JP7444134B2 - Electronic component packaging manufacturing system - Google Patents

Description

The present invention relates to a manufacturing system for electronic component packages.

In a manufacturing system for an electronic component package in which a plurality of electronic components are packaged, an external appearance inspection of the package and an external appearance inspection of the electronic component packaged in the package are performed. Patent Document 1 discloses an inspection system for electronic components packaged in a carrier tape (electronic component package). This inspection system sequentially images multiple electronic components mounted on a carrier tape at regular intervals, stores the image data of the multiple electronic components on a recording medium, and displays it on a display device. Individual images of multiple electronic components detected as defective are visually observed, and inspection result data including symbols that identify individual electronic components in which defects are detected are recorded and saved, and based on the recorded inspection result data, a carrier tape is Search for an electronic component in which a defect has been detected from multiple installed electronic components. Thereby, inspection time can be shortened.

JP2006-308351A

However, the inspection system described in Patent Document 1 is constructed on the premise that the same inspection is performed on all electronic components, and there is a limit to the reduction in inspection time. Similarly, 100% inspection is also common for electronic component packages, and it is desired to shorten the inspection time.

An object of the present invention is to provide a manufacturing system for electronic component packages that can efficiently inspect electronic component packages.

A manufacturing system for an electronic component package according to the present invention is a system for manufacturing an electronic component package in which a plurality of electronic components are packaged, and the electronic component package is manufactured by wrapping the plurality of electronic components with a packaging material. The present invention includes a packaging device that generates the electronic component package, an inspection device that inspects the electronic component package, a conveyor that transports the electronic component package from the packaging device to the inspection device, and a control device. The packaging device includes an abnormality sensor that detects an abnormality in the electronic component package or the electronic component. The control device includes an abnormality information generation unit that generates abnormality information regarding an abnormality of the electronic component package or the electronic component detected by the abnormality sensor of the packaging device, and an abnormality information generation unit that generates abnormality information regarding an abnormality of the electronic component package or the electronic component detected by the abnormality sensor of the packaging device, and a The present invention includes an inspection determining section that determines an inspection to be performed, and a control signal output section that outputs a control signal that controls the transport machine or the inspection apparatus so that the inspection determined by the inspection determining section is performed.

According to the present invention, an electronic component package can be inspected efficiently.

FIG. 1 is a schematic configuration diagram showing a manufacturing system for an electronic component package according to a first embodiment. It is a perspective view showing an example of an electronic component storage container concerning a 1st embodiment. It is a perspective view showing an example of an electronic component package concerning a 1st embodiment. It is a perspective view showing an example of the carrier concerning a 1st embodiment. FIG. 1 is a schematic configuration diagram showing an example of a storage warehouse according to the first embodiment. FIG. 1 is a schematic configuration diagram showing an example of a control device (host device) according to a first embodiment. It is a flowchart which shows the inspection operation (fully automatic) by the manufacturing system of the electronic component package concerning 1st Embodiment. It is a flowchart which shows the inspection operation (automatic+manual) by the manufacturing system of the electronic component package based on 1st Embodiment. It is a schematic block diagram showing the manufacturing system of the electronic component package concerning a 2nd embodiment. FIG. 2 is a schematic configuration diagram showing an example of a control device (host device) according to a second embodiment. It is a flowchart which shows the inspection operation (fully automatic) by the manufacturing system of the electronic component package concerning 2nd Embodiment. It is a flowchart which shows the inspection operation (automatic+manual) by the manufacturing system of the electronic component package based on 2nd Embodiment.

Hereinafter, an example of an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the same reference numerals are given to the same or corresponding parts in each drawing.

(First embodiment)
<Electronic component packaging manufacturing system>
FIG. 1 is a schematic configuration diagram showing a manufacturing system for an electronic component package according to a first embodiment. FIG. 2 is a perspective view showing an example of the electronic component storage container according to the first embodiment. FIG. 3 is a perspective view showing an example of the electronic component package according to the first embodiment. FIG. 4 is a perspective view showing an example of the carrier according to the first embodiment. FIG. 5 is a schematic configuration diagram showing an example of the storage according to the first embodiment. FIG. 6 is a schematic configuration diagram showing an example of a control device (host device) according to the first embodiment.

The electronic component package manufacturing system 1 shown in FIG. 1 is a system for manufacturing and inspecting an electronic component package in which a plurality of electronic components, for example, a plurality of laminated ceramic capacitors are packaged. The manufacturing system 1 includes one or more packaging devices 100, an inspection device 200, a conveyor 210, and a control device 500 as a host device. Further, the manufacturing system 1 may include a storage 300, a carry-in machine 310, and a carry-out machine 320.

<<Packaging equipment>>
The packaging device 100 generates an electronic component package 20 by packaging a plurality of electronic components 10 with a packaging material. Specifically, as shown in FIG. 2, the plurality of electronic components 10 are transported to each packaging device 100 while being accommodated in a container 15. As shown in FIG. 3, the packaging device 100 accommodates a plurality of electronic components 10 in pockets 23 of a long or band-shaped carrier tape 22, and uses a carrier tape 22 and a cover tape 24 (packaging material) to store a plurality of electronic components 10. The part 10 is packaged. The packaging device 100 winds up a long or band-shaped carrier tape 22 and a cover tape 24 (packaging material) into a reel shape to generate an electronic component package 20. Note that it is preferable that the electronic components 10 of the same processing lot be packaged into the electronic component package 20 by the same packaging device 100 and housed in the carrier 30. Details of the electronic component storage container 15 and the electronic component package 20 will be described later.

Furthermore, the packaging device 100 accommodates a plurality of electronic component packages 20 in a transport bucket/transport container 30 . For example, as shown in FIG. 4, the packaging device 100 sequentially arranges the generated electronic component packages 20 on a carrier 30. Details of the carrier 30 will be described later.

<<<Container for electronic parts>>>
Regarding the electronic component storage container 15 described above, one storage container 15 stores electronic components 10 of the same processing lot. Note that the electronic components 10 of the same processing lot may be accommodated in a plurality of electronic component storage containers 15.

As shown in FIG. 2, the electronic component storage container 15 is provided with an identifier 11 that holds lot-related identification information related to a processing lot of the electronic components 10. For example, a bar code or two-dimensional code is pasted on the outer surface of the container 15 as the identifier 11 for identifying lot-related information. Alternatively, an RFID may be provided in the container 15 as the identifier 11 for identifying lot-related information.

The lot-related identification information may directly include processing lot information of the electronic component 10. Alternatively, the lot-related identification information may be identification information associated with processing lot information of the electronic component 10. For example, the lot-related identification information may be information about the electronic component storage container 15 with which the processing lot information of the electronic component 10 is associated. In this case, for example, in the housing step of housing the electronic component 10 in the housing container 15, the control device 500 may associate the processing lot information of the electronic component 10 with the information of the electronic component housing container 15. Thereby, after this housing process, the control device 500 can specify the processing lot of the electronic components 10 housed in the housing container 15 based on the information on the housing container 15 for electronic components.

<<<Electronic component packaging>>>
As shown in FIG. 3, the electronic component package 20 is provided with an identifier 21 that holds identification information of the package 20. For example, a bar code or a two-dimensional code may be attached to the outer surface of the package 20 as the identifier 21 for identifying the package information. Alternatively, an RFID may be provided on the package 20 as the identifier 21 for identifying the package information.

