JP4979989B2 - Chip mounting apparatus and mounting method - Google Patents

Description

  The present invention relates to a chip mounting apparatus and mounting method for mounting a chip produced by dividing a semiconductor wafer on a substrate.

  When a chip as an electronic component is formed from a semiconductor wafer, the following procedure is performed. First, a large number of circuit patterns are formed on the surface of a semiconductor wafer by photographic technology. Next, the semiconductor wafer is attached to an adhesive wafer sheet, and each circuit pattern is cut into a die shape. There are half-cuts that cut the depth of the cutting line to about half the thickness of the semiconductor wafer and full-cuts that reach the depth of the wafer sheet. Recently, full cuts are often used. .

  When the semiconductor wafer is cut into a large number of chips by full cutting, the wafer sheet is stretched and stretched on the wafer holder. As a result, the interval between adjacent chips is enlarged, so that when a chip is picked up, the picked-up chip can be reliably picked up without interfering with the adjacent chip and causing chipping.

The chip thus formed is mounted on the substrate by a mounting device. In that case, the wafer holder is supplied to the wafer table. When the chip to be mounted on the substrate is positioned at the pickup position by the wafer table, the chip is picked up and mounted on the substrate by the mounting tool.
When a large number of circuit patterns are formed on a semiconductor wafer, it is inevitable that differences in quality such as response performance occur in each circuit pattern. Therefore, if a circuit pattern is formed on the semiconductor wafer, the performance of each circuit pattern is inspected to set its information, for example, a grade. The setting of the grade is stored as a data map on a recording medium such as a magnetic disk. FIG. 7 shows the results of performance inspection of the circuit pattern P formed on the semiconductor wafer W, and is classified into three classes A to C.

  When a chip is mounted on a substrate, the grade of the chip to be mounted is determined according to the use of the substrate. For example, when chip grades are set to three levels A to C and grade A chips are required to be mounted first, grade A chips are sequentially placed at the pickup position based on a pre-created data map. Position and pick up and mount the chip.

  After picking up the grade A chip, the wafer holder holding the semiconductor wafer is stored. When the mounting of a grade B or C chip is required, the wafer holder is set on the wafer table again, and the grade B or C chip is picked up.

  By the way, when the wafer sheet is stretched and held on the wafer holder, the elongation of the wafer sheet may not be uniform over the entire semiconductor wafer. Usually, the peripheral part of the wafer holder tends to be larger than the central part. Therefore, if the wafer table is simply driven in the X and Y directions based on the chip grade data map, the chip to be picked up is reliably positioned at the pick-up position due to the non-uniform elongation of the wafer sheet. In such a case, a chip of a different grade may be picked up and mounted on the substrate.

  Therefore, conventionally, when driving the wafer table from the predetermined reference position in the X and Y directions, the chips that enter the field of view are sequentially imaged by the imaging camera, and the movement amount of the wafer table in the X and Y directions is imaged. The amount of positional deviation of the alignment mark provided on the chip with respect to the X and Y coordinates is obtained, and the chip to be picked up at the pickup position while correcting the amount of movement of the wafer table in the X and Y directions according to the amount of deviation. I try to position it.

Patent Document 1 discloses an alignment apparatus in which a semiconductor wafer is cut into dice to form a large number of chips, crystal orientation lines of the semiconductor wafer are formed by grooves by dicing, and the orientation is recognized. However, it is not shown that the chip is divided into a plurality of grades according to the performance of the circuit pattern and the chips are picked up for each grade.
JP 2002-198415 A

  Incidentally, in the case of the semiconductor wafer W shown in FIG. 7, the number of grade A and B chips is large. For this reason, when chips of grades A and B are sequentially picked up based on the data map, the next chip is located next to or relatively close to the first picked up chip.

  Accordingly, the wafer table is driven based on the data map, and the X and Y coordinates of the alignment mark provided on the chip and the amount of movement of the wafer table each time the imaging camera images the chip during the driving process. Compare Then, if the amount of displacement of the chip due to the elongation of the wafer sheet is obtained and the amount of movement of the wafer table is corrected based on the amount of displacement, the chip to be picked up can be reliably positioned at the pickup position.

