JP4860274B2 - Wafer supply device thrust pin speed measuring device and surface mount device - Google Patents

Wafer supply device thrust pin speed measuring device and surface mount device Download PDF

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JP4860274B2
JP4860274B2 JP2006015450A JP2006015450A JP4860274B2 JP 4860274 B2 JP4860274 B2 JP 4860274B2 JP 2006015450 A JP2006015450 A JP 2006015450A JP 2006015450 A JP2006015450 A JP 2006015450A JP 4860274 B2 JP4860274 B2 JP 4860274B2
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push
pin
wafer
height
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JP2007201011A (en
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望 岩嵜
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Juki Corp
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本発明は、ウェハ供給装置の突上げピン速度計測装置及び表面実装装置に係り、特に、表面実装装置におけるウェハ供給装置との接続に際して、突上げピン動作と表面実装装置の吸着ヘッドとの部品受渡しにおける同期制御に用いるのに好適な、ウェハ供給装置の突上げピン速度計測装置、及び、これを備えた表面実装装置に関する。   The present invention relates to a push-up pin speed measuring device and a surface mounting device of a wafer supply device, and in particular, when connecting to a wafer supply device in a surface mount device, the parts are transferred between the push-up pin operation and the suction head of the surface mount device. The present invention relates to a push-up pin speed measurement device for a wafer supply device, and a surface mount device equipped with the device.

図１に例示するようなウェハ供給装置２０において、部品トレイ上に部品が載置されただけで、表面実装装置の吸着ヘッドで簡単に吸着できるトレイ部品と異なり、ウェハシート１０に接着されたウェハ部品１２を表面実装装置の吸着ヘッド３２で吸着する際には、ウェハシート１０から目標のウェハ部品１２だけを剥がすため、特許文献１に記載されているように、図２に示す如く、ウェハ供給装置にヘッド２２及び突上げピン２４が設けられている。そして、図３に示す如く、表面実装装置の吸着ヘッド３２がウェハ部品１２を吸着する位置と同じ位置にウェハ供給装置２０のヘッド２２を移動させ、図４（Ａ）に示す如く、突上げピン２４の上昇動作と吸着ヘッド３２の上昇動作を同期させながら、ウェハ部品１２を吸着ヘッド３２で吸着している。   In a wafer supply apparatus 20 as illustrated in FIG. 1, a wafer bonded to a wafer sheet 10 is different from a tray part that can be easily sucked by a suction head of a surface mounting apparatus just by placing the part on the component tray. When the component 12 is sucked by the suction head 32 of the surface mounting apparatus, only the target wafer component 12 is peeled off from the wafer sheet 10, so that the wafer supply is performed as shown in FIG. The apparatus is provided with a head 22 and a push-up pin 24. Then, as shown in FIG. 3, the head 22 of the wafer supply device 20 is moved to the same position as the position where the suction head 32 of the surface mounting device sucks the wafer component 12, and as shown in FIG. The wafer component 12 is sucked by the suction head 32 while synchronizing the lifting operation of 24 and the lifting operation of the suction head 32.

前記突上げピン２４に関しては、例えば特許文献２に、小チップの場合は１本のピンで突き上げ、大チップの場合は複数のピンで低速で突き上げることが記載され、特許文献３に、突上げピンの上端部位置を検出し得る光センサを設けて、該光センサを突上げピンの上下動方向に沿って移動させて位置決め固定すると共に、その移動距離を検出して表示するデジタルマイクロメータを設けることが記載されている。   With regard to the push-up pin 24, for example, Patent Document 2 describes that a small chip is pushed up by one pin, and a large chip is pushed up at a low speed by a plurality of pins. An optical sensor capable of detecting the position of the upper end of the pin is provided, and the optical sensor is moved along the vertical movement direction of the push-up pin, positioned and fixed, and a digital micrometer for detecting and displaying the moving distance is provided. It is described that it is provided.

