JP4302956B2 - Die pickup device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a die pickup apparatus that picks up a die on a wafer table.
[0002]
[Prior art]
In this type of conventional die pick-up device, mapping data that is information on whether each die on the wafer is good or defective is stored in the storage device, and only good products are picked up based on this data, It was mounted on a substrate (see, for example, Patent Document 1).
[0003]
[Patent Document 1]
Japanese Patent Laid-Open No. 2002-26041
[Problems to be solved by the invention]
However, in a die pick-up apparatus that picks up only non-defective products based on the mapping data as described above, it is not possible to use the in-process wafer again after terminating the wafer halfway for some reason and using another wafer. It was difficult.
[0005]
Accordingly, an object of the present invention is to enable pick-up based on mapping data when a wafer in progress is used again so that the wafer is not wasted.
[0006]
[Means for Solving the Problems]
Therefore, according to the first aspect of the present invention, in the die pick-up apparatus that sequentially picks up the dies on the wafer table by the take-out tool , information on whether each die in the wafer is a non-defective product or a defective product and the taking-out from the wafer is terminated halfway. Storage device that stores mapping data for each wafer as to how far the die was taken out and loaded when the operation on the in-process wafer was stopped, and which wafer in progress A selection device for selecting whether the wafer is a selected wafer, and when a predetermined wafer in process is selected by the operator's operation of the selection device, a pickup is performed based on mapping data relating to the wafer stored in the storage device And a control device that controls to start work.
[0007]
According to a second aspect of the present invention, in a die pick-up apparatus for picking up a die on a wafer table by a take-out tool, information on whether each die in the wafer is a non-defective product or a defective product and when the taking-out from the wafer is terminated halfway. In addition, there is a storage device for storing mapping data, which is intermediate information about how many dies have been taken out and loaded when the operation of the in-process wafer is stopped, and whether it is a new wafer. A selection device for selecting which of the wafers, and mapping data relating to the wafer stored in the storage device when a predetermined wafer in process is selected by an operator's operation of the selection device And a control device for controlling to start the pickup operation based on the above.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, there are a die bonder, a taping device, and the like as a die pickup device to which the present invention is applied, but an embodiment applied to the taping device will be described with reference to the drawings. First, the taping device will be described with reference to a plan view and a left side view of the taping device shown in FIGS. Reference numeral 1 denotes a main body of the taping device. A tape supply reel 2 is rotatably locked to a pin erected on the main body 1 and is wound around the tape supply reel 2 (also referred to as a carrier tape). An appropriate tension is applied to the tape body 3A by a pulley (not shown) and the tip of 3A is fixed to the take-up reel 5 via the transport rail 4.
[0009]
Then, while the tape main body 3A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown), the storage recess 3B of the tape main body 3A is conveyed. The die D is inserted into the inside, further conveyed to a predetermined position, the opening on the upper surface of the storage recess 3B is covered with the cover tape 3C supplied from the cover tape supply reel 6, and then wound on the take-up reel 5. Go. As described above, the tape 3 is formed by the tape main body 3A, the housing recess 3B provided on the tape main body 3A, and the cover tape (top tape) 3C that is pressure-bonded to the upper surface of the tape main body 3A. It is formed with a tape and a spacer.
[0010]
Then, after the die D is inserted into the housing recess 3B of the tape main body 3A by the component loading device 10, this die D is inspected by the component inspection mechanism 7, and the tape main body 3A and the cover tape 3C are inspected by the tape crimping mechanism 8. Is pressure-bonded and wound around the take-up reel 5.
[0011]
Next, the component loading apparatus 10 will be described. First, an X table 12 movable in the X direction by an X axis drive motor 12A is provided on the Y table 11 movable in the Y direction by the Y axis drive motor 11A, and a frame 13 is provided on the X table 12. Is fixed. An index unit 15 is provided at the center of the horizontal plate 14 of the frame 13, and a recognition camera 16 and a recognition camera 17 are provided facing the front and rear portions.
