JP6655355B2 - Mounting device and component return method - Google Patents

Description

  The present invention relates to a mounting apparatus for mounting a component on a board and a component returning method by the mounting apparatus.

  2. Description of the Related Art There is known a device in which a carrier tape in which a large number of components are packaged is fed out by a component supply device (tape feeder) and components are supplied to a mounting device. As this type of mounting apparatus, there is known an apparatus that returns a component taken out from a carrier tape to the carrier tape again (for example, see Patent Document 1). The mounting apparatus described in Patent Literature 1 takes out a component from a pocket (accommodation hole) of a carrier tape by sucking the component with a suction nozzle, judges the quality of the component, and then sucks the suction nozzle in the pocket of the carrier tape. The part is returned by canceling.

JP 2007-088428 A

  In the above mounting apparatus, the component surface is separated from the nozzle tip by raising the suction nozzle in a state where the suction by the suction nozzle is released in the pocket of the carrier tape. However, even when the suction nozzle is raised in a state where the residual pressure (negative pressure) inside the suction nozzle is completely zero, the parts are lifted as the suction nozzle is raised and the carrier tape is lifted. In some cases, parts jumped out of the pocket. In particular, small parts having a small mass tend to jump out of the pocket of the carrier tape as the suction nozzle rises.

  The present invention has been made in view of the above, and an object of the present invention is to provide a mounting apparatus and a component return method capable of appropriately returning components to a carrier tape.

The mounting device of the present invention is a mounting device in which an accommodation hole for accommodating a component is formed in a carrier tape fed from a component supply device, and the component taken out from the accommodation hole can be returned to the accommodation hole again. A suction nozzle capable of sucking and blowing down the component, an elevating mechanism for moving the suction nozzle apart or approaching the accommodation hole, and controlling a pick-up operation and a return operation of the component by the suction nozzle and the elevating mechanism. A control unit, wherein the control unit causes the suction nozzle to suck the component in the storage hole during the component removal operation, and at least the bottom surface of the component enters the storage hole during the component return operation. The component is blown down toward the accommodation hole by the suction nozzle at a height separated from the bottom of the accommodation hole by a predetermined amount.

The component returning method by the mounting device of the present invention is a mounting device capable of returning a component taken out from the receiving hole to the receiving hole, wherein a receiving hole for receiving a component is formed in a carrier tape fed from a component supplying device. Wherein the suction nozzle sucks the component in the receiving hole and takes out the component from the receiving hole, and at least the bottom surface of the component enters the receiving hole and the hole of the receiving hole is provided. Returning the component to the accommodation hole by blowing down the component toward the accommodation hole with the suction nozzle at a height separated from the bottom by a predetermined amount.

According to these configurations, the suction nozzle is positioned at a height where a certain gap is formed between the bottom of the receiving hole of the carrier tape and the bottom of the component, the suction state by the suction nozzle is released, and the component is returned to the receiving hole. are doing. For this reason, after returning the component, the tip of the suction nozzle and the component are sufficiently separated from each other. Absent. Further, since the suction state of the suction nozzle is released in the accommodation hole, the component can be returned while guiding the component to the side surface in the accommodation hole. Therefore, the components can be properly returned to the receiving holes of the carrier tape. In addition, since at least the bottom surface of the component enters the housing hole, the component can be blown down from the suction nozzle into the housing hole while guiding the component to the side surface in the housing hole.

In the above mounting apparatus, a component recognition unit that recognizes the component sucked by the suction nozzle is provided, and the control unit causes the suction nozzle to suck the component in the suction hole in the accommodation hole when the component is taken out. The component recognition unit recognizes the component, and at the time of returning the component after the recognition , at least the bottom surface of the component enters the accommodation hole and is separated from the bottom of the accommodation hole by a predetermined amount, and the suction nozzle The component is blown down toward the receiving hole. According to this configuration, it is possible to confirm whether or not there is a mounting error in the component supply device, whether there is an abnormality in the component, or the like, according to the recognition result of the component. Also, the recognized component can be returned to the original accommodation hole of the carrier tape.

  In the above mounting apparatus, the control unit causes the suction nozzle to blow down the component at a height at which a lower half portion of the component has entered the housing hole during a return operation of the component. According to this configuration, the component blown down from the suction nozzle can be reliably returned to the accommodation hole.