特開２００２−１１１２８９号公報Japanese Patent Laid-Open No. 2002-111289 特開平９−９７８０７号公報JP-A-9-97807 特開平２−１１４５４７号公報Japanese Patent Laid-Open No. 2-114547

しかしながら、ウェハ供給装置２０側の突上げピン２４と表面実装装置側の吸着ヘッド３２の動作が完全に同期していないと、図４（Ｂ）に示す如く、ウェハ部品１２を表面実装装置の吸着ヘッド３２に吸着することができない。そのため、表面実装装置の吸着ヘッド３２とウェハ供給装置の突上げピン２４の上昇速度を合わせて完全に同期させなくてはならないが、制御装置が互いに異なるＣＰＵを持っているため、通信速度及び指令動作遅れが生じて、同期をとるのが困難であった。この点に関して、特許文献２は、同期方法であるが、センサが無く、特許文献３は、センサはあるが、高さ設定用で上昇速度検出用ではなかった。   However, if the operations of the push-up pins 24 on the wafer supply device 20 side and the suction head 32 on the surface mounting device are not completely synchronized, the wafer component 12 is attracted to the surface mounting device as shown in FIG. It cannot be adsorbed to the head 32. Therefore, it is necessary to synchronize the rising speeds of the suction head 32 of the surface mounting apparatus and the push-up pins 24 of the wafer supply apparatus completely, but since the control devices have different CPUs, the communication speed and command Operation delay occurred and it was difficult to synchronize. In this regard, Patent Document 2 is a synchronization method, but there is no sensor, and Patent Document 3 has a sensor, but is for height setting and not for detecting an ascending speed.

本発明は、前記従来の問題点を解消するべくなされたもので、特別な計測器を用いることなく、ウェハ供給装置の突上げピン速度を正確に計測することができるようにすることを第１の課題とする。   The present invention has been made to solve the above-mentioned conventional problems. It is a first object of the present invention to make it possible to accurately measure the push-up pin speed of the wafer supply apparatus without using a special measuring instrument. It is an issue.

本発明は、又、制御装置が互いに異なるＣＰＵを持っている場合であっても、ウェハ供給装置の突上げピンと表面実装装置の吸着ヘッドの同期が取れるようにすることを第２の課題とする。   The second object of the present invention is to make it possible to synchronize the push-up pins of the wafer supply device and the suction head of the surface mount device even when the control devices have different CPUs. .

本発明は、ウェハシート上に接着させたウェハ部品を下方から突上げてウェハシートから剥がすための突上げピンを有するウェハ供給装置の突上げピン速度計測装置であって、前記突上げピンの上方から該突上げピンの先端にレーザ光を照射して、該突上げピンの先端の高さを検出する高さ計測センサを備え、該高さ計測センサにより計測される時間毎の前記突上げピン先端の高さに基いて、該突上げピンの応答遅れ及び移動速度を検出することを特徴とするウェハ供給装置の突上げピン速度計測装置により、前記第１の課題を解決したものである。 The present invention relates to a push-up pin speed measuring device for a wafer supply device having a push-up pin for pushing up a wafer component bonded on a wafer sheet from below and peeling it from the wafer sheet, and above the push-up pin and irradiating the tip of the protruding raised pin with a laser beam from, comprising a height measurement sensor that gives test the height of the tip of the protruding raised pins, each time the push-up as measured by the height-measuring sensor The first problem is solved by a push-up pin speed measuring device for a wafer supply device, which detects a response delay and a moving speed of the push-up pin based on the height of the tip of the pin. .

