JP3473380B2 - Electronic component joining equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding device for electronic parts, and more particularly to a device structure suitable for bonding electrodes of a semiconductor chip to inner leads of a wiring pattern formed on a wiring board.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor chip is mounted on a wiring board formed by forming a wiring pattern on an insulating base formed of synthetic resin or the like, the insulating base is a portion corresponding to the central portion of the wiring pattern. Forming an opening in
There is an inner lead bonding device used when a plurality of inner leads protruding from the opening edge are provided and electrodes of a semiconductor chip are bonded to the inner leads. The inner lead bonding apparatus is a tape-conveying type that feeds a carrier tape, which is a strip-shaped insulating substrate, in the extension direction, and sequentially joins semiconductor chips for each wiring pattern arranged in the extension direction. And a carrier-carrying type device that sequentially transports a carrier case to which a flexible wiring board having one wiring pattern is fixed, and one semiconductor chip is bonded to each carrier case. There is.

For example, in a tape-conveying type inner lead bonder described in Japanese Patent Publication No. 1-50101, a carrier tape pulled out from a supply reel is fed in its extension direction to form wiring formed on the carrier tape. While sequentially positioning the pattern at the bonding position, a rotary table equipped with a plurality of die mounting tables is provided, and the semiconductor chips held on the die mounting table are supplied to the bonding position by rotational movement to perform bonding. Is configured.

[0004]

However, in the above-mentioned conventional inner lead bonding apparatus, it is difficult to miniaturize the apparatus, and there is a limit to shortening the tact time of bonding, so that the productivity is improved more than at present. There is a problem that it is difficult.

In the apparatus described in the above publication, the carrier tape transport system is provided with a tape erection section for erection of the carrier tape pulled out from the supply reel and collection on the take-up reel, and for joining the carrier tapes. Since the mechanism for correcting the position of the carrier tape is also required because the position needs to be accurately positioned, the tape transport system becomes large, which increases the occupied volume of the entire apparatus. Also,
Even in the case of the carrier transport type, since it is necessary to sequentially feed the carrier cases from a magazine accommodating the carrier cases along a linear transport path and position each carrier case, a similarly large device structure is required.

Furthermore, in the device described in the above publication, the position of the wiring pattern of the carrier tape is detected by a camera arranged immediately above the bonding position (bonding position), and the inner lead is accurately adjusted to the bonding position. However, for this reason, the sprocket used to correct the position of the carrier tape after capturing the image of the wiring pattern sent to the vicinity of the joining position, performing image processing, transferring position information, etc. Since the connected XY table is operated to perform fine positioning and the joining is started after the positioning is completed, it is very difficult to reduce the tact time without sacrificing the positioning accuracy.

Therefore, the present invention is to solve the above-mentioned problems, and it is an object of the present invention to reduce the size of the inner lead bonding apparatus and other electronic component bonding apparatus described above and to reduce the takt time of the apparatus. It is to provide a new device structure capable of improving productivity by shortening the length.

[0008]

Measure taken by the present invention for solving the above problems SUMMARY OF THE INVENTION is a bonding apparatus of an electronic component for bonding the first electronic component and the second electronic component to each other, the
First supply means for supplying the first electronic component to the bonding position, and
A second supply means for supplying the second electronic component to the joining position;
Joining for joining the first electronic component and the second electronic component
Means for supplying the first electrons to the first supply means.
A plurality of first fixing means for fixing the parts and a plurality of the first fixing means.
The first electronic component fixed to the fixing means at a predetermined center position
Configured to rotate and move along a rotation trajectory around
One rotation means, and the first electronic component by the first rotation means
The predetermined rotation position of the
A first positioning means for determining the second feeding means.
The step includes a plurality of second fixing means for fixing the second electronic component.
And the second electronic part fixed to the plurality of second fixing means.
Rotate the product along the rotation path around the specified center position
In addition, it is configured to be able to move up and down and near the joining position.
The rotation trajectory of the second electronic component is determined by the first rotation means.
It is configured so as to partially overlap the rotation trajectory of the first electronic component.
Second rotating means and the second electric power generated by the second rotating means.
The predetermined rotation position of the child part is set to the joining position by the joining means.
And a second positioning means for positioning to
The rotating means and the second rotating means operate in synchronization with each other,
The first electronic component and the second electronic component are rotationally moved.
The first positioning means and the second positioning means.
Therefore, it must be configured to be positioned at the joining position.
The joining means is a bonder configured to be movable up and down.
The bonder in the lowered position at the joining position.
And the second rotating means in a raised state.
It is a joining device of electronic parts, which joins 1 electronic parts and the 2nd electronic parts .

