JP5548843B2 - Electronic component inspection device and tray transfer device - Google Patents

Description

  The present invention relates to an electronic component inspection apparatus that performs various processes while supplying and transporting electronic components to a transport mechanism, and a tray transfer device that transfers electronic components to a tray.

  Electronic components (devices) such as semiconductor elements are separated into individual pieces through various assembly processes such as dicing, mounting, bonding, and sealing, and then post-processes such as various inspections are performed on tapes and container tubes. Packaged and shipped. Post-processing includes marking processing, appearance inspection, electrical property inspection, classification of electronic components, and packaging.

  This post-process is mainly performed by an electronic component inspection apparatus that performs various inspections while conveying the electronic component. The electronic component inspection apparatus includes a transport mechanism that forms a processing path for processing the electronic component, various process processing mechanisms on the processing path, a device supply device that supplies the electronic component to the transport mechanism, and a termination of the processing path. It is comprised by the device accommodating apparatus which accommodates an electronic component (for example, refer patent document 1).

  There are various types of device supply apparatuses such as a system in which a large number of electronic components accommodated in a mortar-shaped container are aligned and conveyed by vibration and supplied to a conveyance mechanism, a rotary pickup system, a tray transfer system, and the like. In addition, there are various types of device storage devices such as a taping unit system that stores electronic components on a tape, a tube system that stores electronic components in a tube, and a tray transfer system that stores electronic components in a tray.

  Here, an example of the tray transfer type will be briefly described with reference to FIGS. FIG. 7 is a schematic top view of the tray transfer device. FIG. 8 is a schematic side view of the tray transfer device.

  The tray transfer device picks up the electronic components one by one from the tray 100 in which the electronic components are arranged on the array, and passes them to the transport mechanism.

  As shown in FIG. 7, in this tray transfer apparatus, a tray 100 on which electronic components are arranged is stepped in a supply waiting area 411. From the supply waiting area 411, the trays 100 to be picked up by electronic components are transferred to the supply destination area 412 one by one. The emptied tray 100 is stacked in the discharge area 413 after electronic components are picked up.

  In the supply destination area 412, the multiple adsorption nozzles 51 can move. The suction nozzle 51 has ten or more nozzles in a direction connecting the supply destination area 412 and the processing table 21 constituting the transport mechanism of the electronic component inspection apparatus, and a vacuum is generated inside the nozzle pipe. Alternatively, when the vacuum is broken, the electronic component can be sucked or separated.

  The suction nozzle 51 moves onto the tray 100, holds electronic components, and moves to the replacement area 53. In the replacement area 53, the replacement stage 52 is waiting. The suction nozzle 51 places an electronic component on the replacement stage 52.

  The replacement stage 52 on which the electronic component is mounted moves to a first position 414 immediately below the outer peripheral end of the processing table 21. A holding unit 3 that holds an electronic component is disposed at the outer peripheral end of the processing table 21, and the first position 414 is a stop position of the holding unit 3. The holding means 3 is, for example, a suction nozzle that sucks an electronic component by generating a vacuum and detaches the electronic component by breaking the vacuum. The holding means 3 stopped at the first position 414 holds the electronic component of the transfer stage 52.

  As shown in FIG. 8, the tray transfer apparatus often includes two replacement stages 52 for increasing the supply speed of electronic components. While one replacement stage 52 moves to the first position 414 and an electronic component is picked up, the other replacement stage 52 waits in the transfer area 53 and receives the electronic component from the suction nozzle 51. Yes.

  The two transfer stages 52 change places in the vertical direction of the tray transfer device. Specifically, one transfer stage 52 is movable up and down with an air cylinder 56 attached thereto, and can be moved between the transfer area 53 and the first position 414 by a ball screw 55. Yes. Similarly, the other transfer stage 52 is mounted with an air cylinder 58 and can be moved up and down, and can be moved between the transfer area 53 and the first position 414 by a ball screw 57. More specifically, the ball screws 55 and 57 are disposed in parallel between the replacement area 53 and the first position 414, and an air cylinder 56 that vertically moves one of the replacement stages 52 is provided in the replacement area. 53 and a first position 414 are movable, and an air cylinder 58 for moving the other replacement stage 52 up and down is provided between the replacement area 53 and the first position 414 on the ball screw 57. Can be moved.

