JP2015192029A - Electronic component packaging device and method of picking up electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component packaging device and a method of picking up an electronic component capable of resolving such a problem that it is difficult to suck an electronic component precisely.SOLUTION: An electronic component packaging device includes a pickup nozzle 4, detection means 11, and control means 21. The pickup nozzle 4 sucks an electronic component 102 from a component supply tape. In addition, the control means 21 calculates a difference between a distance of descent of the pickup nozzle 4 to when the pickup nozzle 4 is taken down from a reference position and the detection means 11 detects contact between the pickup nozzle 4 and the electronic component 102, and a distance of descent that is preliminarily set. The control means 21 corrects the distance of descent of the pickup nozzle 4 that is preliminarily set at the pickup of the electronic component 102, on the basis of the calculation result.

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component pickup method.

  During automatic operation of the electronic component mounting apparatus, splicing replenishment may be performed in which component supply tapes that house electronic components are connected to replenish electronic components. However, since there is a dimensional error for each component supply tape, the horizontal position and the vertical position of the electronic components between the component supply tapes before and after the connecting portion are slightly different. Therefore, when picking up an electronic component in the component supply tape with a nozzle that is picked up and placed on the substrate, the electronic component cannot be picked up correctly, or the nozzle is pushed too far into the electronic component, causing damage to the electronic component. There is a case where a problem occurs.

  Therefore, Patent Document 1 proposes a method of correcting the pickup position by recognizing the position of the electronic component in the horizontal direction with a recognition camera. In Patent Document 2, a length measuring sensor such as a laser displacement meter or a distance meter is arranged on the moving path of the component supply tape, and the distance from the vertical reference position to the electronic component of the component supply tape is measured. A mounting apparatus is disclosed in which an electronic component is sucked by lowering a nozzle from a reference position by a descent distance set based on a measurement result.

Japanese Patent No. 4450772 Japanese Patent Application Laid-Open No. 11-204992

  However, in the method of Patent Document 1, the vertical position of the electronic component is not considered. Further, when the size of the electronic component is small, it is difficult for the mounting apparatus using the length measurement sensor of Patent Document 2 to stably measure the accurate position of the electronic component in the vertical direction. Therefore, in Patent Documents 1 and 2, it is difficult to detect the accurate vertical position of the electronic component in the component supply tape, and the electronic component may not be accurately attracted by the nozzle.

  An object of the present invention is to provide an electronic component mounting apparatus and an electronic component pickup method that solve the problem that it is difficult to accurately attract the electronic component.

  The electronic component mounting apparatus of the present invention picks up an electronic component from a component supply unit arranged in a state where a plurality of component supply tapes containing the electronic component are connected, and arranges the electronic component on a substrate. The mounting apparatus includes a pickup nozzle, a moving unit, a detecting unit, and a control unit. The pickup nozzle extends in the vertical direction and has a nozzle portion that sucks an electronic component from the component supply tape and places the sucked electronic component on the substrate. The moving means moves the pickup nozzle. The detection means detects contact between the pickup nozzle and the electronic component. The control means controls the moving means. The control means lowers the pickup nozzle from the reference position, and calculates the difference between the distance by which the pickup nozzle is lowered until the detection means detects the contact between the pickup nozzle and the electronic component, and a preset drop distance. To do. Further, the control means corrects the preset drop distance of the pickup nozzle when picking up the electronic component based on the calculation result.

  The electronic component mounting method of the present invention includes a step of lowering the pickup nozzle from the reference position to bring the pickup nozzle into contact with the electronic component, and a distance by which the pickup nozzle has been lowered until the pickup nozzle comes into contact with the electronic component. Calculating a difference from a preset descent distance. The mounting method includes a step of correcting a preset drop distance of the pickup nozzle at the time of pickup of the electronic component based on the calculation result, and the pickup nozzle is lowered from the reference position by the corrected drop distance, and the electronic component And a step of performing the pickup.

  According to the present invention, an electronic component can be accurately adsorbed.

It is a top view which shows the outline of the electronic component mounting apparatus which concerns on this invention. It is sectional drawing which shows the outline of the pick-up nozzle in picking up an electronic component. It is a flowchart of a pick-up operation.