However, since the number of grade C chips is very small compared to other grade chips, the interval between multiple grade C chips often becomes very large.
Therefore, when picking up a grade C chip after picking up grade A and grade B chips, the first grade C chip is positioned at the pick-up position and picked up, and then the next grade C chip is picked up. When positioning at the pickup position, it is impossible to move the wafer table in the X and Y directions while correcting the movement amount in the X and Y directions with the alignment marks of other chips.

  In other words, not only can the amount of misalignment of the chip due to the elongation of the wafer sheet be corrected using the alignment marks of other chips, but also until the next grade C chip to be picked up is accurately positioned at the pick-up position. Therefore, the amount of misalignment due to the elongation of the wafer sheet also increases.

  For this reason, the chip to be picked up may be greatly displaced from the pick-up position, and the chip cannot be picked up.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a chip mounting apparatus and a mounting method capable of reliably positioning a chip at a pickup position even when the number of chips remaining on a wafer table is small.

The present invention is a mounting apparatus for cutting a semiconductor wafer attached to a wafer sheet and dividing it into a large number of chips, picking up the chips based on previously detected information and mounting them on a substrate,
A wafer holder on which the wafer sheet is stretched;
A wafer table that is driven horizontally and on which the wafer holder is placed;
Imaging means for imaging the wafer sheet of the wafer holder placed on the wafer table;
Image processing means for recognizing the outer shape of the chip regardless of the presence or absence of the chip on the wafer sheet, based on the imaging signal from the imaging means;
Control means for correcting the horizontal driving amount of the wafer table based on the outer shape recognition of the chip by the image processing means and positioning a chip of predetermined information to be picked up at the pickup position;
A chip mounting apparatus comprising: mounting means for picking up a chip positioned at the pickup position and mounting the chip on the substrate.

The semiconductor wafer is cut by a cutting line having a depth reaching the wafer sheet,
The outer shape recognition of the chip by the image processing means is performed by the chip when there is a chip in the visual field range of the imaging means, and when there is no chip in the visual field range, the cutting formed on the wafer sheet when the semiconductor wafer is cut This is preferably done by a line.

The control means stores a data map of pre-detected chip information of the semiconductor wafer, and the semiconductor wafer is provided with an identification unit corresponding to the data map,
A reading unit for recognizing the identification unit of the semiconductor wafer is provided above the wafer table,
Preferably, the control means corrects an amount of deviation between a driving position based on the data map and an actual position obtained by recognition of the outer shape of the chip by the image processing means, and positions the chip at the pickup position.

This invention is a mounting method of cutting a semiconductor wafer attached to a wafer sheet and dividing it into a large number of chips, and picking up the chips based on information detected in advance and mounting them on a substrate,
Placing the wafer holder on which the wafer sheet is stretched on a wafer table driven in a horizontal direction;
Imaging the wafer sheet placed on the wafer table;
Recognizing the outer shape of the chip regardless of the presence or absence of the chip on the wafer sheet by this imaging;
Correcting a horizontal driving amount of the wafer table based on the outer shape recognition of the chip and positioning a chip of predetermined information to be picked up at a pickup position;
And a step of picking up the chip positioned at the pick-up position and mounting the chip on the substrate.

  According to the present invention, since the outer shape of the chip is recognized regardless of the presence or absence of the chip on the wafer sheet, even when the other chip cannot be imaged until the chip to be picked up is positioned at the pickup position. The driving position of the wafer table can be corrected based on the recognition of the outer shape of the chip.

  Therefore, even if the number of chips remaining on the wafer sheet is small, it is possible to reliably position the chip to be picked up at the pickup position.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 7 show an embodiment of the present invention. The flip-chip mounting apparatus shown in FIG. 1 includes a wafer stage 1 as a component supply unit. The wafer stage 1 has an X table 3, a Y table 4 and a θ table 5 sequentially provided on a base 2, and a wafer holder 8 on which a semiconductor wafer W is held as described later is provided on the θ table 5. ing. That is, the wafer holder 8 is provided so as to be driven in the horizontal direction. The semiconductor wafer W is cut and divided into a large number of rectangular chips 6 as electronic components.