  The replacement stage 52 that has been waiting in the replacement area 53 is moved to the first position 414 by the ball screw 55. The replacement stage 52 that has been waiting at the first position 414 is lowered by the air cylinder 56, is positioned immediately below the transfer area 53 by the ball screw 57, and is moved again to the replacement area 53 by the air cylinder 58.

  As described above, the replacement stage 52 includes the ball screw 55, the air cylinder 56, the ball screw 57, the air between the replacement area 53 where the electronic components are placed and the first position 414 where the electronic components are picked up. The cylinder 58 moves back and forth.

  The above is an example in which a tray transfer device is applied to a device supply device. When the tray transfer device is applied to the device storage device, all the above operations are reversed, the first position 414 becomes the replacement position, and the replacement area 53 becomes the storage area for the tray 100. Specifically, the holding means 3 on the processing table 21 side that forms the processing path causes the electronic component to be detached from the replacement stage 52. The replacement stage 52 at the first position 414 moves to the transfer destination area 53 with the ball screw 55, and the suction nozzle 51 holds electronic components from the replacement stage 52 in the replacement area 53 and waits in the supply destination area 412. The electronic component is detached from the tray 100 that is being operated.

JP 2009-286490 A

  The conventional tray transfer device requires two actuators, that is, two ball screws 55 and 57 and two air cylinders 56 and 58, because the two transfer stages 52 are replaced in the vertical direction. I was trying. For this reason, the increase in the number of parts and the complexity of the apparatus have led to high costs. Further, in recent years, while the digitization of various devices is rapidly progressing, the method of replacing the two replacement stages 52 while avoiding the possibility of a collision has a limit in increasing the production speed of electronic components. It was.

  The present invention has been proposed in order to solve the above-described problems of the prior art, and provides an electronic component inspection apparatus and a tray transfer apparatus that reduce costs and increase the production speed of electronic components. For the purpose.

An electronic component inspection apparatus according to the present invention is an electronic component inspection apparatus that performs various process processing by placing electronic components arranged in a tray on a processing process, and holds a first electronic component having a first position. Holding means, the first holding means, and a conveying means for forming a processing path for the electronic component held by the first holding means, arranged in line with the processing path, and the first Various process processing means for performing various processes on the electronic component conveyed by the conveying means while being held by the holding means; and a second process for obtaining the electronic component from the tray and separating it at a second position. Holding means, a turret table that includes the first position and the second position on a rotation trajectory, receives the electronic component detached at the second position, and rotates the electronic component to the first position, and the turret Straight on the table And a transfer means for transferring the tray, wherein the turret table is positioned above the turret table, and a plurality of motors for rotating the turret table are arranged radially, and the first turret table is rotated along with the rotation. And an arm passing over the second position, the second holding means moves up and down over the second position, and the rotation of the turret table causes the second position to move to the second position. The arm passes through the turret table when the arm is not present, acquires the electronic component from the tray immediately below, and the arm exists when the arm is present at the second position during the rotation of the turret table. The electronic component is placed on the board .

  You may make it further provide the external appearance test | inspection means which images one point on the rotation locus of the said electronic component mounted in the said arm.

An electronic component inspection apparatus according to the present invention is an electronic component inspection apparatus that performs various process processes and arranges processed electronic components on a tray, and is arranged along a processing path. Various process processing means for performing processing, transport means for forming the processing path and transporting the electronic component to the various process processing means, and disposed at the transport means, the electronic component at the first position The first holding means for separating from the conveying means, the first position and the second position are included on the rotation locus, and the electronic component detached at the first position is received and rotated to the second position. a turret table that acquires the electronic component at the second position comprises a second holding means to detach the said trays, and a transfer means for transferring the tray directly below the turret table, said Tarettote The bull is positioned above the turret table, and a motor that rotates the turret table, and a plurality of radially arranged arms that pass over the first position and the second position in accordance with the rotation, And the second holding means moves up and down on the second position, and picks up the electronic component from the arm when the arm exists at the second position during rotation of the turret table. And while the said turret table is rotating, when the said arm does not exist in the said 2nd position, it passes through the said turret table, The said electronic component is made to detach | leave to the said tray directly under, It is characterized by the above-mentioned .