  According to the present invention, after the component is returned, the tip of the nozzle and the component are sufficiently separated from each other, so that the component is not lifted by the rise of the suction nozzle, and the component jumps out of the receiving hole of the carrier tape. Nothing. Therefore, components can be appropriately returned to the carrier tape.

FIG. 3 is a schematic top view of the mounting apparatus of the present embodiment. It is explanatory drawing of the return operation | movement of the component of a comparative example. FIG. 2 is a schematic side view of a mounting head and a carrier tape according to the embodiment. It is a figure showing an example of operation of taking out and returning parts of this embodiment.

  Hereinafter, a mounting apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic top view of the mounting apparatus of the present embodiment. FIG. 2 is an explanatory diagram of the return operation of the components of the comparative example. Note that the mounting device of the present embodiment is merely an example, and can be appropriately changed. Further, in FIG. 2, for convenience of description, the same names are denoted by the same reference numerals and described.

  As shown in FIG. 1, the mounting apparatus 1 is configured to mount a component P (see FIG. 2) supplied from a component supply apparatus 10 such as a tape feeder on a mounting surface of a substrate W by a mounting head 40. ing. At a substantially center of the base 20 of the mounting apparatus 1, a board transfer unit 21 is provided along the X-axis direction. The board transport unit 21 carries in and positions the board W before component mounting below the mounting head 40 from one end side in the X-axis direction, and unloads the board W after component mounting from the other end side in the X-axis direction. On the base 20, a number of component supply devices 10 are arranged side by side in the X-axis direction on both sides of the substrate transfer unit 21.

  A tape reel 11 is detachably mounted on the component supply device 10, and a carrier tape 12 (see FIG. 2) in which a number of components P are packaged is wound around the tape reel 11. Each of the component supply devices 10 sequentially feeds out components P toward a transfer position where the components are picked up by the mounting head 40 by rotation of a sprocket wheel (not shown) provided in the device. At the transfer position of the mounting head 40, the cover tape on the surface is peeled off from the carrier tape 12, and the components P in the pockets 13 (see FIG. 2) of the carrier tape 12 are exposed to the outside. The component P is exemplified by a microchip such as a ceramic capacitor, but may be a component other than an electronic component as long as it can be mounted on the substrate W.

  An XY moving unit 30 that moves the mounting head 40 in the X-axis direction and the Y-axis direction is provided on the base 20. The XY moving unit 30 has a pair of Y-axis tables 31 extending parallel to the Y-axis direction and an X-axis table 32 extending parallel to the X-axis direction. The pair of Y-axis tables 31 are supported by supporting portions (not shown) erected at four corners of the base 20, and the X-axis table 32 can be moved on the pair of Y-axis tables 31 in the Y-axis direction. It is installed in. A mounting head 40 is mounted on the X-axis table 32 so as to be movable in the X-axis direction. The mounting head 40 is reciprocated between the component supply device 10 and the substrate W by the XY moving unit 30.

  The mounting head 40 has a plurality (three in this embodiment) of head portions 42 provided with suction nozzles 41. The head unit 42 raises and lowers the suction nozzle 41 in the Z-axis direction by a lifting mechanism 43 (see FIG. 3), and rotates the suction nozzle 41 about the Z axis by a rotation mechanism (not shown). The suction nozzle 41 can be switched between a negative pressure and a positive pressure. When the component P is sucked, the suction nozzle 41 is switched to the negative pressure, and when the component P is released, the suction nozzle 41 is switched to the positive pressure. The mounting head 40 receives the component P from the carrier tape 12 by setting the suction nozzle 41 to a negative pressure, and releases the component P by setting the suction nozzle 41 to a positive pressure at the moment when the component P is pushed into the substrate W.

  The mounting head 40 is provided with a height sensor 45 for measuring the height of the suction nozzle 41, and a component recognition unit 46 (see FIG. 3) for recognizing the component P sucked by the suction nozzle 41. The height sensor 45 measures, for example, the distance of the component P from the suction nozzle 41 and adjusts the amount of elevation of the suction nozzle 41 in the Z-axis direction based on the measurement result. The component recognizing unit 46 recognizes the shape of the component P, the suction position and the suction direction of the suction nozzle 41 with respect to the component P, specifies the type of the component P based on the recognition result, and corrects when mounting the component on the board W. Adjust the amount. By moving the component P up and down after the component is sucked, the component recognition unit 46 can recognize the height (thickness) of the component P in the Z direction. The details of the height sensor 45 and the component recognition unit 46 will be described later.

