JP2017092130A - Packaging apparatus and component return method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately return a component to a carrier tape.SOLUTION: The present invention relates to a packaging apparatus in which a pocket (13) for accommodating a component (P) therein is formed on a carrier tape (12) that is fed out of a component supply device and which is capable of returning the component that is taken out of the pocket into the pocket again. The packaging apparatus comprises: a suction nozzle (41) by which a component can be sucked and blown off; a lift mechanism (43) that makes the suction nozzle separate from or close to the pocket; and a control part (47) which controls a take-out action and a return action of a component by the suction nozzle and the lift mechanism. In the take-out action of a component, the control part causes the suction nozzle to suck the component within the pocket and in the return action of a component, the control part causes the suction nozzle to blow off the component at such a height that at least a bottom face of the component enters the pocket.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a mounting apparatus for mounting a component on a substrate and a component return method using the mounting apparatus.

  A device that feeds a component to a mounting device by feeding a carrier tape in which a large number of components are packaged by a component feeder (tape feeder) is known. As this type of mounting apparatus, there is known a device that returns a component taken out from a carrier tape to the carrier tape again (see, for example, Patent Document 1). The mounting apparatus described in Patent Document 1 picks up a component from a pocket (accommodating hole) of a carrier tape by sucking the component with a suction nozzle, and determines whether the component is good or not, and then sucks the suction nozzle in the pocket of the carrier tape. The parts are returned by canceling.

JP 2007-088428 A

  In the mounting apparatus described above, the surface of the component is separated from the tip of the nozzle by raising the suction nozzle while the suction by the suction nozzle is released in the pocket of the carrier tape. However, even if the suction nozzle is raised with the residual pressure (negative pressure) inside the nozzle of the suction nozzle being completely zero, the parts are lifted as the suction nozzle rises, and the carrier tape In some cases, parts jumped out of the pocket. In particular, small parts having a small mass are likely to jump out of the pocket of the carrier tape as the suction nozzle rises.

  This invention is made | formed in view of this point, and it aims at providing the mounting apparatus and component return method which can return components appropriately with respect to a carrier tape.

  The mounting device of the present invention is a mounting device in which a housing hole for housing a component is formed in a carrier tape fed out from a component supply device, and the component taken out from the housing hole can be returned to the housing hole again. A suction nozzle capable of sucking and blowing off the component, a lifting mechanism for separating or approaching the suction nozzle with respect to the receiving hole, and an operation for taking out and returning the component by the suction nozzle and the lifting mechanism are controlled. A control unit, wherein the control unit adsorbs the component to the suction nozzle in the accommodation hole during the component take-out operation, and the bottom surface of the component is in the accommodation hole during the return operation of the component. The suction state of the component by the suction nozzle is released at a height separated from the hole bottom by a predetermined amount.

  In the component returning method by the mounting apparatus of the present invention, a mounting hole in which a part is accommodated is formed in the carrier tape fed out from the component supply apparatus, and the component taken out from the accommodating hole can be returned to the accommodating hole again. The component return method according to claim 1, wherein the suction nozzle sucks the component in the accommodation hole and takes out the component from the accommodation hole, and the bottom surface of the component is located from the bottom of the accommodation hole in the accommodation hole. And a step of releasing the suction state of the component by the suction nozzle and returning the component to the receiving hole at a fixed distance.

  According to these configurations, the suction nozzle is positioned at such a height that a certain gap is formed between the bottom of the receiving hole of the carrier tape and the bottom of the part, the suction state by the suction nozzle is released, and the part is returned to the receiving hole. doing. For this reason, since the tip of the suction nozzle and the part are sufficiently separated after the part is returned, the part will not be lifted by the rise of the suction nozzle and the part may jump out of the accommodation hole of the carrier tape. Absent. Further, since the suction state of the suction nozzle is released in the housing hole, the component can be returned while guiding the component to the side surface in the housing hole. Therefore, components can be appropriately returned to the accommodation holes of the carrier tape.

