JPH08330336A - Pickup device and chip positioning method - Google Patents

Pickup device and chip positioning method

Info

Publication number
JPH08330336A
JPH08330336A JP7133574A JP13357495A JPH08330336A JP H08330336 A JPH08330336 A JP H08330336A JP 7133574 A JP7133574 A JP 7133574A JP 13357495 A JP13357495 A JP 13357495A JP H08330336 A JPH08330336 A JP H08330336A
Authority
JP
Japan
Prior art keywords
chip
center
camera
recognition
correction amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7133574A
Other languages
Japanese (ja)
Other versions
JP3418929B2 (en
Inventor
Nobuhiro Hori
展啓 堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Machinery Inc
Original Assignee
Nichiden Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichiden Machinery Ltd filed Critical Nichiden Machinery Ltd
Priority to JP13357495A priority Critical patent/JP3418929B2/en
Priority to US08/654,927 priority patent/US5946409A/en
Priority to KR1019960019288A priority patent/KR100238341B1/en
Publication of JPH08330336A publication Critical patent/JPH08330336A/en
Application granted granted Critical
Publication of JP3418929B2 publication Critical patent/JP3418929B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE: To accurately position all chips in the center of the visual field of camera by a method wherein the chips are arranged in the center of visual field of camera by giving the correction amount obtained by the preceding recognition to the preceding recognition data. CONSTITUTION: An image processing part 3 pre-recognizes a plurality of chips T within the visual field (m) of camera while the chips T are in operation, the image processing part 3 recognizes the amount of deviation of the center (c) when the chips T are arranged on the center (c) within the camera's visual field (m) based on the above-mentioned pre-recognition, an automatic teaching, in which the amount of deviation-recognized is used as the correction amount of chip position of pre-recognition, is conducted, and when the chip of the same position is pre-recognized while the correction amount by the automatic teaching is being renewed, the correction amount obtained by the last pre-recognition is given to pre-recognition. On the control part 7, a movable table 2 is operated by a movable table driving part 6 based on the output of the image processing part 3, and the chip T is a arranged on the center C. As a result, highly reliable high-speed pickup can be accomplished.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はピックアップ装置及びチ
ップ位置決め方法に関し、詳しくは、電子部品の製造で
使用されるピックアップ装置、及びチップのピックアッ
プ時に前記チップを画像認識して位置決めするチップ位
置決め方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pick-up device and a chip positioning method, and more particularly to a pick-up device used in the manufacture of electronic parts and a chip positioning method for recognizing and positioning the chip when picking up the chip. .

【0002】[0002]

【従来の技術】例えば、半導体装置の製造におけるマウ
ント工程では、半導体ウェーハから分割されて整列配置
された半導体ペレット(以下、チップと称す)を画像認
識した上で良品のチップをピックアップしている。
2. Description of the Related Art For example, in a mounting step in the manufacture of a semiconductor device, a semiconductor chip (hereinafter referred to as a chip) divided from a semiconductor wafer and aligned is image-recognized, and a good chip is picked up.

【0003】具体的には、可動テーブル上に整列状態で
XY配置されたチップを光学系(カメラを含む)で撮像
し、その撮像されたカメラ視野内にある複数のチップを
画像処理する。この画像処理は、光学系による映像信号
により得られたチップの画像データをフレームメモリに
記憶する。その画像データに基づく画像認識により良品
のチップを選択して認識データによりピックアップポジ
ションに位置決めする。そして、前記ピックアップポジ
ションに位置決めされた良品のチップをコレットにより
真空吸着してピックアップし、リードフレームのアイラ
ンドにマウントしている。
Specifically, an optical system (including a camera) picks up images of chips arranged in an XY state on a movable table in an aligned state, and a plurality of chips within the picked-up camera field of view are subjected to image processing. In this image processing, the image data of the chip obtained from the video signal by the optical system is stored in the frame memory. A non-defective chip is selected by image recognition based on the image data and positioned at the pickup position based on the recognition data. Then, a non-defective chip positioned at the pickup position is vacuum-sucked by a collet to be picked up and mounted on an island of the lead frame.