According to this means, both the first electronic component and the second electronic component are rotationally moved by the first rotating means and the second rotating means to be positioned at the joining position, so that the linear shape as in the conventional case is obtained. It is not necessary to provide a transport path, and the device can be made compact.

In the above means, "the first rotating means and the second rotating means operate in synchronization" means that the operation of the first rotating means and the operation of the second rotating means have a predetermined time. ,
It only shows that there is a timing relationship,
The timing for stopping the fixed position of the first electronic component and the second
There may be a time lag with the timing of stopping the fixed position of the electronic component, or a specific fixed position or a fixed position determined depending on the feeding condition or the operation error of each part. You can skip it and make it work,
Furthermore, the operation timing may be changed midway according to various states.

Further, the rotational trajectories of the first electronic component and the second electronic component are configured such that at least one of them has the same radius or substantially the same radius in order to improve the positioning accuracy and simplify the mechanism. Is more preferable.

Here, the first positioning means includes a position detector for detecting a fixed position of the first electronic component by the first fixing means, and a position adjusting mechanism for adjusting the fixed position of the first fixing means. And the position adjusting mechanism for correcting the position when the first rotating means rotationally moves the first electronic component to the vicinity of the joining position in accordance with the fixed position detected by the position detecting unit. It is preferable to provide a position controller for driving.

According to this means, when the fixed position of the first electronic component is detected by the position detecting section, and the first rotating means is rotated based on the detection information of the fixed position and moved to the vicinity of the joining position. Since the position is corrected at the position, the position correction becomes relatively easy by performing the position correction with respect to the rotational movement of the first rotating means, the positioning accuracy is easily ensured, and the position before the joining position is obtained. Since it is possible to detect the position at the rotation angle position, it is not necessary to perform the position detection immediately before the welding work, and the operation procedure can be set relatively freely, so it is possible to shorten the takt time and improve the productivity. is there.

In this case, the position detecting section is stationary at a position other than the bonding position while the pair of the first electronic component and the second electronic component are bonded at the bonding position. It is desirable to be configured to detect the position of the other first electronic component that is operating.

According to this means, the position of another electronic component is detected in parallel while the bonding work is being performed on the certain electronic component, so that the tact time can be greatly reduced. Therefore, the productivity of the device can be greatly improved.

In each of the above means, the first fixing means holds the first electronic component from above and below so as to be openable and closable, and has upper and lower openings for exposing the first electronic component, respectively. A clamp member and a lower clamp member, the second fixing means has a holding base capable of holding the second electronic component on the holding surface, and the upper clamp member and the upper clamp member at the joining position. It is preferable that the joining means is disposed so as to be able to come into contact with and separate from the upper and lower sides of the lower clamp member, and the holding surface is disposed to face the upper and lower side of the other.

According to this means, the first fixing means clamps the first electronic component from above and below to rotate and move the first electronic component.
Since the electronic components are held on the holding table and rotated, and are arranged at the joining positions so as to join from the opposite side of the holding table, the positioning of the first electronic component and the second electronic component can be made high. It can be performed accurately and easily.

In each of the above-mentioned means, at least one of the position detector, the position adjusting mechanism and the position controller may be provided in the second positioning means.

In each of the above means, the position of the second electronic component may be corrected by the second positioning means according to the position detection result of the first positioning means, and conversely, the position of the second electronic component may be corrected by the second positioning means. The position of the first electronic component may be corrected by the first positioning means, and further, the position may be corrected by either one of the first positioning means and the second positioning means, depending on the result of the position detection.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Next, embodiments of the present invention will be described with reference to the accompanying drawings. In this embodiment, a carrier wiring type inner lead bonding for mounting a flexible wiring substrate on a carrier case and joining electrodes of a semiconductor chip to inner leads formed in the wiring substrate transported for each carrier case. It relates to the device. However, the present invention can be applied to various devices for bonding electronic components to electronic components other than the inner lead bonding device.