<<<Carrier>>>
As shown in FIG. 4, the carrier 30 is configured to accommodate and transport a plurality of packages 20. The carrier 30 is provided with an identifier 31 that holds identification information of the carrier 30. For example, a bar code or a two-dimensional code is pasted on the outer surface of the carrier 30 as an identifier 31 for identifying carrier information. Alternatively, an RFID may be provided on the carrier 30 as the identifier 31 for identifying carrier information.

<<<Processing lot of electronic parts>>>
Here, the above-described processing lot may be composed of a plurality of electronic components 10 packaged in a plurality of electronic component packages 20 housed in one carrier 30. In this case, the electronic components 10 can be efficiently managed for each carrier 30.

Alternatively, the processing lot may be a transport lot made up of a plurality of electronic components 10 forming one transport unit. For example, a transport lot serving as a processing lot may include a plurality of electronic components 10 packaged in a plurality of electronic component packages 20 housed in a plurality of carriers 30. Even if one processing lot is divided into a plurality of carriers 30 in this way, the manufacturing system 1 of this embodiment can efficiently manage the electronic components 10.

Alternatively, the processing lot may be a manufacturing lot composed of a plurality of electronic components 10 manufactured under the same conditions. For example, a manufacturing lot serving as a processing lot may include a plurality of electronic components 10 packaged in a plurality of electronic component packages 20 housed in one or more carriers 30. Even if one processing lot consists of one or more carriers 30 in this manner, the manufacturing system 1 of this embodiment can efficiently manage the electronic components 10.

Referring again to FIG. 1, each packaging apparatus 100 includes a lot-related identification information acquisition device 120 and a first carrier identification information acquisition device 130. That is, the lot-related identification information acquisition device 120 and the first carrier identification information acquisition device 130 are provided for each packaging apparatus 100. Further, each packaging device 100 may include a first packaging body identification information acquisition device 140. That is, the first package identification information acquisition device 140 may be provided for each packaging device 100.

The lot-related identification information acquisition device 120 obtains identification information that directly includes processing lot information of the electronic component 10 as the lot-related identification information of the electronic component 10 . Alternatively, the lot-related identification information acquisition device 120 may obtain identification information associated with processing lot information of the electronic component 10 as the lot-related identification information of the electronic component 10. For example, the lot-related identification information acquisition device 120 is a barcode reader or a two-dimensional code reader, and reads lot-related identification information from the identifier 11, such as a barcode or two-dimensional code, provided on the electronic component storage container 15. . Alternatively, the lot-related identification information acquisition device 120 is an RFID reader, and reads lot-related identification information from the identifier 11 such as RFID.

The first vehicle identification information acquisition device 130 acquires vehicle identification information of the vehicle 30. For example, the first vehicle identification information acquisition device 130 is a barcode reader or a two-dimensional code reader, and reads vehicle identification information from an identifier 31 such as a barcode or two-dimensional code provided on the vehicle 30. Alternatively, the first vehicle identification information acquisition device 130 is an RFID reader, and reads vehicle identification information from the identifier 31 such as RFID.

The first package identification information acquisition device 140 acquires the package identification information of the electronic component package 20. For example, the first package identification information acquisition device 140 is a barcode reader or a two-dimensional code reader, and reads the package identification information from an identifier 21 such as a barcode or two-dimensional code provided on the package 20. . Alternatively, the first package identification information acquisition device 140 is an RFID reader, and reads the package identification information from the identifier 21 such as RFID.

Note that the lot-related identification information acquisition device 120 may be an input unit through which a user inputs lot-related identification information. Further, the first carrier identification information acquisition device 130 may be an input unit through which the user inputs carrier identification information. Further, the first packaging identification information acquisition device 140 may be an input unit through which the user inputs packaging identification information. In this case, the lot-related identification information acquisition device 120, the first carrier identification information acquisition device 130, and the first package identification information acquisition device 140 may be, for example, a keyboard or mouse having physical operation buttons, or a virtual It consists of a touch panel etc. with operation buttons.

Furthermore, each packaging device 100 includes an abnormality sensor 150 that detects an abnormality in at least one of the electronic component package 20 and the electronic component 10. That is, the abnormality sensor 150 is provided for each packaging device 100. For example, the abnormality sensor 150 detects an abnormality in the appearance of the electronic component package 20 (such as an abnormality in the taping state) or an abnormality in the appearance of the electronic component 10 .

<<Inspection equipment>>
The inspection device 200 performs an inspection process of inspecting the electronic component package 20. For example, the inspection device 200 performs an inspection such as an appearance inspection of the electronic component package 20 (confirming the state of taping, etc.) or an appearance inspection of the electronic component 10.

The inspection apparatus 200 includes a plurality of inspection lines with different inspection contents. For example, the inspection device 200 has three inspection lines with different inspection contents: a first inspection line that performs a 100% inspection, a second inspection line that performs a 50% thinning inspection, and a third inspection line that performs a 20% thinning inspection. Equipped with an inspection line. Further, each inspection line may include, for example, automatic inspection based on image analysis, as well as manual inspection based on visual inspection by an operator.

<<Conveyor>>
The conveyor 210 conveys the carrier 30 containing the electronic component package 20 from the packaging apparatus 100 to the inspection apparatus 200. For example, the transport machine 210 loads and transports the transport tools 30 one by one. The transport machine 210 is, for example, an AGV (Automatic Guided Vehicle), and transports the transport tool 30 to the inspection device 200 based on a control signal from the control device 500. Specifically, the carrier 210 transports the carrier 30 to the inspection line determined by the control device 500 among the plurality of inspection lines in the inspection device 200. Note that the transport machine 210 may directly transport the electronic components of the processing lot determined by the control device 500 as not requiring inspection to the storage 300 without transporting them to the inspection device 200 .

<<Carrying machine>>
As shown in FIGS. 1 and 5, the carry-in machine 310 carries the carrier 30 containing the electronic component package 20 inspected by the inspection device 200 into the storage 300. The carry-in machine 310 may include a first carry-in machine 311 and a second carry-in machine 312.

The first carry-in machine 311 is, for example, an AGV (Automatic Guided Vehicle), and transports the carrier 30 from the inspection device 200 to the second carry-in machine 312 based on an instruction signal from the control device 500.

The second carry-in machine 312 is a warehousing robot equipped with, for example, a conveyor, a stacker crane, a work arm, etc., and is based on an instruction signal from the control device 500, for example, storage location information. The carrier 30 is transported to a storage location in the storage warehouse 300.

Note that, based on an instruction signal from the control device 500, the loading machine 310 is configured to transport a plurality of carriers 30 containing electronic components 10 of the same processing lot so as to allow a plurality of carriers 30 to be stored at separate locations. The transport devices 30 may be sequentially carried into vacant storage locations in the storage warehouse 300. In addition, the carrying-in machine 310 may be a transportation trolley carried by a worker.