【0004】具体的に、前記画像処理は、カメラ視野の
センタがピックアップポジションと一致するように設定
された状態で実行され、例えば、図3に示すように光学
系による映像信号Sを所定のしきい値Lでもって二値化
することにより得られたチップTの画像データをフレー
ムメモリに記憶する。この画像データに基づいて、同図
に示すように二値化信号Aの立ち上がりaと立ち下がり
bとの中点を一つのチップTの中心位置(以下、チップ
位置と称す)とし、前記カメラ視野のセンタcに対する
前記チップ位置を画像認識する。これにより、前記カメ
ラ視野のセンタcからチップ位置までの距離dが移動に
必要な距離となる。尚、図中、カメラ視野のセンタcか
ら左側に位置するチップT(破線で示すもの)は、実際
上、ピックアップ済みであるために存在しない場合があ
るが、仮想的に存在するものとして説明する。
Specifically, the image processing is executed in a state where the center of the camera field of view is set to coincide with the pickup position. For example, as shown in FIG. The image data of the chip T obtained by binarizing with the threshold value L is stored in the frame memory. Based on this image data, as shown in the same figure, the midpoint between the rising edge a and the falling edge b of the binarized signal A is set as the center position of one chip T (hereinafter referred to as the chip position), and the camera field of view is set. The chip position is image-recognized with respect to the center c. As a result, the distance d from the center c of the camera field of view to the chip position becomes the distance required for movement. In the figure, the chip T (shown by the broken line) located on the left side of the center c of the field of view of the camera may not actually exist because it has already been picked up, but it will be described as being virtually present. .

【0005】このようにして画像認識により得られたチ
ップ位置に基づいて、そのチップが良品であれば、可動
テーブルの移動(距離d)でもって前記チップ位置にあ
るチップをカメラ視野のセンタcに位置決め配置する。
その後、前記カメラ視野のセンタcであるピックアップ
ポジションに位置決め配置された良品のチップをコレッ
トによりピックアップ動作を実行する。
Based on the chip position thus obtained by image recognition, if the chip is a non-defective product, the chip at the chip position is set to the center c of the camera visual field by the movement of the movable table (distance d). Position and arrange.
After that, the non-defective chip positioned at the pickup position which is the center c of the camera field of view is picked up by the collet.

【0006】[0006]

【発明が解決しようとする課題】ところで、前述したよ
うにチップを光学系で撮像し、その撮像されたカメラ視
野内にある複数のチップを画像処理し、その画像データ
に基づく画像認識により得られたチップ位置でもって、
可動テーブルの移動により前記チップ位置にあるチップ
をカメラ視野のセンタに位置決め配置している。
By the way, as described above, the chips are picked up by the optical system, a plurality of chips in the field of view of the picked-up images are subjected to image processing, and the images are obtained by the image recognition based on the image data. With the tip position,
By moving the movable table, the chip at the chip position is positioned and arranged at the center of the visual field of the camera.

【0007】しかしながら、複数のチップを撮像したカ
メラ視野では、チップ表面での照度分布や光学系のレン
ズ歪み等により、明暗や歪みが生じて全体的に均一性が
損なわれることがある。例えば、前述したチップ表面で
の照度分布や光学系のレンズ歪み等により、図4に示す
ように光学系による映像信号S’が正規の矩形波となら
ず波形歪み(例えば、図示ではカメラ視野の両端に位置
するチップで生じる波形歪み)が生じた場合、この映像
信号S’を所定のしきい値Lで二値化すると、その二値
化信号A’について、カメラ視野の両端に位置するチッ
プによる立ち上がりa’が実際のチップによる立ち上が
りa(図3参照)とずれて、その立ち上がりa’と立ち
下がりbとの中点であるチップ中心が実際のチップ中心
からずれることになる。
However, in the field of view of a camera that images a plurality of chips, brightness and distortion may occur due to the illuminance distribution on the chip surface, lens distortion of the optical system, etc., and overall uniformity may be impaired. For example, due to the above-mentioned illuminance distribution on the chip surface, lens distortion of the optical system, etc., the video signal S ′ by the optical system does not become a regular rectangular wave as shown in FIG. When the video signal S ′ is binarized by a predetermined threshold value L when the waveform distortion generated in the chips located at both ends is generated, the binarized signal A ′ is located in the chips located at both ends of the camera visual field. The rising edge a'due to the above shifts from the actual rising edge a (see FIG. 3), and the chip center, which is the midpoint between the rising edge a'and the falling edge b, shifts from the actual chip center.

