JP2013004895A - Component mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a suction nozzle of a component mounting machine to stably suck a wafer component without damage in the component mounting machine in which a wafer component supply device is set.SOLUTION: A height position of an upper surface of a push-up pot 27 is measured by a height sensor using a reference height position of a component mounting machine 25 as a reference by raising the push-up pot 27 to a sheet sucking position in contact with a lower surface of a dicing sheet 36 in a state that a wafer palette 22 is not set at a wafer palette set position above the push-up pot 27 before starting production, and a descent position of a suction nozzle 30 at the time of wafer component sucking operation is corrected in accordance with the measured height position of the upper surface of the push-up pot 27. The height sensor is attached downward to a mounting head holding the suction nozzle 30 of the component mounting machine, and the position of the height sensor is moved to the position just above the push-up pot 27 by moving the mounting head in an XY direction before measuring the height position of the upper surface of the push-up pot 27.

Description

  The present invention relates to a component mounter in which a wafer component supply device for supplying a wafer component (die) formed by dicing a wafer is set.

  In recent years, as described in Patent Document 1 (Japanese Patent Application Laid-Open No. 2010-129949), a wafer component supply device that supplies wafer components (dies) is set in a component mounter, and the wafer mounter is mounted by the component mounter. Some are mounted on a circuit board. The wafer component supply apparatus includes a wafer pallet with a dicing sheet that can be stretched and bonded with a wafer component, and a push-up pot disposed below the dicing sheet, and lowers the suction nozzle of the component mounting machine. When adsorbing and picking up wafer parts on the dicing sheet, the push-up pot is raised to a predetermined sheet adsorbing position that contacts the lower surface of the dicing sheet and the dicing sheet is adsorbed on the upper surface of the push-up pot, By sticking the push-up pin in the push-up pot upward from the upper surface of the push-up pot, the sticking portion of the wafer part to be adsorbed in the dicing sheet is pushed up by the push-up pin and the wafer part is stuck. The wafer is removed by the suction nozzle while partially peeling the part from the dicing sheet. By adsorbing goods are to be mounted on a circuit board to pick up from the dicing sheet.

JP 2010-129949 A

  By the way, when the suction nozzle of the component mounting machine is lowered to suck the wafer component on the dicing sheet, if the interval between the suction nozzle of the component mounting machine and the push-up pot (push-up pin) becomes too small, There is a possibility that the lower end of the suction nozzle hits the wafer part on the dicing sheet too much, causing the wafer part to be damaged or cracked, and the internal circuit of the wafer part to be damaged. If the distance between the pusher pot and the push-up pot (push-up pin) becomes too large, the wafer component cannot be stably sucked by the suction nozzle of the component mounting machine. Therefore, in order to stably attract the wafer component without damaging the wafer component with the suction nozzle of the component mounting machine, it is necessary to strictly manage the interval between the suction nozzle of the component mounting machine and the push-up pot (push-up pin).

  However, the lowering position of the suction nozzle of the component mounter is managed in the machine coordinate system on the component mounter side, and the push-up height position of the push-up pot (push-up pin) is managed in the machine coordinate system on the wafer component supply device side. Therefore, due to differences in the mechanical dimensions of each part of the wafer component supply device, deviation of the set position of the wafer component supply device to the component mounter, etc., for example, the conditions of the floor on which each component mounter is installed are different. In addition, it is inevitable that the interval between the suction nozzle and the push-up pot (push-up pin) of the component mounting machine varies. For this reason, there is a possibility that the wafer component is damaged by the suction nozzle of the component mounting machine or the wafer component cannot be stably suctioned due to the variation in the distance between the suction nozzle of the component mounting machine and the push-up pot (push-up pin).

  Therefore, a problem to be solved by the present invention is to enable a wafer mounter equipped with a wafer component supply device to stably suck a wafer component without damaging the wafer component with a suction nozzle of the component mounter.

  In order to solve the above-mentioned problem, the invention according to claim 1 includes a wafer pallet having a stretchable dicing sheet with wafer parts attached thereto, and a push-up pot disposed below the dicing sheet. Pot for measuring the height position of the upper surface of the push-up pot with respect to the reference height position of the component mounter in a state where the push-up pot is raised to the sheet suction position in the component mounting machine in which the wafer component supply device is set Height position measuring means and nozzle lowering position moving means for moving the lowering position of the suction nozzle during wafer part suction operation according to the height position of the upper surface of the push-up pot measured by the pot height position measuring means It is set as the structure provided with.

