WO2015083221A1 - Système de réglage de dispositif de fourniture de puce et gabarit de réglage - Google Patents

Système de réglage de dispositif de fourniture de puce et gabarit de réglage Download PDF

Info

Publication number
WO2015083221A1
WO2015083221A1 PCT/JP2013/082385 JP2013082385W WO2015083221A1 WO 2015083221 A1 WO2015083221 A1 WO 2015083221A1 JP 2013082385 W JP2013082385 W JP 2013082385W WO 2015083221 A1 WO2015083221 A1 WO 2015083221A1
Authority
WO
WIPO (PCT)
Prior art keywords
die
stamp
sheet
push
adjustment jig
Prior art date
Application number
PCT/JP2013/082385
Other languages
English (en)
Japanese (ja)
Inventor
早川　昌志
友則 岩瀬
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2015551304A priority Critical patent/JP6112688B2/ja
Priority to PCT/JP2013/082385 priority patent/WO2015083221A1/fr
Publication of WO2015083221A1 publication Critical patent/WO2015083221A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Definitions

  • the present invention relates to a die supply device adjustment used for adjusting a die supply device for adsorbing and supplying a die by a suction nozzle from a wafer stretched body stretched with a dicing sheet that can be stretched and bonded with a diced wafer.
  • the invention relates to a system and an adjustment jig.
  • a die supply device for supplying a die is set in a component mounter, and the die is mounted on a circuit board by the component mounter.
  • This die supply apparatus includes a wafer pallet (wafer stretched body) in which an expandable dicing sheet with a wafer diced so as to be divided into a plurality of dies is stretched on a dicing frame, and a lower portion of the dicing sheet
  • the pickup nozzle is lowered to suck and pick up the die on the dicing sheet
  • the sticking portion of the die to be sucked out of the dicing sheet is picked up by the push-up pin.
  • the die is adsorbed by the adsorption nozzle and picked up from the dicing sheet while being pushed up and partially separating the sticking portion of the die from the dicing sheet.
  • the suction nozzle when the suction nozzle is lowered to suck the die on the dicing sheet, if the height of the stop position of the lowering operation of the suction nozzle (the lower limit position of the lowering stroke) becomes too low, the lower end of the suction nozzle becomes the dicing sheet. There is a possibility that the die will be damaged or cracked by hitting the upper die too much.On the other hand, if the height of the stop position of the lowering operation of the suction nozzle becomes too high, the die will be stably attached to the suction nozzle. Cannot be adsorbed. Therefore, in order to stably suck the suction nozzle without damaging the die, it is necessary to precisely adjust the height of the stop position of the lowering operation of the suction nozzle.
  • the push-up height of the push-up pin (the height of the upper end) becomes too high, the lower end of the suction nozzle may hit the die on the dicing sheet too much and the die may be damaged or cracked. Furthermore, if the push-up height of the push-up pin becomes too low, the die cannot be stably sucked to the suction nozzle. Therefore, in order to stably suck the die without damaging the die, it is necessary to precisely adjust the push-up height of the push-up pin.
  • the die supply apparatus it is necessary to adjust the height of the stop position of the lowering operation of the suction nozzle, the push-up height of the push-up pin, and the horizontal position of both.
  • the height of the stop position of the suction nozzle lowering operation, the push-up height of the push-up pin, and the horizontal position of both are measured manually, and their misalignments exceed the allowable range. If it becomes clear, the laborious work of performing manual measurement again, such as reassembling the component parts of the apparatus, was performed. For this reason, a lot of time may be spent on the adjustment work, which is one factor that reduces productivity.
  • the orientation of the wafer pallet may be slightly inclined in the horizontal direction.
  • the relationship between the suction position of the suction nozzle and the position of each die on the dicing sheet is shifted, and the die cannot be stably suctioned to the suction nozzle. Therefore, in order to stably attract the die to the suction nozzle, it is desirable to adjust the suction position of each die on the dicing sheet according to the tilt of the wafer pallet. Therefore, when the inclination of the wafer pallet becomes large, there is a possibility that the die cannot be stably sucked to the suction nozzle.
  • an object of the present invention is to enable at least one of the above-described problems to be solved.
  • the present invention sets a wafer stretched body in which a stretchable dicing sheet with a wafer diced so as to be divided into a plurality of dies is stretched, and includes a suction nozzle that is detachably held on a suction head.
  • a suction nozzle that is detachably held on a suction head.
  • the stamp portion has a stamp portion that is stamped on the surface of the die, and the stamp portion has a stamp mark stamped on the surface of the die as the amount pressed against the die increases.