【0008】このように前記二値化信号A’により得ら
れるチップ中心と実際のチップ中心とがずれていると、
そのチップTを移動(距離d’)によりカメラ視野のセ
ンタcに位置決めしようとしても、実際のチップ中心か
らカメラ視野のセンタcまでの距離がd(d’<d)で
あるため、カメラ視野のセンタcから位置ずれすること
になり、再度、正確にカメラ視野のセンタcにチップ中
心を位置決めする必要があり、チップを位置決めする時
間が長くなってしまう。
Thus, when the chip center obtained by the binarized signal A'is deviated from the actual chip center,
Even if the chip T is moved (distance d ′) to be positioned at the center c of the camera visual field, the distance from the actual chip center to the center c of the camera visual field is d (d ′ <d). Since the position is displaced from the center c, it is necessary to accurately position the chip center again in the center c of the camera visual field, which increases the time for positioning the chip.

【0009】そこで、本発明は上記問題点に鑑みて提案
されたもので、その目的とするところは、チップ表面で
の照度分布や光学系のレンズ歪み等に左右されることな
く、すべてのチップをカメラ視野のセンタに精度よく位
置決めし得るピックアップ装置及びチップ位置決め方法
を提供することにある。
Therefore, the present invention has been proposed in view of the above problems, and an object of the present invention is not to be influenced by the illuminance distribution on the chip surface, the lens distortion of the optical system, or the like. It is an object of the present invention to provide a pickup device and a chip positioning method capable of accurately positioning the lens in the center of the camera visual field.

【0010】[0010]

【課題を解決するための手段】上記目的を達成するため
の技術的手段として、本発明方法は、整列状態でXY方
向に平面配置されたチップを撮像したカメラ視野内で複
数のチップを先行認識し、その先行認識データに基づい
て、ピックアップすべきチップをセンシングして前記カ
メラ視野のセンタに位置決め配置するに際して、ピック
アップすべきチップを前記先行認識データに基づいてカ
メラ視野のセンタに配置した時のセンタとのずれ量を再
認識してそれを先行認識したチップ位置の補正量とし、
同じチップ位置にあるチップの先行認識時に、前回の先
行認識で得られた補正量を先行認識データに付与して前
記チップをカメラ視野のセンタに配置することを特徴と
する。
As a technical means for achieving the above object, the method of the present invention is such that a plurality of chips are recognized in advance in the camera visual field in which the chips arranged in a plane in the XY direction are imaged in an aligned state. However, when the chip to be picked up is positioned and arranged in the center of the camera visual field based on the preceding recognition data, when the chip to be picked up is arranged in the center of the camera visual field based on the preceding recognition data. Re-recognize the amount of deviation from the center and use it as the correction amount for the chip position that was previously recognized,
At the time of prior recognition of a chip at the same chip position, the correction amount obtained by the previous prior recognition is added to the prior recognition data to arrange the chip at the center of the camera visual field.

【0011】尚、前記ピックアップすべきチップを先行
認識データに基づいてカメラ視野のセンタに配置した時
のセンタとのずれ量を再認識してそれを先行認識したチ
ップ位置の補正量とする自動ティーチングを実行するこ
とが可能で、更に、前記自動ティーチングによる補正量
を先行認識ごとに更新することも可能である。
Note that automatic teaching is performed by re-recognizing the amount of deviation from the center when the chip to be picked up is arranged at the center of the camera visual field based on the prior recognition data, and using it as the correction amount of the previously recognized chip position. Can be performed, and the correction amount by the automatic teaching can be updated for each prior recognition.

【0012】また、本発明装置は、可動テーブル上に整
列状態でXY方向に平面配置されたチップを光学系によ
り撮像して画像認識し、その認識データに基づいて選別
されたチップをアーム系により順次ピックアップする装
置において、前記光学系により撮像されたカメラ視野内
の複数のチップを先行認識し、その先行認識データに基
づいてカメラ視野のセンタに配置した時のセンタとのず
れ量を再認識し、それを先行認識したチップ位置の補正
量とする自動ティーチングを実行し、その自動ティーチ
ングによる補正量を先行認識ごとに更新しながら、同じ
チップ位置にあるチップの先行認識時に、前回の先行認
識で得られた補正量を先行認識データに付与する画像処
理部と、その画像処理部の出力に基づき前記可動テーブ
ルを作動させて前記チップをカメラ視野のセンタに配置
する制御部とを具備したことを特徴とする。
Further, in the device of the present invention, the chips arranged in a plane on the movable table in the XY directions in an aligned state are imaged by the optical system for image recognition, and the chips selected based on the recognition data are recognized by the arm system. In a device that sequentially picks up, a plurality of chips in the camera visual field imaged by the optical system are recognized in advance, and the amount of deviation from the center when the camera is arranged in the center of the camera visual field is recognized again based on the preceding recognition data. , Automatic teaching is performed with the correction amount of the tip position that was previously recognized, and the correction amount by the automatic teaching is updated for each prior recognition. An image processing unit that adds the obtained correction amount to the preceding recognition data, and the movable table is activated based on the output of the image processing unit. Characterized by comprising a control section for arranging the chip on the center of the camera field of view.