1 and 2 are perspective views showing a schematic structure of a main part of this embodiment. As shown in these figures,
This apparatus is provided with a carrier supply mechanism 10 for fixing a carrier case having a wiring board mounted thereon and supplying the carrier case to a bonding position described later, and a carrier supply mechanism 10 connected to the carrier supplying mechanism 10 for supplying a semiconductor chip to the bonding position. Chip supply mechanism 20
And a bonding operation unit 31 which is a bonding means and an image acquisition unit 33 which is a position detection unit, which are arranged above the bonding position.
And a bonding mechanism 30 including the above.

The carrier supply mechanism 10 has an XY (not shown).
Support frame 11 fixed on the table, drive motor 12 fixed to support frame 11, and drive motor 1
The rotary mechanism unit 13 is configured to be fixed to the two output shafts and driven to rotate, and the upper clamp plate 14 and the lower clamp plate 15 attached to the rotary mechanism unit 13. The drive motor 12 is provided with eight predetermined stop angle positions to drive the rotating mechanism section 13 intermittently, and the stop angle position is the drive motor 12 (rotational direction).
And an XY table (horizontal direction) (not shown) mounted below the support frame 11 can be used for adjustment.

The small motor 11a shown in FIG. 2 is for vertically moving the IC table 24a on the rotary table 23.

As shown in FIGS. 3 and 4, the rotation mechanism section 1
3 is provided with four sets of carrier mounting parts each including one upper clamp plate 14 and one lower clamp plate 15, and these carrier mounting parts are at equal angular intervals to each other, that is,
They are provided at 90 degree intervals. The lower clamp plate 15 is attached to the upper clamp plate 14 so as to be movable up and down with respect to the rotating mechanism unit 13, and is moved up and down by a small actuator (air actuator) 13a mounted on the rotating mechanism unit 13, and will be described later. The carrier case can be held in a clamped state or released from the clamped state.

As shown in FIG. 6, the carrier case 16 is a frame body having a rectangular shape in a plan view, and a flexible wiring board 17 having a fine wiring pattern 18 formed of copper or gold on an insulating substrate inside. Is fixed. The front and back surfaces of the wiring board 17 are exposed by the upper and lower opening windows of the carrier case 16. A rectangular opening 17a is formed in the center of the wiring board 17, and a plurality of inner leads 18a formed by protruding the wiring pattern 18 are arranged in parallel at the edge of the opening 17a.

FIG. 7 shows the structure of the above-mentioned carrier mounting portion configured to mount the carrier case 16. The upper clamp plate 14 is fixed to a support plate 13b fixed to the rotation mechanism section 13. Lower clamp plate 15
Is fitted to a guide portion 13d fixed to the rotation mechanism portion 13 and is attached to a slide plate 13c that is vertically slidably attached. The slide plate 13c is provided with a driven protrusion 13e, and the tip of the driven protrusion 13e is covered with an elastic body 13f such as synthetic rubber.
This elastic body 13f is provided with a spring 13 on the outer peripheral surface of an eccentric cam 13g connected to the output shaft of the small actuator 13a.
It is constantly pressed by the biasing force of h.

In this embodiment, the carrier case 16 is inserted between the upper clamp plate 14 and the lower clamp plate 15 shown in FIG.
The eccentric cam 13g is rotated by the drive of 3a to raise the lower clamp plate 15, so that it is sandwiched between the upper clamp plate 14 and the lower clamp plate 15.

Next, as shown in FIGS. 1 and 2, the chip supply mechanism 20 includes a fixed frame 21, a drive motor 22 fixed to the fixed frame 21, and a drive motor 22.
Table 23 that is fixed to the output shaft of
And the chip mounting part 24 mounted on the turntable 23.
It is composed of and. The chip mounting portions 24 are provided on the turntable 23 at equal angular intervals, that is, at 90 degree intervals. Chip mounting part 24
An IC stand 24a is mounted on the upper end of the
Further, the IC base 24a at the upper end of the chip mounting portion 24 can change the rotational position of the semiconductor chip by a guide 24b installed on the rotary table 23. In addition, the fixed frame 21 of the rotary table 23
There is an XY table (not shown) underneath, and the horizontal position of the semiconductor chip can be changed.