  According to this configuration, the height position of the upper surface of the push-up pot is measured by the pot height position measuring unit with the reference height position of the component mounting machine as a reference with the push-up pot raised to the sheet suction position. Since the lowering position of the suction nozzle during the wafer component suction operation is moved according to the measured height position of the upper surface of the push-up pot, the upper surface of the push-up pot can be changed by changing the wafer component supply device set in the component mounting machine. Even if the height position of the wafer fluctuates, the distance between the lowering position of the suction nozzle and the height position of the upper surface of the push-up pot during the wafer part suction operation can be automatically corrected to an appropriate distance. With this suction nozzle, the wafer parts on the dicing sheet can be stably sucked without being damaged. The maximum effect is that the optimally adjusted optimal settings can be reproduced without re-adjustment even when the production type is changed (when mounting / dismounting by setup change), and the program can be managed as a common setting value among multiple devices. That is.

  In this case, as described in claim 2, the pot height position measuring means raises the push-up pot to the sheet suction position without setting the wafer pallet at the wafer pallet set position above the push-up pot before the start of production. Then, the height position of the upper surface of the push-up pot may be measured.

  The thickness dimensions of both the wafer part and the dicing sheet are known data depending on the product specifications of the wafer part. Considering this point, as in claim 3, the pot height position measuring means sets the push-up pot to the sheet suction position in a state where the wafer pallet is set at the wafer pallet set position above the push-up pot after production is started. By measuring the height position of the upper surface of the wafer component on the dicing sheet with reference to the reference height position of the component mounting machine in a state where the dicing sheet is attracted to the upper surface of the push-up pot. The height position of the upper surface of the push-up pot may be indirectly measured. The position lower than the height position of the upper surface of the wafer component on the dicing sheet by the total thickness dimension of the wafer component and the dicing sheet is the height position of the upper surface of the push-up pot.

  According to a fourth aspect of the present invention, the pot height position measuring means measures the height position of the upper surface of the push-up pot at a plurality of locations, and averages the measured values to determine the height position of the upper surface of the push-up pot. You may make it ask. In this way, even if the upper surface of the push-up pot is slightly inclined, the height position near the center of the push-up pot upper surface (near the suction point of the suction nozzle) can be accurately measured.

  Further, the pot height position measuring means may be attached to a mounting head that holds the suction nozzle. In this way, when the position of the pot height position measuring means is deviated from the position directly above the push-up pot, the mounting head is moved in the XY direction to move the position of the pot height position measuring means to the true position of the pot. It is possible to move to the upper position, and there is an advantage that the height position of the upper surface of the push-up pot can be accurately measured from the position directly above the push-up pot.

  By the way, the protrusion amount of the push-up pin from the upper surface of the push-up pot (the push-up amount of the dicing sheet) is a constant value determined by the product specification of the wafer component supply device, so the height position of the upper surface of the push-up pot can be measured. For example, the height position of the upper end of the push-up pin protruding from the upper surface of the push-up pot is found. Therefore, the suction nozzle at the time of wafer part suction operation, taking into consideration the protrusion amount of the push-up pin (the push-up amount of the dicing sheet) and the total thickness dimension of the dicing sheet and the wafer part based on the height position of the upper surface of the push-up pot The lowering position can be moved. In addition, if the height position of the upper end of the push-up pin is measured, the lowering position of the suction nozzle during the wafer part suction operation is moved in consideration of the total thickness of the dicing sheet and wafer part based on the height position. Can be made.

  Therefore, as in claim 6, the height of the upper end of the push-up pin when the push-up pin in the push-up pot is protruded from the upper surface of the push-up pot with the push-up pot raised to the sheet suction position. The position is measured by the pin height position measuring means with reference to the reference height position of the component mounting machine, and the lowering position of the suction nozzle during the wafer part suction operation is determined according to the measured height position of the upper end of the push-up pin. You may make it move by a nozzle descending position moving means. Even if it does in this way, the effect similar to the invention concerning the said Claim 1 can be acquired. In the inventions according to claims 1 to 6, the component mounter is provided with pot height position measuring means or pin height position measuring means for measuring the height position of the upper surface of the push-up pot or the upper end of the push-up pin. However, if the component mounter does not have a height position measuring means, the operator uses a dial gauge or the like to determine the height position of the upper surface of the push-up pot or the upper end of the push-up pin as the reference height position of the component mounter. You may make it measure.

