor 441 are started to work, thimble 443 can be driven relative to the
Seven sliding rails 433 move back and forth, i.e., move reciprocatingly relative to Z axis, and thimble 443 is convenient for subsequent suction nozzle for jacking up chip
64 absorption chips.X-axis self-correcting holotype group 41, Y-axis self-correcting holotype group 42 according to the position of suction nozzle 64 each in clamping and placing system 6, into
The X-axis of row chip and the self-correcting of Y-axis position.
Figure 10 and Figure 11 are please referred to, wafer disks grasp handling device 5 includes the 9th driving motor 51, carries screw rod 52, passes
Dynamic support plate 53, Pneumatic power elevator apparatus 54 and snap finger 55, the effect of wafer disks grasp handling device 5 is that wafer disks are grabbed and removed
It is transported in chip compensation device 3, screw rod 52 is carried in the output shaft transmission connection of the 9th driving motor 51, carries screw thread on screw rod 52
Feed screw nut is carried in connection, carries feed screw nut and is fixedly connected with transmission support plate 53, and the lower end of transmission support plate 53 is equipped with gas
Dynamic lifting device 54, Pneumatic power elevator apparatus 54 can be cylinder, and the output shaft of Pneumatic power elevator apparatus 54 is connected with snap finger 55.
When the 9th driving motor 51 is started to work, the 9th driving motor 51, which drives, carries the rotation of screw rod 52, and then drives
Transmission support plate 53 is axially moved along screw rod 52 is carried, and correspondingly, can be arranged at screw rod 52 carrying to transmission branch
The position sensor that 53 running track of fagging is limited realizes the adjusting of 53 position of transmission support plate, for removing crawl wafer
Disk completes the movement for picking up wafer disks by the driving snap finger 55 of Pneumatic power elevator apparatus 54, later equally when reaching designated position
Wafer disks are carried in wafer compensation device 3 by ground by the 9th driving motor 51, and then snap finger 55 can unclamp wafer disks, wafer
Disk grasp handling device 5 resets, and waiting acts next time.
Figure 12 and Figure 13 are please referred to, capstan head clamping and placing system 6 includes swing arm drive motor 61, chip pick-and-place swing arm set 62, inhales
Mouth 63, swing arm linear guide 64, Z axis wafer hold-down devices 65, Z axis braid hold-down devices 66 and vacuum distribution 67,
Swing arm drive motor 61 is DDR series direct driving motor, and the output axis connection chip of swing arm drive motor 61 picks and places swing arm set 62, core
Piece picks and places multiple swing arms that swing arm set 62 includes circle distribution, by DDR series direct driving motor and more set swing arms 62 and 64 groups of suction nozzle
At capstan head clamping and placing system 6, the distribution of Cheng Weixing shape, DDR series direct driving motor drive suction nozzle 64 using 360/n ° (n is swing arm 62
Quantity) rotating operation, successively picks up chip from wafer disks.The front end of each swing arm is equipped with suction nozzle 64, vacuum distribution
67 are connected to suction nozzle 64, and provide adsorption capacity for suction nozzle 64, in each swing arm on be additionally provided with swing arm linear guide 64, putting
The both ends of arm driving motor 61 are respectively symmetrically equipped with wafer video detection device 8, braid video detection device 9, in wafer video
Detection device 8, braid video detection device 9 side be also respectively provided under Z axis wafer hold-down devices 65 and Z axis braid and be pressed
66 are set, wafer video detection device 8, braid video detection device 9 are pressed under Z axis wafer hold-down devices 65, Z axis braid respectively
66 electric connections are set, and control Z axis wafer hold-down devices 65, Z axis braid hold-down devices 66 respectively.
In the present embodiment, Z axis wafer hold-down devices 65, the structure of Z axis braid hold-down devices 66 are similar, be cylinder or
The elevating mechanisms such as person's hydraulic cylinder, wherein the output shaft with chip of Z axis wafer hold-down devices 65 pick and place swing arm set 62 and are fixedly connected, i.e.,
Z axis wafer hold-down devices 65 can drive chip pick and place swing arm set 62 pushing or move up, Z axis braid hold-down devices 66 it is defeated
Shaft is for depressing braid or unclamps braid, captures in advance to the location parameter of required braid, and suction nozzle 63 is used for vacsorb
Chip.
Also interval is provided with and abandons recycling magazine 11 and defective product recycling magazine 12 below swing arm linear guide 64.
