JP2003051531A - Method and device for taking out chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for taking out chip component, with which operation for taking out a chip component can be accelerated. SOLUTION: On the basis of the position information of a mark M, a table is moved by a CPU, the images of the mark M on a sheet 28 are respectively picked up while locating the mark under a camera, and the pitches of respective components 30 are calculated and stored from the wafer position recognized result of a recognizing processing part by the CPU. The table is moved for one pitch, the images of components 30A and 30B to be taken out during the rotation of a turn table are picked up by the camera. On the basis of the position recognized result of the recognizing processing part, the table is moved to a position just under a nozzle for correction and attracted. The table is moved just for one pitch while including a correction quantity for taking out the component 30B, the turn table is rotated, the images of components 30B and 30C are picked up and recognized, the component 30B is taken out, it is judged by the CPU whether the component 30B is the final component or not, and processing is repeated to the final component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention uses a recognition camera to image a chip component mounted on a component supply table movable in a plane direction in a state where a wafer attached to a sheet is diced and divided. The present invention relates to a chip component taking-out method and a taking-out device for taking out the chip component by a suction nozzle after correcting and moving the component supply table based on the execution result of the recognition process.

[0002]

2. Description of the Related Art Conventionally, when a chip nozzle (die) is picked up by a suction nozzle and picked up, an image pickup and recognition process of a chip part to be picked up by a recognition camera is executed after the movement of a part supply table is completed. After the recognition process is performed, a correction movement operation of the component supply table is performed to take out the chip component, and the chip component is taken out.

[0003]

Therefore, a two-time moving operation of moving the chip part to be taken out by the recognition camera and then correcting and moving the chip part to be taken out from the part supply table is performed. Was being conducted. Therefore, it has been an obstacle to speeding up the process of taking out chip components.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a chip component taking-out method and a taking-out device which can speed up the taking-out of chip components.

[0005]

Therefore, the first invention is
A wafer attached to a sheet is diced on a component supply table that is movable in the plane direction, and the chip components placed in a divided state are imaged with a recognition camera, and the component supply is performed based on the execution result of the recognition processing. After the table is corrected and moved, in the chip component taking-out method of taking out the chip component by a suction nozzle, the recognition camera captures an image of the chip component to be taken out and the chip component to be taken out next, and the recognition process is performed. After the component supply table is corrected and moved for taking out the chip component to be taken out based on the execution result, after the chip component is taken out by the suction nozzle, the component supply table is taken out to take out the next chip component. The step of moving the operation including one pitch and the correction amount, and the next step to be taken out by the recognition camera. Performing a-up components and recognition processing by imaging the chip component to be taken out to the next following, characterized in that the next chip component was to repeat the steps of retrieving by the suction nozzle.

According to a second aspect of the present invention, a chip camera mounted on a component supply table which is movable in a plane direction in a state where a wafer attached to a sheet is diced and divided is imaged by a recognition camera. In a chip component take-out device for taking out the chip part by a suction nozzle after correcting and moving the part supply table based on the execution result of the recognition process, the chip part to be taken out by the recognition camera and the chip part to be taken out next Is configured to be imaged, and after the component supply table is corrected and moved for taking out the chip component to be taken out based on the execution result of the recognition process, the chip component is taken out by the suction nozzle, and After taking out, in order to take out the next chip part from the parts supply table, one pitch and the correction amount are included. In order to repeat the operation, the recognition camera captures the image of the next chip part to be taken out by the recognition camera and the chip part to be taken out next and executes the recognition process, and the next chip part is taken out by the suction nozzle. It is characterized by being configured.

Further, in a third aspect of the invention, a chip camera mounted on a component supply table movable in a plane direction in a state where a wafer attached to a sheet is diced and divided is imaged by a recognition camera, After the component supply table is corrected and moved by the moving means based on the execution result of the recognition process, in the chip component take-out device that takes out the chip component by the suction nozzle, the chip component to be taken out by the recognition camera and the next take-out The chip part to be picked up is picked up, and the moving means is controlled so as to correct and move the part supply table in order to take out the chip part to be taken out based on the execution result of the recognition processing. The drive of the suction nozzle is controlled so that it is taken out by the nozzle, and after taking out,
The moving means is controlled so as to move the component supply table by including one pitch and a correction amount to take out the next chip component, and the next chip component to be taken out by the recognition camera and the next chip component. The present invention is characterized in that a recognition means is executed based on an image pickup result of a chip component to be taken out, and a control means for controlling the drive of the suction nozzle is repeated so as to repeat taking out the next chip component by the suction nozzle.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a taping device to which the present invention is applied will be described below with reference to the drawings. First, based on the plan view of the taping device of FIG.
The taping device will be described. Reference numeral 1 is a main body of a taping device, and a tape supply reel 2 is rotatably locked to a pin provided upright on the main body 1, and a tape main body (also referred to as a carrier tape) wound around the tape supply reel 2. An appropriate tension is applied to the tape body 3A by a pulley (not shown) on the tape body 3A, and the tape body 3A is fixed to the take-up reel 5 via the transport rail 4.