  When the component mounter does not have the height position measuring means, the height position of the upper surface of the push-up pot is set in the state of the component mounter in the state where the push-up pot is raised to the sheet suction position as in claim 7. The value measured with reference to the reference height position, or the height position of the upper end of the push-up pin when the push-up pin in the push-up pot protrudes from the upper surface of the push-up pot is the reference height of the component mounting machine A height position input means for inputting a value measured on the basis of the position is provided, and the wafer is set in accordance with the height position of the upper surface of the push-up pot or the height position of the upper end of the push-up pin inputted by the height position input means. The lowering position of the suction nozzle during the component suction operation may be moved by the nozzle lowering position moving means. Even if it does in this way, the effect similar to the invention concerning the said Claim 1 can be acquired.

FIG. 1 is an external perspective view of a component supply apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged perspective view of the push-up unit portion. FIG. 3 is an external perspective view of a component mounter on which a component supply device is set. FIG. 4 is a diagram showing a positional relationship among a push-up pot partially broken, a wafer part on a dicing sheet, and a suction nozzle. FIG. 5 is a block diagram schematically illustrating the configuration of the control system of the component mounter and the component supply apparatus.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment embodying a mode for carrying out the present invention will be described with reference to the drawings.
As shown in FIG. 1, the component supply apparatus 11 (wafer component supply apparatus) of the present embodiment includes a magazine holding unit 12 (tray tower), a pallet extraction table 13, a pallet extraction mechanism 14, a sub robot 15, a shuttle mechanism 16, The reversing unit 17, push-up unit 18 (see FIG. 2), NG conveyor 19, nozzle changer 20 and the like are provided. As shown in FIG. 3, the component supply device 11 is set in a state in which the pallet drawer table 13 is inserted into the feeder setting slot of the component mounter 25.

  In a magazine (not shown) housed in a magazine holder 12 of the component supply device 11 so as to be movable up and down, a wafer pallet 22 on which wafer components 21 (dies) are placed and a tray pallet on which tray components are placed (see FIG. (Not shown) can be mixed in multiple stages. As shown in FIGS. 4 and 5, the wafer pallet 22 includes an expandable dicing sheet 36 on which a wafer part 21 formed by dicing a wafer in a grid pattern is attached, and a wafer mounting plate having a circular opening. The wafer mounting plate 23 is mounted in an expanded state, and the wafer mounting plate 23 is attached to the pallet body 28 by screwing or the like. The dicing sheet 36 may be expanded by any method. For example, the dicing sheet 36 may be mounted on the wafer mounting plate 23 with the circular ring pushed up from below.

  The pallet pulling mechanism 14 pulls out one of the wafer pallet 22 and the tray pallet from the magazine in the magazine holding unit 12 onto the pallet pulling table 13 according to a production program (production job). And a position at which the wafer component 21 is picked up by the suction nozzle 30 (see FIG. 4) of the component mounting machine 25 (see FIG. 3) (hereinafter referred to as “component mounting machine drawing position”) and a drawing position close to the magazine (hereinafter referred to as “sub-mounting machine” The pallet 22 can be pulled out at any position (referred to as “robot pulling position”). The component mounting machine drawer position is the position of the front end of the pallet drawer table 13 (the position farthest from the magazine), and the sub robot drawer position is the suction nozzle (not shown) of the sub robot 15 on the wafer pallet 22. This is a position where the wafer component 21 on the dicing sheet 36 can be adsorbed.

  The sub-robot 15 is provided above the pallet pull-out table 13 in the rear surface (the surface on the sub-robot pull-out position side) of the magazine holding unit 12 and is arranged in the XZ direction (the width direction of the pallet pull-out table 13 and the vertical direction). Direction). The movement direction of the sub robot 15 is only the X direction, and the relative position of the sub robot 15 in the Y direction (pallet pulling direction) with respect to the wafer pallet 22 is gradually pulled out in the Y direction by the pallet pulling mechanism 14. I try to control it. The sub robot 15 is provided with one or a plurality of suction nozzles (not shown) facing downward, so that the suction nozzles can be replaced by the nozzle changer 20 according to the size of the wafer component 21 to be picked up. Yes. The sub robot 15 is provided with a camera 24 so that the position of the wafer component 21 to be picked up or the suction posture of the wafer component 21 can be confirmed based on an image captured by the camera 24.