【0013】[0013]

【作用】本発明では、複数のチップをカメラ視野内で先
行認識し、ピックアップすべきチップを前記先行認識デ
ータに基づいてカメラ視野のセンタに配置した時のセン
タとのずれ量を再認識してそれを先行認識したチップ位
置の補正量とし、同じチップ位置にあるチップの先行認
識時に、前回の先行認識で得られた補正量を先行認識デ
ータに付与して前記チップをカメラ視野のセンタに配置
する。
According to the present invention, a plurality of chips are recognized in advance in the camera field of view, and the amount of deviation from the center when the chip to be picked up is placed in the center of the camera field of view is recognized again based on the preceding recognition data. It is used as the correction amount of the chip position that is recognized in advance, and when the chip at the same chip position is recognized in advance, the correction amount obtained in the preceding recognition is added to the recognition data and the chip is placed in the center of the camera field of view. To do.

【0014】このようにすれば、チップ表面での照度分
布や光学系のレンズ歪み等により光学系からの映像信号
の波形歪みでもって画像データから得られるチップ中心
が実際のチップ中心から位置ずれしていても、その位置
ずれを前記補正量により修正することができ、前記先行
認識データと補正量とに基づいて前記チップをカメラ視
野のセンタであるピックアップポジションに正確に位置
決めする。
By doing so, the chip center obtained from the image data is displaced from the actual chip center due to the waveform distortion of the video signal from the optical system due to the illuminance distribution on the chip surface, the lens distortion of the optical system, and the like. However, the positional deviation can be corrected by the correction amount, and the chip is accurately positioned at the pickup position which is the center of the camera visual field based on the preceding recognition data and the correction amount.

【0015】[0015]

【実施例】本発明の一実施例を図1乃至図4に示して説
明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS.

【0016】まず、本発明のピックアップ装置は、以下
の概略構成を有する。即ち、図1に示すように可動テー
ブル2上に整列状態でXY方向に平面配置されたチップ
Tをカメラを含む光学系1で撮像し、その光学系1から
の映像信号を後述の画像処理部3で二値化等により画像
処理する。前記光学系1で撮像されたカメラ視野m(図
2参照)でのチップTの画像処理により得られた画像デ
ータをフレームメモリに記憶させ、その画像データに基
づく画像認識により良品のチップTを選択して可動テー
ブル2の駆動でカメラ視野mのセンタcであるピックア
ップポジションに認識データにより位置決め配置する。
そして、そのピックアップポジションに位置決め配置さ
れた良品のチップTをアーム系4のコレット5により真
空吸着してピックアップする。
First, the pickup device of the present invention has the following schematic structure. That is, as shown in FIG. 1, an optical system 1 including a camera takes an image of a chip T which is arranged on a movable table 2 in a plane in the XY directions, and a video signal from the optical system 1 is imaged by an image processing unit described later. In 3, image processing is performed by binarization or the like. Image data obtained by image processing of the chip T in the camera view m (see FIG. 2) captured by the optical system 1 is stored in a frame memory, and a good chip T is selected by image recognition based on the image data. Then, the movable table 2 is driven and positioned according to the recognition data at the pickup position which is the center c of the camera visual field m.
Then, the good chip T positioned at the pickup position is vacuum-sucked by the collet 5 of the arm system 4 and picked up.

【0017】画像処理部3は、複数のチップTを撮像し
たカメラ視野mに基づいて前述した光学系1からの映像
信号を二値化信号等に変換することにより画像処理す
る。また、可動テーブル駆動部6は、後述の制御部7か
らの出力信号に基づいて、可動テーブル2を駆動させて
良品のチップTをピックアップポジションに位置決め配
置し、ピックアップ駆動部8は、前記ピックアップポジ
ションに位置する一つのチップTをコレット5による真
空吸着でピックアップ動作する。
The image processing unit 3 performs image processing by converting the video signal from the optical system 1 described above into a binarized signal or the like based on the camera view m of the plurality of chips T. The movable table drive unit 6 drives the movable table 2 based on an output signal from the control unit 7, which will be described later, to position the non-defective chip T at the pickup position, and the pickup drive unit 8 sets the pickup position to the pickup position. The one chip T located at is picked up by vacuum suction by the collet 5.