While the tape main body 3A is successively conveyed by a predetermined amount (wound on the take-up reel 5) in accordance with the rotation of the take-up reel 5 by the drive motor 5A,
After the chip component is inserted into the storage groove 3B of the tape body 3A and further conveyed to a predetermined position, the opening on the upper surface of the storage groove 3B is covered with a cover tape 3C supplied from a cover tape supply reel (not shown). , The take-up reel 5
Will be wound up. As described above, the tape body 3A
The storage tape 3 is formed by the storage groove 3B provided therein and the cover tape (top tape) 3C that is crimped onto the upper surface thereof. The tape body 3A is formed by the bottom tape and the spacer. It

After the chip component is inserted into the storage groove 3B of the tape body 3A by the component loading device 10, the component is inspected by the component inspection mechanism (not shown), and the tape pressure bonding mechanism (not shown). As a result, the tape body 3A and the cover tape 3C are pressure-bonded to each other and wound on the take-up reel 5.

Next, the component loading apparatus 10 will be described below with reference to FIGS. 1 and 2. First, the Y-axis table 11 that can be moved in the Y direction by the drive motor 11A.
X on the top is movable by the drive motor 12A in the X direction.
A table 12 is provided, and a frame 13 is fixed on the X table 12. An attachment plate 14 is fixed to the frame body 13, an index unit 15 is provided at the center of the attachment plate 14, and a recognition camera 16 and a recognition camera 17 are provided at the front and rear portions so as to face each other. .

On the lower surface of the mounting plate 14, there is provided a turntable 20 which is intermittently rotated (at intervals of 90 degrees) by the drive motor 15A via the index unit 15.
A plurality of, for example, four mounting heads 21 are provided on the turntable 20. For example, four suction loading nozzles 22 are provided on each mounting head 21.

The suction loading nozzle 22 is configured to be vertically movable together with the mounting head 21 by a vertical drive motor 22A, and is rotatable around a vertical line by a θ rotation motor 22B.

On the X table 12, a Y-axis table 24 movable in the Y direction by a drive motor 24A is provided.
Further, an X-axis table 25 movable in the X direction by a drive motor 25A is provided on the Y-axis table 24. A component supply table 27 is provided on the X-axis table 25 via a mounting member 26, and the wafer attached to the sheet 28 is diced on the supply table 27 and divided into individual chip components 30. This component is fixed in a state, and this component is taken out while being pushed up by a push-up pin (not shown) from the back surface.

Below the recognition camera 17 in FIG. 1 is a component suction (take-out) station. In the state shown in FIG. 1, that is, while the turntable 20 is rotating, the chip parts 30 to be taken out on the part supply table 27 and the next one should be taken out. Chip parts 30
Is recognized by the recognition camera 17 and the recognition processing section 17A recognizes the position of the chip component 30. The Y table 2 is positioned so as to be positioned immediately below the moving suction loading nozzle 22.
4 and the X table 25 are moved, and the chip loading nozzle 22 that has lowered the chip component 30 on the component supply table 27 at this component suction station sucks and takes it out.

Next, in accordance with 90-degree rotation of the turntable 20 through the index unit, it is conveyed to the next station and further to the next component insertion station. During this conveyance, the recognition camera 16 conveys a rail. The three storage grooves 3B of the tape main body 3A on 4 are imaged. That is, in order to confirm whether or not the chip component 30 has been inserted into the leftmost storage groove 3B, and to confirm that the chip component 30 has not been inserted (empty) into the rightmost storage groove 3B. Also, the three storage grooves 3B are simultaneously imaged in order to recognize the position of the rightmost storage groove 3B.