  • the adjustment jig which is formed of a material that can be elastically deformed so as to increase its size and is held by the suction head, is positioned above the die, and the suction head is lowered as in the die suction operation.
  • a stamp mark having a size corresponding to the pressing amount of the stamp portion is impressed on the surface of the die, and the size of the stamp mark is set. Based on this, the height of the stop position of the lowering operation of the suction head (lower limit position of the lowering stroke) can be known.
  • the suction head is caused to hold an adjustment jig instead of the suction nozzle, and the suction head is moved down in the same manner as the die suction operation so that the adjustment jig is lowered to the surface of the die.
  • the stamp portion of the adjustment jig By pressing the stamp portion of the adjustment jig, a stamp mark having a size corresponding to the pressing amount of the stamp portion is impressed on the surface of the die.
  • the stamp part of the adjustment jig is formed so that the size of the stamp mark stamped on the surface of the die increases as the pressing amount to the die (the amount by which the stamp part descends) increases.
  • the pressing amount (lowering amount) of the stamp portion against the die increases, that is, the height of the stop position of the lowering operation of the suction head decreases.
  • the height of the stop position of the lowering operation of the suction head can be easily and accurately measured from the size of the stamp mark imprinted on the die surface.
  • a sheet stretched body in which a sheet to which a wafer is not attached is stretched is prepared, the sheet stretched body is set instead of the wafer stretched body, and is held by the suction head
  • the adjustment jig is positioned above the sheet of the sheet extending body, and the suction head is moved down in the same manner as the die suction operation to lower the adjustment jig to place the stamp portion on the surface of the sheet.
  • a stamp mark having a size corresponding to the pressing amount of the stamp portion is impressed on the surface of the sheet so that the height of the stop position of the lowering operation of the suction head can be known based on the size of the stamp mark. You may make it comprise. In this way, if a sheet stretch body is set instead of the wafer stretch body and the stamp mark is imprinted on the surface of the sheet of the sheet stretch body, the stamp mark is not imprinted on the surface of the die.
  • the stamp part may have any shape such as a columnar shape as long as it can be elastically deformed.
  • the stamp part has a shape that becomes thinner toward the lower side by a porous material that can be elastically deformed. It is preferable that the adjustment jig is provided with an ink tank portion for supplying ink to the stamp portion.
  • the stamp part is formed into a shape (for example, a taper shape, a spherical shape, etc.) that becomes thinner toward the lower side by a porous material that can be elastically deformed, the size of the stamp mark with respect to the pressing amount (down amount) of the stamp part to the die The rate of change is increased, and the measurement accuracy of the height of the stop position of the lowering operation of the suction head (suction nozzle) can be improved.
  • the adjustment jig is provided with an ink tank section that supplies ink to the stamp section, the work (operation) for attaching ink to the stamp section before the stamping operation can be omitted, and the measurement work can be omitted. Can be performed efficiently.
  • the operator may measure the size of the stamp mark visually or with a measuring instrument such as a ruler, but this operation may be automated.
  • a camera that captures the stamp mark stamped on the surface of the die or sheet
  • an image processing unit that recognizes the stamp mark by processing an image captured by the camera
  • the image processing unit It is good also as a structure provided with the calculating means which calculates the height of the stop position of the downward movement operation
  • the push pin is pushed up and the sheet is pushed up by the push pin to make a push mark on the sheet, and the stamp mark and the push mark are moved in the horizontal direction.
  • the location relationship it may be configured such horizontal positional relationship between the adsorption head and the push-up pins can be seen. In this way, the horizontal positional relationship between the suction head and the push-up pin can be easily and accurately measured based on the horizontal positional relationship between the stamp mark stamped on the surface of the sheet and the push-up trace.
  • the shape of the stamp portion may be any shape.
  • the stamp portion is formed so that a stamp mark to be impressed by an elastically deformable porous material is a circle or a ring.
  • the adjustment jig is preferably provided with an ink tank portion for supplying ink to the stamp portion.
  • the shape of the stamp mark is a ring, there is an advantage that even if the stamp mark is large, the push-up trace does not overlap with the stamp mark and the push-up trace can be easily recognized.
  • the operator may measure the horizontal positional relationship between the stamp mark and the push-up mark with an instrument such as a visual or ruler, but this operation may be automated by image processing using a camera.
  • image processing using a camera.
  • the horizontal position of the suction head and the horizontal position of the push-up pin and / or the horizontal displacement amount of both are calculated. The calculation may be performed by
  • a configuration may be provided with reference position correction means for correcting the horizontal reference position of the moving mechanism for moving the suction head and the push-up pin in the horizontal direction based on the calculation result of the calculation means. In this way, the horizontal displacement between the suction head and the push-up pin can be automatically corrected.