【0018】具体的に、前記画像処理部3は、前記チッ
プTのピックアップ動作中に、前記カメラ視野m内の複
数のチップTを先行認識し、その先行認識データに基づ
いてカメラ視野mのセンタcに配置した時のセンタcと
のずれ量を再認識し、それを先行認識したチップ位置の
補正量とする自動ティーチングを実行し、その自動ティ
ーチングによる補正量を先行認識ごとに更新しながら、
同じチップ位置にあるチップTの先行認識時に、前回の
先行認識で得られた補正量を先行認識データに付与す
る。制御部7では、その画像処理部3の出力に基づいて
可動テーブル2を可動テーブル駆動部6により作動させ
て前記チップTをカメラ視野mのセンタcに配置する。
Specifically, the image processing section 3 recognizes a plurality of chips T in the camera field of view m in advance during the pickup operation of the chip T, and based on the preceding recognition data, the center of the camera field of view m. While re-recognizing the amount of deviation from the center c when it is placed at c, the automatic teaching is executed by using it as the correction amount of the previously recognized chip position, and the correction amount by the automatic teaching is updated for each prior recognition,
At the time of prior recognition of the chip T at the same chip position, the correction amount obtained in the previous prior recognition is added to the prior recognition data. In the control unit 7, the movable table 2 is operated by the movable table driving unit 6 based on the output of the image processing unit 3, and the chip T is arranged at the center c of the camera visual field m.

【0019】上記構成からなるピックアップ装置による
チップの位置決め及びピックアップ動作は、具体的に以
下の通りである。
The chip positioning and the pick-up operation by the pick-up device having the above-mentioned structure are specifically as follows.

【0020】まず、可動テーブル2上の複数のチップT
を光学系1により撮像し、その映像信号を画像処理部3
で二値化等により画像処理し、その画像データに基づい
て画像認識する。この時、カメラ視野m内の複数のチッ
プTを前記画像処理部3で先行認識する。この先行認識
は、チップTのピックアップ動作中に実行され、チップ
自体の有無、欠け等の外観不良の有無、及び前工程で付
与される特性検査結果による不良マークの有無などに基
づいてチップTの良否が前記画像処理部3で判定され
る。その画像処理部3の出力に基づいて判定結果から良
品のチップTを選択し、制御部7では、可動テーブル駆
動部6により可動テーブル2を駆動させ、認識データに
より前述した良品のチップTをカメラ視野mのセンタc
であるピックアップポジションに位置決め配置する。
First, a plurality of chips T on the movable table 2
Is imaged by the optical system 1, and the video signal is captured by the image processing unit 3
Image processing is performed by binarization, and image recognition is performed based on the image data. At this time, the image processing unit 3 precedently recognizes a plurality of chips T in the camera visual field m. This prior recognition is performed during the pick-up operation of the chip T, and the chip T of the chip T is detected based on the presence / absence of the chip itself, the presence / absence of a defective appearance such as a chip, and the presence / absence of a defective mark based on the characteristic inspection result applied in the previous process. The quality of the image is determined by the image processing unit 3. Based on the output of the image processing unit 3, a non-defective chip T is selected from the determination result, and in the control unit 7, the movable table 2 is driven by the movable table driving unit 6 and the non-defective chip T described above is recognized by the camera based on the recognition data. Center c of field of view m
Position it at the pickup position.

【0021】この時、ピックアップポジションでのチッ
プ中心とカメラ視野mでのセンタcとがずれることがあ
る。即ち、図4に示すようにチップ表面での照度分布や
光学系のレンズ歪み等により、光学系1による映像信号
S’が正規の矩形波とならず波形歪み(例えば、図示で
はカメラ視野の両端に位置するチップで生じる波形歪
み)が生じ、この映像信号S’をしきい値Lで二値化し
た二値化信号A’について、カメラ視野mの両端に位置
するチップTによる立ち上がりa’が実際のチップによ
る立ち上がりa(図3参照)とずれて、その立ち上がり
a’と立ち下がりとの中点が実際のチップ中心からずれ
ることが原因となっている。
At this time, the chip center at the pickup position and the center c in the camera visual field m may deviate from each other. That is, as shown in FIG. 4, the image signal S ′ by the optical system 1 does not become a regular rectangular wave due to illuminance distribution on the chip surface, lens distortion of the optical system, etc. Waveform distortion) that occurs in the chip located at the position a, the rising edge a'of the chips T located at both ends of the camera field m of the binarized signal A'which is obtained by binarizing the video signal S'with the threshold value L. The cause is that the midpoint between the rising edge a ′ and the falling edge deviates from the actual chip edge (see FIG. 3) and deviates from the actual chip center.

