JPH09138116A - Visual inspection apparatus for ic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield by decreasing the erroneous discrimination of a good product from a defective product. SOLUTION: A first image pickup camera 1 photographs the image of the state, wherein an IC package is accommodated on an embossed tape. A second image pickup camera 2 photographs the image of the state before the IC package is accommodated on the embossed tape. Whether a reflected image is present or not in the specified outer surface ergion of the embossed tape is judged based on the image from the first image pickup camera 1. When the reflected image is not present, the image pickup with the first image pickup camera 1 is continued, and the discrimination of a good product and a defective product is performed. When the reflected image is present, the imaging is changed to the image pickup with the second image pickup camera 2, and the discrimination of the good product and the defective product is performed based on the image from the second image pickup camera 2. A controller 3, which performs these function, is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package appearance inspection apparatus suitable for inspecting the appearance of an IC package when the IC package is stored in an embossed tape.

[0002]

2. Description of the Related Art Generally, an IC which is completed through a series of manufacturing processes and comprises an IC body and leads mounted thereon.
The package is supplied to an automatic mounting machine (auto mounter) or the like in a state of being stored in an embossed tape for mounting on a wiring board. The IC package is stored in the embossed tape by an IC taping machine as shown in FIG.

In FIG. 3, an IC package 11 placed in a supply tray (not shown) is replaced with an inverted index 1
Adsorb by 2. Then, after the inversion index 12 is rotated 180 degrees, the IC package 11 that has been adsorbed
Is released on the index table 13
The C package 11 is arranged. Next, after rotating the index table 13 by 180 degrees to move the IC package 11 to a predetermined position, the IC package 11 is sucked by the insertion index 14 and the insertion index 1
4 is rotated 180 degrees to move the IC package 11 onto the embossed tape 15.

Here, for example, as shown in FIG. 4, the embossed tape 15 is formed with a storage recess 15a for storing an IC package, and by releasing the IC package 11 sucked by the insertion index 14. Is stored in the storage recess 15a.

The tape supply reel 16 around which the embossed tape 15 is wound and the take-up reel 17 around which the embossed tape 15 is wound are driven by motors not shown, and these motors are also positioned by a motor controller not shown. It is controlled so that the storage recess 15a formed on the embossed tape 15 is positioned at a desired position.

The IC package 11 is thus housed in the housing recess 15a. The IC package 11 housed in the embossed tape 15 is mounted on the wiring board as it is by the automatic mounting machine. At this time, the orientation of the IC package 11 in the housed state is reversed, the position of the mark 11m indicating the 1-pin position is different, the IC packages 11 of different types are mixed, and further, the lead 11a is bent. If there are ups and downs, defects will occur in the mounting process on the wiring board after the product is shipped. For these reasons,
When the IC package 11 is housed in the embossed tape 15, it is necessary to perform a visual inspection including a lead shape inspection for inspecting the pitch of the leads 11a and unevenness of the tips and a mark inspection for inspecting the type and direction of the IC package 11. is there.

For this reason, the IC package 11 is moved so as to be located below the image capturing camera 17 provided at a position facing the embossing tape 15, where I
The external shape image of the C package 11 is the image capturing camera 1
The visual inspection is carried out by being taken into a visual inspection device (not shown) by 7. The appearance inspection apparatus determines whether the IC package 11 is a good product or a defective product based on the appearance shape image data of the IC package 11. If it is determined that the IC package 11 is a good product, the embossing tape 15 is conveyed in the direction of the arrow B1. The IC package 11 is moved below the thermocompression bonding device 18. Here, the cover tape 20 wound around the tape reel 19 is applied to the embossed tape 1 by the thermocompression bonding device 18.
5 is thermocompression-bonded so as to seal the storage recess 15a of
The storage of the package 11 is completed. On the other hand, when the appearance inspection device determines that the product is defective, the embossed tape 1
5 is conveyed in the direction of arrow B2, and the IC package 11 housed in the housing recess 15a is adsorbed by the take-out arm 21 for taking it out, and the IC package 11 is released after the take-out arm 21 rotates. It is placed on the discharge conveyor 22 and discharged.

[0008]

As described above, when the appearance inspection is performed with the IC package 11 housed in the embossing tape 15, the material of the housing recess 15a of the embossing tape 15 is difficult to reflect light. In that case, the image is as shown in FIG.

However, in the case where the material of the embossed tape 15 is a material that easily reflects light, as shown in FIG.
As shown in (b), the storage recess 1 of the embossed tape 15
Since the side wall 15b of 5a is provided with a draft taper, the reflected image 11b of the lead 11a of the IC package 11 may be reflected on the side wall 15b, and the lead 11a may appear as if it were elongated.

Therefore, when the appearance inspection device discriminates whether the product is a good product or a defective product on the basis of the image in such a state, it is determined that the lead 11a is a normal product but is a defective IC package 11. There was a problem that it might be misjudged.