The tray transfer apparatus according to the present invention is an electronic component inspection apparatus that performs various process processes while transporting the electronic component by a transport unit having a first holding unit that holds the electronic component at the first position. against it, a tray transfer device for supplying a sequence electronic components in a tray, and a second holding means to detach at a second location to obtain the electronic component from said tray, said on a rotation locus A turret table that includes the first position and the second position, receives the electronic component detached at the second position and rotates the electronic component to the first position, and a transfer for transferring the tray directly below the turret table Means, and the turret table is located above the turret table, and a plurality of motors that rotate the turret table are arranged radially, and the first position is accompanied with the rotation. And an arm passing over the second position, wherein the second holding means moves up and down over the second position, and the arm exists at the second position during the rotation of the turret table. The electronic component is obtained from the tray directly below the turret table, and when the arm is in the second position during rotation of the turret table, the electronic It is characterized by mounting parts.

  You may make it further provide the external appearance test | inspection means which images one point on the rotation locus of the said electronic component mounted in the said arm.

Further, the tray transfer apparatus according to the present invention is an electronic component inspection apparatus having a first holding unit that performs various process processes while conveying an electronic component by a conveying unit and detaches the electronic component at the first position. On the other hand, a tray transfer device that accommodates the electronic component that has been detached from the tray, the electronic component including the first position and the second position on a rotation trajectory and detached at the first position. A turret table that receives and rotates to the second position, a second holding means that acquires the electronic component at the second position and separates it into the tray, and transports the tray directly below the turret table The turret table is located above the turret table, and a plurality of motors are arranged radially to rotate the turret table. The second holding means is moved up and down on the second position, and is rotated to the second position during rotation of the turret table. The arm passes through the turret table when the arm is not present, acquires the electronic component from the tray immediately below, and the arm exists when the arm is present at the second position during the rotation of the turret table. The electronic component is placed on the board .

  According to the present invention, the number of actuators for supplying electronic components to the processing path can be greatly reduced, and the reduction of component constants and simplification of the apparatus can be achieved, resulting in a significant cost reduction. In addition, since the supply interruption of the electronic component can be eliminated and the supply process can be continued, the production efficiency of the electronic component is improved.

It is a figure which shows schematic structure of an electronic component inspection apparatus. It is a figure which shows schematic structure of a conveyance mechanism. It is a schematic side view of a tray transfer apparatus. It is a perspective view which shows the 1st state of a tray transfer apparatus. It is a perspective view which shows the 2nd state of a tray transfer apparatus. It is a perspective view which shows an external appearance test | inspection means. It is a schematic top view which shows the conventional tray transfer apparatus. It is a schematic side view which shows the conventional tray transfer apparatus.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of an electronic component inspection apparatus and a tray transfer apparatus according to the present invention will be described in detail with reference to the drawings. First, the configuration of the electronic component inspection apparatus will be described with reference to FIGS. FIG. 1 is a diagram showing a schematic configuration of an electronic component inspection apparatus. FIG. 2 is a diagram illustrating a schematic configuration of the transport mechanism. In addition, about the same structure as the past, the same name and code | symbol are attached | subjected, and the detailed description is abbreviate | omitted.

(Electronic component inspection equipment)
The electronic component inspection apparatus 1 according to the present embodiment is an apparatus that performs various process processes while aligning and conveying the electronic component D. The electronic component D is a component used for an electrical product, and includes a semiconductor element. Examples of the semiconductor element include discrete semiconductors such as transistors, diodes, capacitors, resistors, and integrated circuits. The various process processes are inspection processes after passing through assembly processes such as dicing, mounting, bonding, and sealing, and include marking, appearance inspection, test contact, classification sorting, packaging, and the like.