[0012]
A rotating plate 20 is provided on the lower surface of the horizontal plate 14 to rotate intermittently (at intervals of 90 degrees) via the index unit 15 by a drive motor (not shown). A suction loading nozzle 22 as an extraction tool is disposed on each of the mounting heads 21 disposed at intervals of four.
[0013]
The suction loading nozzle 22 is configured such that the mounting head 21 can be moved up and down by a vertical axis drive motor 18 (not shown) and can be rotated around a vertical line by a θ axis drive motor 19.
[0014]
Further, a Y table 24 movable in the Y direction by a Y axis drive motor 24A is provided on the X table 12, and further moved on the Y table 24 in the X direction by an X axis drive motor 25A. An X table 25 is provided. A die supply table 27 is provided on the X table 25 via a support table 26. The die supply table 27 is rotatable by a predetermined rotation range about the vertical direction. A wafer attached to a sheet 28 is placed on the supply table 27. It is diced and fixed in a state of being divided into individual dies D, and this die D is taken out while being pushed up from the back by a push-up pin 29.
[0015]
Reference numeral 30 denotes a θ-axis drive motor. A gear 31 formed around the drive shaft of the θ-axis drive motor 30 meshes with a gear 32 formed around the lower portion of the die supply table 27. The two gears 31 and 32 are rotated by the rotation of the drive shaft by driving, and the die supply table 27 is rotated by, for example, 90 degrees, 180 degrees, and 270 degrees through the bearings 33.
[0016]
Below the recognition camera 17 in FIG. 1 is a component suction (takeout) station, which recognizes the state of FIG. 1, that is, the die D to be taken out and the next die D to be taken out on the die supply table 27 during the rotation of the turntable 20. The image is captured by the camera 17, the position of the die D is recognized by the recognition processing unit 34, and the Y table 24 and the X table 25 are moved so as to be positioned immediately below the moving suction loading nozzle 22. The suction loading nozzle 22 that has lowered the die D on the die supply table 27 at the component suction station sucks and takes out.
[0017]
Next, it is transported to the next recognition station in accordance with the 90 ° rotation of the turntable 20 via the index unit, and further transported to the next component insertion station. The component recognition camera 9 is arranged at this recognition station, and the die D sucked and held by the suction loading nozzle 22 is imaged, and the suction posture, appearance shape, bump size and position, etc. are recognized by the recognition processing device 34. The In this case, if the appearance shape (such as a chip) and the size and position of the bump are abnormal, they are discarded as described later.
[0018]
Next, it is conveyed to the next component insertion station in accordance with the 90 ° rotation of the turntable 20 via the index unit. During this conveyance, the three storage recesses of the tape main body 3A on the conveyance rail 4 by the recognition camera 16 are conveyed. 3B is imaged. That is, for confirming whether or not the die D has been inserted into the leftmost storage recess 3B, it is confirmed that it is not inserted into the rightmost storage recess 3B (empty). In order to recognize the position of the rightmost storage recess 3B, the three storage recesses 3B are imaged simultaneously.
[0019]
Accordingly, after the image is picked up by the recognition camera 16, the recognition processing device 34 recognizes the position of the rightmost storage recess 3B, and based on the result, the CPU 35, which is a control device, drives the drive motors 11A and X table of the Y table 11. The 12 drive motors 12A and the θ-axis drive motor 19 are corrected and controlled, and the die D is inserted by the suction loading nozzle 22 that descends to an appropriate position in the middle housing recess 3B. That is, in this component insertion station, the correction movement in the X and Y directions of the rotary disk 20 and the storage recess 3B of the tape body 3A on the transport rail 4 waiting below the die D sucked by the suction loading nozzle 22 and The suction loading nozzle 22 can be inserted and loaded at an appropriate position by the correction movement in the θ direction.
[0020]
After the insertion and loading, while the tape main body 3A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up reel 5 (taken up by the take-up reel 5), the component inspection mechanism 7 makes the tape main body 3A. A component inspection (for example, an electrical characteristic inspection) is performed on the chip component inserted in the storage recess 3B of the tape, and the tape body 3A and the cover tape 3C after the inspection of the die D by the tape crimping mechanism 8 are completed. The taping is completed to complete the taping.