  Further, the mounting head 40 includes a board imaging unit 48 for imaging a BOC (Board Offset Correction) mark on the substrate W from directly above, and a component imaging unit 49 for imaging the mounting operation of the component P by the suction nozzle 41 from obliquely above. Are provided. The board imaging unit 48 recognizes the position, deformation, and the like of the board W based on the captured image of the BOC mark, and corrects the mounting position of the component P on the board W based on the recognition result. In the component imaging unit 49, in addition to imaging the components P before and after being sucked into the component supply device 10, the components P before and after mounting on the substrate W are imaged, and these images are stored as traceability information.

  In addition, the mounting device 1 is provided with a control unit 47 (see FIG. 3) that performs overall control of each unit of the device. The control unit 47 includes a processor, a memory, and the like that execute various processes. The memory is constituted by one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. The memory stores a production program used in actual production, a program for confirming a mounting error of the component supply device 10 described later, and the like. The production program differs for each type of the substrate W, and includes data on the mounting position of the component on the substrate W, the type of the component, the type of the component supply device 10, and the like.

  By the way, the mounting apparatus 1 handles various types of components P, and the component supply device 10 that supplies these various types of components P may be erroneously set to the mounting apparatus 1. For this reason, the mounting apparatus 1 is provided with a function of confirming whether the component supply apparatus 10 is correctly set to the mounting apparatus 1 before actual production. The mounting apparatus 1 recognizes the type of the component P supplied from the component supplying apparatus 10 by the component recognizing unit 46 (see FIG. 3), and the component supplying apparatus 10 mounts the component P depending on whether the component P is used in the production program. It is checked whether the device 1 is set incorrectly. When the mounting mistake of the component supply device 10 is confirmed, the operator is prompted to replace the component supply device 10.

  In the operation of recognizing the component P, the component P is taken out from the pocket 13 of the carrier tape 12 of the component supply device 10 by the suction nozzle 41, and the component P is recognized by the component recognizing unit 46. The component P has been returned to the pocket 13. Note that the component recognition unit 46 rotates the component P and recognizes the component from the dimension of the component P in the X direction or the Y direction. As shown in FIG. 2A, when the normal component P is returned, the suction nozzle 41 places the component P in the pocket 13, switches the suction nozzle 41 to positive pressure, and separates the suction nozzle 41 from the component P from the tip of the suction nozzle 41. ing. However, as shown in FIG. 2B, even when the inside of the suction nozzle 41 is at atmospheric pressure, the component P is lifted as the suction nozzle 41 rises, and the component P is moved outward from the pocket 13 of the carrier tape 12. It may jump out.

  This is because when the general-purpose metal suction nozzle 41 is used, the nickel component (magnetic component) included in the electrode of the component P is attracted by the fact that the suction nozzle 41 is slightly magnetized. Conceivable. In particular, due to the recent miniaturization of components, the attractive force of magnetism becomes larger than the mass of the components P, and there is a high possibility that the small components P will fail to be returned. Further, even when the general-purpose metal suction nozzle 41 is not used, depending on the tip of the suction nozzle 41 and the surface condition of the component P, the component P does not move away from the tip of the suction nozzle 41 and the carrier tape 12 does not move. There is a possibility that the component P may be lifted from the pocket 13 and fail to be returned.

  The operation of returning the component P is performed not only in the operation of checking the component supply device 10 before the actual production, but also in the case where a suction abnormality occurs in the suction nozzle 41 during the actual production. In this case, the component P is taken out of the pocket 13 of the carrier tape 12 by the suction nozzle 41, the dimensions of the component P are confirmed by the component recognition unit 46, and then the component P is returned to the original pocket 13 of the carrier tape 12. . Even in such a case, the component P may be lifted from the pocket 13 due to the rise of the suction nozzle 41 when returning the component P, and the component P may jump out of the pocket 13.