  A procedure for cutting the semiconductor wafer W to form the chip 6 will be described with reference to FIGS. First, as shown to Fig.4 (a), the non-device surface in which the circuit pattern of the semiconductor wafer W is not formed is stuck on the adhesion surface 9a of the wafer sheet 9 made of a synthetic resin.

  Next, as shown in FIG. 4B, the semiconductor wafer W to which the wafer sheet 9 is adhered is cut into a dice for each circuit pattern by a dicing blade (not shown). The cutting depth at that time is a depth at which the dicing blade reaches the wafer sheet 9, that is, a full cut, as shown in an enlarged view in FIG. Thereby, a cutting line S corresponding to the outer shape of the chip 6 is formed on the wafer sheet 9.

  As shown in FIG. 5, when a circuit pattern is formed on the semiconductor wafer W, the performance of each circuit pattern is inspected by an inspection apparatus (not shown). Then, it is classified into a plurality of grades classified by access speed, for example, grades A to C, which are information based on the inspection result, and the information is recorded as a data map M on a storage medium such as a magnetic disk and will be described later. Stored in the control device 39. Thereafter, the semiconductor wafer W is cut for each circuit pattern to form the chip 6.

  Information based on the performance inspection of each circuit pattern includes classification based on non-defective products and defective products in addition to the grade based on the access speed, and the information is not limited to the grade based on the access speed.

  When a circuit pattern is printed on the chip 6, at the same time, an alignment mark m such as a cross is formed at a position deviated from the circuit pattern, as shown in FIG. The X and Y coordinates can be recognized as will be described later.

  On the wafer sheet 9 to which the semiconductor wafer W is adhered, as shown in FIG. 4D, an identification unit 10 such as a barcode for identifying the semiconductor wafer W corresponding to the data map M stored in the control device 39. Is provided. The data map M of a predetermined semiconductor wafer W can be called by the identification unit 10 from the control device 39 as described later.

  When the semiconductor wafer W is cut into a large number of chips 6 in this way, the wafer sheet 9 is stretched and stretched on the ring-shaped wafer holder 8 as shown in FIG. As a result, the distance between the chips 6 is increased, and therefore, when the chips 6 are picked up as will be described later, it is possible to prevent chipping caused by interference between the picked-up chips 6 and the chips 6 located around the chips 6. .

  The chip 6 is taken out by the pickup tool 11 shown in FIG. The pickup tool 11 is L-shaped and can be driven to rotate within a range of 180 degrees between the position indicated by the chain line and the position indicated by the solid line in FIG. Is provided with a suction nozzle 13 for vacuum suction. Further, the pickup tool 11 can be driven in the X, Y direction (horizontal direction) and Z direction (vertical direction) by a driving means (not shown).

  The base 2 is provided with a support 15 at a position facing the wafer stage 1. On the upper surface of the support 15, a first base 16 having one end fixed to the support 15 and the other end protruding in the direction of the wafer stage 1 is provided horizontally. A stage table 17 is provided on the upper surface of the other end of the first base 16.

  The stage table 17 is provided with a Y table 18, an X table 19 provided on the Y table 18 and driven in the X direction to be in contact with and away from the wafer stage 1, and the X and Y provided on the X table 19. The mounting stage 20 is driven in the direction. The mounting stage 20 can be driven in a Z direction orthogonal to a plane formed by the X and Y directions by a driving source (not shown). The mounting stage 20 is provided with a heater (not shown), and a rectangular convex portion 20a is provided on the upper surface.

  A conveyance guide 21 is provided above the mounting stage 20. As will be described later, a substrate 22 having a thickness of 100 μm or less, for example, 40 to 50 μm, is mounted on the transport guide 21 in a predetermined direction. It is like that.

  The substrate 22 is formed of a thin material having a thickness of 100 μm or less, that is, a material that is elastically deformable, such as polyimide. When the substrate 22 is cut to a predetermined length, the pitch is fed.

  A second base 25 is provided horizontally at one end of the first base 16 with a first spacer fixed via a first spacer 24. The second base 25 is shorter in length than the first base 16, and the other end protrudes toward the wafer stage 1.

  A camera table 26 is provided on the upper surface of the other end of the second base 25. The camera table 26 has a Y table 27. On the Y table 27, an X table 28 driven in the X direction is provided. On the X table 28, an attachment member 29 driven in the X and Y directions is provided.