The chip of capstan head clamping and placing system 6 picks and places swing arm set 62, under the action of Z axis wafer hold-down devices 65, under suction nozzle 64
It presses and is contacted with chip, thimble 443 is responsible for jacking up chip, and Z axis wafer hold-down devices 65 are lifted at this time, and vacuum distribution 67 is right
Suction nozzle 64, which vacuumizes, provides adsorption capacity for suction nozzle 64, suction nozzle 64 can vacuum suction chip, realize and pick up chip.
When the chip that suction nozzle 64 adsorbs is sent to bottom video detection system 10, bottom video detection system is responsible for detection
The defects of appearance of chip, electrode, breakage.The defective products detected will abandon in defective product recycling magazine 12 in lower process,
Detailed process is chip adsorb when suction nozzle 64, when by screening being defective products, when by defective product recycling magazine 12, and non-defective unit general
Next procedure is flowed into, defective products then forms positive pressure to the ventilation of suction nozzle 64 by vacuum distribution 67, so that defective products is from suction nozzle 64
Place, which is blown down, to fall off, and abandons in defective product recycling magazine 12.In the rotary course of suction nozzle 64, braid sealing system have passed through
When, chip is accurately put into carrier band and carries out braid encapsulation, a braid packaging process can be referred to as in this way, in the rotary type tower
When the swing arm drive motor 61 of chip braider is resetted, midway shutdown is switched on again etc., suction nozzle 64 can may also adsorb core
Piece, these chips may be non-defective unit, it is also possible to not be non-defective units, but take brilliant position when suction nozzle 64 is rotated to normal chip in this way
When, can not adsorb new chip, therefore when be moved to abandon recycling magazine 11 when, vacuum distribution 67 ventilates shape to suction nozzle 64
It at positive pressure, falls off so that defective products is blown down from suction nozzle 64, the effect for abandoning recycling magazine 11 is to recycle these chips.
When the chip that suction nozzle 64 adsorbs is sent to braid sealing system, braid video detection system is in advance to required braid
Location parameter capture, swing arm 62 with capstan head clamping and placing system 6 and the integration of 64 location parameter of suction nozzle, to braid sealing system
Carry the correction of position compensated in advance.
Offset parameter is photographed to record through bottom video detection system, in conjunction with braid video detection system to being placed
Location parameter record is carried, by braid sealing system, compensation is modified to carrier band position, last suction nozzle 64 is accurate by chip
Be put into carrier band carry out braid encapsulation, realize chip high speed space transfer braid packaging technology requirement.
Figure 14 and Figure 15 are please referred to, chip braid sealing device 7 includes braid transmission device, lid belt driver, sealing
Device 76 and finished product closing quotation device, braid transmission device include braid driving motor 71, live-roller 72 and braid, braid transmission electricity
Machine 71 drives live-roller 72 to rotate by braid drive coordination band, and braid drives braid transmission, and lid belt driver includes lid band
Disk 73, rocking bar relieving mechanism 74 cover band tensioning apparatus 75 and lid band, are wound with lid band, rocking bar relieving mechanism 74 on lid tep reel 73
For the tightness for being used to adjust lid band with tensioning apparatus 75 being covered, so that lid band and transplanting from release cap band on lid tep reel 73
The braid of wafer is contacted, and sealing device 76 is heating sealing device, for braid, lid band and wafer to be packaged,
Finished product closing quotation device includes finished disk 77, and one end of braid is driven on live-roller 76, and the other end is gradually wrapped in finished disk 77
On, finished disk 77 is accordingly drivingly connected with finished product disk-drive motor, and finished product disk-drive motor drives finished disk 77 opposite
Braid driving motor 71 rotates synchronously, and is convenient for the winding of finished product.
The hot pressing temperature control device for carrying out braid sealing parameter setting, air pressure are also set up at chip braid sealing device 7
Regulating device, air pressure display instrument and emergency braking device.
Chip braid sealing device 7 further includes braid feeding inlet, cassette tape warning device and carrier band cleaning mechanism 78, and braid enters
Material mouth has also been correspondingly arranged the photoelectric sensor for carrying out braid pan feeding detection in braid feeding inlet, has blocked for supplying braid
Band warning device is photoelectric sensor, and for alarming when detecting braid cassette tape, carrier band cleaning mechanism 78 is four
It is dispersed with several air blowing apertures ring-like tunnel-like part week, when the carrier band that encapsulation finishes is run at this, can will carry
The dust or sundries of upper adherency are clean, it is ensured that chip product braid encapsulates clean.
Before packaging process, chip braid sealing device 7 is also provided with encapsulation video detection device 79, for before encapsulating most
The primary detection to chip afterwards.