  The mounting apparatus includes a component recognition unit for recognizing the component sucked by the suction nozzle, and the control unit sucks the component to the suction nozzle in the housing hole during the component take-out operation. The component recognition unit recognizes the component, and when the component is returned, the bottom surface of the component is spaced apart from the bottom of the housing hole by a predetermined amount in the housing hole. Release the suction state. According to this configuration, according to the recognition result of the component, it is possible to confirm whether or not there is an installation error of the component supply device or an abnormality of the component. Moreover, the recognized part can be returned to the original accommodation hole of the carrier tape.

  In the mounting apparatus, the control unit causes the suction nozzle to blow down the component at a height at which at least a bottom surface of the component enters the accommodation hole during the return operation of the component. According to this configuration, the parts are blown down and returned from the suction nozzle to the receiving hole of the carrier tape. Since at least the bottom surface of the component enters the accommodation hole, the component can be blown down from the suction nozzle into the accommodation hole while guiding the component to the side surface inside the accommodation hole.

  In the mounting apparatus, the control unit causes the suction nozzle to blow down the component at a height at which the lower half of the component enters the accommodation hole during the return operation of the component. According to this configuration, the parts blown off from the suction nozzle can be reliably returned into the accommodation hole.

  The mounting apparatus includes a height sensor that measures an upper surface height of a component in the accommodation hole, and adjusts a height position of the component when the component is returned based on the upper surface height. According to this configuration, the height position at which the suction nozzle blows off the components can be adjusted with high accuracy.

  In the mounting apparatus, the suction nozzle is made of metal, and the component has an electrode containing a magnetic component. According to this configuration, even if the metal suction nozzle is slightly magnetized to such an extent that it cannot be completely demagnetized, the tip of the nozzle and the component are sufficiently separated after blowing the component into the receiving hole. The parts are not attracted to the suction nozzle and lifted. Therefore, even if a magnetic component is contained in the electrode of the component, the component can be properly returned to the accommodation hole of the carrier tape.

  According to the present invention, since the tip of the nozzle and the part are sufficiently separated after the part is returned, the part is not lifted by the suction nozzle rising, and the part jumps out of the accommodation hole of the carrier tape. There is nothing. Therefore, it is possible to appropriately return the parts to the carrier tape.

It is an upper surface schematic diagram of the mounting apparatus of this Embodiment. It is explanatory drawing of the return operation | movement of the components of a comparative example. It is a side surface schematic diagram of the mounting head and carrier tape of this Embodiment. It is a figure which shows an example of the pick_out | removing operation | movement of the components of this Embodiment, and return operation | movement.

  Hereinafter, the mounting apparatus of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a schematic top view of the mounting apparatus of the present embodiment. FIG. 2 is an explanatory diagram of a part return operation of the comparative example. In addition, the mounting apparatus of this Embodiment is only an example, and can be changed suitably. In FIG. 2, for convenience of explanation, the same name is given the same reference numeral.

  As shown in FIG. 1, the mounting apparatus 1 is configured to mount a component P (see FIG. 2) supplied from a component supply apparatus 10 such as a tape feeder on a mounting surface of a substrate W by a mounting head 40. ing. A substrate transport unit 21 is disposed substantially along the X-axis direction at the center of the base 20 of the mounting apparatus 1. The board transport unit 21 loads and positions the substrate W before component mounting from one end side in the X-axis direction below the mounting head 40, and unloads the substrate W after component mounting from the other end side in the X-axis direction. In addition, on the base 20, a large number of component supply devices 10 are arranged side by side in the X-axis direction on both sides of the board conveyance unit 21.