  The shuttle mechanism 16 receives the component picked up by the suction nozzle of the sub robot 15 by the shuttle nozzle 26 and transfers it to a position where it can be picked up by the suction nozzle 30 of the component mounting machine 25.

  The reversing unit 17 vertically flips the wafer part 21 received from the sub robot 15 as necessary. This is because depending on the type of the wafer component 21, there is a wafer component (for example, flip chip) that is attached to the dicing sheet 36 of the wafer pallet 22 upside down.

  The push-up unit 18 (see FIG. 2) is provided on the pallet drawer table 13 and can move in the XY direction (the width direction of the pallet drawer table 13 and the horizontal direction perpendicular thereto) in the space area below the dicing sheet 36 of the wafer pallet 22. It is configured. Even when the wafer pallet 22 is pulled out to any position of the component mounter pulling position and the sub robot pulling position, the sticking portion of the wafer component 21 to be picked up in the dicing sheet 36 is pushed up from below. By locally pushing up with the push-up pins 29 (see FIG. 4) of the pot 27, the sticking part of the wafer part 21 is partially peeled off from the dicing sheet 36 so that the wafer part 21 can be easily picked up. I have to. In order for the push-up unit 18 to select the push-up pot 27 according to the size of the wafer component 21, etc., a plurality of types (for example, four types) of push-up pots 27 are arranged at a predetermined angle pitch (90 ° pitch in the example of FIG. 2). ) And is configured to rotate to a position where the push-up pot 27 to be pushed up is directed upward.

The push-up unit 18 is configured such that the push-up unit 18 as a whole moves up and down using a servo motor 37 (see FIG. 5) as a drive source. During the die pick-up operation, when the push-up unit 18 is raised and the upper surface of the push-up pot 27 is raised to a predetermined sheet suction position where it contacts the dicing sheet 36 of the wafer pallet 22, the push-up unit 18 is raised by a stopper mechanism (not shown). When the operation stops and the ascending operation is continued, the push-up pin 29 (see FIG. 4) protrudes upward from the upper surface of the push-up pot 27, and the adhering portion (suction nozzle) of the wafer component 21 to be sucked out of the dicing sheet 36 30 adsorption points). In this case, the push-up height of the push-up pin 29 can be adjusted by adjusting the rotation amount of the servo motor 37 serving as a drive source.
The NG conveyor 19 is a conveyor that discharges defective parts and wafer parts 21 with poor adsorption.

  As shown in FIG. 3, the control device 32 of the component supply device 11 configured as described above includes an input device 33 such as a keyboard, a mouse, and a touch panel, and a peripheral device such as a display device 34 such as a liquid crystal display. The pallet drawer position and the part pickup method are selected according to the type of parts supplied to the component mounter 25 according to the production program, and the pallet drawer mechanism 14, the sub robot 15 and the shuttle are selected according to the selection result. The operations of the mechanism 16, the reversing unit 17, the pushing-up unit 18, the suction nozzle 30 of the component mounter 25, and the like are controlled as follows.

(1) In the case of a small wafer part 21 In the case of a small wafer part 21, it is difficult to change the wafer part 21 to the suction nozzle 30 of the sub robot 15 → the shuttle nozzle 26 → the component mounting machine 25. 12, the wafer pallet 22 is pulled out to the component mounter drawing position, and the wafer component 21 on the dicing sheet 36 of the wafer pallet 22 is directly picked up by the suction nozzle 30 of the component mounter 25.

(2) In the case of the wafer part 21 having a size other than the above In the case of the wafer part 21 having a size that allows the wafer part 21 to be held, the wafer from the magazine in the magazine holder 12 is shortened for the purpose of shortening the mounting time. The pallet 22 is pulled out to the sub robot pulling position, the wafer part 21 on the dicing sheet 36 of the wafer pallet 22 is picked up by the suction nozzle of the sub robot 15, and the wafer part 21 is received by the shuttle nozzle 26 of the shuttle mechanism 16. The wafer component 21 is picked up by the suction nozzle 30 of the component mounter 25 from the shuttle nozzle 26 of the shuttle mechanism 16 at this pickup position.

(3) In the case of a tray component In the case of a tray component, the tray pallet is pulled out from the magazine in the magazine holding unit 12 to the component mounter drawing position, and the component on the tray pallet is picked up by the suction nozzle 30 of the component mounter 25. Pick up directly.