【0022】そこで、本発明では、このように前記二値
化信号A’により得られるチップ中心と実際のチップ中
心とがずれていた場合、制御部7からの指令に基づい
て、前記チップTをカメラ視野mのセンタcに位置決め
配置した時に生じたチップ中心とカメラ視野mのセンタ
cとのずれ量を画像処理部3により再認識する。この再
認識により得られたチップ中心とカメラ視野mのセンタ
cとのずれ量を先行認識したチップ位置の補正量として
自動ティーチングを実行する。これにより、個々のチッ
プTは、先行認識データに前記ずれ量による補正量が付
与されることになる。
Therefore, in the present invention, when the center of the chip obtained by the binarized signal A'is deviated from the actual center of the chip as described above, the chip T is set based on the instruction from the control unit 7. The image processing unit 3 re-recognizes the amount of deviation between the center of the chip and the center c of the camera visual field m, which occurs when the positioning is performed at the center c of the camera visual field m. The automatic teaching is executed with the amount of deviation between the center of the chip obtained by this re-recognition and the center c of the camera field of view m as the correction amount of the previously recognized chip position. As a result, for each chip T, the correction amount based on the shift amount is added to the preceding recognition data.

【0023】そして、その自動ティーチングによる補正
量を先行認識ごとに更新することにより、経時的な変化
などにより影響を可及的に抑制して常に最新の補正量が
先行認識データに付与され、同じチップ位置にあるチッ
プTの先行認識時に、前回の先行認識で得られた補正量
を先行認識データに付与し、制御部7からの指令に基づ
いて、可動テーブル駆動部6により可動テーブル2を駆
動させ、その認識データにより前記チップTをカメラ視
野mのセンタcであるピックアップポジションに精度よ
く位置決め配置する。
By updating the correction amount by the automatic teaching for each preceding recognition, the influence due to a change with time is suppressed as much as possible, and the latest correction amount is always added to the preceding recognition data. At the time of prior recognition of the chip T at the chip position, the correction amount obtained in the previous prior recognition is added to the prior recognition data, and the movable table drive unit 6 drives the movable table 2 based on a command from the control unit 7. Then, based on the recognition data, the chip T is accurately positioned and arranged at the pickup position which is the center c of the visual field m of the camera.

【0024】尚、前述した自動ティーチングによる補正
量は、チップTをカメラ視野mのセンタcに位置決め配
置した時に生じたチップ中心とカメラ視野mのセンタc
とのずれ量を画素単位でそのままカメラ視野mのチップ
Tの位置を認識した時の補正量とするか、或いは、カメ
ラ視野mのチップTの位置を認識した時の画面分解能と
して保持するようにすればよい。
The correction amount by the above-mentioned automatic teaching is the center of the chip and the center c of the camera field of view m generated when the chip T is positioned and arranged at the center c of the camera field of view m.
The amount of deviation from the above is used as a correction amount when the position of the chip T in the camera field of view m is recognized as it is in pixel units, or is held as the screen resolution when the position of the chip T in the camera field of view m is recognized. do it.

【0025】[0025]