Therefore, after the image is picked up, the recognition processing section 16A recognizes the position of the rightmost storage groove 3B, and based on the result, the CPU 6 as the control device drives the drive motor 11A and the X table 12 of the Y table 11. The suction loading nozzle 2 which corrects and controls the drive motor 12A and the θ rotation motor 22B and descends to an appropriate position in the middle storage groove 3B.
2, the chip component 30 is inserted. That is,
At this component insertion station, the turntable 2 is placed in the storage groove 3B of the tape body 3A on the transport rail 4 on which the chip component 30 sucked by the suction loading nozzle 22 is waiting below.
By the correction movement of 0 in the XY directions and the correction movement of the suction loading nozzle 22 in the θ direction, the insertion and loading can be performed at an appropriate position.

After this insertion and loading, the drive motor 5
While the tape main body 3A is sequentially conveyed by a predetermined amount in accordance with the rotation of the take-up reel 5 by A (wound by the take-up reel 5), the component inspection mechanism is operated by the tape main body 3A.
The tape main body 3 that has undergone a component inspection (for example, an electrical characteristic inspection) on the chip component inserted in the storage groove 3B of
The tape A is pressed against the cover tape 3C to complete taping.

The chip component 30 is placed in the leftmost storage groove 3B.
In order to confirm whether or not has been inserted, if the result of the recognition processing of the recognition processing unit 16A based on the image pickup of the recognition camera 16 determines that it is not inserted, the taping device is stopped. The CPU 6 controls.

Further, even when it is judged that the taping device is already inserted in the rightmost storage groove 3B, the CPU 6 controls so as to stop the taping device.

Next, a control block diagram of the taping device will be described with reference to FIG. Reference numeral 6 is a CPU as a control device for integrally controlling the operation of taking out and loading the chip parts of the taping device, and 7 is a RAM as a storage device.
(Random Access Memory), 8 is a ROM (Read Only Memory). Then, based on the data stored in the RAM 7, the CPU 6 comprehensively controls each drive source through the interface 9 in accordance with the program stored in the ROM 8 for the operation of taking out and loading the chip component of the taping device.

With the above structure, the taking-out operation of the chip component 30 will be described in detail below with reference to the flowchart of FIG. First, based on the position information of the recognition mark M stored in the RAM 7, the CPU 6 drives the drive motors 25A and 2A.
4A is controlled to control the X-axis table 25 and the Y-axis table 24.
Are moved to position the recognition marks M on the sheet 28 fixed to the component supply table 27 below the recognition camera 17 and imaged (see FIG. 4).
A recognizes the position of the wafer (S1).

Then, the result of this recognition processing is stored in the RAM 7, and the CPU 6 is based on this result and each chip component 30.
Of the pitch of the RAM 7 and the result of the calculation.
To store. Next, the CPU 6 uses the parts supply table 2
7 is moved by one pitch, and the turntable 20 is rotated by 90 degrees by the index unit 15 (S2).

While the turntable 20 is rotating, the recognition camera 17 simultaneously captures images of the chip parts 30A to be taken out and the chip parts 30B to be taken out next on the part supply table 27, and the recognition processing section 17A detects the chip parts 30. The position is recognized (S3). In addition, as shown in FIG.
The component located inside the camera center 19 is the chip component 30A to be taken out, and the component located above it is the chip component 30B to be taken out next.

Then, based on the recognition result of the recognition processing section 17A, the component supply table 27 is corrected and moved so as to be positioned immediately below the moving suction loading nozzle 22 (S4). Next, at the stopped component suction station, the lowered chip component 30 on the component supply table 27 is adsorbed and taken out by the suction loading nozzle 22 (S5).

Next, the component supply table 27 is moved to remove the next chip component 30B by one pitch and a correction amount, and the index unit 1 is operated.
The turntable 20 is rotated 90 degrees again by 5 (S6).
Note that the correction amount at this time is the same as that of the chip component 3 as described above.
This is based on the result of the recognition camera 17 simultaneously capturing 0A and 30B and performing recognition processing by the recognition processing unit 17A.

While the turntable 20 is rotating, the next chip component 30B to be taken out by the recognition camera 17 is obtained.
Then, the chip component 30C to be taken out next is imaged at the same time to execute recognition processing (S7), and the next chip component 30B is taken out by the suction loading nozzle 22 at the stopped component suction station (S8). Then, the CPU 6 determines whether or not it is the final chip component 30 (S9), and if it is not the final chip component, the process returns to step S6 until the final chip component 30 is reached, and steps S7, S8, S9, and S6 are sequentially repeated. .