  The attachment member 29 is provided with a camera unit 31. The camera unit 31 has a case 31a formed in a hollow box shape as shown in FIG. 2, and a first camera that images the substrate 22 transported along the transport guide 21 in the case 31a. 32 and a second camera 33 that images the semiconductor chip 6 transferred from the pickup tool 11 to a mounting tool 50 described later. Each of the cameras 32 and 33 is composed of a CCD (solid state imaging device).

  Imaging windows 36 are respectively formed on the lower surface and the upper surface of the tip of the camera unit 31. A mirror 38 having two reflecting surfaces 37 inclined at an angle of 45 degrees with respect to the imaging window 36 is accommodated in the distal end portion of the camera unit 31. Light incident from the lower imaging window 36 and reflected by one reflecting surface 37 enters the first camera 32. Light incident from the upper imaging window 36 and reflected by the other reflecting surface 37 enters the second camera 33.

  As shown in FIG. 3, the imaging signals from the cameras 32 and 33 are input to an image processing unit 40 as image processing means connected to the control device 39, where they are processed and converted into digital signals. It has become. The control device 39 is provided on the support 15 as shown in FIG.

  As shown in FIG. 1, a third spacer 41 is provided on the upper surface of one end of the second base 25. The third spacer 41 is provided with a fourth base 42 horizontally with one end fixed. A head table 43 is provided on the upper surface of the other end of the fourth base 42. The head table 43 has a Y table 44. An X table 45 driven in the X direction is provided on the upper surface of the Y table 44. An attachment body 46 that is driven in the X and Y directions is provided on the upper surface of the X table 45.

  A Z table 47 is provided on the front end surface of the mounting body 46, and a mounting head 48 is mounted on the Z table 47 as mounting means that is driven in the Z direction perpendicular to the plane formed by the X direction and the Y direction. Is provided. A θ table 49 is provided at the tip of the mounting head 48, and the mounting tool 50 including the ultrasonic horn 52 having the suction portion 51 is provided on the θ table 49.

  In this embodiment, the pickup tool 11 and the mounting tool constitute mounting means for picking up the chip 6 from the wafer holder 8 and mounting it on the substrate W.

  When the pick-up tool 11 picks up the chip 6 from the wafer holder 8, the pick-up tool 11 rotates about 180 degrees in the clockwise direction indicated by the arrow in FIG. Turn upward. That is, the chip 6 is inverted so that the upper and lower surfaces are reversed.

  In this state, the head table 43 operates to position the mounting head 48 above the suction nozzle 13 of the pickup tool 11. Next, when the pickup tool 11 is raised, the suction portion 51 of the ultrasonic horn 52 provided in the mounting head 48 receives the chip 6 sucked and held by the suction nozzle 13.

  The wafer holder 8 is housed in a stocker (not shown) so that when the chip 6 is picked up, the wafer holder 8 is supplied and held on a wafer table 61 provided at the upper end of a support 60 having a lower end attached to the θ table 5. It has become.

  On the lower surface side of the wafer sheet 9 stretched on the wafer holder 8, a backup body 65 fixed to a fixing portion (not shown) is disposed in a state not interlocking with the horizontal movement of the wafer holder 8. A suction hole 64 penetrating in the axial direction is formed in the central portion of the backup body 65. A suction pump 66 is connected to the suction hole 64.

  The wafer holder 8 is positioned at a height at which the lower surface of the wafer sheet 9 comes into contact with the upper surface of the backup body 65 where the suction hole 64 is opened. Further, above the wafer holder 8, a bar code for identifying the third camera 67 as an imaging means for imaging the chip 6 attached to the upper surface of the wafer sheet 9 and the identification unit 10 provided on the semiconductor wafer W. A reading unit 68 such as a reader is arranged.

  The control device 39 calls the data map M corresponding to the semiconductor wafer W identified by the reading unit 68, drives the wafer table 61 based on the data map M, and holds the semiconductor wafer W held on the wafer holder 8. The chip 6 to be picked up is positioned so as to coincide with the pickup position, that is, the center of the backup body 65. At that time, the positioning of the chip 6 is corrected as described later on the basis of the imaging signal from the third camera 67 processed by the image processing unit 40.