  By the way, when the wafer component 21 on the dicing sheet 36 of the wafer pallet 22 is sucked by the suction nozzle 30 of the component mounting machine 25, if the distance between the push-up pot 27 (push-up pin 29) and the suction nozzle 30 becomes too small, The lower end of the suction nozzle 30 may hit the wafer part 21 on the dicing sheet 36 too much and the wafer part 21 may be damaged or broken, or the internal circuit of the wafer part 21 may be damaged. If the gap between the pot 27 (the push-up pin 29) and the suction nozzle 30 becomes too large, the wafer component 21 cannot be stably suctioned by the suction nozzle 30. Therefore, in order to stably suck the wafer component 21 without damaging the wafer component 21 with the suction nozzle 30 of the component mounting machine 25, the interval between the suction nozzle 30 of the component mounting machine 25 and the push-up pot 27 (push-up pin 29) is strictly set. Need to manage.

  However, the lowering position of the suction nozzle 30 of the component mounting machine 25 is managed by the machine coordinate system on the component mounting machine 25 side, and the rising height position of the push-up pot 27 and the push-up height position of the push-up pin 29 are the component supply device. 11 is managed in the machine coordinate system on the 11 side, and therefore, for example, each component mounting machine includes a variation in mechanical dimensions of each part of the component supply apparatus 11 and a set position shift of the component supply apparatus 11 to the component mounting machine 25. It is inevitable that the space between the suction nozzle 30 and the push-up pot 27 (push-up pin 29) of the component mounting machine 25 varies due to different conditions of the floor to be installed. For this reason, due to variations in the distance between the suction nozzle 30 of the component mounting machine 25 and the push-up pot 27 (push-up pin 29), the wafer part 21 is damaged by the suction nozzle 30 of the component mounting machine 25, or the wafer part 21 is stabilized. May not be adsorbed.

  As a countermeasure, in this embodiment, the height of the upper surface of the push-up pot 27 is measured based on the reference height position of the component mounting machine 25 in a state where the push-up pot 27 is raised to the sheet suction position. As a height measurement means, a height sensor 38 (see FIG. 5) is attached downward to a mounting head (not shown) that holds the suction nozzle 30 of the component mounter 25. As the height sensor 38, for example, a non-contact type height sensor such as a laser type, an ultrasonic type, or an LED type may be used. Alternatively, a contact-type sensor such as a touch sensor is attached to the mounting head, and the mounting head is lowered until the contact-type sensor comes into contact with the object to be measured (the upper surface of the push-up pot 27). You may make it measure by the count value of the encoder of the Z-axis motor 39 which is a drive motor of the Z-axis direction (up-down direction) of a moving apparatus. Alternatively, the mounting head is lowered until the lower end of the suction nozzle 30 comes into contact with the measurement object, and a change in torque of the Z-axis motor 39 of the mounting head moving device is detected, whereby the lower end of the suction nozzle 30 is detected. It is also possible to detect the height position where the contact is made and measure the height position by the count value of the encoder of the Z-axis motor 39 of the mounting head moving device.

  The control device 40 of the component mounter 25 does not set the push pot 27 on the dicing sheet 36 in a state where the wafer pallet 22 is not set at the wafer pallet set position above the push pot 27 before starting production. The height of the upper surface of the push-up pot 27 is measured by the height sensor 38 with reference to the reference height position of the component mounting machine 25, and the upper surface of the push-up pot 27 is measured. It functions as a nozzle lowering position moving means for moving the lowering position of the suction nozzle 30 during the wafer part suction operation in accordance with the height position.

  The lowering position of the suction nozzle 30 during the wafer component suction operation is obtained by the following equation using the height position A of the upper surface of the push-up pot 27.

Lowering position of suction nozzle 30 = A + B + C + D + E (1)
Push-up height position of push-up pin 29 (height position of upper end) = A + B (2) A: Height position of upper surface of push-up pot 27
B: Push-up amount of push-up pin 29
C: Thickness dimension of the dicing sheet 36
D: Thickness dimension (height dimension) of the wafer component 21
E: Appropriate pushing amount of the suction nozzle 30

  Here, the push-up amount B of the push-up pin 29 is known data according to the product specification of the component supply device 11, and the thickness dimension C of the dicing sheet 36 and the thickness dimension D of the wafer component 21 are known from the product specification of the wafer part 21. The proper pushing amount E of the suction nozzle 30 is an appropriate compression amount of the spring that urges the suction nozzle 30 downward, and is known data according to the product specifications of the component mounting machine 25. Therefore, if the height position A of the upper surface of the push-up pot 27 is measured, the lowered position of the suction nozzle 30 can be calculated by the above equation (1).