  Details of embodiments of the present invention will be described below with reference to the accompanying drawings. In addition, the same number is attached | subjected to the structure which has the same function in an accompanying drawing, and the description may be abbreviate | omitted.

  FIG. 1 is a top view schematically showing an electronic component mounting apparatus according to the present invention. FIG. 2 is a cross-sectional view schematically showing a pickup nozzle that picks up an electronic component. The electronic component mounting apparatus 1 (hereinafter referred to as “mounting apparatus”) of the present invention is an apparatus for mounting an electronic component supplied from a component supply unit 6 on a substrate 101. The mounting apparatus 1 includes a conveyor 2, a component supply unit 6, a pickup nozzle 4, a component recognition camera 5, a stage 7, a horizontal direction moving unit 3, a vertical direction moving unit 10, and a control unit 21. .

  The conveyor 2 conveys the substrate 101 on which electronic components are mounted. In the component supply unit 6, a component supply tape 103 that accommodates the electronic component 102 is set and supplies the electronic component 102. The pickup nozzle 4 picks up and holds the electronic component 102 of the component supply unit 6 and arranges it on the substrate 101. The component recognition camera 5 performs position recognition of the electronic component 102 in the component supply unit 6.

  The stage 7 fixes the substrate 101 supplied from the conveyor 2. The electronic component 102 is mounted on the substrate 101 in a state where the substrate 101 is fixed to the stage 7. The horizontal movement means 3 moves the pickup nozzle 4 between the component supply unit 6 and the substrate 101 on the stage 7 and positions the pickup nozzle 4 in the horizontal direction.

  The pickup nozzle 4 includes a nozzle portion 4a that includes a seat portion 4b and that extends in the vertical direction, and a spring 4d that supports the nozzle portion 4a so that the nozzle portion 4a is relatively movable and that urges the nozzle portion 4a vertically downward. Part 4c. One end of the spring 4d is fixed to the base portion 4c, and the other end is fixed to the seat portion 4d. Further, the pickup nozzle 4 is provided with a contact detection sensor 11 that detects that the nozzle portion 4a has come into contact with the electronic component 102 or the substrate 101.

  The contact detection sensor 11 of the present embodiment measures a change in contact pressure between the rear end portion positioned vertically above the nozzle portion 4a and the base portion 4c. Specifically, the base portion 4c is normally biased toward the rear end portion of the nozzle portion 4a by the spring 4d. A tip portion positioned vertically below the nozzle portion 4a contacts the electronic component 102 during pick-up, and contacts the substrate 101 via the sucked electronic component 102 during mounting. At this time, the nozzle portion 4a moves so as to compress the spring 4d, that is, the rear end of the nozzle portion 4a moves away from the base portion 4c. Then, the contact pressure between the rear end portion of the nozzle portion 4a and the base portion 4c is reduced, and the control means 21 makes contact between the pickup nozzle 4 and the electronic component 102 or contact with the substrate 101 via the adsorbed electronic component 102. Is detected.

  The vertical direction moving means 10 moves in the vertical direction and is attached to the horizontal direction moving means 3, and the base portion 4 c of the pickup nozzle 4 is attached. Therefore, the pickup nozzle 4 is movable in the horizontal direction and the vertical direction. The control means 21 includes a correction circuit 13.

  Next, the pickup operation of the electronic component 102 will be described. FIG. 3 shows a flowchart of the pickup operation. First, based on the position recognized by the component recognition camera 5, the pickup nozzle 4 is moved above the electronic component 102 that is initially picked up by the horizontal movement means 3 (S <b> 1). Thereafter, the pickup nozzle 4 is lowered from the reference position at a low speed, and a search operation is performed in which the contact detection sensor 11 detects a position where the pickup nozzle 4 contacts the electronic component 102 (S2).

  If there is a difference between the distance by which the pickup nozzle 4 is lowered until the contact between the pickup nozzle 4 and the electronic component 102 is detected by the contact detection sensor 11, and a preset lowering distance, the correction circuit 13 picks up the pickup nozzle 4. The descent distance of the nozzle 4 is corrected (S3). Thereafter, when picking up the electronic component 102 in the same component supply tape 103, the pickup nozzle 4 is lowered by the descent distance corrected earlier from the reference position, and the electronic component 102 is picked up (S4).