  A tape reel 11 is detachably mounted on the component supply apparatus 10, and a carrier tape 12 (see FIG. 2) in which a large number of components P are packaged is wound around the tape reel 11. Each component supply device 10 feeds components P in order toward a delivery position picked up by the mounting head 40 by rotation of a sprocket wheel (not shown) provided in the device. At the delivery position of the mounting head 40, the cover tape on the surface is peeled from the carrier tape 12, and the component P in the pocket 13 (see FIG. 2) of the carrier tape 12 is exposed to the outside. The component P is exemplified by a microchip such as a ceramic capacitor, but may be a component other than an electronic component as long as it can be mounted on the substrate W.

  On the base 20, an XY moving unit 30 that moves the mounting head 40 in the X-axis direction and the Y-axis direction is provided. The XY moving unit 30 includes a pair of Y-axis tables 31 extending in parallel with the Y-axis direction and an X-axis table 32 extending in parallel with the X-axis direction. The pair of Y-axis tables 31 are supported by support portions (not shown) erected at the four corners of the base 20, and the X-axis table 32 is movable on the pair of Y-axis tables 31 in the Y-axis direction. Is installed. On the X-axis table 32, a mounting head 40 is installed so as to be movable in the X-axis direction. The mounting head 40 is reciprocated between the component supply apparatus 10 and the substrate W by the XY moving unit 30.

  The mounting head 40 has a plurality (three in the present embodiment) of head portions 42 including suction nozzles 41. The head unit 42 moves the suction nozzle 41 up and down in the Z-axis direction by a lifting mechanism 43 (see FIG. 3), and rotates the suction nozzle 41 around the Z axis by a rotation mechanism (not shown). The suction nozzle 41 can be switched between a negative pressure and a positive pressure, and is switched to a negative pressure when the component P is sucked, and is switched to a positive pressure when the suction of the component P is released. The mounting head 40 receives the component P from the carrier tape 12 by setting the suction nozzle 41 to a negative pressure, and releases the component P by setting the suction nozzle 41 to a positive pressure at the moment when the component P is pushed into the substrate W.

  The mounting head 40 is provided with a height sensor 45 that measures the height of the suction nozzle 41 and a component recognition unit 46 (see FIG. 3) that recognizes the component P sucked by the suction nozzle 41. The height sensor 45 measures, for example, the distance from the suction nozzle 41 to the component P, and adjusts the lift amount of the suction nozzle 41 in the Z-axis direction based on the measurement result. The component recognition unit 46 recognizes the shape of the component P, the suction position and suction direction of the suction nozzle 41 with respect to the component P, specifies the type of the component P based on the recognition result, and also corrects when mounting the component on the substrate W The amount is adjusted. Further, by moving the component P up and down after the component is picked up, the component recognition unit 46 can recognize the height (thickness) of the component P in the Z direction. Details of the height sensor 45 and the component recognition unit 46 will be described later.

  The mounting head 40 includes a board imaging unit 48 that images a BOC (Board Offset Correction) mark on the substrate W from directly above, and a component imaging unit 49 that images the mounting operation of the component P by the suction nozzle 41 from above. And are provided. The board imaging unit 48 recognizes the position, deformation, and the like of the substrate W based on the captured image of the BOC mark, and corrects the mounting position of the component P on the board W based on the recognition result. In the component imaging unit 49, the component P before and after being picked up by the component supply apparatus 10 is picked up, and the component P before and after being mounted on the substrate W is picked up, and these images are stored as traceability information.

  In addition, the mounting apparatus 1 is provided with a control unit 47 (see FIG. 3) that performs overall control of each part of the apparatus. The control unit 47 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. The memory stores a production program used in actual production, a program for confirming a mounting error of a component supply device 10 to be described later, and the like. The production program differs depending on the type of the substrate W, and includes data related to the mounting position of the component on the substrate W, the type of the component, the type of the component supply device 10, and the like.