  The electronic component inspection apparatus 1 includes various process processing mechanisms 4 for the electronic component D and a transport mechanism that transports the electronic component D to the various process processing mechanisms 4. The transport mechanism includes a processing table 21 that forms a processing path. The center of the processing table 21 is supported by the drive shaft of the direct drive motor 22 disposed below. The processing table 21 rotates intermittently at a predetermined angle as the direct drive motor 22 is driven.

  A plurality of holding means 3 for holding the electronic component D are attached to the outer peripheral end of the processing table 21 at regular intervals along the outer periphery of the processing table 21. In this transport mechanism, the outer periphery of the processing table 21 serves as a processing path for the electronic component D. The transport mechanism holds the electronic component D by the holding means 3, aligns it on the outer periphery of the processing table 21, and rotates the processing table 21 to transport the electronic component D in the outer peripheral direction. The arrangement interval of the holding means 3 is equal to the rotation angle of 1 pitch of the processing table 21.

  The holding means 3 includes a suction nozzle 31 that sucks and removes the electronic component D. The suction nozzle 31 can be moved up and down with respect to the processing table 21 by a support portion 32 attached to the outer peripheral end of the processing table 21. A drive unit 33 including an operation rod 34 is disposed immediately above the suction nozzle 31. When the operation rod 34 contacts the upper end of the suction nozzle 31 and is pushed downward, the suction nozzle 31 is lowered. The inside of the pipe of the suction nozzle 31 communicates with a pneumatic circuit of a vacuum generator (not shown). The suction nozzle 31 sucks the electronic component D by generating a negative pressure and releases the electronic component D by vacuum break.

  Various process processing mechanisms 4 surround the processing table 21 and are arranged at equal intervals in the outer circumferential direction. The arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the processing table 21. The arrangement positions of the various process processing mechanisms 4 coincide with the stop positions P of the holding means 3. Each of the various transport processing mechanisms is arranged at each stop position P. If the number of stop positions is equal to or greater than the number of transport processing mechanisms 4, these numbers may not be the same, and there may be a stop position P where the transport processing mechanism 4 is not disposed.

  As the various process processing mechanisms 4, for example, the device supply device 41, the test contact device 42, the marking unit 43, the appearance inspection device 45, the sorting / sorting mechanism 46, the device storage device 47, A non-defective product discharging device 48 is arranged.

  The device supply apparatus 41 is an apparatus that supplies the electronic component D to the electronic component inspection apparatus 1. A first position is set at one point on the outer peripheral end of the processing table 21, and a large number of electronic components are reached up to the first position. D is aligned and fed continuously. The test contact device 42 has a contact made of a metal such as a plate such as beryllium copper or a pin, and contacts the lead D1 of the electronic component D so that an electric current flows or a voltage is applied, The electrical characteristics such as voltage, current, resistance, or frequency of the component D are measured and inspected.

  The marking unit 43 has a lens for laser irradiation facing the electronic component D, and performs marking by irradiating the electronic component D with a laser. The appearance inspection apparatus 45 has a camera, images the electronic component D, and inspects the presence or absence of an electrode shape, surface defects, scratches, dirt, foreign matter, and the like of the electronic component D from the image.

  The classification / sorting mechanism 46 classifies the electronic component D into a defective product and a non-defective product according to the results of the appearance inspection and the electrical property inspection, and classifies and shoots according to the level. The device housing device 47 is a device that houses the electronic component D from the electronic component inspection device 1, and a first position is set at one point on the outer peripheral end of the processing table 21, and the electronic component D is moved from the first position. It is stored in the tray 100. The defective product discharge device 48 discharges the electronic component D that has not been accommodated in the tray 100 from the electronic component inspection device 1.

(Device supply equipment)
Based on FIG. 3 thru | or FIG. 5, the device supply apparatus 41 which concerns on this embodiment is demonstrated still in detail. FIG. 3 is a side view of the device supply apparatus 41, and FIG. 4 is a perspective view of the device supply apparatus 41 in the first state. FIG. 5 is a perspective view of the device supply apparatus 41 in the second state.