  Further, in the present embodiment, the height position of the upper surface of the push-up pot 27 is measured at a plurality of positions by the height sensor 38, and the measured values are averaged to obtain the height position of the upper surface of the push-up pot 27. ing. In this way, even if the upper surface of the push-up pot 27 is slightly inclined, the height position near the center of the upper surface of the push-up pot 26 (near the suction point of the suction nozzle 30) can be accurately measured. However, it goes without saying that in the present invention, the height position of the upper surface of the push-up pot 27 may be measured at only one location.

  In the present embodiment described above, the lowering position of the suction nozzle 30 during the wafer part suction operation is moved in accordance with the height position of the upper surface of the push-up pot 27 measured by the height sensor 38. Even if the height position of the upper surface of the push-up pot 27 is changed by changing the component supply device 11 set to 25, the lowering position of the suction nozzle 30 and the height position of the upper surface of the push-up pot 27 during the wafer component suction operation are changed. The interval can be automatically corrected to an appropriate interval, and the suction nozzle 30 of the component mounter 25 can stably suck the wafer component 21 on the dicing sheet 36 without damaging it. The maximum effect is that the optimally adjusted settings can be reproduced without re-adjustment even when the production type is changed (when mounting / dismounting by setup change), and the same push-up amount and nozzle stroke setting values among multiple devices The program can be managed as follows.

  In addition, in this embodiment, the height sensor 38 is attached to the mounting head of the component mounter 25. Therefore, when the position of the height sensor 38 is displaced from the position directly above the push-up pot 27, the mounting head is The position of the height sensor 38 can be moved to the position directly above the push-up pot 27 by moving in the X and Y directions, and the height position of the upper surface of the push-up pot 27 can be accurately measured from the position directly above the push-up pot 27. There is an advantage that can be.

  However, the position where the height sensor 38 (pot height position measuring means) is attached is not limited to the mounting head of the component mounter 25, and for example, the wafer pallet set position (drawer for component mounter) in the component mounter 25 You may make it attach to the site | part located above (position). When the position of the height sensor 38 attached to the component mounting machine 25 is deviated from the position directly above the push-up pot 27, the push-up pot 27 is moved in the XY direction so that the position of the push-up pot 27 is adjusted to the height sensor 38. What is necessary is just to make it move to a position right under. Even in this case, the height position of the upper surface of the push-up pot 27 can be accurately measured from the position directly above the push-up pot 27.

  In this embodiment, the wafer pallet 22 is not set at the wafer pallet setting position (drawing position for the component mounting machine) above the push-up pot 22 before the production is started, and the push-up pot 27 is raised to the sheet suction position and pushed up. Although the height position of the upper surface of the pot 27 is measured by the height sensor 38, it is considered that the thickness dimensions of both the wafer component 21 and the dicing sheet 36 are known data depending on the product specifications of the wafer component 21. Then, with the wafer pallet 22 set in the wafer pallet setting position (component mounting machine drawer position) above the push-up pot 27 after production is started, the push-up pot 27 is raised to the sheet suction position, and the dicing sheet 36 is moved. While adsorbed on the upper surface of the push-up pot 27, the wafer on the dicing sheet 36 is The height position of the upper surface of the push-up pot 27 is indirectly measured by measuring the height position of the upper surface of the component 21 with the height sensor 38 based on the reference height position of the component mounting machine 25. You may do it. The position lower than the height position of the upper surface of the wafer component 21 on the dicing sheet 36 by the total thickness dimension of the wafer component 21 and the dicing sheet 36 is the height position of the upper surface of the push-up pot 27.