  By the way, the mounting apparatus 1 handles various types of components P, and the component supply device 10 that supplies these various types of components P may be set to the mounting device 1 by mistake. For this reason, the mounting apparatus 1 is equipped with a function for confirming whether the component supply apparatus 10 is correctly set with respect to the mounting apparatus 1 before actual production. The mounting device 1 recognizes the type of the component P supplied from the component supply device 10 by the component recognition unit 46 (see FIG. 3), and the component supply device 10 mounts depending on whether or not the component P is used in the production program. It is confirmed whether or not the device 1 is set by mistake. When an attachment error of the component supply device 10 is confirmed, the operator is prompted to replace the component supply device 10.

  In the recognition operation of the component P, after the component P is taken out from the pocket 13 of the carrier tape 12 of the component supply device 10 by the suction nozzle 41 and recognized by the component recognition unit 46, the original of the carrier tape 12 is recovered. The part P is returned to the pocket 13. The component recognition unit 46 rotates the component P and recognizes the component from the dimension of the component P in the X direction or the Y direction. As shown in FIG. 2A, when returning the normal component P, the suction nozzle 41 places the component P in the pocket 13 and switches the suction nozzle 41 to a positive pressure so that the suction nozzle 41 is separated from the component P from the tip of the suction nozzle 41. ing. However, as shown in FIG. 2B, even when the inside of the suction nozzle 41 is at atmospheric pressure, the part P is lifted as the suction nozzle 41 rises, and the part P is outside the pocket 13 of the carrier tape 12. It may jump out.

  This is because when a general-purpose metal suction nozzle 41 is used, the nickel component (magnetic component) contained in the electrode of the component P is attracted by the suction nozzle 41 being slightly magnetized. Conceivable. In particular, due to the recent miniaturization of parts, the magnetic attraction force becomes larger than the mass of the parts P, and there is a high possibility that the return of the small parts P will fail. Even when the general-purpose metal suction nozzle 41 is not used, depending on the tip of the suction nozzle 41 and the surface state of the component P, the component P does not move away from the tip of the suction nozzle 41 and the carrier tape 12 There is a possibility that the part P is lifted from the pocket 13 and the return fails.

  Note that the above-described operation of returning the component P is performed not only in the confirmation operation of the component supply apparatus 10 before actual production, but also when an adsorption abnormality of the adsorption nozzle 41 during actual production occurs. In this case, the part P is taken out from the pocket 13 of the carrier tape 12 by the suction nozzle 41 and the dimension of the part P is confirmed by the part recognition unit 46, and then the part P is returned to the original pocket 13 of the carrier tape 12. . Even in such a case, the component P may be lifted from the pocket 13 as the suction nozzle 41 is raised when the component P is returned, and the component P may jump out of the pocket 13.

  Therefore, in the present embodiment, the suction nozzle 41 is positioned at a height where a certain gap is formed between the bottom surface of the component P and the hole bottom of the pocket 13, and the component P is blown from the suction nozzle 41 into the pocket 13 of the carrier tape 12. I drop it and return it. After the component P is blown down into the pocket 13, the tip of the suction nozzle 41 and the component P are sufficiently separated from each other, so that the component P is not lifted by being lifted by the suction nozzle 41. Even in the case of a general metal suction nozzle 41, the magnetic field acting on the component P is small, so that the component P is not attracted. Therefore, the component P can be appropriately returned to the pocket 13 of the carrier tape 12.

  In the following, the component take-out operation and the return operation will be described. FIG. 3 is a schematic side view of the mounting head and carrier tape of the present embodiment. FIG. 4 is a diagram illustrating an example of a component take-out operation and a return operation according to the present embodiment. In FIG. 4, it is assumed that the upper surface height of the component is measured in advance by the height sensor. Here, the part extraction operation and the return operation at the time of confirmation of the component supply apparatus before actual production will be described, but the part extraction operation and the return operation at the time of confirmation of the suction state of the suction nozzle during actual production are the same. .