<<Storage>>
As shown in FIG. 5, the storage 300 is an automated warehouse that stores the carriers 30 containing the electronic component packages 20. The storage 300 has storage location information (address information) for each storage location where the carrier 30 is stored. The carriers 30 are sequentially carried into vacant storage locations in the storage warehouse 300 according to commands from the control device 500. As will be described later, when the carriers 30 are carried into the storage 300, the storage information indicating the carrier identification information of each carrier 30 stored in the storage 300 and the storage location of each carrier 30 is displayed. The location information is stored in association with the location information by the control device 500.

<<Unloading machine>>
As shown in FIGS. 1 and 5, the unloading machine 320 unloads the transport tool 30 from the storage 300 when the transport tool 30 containing the electronic component package 20 is shipped. The unloading machine 320 may include a first unloading machine 321 and a second unloading machine 322.

The first unloading machine 321 is an unloading robot equipped with, for example, a conveyor, a stacker crane, a work arm, etc., and based on the instruction signal from the control device 500, the first unloading machine 321 stores the transport equipment specified by the instruction signal and the storage device specified by the instruction signal. It is carried out to the second carrying out machine 322 from the storage location of the storage warehouse 300 indicated by the location information.

The second carry-out machine 322 is, for example, an AGV (Automatic Guided Vehicle), and carries out the carrier 30 carried out by the first carry-out machine from the storage 300 . Note that the unloading machine 320 may be a transportation cart carried by an operator.

<<Control device (host device)>>
As shown in FIG. 6, the control device 500 determines the inspection level to be performed in the inspection process based on the abnormality level of the electronic component package 20 or the electronic component 10 detected in the packaging process, and The transport machine 210 is controlled to transport the transport device 30 containing the packaged electronic component package 20 to the inspection line of the relevant inspection level in the inspection process. The control device 500 includes an abnormality information generation section 520, an inspection line determination section 530 as an inspection determination section, a control signal output section 540, and a storage section 560. Further, the control device 500 may include a first association information generation section 511.

<<<First association information generation unit>>>
The first association information generation unit 511 uses the lot-related identification information acquired by the lot-related identification information acquisition device 120 of the packaging apparatus 100 and the first transportation of the packaging apparatus 100 via a communication interface that conforms to a wireless or wired communication standard. The carrier identification information acquired by the equipment identification information acquisition device 130 is received. The first association information generation unit 511 associates the lot-related identification information and the vehicle identification information to generate first association information. The generated first association information may be stored in the storage unit 560.

Note that the first association information generation unit 511 receives the package identification information acquired by the first package identification information acquisition device 140 of the packaging apparatus 100, and further associates the package identification information to generate first association information. You may.

<<<Abnormality information generation section>>>
The abnormality information generation unit 520 generates abnormality information regarding an abnormality in the electronic component package 20 or the electronic component 10 detected by the abnormality sensor 150 of the packaging device 100. For example, the abnormality information generation unit 520 generates abnormality information for each lot of electronic components 10 processed. More specifically, the abnormality information generation unit 520 calculates, as abnormality information, the number of abnormalities in the electronic component package 20 or the electronic component 10 detected by the abnormality sensor 150 of the packaging device 100 for each processed lot of the electronic component 10. Information on the number of abnormalities within a lot counted may be generated.

<<<Inspection line determination unit (inspection determination unit)>>>
The inspection line determining unit 530 serving as an inspection determining unit determines the inspection to be performed by the inspection apparatus 200 based on the abnormality information. Specifically, the inspection line determining unit 530 determines an inspection line from among a plurality of inspection lines with different inspection contents in the inspection apparatus 200 based on the abnormality information. The inspection line determination unit 530 may determine an inspection line for each processing lot of electronic components based on abnormality information for each processing lot. For example, the inspection line determining unit 530 determines an inspection line with a higher inspection level for a processed lot with a larger number of intra-lot abnormalities, and for a processed lot with a smaller number of abnormalities within a lot, based on information on the number of abnormalities within a lot as abnormality information. The lower the inspection level, the lower the inspection line is determined.

For example, the inspection line determining unit 530
・Determine a first inspection line for performing a 100% inspection on processed lots where the number of abnormalities within the lot is equal to or greater than a predetermined first threshold;
・Determine a second inspection line that performs a 50% thinning inspection for processed lots where the number of abnormalities within the lot is greater than or equal to a predetermined second threshold and less than the first threshold;
- Determine a third inspection line for performing a 20% thinning inspection on processed lots in which the number of intra-lot abnormalities is greater than 0 and less than the second threshold.
Note that the first threshold value>the second threshold value>0.
Furthermore, for example, the inspection line determining unit 530 may determine that inspection is not necessary for a processed lot in which the number of intra-lot abnormalities is 0.

Furthermore, the inspection line determination unit 530 may determine an inspection line for each carrier 30 that accommodates the electronic components of the processing lot based on the abnormality information and the first association information for each processing lot of electronic components. . For example, by associating abnormality information with a processing lot, the inspection line determining unit 530 inspects the carrier 30 that transports the processing lot associated with the predetermined abnormality information and the inspection content corresponding to the predetermined abnormality information. It may also be associated with an inspection line. That is, one or more carriers 30 constituting the same processing lot are transported to the same inspection line.

<<<Control signal output section>>>
The control signal output unit 540 transmits a control signal for controlling the carrier 210 so that the inspection determined by the inspection line determination unit 530 as an inspection determination unit is performed, via a communication interface that conforms to a wireless or wired communication standard. output to the machine 210. Specifically, the control signal output unit 540 controls the conveyance machine 210 to convey the carrier 30 that accommodates the electronic component package 20 to the inspection line determined by the inspection line determination unit 530 as a control signal. A control signal is output to the transport machine 210. Note that when the inspection line determination unit 530 determines that the inspection is not necessary, the control signal output unit 540 directly conveys the carrier 30 containing the electronic component package 20 to the storage 300 without conveying it to the inspection apparatus 200. A control signal for doing so may be output to the transport machine 210.

The control device 500 may feed back the inspection result information for each processed lot in the inspection device 200 to the packaging device 100 that has packaged the electronic components 10 of this processed lot into the electronic component package 20 and accommodated it in the carrier 30. .

The first association information generation section 511, the abnormality information generation section 520, the inspection line determination section 530, and the control signal output section 540 (also the examination content determination section 530A and the control signal output section 540A, which will be described later) of the control device 500, For example, it is composed of one or more arithmetic processors such as a CPU (Central Processing Unit), a DSP (Digital Signal Processor), and an FPGA (Field-Programmable Gate Array). These various functions of the control device 500 are realized, for example, by executing predetermined software (programs) stored in the storage unit 560. These various functions of the control device 500 may be realized by cooperation between hardware and software, or may be realized only by hardware (electronic circuits).

All of the functions of these control devices 500 do not necessarily have to be provided in the host device, and some of the functions of these control devices 500 may be provided separately in a device other than the host device. For example, the first association information generation section 511 and the abnormality information generation section 520 may be provided in the packaging device 100.

Storage unit 560 stores programs (software) executed by each unit of control device 500. The storage unit 560 also stores first association information, a first threshold, a second threshold, and a third threshold. The storage unit 560 is configured with a recording medium such as a ROM (Read Only Memory), an HDD (Hard Disk Drive), an SSD (Solid State Drive), or a removable memory card.