又、ウェハシート上に接着させたウェハ部品を下方から突上げてウェハシートから剥がすための突上げピンを有するとともに、該突上げピンの上方から該突上げピンの先端にレーザ光を照射して該突上げピンの先端の高さを検出する高さ計測センサにより該突上げピン先端の高さを時間毎に計測して、該突上げピンの応答遅れ及び移動速度を検出する突上げピン速度計測装置を有するウェハ供給装置と、前記突上げピン駆動時の前記高さ計測センサの出力により、前記突上げピン速度計測装置が検出した前記突上げピンの応答遅れ及び移動速度を記憶する手段と、記憶した前記突上げピンの応答遅れ及び移動速度により、ウェハ部品を吸着するための吸着ヘッドと前記突上げピンの先端の動きを同期させる手段と、を備え、前記高さ計測センサが前記吸着ヘッドに配設されていることを特徴とする表面実装装置により、前記第２の課題を解決したものである。 Also, it has a push-up pin for pushing up the wafer component bonded on the wafer sheet from below and peeling it from the wafer sheet, and irradiating the tip of the push- up pin with laser light from above the push- up pin protruding and measured by raising the pin height measuring sensor for detect the height of the tip of the height of the protruding raised pin tip for each time, the push-up pins for detecting the response delay and the moving speed of the protruding raised pins A wafer supply device having a speed measuring device, and means for storing a response delay and a moving speed of the push-up pin detected by the push-up pin speed measuring device based on an output of the height measuring sensor when the push-up pin is driven And a means for synchronizing the movement of the tip of the push-up pin with a suction head for picking up the wafer component according to the stored response delay and movement speed of the push-up pin. There the surface mounting apparatus characterized by being arranged in the suction head, is obtained by solving the second problem.

本発明によれば、特別な計測器を用いることなく、ウェハ供給装置の突上げピン速度を正確に計測することができる。   According to the present invention, the push-up pin speed of the wafer supply apparatus can be accurately measured without using a special measuring instrument.

従って、表面実装装置の動作に反映することにより、安定したウェハ部品の供給が可能となる。   Therefore, it is possible to stably supply wafer components by reflecting the operation on the surface mounting apparatus.

以下図面を参照して、本発明の実施形態を詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

本実施形態は、図５（Ａ）（正面図）及び図５（Ｂ）（平面図）に示す如く、表面実装装置３０の吸着ヘッド３２の近傍に、図６に示す如く、ウェハ供給装置（図示省略）の上方から、突上げピン２４の変位を検出するための高さ計測センサ（ＨＭＳとも称する）４０を設けたものである。 In this embodiment, as shown in FIG. 5A (front view) and FIG. 5B (plan view), in the vicinity of the suction head 32 of the surface mounting device 30, as shown in FIG. A height measurement sensor (also referred to as HMS) 40 for detecting the displacement of the push-up pin 24 is provided from above (not shown).

図５において、３４は、上方から基板位置を認識するための基板位置認識用のカメラである。   In FIG. 5, reference numeral 34 denotes a substrate position recognition camera for recognizing the substrate position from above.

前記高さ計測センサ４０は、図６に詳細に示す如く、供給装置ヘッド２２の上方から突上げピン２４の頂部に向けてレーザ光４１を照射し、その反射から突上げピン２４の高さを検出する。   As shown in detail in FIG. 6, the height measuring sensor 40 irradiates a laser beam 41 from above the supply device head 22 toward the top of the push-up pin 24, and determines the height of the push-up pin 24 from the reflection. To detect.

以下、図７を参照して、本実施形態における突上げピン速度計測の手順を詳細に説明する。   Hereinafter, with reference to FIG. 7, a procedure for measuring the push-up pin speed in this embodiment will be described in detail.

まず、測定開始時に、ステップ１００で突上げピン２４を図６（Ａ）に示す下降状態にして、高さ計測センサ４０がピン２４の中心を測れるように、ステップ１０２で表面実装装置３０のＸＹ軸を調整する。   First, at the start of measurement, the push pin 24 is lowered as shown in FIG. 6A at step 100 so that the height measuring sensor 40 can measure the center of the pin 24 at step 102. Adjust the axis.