  The device supply apparatus 41 is a tray transfer type. The trays 100 stacked in the supply waiting area 411 illustrated in FIG. 7 are conveyed to the supply destination area 413. The empty tray 100 is conveyed to the discharge area 413. As shown in FIG. 3, the device supply apparatus 41 includes a replacement table 416 and a holding unit 3a.

  The replacement table 416 is a turret table on which the electronic component D on the tray 100 is replaced. The electronic component D is supplied from the tray 100 through the replacement table 416 to the processing path formed by the processing table 21.

  The center of the replacement table 416 is supported by a drive shaft of a direct drive motor 417 disposed above. The replacement table 416 rotates intermittently at a predetermined angle as the direct drive motor 417 is driven.

  As shown in FIG. 4, the replacement table 416 includes a plurality of arms 418. The plurality of arms 418 extend radially away from the central axis supported by the direct drive motor 417 at an equal angle. An electronic component D is placed on the tip of the arm 418.

  A first position 414 and a second position 415 are set on the rotation trajectory through which the outer peripheral end of the transfer table 416 passes, that is, on the rotation trajectory of the tip of the arm 418. In the device supply apparatus 41, the second position 415 is a position where the electronic component D is placed from the tray 100 to the tip of the arm 418. In the device supply apparatus 41, the first position 414 is supplied to the processing path by the holding means 3 disposed in the processing table 21 holding the electronic component D from the replacement table 416. It is a position to be done.

  The replacement table 416 is arranged so that one of the stop positions P set in the processing table 21 and the first position 414 overlap each other when viewed from above. In other words, one point on the outer peripheral end of the replacement table 416 is located below the processing table 21, and the overlapping position of the replacement table 416 and the processing table 21 is the first position 414.

  The tray 100 is transferred to an area that includes the second position 415. That is, the supply area 412 is a region including the second position 415. The supply destination area 412 is set below the replacement table 416, and the tray 100 is transferred below the replacement table 416.

  The tray 100 in the supply destination area 412 can be moved on an XY plane in which the tray 100 extends by a driving device (not shown). Since the direct drive motor 417 is positioned above the replacement table 416, the tray 100 can move in a direction of further entering the replacement table 416 without interfering with the direct drive motor 417.

  The holding unit 3 a picks up an electronic component from the tray 100 and places it on the arm 418 of the replacement table 416. This holding means 3 a is disposed immediately above the second position 415. The holding means 3a has a suction nozzle 31a for sucking and releasing the electronic component D. The suction nozzle 31a and the second position 415 are located on the same axis.

  The suction nozzle 31a can be moved up and down on the second position 415 by the support portion 32a. The raising / lowering range of the suction nozzle 31 a extends from above the replacement table 416 to the upper surface of the tray 100 beyond the plane on which the arm 418 extends. A drive unit 33a including an operation rod 34a is disposed immediately above the suction nozzle 31a. The operation nozzle 34a abuts on the upper end of the suction nozzle 31a and pushes down, so that the suction nozzle 31a is lowered.

  The inside of the pipe of the suction nozzle 31a communicates with a pneumatic circuit of a vacuum generator (not shown). The suction nozzle 31a sucks the electronic component D by the generation of negative pressure and separates the electronic component D by vacuum break.

  The suction nozzle 31a is urged by the compression spring in the upward direction, descends against the urging force of the compression spring, and when the operation rod 34a is separated, the urging force of the compression spring causes the upper side of the replacement table 416. To rise.

  The operation of the device supply apparatus 41 will be described in detail with reference to FIGS. The transfer table 416 stops by rotating by half the angle formed by the adjacent arm 418 during one cycle. One cycle consists of rotating at a predetermined angle and stopping. That is, at the first position 414, the arm 418 on which the electronic component D is placed stops once every two cycles. The second position 415 repeats the state where the arm 418 is located and the state where the space between the arms 418 is located during two cycles.