Next, an inspection operation by the electronic component package manufacturing system according to the first embodiment will be described. FIG. 7 is a flowchart showing the inspection operation (fully automatic) by the electronic component package manufacturing system according to the first embodiment, and FIG. 8 is a flowchart showing the inspection operation by the electronic component package manufacturing system according to the first embodiment. (Automatic+Manual) is a flowchart.

<Inspection operation (fully automatic)>
The packaging device 100 packages a plurality of electronic components 10 to generate an electronic component package 20. Furthermore, the packaging device 100 accommodates a plurality of electronic component packages 20 in a carrier 30.

At this time, the lot-related identification information acquisition device 120 of the packaging apparatus 100 obtains lot-related identification information related to the processed lot of the electronic components 10 from the identifier 11 of the electronic component storage container 15. Further, the first carrier identification information acquisition device 130 of the packaging apparatus 100 acquires carrier identification information of the carrier 30 from the identifier 31 of the carrier 30. Then, the first association information generation unit 511 of the control device 500 associates the lot-related identification information and the vehicle identification information to generate first association information.

Also, at this time, as shown in FIG. 7, the abnormality sensor 150 of the packaging device 100 detects an abnormality in the electronic component package 20 or the electronic component 10 (S11). Then, the abnormality information generation unit 520 of the control device 500 generates abnormality information regarding the abnormality of the electronic component package 20 or the electronic component 10 for each processed lot of the electronic component 10 (S12). Specifically, the abnormality information generating unit 520 uses the number of abnormalities in the electronic component package 20 or the electronic component 10 detected by the abnormality sensor 150 as the abnormality information in the lot, which is counted for each processed lot of the electronic component 10. Generate abnormality count information.

Next, the inspection line determining unit 530 of the control device 500 selects the inspection device 200 for each carrier 30 that accommodates the electronic components of the processing lot based on the abnormality information and the first association information for each processing lot of electronic components. An inspection line is determined from among a plurality of inspection lines with different inspection contents (S13). Specifically, based on the information on the number of abnormalities within a lot, the inspection line determining unit 530 determines an inspection line with a higher inspection level for a processed lot with a higher number of abnormalities within a lot, and determines an inspection line with a higher inspection level for a processed lot with a lower number of abnormalities within a lot. , determine the inspection line with a low inspection level.

For example, the inspection line determining unit 530
・Determine a first inspection line for performing a 100% inspection on processed lots where the number of abnormalities within the lot is equal to or greater than a predetermined first threshold;
・Determine a second inspection line that performs a 50% thinning inspection for processed lots where the number of abnormalities within the lot is greater than or equal to a predetermined second threshold and less than the first threshold;
- Determine a third inspection line for performing a 20% thinning inspection on processed lots in which the number of intra-lot abnormalities is greater than 0 and less than the second threshold.
Furthermore, for example, the inspection line determining unit 530 may determine that inspection is not necessary for a processed lot in which the number of intra-lot abnormalities is 0.

Next, the control signal output unit 540 of the control device 500 outputs a control signal for controlling the conveyor 210 to convey the carrier 30 that accommodates the electronic component package 20 to the inspection line determined by the inspection line determining unit 530. is output to the transport machine 210 (S14). Note that when the inspection line determination unit 530 determines that the inspection is not necessary, the control signal output unit 540 directly conveys the carrier 30 containing the electronic component package 20 to the storage 300 without conveying it to the inspection apparatus 200. A control signal for doing so may be output to the transport machine 210.

Then, based on the control signal, the conveyor 210 conveys the carrier 30 that accommodates the electronic component package 20 to the first inspection line, second inspection line, or third inspection line of the inspection apparatus 200 (S15). .

Next, the inspection device 200 inspects each inspection line. For example, the first inspection line performs a 100% inspection (S16-1), the second inspection line performs a 50% inspection (S16-2), and the third inspection line performs a 20% inspection (S16-3). ).

After the inspection is completed, the carry-in machine 310 carries the carrier 30 that accommodates the electronic component package 20 into the storage 300 (S17).

Note that when the inspection line determining unit 530 determines that inspection is not necessary in step S14, in step S15, the carrier 210 moves the carrier 30 containing the electronic component package 20 to the inspection device based on the control signal. 200, but may be directly transported to the storage 300.

<Inspection operation (automatic + manual)>
As shown in FIG. 8, after the automatic inspection by the inspection device 200, a manual inspection by an operator may be performed. For example, in the first inspection line, a manual inspection, which is an operator inspection, may be performed after the automatic inspection of all items (S18-1). Furthermore, in the second inspection line, a manual inspection, which is an operator inspection, may be performed after the automatic 50% inspection (S18-2). Further, in the third inspection line, a manual inspection, which is an operator inspection, may be performed after the automatic inspection of the 20% inspection (S18-3).

As described above, according to the electronic component package manufacturing system 1 of the first embodiment, the packaging device 100 includes the abnormality sensor 150 that detects an abnormality in the electronic component package 20 or the electronic component 10, and the control device 500 is an abnormality information generation unit 520 that generates abnormality information regarding the abnormality of the electronic component package 20 or the electronic component 10 detected by the abnormality sensor 150 of the packaging device 100, and an abnormality information generation unit 520 that generates abnormality information regarding the abnormality of the electronic component package 20 or the electronic component 10 detected by the abnormality sensor 150 of the packaging device 100, and the inspection device 200 based on the abnormality information. It includes an inspection line determining section 530 as an inspection determining section that determines the inspection to be performed, and a control signal output section 540 that outputs a control signal to control the carrier 210 so that the inspection determined by the inspection line determining section 530 is performed. .
More specifically, according to the electronic component package manufacturing system 1 of the first embodiment, the inspection device 200 includes a plurality of inspection lines with different inspection contents, and the inspection line determination unit 530 selects a plurality of inspection lines based on abnormality information. The control signal output unit 540 outputs a control signal to the transport machine 210 to control the transport machine 210 to transport the electronic component package 20 to the determined test line. Output to.
Thereby, the inspection content can be varied in the inspection process based on the abnormality detected in the packaging process. For example, the higher the abnormality level in the packaging process, the higher the inspection level in the inspection process. On the other hand, the lower the abnormality level in the packaging process, the lower the inspection level in the inspection process. Therefore, the electronic component package 20 can be efficiently inspected while maintaining the inspection accuracy of the electronic component package 20.

Here, in the inspection of the electronic component package 20 in the conventional electronic component package manufacturing system,
(1) In the packaging process, a visual inspection of all the completed packages 20 is performed,
(2) After completing the packaging of all processed lots in the packaging process, in the pre-shipment inspection process, the appearance of all the completed packages 20 is inspected, and any number of completed packages 20 are checked for taping status. Check the
(3) In the steps (1) and (2) above, if a defect in the appearance or taping condition of the package 20 is found, the operator visually confirms the details of the defect, and if the defect is found, the product is sent to the abnormality processing process. manually convey the
(4) In the abnormality handling process, the operator takes measures according to the nature of the failure.

In this conventional inspection procedure, the confirmation of the taping state in the pre-shipment inspection process (2) above is a fixed amount of inspection regardless of the size of defects in the processed lot in the inspection of the packaging process. In addition, in response to the history of past failures, the number of taping state checks in the pre-shipment inspection process described in (2) above was increased to ensure quality. Therefore, in the pre-shipment inspection step (2) above, the amount of inspection becomes excessive even for processed lots with few occurrences of defects, and the number of man-hours required for inspection (confirmation of taping state) increases.