  First, the peripheral configuration of the suction nozzle 41 will be briefly described with reference to FIG. As shown in FIG. 3, the component P is accommodated in the pocket 13 formed in the carrier tape 12, and the component P is fed out toward the delivery position with respect to the suction nozzle 41. Above the pocket 13, a suction nozzle 41 capable of sucking and blowing off the component P is positioned. The suction nozzle 41 is switched to a negative pressure when the component P is taken out to suck the component P, and is switched to a positive pressure when the component P is returned to blow off the component P. A lifting mechanism 43 is connected to the suction nozzle 41, and the suction nozzle 41 is separated or approached from the pocket 13 by the lifting mechanism 43.

  The mounting head 40 is provided with a component recognition unit 46 that recognizes the component P sucked by the suction nozzle 41. The component recognition unit 46 causes the light emitting elements 51 and the light receiving elements 52 arranged in a line to face each other in the horizontal direction, and the light receiving state of each light receiving element 52 is changed by the laser beam from each light emitting element 51 being blocked by the component P. Thus, the type of the part P is recognized. Based on the recognition result of the component recognition unit 46, that is, whether or not the component P is correct, it is confirmed whether the component supply device 10 (see FIG. 1) is correctly set with respect to the mounting device 1. The component recognition unit 46 may be configured to recognize the component P, and may be configured of an imaging device that recognizes the component P from a captured image, for example.

  Further, the mounting head 40 is provided with a height sensor 45 that measures the upper surface height of the component P in the pocket 13 of the carrier tape 12. The height sensor 45 is, for example, a reflection type optical sensor, and the upper surface height of the component P is determined from the time from when the laser beam is emitted from the light emitting element until the laser beam reflected by the upper surface of the component P is received by the light receiving element. Is measuring. Based on the height of the upper surface of the component P measured by the height sensor 45, the height position of the suction nozzle 41 is adjusted by the lifting mechanism 43. The upper surface height of the component P may be included in the production program in advance as prescribed data without being measured by the height sensor 45.

  The suction nozzle 41, the lifting mechanism 43, the component recognition unit 46, and the height sensor 45 are controlled by the control unit 47. The control unit 47 controls the operation of taking out and returning the component P by the suction nozzle 41 and the lifting mechanism 43, and also controls the recognition operation by the component recognition unit 46 and the measurement operation by the height sensor 45. The controller 47 causes the suction nozzle 41 to suck the component P in the pocket 13 of the carrier tape 12 during the component P take-out operation, and causes the component recognition unit 46 to recognize the component P. The component P is blown down to the suction nozzle 41 at a height at which the lower half of the component P enters the pocket 13 of the carrier tape 12 during the return operation after the recognition of the component P.

  Hereinafter, with reference to FIG. 4, the operation of taking out and returning the component P will be described. As shown in FIG. 4A, the component P is taken out from the pocket 13 of the carrier tape 12 by the suction nozzle 41. In this case, the tip of the suction nozzle 41 is brought close to the component P in the pocket 13 by the lifting mechanism 43 (see FIG. 3), and the tip of the suction nozzle 41 is brought into contact with the top surface of the component P slightly. When the tip of the suction nozzle 41 comes into contact with the upper surface of the component P, the inside of the nozzle becomes negative pressure and the component P is sucked by the suction nozzle 41. The suction nozzle 41 is raised to a height that can be recognized by the component recognition unit 46 in a state where the component P is sucked.

  Next, as shown in FIG. 4B, the component P sucked by the suction nozzle 41 is positioned between the light emitting element 51 and the light receiving element 52 of the component recognition unit 46, and the type of the component P is specified. In this case, the laser beam emitted from the light emitting element 51 is blocked by the component P, and the outer shape of the component P is recognized by changing the light receiving state of the light receiving element 52. By recognizing the external shape of the component P, the type of the component P is specified, and whether or not the component supply device 10 is erroneously set with respect to the mounting device 1 depending on whether or not the component P is used in the production program. Is confirmed. After confirming the component P, the suction nozzle 41 is lowered toward the original pocket 13 of the carrier tape 12. When recognizing the external shape of the component P, the component P sucked by the suction nozzle 41 is moved up and down. By this vertical movement, the component recognition unit 46 can recognize the height (thickness) of the component P in the Z direction. When recognizing the thickness of the component P, the suction nozzle 41 in a state in which the component is not sucked in advance is positioned on the component recognition unit 46 and the lower end position of the suction nozzle is confirmed.