Figure 16 and Figure 17 are please referred to, detection system includes wafer video detection device 8, braid video detection device 9, bottom
Video detection device 10 and encapsulation video detection device 79, wafer video detection device 8, braid video detection device 9, bottom view
As the core component of detection device 10 and encapsulation video detection device 14 is technical grade CCD camera.
By taking bottom video detection device 10 as an example, the camera lens 101 of each technical grade CCD camera has been correspondingly arranged top light
Source 102, bottom light source 103 and plane mirror group 104 are also provided with industry for the ease of completing the detection work to chip
The grade displacement adjustable plate 105 of CCD camera, the DOCK LEVELER 106 for adjusting whole height and for adjusting integral planar position
That sets moves horizontally plate 107.
Figure 18, Figure 19 and Figure 20 are please referred to, the workflow of the rotary type tower chip braider are as follows:
S1) wafer disks equipped with chip are placed on wafer disks hand basket lifting device 2, and wafer disks hand basket lifting device 2 will
Automatic running to setting position, waiting takes wafer disks；
S2 the photoelectric sensor) being supported on platform 22 detects wafer disks, and wafer disks grasp handling device 5 grabs wafer disks
It send to wafer compensation device 3；
S3) corresponding photoelectric sensor can be also arranged in wafer compensation device 3, when detecting wafer disks, first by wafer disks
Clamping fastener is carried out, according to the position parameter data that wafer video detection system 8 provides, wafer compensation device carries out taking brilliant anteposition
Set compensation correction；
S4) self-correcting push pin device 4 carries out X-axis and Y-axis position according to each swing arm 62 and the position of suction nozzle 64
Correction and thimble 443 are run to holding fix；
S5) swing arm 62 of capstan head clamping and placing system 6 and suction nozzle 64, under the action of Z axis wafer press mechanism 65, under suction nozzle
It presses and is contacted with chip, thimble 443 jacks up chip, and Z axis wafer press mechanism 65 lifts, and 64 vacuum suction of suction nozzle simultaneously picks up core
Piece；
S6) when the chip that suction nozzle 64 adsorbs is sent to bottom video detection system 10, bottom video detection system is responsible for
The defects of appearance of detection chip, electrode, breakage.The defective products detected will be abandoned in lower process in defective product recycling magazine 12
In；
S7) when the chip that suction nozzle 64 adsorbs is sent to braid sealing system, braid video detection device 9 is in advance to required
The location parameter of braid captures, and swing arm 62 and the integration of 64 location parameter of suction nozzle with capstan head clamping and placing system 6 seal system to braid
The carrier band position compensated in advance of system corrects；
S8) under the action of Z axis braid press mechanism 66, chip is implanted in carrier band by swing arm 62 and corresponding suction nozzle 64
On, after encapsulated video detection device 79 detects, packaging by hot pressing is carried out together with lid band, carries out reel receipts according to certain quantity
Collection is finished product output；
S9) to carrier band cleaning mechanism, carrier band cleaning mechanism is shut down when equipment midway for the operation of swing arm 62 of capstan head clamping and placing system 6
Or when device reset, the chip of institute's band on suction nozzle 64 is subjected to clearing and retrieving and avoids mixing.
In conclusion the present invention has the advantages that using plurality of pendulums arm, more nozzle structures, in conjunction with DDR series direct driving motor
Rotary type tower chip braider, continuously can accurately take crystalline substance from the wafer disks of blue film, at the same accurately be put into carrier band carry out
Braid encapsulation, realizes the high-speed paster of chip high speed space transfer, can be realized and continuously takes brilliant, detection, braid from wafer disks
The processes such as encapsulation, can satisfy semiconductor chip high speed, high-precision, the chip class production packaging technology of high reliability and want
It asks, meanwhile, which has wafer hand basket automatic loading/unloading, realizes that wafer automatically supplies and recycles function automatically, greatlys save
Manpower improves production efficiency；In addition in terms of equipment cost, manufacturing cost is lower with respect to overseas equipment, can be applicable in
In the fund tolerance range of Small and Medium Manufacturing Enterprises, production demand is opened up in the development for being conducive to medium-sized and small enterprises.
As known by the technical knowledge, the present invention can pass through the embodiment party of other essence without departing from its spirit or essential feature
Case is realized.Therefore, embodiment disclosed above, in all respects are merely illustrative, not the only.Institute
Have within the scope of the present invention or is included in the invention in the change being equal in the scope of the present invention.