  Further, instead of the height position of the upper surface of the push-up pot 27, the height position of the upper end of the push-up pin 29 when protruding from the upper surface of the push-up pot 27 may be measured. For example, in a state where the wafer pallet 22 is not set at the wafer pallet setting position (component mounting machine drawer position) above the push-up pot 22 before the start of production, the push-up pot 27 is raised to the sheet suction position. 27, the height position of the upper end of the push-up pin 29 when the push-up pin 29 in the push-up pot 27 is protruded from the upper surface of the push-up pot 27 with respect to the reference height position of the component mounting machine 25. The position of the suction nozzle 30 during the wafer component suction operation may be moved in accordance with the measured height position of the upper end of the push-up pin 29. Also in this case, the height sensor (pin height position measuring means) may be attached to the mounting head of the component mounting machine 25, or the wafer pallet setting position (drawing position for the component mounting machine) in the component mounting machine 25. In any configuration, when the position of the height sensor (pin height position measuring means) is shifted from the position directly above the push-up pin 29, the mounting head or The push pot 27 may be moved in the XY directions so that the position of the height sensor (pin height position measuring means) and the position directly above the push pin 29 may be aligned.

  The pot height position measuring means (height sensor 38) and the pin height position measuring means are not limited to those that measure the height position from above the push-up pot 27 or the push-up pin 29, and the push-up pot 27 or push-up The height position may be measured from the side of the pin 29. For example, using a camera fixed to the component mounting machine 25, the push-up pot 27 and the push-up pin 29 are picked up from the side, and the picked-up image is processed and the height position of the upper face of the push-up pot 27 and the push-up pin are taken. The height position of the upper end of 29 may be measured.

  Moreover, in the said Example, although the pot height position measuring means or pin height position measuring means which measures the height position of the upper surface of the pushing pot 27 or the upper end of the pushing pin 29 was provided in the component mounting machine 25, height In a component mounting machine that does not have a position measuring means, an operator uses a dial gauge or the like to measure the height position of the upper surface of the push-up pot 27 or the upper end of the push-up pin 29 with reference to the reference height position of the component mounter 25. Anyway.

  When the component mounting machine 25 does not have the height position measuring means, the operator uses the dial gauge or the like to raise the height position of the upper surface of the push-up pot 27 while the push-up pot 27 is raised to the sheet suction position. The value measured with reference to the reference height position of the component mounting machine 25 or the height position of the upper end of the push-up pin 29 when the push-up pin 29 in the push-up pot 27 is protruded from the upper surface of the push-up pot 27 Is provided with height position input means (keyboard, mouse, touch panel, etc.) for inputting a value measured with reference to the reference height position of the component mounting machine 25, and the push-up pot 27 input by the height position input means. Depending on the height position of the upper surface or the height position of the upper end of the push-up pin 29, the lowering position of the suction nozzle 30 during the wafer part suction operation is moved by the nozzle lowering position moving means. It may be allowed to. Even if it does in this way, the effect similar to the said Example can be acquired.

  In the above-described embodiment, the component supply device 11 in which the wafer pallet 22 and the tray pallet are mixedly mounted is set in the component mounter 25. However, the wafer component supply device in which only the wafer pallet 22 is loaded is used as the component mounter 25. The present invention can be implemented with various modifications, for example, the present invention may be applied to the configuration set in the above.

  DESCRIPTION OF SYMBOLS 11 ... Component supply apparatus (wafer component supply apparatus), 12 ... Magazine holding part, 13 ... Pallet drawer table, 14 ... Pallet drawer mechanism, 15 ... Sub robot, 16 ... Shuttle mechanism, 17 ... Reversing unit, 18 ... Push-up unit, DESCRIPTION OF SYMBOLS 19 ... NG conveyor, 20 ... Nozzle changer, 21 ... Wafer component, 22 ... Wafer pallet, 23 ... Wafer mounting plate, 25 ... Component mounting machine, 26 ... Shuttle nozzle, 27 ... Push-up pot, 28 ... Pallet body, 29 ... Push-up Pin: 30 ... Adsorption nozzle of component mounting machine, 32 ... Control device of component supply device, 33 ... Input device, 34 ... Display device, 36 ... Dicing sheet, 37 ... Servo motor, 38 ... Height sensor (pot height position Measuring means), 40... Control device for component mounting machine (nozzle lowering position moving means)

Claims (7)