[0021]
The component inspection mechanism 7 includes a mark recognition camera 7A and an inspection unit 7B, and the mark recognition camera 7A captures an image of the die D inserted in the storage recess 3B while illuminating with a lighting device. The camera recognizes a mark such as a model number attached to the die D in the storage recess 3B, and the inspection unit 7B has a probe needle on the lower surface and is movable in the plane direction and has a vertical movement mechanism (not shown). The probe needle is brought into contact with the die D inserted into the housing recess 3B by being lowered, and, for example, the electrical characteristics are inspected.
[0022]
In addition, in order to confirm whether or not the die D has been inserted into the leftmost storage recess 3B, it has been determined that the die D has not been inserted as a result of recognition processing by the recognition processing device 34 based on the imaging of the recognition camera 16. In that case, the CPU 35 controls to stop the taping device.
[0023]
Further, even when it is determined that the tape is already inserted into the rightmost storage recess 3B, the CPU 35 controls to stop the taping device.
[0024]
Next, a description will be given of a control block diagram of the taping device based on FIG. Reference numeral 35 denotes a CPU as a control device that performs overall control of operations related to removal and loading of chip parts of the taping device, 36 denotes a RAM (Random Access Memory) as a storage device, and 37 denotes a ROM (Read Only Memory). ). Then, based on the data stored in the RAM 36, the CPU 35 determines each drive source via the interface 38 and the drive circuit 39 for operations related to the removal and loading of the chip parts of the taping device according to the program stored in the ROM 37. Take overall control. It should be noted that a hard disk may be used instead of the ROM 37, and the CPU 35 may control each drive source according to a program read from the hard disk into the RAM 36.
[0025]
The RAM 36 determines whether each die D (indicated by a position from the reference die) on the sheet 28 stretched on the die supply table 27 is a non-defective product (displayed as “OK”) or a defective product (“NG”). Information mapping data (see FIG. 5) can be stored for each wafer.
[0026]
Reference numeral 40 denotes an operation unit, which is a numeric keypad 41 for keying in numbers, a cursor key 42, a SET key 43 for setting a mode, a teaching key 44 for setting the electronic component mounting apparatus to a teaching mode, and setting the apparatus to an automatic operation mode. An automatic key 45, a manual key 46 for setting the apparatus to a manual operation mode, a start key 47, an operation key 48, and a stop key 49.
[0027]
The recognition processing device 34 captures images captured by the respective recognition cameras 16 and 17, 50 is a CRT that displays the captured images, and 51 is a CRT that displays an editing screen for teaching. 52 is a mouse.
[0028]
Note that the CRT 50 provided with various touch panel switches 53 is used as a selection device for the operator to select a new wafer or an in-process wafer. That is, when the operator operates the touch panel switch 53, the die D is taken out from a new wafer and loaded into each storage recess 4B of the storage tape 4, or from which wafer in progress the die D is taken out. It is possible to select whether or not each of the storage recesses 4B of the storage tape 4 is loaded and stored. By this selection, mapping data related to the corresponding wafer stored in the RAM 36 is selected (designated), and the CPU 35 selects the selected data. Control to start the pickup operation based on the mapping data.
[0029]
In the touch panel switch 53, the entire surface of the glass substrate is coated with a transparent conductive film, and electrodes are printed on four sides. Therefore, when a very small current is passed through the surface of the touch panel switch 53 and the operator touches it, current changes are caused in the electrodes on the four sides, and the coordinate value touched by the circuit board connected to the electrodes is calculated. Therefore, if the coordinate value matches a coordinate value in a coordinate value group stored in advance in the RAM 36 as a switch unit for performing a certain operation, the operation is performed.
[0030]
With the above configuration, the operation of taking out the die D will be described with reference to FIGS. 5 and 6 in particular. First, a new wafer is set on the chip component supply table 27, a disk storing mapping data related to the new wafer is set in the apparatus, and the mapping data is stored in the RAM 36.