In this regard, according to the electronic component package manufacturing system 1 of the first embodiment, as described above, the inspection process is performed based on the abnormality level (for example, the number of abnormalities) for each processing lot of each packaging device in the packaging process. Inspection levels (for example, 100% inspection, 50% inspection, 20% inspection) can be varied for each processed lot. Therefore, the number of inspection steps can be reduced.

In addition, in the conventional inspection procedure, as in the procedure (2) above, the pre-shipment inspection process is performed after the packaging of all processed lots is completed in the packaging process, so when the pre-shipment inspection process is performed, In the packaging process, the next processing lot is being processed as in the procedure (1) above. The inspection process is not real-time compared to the packaging process. Therefore, if a defect is confirmed in the pre-shipment inspection process, it is necessary to inspect not only the current processed lot but also the next processed lot, considering the possibility of a defect in the packaging device.

In this regard, according to the electronic component package manufacturing system 1 of the first embodiment, when a processing lot, which is a transport lot constituted by a plurality of carriers 30, is flowing in the packaging process, real-time As soon as a certain number of packages 20 and carriers 30 are completed, that is, for each part of the processing lot, the abnormality information generation unit 520 generates abnormality information, and the inspection line determination unit 530 as an inspection determination unit generates abnormality information. The inspection level (for example, 100% inspection, 50% inspection, 20% inspection) of the packages 20 may be determined, and the inspection process may be performed on these packages 20. Moreover, in the packaging process, when the same process lot is flowing, the control device 500 may feed back the inspection results for each part of the process lot in the inspection process to the packaging process in real time.

(Second embodiment)
In the first embodiment described above, the control device 500 controlled the transport machine 210 so that the determined inspection was performed. In the second embodiment, the control device controls the inspection device so that the determined inspection is performed.

FIG. 9 is a schematic configuration diagram showing a manufacturing system for an electronic component package according to the second embodiment. FIG. 10 is a schematic configuration diagram showing an example of a control device (host device) according to the second embodiment. An electronic component package manufacturing system 1A according to the second embodiment shown in FIG. 9 is an electronic component package manufacturing system 1 shown in FIG. This embodiment differs from the first embodiment in that it includes 500A.

<<Inspection equipment>>
The inspection apparatus 200A differs from the first embodiment in that the inspection apparatus 200 shown in FIG. 1 includes one inspection line instead of the plurality of inspection lines. Furthermore, the inspection apparatus 200A differs from the first embodiment in that the inspection apparatus 200 shown in FIG. 1 further includes a display section 250.

The inspection device 200A has an inspection line that can perform inspections of different inspection contents. Further, the inspection line may include manual inspection using visual inspection by an operator in addition to automatic inspection using image analysis, for example.

The inspection apparatus 200A may include a second carrier identification information acquisition device 230. Furthermore, the inspection apparatus 200A may include a second package identification information acquisition device 240.

The second carrier identification information acquisition device 230 acquires carrier identification information of the carrier 30 when carrying the carrier 30 into the inspection apparatus 200A. For example, the second carrier identification information acquisition device 230 is a barcode reader or a two-dimensional code reader, and reads carrier identification information from an identifier 31 such as a barcode or two-dimensional code provided on the carrier 30. Alternatively, the second vehicle identification information acquisition device 230 is an RFID reader, and reads vehicle identification information from the identifier 31 such as RFID.

The second package identification information acquisition device 240 acquires the package identification information of the package 20 when carrying the carrier 30 into the inspection apparatus 200A. Specifically, the second package identification information acquisition device 240 is a barcode reader or a two-dimensional code reader, and acquires carrier identification information from an identifier 21 such as a barcode or two-dimensional code provided on the package 20. Read. Alternatively, the second packaging identification information acquisition device 240 is an RFID reader, and acquires packaging identification information from the identifier 21 such as an RFID tag.

Note that the second carrier identification information acquisition device 230 may be an input unit through which the user inputs carrier identification information. Further, the second packaging identification information acquisition device 240 may be an input unit through which the user inputs packaging identification information. In this case, the second carrier identification information acquisition device 230 and the second package identification information acquisition device 240 are configured by, for example, a keyboard or mouse having physical operation buttons, or a touch panel having virtual operation buttons. be done.

The display unit 250 is a display unit that can display different test contents. The display unit 250 displays the test content determined by the test content determining unit 530A, which will be described later, based on a control signal from the control device 500A. For example, the display unit 250 displays three different inspection contents: a first inspection content that performs a 100% inspection, a second inspection content that performs a 50% thinning inspection, and a third inspection content that performs a 20% thinning inspection. do. Thereby, the operator can set the inspection line to perform the inspection according to the inspection content displayed on the display unit 250. The display unit 250 is configured with, for example, a liquid crystal display or an organic EL display.

Further, the display unit 250 may display the test content determined by the test content determination unit 530A based on the carrier identification information acquired by the second carrier identification information acquisition device 230. Alternatively, the display unit 250 may display the test content determined by the test content determination unit 530A based on the package identification information acquired by the second package identification information acquisition device 240.

<<Conveyor>>
The transport machine 210 may be an AGV as in the first embodiment described above. In addition, in 2nd Embodiment, the conveyance machine 210 may be a conveyance trolley carried by a worker.

<<Control device (host device)>>
As shown in FIG. 10, in the control device 500 shown in FIG. 1, the control device 500A includes an examination content determination section as an examination determination section in place of the examination line determination section 530 and the control signal output section 540 as the examination determination section. This embodiment differs from the first embodiment in that it includes a control signal output section 530A and a control signal output section 540A. The control device 500A determines the inspection level to be performed in the inspection process based on the abnormality level of the electronic component package 20 or the electronic component 10 detected in the packaging process, and determines the level of inspection to be performed in the inspection process. The inspection device 200 is controlled to inspect the carrier 30 that accommodates the above at the inspection level in the inspection process.

<<<Inspection content determination unit (examination determination unit)>>>
The test content determining unit 530A, which serves as a test determining unit, determines the test to be performed in the testing device 200A based on the abnormality information. Specifically, the test content determination unit 530A determines the test content of the inspection device 200A from among a plurality of different test content based on the abnormality information. The inspection content determination unit 530A may determine the inspection content for each processed lot of electronic components based on the abnormality information for each processed lot. For example, the inspection content determination unit 530A determines the inspection content with a higher inspection level for a processed lot with a larger number of intra-lot abnormalities, based on the information on the number of abnormalities within a lot as abnormality information, and for a processed lot with a lower number of abnormalities within a lot. The lower the inspection level, the lower the inspection content is determined.

For example, the inspection content determining unit 530A:
・Determine the contents of a first inspection to perform a 100% inspection on a processed lot in which the number of abnormalities within the lot is equal to or greater than a predetermined first threshold;
・Determine the content of a second inspection to perform a 50% thinning inspection for a processed lot whose number of abnormalities within the lot is greater than or equal to a predetermined second threshold and less than a first threshold;
- Determine the content of a third inspection in which a 20% thinning inspection is performed on a processed lot in which the number of in-lot abnormalities is greater than 0 and less than the second threshold.
Note that the first threshold value>the second threshold value>0.
Further, for example, the inspection content determining unit 530A may determine that inspection is not necessary for a processed lot in which the number of intra-lot abnormalities is 0.