  Therefore, in the present embodiment, the suction nozzle 41 is positioned at a height where a certain gap is formed between the bottom surface of the component P and the hole bottom of the pocket 13, and the component P is blown from the suction nozzle 41 into the pocket 13 of the carrier tape 12. Drop it and return it. After the component P is blown down into the pocket 13, the tip of the suction nozzle 41 and the component P are sufficiently separated from each other, so that the component P is not lifted by the suction nozzle 41 rising. Even with the general-purpose metal suction nozzle 41, the component P is not attracted because the magnetic field acting on the component P is small. Therefore, the component P can be appropriately returned to the pocket 13 of the carrier tape 12.

  Hereinafter, an operation of taking out and returning a component will be described. FIG. 3 is a schematic side view of the mounting head and the carrier tape of the present embodiment. FIG. 4 is a diagram illustrating an example of a component removal operation and a component return operation according to the present embodiment. In FIG. 4, it is assumed that the height of the upper surface of the component is measured in advance by the height sensor. Here, the operation of picking up and returning components at the time of checking the component supply device before actual production will be described, but the same applies to the operations of taking out and returning components at the time of checking the suction state of the suction nozzles during actual production. .

  First, the configuration around the suction nozzle 41 will be briefly described with reference to FIG. As shown in FIG. 3, the component P is accommodated in a pocket 13 formed in the carrier tape 12, and the component P is fed toward a delivery position with respect to the suction nozzle 41. Above the pocket 13, a suction nozzle 41 that can suck and blow down the component P is positioned. The suction nozzle 41 is switched to a negative pressure to take out the component P when the component P is taken out, and is switched to a positive pressure to blow down the component P when returning the component P. A lifting mechanism 43 is connected to the suction nozzle 41, and the lifting nozzle 43 separates or approaches the pocket 13 from the pocket 13.

  The mounting head 40 is provided with a component recognition unit 46 that recognizes the component P sucked by the suction nozzle 41. The component recognition unit 46 causes the light emitting elements 51 and the light receiving elements 52 arranged in a line to face each other in the horizontal direction, and the laser light from each light emitting element 51 is blocked by the component P, and the light receiving state of each light receiving element 52 changes. , The type of the component P is recognized. Based on the recognition result of the component recognition unit 46, that is, whether or not the component P is correct, it is confirmed whether the component supply device 10 (see FIG. 1) is correctly set in the mounting device 1. The component recognizing unit 46 may have any configuration as long as the component P can be recognized. For example, the component recognizing unit 46 may be configured by an imaging device that recognizes the component P based on a captured image.

  The mounting head 40 is provided with a height sensor 45 for measuring the height of the upper surface of the component P in the pocket 13 of the carrier tape 12. The height sensor 45 is, for example, a reflection-type optical sensor. Is measured. The height position of the suction nozzle 41 is adjusted by the elevating mechanism 43 based on the upper surface height of the component P measured by the height sensor 45. Note that the upper surface height of the component P may not be measured by the height sensor 45 but may be included in the production program in advance as prescribed data.

  The suction nozzle 41, the elevating mechanism 43, the component recognition unit 46, and the height sensor 45 are controlled by the control unit 47. The control unit 47 controls the operation of taking out and returning the component P by the suction nozzle 41 and the elevating mechanism 43, and also controls the recognition operation by the component recognition unit 46 and the measurement operation by the height sensor 45. The control unit 47 causes the suction nozzle 41 to suck the component P in the pocket 13 of the carrier tape 12 at the time of the component P removal operation, and causes the component recognition unit 46 to recognize the component P. Then, at the time of the returning operation after the recognition of the component P, the suction nozzle 41 blows the component P down at the height where the lower half of the component P has entered the pocket 13 of the carrier tape 12.

  Hereinafter, with reference to FIG. 4, the operation of taking out and returning the component P will be described. As shown in FIG. 4A, the component P is taken out of the pocket 13 of the carrier tape 12 by the suction nozzle 41. In this case, the tip of the suction nozzle 41 is brought closer to the component P in the pocket 13 by the elevating mechanism 43 (see FIG. 3), and the tip of the suction nozzle 41 is brought into contact with the component P by slightly pushing the upper surface thereof. When the tip of the suction nozzle 41 contacts the upper surface of the component P, the inside of the nozzle becomes negative pressure, and the component P is sucked by the suction nozzle 41. The suction nozzle 41 is raised to a height recognizable by the component recognition unit 46 in a state where the component P is suctioned.