  The positioned chip 6 is sucked by the suction nozzle 13 at the tip of the pickup tool 11 driven in the downward direction. At the same time, a portion corresponding to the chip 6 of the wafer sheet 9 is adsorbed by the backup body 65. Thereby, the chip 6 is peeled from the wafer sheet 9 by the pickup tool 11.

  Next, after the pickup tool 11 is lifted, the pickup tool 11 is rotated 180 degrees from the state shown by the chain line in FIG. 1 and turned upward. In this state, the lower end of the suction portion 51 of the ultrasonic horn 52 provided on the mounting head 48 is positioned so as to face the chip 6 sucked and held by the suction nozzle 13.

  After positioning or at the time of positioning, the mounting head 48 descends to a position where the lower end surface of the suction portion 51 comes into contact with the chip 6 and sucks the chip 6 to the tip. The mounting head 48 that has sucked the chip 6 rises and returns to above the substrate 22 and then descends, and the chip 6 is mounted on the mounting portion of the substrate 22.

  The wafer stage 1, the pickup tool 11, the stage table 17 provided with the mounting stage 20, the camera table 26 provided with the camera unit 31, and the head table 43 provided with the mounting tool 50 are controlled by the control device 39. The drive is controlled.

  Next, the operation when picking up the divided chips 6 of the semiconductor wafer W and mounting them on the substrate 22 will be described. When the wafer holder 8 holding the semiconductor wafer W divided into a large number of chips 6 is supplied to the wafer table 61, the identification unit 10 provided on the wafer sheet 9 to which the semiconductor wafer W is adhered is read by the reading unit 68. Read.

  Thereby, the control device 39 calls up the data map M corresponding to the semiconductor wafer W stored in the storage medium, and based on the data map M, for example, the grade A chips 6 are sequentially positioned at the pickup position. The driving of the wafer table 61 is controlled.

  For example, with reference to the outer shape of the semiconductor wafer W, the alignment mark m provided on the A1 chip 6 located in the fifth column of the first row shown in FIG. After positioning the wafer table 61, the alignment mark m of the A1 chip 6 is imaged by the third camera 67, and the X and Y coordinates of the chip 6 are calculated based on the imaging signal. Thus, the chip 6 is positioned at the pickup position, picked up by the pickup tool 11 and mounted on the substrate W.

  Next, the A6 chip 6 located in the first column and the sixth column, which is adjacent to the chip, is picked up. In this case, the control device 39 drives the wafer table 61 in the X and Y directions so that the A2 chip 6 is positioned at the pickup position based on the data map M. At the same time, the alignment mark m provided on the A2 chip 6 is imaged by the third camera 67, and the position of the A2 chip 6, that is, the X and Y coordinates are calculated from the imaging signal.

  Each chip 6 adhered to the wafer sheet 9 is stretched and held by the wafer holder 8 because the wafer sheet 9 is stretched, so that there is a deviation from the X and Y coordinates stored in the data map M due to the elongation. . The deviation amounts are assumed to be ΔX and ΔY.

  The deviation amounts ΔX and ΔY can be obtained from the difference between the drive position of the wafer table 61 in the X and Y directions based on the data map M and the actually measured position calculated from the imaging signal of the third camera 67. . Therefore, if there is a deviation between the driving position and the actually measured position, the driving position, that is, the driving of the wafer table 61 is corrected according to the deviation.

  As a result, the A2 chip 6 can be accurately positioned at the pick-up position, so that the A2 chip 6 can be picked up by the pick-up tool 11, transferred to the mounting tool 50, and mounted on the substrate 22.

  In this way, when picking up the grade A chips 6, most of the grade A to C chips 6 remain on the wafer sheet 9. Therefore, while moving the wafer table 61 in the X and Y directions, the alignment mark m of the grade B or C chip 6 remaining on the wafer sheet 9 is imaged by the third camera 67, and the measured position by the imaging is determined. If the amount of displacement with respect to the drive position based on the data map M is calculated, the drive position in the X and Y directions of the wafer table 61 can be corrected based on the amount of displacement, so the chips 6 of A3,. It can be positioned and picked up.