  FIG. 4 shows a cycle in which the second position 415 is a space between the arms 418. In this cycle, the electronic component D is picked up from the tray 100. In other words, the holding unit 3 a causes the suction nozzle 31 a to pass through the space between the arms 418 so as to pass over the replacement table 416 and descend to the tray 100 to suck the electronic component D.

  Next, FIG. 5 shows a cycle in which the arm 418 is positioned at the second position 415. In this cycle, the electronic component D picked up from the tray 100 in the previous cycle is placed on the arm 418. That is, the holding unit 3a lowers the suction nozzle 31a to the arm 418 and causes the electronic component D to be detached.

  The arm 418 on which the electronic component D is placed moves to the first position 414 after a plurality of cycles. At this time, one of the holding means 3 of the processing table 21 stops at the first position 414, and the holding means 3 holds the electronic component D from the arm 418, whereby the electronic component D is supplied to the processing path. . Further, the tray 100 moves on the XY plane until the next cycle in which the electronic component D is picked up, and positions the next electronic component D on the second position 415.

(Device storage device)
Next, the device housing apparatus will be described in detail. The tray transfer type device storage device 47 has the same configuration as the device supply device 41, and its operation is reversed from that of the device supply device 41. That is, the first position 414 is a replacement position where the electronic component D is transferred from the processing table 21 to the replacement table 416, and the second position 415 accommodates the electronic component D from the replacement table 416 into the tray 100. Supply position.

  The specific operation is as follows. That is, the transfer table 416 rotates and stops by half the angle formed by the adjacent arm 418 during one cycle. One cycle consists of rotating at a predetermined angle and stopping. That is, at the first position 414, the arm 418 on which the electronic component D is placed stops once every two cycles. The second position 415 repeats the state where the arm 418 is located and the state where the space between the arms 418 is located during two cycles.

  At the first position 414, one of the holding means 3 holding the electronic component D is stopped, and the electronic component D is detached from the tip of the arm 418, so that the electronic component D is loaded from the processing table 21 onto the replacement table 416. Change.

  The arm 418 on which the electronic component D is placed moves to the second position 415 after passing through a plurality of cycles as the replacement table 416 rotates. As shown in FIG. 5, in the cycle in which the arm 418 is located at the second position 415, the holding unit 3 a lowers the suction nozzle 31 a to the arm 418 and holds the electronic component D on the arm 418.

  Next, as shown in FIG. 4, in the cycle in which the second position 415 is a space between the arms 418, the electronic component D held in the previous cycle is accommodated in the tray 100. In other words, the holding unit 3 a causes the suction nozzle 31 a to pass through the space between the arms 418 so as to exceed the replacement table 416, and is lowered to the tray 100, and the held electronic component D is released onto the tray 100.

  At this time, the tray 100 moves on the XY plane until the next cycle on which the electronic component D is placed, and the accommodation space for the next electronic component is positioned on the second position 415.

  In the above embodiment, the holding means 3a only moves up and down in the Z-axis direction, and the tray 100 moves in the XY plane, so that the accommodation space of the electronic component D or the next electronic component D is moved to the second position 415. The mode in which the electronic component D is picked up or removed is described. However, if the second table 416 and the second position 415 and the first position 414 exist on the rotation trajectory, the present invention is not limited to this, and various modes are possible.

  For example, the tray 100 and the holding unit 3a may be relatively moved on the XY plane, and the holding unit 3a may be moved in the extending direction of the arm 418 or on the XY plane. In this case, the tray 100 does not need to be transferred to the lower side of the replacement table 416. In this case, the rotation angle of the replacement table 416 may be equal to the separation angle of the arm 418.

  As described above, in the electronic component inspection apparatus 1 according to the present embodiment, the device supply apparatus 41 acquires the electronic component D from the tray 100 and disengages it at the second position 415, and on the rotation locus. A replacement table 416 that includes the first position 414 and the second position 415, receives the electronic component D detached at the second position 415, and rotates the electronic component D to the first position 414 is provided.