  Next, as shown in FIG. 4B, the component P sucked by the suction nozzle 41 is positioned between the light emitting element 51 and the light receiving element 52 of the component recognition unit 46, and the type of the component P is specified. In this case, the laser light emitted from the light emitting element 51 is blocked by the component P, and the light receiving state of the light receiving element 52 changes, whereby the external shape of the component P is recognized. By recognizing the outer shape of the component P, the type of the component P is specified, and depending on whether or not the component P is used in the production program, whether the component supply device 10 is erroneously set to the mounting device 1 or the like. Is confirmed. After confirming the component P, the suction nozzle 41 is lowered toward the original pocket 13 of the carrier tape 12. When recognizing the outer shape of the component P, the component P sucked by the suction nozzle 41 is moved up and down. By this vertical movement, the component recognition unit 46 can recognize the height (thickness) of the component P in the Z direction. When recognizing the thickness of the component P, it is preferable to position the suction nozzle 41 in a state where the component is not suctioned in advance in the component recognition unit 46 and confirm the lower end position of the suction nozzle.

  Next, as shown in FIG. 4C, the component P is returned to the original pocket 13 of the carrier tape 12 by the suction nozzle 41. In this case, the suction nozzle 41 is moved closer to the pocket 13 by the elevating mechanism 43, and the lower half of the component P is stopped at a height at which it enters the pocket 13 of the carrier tape 12. This height position is based on the assumption that the upper surface height of the component P detected by the height sensor 45 substantially matches the upper surface height of the carrier tape 12 and the height (thickness) of the component P determined above. , The position where the lower half of the part P enters the pocket 13 of the carrier tape 12 is calculated. More precisely, the height sensor 45 may measure the upper surface of the carrier tape 12.

  Next, as shown in FIG. 4D, when the lowering of the suction nozzle 41 is stopped, the pressure inside the nozzle becomes positive and the component P is blown off from the suction nozzle 41. Since the lower half of the component P enters the pocket 13 of the carrier tape 12, the component P is blown down into the pocket 13 while being guided by the side surface of the pocket 13.

  When the component P is separated from the suction nozzle 41 by blowing, the component P temporarily flaps under the influence of the air flow in the pocket 13 of the carrier tape 12, but the component P falls without jumping out of the pocket 13. A certain gap is provided between the upper surface of the component P that has fallen to the bottom of the hole of the pocket 13 and the tip of the suction nozzle 41. Therefore, the component P is not lifted as the suction nozzle 41 is raised. In particular, even when a metal made of a magnet with residual magnetization is used as the suction nozzle 41, the magnetic field generated by the suction nozzle 41 becomes weak around the component P, and the component P may be attracted to the suction nozzle 41. Absent. In this manner, since the component P is appropriately returned into the pocket 13 of the carrier tape 12 by the suction nozzle 41 and the component P does not fail to be returned, erroneous mounting of the component P on the substrate W is reliably prevented. be able to.

  As described above, according to the mounting apparatus 1 of the present embodiment, the suction nozzle 41 is positioned at a height where a fixed gap is formed between the bottom of the hole of the pocket 13 of the carrier tape 12 and the bottom of the component P. The component P is blown down from the pocket 41 to the pocket 13 and returned. Therefore, after returning the component P, the tip of the suction nozzle 41 and the upper surface of the component P are sufficiently separated from each other. P does not jump out. Therefore, the component P can be appropriately returned to the pocket 13 of the carrier tape 12.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited thereto, and can be appropriately changed without departing from the effects of the present invention. In addition, the present invention can be appropriately modified and implemented without departing from the scope of the object of the present invention.