The drive motor 22 drives the rotary table 23 so as to perform an intermittent rotation operation having four stop angle positions at equal intervals. These stop angle positions can be adjusted by the small motor 21a.

The carrier supply mechanism 10 intermittently rotates the carrier case 16 around a predetermined center of rotation, and the chip supply mechanism 20 predetermined the semiconductor chips held on the IC table 24a by vacuum suction or the like. It is configured to be intermittently rotated around the rotation center of. Further, the rotation locus of the carrier case 16 by the carrier supply mechanism 10 and the rotation locus of the semiconductor chip by the chip supply mechanism 20 are configured to planarly overlap each other at the bonding position where the bonding mechanism 30 is installed.

The bonding mechanism 30 is arranged above the bonding position, and the bonding operation part 31 arranged immediately above the bonding position is a movable part 31a which is guided up and down with respect to the fixed frame 30a shown in FIG. And the movable part 31
and a bonding tool 32 attached to the lower end of a. An image acquisition unit 33 fixed to the fixed frame 30a is provided on the side of the bonding operation unit 31. At this time, the image attachment portion 33 may be fixed separately from the bonding mechanism 30 or may be fixed independently on an XY table (not shown). The image acquisition unit 33 includes a carrier case 16
And an annular light 33a for illuminating
Wiring pattern 18 on wiring board 17 through the inside of 3a
Is provided with a pair of CCD cameras 33b, 33b. At this time, a single CCD camera may be used. This pair of CCD cameras 33b has a wiring pattern 1
The control device (not shown) connected to the CCD camera 33b captures two areas including the inner lead 18a of 8 and the wiring pattern 18 and the inner lead by pattern matching with the standard image from the two captured images. The exact position of 18a is determined.

FIG. 9 is a diagram for explaining the operation of this embodiment. The rotation mechanism unit 13 includes an upper clamp plate 14 and a lower clamp plate 1.
Four sets of carrier mounting portions composed of 5 are configured to stop at eight illustrated stop angle positions D, D ', E, E', B, B'F, F '. At the stop angle position D, the carrier case 16 is inserted between the upper clamp plate 14 and the lower clamp plate 15 manually or by an automatic loading device (not shown), and the upper clamp plate 14 and the lower clamp plate 15 are closed to clamp the carrier case 16. To do.

Next, when it is rotated to the stop angle position D'and stopped, further rotated to the stop angle position E and stopped, and further rotated to the stop angle position E'and stopped, it is incorporated into the bonding mechanism 30. The image acquisition unit 33 is disposed above, and the wiring substrate 1
The position of the inner lead 18a protruding into the opening of
Take pictures at several places. The positions of the wiring pattern 18 and the inner leads 18a are detected from this image as described above, and the control device (not shown) drives the XY table (not shown) mounted with the support frame 11 based on the position information, and the rotation mechanism section 13 is driven. While rotating the upper clamp plate 1
4 and the lower clamp plate 15 move to the stop angle position B, and the carrier case 16 is sandwiched between the clamp plates.
The inner wiring pattern 18 and the inner lead 18a are positioned so as to exactly coincide with the joining position S.

Next, the wiring board 1 is joined by the bonding described later.
7, the upper clamp plate 14 and the lower clamp plate 15 sandwiching the carrier case 16 having the semiconductor chip mounted thereon further stop at the stop angular position F through the stop angular position B ′, where the upper clamp plate 14 and the lower clamp plate 15 are stopped. The plate 15 and the plate 15 are opened to each other, and the carrier case 16 is manually taken out or automatically drawn out by an automatic take-out device (not shown). The upper clamp plate 14 and the lower clamp plate 15 return to the stop angle position D through the stop angle position F ′ in the open state. In this way, the four upper clamp plates 14 and the lower clamp plates 15 repeat the above operation while sequentially stopping at eight stop angle positions.

