JP4641678B2 - Taping device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a taping device in which a chip component is loaded in each storage groove in a storage tape, and an opening on the upper surface of the storage groove is closed with a cover tape.
[0002]
[Prior art]
In this type of conventional taping device, in the process of loading the chip part into the storage groove in the storage tape, the position of the storage groove before insertion is recognized by imaging by the recognition camera, and then the image is also captured by the recognition camera. After the insertion operation is completed, the presence / absence of the inserted part is recognized, and then the storage tape is conveyed.
[0003]
[Problems to be solved by the invention]
However, imaging by the recognition camera has to be performed twice, which takes extra time for production.
[0004]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to reduce the time required for recognition and shorten the production time as much as possible.
[0005]
[Means for Solving the Problems]
Accordingly a first aspect of the present invention, a chip component to the receiving groove in the storage tapes sequentially loaded by the suction loading nozzle, the taping device formed by closing the opening of the receiving groove top by a cover tape, the suction loading nozzle And a recognition camera that simultaneously images the storage groove of the storage tape in which the chip component has already been inserted and the storage groove before insertion of the chip component before the chip component taken out from the chip component supply unit is inserted into the storage groove of the storage tape. It is characterized by that.
[0006]
According to a second aspect of the present invention, the recognition camera images the storage groove of the storage tape in which the chip component is inserted by the suction loading nozzle to confirm the presence or absence of the chip component, and recognizes the position of the storage groove before insertion. The storage groove is imaged.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a taping device of the present invention will be described with reference to the drawings. First, the taping device will be described based on a plan view of the taping device of FIG. Reference numeral 1 denotes a main body of the taping device. A tape supply reel 2 is rotatably locked to a pin erected on the main body 1 and is wound around the tape supply reel 2 (also referred to as a carrier tape). An appropriate tension is applied to the tape body 3A by a pulley (not shown) and the tip of 3A is fixed to the take-up reel 5 via the transport rail 4.
[0008]
Then, while the tape main body 3A is successively conveyed by a predetermined amount in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown), the storage groove 3B of the tape main body 3A is taken. A chip component is inserted into the cover, and further conveyed to a predetermined position. The opening on the upper surface of the storage groove 3B is covered with a cover tape 3C supplied from a cover tape supply reel (not shown). It will be wound up. As described above, the tape 3 is formed by the tape main body 3A, the storage groove 3B provided in the tape main body 3A, and the cover tape (top tape) 3C that is pressure-bonded to the upper surface of the tape main body 3A. It is formed with a tape and a spacer.
[0009]
Then, after the chip component is inserted into the storage groove 3B of the tape main body 3A by the component loading device 10, the component is inspected by a component inspection mechanism (not shown), and then the tape main body by the tape crimping mechanism (not shown). 3A and the cover tape 3C are pressure-bonded and wound on the take-up reel 5.
[0010]
Next, the component loading apparatus 10 will be described below with reference to FIGS. First, an X table 12 movable in the X direction by a drive motor 12A is provided on the Y axis table 11 movable in the Y direction by the drive motor 11A, and a frame 13 is fixed on the X table 12. ing. A mounting plate 14 is fixed to the frame 13, an index unit 15 is provided at the center of the mounting plate 14, and a recognition camera 16 and a recognition camera 17 are provided facing the front and rear portions. .
[0011]
Further, on the lower surface of the mounting plate 14, there is provided a turntable 20 that is intermittently rotated (at intervals of 90 degrees) via the index unit 15 by a drive motor (not shown). Adsorption loading nozzles 22 are arranged on the respective mounting heads 21 arranged at intervals of four.
[0012]
The suction loading nozzle 22 is configured such that the mounting head 21 can be moved up and down by a vertical drive motor (not shown) and can be rotated around a vertical line by a θ rotation motor.
[0013]
A Y-axis table 24 movable in the Y direction by a drive motor 24A is provided on the X table 12. Further, an X-axis movable on the Y-axis table 24 in the X direction by a drive motor 25A. A table 25 is provided. A chip component supply table 27 is provided on the X-axis table 25 via an attachment member 26, and a wafer affixed to a sheet 28 is diced on the supply table 27 and divided into individual chip components 30. This part is to be taken out while being pushed up from the back by a push-up pin (not shown).
[0014]