Claims (10)
1. a kind of rotary type tower chip braider, which is characterized in that including loading and unloading system, rectification building-out system, clamping and placing system, volume
Band sealing system and detection system；
Wherein, the loading and unloading system is loaded with the wafer disks of chip to designated position for transporting, and by vacant wafer
Disk resets, to load chip；
The rectification building-out system for grabbing the wafer disks, and finely tunes the position of wafer disks；
The clamping and placing system carries out the transfer of chip position for picking up and transporting the chip in wafer disks；
The braid sealing system receives the chip transported from clamping and placing system, carries out braid encapsulation；
Detection system for filtering out non-defective unit and defective products in chip, and rejects defective products chip therein.
2. a kind of rotary type tower chip braider according to claim 1, it is characterised in that: the loading and unloading system includes crystalline substance
Disk hand basket lifting device (2), the wafer disks hand basket lifting device (2) include wafer disks hand basket (21), supporting platform (22),
Tensioning apparatus (23), lifting base (24) and lifting drive, the lifting base (24) are equipped with lifting driving dress
It sets, lifting drive includes the first driving motor (25), the first synchronous belt (26) and drive lead screw (27), first driving
The output shaft drive connection of motor (25) has the first driving wheel, and first driving wheel is driven by first synchronous belt (26)
The first driven wheel is connected, first driven wheel is fixedly connected with the drive lead screw (27), and screw thread connects on drive lead screw (27)
It is connected to drive lead screw nut, the drive lead screw nut is fixedly connected with slide plate, and the slide plate and the supporting platform (22) are solid
Fixed connection, the wafer disks hand basket (21) are arranged on the upper surface of supporting platform (22), and one end of supporting platform (22) is equipped with
The tensioning apparatus (23).
3. a kind of rotary type tower chip braider according to claim 1, it is characterised in that: the rectification building-out system includes
Wafer compensation device (3), self-correcting push pin device (4) and wafer disks grasp handling device (5), wherein；
The wafer compensation device (3) includes that X-axis movement mould group (31), Y-axis movement mould group (32) and θ axis move mould group (33),
X-axis movement mould group (31) drives Y-axis movement mould group (32) to be displaced in the X-axis direction, and Y-axis moves mould group (32)
θ axis movement mould group (33) is driven to be displaced in the Z-axis direction, it includes θ axis supporting platform that θ axis, which moves mould group (33),
(331), the 4th driving motor (332), belt pulley set (333), wafer disks mother carry ring (334), carry ring pallet (335), wafer disks
Son carries ring (336), carries ring guiding device (337), carries ring guide wheel device (338) He Zaihuan pressing device (339), the θ axis branch
It supports microscope carrier (331) and is equipped with wafer plate load ring (336), the 4th transmission electricity is additionally provided on θ axis supporting platform (331)
The output shaft of machine (332), the 4th driving motor (332) runs through the θ axis supporting platform (331) and the belt pulley that is sequentially connected
Group (333), for adjusting, the wafer disks mother carries ring (334) and matches with wafer plate load ring (336) belt pulley set (333)
And be set in wafer plate and carry ring (336) outer end, wafer disks mother carries ring (334) and wafer plate is carried and is additionally provided between ring (336)
The load ring pallet (335), the load ring guiding device (337) and the load ring guide wheel device (338) carry ring to wafer disks mother
(334) the line position that is installed into sets guiding, and the load ring pressing device (339) carries ring (334) for carrying out wafer disks mother, carries ring support
Disk (335) and wafer plate carry the relatively fixed of ring (336) position；
The self-correcting push pin device (4) includes X-axis self-correcting holotype group (41), Y-axis self-correcting holotype group (42), Z axis self-correcting holotype
Group (43) and thimble movement mould group (44), the X-axis self-correcting holotype group (41) drive the Y-axis self-correcting holotype group (42) in X-axis
The enterprising line position in direction is moved, and Y-axis self-correcting holotype group (42) drives the Z axis self-correcting holotype group (43) to be displaced in the Y-axis direction,
Z axis self-correcting holotype group (43) drives thimble movement mould group (44) to be displaced in the Z-axis direction, and thimble moves mould group (44)
Including the 8th driving motor (441), the 8th eccentric wheel drive mechanism (442), thimble (443) and thimble anticollision device, collision-prevention device (444), institute
State output shaft transmission connection the 8th eccentric wheel drive mechanism (442) of the 8th driving motor (441), the transmission of the 8th eccentric wheel
Mechanism (442) drives the thimble (443) to move reciprocatingly in the Z-axis direction, and it is anti-that the thimble is equipped at the thimble (443)
Collision device (444)；
The wafer disks grasp handling device (5) includes the 9th driving motor (51), carries screw rod (52), transmission support plate
(53), Pneumatic power elevator apparatus (54) and snap finger (55), the output shaft transmission connection carrying of the 9th driving motor (51)
Screw rod (52) is carried to be threadedly coupled on screw rod (52) and carries feed screw nut, the carrying feed screw nut and the transmission support plate
(53) it is fixedly connected, the lower end of transmission support plate (53) is equipped with the Pneumatic power elevator apparatus (54), Pneumatic power elevator apparatus (54)
Output shaft is connected with the snap finger (55).