  Next, as shown in FIG. 4C, the component P is returned to the original pocket 13 of the carrier tape 12 by the suction nozzle 41. In this case, the suction nozzle 41 is brought close to the pocket 13 by the elevating mechanism 43, and the lower half of the component P is stopped at a height at which it enters the pocket 13 of the carrier tape 12. This height position assumes that the height of the upper surface of the component P detected by the height sensor 45 is substantially equal to the height of the upper surface of the carrier tape 12, and from the height (thickness) of the component P determined above. The position where the lower half of the part P enters the pocket 13 of the carrier tape 12 is calculated. More precisely, the height sensor 45 may measure the upper surface of the carrier tape 12.

  Next, as shown in FIG. 4D, when the lowering of the suction nozzle 41 is stopped, the inside of the nozzle becomes a positive pressure and the component P is blown off from the suction nozzle 41. Since the lower half portion of the component P is in the pocket 13 of the carrier tape 12, the component P is blown down into the pocket 13 while being guided by the side surface of the pocket 13.

  When the component P is separated from the suction nozzle 41 by blowing, the component P temporarily flutters due to the influence of the air flow in the pocket 13 of the carrier tape 12, but the component P falls without jumping out of the pocket 13. A certain gap is formed between the upper surface of the component P that has fallen to the hole bottom of the pocket 13 and the tip of the suction nozzle 41. Therefore, the component P is not lifted by the raising of the suction nozzle 41. In particular, even when the suction nozzle 41 is made of a metal that remains magnetized, the magnetic field generated by the suction nozzle 41 becomes weak around the part P, and the part P is attracted to the suction nozzle 41. Absent. In this way, since the component P is appropriately returned into the pocket 13 of the carrier tape 12 by the suction nozzle 41 and the return of the component P does not fail, the erroneous mounting of the component P on the substrate W is reliably prevented. be able to.

  As described above, according to the mounting apparatus 1 of the present embodiment, the suction nozzle 41 is positioned at such a height that a certain gap is formed between the hole bottom of the pocket 13 of the carrier tape 12 and the bottom surface of the component P. The part P is blown down from 41 to the pocket 13 and returned. For this reason, since the tip of the suction nozzle 41 and the upper surface of the part P are sufficiently separated after the part P is returned, the part P is not lifted as the suction nozzle 41 rises, and the part 13 is removed from the pocket 13. P never jumps out. Therefore, the component P can be appropriately returned to the pocket 13 of the carrier tape 12.

  In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, in the present embodiment, the configuration has been described in which the lower half of the component P is blown into the suction nozzle 41 at the height at which the lower half of the component P enters the pocket 13 of the carrier tape 12 when the component P is returned. The configuration is not limited to this. What is necessary is just to blow the component P down to the suction nozzle 41 at a height at which at least the bottom surface of the component P enters the pocket 13 during the return operation of the component P. The height at which the bottom surface of the component P enters the pocket 13 is calculated from the measurements of the height sensor 45 and the component recognition unit 46 as described above. Therefore, the component P may be blown down to the suction nozzle 41 at the position where the bottom surface of the component P reaches the entrance of the pocket 13, or the position immediately before the bottom surface of the component P contacts the hole bottom of the pocket 13, The component P may be blown off to the suction nozzle 41.

  Moreover, in this Embodiment, the carrier tape 12 should just be formed with the pocket 13 in which the components P were accommodated, may be comprised with the resin tape, and may be comprised with the paper tape.

  Moreover, in this Embodiment, although the return method of small components P (for example, 1.6 mm in width, 0.8 mm or less in length) was demonstrated, if this return method is a component which can be adsorbed with the adsorption nozzle 41, It can also be used to return large parts P.