【発明の効果】本発明によれば、カメラ視野内の複数の
チップを画像処理部により先行認識し、その先行認識デ
ータに基づいてカメラ視野のセンタに配置した時のセン
タとのずれ量を再認識し、それを先行認識したチップ位
置の補正量とする自動ティーチングを実行し、その自動
ティーチングによる補正量を先行認識ごとに更新しなが
ら、同じチップ位置にあるチップの先行認識時に、前回
の先行認識で得られた補正量を先行認識データに付与し
て前記チップをカメラ視野のセンタに配置するようにし
たから、チップ表面での照度分布や光学系のレンズ歪み
等の悪影響を受けることなく、常に、個々のチップをカ
メラ視野のセンタであるピックアップポジションに精度
よく位置決めすることができるので、信頼性の高い高速
なピックアップを実現できてその実用的価値は大であ
る。
According to the present invention, a plurality of chips in the field of view of a camera are recognized in advance by an image processing unit, and the amount of deviation from the center when the camera is arranged in the center of the field of view of the camera is re-recognized based on the preceding recognition data. Recognize and execute the automatic teaching with the correction amount of the tip position that was recognized in advance, and update the correction amount by the automatic teaching for each prior recognition. Since the chip is arranged in the center of the camera field of view by adding the correction amount obtained by the recognition to the preceding recognition data, without being adversely affected by the illuminance distribution on the chip surface or the lens distortion of the optical system, Since each chip can always be accurately positioned at the pickup position, which is the center of the camera's field of view, a reliable and high-speed pickup can be achieved. Its practical value made the current is large.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のピックアップ装置の概略構成図FIG. 1 is a schematic configuration diagram of a pickup device of the present invention.

【図2】本発明の実施例における先行認識でのカメラ視
野を示す説明図
FIG. 2 is an explanatory view showing a camera field of view in prior recognition in the embodiment of the present invention.

【図3】正規の映像信号及びその映像信号をしきい値で
二値化した二値化信号を示す波形図
FIG. 3 is a waveform diagram showing a normal video signal and a binarized signal obtained by binarizing the video signal with a threshold value.

【図4】歪んだ映像信号及びその映像信号をしきい値で
二値化した二値化信号を示す波形図
FIG. 4 is a waveform diagram showing a distorted video signal and a binarized signal obtained by binarizing the video signal with a threshold value.

【符号の説明】[Explanation of symbols]

T チップ m カメラ視野 c カメラ視野のセンタ 1 光学系 2 可動テーブル 3 画像処理部 4 アーム系 7 制御部 T chip m camera field of view c camera field of view center 1 optical system 2 movable table 3 image processing unit 4 arm system 7 control unit

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 整列状態でXY方向に平面配置されたチ
ップを撮像したカメラ視野内で複数のチップを先行認識
し、その先行認識データに基づいて、ピックアップすべ
きチップをセンシングして前記カメラ視野のセンタに位
置決め配置するに際して、ピックアップすべきチップを
前記先行認識データに基づいてカメラ視野のセンタに配
置した時のセンタとのずれ量を再認識してそれを先行認
識したチップ位置の補正量とし、同じチップ位置にある
チップの先行認識時に、前回の先行認識で得られた補正
量を先行認識データに付与して前記チップをカメラ視野
のセンタに配置することを特徴とするチップ位置決め方
法。
1. A camera field of view in which a plurality of chips are recognized in advance in a camera field of view in which chips arranged in a plane in the XY directions in an aligned state are sensed, and a chip to be picked up is sensed based on the pre-recognition data. At the time of positioning and arranging at the center of the center, the amount of deviation from the center when the chip to be picked up is arranged at the center of the camera field of view based on the preceding recognition data is re-recognized, and this is taken as the correction amount of the previously recognized chip position. A chip positioning method characterized in that, at the time of prior recognition of a chip at the same chip position, the correction amount obtained in the previous prior recognition is added to the prior recognition data to arrange the chip at the center of the camera visual field.
【請求項2】 前記ピックアップすべきチップを先行認
識データに基づいてカメラ視野のセンタに配置した時の
センタとのずれ量を再認識してそれを先行認識したチッ
プ位置の補正量とする自動ティーチングを実行すること
を特徴とする請求項1記載のチップ位置決め方法。
2. Automatic teaching in which the amount of deviation from the center when the chip to be picked up is placed at the center of the camera field of view based on the prior recognition data is recognized again as the correction amount of the chip position that was previously recognized. The chip positioning method according to claim 1, further comprising:
【請求項3】 前記自動ティーチングによる補正量を先
行認識ごとに更新することを特徴とする請求項2記載の
チップ位置決め方法。
3. The chip positioning method according to claim 2, wherein the correction amount by the automatic teaching is updated for each prior recognition.
【請求項4】 可動テーブル上に整列状態でXY方向に
平面配置されたチップを光学系により撮像して画像認識
し、その認識データに基づいて選別されたチップをアー
ム系により順次ピックアップする装置において、前記光
学系により撮像されたカメラ視野内の複数のチップを先
行認識し、その先行認識データに基づいてカメラ視野の
センタに配置した時のセンタとのずれ量を再認識し、そ
れを先行認識したチップ位置の補正量とする自動ティー
チングを実行し、その自動ティーチングによる補正量を
先行認識ごとに更新しながら、同じチップ位置にあるチ
ップの先行認識時に、前回の先行認識で得られた補正量
を先行認識データに付与する画像処理部と、その画像処
理部の出力に基づき前記可動テーブルを作動させて前記
チップをカメラ視野のセンタに配置する制御部とを具備
したことを特徴とするピックアップ装置。
4. An apparatus for picking up an image of a chip, which is arranged in a plane in the XY direction in an aligned state on a movable table by an optical system, for image recognition, and sequentially picking up a chip selected based on the recognition data by an arm system. , A plurality of chips in the camera field of view picked up by the optical system are recognized in advance, and the amount of deviation from the center when the camera is arranged in the center of the camera field of view is recognized again based on the preceding recognition data, and it is recognized in advance. Automatic teaching is performed as the correction amount of the specified chip position, and the correction amount by the automatic teaching is updated for each prior recognition. Is added to the preceding recognition data, and the movable table is operated based on the output of the image processing unit to operate the chip in the field of view of the camera. And a control unit disposed at the center of the pickup device.
JP13357495A 1995-05-31 1995-05-31 Pickup device and chip positioning method Expired - Fee Related JP3418929B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP13357495A JP3418929B2 (en) 1995-05-31 1995-05-31 Pickup device and chip positioning method
US08/654,927 US5946409A (en) 1995-05-31 1996-05-29 Pick-up apparatus and method for semiconductor devices
KR1019960019288A KR100238341B1 (en) 1995-05-31 1996-05-31 Pick up apparatus of semiconductor device and pick up method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13357495A JP3418929B2 (en) 1995-05-31 1995-05-31 Pickup device and chip positioning method