A wafer part supply apparatus is set, which includes a wafer pallet with a dicing sheet that can be stretched and bonded with a wafer part, and a push-up pot disposed below the dicing sheet.
When the wafer nozzle on the dicing sheet is sucked by lowering the suction nozzle, the push-up pot of the wafer component supply device is raised to a predetermined sheet suction position that contacts the lower surface of the dicing sheet. The sticking portion of the wafer part to be sucked out of the dicing sheet is made to protrude by projecting the push-up pin in the push-up pot upward from the upper surface of the push-up pot in a state where it is adsorbed on the upper face of the push-up pot. A component mounting machine that picks up the wafer component by the suction nozzle and picks it up from the dicing sheet and mounts it on the circuit board while pushing the sticking portion of the wafer component from the dicing sheet by pushing it up with a push-up pin In
Pot height position measuring means for measuring the height position of the upper surface of the push-up pot with reference to the reference height position of the component mounting machine in a state where the push-up pot is raised to the sheet suction position;
Nozzle lowering position moving means for moving the lowering position of the suction nozzle during wafer part suction operation according to the height position of the upper surface of the push-up pot measured by the pot height position measuring means. A component mounting machine.   The pot height position measuring means raises the push-up pot to the sheet suction position without setting the wafer pallet at the wafer pallet set position above the push-up pot before production is started. The component mounter according to claim 1, wherein the height position of the component mounter is measured.   The pot height position measuring means raises the dicing sheet by raising the push pot to the sheet suction position in a state where the wafer pallet is set at a wafer pallet set position above the push pot after the production starts. The height position of the upper surface of the push-up pot is measured by measuring the height position of the upper surface of the wafer component on the dicing sheet with reference to the reference height position of the component mounting machine in a state of being attracted to the upper surface of the pot. The component mounting machine according to claim 1, wherein the component mounting machine is indirectly measured.   The pot height position measuring means measures the height position of the upper surface of the push-up pot at a plurality of locations and averages the measured values to obtain the height position of the upper surface of the push-up pot. Item mounting machine according to any one of Items 1 to 3.   The component mounting machine according to claim 1, wherein the pot height position measuring unit is attached to a mounting head that holds the suction nozzle. A wafer part supply apparatus is set, which includes a wafer pallet with a dicing sheet that can be stretched and bonded with a wafer part, and a push-up pot disposed below the dicing sheet.
When the wafer nozzle on the dicing sheet is sucked by lowering the suction nozzle, the push-up pot of the wafer component supply device is raised to a predetermined sheet suction position that contacts the lower surface of the dicing sheet. The sticking portion of the wafer part to be sucked out of the dicing sheet is made to protrude by projecting the push-up pin in the push-up pot upward from the upper surface of the push-up pot in a state where it is adsorbed on the upper face of the push-up pot. A component mounting machine that picks up the wafer component by the suction nozzle and picks it up from the dicing sheet and mounts it on the circuit board while pushing the sticking portion of the wafer component from the dicing sheet by pushing it up with a push-up pin In
The height position of the upper end of the push-up pin when the push-up pin in the push-up pot protrudes from the upper surface of the push-up pot with the push-up pot raised to the sheet suction position is a reference for the component mounting machine Pin height position measuring means for measuring with reference to the height position,
Nozzle lowering position moving means for moving the lowering position of the suction nozzle during the wafer part suction operation according to the height position of the upper end of the push-up pin measured by the pin height position measuring means. A component mounting machine. A wafer part supply apparatus is set, which includes a wafer pallet with a dicing sheet that can be stretched and bonded with a wafer part, and a push-up pot disposed below the dicing sheet.
When the wafer nozzle on the dicing sheet is sucked by lowering the suction nozzle, the push-up pot of the wafer component supply device is raised to a predetermined sheet suction position that contacts the lower surface of the dicing sheet. The sticking portion of the wafer part to be sucked out of the dicing sheet is made to protrude by projecting the push-up pin in the push-up pot upward from the upper surface of the push-up pot in a state where it is adsorbed on the upper face of the push-up pot. A component mounting machine that picks up the wafer component by the suction nozzle and picks it up from the dicing sheet and mounts it on the circuit board while pushing the sticking portion of the wafer component from the dicing sheet by pushing it up with a push-up pin In
A value obtained by measuring the height position of the upper surface of the push-up pot with reference to the reference height position of the component mounting machine with the push-up pot raised to the sheet suction position, or the push-up in the push-up pot A height position input means for inputting a value obtained by measuring the height position of the upper end of the push-up pin when the pin is protruded from the upper surface of the push-up pot with reference to the reference height position of the component mounting machine;
Nozzle lowering position movement for moving the lowering position of the suction nozzle during the wafer part suction operation according to the height position of the upper surface of the push-up pot or the height position of the upper end of the push-up pin input by the height position input means And a component mounting machine.

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