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention can be carried out in the above-described various ways without departing from the spirit of the invention. It is intended to cover alternatives, modifications or variations.

[0029]

As described above, the present invention can provide a chip component taking-out method and a taking-out device which can speed up the taking-out of chip components.

[Brief description of drawings]

FIG. 1 is a plan view showing a taping device.

FIG. 2 is a left side view showing a taping device.

FIG. 3 is a control block diagram.

FIG. 4 is a diagram showing an arrangement of chip components on a component supply table.

FIG. 5 is a diagram showing a flowchart.

[Explanation of symbols]

1 Taping device body 3 storage tape 3A tape body 3B storage groove 3C cover tape 10 Parts loading device 20 turntable 21 mounting head 22 Suction loading nozzle 30 chip parts

Continued front page    (72) Inventor Toru Beppu             2-5-3 Keihan Hondori, Moriguchi City, Osaka Prefecture             Within Yo Denki Co., Ltd. F term (reference) 3E054 AA20 BA10 DC12 DC17 EA03                       FA02 FA06 GA01 GA02 GA04                       GB01 GB05 GC03 GC07 GC08                       GC10 HA01 HA07 JA10                 5E313 AA03 AA18 AA23 AA31 CC03                       CC04 DD02 DD03 DD07 DD23                       EE24 EE25 FF24 FF26 FF33                       FG10                 5F031 CA02 CA20 FA05 FA07 FA11                       FA12 FA24 GA23 GA47 GA49                       GA50 GA54 HA57 JA06 JA25                       JA27 JA51 KA06 KA11 MA35                       MA40

Claims (3)

[Claims] 1. A recognition camera takes an image of a chip component mounted on a component supply table that is movable in a plane direction in a state where a wafer attached to a sheet is diced and divided, and the recognition processing execution result. After correcting and moving the component supply table based on the above, in the chip component taking-out method of taking out the chip component by a suction nozzle, the chip camera to be taken out by the recognition camera and the chip part to be taken out next are imaged. , After the component supply table is corrected and moved for taking out the chip component to be taken out based on the execution result of the recognition process, and after the chip component is taken out by the suction nozzle, the component supply table is changed to the next chip. A step of moving the part including one pitch and a correction amount to take out the part; It is characterized in that the step of picking up the next chip part to be taken and the chip part to be taken out next and executing the recognition process, and the step of taking out the next chip part with the suction nozzle are repeated. How to take out chip parts. 2. A recognition camera takes an image of a chip component placed in a state where a wafer attached to a sheet is diced and divided on a component supply table movable in a plane direction, and the recognition processing execution result is obtained. After correcting and moving the component supply table based on the above, in a chip component take-out device for taking out the chip component by a suction nozzle, the chip camera to be taken out by the recognition camera and the chip part to be taken out next are imaged. , After the component supply table is corrected and moved for taking out the chip component to be taken out based on the execution result of the recognition processing, the chip component is taken out by the suction nozzle, and after the taking out, Move the component supply table including one pitch and the correction amount to extract the next chip component. It is characterized in that the recognition camera picks up an image of the next chip part to be taken out and the next chip part to be taken out next, executes the recognition process, and repeatedly takes out the next chip part by the suction nozzle. A device for taking out chip parts. 3. A recognition camera takes an image of a chip component mounted on a component supply table that is movable in a plane direction in a state in which a wafer attached to a sheet is diced and divided, and the recognition processing execution result is obtained. In the device for picking up a chip component that picks up the chip component by a suction nozzle after the component supply table is corrected and moved by the moving means based on the above, the recognition camera captures the chip component to be taken out and the chip component to be taken out next. In order to take out the chip component to be taken out based on the execution result of the recognition processing, the moving means is controlled so as to correctively move the component supply table, and then the chip component is taken out by the suction nozzle. Control the drive of the suction nozzle, and after taking it out, set the above-mentioned component supply table to the next chip. The moving means is controlled so as to move by including one pitch and a correction amount to take out the product, and the imaging result of the next chip part to be taken out by the recognition camera and the chip part to be taken out next to Based on the recognition process,
A chip component take-out device comprising a control means for controlling the drive of the suction nozzle so as to repeat the taking-out of the next chip component by the suction nozzle.