The present invention has been made in view of the above conventional problems, and in the appearance inspection performed when the IC package is housed in the embossed tape, erroneous discrimination between non-defective products and defective products is reduced to improve the yield. It is an object of the present invention to provide an IC package appearance inspection device that enables the above.

[0012]

An IC package appearance inspection apparatus according to the present invention is an IC package appearance inspection apparatus used for appearance inspection of an IC package when the IC package is housed in an embossed tape. First imaging means for imaging the state in which the IC package is accommodated in the embossed tape accommodation recess, second imaging means for imaging the state before the IC package is accommodated in the embossed tape accommodation recess, and first imaging Based on the image from the means, it is judged whether a reflection image exists in a predetermined outer peripheral area of the embossed tape storage recess, and if there is no reflection image, the first
Image pickup means continues to determine whether the IC package is a good product or a defective product based on the image from the first image pickup means, and when a reflected image exists, switches to the second image pickup means. I based on the image from the second imaging means
It is provided with a control means for discriminating whether the C package is a good product or a defective product.

According to the appearance inspection apparatus for an IC package of the present invention, for example, the side wall of the recess of the embossed tape is set as the predetermined outer peripheral area, and the predetermined outer peripheral area is reflected on the basis of the image from the first image pickup means. Judging whether or not an image exists, when the embossed tape is made of a material that easily reflects, a reflected image may exist in a predetermined outer peripheral area,
In such a case, the image pickup is switched to the image pickup by the second image pickup means.

Since the second image pickup means picks up an image of the state before the IC package is stored, the image is not displayed on the side wall of the storage recess of the embossed tape. Misidentification of defective products will be greatly reduced.

[0015]

FIG. 1 is a perspective explanatory view showing an embodiment of an IC taping machine to which an IC package appearance inspection apparatus according to the present invention is applied.

In FIG. 1, the IC package 1 is located above the position where the IC package 11 is housed in the housing recess 15a of the embossed tape 15 by a predetermined distance in the direction of arrow B1.
The first image capturing camera 1 for capturing the image 1 is disposed, and the second image capturing camera 2 for capturing the unpackaged IC package 11 is disposed above the index table 13.

On the other hand, the first image capturing camera 1 and the second image capturing camera 1
2, the image capturing camera 2 includes signal lines S1 and S4 for controlling the operations of the first image capturing camera 1 and the second image capturing camera 2; The signal line S2 and S3 for taking in the image data from the first image capturing camera 1 and the second image capturing camera 2 are connected to the control device 3, and the IC package appearance inspection device is basically used. It is configured to

The control device 3 judges whether or not the reflection image 11b of the lead 11a is present on the side wall 15b of the storage recess 15a of the embossing tape 15 based on the image from the first image capturing camera 1. If the reflected image 11b does not exist, the imaging by the first image capturing camera 1 is continued, and the good or defective product of the IC package 11 is discriminated based on the image from the first image capturing camera 1. And the reflected image 11
When b is present, the image capturing is switched to the image capturing by the second image capturing camera 2 and basically, the good / defective IC package 11 is discriminated based on the image from the second image capturing camera 2. It is something to do.

The operation of the IC taping machine to which the IC package appearance inspection apparatus shown in FIG. 2 is applied will be described below.

First, the IC package 11 arranged in a supply tray (not shown) is sucked by the reversal index 12. Then, after rotating the inversion index 12 by 180 degrees, the IC package 11 adsorbed is released to place the IC package 11 on the index table 13.

Next, the index table 13 is set to 180
After rotating the IC package 11 to a predetermined position by rotating the IC package 11, the IC package 11 is sucked by the insertion index 14 and the insertion index 14 is rotated 180 degrees to move the IC package 11 onto the embossing tape 15 for storage. It is stored in the recess 15a. In the initial state, the control device 3 controls so that the second image capturing camera 2 arranged above the index table 13 does not operate.

Then, the IC package 11 is moved so as to be located below the first image capturing camera 1, and here, the appearance shape image of the IC package 11 is captured by the control device 3.

The control device 3 first determines whether or not an image exists in a predetermined area of the embossed tape 15 based on the captured image. That is, as shown in FIG. 5B, the leads 1 of the IC package 11 are attached to the side wall 15b.
It is determined whether or not the reflection image 11b of 1a exists.

When the reflection image 11b does not exist on the side wall 15b of the embossed tape 15, the lead shape inspection for inspecting the pitch and the unevenness of the ends of the leads 11a and the mark inspection for inspecting the type and direction of the IC package 11 are performed. The appearance inspection is performed to determine whether the product is a non-defective product or a defective product, and the determination signal G is sent to the control device of the IC taping machine (not shown).

In the IC taping machine, if the determination result is good, the cover tape 20 is a recess 15 for storing the embossed tape 15 in which the IC package 11 is stored.
It is thermocompression bonded to a and the storage of the IC package 11 is completed,
If the determination result is a defective product, the defective IC package 1
1 is discharged by the take-out arm 21 and the discharge conveyor 22.