  • the stamp part of the adjustment jig is used to measure the stamp mark stamped on the surface of the die on the dicing sheet as the push-up height of the dicing sheet by the push-up pin increases.
  • the adjustment jig is formed of a material that can be elastically deformed so as to increase in size, and the adjustment jig held by the adsorption head is positioned above the die to move the adsorption head downward.
  • the push-up pin located directly below the adjustment jig is pushed up to push up the dicing sheet with the push-up pin and on the push-up part of the dicing sheet
  • a die is pressed against the stamp portion to stamp a stamp mark on the surface of the die, and the bump is determined based on the size of the stamp mark.
  • the push-up height of up pin may be configured as can be seen.
  • the stamp portion of the adjustment jig is formed so that the size of the stamp mark imprinted on the surface of the die on the dicing sheet increases as the push-up height of the dicing sheet by the push-up pin increases. It can be seen that the push-up height of the push-up pin increases as the size of the stamp mark imprinted on the surface of the die increases. Thereby, the push-up height of the push-up pin can be measured easily and accurately.
  • a sheet stretching body in which a sheet to which a wafer is not bonded is stretched is used, the sheet stretching body is set in place of the wafer stretching body, and an adjustment jig held on the suction head is provided.
  • the suction head is moved down by being positioned above the sheet of the sheet stretching body, and the stamp part of the adjustment jig is in contact with or close to the surface of the sheet, and is directly below the adjustment jig.
  • the push-up pin located on the sheet is pushed up, the sheet is pushed up by the push-up pin, the push-up portion of the sheet is pressed against the stamp portion, and the stamp mark is stamped on the push-up portion of the sheet, and the size of the stamp mark is increased.
  • the push-up height of the push-up pin may be determined. As described above, if the stamp mark is stamped on the surface of the sheet of the sheet stretched body instead of the wafer stretched body, there is an advantage that the surface of the die does not need to be stained with the stamp mark.
  • the stamp part of the adjustment jig is formed in a shape in which the direction of the stamp mark to be stamped on the surface of the die is specified, and the adjustment jig held by the suction head is positioned above the die to The suction head is moved downward in the same manner as the die suction operation, the adjustment jig is lowered, and the stamp portion is pressed against the surface of the die, so that a stamp mark is stamped on the surface of the die.
  • the operator may measure the direction of the stamp mark visually or with a meter such as a protractor, but this operation may be automated by image processing using a captured image of the camera.
  • FIG. 1 is an external perspective view of a die supply apparatus according to Embodiment 1 of the present invention.
  • FIG. 2 is an external perspective view of the push-up unit and its peripheral part.
  • FIG. 3 is an external perspective view of the wafer pallet.
  • FIG. 4 is a partially broken enlarged view showing a state in which the push-up pot is raised to the suction position during the push-up operation.
  • FIG. 5 is a partially broken enlarged view showing a state in which the push-up pin is protruded from the push-up pot during the push-up operation.
  • FIG. 6 is a block diagram showing the configuration of the control system of the die supply apparatus.
  • 7A and 7B are a longitudinal front view and a bottom view of the adjustment jig.
  • FIGS. 8A and 8B are views for explaining the relationship between the amount of stamp portion pressed against the die and the size of the stamp mark.
  • FIG. 9 is an external perspective view of a sheet pallet used in Embodiment 2 of the present invention.
  • FIG. 10 is a diagram illustrating an example of a captured image of the camera according to the third embodiment of the present invention.
  • FIG. 11 is a diagram illustrating an example of a captured image of the camera according to the fourth embodiment of the present invention.
  • FIGS. 12A and 12B are diagrams for explaining the relationship between the push-up height of the push-up pin (the pressing amount of the stamp portion) and the size of the stamp mark in the fifth embodiment of the present invention.
  • FIGS. 13A and 13B are diagrams illustrating the relationship between the push-up height of the push-up pin (the pressing amount of the stamp portion) and the size of the stamp mark according to the sixth embodiment of the present invention.
  • FIGS. 14A and 14B are a front view and a bottom view of an adjustment jig used in Example 7 of the present invention.
  • FIGS. 15A and 15B are plan views showing examples of stamp mark imprinting with and without a wafer pallet tilt.
  • a first embodiment of the present invention will be described with reference to FIGS. First, the configuration of the die supply apparatus 11 will be schematically described with reference to FIG.