In addition, the inspection content determination unit 530A may determine the inspection content for each carrier 30 that accommodates the electronic components of the processing lot based on the abnormality information and the first association information for each processing lot of electronic components. . For example, the inspection content determination unit 530A associates the abnormality information with the processing lot, thereby associating the transport equipment 30 that transports the processing lot associated with the predetermined abnormality information with the inspection content corresponding to the predetermined abnormality information. You can also attach it. That is, one or more carriers 30 constituting the same processing lot will be inspected with the same inspection content.

<<<Control signal output section>>>
The control signal output unit 540A outputs a control signal for controlling the inspection device 200A so that the inspection determined by the inspection content determination unit 530A as an inspection determination unit is performed via a communication interface that conforms to a wireless or wired communication standard. Output to device 200A. Specifically, the control signal output unit 540A outputs to the inspection apparatus 200A a control signal that controls the inspection apparatus 200A to perform the inspection according to the inspection content determined by the inspection content determination unit 530A. Note that when the test content determination unit 530A determines that the test is not necessary, the control signal output unit 540 may output a control signal to the test device 200A to control the test device 200A so as not to perform the test.

Next, an inspection operation by the electronic component package manufacturing system according to the second embodiment will be described. FIG. 11 is a flowchart showing the inspection operation (fully automatic) by the electronic component package manufacturing system according to the second embodiment, and FIG. 12 is a flowchart showing the inspection operation by the electronic component package manufacturing system according to the second embodiment. (Automatic+Manual) is a flowchart.

<Inspection operation (fully automatic)>
Similarly to the above, the packaging device 100 packages a plurality of electronic components 10 to generate an electronic component package 20. Furthermore, the packaging device 100 accommodates a plurality of electronic component packages 20 in a carrier 30.

At this time, as described above, the lot-related identification information acquisition device 120 of the packaging apparatus 100 obtains lot-related identification information related to the processed lot of the electronic components 10 from the identifier 11 of the electronic component storage container 15. Further, the first carrier identification information acquisition device 130 of the packaging apparatus 100 acquires carrier identification information of the carrier 30 from the identifier 31 of the carrier 30. Then, the first association information generation unit 511 of the control device 500A associates the lot-related identification information and the vehicle identification information to generate first association information.

At this time, as shown in FIG. 11, the abnormality sensor 150 of the packaging device 100 detects an abnormality in the electronic component package 20 or the electronic component 10 (S21). Then, the abnormality information generation unit 520 of the control device 500A generates abnormality information regarding the abnormality of the electronic component package 20 or the electronic component 10 for each processed lot of the electronic component 10 (S22). Specifically, the abnormality information generating unit 520 uses the number of abnormalities in the electronic component package 20 or the electronic component 10 detected by the abnormality sensor 150 as the abnormality information in the lot, which is counted for each processed lot of the electronic component 10. Generate abnormality count information.

Next, the inspection content determining unit 530A of the control device 500A selects a plurality of different inspection items for each carrier 30 that accommodates the electronic components of the processing lot, based on the abnormality information and the first association information for each processing lot of electronic components. The inspection contents of the inspection device 200A are determined from among the inspection contents (S23). Specifically, based on the information on the number of abnormalities within a lot, the inspection content determining unit 530A determines the inspection content with a higher inspection level for a processed lot with a higher number of abnormalities within a lot, and for a processed lot with a lower number of abnormalities within a lot. , determine the inspection content with a low inspection level.

For example, the inspection content determining unit 530A:
・Determine the contents of a first inspection to perform a 100% inspection on a processed lot in which the number of abnormalities within the lot is equal to or greater than a predetermined first threshold;
・Determine the content of a second inspection to perform a 50% thinning inspection for a processed lot whose number of abnormalities within the lot is greater than or equal to a predetermined second threshold and less than a first threshold;
- Determine the content of a third inspection in which a 20% thinning inspection is performed on a processed lot in which the number of in-lot abnormalities is greater than 0 and less than the second threshold.
Further, for example, the inspection content determining unit 530A may determine that inspection is not necessary for a processed lot in which the number of intra-lot abnormalities is 0.

Next, the control signal output unit 540A of the control device 500A outputs a control signal to the inspection device 200A to control the inspection device 200A to perform the inspection based on the inspection content determined by the inspection content determination unit 530A (S24). Note that when the test content determination unit 530A determines that the test is unnecessary, the control signal output unit 540A may output a control signal to the test device 200A to control the test device 200A so as not to perform the test.

At this time, the transport machine 210 as an AGV transports the transport tool 30 that accommodates the electronic component package 20 to the inspection device 200A based on a control signal from the control device 500A. Alternatively, the carrier 210 serving as a carrier transports the carrier 30 containing the electronic component package 20 to the inspection device 200A manually by an operator.

Next, the display unit 250 of the inspection device 200A displays the inspection details based on the control signal (S25). For example, the first inspection content displays a 100% inspection, the second inspection content displays a 50% inspection, and the third inspection content displays a 20% inspection. Thereby, the operator sets the inspection line to perform the inspection according to the inspection content displayed on the display unit 250.

Then, the inspection device 200A inspects each inspection content. For example, in the inspection of the first inspection content, 100% inspection is performed (S26-1), in the inspection of the second inspection content, 50% inspection is carried out (S26-2), and in the inspection of the third inspection content, 20% inspection is carried out. This is done (S26-3).

After the inspection is completed, the carry-in machine 310 carries the carrier 30 that accommodates the electronic component package 20 into the storage 300 (S27).

Note that if the test content determining unit 530A determines that the test is not necessary in step S24, the display unit 250 displays, based on the control signal, that the test is not performed in step S25. Accordingly, the operator sets the inspection line so that no inspection is performed. Thereby, the carrier 30 that accommodates the electronic component package 20 may be directly transported to the storage 300 without being inspected.

<Inspection operation (automatic + manual)>
As shown in FIG. 12, a manual inspection by an operator may be performed after the automatic inspection by the inspection device 200A. For example, in the inspection of the first inspection content, a manual inspection, which is an operator inspection, may be performed after an automatic inspection of a 100% inspection (S28-1). Furthermore, in the inspection of the second inspection content, a manual inspection, which is an operator inspection, may be performed after the automatic inspection of 50% inspection (S28-2). Furthermore, in the inspection of the third inspection content, a manual inspection, which is an operator inspection, may be performed after the automatic inspection of the 20% inspection (S28-3).

As explained above, the electronic component package manufacturing system 1A of the second embodiment can also provide the same advantages as the electronic component package manufacturing system 1 of the first embodiment. To be more specific, in the electronic component package manufacturing system 1A of the second embodiment, the packaging device 100 also includes an abnormality sensor 150 that detects an abnormality in the electronic component package 20 or the electronic component 10, and the control device 500A An anomaly information generation unit 520 that generates anomaly information regarding an anomaly in the electronic component package 20 or the electronic component 10 detected by the anomaly sensor 150 of the device 100, and determines an inspection to be performed in the inspection device 200A based on the anomaly information. and a control signal output section 540A that outputs a control signal for controlling the inspection apparatus 200A so that the test determined by the test content determining section 530A is performed.
More specifically, according to the electronic component package manufacturing system 1A of the second embodiment, the inspection content determination unit 530A selects the inspection of the inspection device 200A from among a plurality of different inspection content based on the abnormality information. The content is determined, and the control signal output unit 540A outputs a control signal to the inspection apparatus 200A to control the inspection apparatus 200A to perform the inspection based on the determined inspection content.
Thereby, the inspection content can be varied in the inspection process based on the abnormality detected in the packaging process. For example, the higher the abnormality level in the packaging process, the higher the inspection level in the inspection process. On the other hand, the lower the abnormality level in the packaging process, the lower the inspection level in the inspection process. Therefore, the electronic component package 20 can be efficiently inspected while maintaining the inspection accuracy of the electronic component package 20.