On the other hand, when the reflected image 11b exists on the side wall 15b of the embossed tape 15, the embossed tape 15 is used.
Is determined to be a material that easily reflects light, an operation command is sent from the control device 3 to the second image capturing camera 2, and the second image capturing camera 2 is ready to capture an image.

At this time, the side wall 15 of the embossed tape 15
The IC package 11 that is judged to have the reflection image 11b on the side b is ejected, but the index table 1 is newly added.
The IC package 11 supplied to the No. 3 is arranged below the second image capturing camera 2 by rotating the index table 13 by 90 degrees, and the appearance inspection is performed here.

At this time, since the IC package 11 is on the index table 13, the IC package 11 is a good product in which the leads 11a are normal as in the case where the IC package 11 is housed in the housing recess 15a of the embossing tape 15. Despite that, it is not mistakenly judged as a defective product.

Then, a non-defective product and a defective product are discriminated, and the discrimination signal G is sent to the control device of the IC taping machine (not shown) in the same manner as described above.

Then, in the IC taping machine, the IC package 11 is stored or discharged according to the determination result.

As a result, it is possible to greatly reduce the erroneous discrimination between the good product and the defective product of the IC package, and it is possible to improve the yield.

In the embodiment described above, the second image is formed when the reflection image 11b of the lead 11a of the IC package 11 is present on the side wall 15b, that is, in the case of the embossed tape where light is easily reflected. Capture camera 2
Although the appearance inspection is performed only on the basis of the image data from, the orientation of the IC package 11 may be changed after the appearance inspection is completed and before it is stored in the embossed tape 15.

Therefore, in order to further improve the yield, it is desirable to perform the mark inspection (direction inspection) of the IC package 11 in the final shipping state in which the IC package 11 is stored in the embossed tape 15.

Therefore, as another embodiment of the appearance inspection apparatus for an IC package according to the present invention, when it is determined that the embossed tape easily reflects light and the second image capturing camera 2 starts image capturing, For the shape inspection of the leads 11a, the inspection is performed based on the image from the second image capturing camera 2, and for the mark inspection (direction inspection),
The inspection can be performed based on the image from the first image capturing camera 1.

This makes it possible to reduce erroneous discrimination of the IC package 11 due to the reflection image of the lead 11a being reflected on the side wall 15b of the recess 15a of the embossed tape 15, and at the same time after the visual inspection is completed. IC package 11 before being stored in embossed tape 15
It is possible to prevent a decrease in yield due to a change in the direction of the.

[0036]

According to the IC package appearance inspection apparatus of the present invention, when the embossed tape is made of a material that easily reflects in the appearance inspection performed when the IC package is housed in the embossed tape, the IC package is housed. Since it is possible to switch to the image pickup by the second image pickup means for picking up the image in the state before the operation, erroneous discrimination between the good product and the defective product of the IC package due to the reflection image being reflected on the side wall portion of the storage recess of the embossing tape. Can be significantly reduced, and the yield can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective explanatory view showing an embodiment of an IC taping machine to which an IC package appearance inspection device according to the present invention is applied.

FIG. 2 is a configuration diagram showing an embodiment of an IC package appearance inspection apparatus according to the present invention.

FIG. 3 is a perspective explanatory view showing an example of an IC taping machine to which a conventional IC package appearance inspection device is applied.

FIG. 4 is a perspective explanatory view showing a state in which an IC package is stored in a storage recess of an embossed tape.

FIG. 5 is an explanatory plan view showing a state in which an IC package is accommodated in an embossed tape accommodating recess (FIG. 5A) and a plan view showing a state in which a reflection image of a lead is reflected on a side wall portion of the embossing tape accommodating recess. It is a figure (FIG.5 (b)).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st image acquisition camera (1st imaging means) 2 2nd image acquisition camera (2nd imaging means) 3 Control device (control means) 11 IC package 11a lead 11b Lead reflection image 11m Mark 12 reverse index 13 index table 14 insertion index 15 embossed tape 15a storage recess 15b side wall 16 tape supply reel 17 take-up reel 18 thermocompression bonding device 19 tape reel 20 cover tape 21 take-out arm 22 discharge conveyor

Claims (1)

[Claims] 1. An IC used for visual inspection of an IC package when the IC package is stored in an embossed tape.
A package appearance inspection device, comprising: first imaging means for imaging an IC package housed in an embossed tape housing recess, and second imaging means for imaging an IC package before being housed in an embossed tape housing recess. It is determined whether or not a reflection image exists in a predetermined outer peripheral area of the embossed tape housing recess based on the image from the first image pickup means and the image from the first image pickup means. Image pickup by the image pickup means is continued to determine whether the IC package is a good product or a defective product based on the image from the first image pickup means, and if a reflected image is present, the image pickup means is switched to the second image pickup means. 2. A visual inspection apparatus for an IC package, comprising: a control unit that determines whether the IC package is a good product or a defective product based on an image from the imaging unit.