  When the connection part between the component supply tapes 103 is detected by the component recognition camera 5, the reference of the pickup nozzle 4 is applied to the electronic component 102 located at the head of the component supply tape 103 after the connection part by the same method as described above. Correct the descent distance from the position.

  By performing the above-described method, the component supply tape 103 is switched to become a new component supply tape 103, and even when the position of the electronic component in the vertical direction is different due to the dimensional error of the component supply tape 103 before and after the switch, The electronic component 102 can be picked up.

  As another method for detecting contact between the pickup nozzle 4 and the electronic component 102 or the substrate 101, a sensor is installed on the base portion 4c, and a sensor detection body is installed on the rear end of the nozzle portion 4a. There is a method of detecting by a sensor that the rear end of 4a is separated from the base portion 4c. As another method for detecting contact, there is a method for detecting contact by changing a driving current of a vertical direction moving means 10 described later at the time of contact.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Horizontal direction moving means 4 Pickup nozzle 5 Component recognition camera 10 Vertical direction moving means 11 Contact detection sensor 21 Control means 102 Electronic component 103 Component supply tape

Claims (7)

In an electronic component mounting apparatus that picks up the electronic component from a component supply unit arranged in a state where a plurality of component supply tapes containing electronic components are connected, and arranges the electronic component on a substrate.
A pickup nozzle that extends in the vertical direction, sucks an electronic component from the component supply tape, and has a nozzle portion that places the sucked electronic component on the substrate;
Moving means for moving the pickup nozzle;
Detecting means for detecting contact between the pickup nozzle and the electronic component;
The distance between which the pickup nozzle is lowered before the movement of the pickup nozzle is controlled from the reference position and the detection means detects the contact between the pickup nozzle and the electronic component is controlled in advance. A control means for calculating a difference from the descent distance and correcting a descent distance of the pickup nozzle set in advance at the time of picking up the electronic component based on the calculation result;
An electronic component mounting apparatus. It has a recognition camera that moves with the pickup nozzle and recognizes the position of the connecting part between the component supply tapes and the electronic component,
The electronic components in the component supply tape are picked up by the pickup nozzle in order along the component supply tape,
The correction of the preset descent distance of the pickup nozzle with respect to the electronic component is performed on the electronic component picked up first in the component supply tape located next to the connecting portion. The electronic component mounting apparatus described in 1. The pickup nozzle has a base portion that indirectly supports the nozzle portion,
The base portion is movable in a vertical direction relative to the nozzle portion;
The nozzle part is provided with a seat part vertically below the base part, and the seat part and the base part are fixed by a biasing means,
By the biasing means, the nozzle portion is biased vertically downward with respect to the base portion,
The electronic component mounting apparatus according to claim 1, wherein the detection unit detects a change in contact pressure between a portion of the nozzle portion that is vertically above the base portion and the base portion.   The electronic component mounting apparatus according to claim 1, wherein the detection unit detects a change in a driving current that drives the moving unit when the pickup nozzle is moved vertically downward. The pickup nozzle has a base portion that indirectly supports the nozzle portion,
The base portion is movable in a vertical direction relative to the nozzle portion;
The nozzle part is provided with a seat part vertically below the base part, and the seat part and the base part are fixed by a biasing means,
By the biasing means, the nozzle portion is biased vertically downward with respect to the base portion,
The electronic component mounting apparatus according to claim 1, wherein the detection unit detects a relative movement between the nozzle portion and the base portion.   The control means slows down the descent speed of the vertical movement means when lowering the vertical movement means to correct the descent distance compared to picking up the electronic component. Item 6. The electronic component mounting apparatus according to any one of Items 1 to 5. Lowering the pickup nozzle from the reference position, bringing the pickup nozzle and the electronic component into contact with each other,
Calculating a difference between a distance by which the pickup nozzle is lowered before the pickup nozzle and the electronic component are in contact with each other, and a preset lowering distance;
Based on the calculation result, when the electronic component is picked up, a preset descent distance of the pickup nozzle is corrected,
The electronic component pick-up method of picking up the electronic component by lowering the descent distance corrected from the reference position by the pickup nozzle.

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