  Further, the device accommodating device 47 includes the first position 414 and the second position 415 on the rotation locus, acquires the electronic component D from the processing table 21 at the first position 414, and rotates to the second position 415. A replacement table 416 to be obtained, and a holding means 3a for acquiring the electronic component D at the second position 415 and separating it from the tray 100 are provided.

  As a result, the number of actuators that conventionally required four units can be reduced to one direct drive motor 417 that rotates the transfer table 416, and the reduction of component constants and simplification of the apparatus can be achieved. Cost reduction. Moreover, since the supply interruption during the replacement of the replacement stage 52 that has been conventionally performed can be eliminated and the supply process can be continued, the production efficiency of the electronic component D is improved.

  In addition, since the direct drive motor 417 can be disposed above the replacement table 416, the tray 100 is transported directly below the replacement table 416. The replacement table 416 is configured by an arm 418 that passes through the second position 415 and the first position 414.

  Further, the holding means 3 a that moves up and down on the second position 415 passes through the replacement table 416 and acquires the electronic component D from the tray 100 directly below when the arm 418 does not exist at the second position 415. Or to the tray 100. Further, the holding means 3 a is configured to place the electronic component D on the arm 418 or hold the electronic component D from the arm 418 when the arm 418 exists at the second position 415.

  As a result, the holding means 3a can only move up and down, and the pickup of the electronic component D from the tray 100 and the placement on the arm 418 can be accelerated, or the pickup of the electronic component D from the arm 418 and the tray 100 can be performed. The mounting speed of the electronic component D can be increased, and the production efficiency of the electronic component D can be improved.

  Note that, in the device supply apparatus 41 of the present embodiment, the upper side of the rotation locus of the electronic component D placed on the replacement table 416 is opened except for the second position 415 and the first position 414. ing. Therefore, it is also possible to arrange various process processing mechanisms using this open space.

  For example, the device supply apparatus 41 includes an appearance inspection unit 420 such as a CCD image sensor or a CMOS image sensor. As shown in FIG. 6, a point on the rotation locus of the tip of the arm 418 is defined as an imaging region 419. This imaging region 419 is set at a later stage in the rotational direction than the second position 415 and at an earlier stage than the first position 414.

  Moreover, this embodiment is presented as an example and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. And this embodiment and its deformation | transformation are included in the invention described in the claim, and its equivalent range while being included in the range and summary of invention.

  For example, in the present embodiment, the case where various process processing mechanisms 4 are arranged on one processing table 21 has been described as an example, but the transport mechanism may be a linear transport system, or a plurality of processing tables 21. A single transport path may be configured. Further, as a holding means, instead of the suction nozzle 31 for sucking and releasing the electronic component D by generation and breakage of vacuum, an electrostatic suction method, a Bernoulli chuck method, or a chuck mechanism for mechanically holding the electronic component D is arranged. May be. The various process processing mechanisms 4 are not limited to the types described above, and can be replaced with various process processing mechanisms 4, and the arrangement order can be changed as appropriate.

  Further, the tray transfer type in this embodiment may be applied to both the device supply apparatus 41 and the device storage apparatus 47, or one of them may be a tray transfer type.

DESCRIPTION OF SYMBOLS 1 Electronic component inspection apparatus 21 Processing table 22 Direct drive motor 3 Holding means 3a Holding means 31 Adsorption nozzle 31a Adsorption nozzle 32 Support part 32a Support part 33 Drive part 33a Drive part 34 Operation rod 34a Operation rod 4 Process processing mechanism 41 Device supply apparatus 411 Supply waiting area 412 Supply destination area 413 Discharge area 414 First position 415 Second position 416 Replacement table 417 Direct drive motor 418 Arm 419 Imaging position 420 Appearance inspection means 42 Test contact 43 Marking unit 44 Forming device 45 Appearance inspection Device 46 Sort / sort mechanism 47 Device storage device 48 Defective product discharge device 100 Tray D Electronic component D1 Lead P Stop position

Claims (6)