On the other hand, the turntable 23 is constructed so that the four IC stands 24a stop at the four stop angle positions A, G, B and C. As for the stop timing of the rotary table 23, the upper clamp plate 14 and the lower clamp plate 15 in the rotary mechanism section 13 have the stop angle position D,
It corresponds to the timing of stopping at E, B, and F.
On the IC stand 24a that stops at the stop angle position A, semiconductor chips are picked up from a wafer divided into chips or a chip tray in which the chips are arranged and housed by a pick-and-place type hand mechanism (not shown) such as a robot. The semiconductor chips are transferred one by one and held by the holding mechanism (vacuum suction mechanism, clamp mechanism, etc.) (not shown) of the IC stand 24a. Here, the coarse positioning lever 26 (or the rough positioning claw) corrects the attitude and the approximate holding position of the semiconductor chip.

Next, the IC stand 24a is moved to the stop angle position G
The image acquisition unit 25 (which has the same configuration as the above-described image acquisition unit 33) arranged immediately above this position is rotated and moved to (stopped), but in this case, a single CCD camera may be used. ), An image of the semiconductor chip is photographed, the image is transferred to a control device (not shown), and the position of the semiconductor chip on the IC stand 24a is detected by comparing it with a prescribed pattern image. Then, based on the position information, the horizontal position of the IC stand 24a at the stop angle position B where the semiconductor chip next stops is corrected by an XY table (not shown), and the semiconductor chip is accurately positioned at the bonding position S.

Next, after the semiconductor chip is mounted on the wiring board held by the carrier case 16 by the bonding described later, the empty IC stand 24a rotates to the stop angle position C and stops, so that compressed air is released. By spraying from the nozzle 27, the IC stand 24a is cleaned so that the chips of the semiconductor chip do not remain. Then, again, the stop angle position A
It stops after rotating to a new semiconductor chip on the IC stand 24a. In the chip supply mechanism 20, the above process is repeated in each mounting portion 24 on the rotary table 23.

FIG. 8 is an enlarged explanatory view showing a state in which the inner leads 18a of the conveyed wiring board 17 and the electrodes of the semiconductor chip 19 held on the IC stand 24a are joined. After being accurately positioned at the bonding position S as described above, the IC table 24a rises and the bonding tool 32 descends from above the upper clamp plate 14 to bring the inner leads 18a into contact with the electrodes of the semiconductor chip 19. While heating, pressurize and bond. The time required for joining is usually about 0.5 to 0.8 seconds. When the bonding is completed, the bonding tool retracts upward again, and the IC stand 24a also descends downward.

According to this embodiment, the carrier case 16
Is configured to rotate, and the rotation locus of the carrier case 16 and the rotation locus of the semiconductor chip by the rotary table 23 are configured to overlap each other in a plane, and the overlaps are formed. Since the joining position is set in the portion, the main portion of the device can be made extremely smaller than the conventional one, and the size of the entire device can be reduced.

Next, another embodiment different from the above embodiment will be described with reference to FIG. In this embodiment, the structure of most parts is the same as that of the above-mentioned embodiment, and the description thereof is omitted. In the present embodiment, the upper clamp plate 14 and the lower clamp plate 15 of the rotation mechanism unit 13 have only four stop angle positions D, E, B, and F, and the rotation mechanism unit 13 synchronizes with the rotary table 23. It is designed to rotate intermittently. Further, in the bonding mechanism, the bonding operation unit 31 and the image acquisition unit 33 ′ are arranged at a distance from each other, and the bonding operation unit 3
Although 1 is arranged right above the joining position S as in the previous embodiment, the image acquisition unit 33 ′ is arranged right above the stop angle position E of the upper clamp plate 14 and the lower clamp plate 15.

In this embodiment, the upper and lower clamp plates 14 and 14 next to the upper and lower clamp plates 14 and 15 stopped at the stop angle position B corresponding to the joining position S by the intermittent rotation of the rotating mechanism section 13. The carrier case 16 sandwiched between the clamp plates 15 is at the stop angle position E and the image acquisition unit 3
An image of the wiring pattern placed under the carrier case 16 and loaded in the carrier case 16 is acquired, and the image processing as described above is performed. Therefore, while the semiconductor chip is bonded to the previous wiring pattern, position detection is performed at the stop angle position E for the next wiring pattern.