Also, in the electronic component package manufacturing system 1A of the second embodiment, the inspection level (e.g., , 100% inspection, 50% inspection, and 20% inspection). Therefore, the number of inspection steps can be reduced.

Also, in the electronic component package manufacturing system 1A of the second embodiment, in the packaging process, for example, when a processing lot, which is a transport lot composed of a plurality of carriers 30, is flowing, a certain amount of As soon as several packages 20 and carriers 30 are completed, that is, for each part of a processing lot, the abnormality information generation unit 520 generates abnormality information, and the inspection content determination unit 530A as an inspection determination unit generates abnormality information for each of these packages 20. The inspection level (for example, 100% inspection, 50% inspection, 20% inspection) may be determined, and the inspection process may be performed on these packages 20. Moreover, in the packaging process, when the same process lot is flowing, the control device 500A may feed back the inspection results for each part of the process lot in the inspection process to the packaging process in real time.

(Modified example of second embodiment)
In the second embodiment, the inspection device 200A includes a display unit 250 that displays the inspection content determined by the inspection content determination unit 530A based on a control signal from the control device 500A. Thereby, the operator set the inspection line to perform the inspection according to the inspection contents displayed on the display unit 250.
In a modification of the second embodiment, the inspection device 200A is capable of executing the inspection of the inspection content determined by the inspection content determination unit 530A based on the control signal from the control device 500A without depending on the settings of the operator. It may be configured as follows. In this case, the inspection device 200A may be an automatic inspection robot or the like.

Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and various changes and modifications are possible. For example, the electronic component is not limited to a multilayer ceramic capacitor, but may also be a chip-shaped multilayer ceramic electronic component such as a piezoelectric component, a thermistor, an inductor, or other electronic components.

1, 1A Electronic component package manufacturing system 10 Electronic component 11 Identifier (lot-related identification information)
15 Electronic component storage container 20 Electronic component package 21 Identifier (package identification information)
23 Carrier tape (packaging material)
24 Cover tape (packaging material)
30 Transportation equipment 31 Identifier (transportation equipment identification information)
100 Packaging device 120 Lot-related identification information acquisition device 130 First carrier identification information acquisition device 140 First package identification information acquisition device 200, 200A Inspection device 210 Conveyor 230 Second carrier identification information acquisition device 240 First package Identification information acquisition device 250 Display unit 300 Storage 310 Carrying-in machine 311 First carrying-in machine 312 Second carrying-in machine 320 Carrying-out machine 321 First carrying-out machine 322 Second carrying-out machine 500, 500A Control device (host device)
511 First association information generation unit 520 Abnormality information generation unit 530 Inspection line determination unit (inspection determination unit)
530A Inspection content determination unit (examination determination unit)
540, 540A Control signal output section 560 Storage section

Claims (18)