An electronic component inspection apparatus for performing various processes by placing electronic components arranged in a tray on a processing process,
First holding means for holding an electronic component having a first position;
A transport unit that includes the first holding unit and forms a processing path for the electronic component held by the first holding unit;
Various process processing means that are arranged in line with the processing path and perform various processes on the electronic component that has been transported by the transport means while being held by the first holding means;
Second holding means for acquiring the electronic component from the tray and detaching it at a second position;
A turret table that includes the first position and the second position on a rotation locus, receives the electronic component detached at the second position, and rotates the electronic component to the first position;
Transfer means for transferring the tray directly under the turret table;
With
The turret table is
A motor that is located above the turret table and rotates the turret table;
A plurality of radially arranged arms passing through the first position and the second position with the rotation;
Including
The second holding means is
Moving up and down on the second position;
During rotation of the turret table, when the arm does not exist at the second position, the electronic component is obtained from the tray directly below the turret table,
Placing the electronic component on the arm when the arm is in the second position during rotation of the turret table;
An electronic component inspection apparatus characterized by. Further comprising an appearance inspection means for imaging a point on the rotation trajectory of the electronic component placed on the arm;
The electronic component inspection apparatus according to claim 1 . An electronic component inspection apparatus that performs various process processes and arranges processed electronic components on a tray,
Various process processing means that are arranged along the processing path and perform various types of processing on electronic components,
A transport unit that forms the processing path and transports electronic components to the various process processing units;
A first holding means disposed on the transport means and configured to detach the electronic component from the transport means at a first position;
A turret table that includes the first position and the second position on a rotation trajectory, receives the electronic component detached at the first position, and rotates the electronic component to the second position;
Second holding means for acquiring the electronic component at the second position and separating it from the tray;
Transfer means for transferring the tray directly under the turret table;
With
The turret table is
A motor that is located above the turret table and rotates the turret table;
A plurality of radially arranged arms passing through the first position and the second position with the rotation;
Including
The second holding means is
Moving up and down on the second position;
During rotation of the turret table, when the arm is present at the second position, the electronic component is picked up from the arm,
During rotation of the turret table, when the arm is not present at the second position, passing the turret table and detaching the electronic component to the tray immediately below;
An electronic component inspection apparatus characterized by. Supplying electronic components arranged in a tray to an electronic component inspection apparatus that performs various process processes while conveying the electronic component by a conveying unit having a first holding unit that holds the electronic component at a first position A tray transfer device,
Second holding means for acquiring the electronic component from the tray and detaching it at a second position;
A turret table that includes the first position and the second position on a rotation locus, receives the electronic component detached at the second position, and rotates the electronic component to the first position;
Transfer means for transferring the tray directly under the turret table;
With
The turret table is
A motor that is located above the turret table and rotates the turret table;
A plurality of radially arranged arms passing through the first position and the second position with the rotation;
Including
The second holding means is
Moving up and down on the second position;
During rotation of the turret table, when the arm does not exist at the second position, the electronic component is obtained from the tray directly below the turret table,
Placing the electronic component on the arm when the arm is in the second position during rotation of the turret table;
A tray transfer device. Further comprising an appearance inspection means for imaging a point on the rotation trajectory of the electronic component placed on the arm;
The tray transfer apparatus according to claim 4 . With respect to the electronic component inspection apparatus having the first holding means for performing various process processes while conveying the electronic component by the conveying means and detaching the electronic component at the first position, the electronic component removed to the tray A tray transfer device for receiving,
A turret table that includes the first position and the second position on a rotation trajectory, receives the electronic component detached at the first position, and rotates the electronic component to the second position;
Second holding means for acquiring the electronic component at the second position and separating it from the tray;
Transfer means for transferring the tray directly under the turret table;
With
The turret table is
A motor that is located above the turret table and rotates the turret table;
A plurality of radially arranged arms passing through the first position and the second position with the rotation;
Including
The second holding means is
Moving up and down on the second position;
During rotation of the turret table, when the arm does not exist at the second position, the electronic component is obtained from the tray directly below the turret table,
Placing the electronic component on the arm when the arm is in the second position during rotation of the turret table;
A tray transfer device.

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