  Even when a grade B chip is picked up after picking up a grade A chip 6, a considerable number of grade A and C chips 6 still remain on the wafer sheet 9. Therefore, the driving position based on the data map M of the wafer table 61 can be corrected by the actually measured position calculated from the alignment mark m of the chip 6 remaining on the wafer sheet 9 imaged by the third camera 67. Therefore, the grade B chip 6 can be sequentially and reliably positioned at the pickup position.

  When the grade A and B chips 6 are picked up, only three grade C chips 6 remain in the wafer holder 8 in this embodiment as shown in FIG. In order to pick up the chip 6 of grade C, first, the chip 6 indicated by C1 in the drawing is positioned within the field of view of the third camera 67 with reference to the outer shape of the semiconductor wafer W, for example. Next, the alignment mark m provided on the C1 chip 6 is imaged by the third camera 67, and the X and Y coordinates of the chip 6 are calculated based on the imaging signal and positioned at the pickup position. Then, the chip 6 of C1 is picked up by the pickup tool 11.

  Next, the chip 6 indicated by C2 is picked up. At this time, since there is no chip 6 remaining in the path from C1 to C2, the driving position of the wafer table 61 based on the data map M cannot be corrected by the chip 6 remaining on the wafer sheet 9.

  Therefore, the wafer table 61 positions the chip 6 indicated by C2 without correcting the driving in the X and Y directions. Therefore, the extension of the wafer sheet 9 causes the chip 6 of C2 to be greatly displaced from the pickup position. Will end up.

  By the way, when the chip 6 is diced from the semiconductor wafer W, the semiconductor wafer W is cut by a full cut that is cut deeper than its thickness. Therefore, a rectangular cutting line S corresponding to the outer shape of the chip 6 is formed and left on the wafer sheet 9 from which the chip 6 is removed, as shown in FIG. 6 and FIG.

  Therefore, after picking up the chip 6 of C1, after picking up the chip 6 of C2, if there is no chip 6 in the middle, the chip 6 left on the wafer sheet 9 imaged by the third camera 67 is removed. The position of the chip 6 before being picked up at the position of the cutting line S is obtained from the cutting line S indicating the outer shape.

  When the chip 6 is as small as about 1 to 2 mm, the cutting line S of the entire chip 6 can be imaged. However, when the chip 6 is as large as, for example, 5 mm or more, the corner of the chip 6 among the cutting lines S. The position of the chip 6 before being picked up in that part is calculated from the image signal obtained by imaging the part corresponding to, for example, the intersection of the vertical and horizontal cutting lines S.

  Then, if the C2 chip 6 is positioned at the pickup position while correcting the driving of the wafer table 61 in the X and Y directions based on the actually measured position of the chip 6 before being picked up by the calculation, that chip. 6 can be reliably positioned at the pickup position.

The path from the C1 chip 6 to the C2 chip 6 may be a path connecting C1 and C2 indicated by a solid line in FIG. 7 with a straight line, or may be arranged in a matrix as indicated by a broken line in FIG. A zigzag path along the dice of the chip 6 may be used, and it is possible to select a path.
If the C2 chip 6 is picked up, the C3 chip 6 can be similarly positioned and picked up at the pickup position.

  As described above, when the alignment mark m provided on the chip 6 imaged by the third camera 67 or the chip 6 is not picked up, the cutting line S left on the wafer sheet 9 is image-processed. The outer shape of the chip 6 provided on the wafer sheet 9 is recognized regardless of the presence or absence of the chip 6 on the wafer sheet 9.

  Then, the measured position of the chip 6 is compared with the driving position driven based on the data map M based on the recognition of the alignment mark m or the cutting line S, and the position of the wafer table 61 is corrected by the comparison. I tried to do it.

  Therefore, even if only a few grade C chips 6 remain on the wafer sheet 9, the chips 6 can be reliably positioned and picked up at the pickup position.

  The third camera 67 always images the alignment mark m and the cutting line S of the chip 6 within the field of view. Therefore, when picking up the grade B chip 6 after picking up the grade A chip 6, the distance to the next grade B chip 6 to be picked up is large due to the reason that the number of the grade B chips 6 is small. In this case, the grade 6 chip 6 to be picked up next is positioned while correcting the driving position of the wafer table 61 using the cutting line S indicating the outer shape of the grade 6 chip 6 already picked up. You can also.