Publications (2)

Publication Number Publication Date
JPH08330336A true JPH08330336A (en) 1996-12-13
JP3418929B2 JP3418929B2 (en) 2003-06-23

Family

ID=15108000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13357495A Expired - Fee Related JP3418929B2 (en) 1995-05-31 1995-05-31 Pickup device and chip positioning method

Country Status (1)

Country Link
JP (1) JP3418929B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051531A (en) * 2001-08-03 2003-02-21 Sanyo Electric Co Ltd Method and device for taking out chip component
JP2005093862A (en) * 2003-09-19 2005-04-07 Hitachi High-Tech Instruments Co Ltd Die pickup apparatus and die pickup method
WO2005119774A1 (en) * 2004-06-01 2005-12-15 Manufacturing Integration Technology Ltd Method and apparatus for precise marking and placement of an object
JP2007141979A (en) * 2005-11-16 2007-06-07 Nidec Tosok Corp Bonding apparatus
JP2012190879A (en) * 2011-03-09 2012-10-04 Fuji Mach Mfg Co Ltd Electronic component mounting device and electronic component mounting method
CN110084802A (en) * 2019-04-29 2019-08-02 江苏理工学院 A kind of high-accuracy PCB chip pin center positioning method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051531A (en) * 2001-08-03 2003-02-21 Sanyo Electric Co Ltd Method and device for taking out chip component
JP2005093862A (en) * 2003-09-19 2005-04-07 Hitachi High-Tech Instruments Co Ltd Die pickup apparatus and die pickup method
JP4628661B2 (en) * 2003-09-19 2011-02-09 株式会社日立ハイテクインスツルメンツ DIE PICKUP DEVICE AND DIE PICKUP METHOD
WO2005119774A1 (en) * 2004-06-01 2005-12-15 Manufacturing Integration Technology Ltd Method and apparatus for precise marking and placement of an object
JP2007141979A (en) * 2005-11-16 2007-06-07 Nidec Tosok Corp Bonding apparatus
JP4676315B2 (en) * 2005-11-16 2011-04-27 日本電産トーソク株式会社 Bonding equipment
JP2012190879A (en) * 2011-03-09 2012-10-04 Fuji Mach Mfg Co Ltd Electronic component mounting device and electronic component mounting method
CN110084802A (en) * 2019-04-29 2019-08-02 江苏理工学院 A kind of high-accuracy PCB chip pin center positioning method
CN110084802B (en) * 2019-04-29 2023-07-07 江苏理工学院 High-precision PCB chip pin center positioning method

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