A system for manufacturing an electronic component package in which a plurality of electronic components are packaged,
a packaging device that generates the electronic component package by packaging the plurality of electronic components with a packaging material;
an inspection device that inspects the electronic component package;
a conveyance machine that conveys the electronic component package from the packaging device to the inspection device;
a control device;
Equipped with
The packaging device includes an abnormality sensor that detects an abnormality in the electronic component package or the electronic component,
The inspection device includes a plurality of inspection lines with different inspection contents,
The control device includes:
an abnormality information generation unit that generates abnormality information regarding an abnormality of the electronic component package or the electronic component detected by the abnormality sensor of the packaging device;
a test determining unit that determines a test to be performed in the test device based on the abnormality information;
a control signal output unit that outputs a control signal to control the transport machine or the inspection device so that the inspection determined by the inspection determination unit is performed;
Equipped with
The inspection determining unit is an inspection line determining unit that determines an inspection line from among the plurality of inspection lines based on the abnormality information,
The inspection line determining unit determines an inspection line for each processing lot of the electronic components based on the abnormality information for each processing lot,
The control signal output unit outputs to the transport machine, as the control signal, a control signal that controls the transport machine to transport the electronic component package to the inspection line determined by the inspection line determination unit.
Manufacturing system for electronic component packaging. The manufacturing of an electronic component package according to claim 1 , wherein the conveyance machine conveys the electronic component package to an inspection line determined by the inspection line determination section based on the control signal from the control device. system. The packaging device stores the plurality of electronic component packages in a carrier,
The packaging device includes:
a lot-related identification information acquisition device that obtains lot-related identification information that includes processing lot information of a plurality of electronic components or that is associated with processing lot information of the electronic components;
a first carrier identification information acquisition device that acquires carrier identification information of the plurality of carriers;
Equipped with
The control device associates the lot-related identification information acquired by the lot-related identification information acquisition device with the carrier identification information acquired by the first carrier identification information acquisition device, and generates first association information. further comprising a first association information generation unit that generates
The inspection line determining unit determines an inspection line for each carrier that accommodates the electronic components of the processing lot, based on the abnormality information and the first association information for each processing lot of the electronic components.
A manufacturing system for an electronic component package according to claim 1 or 2 . A system for manufacturing an electronic component package in which a plurality of electronic components are packaged,
a packaging device that generates the electronic component package by packaging the plurality of electronic components with a packaging material;
an inspection device that inspects the electronic component package;
a conveyance machine that conveys the electronic component package from the packaging device to the inspection device;
a control device;
Equipped with
The packaging device stores the plurality of electronic component packages in a carrier,
The packaging device includes:
a lot-related identification information acquisition device that obtains lot-related identification information that includes processing lot information of a plurality of electronic components or that is associated with processing lot information of the electronic components;
a first carrier identification information acquisition device that acquires carrier identification information of the plurality of carriers;
an abnormality sensor that detects an abnormality in the electronic component package or the electronic component;
Equipped with
The inspection device includes a plurality of inspection lines with different inspection contents,
The control device includes:
A first step of associating the lot-related identification information acquired by the lot-related identification information acquisition device with the vehicle identification information acquired by the first vehicle identification information acquisition device to generate first association information. An association information generation unit ;
an abnormality information generation unit that generates abnormality information regarding an abnormality of the electronic component package or the electronic component detected by the abnormality sensor of the packaging device;
a test determining unit that determines a test to be performed in the test device based on the abnormality information;
a control signal output unit that outputs a control signal to control the transport machine or the inspection device so that the inspection determined by the inspection determination unit is performed;
Equipped with
The inspection determining unit is an inspection line determining unit that determines an inspection line from among the plurality of inspection lines based on the abnormality information,
The inspection line determining unit determines an inspection line for each carrier that accommodates the electronic components of the processing lot based on the abnormality information and the first association information for each processing lot of the electronic components,
The control signal output unit outputs to the transport machine, as the control signal, a control signal that controls the transport machine to transport the electronic component package to the inspection line determined by the inspection line determination unit.
Manufacturing system for electronic component packaging. A system for manufacturing an electronic component package in which a plurality of electronic components are packaged,
a packaging device that generates the electronic component package by packaging the plurality of electronic components with a packaging material;
an inspection device that inspects the electronic component package;
a conveyance machine that conveys the electronic component package from the packaging device to the inspection device;
a control device;
Equipped with
The packaging device includes an abnormality sensor that detects an abnormality in the electronic component package or the electronic component,
The control device includes:
an abnormality information generation unit that generates abnormality information regarding an abnormality of the electronic component package or the electronic component detected by the abnormality sensor of the packaging device;
a test determining unit that determines a test to be performed in the test device based on the abnormality information;
a control signal output unit that outputs a control signal to control the transport machine or the inspection device so that the inspection determined by the inspection determination unit is performed;
Equipped with
The test determining unit is a test content determining unit that determines the test content of the inspection device from among a plurality of different test contents based on the abnormality information,
The inspection content determination unit determines inspection content for each processing lot of the electronic component based on the abnormality information for each processing lot,
The control signal output unit outputs, as the control signal, a control signal for controlling the inspection apparatus to perform the inspection according to the inspection content determined by the inspection content determination unit, to the inspection apparatus.
Manufacturing system for electronic component packaging. 6. The electronic component package manufacturing system according to claim 5 , wherein the inspection device includes a display unit that displays the inspection content determined by the inspection content determination unit based on the control signal from the control device. 6. The electronic component package manufacturing system according to claim 5 , wherein the inspection device executes the inspection based on the control signal from the control device based on the inspection content determined by the inspection content determination unit. The packaging device stores the plurality of electronic component packages in a carrier ,
The packaging device includes:
a lot-related identification information acquisition device that obtains lot-related identification information that includes processing lot information of a plurality of electronic components or that is associated with processing lot information of the electronic components;
a first carrier identification information acquisition device that acquires carrier identification information of the plurality of carriers;
Equipped with
The control device associates the lot-related identification information acquired by the lot-related identification information acquisition device with the carrier identification information acquired by the first carrier identification information acquisition device , and generates first association information. further comprising a first association information generation unit that generates
The inspection content determination unit determines the inspection content for each carrier that accommodates the electronic components of the processing lot based on the abnormality information and the first association information for each processing lot of the electronic components.
The electronic component package manufacturing system according to any one of claims 5 to 7 . A system for manufacturing an electronic component package in which a plurality of electronic components are packaged,
a packaging device that generates the electronic component package by packaging the plurality of electronic components with a packaging material;
an inspection device that inspects the electronic component package;
a conveyance machine that conveys the electronic component package from the packaging device to the inspection device;
a control device;
Equipped with
The packaging device stores the plurality of electronic component packages in a carrier ,
The packaging device includes:
a lot-related identification information acquisition device that obtains lot-related identification information that includes processing lot information of a plurality of electronic components or that is associated with processing lot information of the electronic components;
a first carrier identification information acquisition device that acquires carrier identification information of the plurality of carriers;
an abnormality sensor that detects an abnormality in the electronic component package or the electronic component;
Equipped with
The control device includes:
A first step of associating the lot-related identification information acquired by the lot-related identification information acquisition device with the vehicle identification information acquired by the first vehicle identification information acquisition device to generate first association information. An association information generation unit;
an abnormality information generation unit that generates abnormality information regarding an abnormality of the electronic component package or the electronic component detected by the abnormality sensor of the packaging device;
a test determining unit that determines a test to be performed in the test device based on the abnormality information;
a control signal output unit that outputs a control signal to control the transport machine or the inspection device so that the inspection determined by the inspection determination unit is performed;
Equipped with
The test determining unit is a test content determining unit that determines the test content of the inspection device from among a plurality of different test contents based on the abnormality information,
The inspection content determination unit determines the inspection content for each carrier that accommodates the electronic components of the processing lot based on the abnormality information and the first association information for each processing lot of the electronic components,
The control signal output unit outputs, as the control signal, a control signal for controlling the inspection apparatus to perform the inspection according to the inspection content determined by the inspection content determination unit, to the inspection apparatus.
Manufacturing system for electronic component packaging. The abnormality information generation unit generates the abnormality information for each processed lot of the electronic component.
A manufacturing system for an electronic component package according to any one of claims 1 to 9 . A system for manufacturing an electronic component package in which a plurality of electronic components are packaged,
a packaging device that generates the electronic component package by packaging the plurality of electronic components with a packaging material;
an inspection device that inspects the electronic component package;
a conveyance machine that conveys the electronic component package from the packaging device to the inspection device;
a control device;
Equipped with
The packaging device includes an abnormality sensor that detects an abnormality in the electronic component package or the electronic component,
The control device includes:
an abnormality information generation unit that generates abnormality information regarding an abnormality of the electronic component package or the electronic component detected by the abnormality sensor of the packaging device;
a test determining unit that determines a test to be performed in the test device based on the abnormality information;
a control signal output unit that outputs a control signal to control the transport machine or the inspection device so that the inspection determined by the inspection determination unit is performed;
Equipped with
The abnormality information generation unit generates the abnormality information for each processed lot of the electronic component.
Manufacturing system for electronic component packaging. The abnormality information generating unit is configured to generate, as the abnormality information, the number of abnormalities in the electronic component package or the electronic component detected by the abnormality sensor of the packaging device, and the number of abnormalities in the electronic component package or the electronic component within a lot counted for each processed lot of the electronic component. Generate abnormality count information,
The electronic component package manufacturing system according to claim 10 or 11 . The packaging device stores the plurality of electronic component packages in a carrier,
The processing lot is composed of a plurality of electronic components packaged in a plurality of electronic component packages housed in one of the carriers,
The electronic component package manufacturing system according to any one of claims 10 to 12 . The packaging device stores the plurality of electronic component packages in a carrier,
The processing lot is a transport lot composed of a plurality of electronic components constituting one transport unit, and is composed of a plurality of electronic components packaged in a plurality of electronic component packages housed in a plurality of the carriers. be done,
The electronic component package manufacturing system according to any one of claims 10 to 12 . The processing lot is a manufacturing lot made up of a plurality of electronic components manufactured under the same conditions, and is made up of a plurality of electronic components packaged in a plurality of electronic component packages housed in one or more carriers. be done,
The electronic component package manufacturing system according to any one of claims 10 to 12 . having a plurality of said packaging devices;
Electronic components of the same processing lot are packaged into electronic component packages by the same packaging device and housed in a carrier.
The electronic component package manufacturing system according to any one of claims 10 to 15. 17. The control device feeds back inspection result information for each of the processing lots in the inspection device to a packaging device that packages the electronic components of the processing lot into electronic component packages and accommodates them in a carrier. manufacturing system for electronic component packaging. The lot-related identification information acquisition device obtains storage container information for the electronic component as the lot-related identification information,
The control device identifies a processing lot for electronic components contained in the electronic component storage container based on the electronic component storage container information.
The electronic component package manufacturing system according to any one of claims 3, 4, 8, and 9 .

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