次いで、ステップ１０４で、高さ計測センサ４０の測定開始と共に、図８に示す如く、突上げピン２４に対して上昇命令（突上げコマンド）を発行する。   Next, at step 104, when the height measurement sensor 40 starts measurement, as shown in FIG.

そして、ステップ１０６、１０８、１１０、１１２で、突上げピン２４が上昇を完了（例えばエンコーダが目標座標に到達、又は動作開始からタイマーで待つなど）するまで、図８に示す如く、例えば１ミリ秒毎に突上げピン２４の高さを取得する。   Then, in steps 106, 108, 110, and 112, as shown in FIG. 8, for example, 1 mm until the push-up pin 24 completes raising (for example, the encoder reaches the target coordinate or waits with a timer from the start of operation). The height of the push-up pin 24 is acquired every second.

突上げピン上昇が完了した後、ステップ１１４で、取得したデータにより、応答遅れ（t1-t0）及び移動速度を求める。移動速度は、移動距離を時間で割る（ｍｍ/t）ことによって得られる。 After completing the raising of the push-up pin, in step 114, the response delay (t 1 -t 0 ) and the moving speed are obtained from the acquired data. The moving speed is obtained by dividing the moving distance by time (mm / t).

そして、得られたデータを同期させる吸着ヘッドにフィードバックして、図９に破線で示す如く、突上げピン２４の実際の動作に合わせて吸着ヘッド３２に対する動作指令を従来の突上げコマンドより（t1-t0）遅らせることにより、突上げピン２４と吸着ヘッド３２を部品厚み分の距離を保ちながら、部品がウェハシートより剥離するまで上昇して、吸着ヘッド及び突上げピンの動作を完全に同期させる。 Then, the obtained data is fed back to the suction head to be synchronized, and as shown by a broken line in FIG. 9, the operation command for the suction head 32 is set to (t by 1 -t 0) delaying, while the suction head 32 and the push-up pin 24 at a distance of the part thickness of, rises until the bracket is separated from the U E Ha sheet, the operation of the suction head and the push-up pins Synchronize completely.

本実施形態においては、高さ計測センサ４０としてレーザ光の反射を用いているので、突上げピン２４の変位を高精度で迅速に測定することができる。なお、突上げピン２４の変位を検出するセンサの構成はこれに限定されず、例えば突上げピン２４の先端位置に反射材を設けて、更に高精度の測定を可能としたり、あるいは、例えば突上げピン２４が３以上設けられている場合には、その上に反射板を載せて計測することも可能である。 In the present embodiment, since the reflection of the laser beam is used as the height measurement sensor 40, the displacement of the push-up pin 24 can be measured quickly with high accuracy. The configuration of the sensor that detects the displacement of the push-up pin 24 is not limited to this. For example, a reflective material is provided at the tip position of the push-up pin 24 to enable more accurate measurement, or, for example, When three or more raising pins 24 are provided, it is also possible to measure by placing a reflecting plate thereon .

本発明の適用対象であるウェハ供給装置の全体構成を示す平面図The top view which shows the whole structure of the wafer supply apparatus which is an application object of this invention 同じくウェハ供給装置のヘッドと突上げピンを示す正面図The front view which similarly shows the head and the push-up pin of the wafer supply device 同じく突上げピンによるウェハからの部品吸着状態を示す正面図The front view which shows the component adsorption state from the wafer similarly with the push-up pin 同じく吸着ヘッドと突上げピンの同期がとれていない場合の問題点を説明するための正面図Similarly, a front view for explaining the problem when the suction head and the push-up pin are not synchronized 本発明に係る表面実装装置の実施形態を示す（Ａ）正面図及び（Ｂ）吸着ヘッド周りの断面図(A) Front view and (B) Cross-sectional view around suction head showing an embodiment of a surface mount device according to the present invention 前記実施形態の高さ計測センサの動作を説明するための正面図Front view for explaining the operation of the height measurement sensor of the embodiment 同じく突上げピン速度計測の手順を示す流れ図A flow chart showing the procedure for measuring the speed of the pin 同じく取得した高さのデータの例を示す線図Diagram showing example of height data obtained 同じく該データに基づく吸着ヘッド側の指令の例を示す図The figure which similarly shows the example of the command by the side of the suction head based on this data