According to the second embodiment, in addition to the above effects of the previous embodiment, while the semiconductor chip bonding work is being performed on another wiring board, another wiring board is Since position detection is performed in parallel, it is not necessary to secure time for position detection before joining work, and the tact time is shortened to almost equal to the total time of joining time and movement and positioning. can do.

The fixing means composed of the upper clamp plate and the lower clamp plate is not limited to the case where four sets are provided as described above, and an arbitrary number of sets may be used. For example, two sets or three sets may be provided and the stop position may be two. It may be three or three.

In the above embodiment, the position detection and the position correction are performed in both the carrier supply mechanism 10 on the first rotation means side and the chip supply mechanism 20 on the second rotation means side. The joining position may be adjusted by only correcting the position on the side of the first rotating means in accordance with the position detection on the side of the second rotating means, and vice versa.
The joining position may be adjusted by only correcting the position on the second rotating means side according to the position detection on the rotating means side. Of course, both positions may be detected, and the position may be corrected by only one of the first rotating device side and the second rotating device side according to the result.

Further, the operation of the carrier supply mechanism 10 and the operation of the chip supply mechanism 20 need only have a predetermined predetermined time and timing relationship required for the bonding work. For example, when there is a carrier or chip supply error or other malfunction, an empty carrier holding part or chip mounting part may be skipped and sent.
Also, depending on the status of the device, the carrier holding part and chip mounting part that are used steadily are limited, or the operation timing of the carrier supply side and the chip supply side changes when the operating speed (tact time) of the device is switched. It may be configured to do so.

[0046]

As described above, according to the present invention, both the first electronic component and the second electronic component are rotationally moved by the first rotating means and the second rotating means to be positioned at the joining position. Since it is not necessary to provide a linear transport path as in the related art, the device can be made compact.

In particular, the position detector is composed of the first electronic component and the second electronic component.
While a set of electronic components is being joined at the joining position, the position of another first electronic component that is stationary at a position other than the joining position is detected, so that a certain electronic component can be obtained. On the other hand, while the bonding work is being performed, the position detection of another electronic component is performed in parallel, so that the tact time can be significantly shortened and the productivity of the device can be greatly improved.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a main structure portion in an embodiment of an electronic component joining apparatus according to the present invention.

FIG. 2 is a schematic perspective view showing the main structure portion in the same embodiment from another angle.

FIG. 3 is a schematic perspective view showing a structure of a carrier transport mechanism in the same embodiment.

FIG. 4 is a schematic perspective view showing the structure of the carrier transport mechanism in the same embodiment from another angle.

FIG. 5 is a schematic perspective view showing the structure of the bonding mechanism in the same embodiment.

FIG. 6 is a schematic end view (a) and a schematic plan view (b) showing a structure of a carrier case used in the same embodiment.

FIG. 7 is a schematic explanatory view showing a structure in the vicinity of an upper clamp plate and a lower clamp plate in the rotation mechanism section of the embodiment.

FIG. 8 is an explanatory diagram showing a state at the time of joining at the joining position of the same embodiment.

FIG. 9 is an operation explanatory view showing the operation of the embodiment.

FIG. 10 is an operation explanatory diagram illustrating an operation of an embodiment different from the above embodiment.

[Explanation of symbols]

10 Carrier transport mechanism 11 Support frame 12 Drive motor 13 Rotating mechanism 14 Upper clamp plate 15 Lower clamp plate 16 carrier cases 17 wiring board 17a opening 18 wiring patterns 18a inner lead 19 semiconductor chips 20 Chip transfer mechanism 21 fixed frame 22 Drive motor 23 turntable 24 chip mounting part 24a IC stand 24b guide 30 Bonding mechanism 31 Bonding operation part 32 Bonding tool 33 Image acquisition unit 33a Ring lighting 33b CCD camera

Claims (6)