Below the recognition camera 17 in FIG. 1 is a component adsorption (removal) station. The state shown in FIG. 1, that is, the chip component 30 to be taken out next on the chip component supply table 27 during the movement of the turntable 20 is detected by the recognition camera 17. The Y table 24 and the X table 25 are moved so as to be positioned immediately below the moving suction loading nozzle 22 by recognizing the position of the chip component 30, and the chip component supply table is moved at this component suction station. 27, the suction loading nozzle 22 descends and picks up the chip component 30 on the chip.
[0015]
Next, it is transported to the next station according to the 90 ° rotation of the turntable 20 via the index unit, and further transported to the next component insertion station. During this transport, the recognition camera 16 images the three storage grooves 3B of the tape body 3A on the transport rail 4. That is, whether or not the chip component 30 has been inserted into the leftmost storage groove 3B, and whether it is not inserted into the rightmost storage groove 3B (is empty). The three storage grooves 3B are simultaneously imaged for recognizing the position of the rightmost storage groove 3B.
[0016]
Accordingly, the position of the rightmost storage groove 3B is recognized by a recognition processing circuit (not shown) after the image is taken, and based on the result, a control device (not shown) drives the drive motor 11A and X table 12 of the Y table 11. The drive motor 12A and the θ rotation motor are corrected and controlled, and the chip component 30 is inserted by the suction loading nozzle 22 that descends to an appropriate position in the middle storage groove 3B. That is, in this component insertion station, the correction movement of the rotary disk 20 in the XY directions is placed in the storage groove 3B of the tape body 3A on the transport rail 4 waiting for the chip component 30 sucked by the suction loading nozzle 22 below. In addition, the suction loading nozzle 22 can be inserted and loaded at an appropriate position by the correction movement in the θ direction.
[0017]
After this insertion and loading, while the tape main body 3A is sequentially conveyed by a predetermined amount (taken up by the take-up reel 5) in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown), the component inspection is performed. The tape main body 3A in which the inspection of the chip part 30 is completed by the tape crimping mechanism after the part inspection (for example, electrical characteristic inspection etc.) is performed on the chip part in a state where the mechanism is inserted into the storage groove 3B of the tape main body 3A. And the cover tape 3C are crimped to complete the taping.
[0018]
In addition, in order to confirm whether or not the chip component 30 has been inserted into the leftmost storage groove 3B, as a result of recognition processing based on the imaging of the recognition camera 16, if it is determined that it is not inserted, The control device controls the taping device to stop.
[0019]
In addition, when it is determined that the taping device is already inserted into the rightmost storage groove 3B, the control device controls to stop the taping device.
[0020]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0021]
【The invention's effect】
Conventionally, in the process of loading the chip part into the storage groove in the storage tape, the position of the storage groove before insertion is recognized by imaging by the recognition camera, and then the insertion part after the insertion operation is completed by imaging by the recognition camera. Since the presence / absence recognition is performed, the imaging by the recognition camera has to be performed twice, which takes extra time for production. However, according to the present invention, the time required for the recognition is determined as one imaging. The production time can be shortened as much as possible.
[Brief description of the drawings]
FIG. 1 is a plan view showing a taping device.
FIG. 2 is a left side view showing the taping device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 3 Storage tape 3A Tape main body 3B Storage groove 3C Cover tape 10 Component loading apparatus 20 Turntable 21 Mounting head 22 Adsorption loading nozzle 30 Chip component

Claims (2)

In a taping apparatus in which chip parts are sequentially loaded into the respective storage grooves in the storage tape by suction loading nozzles , and the openings on the upper surface of the storage grooves are closed with a cover tape, the suction loading nozzles are taken out from the chip part supply unit. A taping device comprising: a recognition camera that simultaneously images the storage groove of the storage tape in which the chip component has already been inserted and the storage groove before insertion of the chip component before the chip component is inserted into the storage groove of the storage tape. . The recognition camera images the storage groove of the storage tape in which the chip component is inserted by the suction loading nozzle to check for the presence of the chip component, and images the storage groove to recognize the position of the storage groove before insertion. The taping device according to claim 1, wherein:

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