4. a kind of rotary type tower chip braider according to claim 1, it is characterised in that: the clamping and placing system includes capstan head
Clamping and placing system (6), the capstan head clamping and placing system (6) include swing arm drive motor (61), chip pick-and-place swing arm set (62), suction nozzle
(63), swing arm linear guide (64), Z axis wafer hold-down devices (65), Z axis braid hold-down devices (66) and vacuum distribution dress
It sets (67), chip described in the output axis connection of the swing arm drive motor (61) picks and places swing arm set (62), and the chip picks and places pendulum
Arm group (62) includes multiple swing arms of circle distribution, and the front end of each swing arm is equipped with the suction nozzle (64), the vacuum
Distributor (67) is connected to suction nozzle (64), and provides adsorption capacity for suction nozzle (64), in each swing arm on be additionally provided with swing arm straight line
Guiding device (64) is respectively symmetrically equipped with the Z axis wafer hold-down devices (65) and institute at the both ends of swing arm drive motor (61)
State Z axis braid hold-down devices (66).
5. a kind of rotary type tower chip braider according to claim 4, it is characterised in that: the swing arm drive motor (61)
For DDR series direct driving motor.
6. a kind of rotary type tower chip braider according to claim 1, it is characterised in that: the braid sealing system includes
Chip braid sealing device (7) include braid transmission device, lid belt driver, sealing device (76) and finished product closing quotation device,
The braid transmission device includes braid driving motor (71), live-roller (72) and braid, and the braid driving motor (71) is logical
It crosses braid drive coordination band and drives live-roller (76) rotation, the braid drives the braid transmission, the lid V belt translation
Device includes lid tep reel (73), rocking bar relieving mechanism (74), lid band tensioning apparatus (75) and lid band, is twined on the lid tep reel (73)
It is wound with the lid band, the rocking bar relieving mechanism (74) is used for from release cap band on lid tep reel (73), the lid band tensioning apparatus
(75) for adjusting the tightness of lid band, so that lid band is contacted with the braid for having transplanted the chip, the sealing dress
(76) are set as heating sealing device, for braid, lid band and chip to be packaged, the finished product closing quotation device includes finished disk
(77), one end of braid is driven on live-roller (76), and the other end is gradually wrapped on finished disk (77).
7. a kind of rotary type tower chip braider according to claim 6, it is characterised in that: the braid sealing system also wraps
Braid feeding inlet, cassette tape warning device and carrier band cleaning mechanism (78) are included, the braid feeding inlet is for supplying the braid, institute
Stating cassette tape warning device is photoelectric sensor, for alarming when detecting braid cassette tape, the carrier band cleaner
Structure (78) is used to clean the chip that encapsulation is completed.
8. a kind of rotary type tower chip braider according to claim 4, it is characterised in that: the detection system includes wafer
Video detection device (8), braid video detection device (9) and bottom video detection device (10), the wafer video detection dress
The core component for setting (8), braid video detection device (9) and bottom video detection device (10) is technical grade CCD camera.
9. a kind of rotary type tower chip braider according to claim 8, it is characterised in that: the wafer video detection device
(8), the braid video detection device (9) respectively with the Z axis wafer hold-down devices (65), the Z axis braid hold-down devices
(66) it is electrically connected, and controls Z axis wafer hold-down devices (65), Z axis braid hold-down devices (66) respectively.
10. a kind of rotary type tower chip braider according to claim 4, it is characterised in that: in the swing arm straight-line guidance
Also interval is provided with and abandons recycling magazine (11) and defective product recycling magazine (12) below device (64).
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| CN201910485751.XA CN110194290A (en) | 2019-06-05 | 2019-06-05 | A kind of rotary type tower chip braider |
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| CN201910485751.XA CN110194290A (en) | 2019-06-05 | 2019-06-05 | A kind of rotary type tower chip braider |
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