(57) [Claims] 1. An electronic component joining apparatus for joining a first electronic component and a second electronic component to each other, the first supplying means supplying the first electronic component to a joining position.
And a second supplier for supplying the second electronic component to the joining position.
A step, joining the first electronic component and the second electronic component
And a plurality of first fixing means for fixing the first electronic component.
1 fixing means, and the above-mentioned fixed to a plurality of said 1st fixing means
The first electronic component is moved along the rotation locus around the predetermined center position.
And a first rotating means configured to be rotationally movable
The predetermined rotation position of the first electronic component by the rolling means
First positioning hand for positioning at the joining position by the joining means
A plurality of steps for fixing the second electronic component.
Second fixing means and a plurality of the second fixing means
Rotate the second electronic component around a predetermined center position
It is configured to rotate along and move up and down.
In the vicinity of the position, the rotation trajectory of the second electronic component is the first
The rotation means partially overlaps the rotation trajectory of the first electronic component.
And a second rotation means configured to
According to the predetermined rotation position of the second electronic component by the joining means
And a second positioning means for positioning at the joining position by
However , the first rotating means and the second rotating means are synchronized with each other.
And operates to rotate the first electronic component and the second electronic component.
The first positioning means and the second positioning are moved by rolling.
And means for positioning at the joining position by means.
The bonding means is a bonding device that can move up and down.
The bonding position and the lower position of the bonding
The first electronic component by the second rotating means in a raised state
And a second electronic component, which is joined to the second electronic component . 2. The position detecting unit for detecting the fixed position of the first electronic component by the first fixing unit, and the fixed position of the first fixing unit in the first positioning unit. And a position adjusting mechanism that corrects a position when the first electronic component is rotationally moved to the vicinity of the joining position by the first rotating unit according to the fixed position detected by the position detecting unit. An electronic component joining apparatus, comprising: a position control unit that drives a position adjusting mechanism. 3. The position detecting unit according to claim 2,
While the set of the first electronic component and the second electronic component is joined at the joining position, the position of the other first electronic component that is stationary at a position other than the joining position is detected. A joining device for electronic components, which is configured as described above. 4. The opening according to claim 1, wherein the first fixing means holds the first electronic component from above and below so as to be openable and closable, and exposes the first electronic component above and below, respectively. Each of which has an upper clamp member and a lower clamp member, wherein the second fixing means has a holding base capable of holding the second electronic component placed on a holding surface, and at the joining position, The joining device for an electronic component, wherein the joining means is disposed so as to be able to come into contact with and separate from the upper and lower ones of the upper clamp member and the lower clamp member, and the holding surface is arranged to face the other of the upper and lower clamp members. 5. A first electronic component and a second electronic component are joined together.
A joining device for electronic parts, First supply means for supplying the first electronic component to the bonding position
And a second supplier for supplying the second electronic component to the joining position.
A step, joining the first electronic component and the second electronic component
And a joining means, The first supply means includes a plurality of means for fixing the first electronic component.
And rotating the first fixing means and the first electronic component.
Positioning the first rotating means and the first electronic component at the joining position
A first positioning means for The second supply means includes a plurality of means for fixing the second electronic component.
Of the second fixing means and the first rotating means in synchronization with the rotation transfer.
A mechanism for moving and a mechanism for moving up and down the second fixing means.
And a second rotation means having a second electronic part
Second positioning means for positioning to The bonding means is a bonding device that can be moved up and down.
Have, The rotation trajectory of the second electronic component is the rotation of the first electronic component.
The first rotating means and the second rotating means so as to partially overlap the locus.
The rotating means is arranged and descended at the joining position.
The bonding in the state and the second rotation in the raised state
By means of Joining the first electronic component and the second electronic component
A device for joining electronic parts, characterized by: 6. A first electronic component and a second electronic component are joined together.
A method of manufacturing an electronic component, The first electronic component is rotatably moved and supplied to the bonding position.
Process, The second electronic component is synchronized with the movement of the first electronic component.
A step of rotating and supplying to the bonding position, Bonding the first electronic component and the second electronic component
And a step of further joining, The rotational movement locus along which the first electronic component moves and the second electric path.
The above-mentioned first
1 electronic component, moving the second electronic component, When the bonding is lowered at the bonding position,
Together, the second electronic component is raised and the first electronic part is
An electronic device, characterized in that a product and the second electronic component are joined together.
How to join parts.