符号の説明Explanation of symbols

１０…ウェハシート
１２…ウェハ部品
２０…ウェハ供給装置
２２…供給装置ヘッド
２４…突上げピン
３０…表面実装装置
３２…吸着ヘッド
４０…高さ計測センサ（ＨＭＳ） DESCRIPTION OF SYMBOLS 10 ... Wafer sheet 12 ... Wafer component 20 ... Wafer supply apparatus 22 ... Supply apparatus head 24 ... Push-up pin 30 ... Surface mount apparatus 32 ... Adsorption head 40 ... Height measurement sensor (HMS)

Claims (2)

ウェハシート上に接着させたウェハ部品を下方から突上げてウェハシートから剥がすための突上げピンを有するウェハ供給装置の突上げピン速度計測装置であって、
前記突上げピンの上方から該突上げピンの先端にレーザ光を照射して、該突上げピンの先端の高さを検出する高さ計測センサを備え、
該高さ計測センサにより計測される時間毎の前記突上げピン先端の高さに基いて、該突上げピンの応答遅れ及び移動速度を検出することを特徴とするウェハ供給装置の突上げピン速度計測装置。 A push-up pin speed measuring device of a wafer supply device having a push-up pin for pushing up a wafer component bonded on a wafer sheet from below and peeling it from the wafer sheet,
The push-up is irradiated with a laser beam to the tip of the protruding raised pins from above up pins, comprising a height measurement sensor that gives test the height of the tip of the protruding raised pins,
The push-up pin speed of the wafer supply apparatus, wherein a response delay and a moving speed of the push-up pin are detected based on a height of the tip of the push-up pin for each time measured by the height measuring sensor. Measuring device. ウェハシート上に接着させたウェハ部品を下方から突上げてウェハシートから剥がすための突上げピンを有するとともに、該突上げピンの上方から該突上げピンの先端にレーザ光を照射して該突上げピンの先端の高さを検出する高さ計測センサにより該突上げピン先端の高さを時間毎に計測して、該突上げピンの応答遅れ及び移動速度を検出する突上げピン速度計測装置を有するウェハ供給装置と、
前記突上げピン駆動時の前記高さ計測センサの出力により、前記突上げピン速度計測装置が検出した前記突上げピンの応答遅れ及び移動速度を記憶する手段と、
記憶した前記突上げピンの応答遅れ及び移動速度により、ウェハ部品を吸着するための吸着ヘッドと前記突上げピンの先端の動きを同期させる手段と、
を備え、
前記高さ計測センサが前記吸着ヘッドに配設されていることを特徴とする表面実装装置。 It has a push-up pin for pushing up the wafer component bonded on the wafer sheet from below and peeling it from the wafer sheet, and irradiates the tip of the push-up pin from above with the laser light. by measuring the height of the protruding raised pin tip for each time by the height measuring sensor to detect the height of the tip of the raised pins, push-up pin speed measurement for detecting a response delay and the moving speed of the protruding raised pins A wafer supply apparatus having the apparatus;
Means for storing a response delay and a moving speed of the push-up pin detected by the push-up pin speed measuring device based on an output of the height measurement sensor at the time of driving the push-up pin;
Means for synchronizing the movement of the tip of the push-up pin with the suction head for sucking the wafer component by the stored response delay and moving speed of the push-up pin;
With
The surface mounting apparatus, wherein the height measuring sensor is disposed on the suction head.
JP2006015450A 2006-01-24 2006-01-24 Wafer supply device thrust pin speed measuring device and surface mount device Expired - Fee Related JP4860274B2 (en)

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