  In the present embodiment, the height sensor 45 is used to measure the height of the upper surface of the component P, and the lifting mechanism 43 is raised and lowered based on the height of the upper surface. However, the present invention is not limited to this configuration. The amount of lifting by the lifting mechanism 43 may be adjusted using data such as the height of the component P preset in the memory of the mounting apparatus 1.

  In the present embodiment, the return operation of the component P when the component supply device 10 is confirmed to be correctly set with respect to the mounting device 1 or when the suction abnormality of the suction nozzle 41 is confirmed has been described. The configuration is not limited to this.

  Further, in the present embodiment, the configuration in which the suction nozzle 41 blows and returns the component P by blowing is described, but by reducing the negative pressure inside the suction nozzle 41 during deceleration of the descending operation, The component P may be dropped from the suction nozzle 41 by its own weight and a downward inertia force. That is, the component P is released from the suction state by the suction nozzle 41 at a height in which the bottom surface of the component P is separated from the hole bottom of the pocket 13 in the pocket 13 of the carrier tape 12 when the component P is returned. P may be returned.

  As described above, the present invention has an effect that it is possible to appropriately return a component to a carrier tape, and is particularly useful for a mounting apparatus for mounting a component on a substrate and a component return method using the mounting apparatus. is there.

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 10 Component supply apparatus 12 Carrier tape 13 Pocket (accommodating hole)
41 Suction nozzle 43 Elevating mechanism 45 Height sensor 46 Component recognition unit 47 Control unit P component

Claims (7)

A mounting hole in which a component is accommodated in the carrier tape fed out from the component supply device is formed, and the component taken out from the accommodation hole can be returned to the accommodation hole again.
A suction nozzle capable of sucking and blowing off the components;
An elevating mechanism for separating or approaching the suction nozzle with respect to the accommodation hole;
A control unit for controlling the operation of taking out and returning the component by the suction nozzle and the lifting mechanism;
The controller causes the suction nozzle to suck the component in the housing hole during the component take-out operation, and the bottom surface of the component is separated from the bottom of the housing hole by a predetermined amount in the housing hole during the component return operation. The mounting apparatus releases the suction state of the component by the suction nozzle at a height that has been achieved. A component recognition unit for recognizing the component sucked by the suction nozzle;
The control unit causes the suction nozzle to suck the component in the housing hole during the component take-out operation, causes the component recognition unit to recognize the component, and in the housing hole during the return operation of the component after recognition. 2. The mounting apparatus according to claim 1, wherein the suction state of the component by the suction nozzle is released at a height at which the bottom surface of the component is separated from the bottom of the accommodation hole by a predetermined amount.   3. The control unit according to claim 1, wherein the control unit causes the suction nozzle to blow down the component at a height at which at least a bottom surface of the component enters the receiving hole during the return operation of the component. The mounting apparatus described.   4. The mounting according to claim 3, wherein the control unit causes the suction nozzle to blow down the component at a height at which a lower half of the component enters the accommodation hole during a return operation of the component. apparatus. A height sensor for measuring the height of the upper surface of the component in the accommodation hole;
5. The mounting apparatus according to claim 1, wherein the height position of the component is adjusted during the return operation of the component with reference to the height of the upper surface.   The mounting apparatus according to claim 1, wherein the suction nozzle is made of metal, and the component includes an electrode including a magnetic component. A component return method by a mounting device in which a housing hole for housing a component is formed in a carrier tape fed from a component supply device, and the component taken out from the housing hole can be returned to the housing hole again,
A suction nozzle sucking the component in the housing hole and taking out the component from the housing hole;
Releasing the suction state of the component by the suction nozzle and returning the component to the storage hole at a height in which the bottom surface of the component is spaced from the bottom of the storage hole by a predetermined amount in the storage hole; A method for returning parts, comprising:

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