  In the above embodiment, the flip chip type mounting apparatus has been described as an example. However, as the mounting apparatus, a die bonder for mounting on a substrate without inverting the chip or an inner lead bonder for mounting a chip on a tape carrier, etc. There may be, and the kind of mounting apparatus is not limited at all.

  Moreover, although the case where the chip formed by cutting the semiconductor wafer is divided into three grades has been described, the number of grades is not limited to three and may be two or four or more.

  Further, when the chip is picked up, the wafer sheet is sucked by the backup body, but instead of being picked up, it may be pushed up by a push-up pin and picked up from the wafer sheet by a pick-up tool.

  Although the wafer sheet is stretched and stretched on the wafer holder, the wafer sheet on the wafer holder may be stretched on the wafer table.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. Sectional drawing of a camera unit. The block diagram of a control system. Explanatory drawing which showed the procedure which cut | disconnects the semiconductor wafer stuck on the wafer sheet | seat into a chip | tip, and stretches the sheet | seat on a wafer holder. The figure which expands and shows a part of semiconductor wafer in order to demonstrate the procedure when picking up the chip | tip of a grade A. The figure for demonstrating the procedure at the time of picking up the chip | tip of a grade C. FIG. Explanatory drawing which shows the state which divided | segmented the circuit pattern formed in the semiconductor wafer into the grades AC.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 8 ... Wafer holder, 9 ... Wafer sheet, 10 ... Identification part, 11 ... Pick-up tool (mounting means), 39 ... Control apparatus (control means), 40 ... Image processing part (image processing means), 50 ... Mounting tool (mounting means) ) 61... Wafer table 67. Third camera (imaging means) 68.

Claims (4)

A mounting device that cuts a semiconductor wafer attached to a wafer sheet and divides it into a large number of chips, picks up the chips based on previously detected information, and mounts them on a substrate.
A wafer holder on which the wafer sheet is stretched;
A wafer table that is driven horizontally and on which the wafer holder is placed;
Imaging means for imaging the wafer sheet of the wafer holder placed on the wafer table;
Image processing means for recognizing the outer shape of the chip regardless of the presence or absence of the chip on the wafer sheet, by an imaging signal from the imaging means;
Control means for correcting the horizontal driving amount of the wafer table based on the outer shape recognition of the chip by the image processing means and positioning a chip of predetermined information to be picked up at the pickup position;
A chip mounting apparatus comprising: mounting means for picking up a chip positioned at the pickup position and mounting the chip on the substrate. The semiconductor wafer is cut by a cutting line having a depth reaching the wafer sheet,
The outer shape recognition of the chip by the image processing means is performed by the chip when there is a chip in the visual field range of the imaging means, and when there is no chip in the visual field range, the cutting formed on the wafer sheet when the semiconductor wafer is cut The chip mounting apparatus according to claim 1, wherein the chip mounting apparatus is a line. The control means stores a data map of pre-detected chip information of the semiconductor wafer, and the semiconductor wafer is provided with an identification unit corresponding to the data map,
A reading unit for recognizing the identification unit of the semiconductor wafer is provided above the wafer table,
The control means corrects an amount of deviation between a driving position based on the data map and an actual measurement position obtained by recognition of the outer shape of the chip by the image processing means, and positions the chip at the pickup position. The chip mounting apparatus according to claim 1. A mounting method for cutting a semiconductor wafer attached to a wafer sheet and dividing it into a large number of chips, picking up the chips based on information detected in advance and mounting them on a substrate,
Placing the wafer holder on which the wafer sheet is stretched on a wafer table driven in a horizontal direction;
Imaging the wafer sheet placed on the wafer table;
Recognizing the outer shape of the chip regardless of the presence or absence of the chip on the wafer sheet by this imaging;
Correcting a horizontal driving amount of the wafer table based on the outer shape recognition of the chip and positioning a chip of predetermined information to be picked up at a pickup position;
And a step of picking up the chip positioned at the pick-up position and mounting the chip on the substrate.

Images