[0031]
Then, the operator touches a “new wafer switch unit” which is one of the touch panel switches 53 on the CRT 50 to select a new wafer. Here, when the operation key 48 is operated, the CPU 35 controls each drive source and the like so that the die take-out and loading operations of this apparatus are started.
[0032]
That is, the die D to be taken out on the die supply table 27 is imaged by the recognition camera 17 during the movement of the turntable 20 to the component suction (takeout) station, and the position of the die D and the number of bumps B are detected by the recognition processing device 34. And recognize the area. At this time, as for the position of the die D, the recognition processing device 34 compares the image of the die D to be taken out picked up by the recognition camera 17 with the template stored and registered in the RAM 36. Recognition process.
[0033]
Based on the recognition result, for example, if the number of bumps B is 4 and the area is more than 80% of the set area, the product is good, and the operation is continued and the position is just below the moving suction loading nozzle 22. The Y table 24 and the X table 25 are moved so as to be positioned, and the die D on the chip component supply table 27 is lowered and sucked and taken out at the component suction station by the suction loading nozzle 22.
[0034]
Then, the recognition processing is sequentially performed as described above, and if it is a non-defective product, the die D on the chip component supply table 27 is picked up by the suction loading nozzle 22 to be picked up, but the second (second) die is taken out. Since the third die D is defective after taking out D, the fourth die D is imaged by the recognition camera 17, and the recognition processor 34 recognizes the position of the die D and the number and area of the bumps B. . At this time, if the number of bumps B is 3 or less or the area is 80% or less of the set area based on the recognition result, it is determined that the product is defective (recognized NG). If it is determined that the product is defective (recognized NG) based on the recognition result, the die is discarded in a collection tray (not shown).
[0035]
Next, the rotating disk 20 is rotated 90 degrees to be conveyed to a recognition station next to the component suction (removal) station, and the recognition camera 9 images the die D sucked and held by the suction loading nozzle 22 to pick up the suction posture and appearance. , The size and position of the bumps, etc. are recognized by the recognition processing device 34. In this case, if the appearance shape (such as chipping) and the size and position of the bump are abnormal, they are discarded in a collection tray (not shown). At this time, the image of the die D to be taken out picked up by the recognition camera 9 is compared with the template stored and registered in the RAM 36, and the recognition processor 34 recognizes the position of the die D.
[0036]
Then, during the conveyance by rotating the turntable 20 by 90 degrees, the recognition camera 16 images the three storage recesses 3B of the tape body 3A on the conveyance rail 4. That is, for checking whether or not the chip component 30 has been inserted into the leftmost storage recess 3B, it is confirmed that it is not inserted into the rightmost storage recess 3B (empty). The three storage recesses 3B are simultaneously imaged in order to recognize the position of the rightmost storage recess 3B.
[0037]
Therefore, after the image is picked up, the recognition processing device 34 recognizes the position of the rightmost storage recess 3B, and based on the result, the control device (not shown) controls the Y-axis drive motor 11A of the Y table 11 and the X of the X table 12. The shaft drive motor 12A and the θ-axis drive motor 19 are corrected and controlled, and the chip component 30 is inserted by the suction loading nozzle 22 that descends to an appropriate position in the middle housing recess 3B. That is, in this component insertion station, the image of the component recognition camera 9 and the recognition camera 16 is captured in the storage recess 3B of the tape main body 3A on the transport rail 4 waiting below the die D sucked by the suction loading nozzle 22. Based on the result, recognition processing is performed, and insertion and loading can be performed at an appropriate position by the correction movement in the XY direction of the turntable 20 and the correction movement in the θ direction of the suction loading nozzle 22.
[0038]
Then, after the insertion and loading, while the tape main body 3A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown), Component inspection is performed by the component inspection mechanism 7 on the die D inserted into 3B.
[0039]
That is, the die D inserted in the storage recess 3B is imaged by the mark recognition camera 7A while being illuminated by the illumination device, and the mark such as the model number attached to the chip component 30 is recognized. Further, the inspection unit 7B provided with the probe needle moves in the plane direction and the vertical direction, and the probe needle is brought into contact with the die D inserted into the housing recess 3B, for example, to inspect electric characteristics and the like.