  For example, in the present embodiment, the configuration has been described in which the suction nozzle 41 blows the component P down at the height at which the lower half of the component P has entered the pocket 13 of the carrier tape 12 during the returning operation of the component P. However, the present invention is not limited to this configuration. The component P may be blown down by the suction nozzle 41 at a height at which at least the bottom surface of the component P enters the pocket 13 during the returning operation of the component P. The height at which the bottom surface of the component P has entered the pocket 13 is calculated from the measurement of the height sensor 45 and the component recognition unit 46 as described above. Therefore, at a position where the bottom surface of the component P reaches the entrance of the pocket 13, the component P may be blown down by the suction nozzle 41, or at a position immediately before the bottom surface of the component P contacts the hole bottom of the pocket 13, The component P may be blown down to the suction nozzle 41.

  Further, in the present embodiment, the carrier tape 12 may have a pocket 13 in which the component P is accommodated, and may be formed of a resin tape or a paper tape.

  Further, in the present embodiment, a method of returning a small component P (for example, 1.6 mm in width and 0.8 mm in length or less) has been described. It can also be used to return large parts P.

  In the present embodiment, the height sensor 45 measures the upper surface height of the component P, and the lifting mechanism 43 is moved up and down based on the upper surface height. However, the present invention is not limited to this structure. The elevation amount by the elevation mechanism 43 may be adjusted using data such as the height of the component P preset in the memory of the mounting apparatus 1.

  In the present embodiment, the operation of returning the component P when confirming whether the component supply device 10 is correctly set to the mounting device 1 or when confirming the suction abnormality of the suction nozzle 41 has been described. However, the present invention is not limited to this configuration.

  Further, in the present embodiment, the configuration in which the suction nozzle 41 blows and returns the component P by blowing has been described. However, by setting the negative pressure inside the nozzle of the suction nozzle 41 to zero during the deceleration of the descending operation, The component P may be configured to drop from the suction nozzle 41 by its own weight and a downward inertial force. That is, by releasing the suction state of the component P by the suction nozzle 41 at the height where the bottom surface of the component P is separated from the bottom of the hole of the pocket 13 by a predetermined amount in the pocket 13 of the carrier tape 12 during the returning operation of the component P. You may return P.

  As described above, the present invention has an effect that components can be appropriately returned to a carrier tape, and is particularly useful for a mounting apparatus for mounting components on a substrate and a component returning method by the mounting apparatus. is there.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 10 Component supply apparatus 12 Carrier tape 13 Pocket (accommodation hole)
41 suction nozzle 43 elevating mechanism 45 height sensor 46 component recognition unit 47 control unit P component

Claims (4)

An accommodating hole for accommodating the component is formed in the carrier tape fed from the component supply device, and the mounting device capable of returning the component taken out from the accommodating hole to the accommodating hole again,
A suction nozzle capable of sucking and blowing down the component,
An elevating mechanism for separating or approaching the suction nozzle with respect to the accommodation hole,
A control unit for controlling the operation of taking out and returning the component by the suction nozzle and the elevating mechanism,
The control unit causes the suction nozzle to suck the component in the storage hole during the component removal operation, and at least the bottom surface of the component enters the storage hole during the component return operation, and the bottom of the storage hole is formed. A mounting device, wherein the component is blown down toward the accommodation hole by the suction nozzle at a height that is separated from the mounting hole by a predetermined amount. A component recognition unit that recognizes the component sucked by the suction nozzle;
The control unit causes the suction nozzle to suck the component in the accommodation hole and causes the component recognition unit to recognize the component during the component removal operation, and at least returns the component during the component return operation after recognition. 2. The component according to claim 1, wherein the component is blown down toward the accommodation hole by the suction nozzle at a height at which a bottom surface enters the accommodation hole and is separated from the bottom of the accommodation hole by a predetermined amount. 3. Mounting device. The said control part makes the said suction nozzle blow down the said component at the height which the lower half part of the said component entered into the accommodation hole at the time of the return operation of the said component, The said component or Claim 2 characterized by the above-mentioned. A mounting device according to item 1. An accommodating hole for accommodating a component is formed in a carrier tape fed from a component supply device, and a component returning method by a mounting device capable of returning the component taken out from the accommodating hole to the accommodating hole again,
A step in which a suction nozzle sucks the component in the accommodation hole and removes the component from the accommodation hole;
At least the bottom surface of the component enters the accommodation hole and is separated by a predetermined amount from the bottom of the accommodation hole, and the suction nozzle blows the component down toward the accommodation hole, so that the accommodation hole is Returning the component.

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