[0040]
In this way, the dies D are inserted one after another, and after completion of the inspection, the tape body 3A and the cover tape 3C are crimped by the tape crimping mechanism 8 to complete the taping, and the tape 3 is sequentially wound around the take-up reel 5. It will be taken.
[0041]
Here, when an operator operates the stop key 49 in order to end the removal from the new wafer for some reason, the CPU 35 controls to stop the apparatus and sets mapping data related to the wafer. Is stored in the RAM 36 as mapping data of another wafer (for example, in-process wafer number 1). When another new wafer is used, as described above, another new wafer is set on the chip component supply table 27, and a disk storing mapping data related to the new wafer is set in this apparatus. The mapping data is stored in the RAM 36. Again, when the operator touches a “new wafer switch section” which is one of the touch panel switches 53 on the CRT 50, selects a new wafer and operates the operation key 48, the die is removed from another new wafer. The CPU 35 controls each drive source and the like so that production operations such as take-out and loading operations are started.
[0042]
Then, when the operator operates the stop key 49 to end the removal from the other new wafer halfway, the CPU 35 controls to stop the apparatus and sets mapping data related to the wafer. Is stored in the RAM 36 as mapping data of the wafer (for example, in-process wafer number 2).
[0043]
Thereafter, when an operator wants to use the in-process wafer (in-process wafer number 1), touching “in-process wafer number 1 switch portion” which is one of the touch panel switches 53, the in-process wafer number is displayed. One wafer is selected. Accordingly, the CPU 35 controls each drive source and the like so as to start production operations such as die removal and loading operations according to the mapping data of the in-process wafer (in-process wafer number 1) stored in the RAM 36.
[0044]
At this time, when the previous removal from the wafer is completed in the RAM 36, intermediate information about the in-process wafer (in-process wafer number 1) (part of mapping data), that is, the previous operation is performed. Since information on how many (up to how many) dies D have been taken out and loaded has been stored when the operation is stopped, taking out and loading operations from the next die D are performed. Become.
[0045]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0046]
【The invention's effect】
According to the present invention, when the in-process wafer is used again , when the operation for the in-process wafer is stopped when the extraction from the wafer in the mapping data is terminated halfway, A pickup based on the intermediate information about whether the wafer has been taken out and loaded can be made possible so that the wafer is not wasted.
[Brief description of the drawings]
FIG. 1 is a plan view of a taping device.
FIG. 2 is a left side view of the taping device.
FIG. 3 is a control block diagram of the taping device.
FIG. 4 is a diagram showing mapping data.
FIG. 5 is a flowchart relating to storage of an in-process wafer.
FIG. 6 shows a flowchart when the work-in-process wafer is used again.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 3 Storage tape 3A Tape main body 3B Storage recessed part 3C Cover tape 10 Component loading apparatus 17 Recognition camera 20 Turntable 21 Mounting head 22 Adsorption loading nozzle 27 Die supply table 28 Sheet 34 Recognition processing apparatus 35 CPU
36 RAM
53 Touch Panel Switch D Die

Claims (2)

In the die pick-up device that picks up the dies on the wafer table sequentially with the take-out tool , information on whether each die in the wafer is non-defective or defective and when the take-out from the wafer is finished halfway, the in-process wafer A storage device that stores mapping data, which is intermediate information about how many dies have been taken out and loaded when operation is stopped, and a selection device that selects which wafer is in progress When a predetermined wafer in process is selected by the operator's operation of the selection device, the pickup operation is controlled based on mapping data relating to the wafer stored in the storage device. A die pickup device comprising a control device. In a die pick-up device that picks up a die on a wafer table with a take-out tool, information on whether each die on the wafer is a non-defective product or a defective product, and when a wafer is finished being removed, Storage device that stores mapping data for each wafer as to how far the die was taken out and loaded when the operation was stopped, and which wafer is new or in progress A pick-up operation based on mapping data relating to the wafer stored in the storage device when a selection device for selecting the selected wafer and a predetermined wafer in progress are selected by the operator's operation of the selection device And a control device that controls the die pickup device.

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