  • the die supply device 11 includes a magazine holding unit 22 (tray tower), a pallet drawer table 23, an XY moving mechanism 25, a push-up unit 28 (see FIG. 2), and the like, and the pallet drawer table 23 is a component mounting machine (not shown). Is set to the state where it is plugged in.
  • wafer pallets 32 equipped with wafer extending bodies 30 are stacked in multiple stages.
  • the pallet 32 is drawn onto the pallet drawer table 23 by a pallet drawer mechanism 56 (see FIG. 6).
  • the wafer extending body 30 is obtained by expanding a dicing sheet 34 that can be stretched and bonded with a die 31 formed by dicing the wafer into a grid pattern on a dicing frame 33 having a circular opening.
  • the dicing frame 33 is attached to the pallet main body 35 by screwing or the like.
  • the push-up unit 28 (see FIG. 2) is configured to be movable in the XY direction (horizontal direction) in the space area below the dicing sheet 34 of the wafer pallet 32. And the sticking part of the die 31 to be picked up (sucked) in the dicing sheet 34 is pushed up from below and pushed up locally by a push-up pin 39 (see FIGS. 4 and 5) of the pot 37, so that the die The sticking part of 31 is partly peeled off from the dicing sheet 34 so that the die 31 can be easily lifted.
  • the push-up unit 28 is configured such that the push-up unit 28 as a whole moves up and down using a servo motor 55 (see FIG. 6) as a drive source.
  • a servo motor 55 see FIG. 6
  • the push-up unit 28 rises and the upper surface of the push-up pot 37 rises to a predetermined sheet adsorbing position where it contacts or approaches the dicing sheet 34 of the wafer pallet 32, and the push-up unit 28 is moved by a stopper mechanism (not shown).
  • the push-up pin 39 protrudes upward from the upper surface of the push-up pot 37, and the die 31 to be picked up from the dicing sheet 34 is attached. The part is pushed up.
  • the push-up height position (push-up amount) of the push-up pin 39 can be adjusted by adjusting the rotation amount of the servo motor 55 serving as a drive source.
  • the suction head 41 and the camera 42 are assembled to the XY movement mechanism 25, and the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY movement mechanism 25. ing.
  • the suction head 41 is provided with a suction nozzle 43 (see FIGS. 4 and 5) that sucks the die 31 on the dicing sheet 34 so as to move up and down.
  • the camera 42 picks up the die 31 on the dicing sheet 34 from above and performs image processing on the picked-up image with the control device 51 (see FIG. 6) of the die supply device 11, so that the die to be sucked by the suction nozzle 43.
  • the position of 31 can be recognized.
  • the control device 51 (calculation means) of the die supply apparatus 11 includes a storage device 52 that stores various control programs and data, and an input device 53 (input means) such as a mouse, a keyboard, and a touch panel. Are connected to a display device 54 (display means) for displaying various types of information.
  • the control device 51 functions as a control unit that controls the suction operation of the suction head 41 and the push-up operation of the push-up pin 39 and also functions as an image processing unit. An image obtained by imaging the die 31 to be picked up by the camera 42 is processed to recognize the position of the die 31 to determine the push-up position and the suction position of the die 31. As shown in FIG.
  • the sticking part of the die 31 to be picked up is pushed up from below and locally pushed up by the push-up pin 39 of the pot 37, so that the sticking part of the die 31 is partially removed from the dicing sheet 34.
  • the die 31 is picked up by being sucked by the suction nozzle 43 while being lifted up so that the die 31 is easily picked up. We are backing up.
  • the position of the next die 31 (hereinafter referred to as “next suction die”) 31 is estimated based on the recognition position of the die 31 that has performed the suction operation this time, and the estimated position of the next suction die 31 is determined as the target imaging die.
  • the next suction die 31 is imaged by the camera 42, the position of the next suction die 31 is recognized, and the above-described push-up operation and suction operation are repeated, so that the die 31 on the dicing sheet 34 is moved. Adsorption is performed in a predetermined order.
  • the suction nozzle 43 when the suction nozzle 43 is lowered to suck the die 31 on the dicing sheet 34, if the height of the stop position of the lowering operation of the suction nozzle 43 (the lower limit position of the lowering stroke) becomes too low, the suction nozzle 43 If the lower end of the suction nozzle 43 hits the die 31 on the dicing sheet 34 too much, the die 31 may be damaged or cracked. On the contrary, if the height of the stop position of the lowering operation of the suction nozzle 43 is too high. The die 31 cannot be stably adsorbed to the adsorption nozzle 43.
  • the height and the horizontal position of the stop position of the lowering operation of the suction head 41 are measured using the adjustment jig 61 shown in FIG.
  • this measurement method will be described.
  • a holding portion 62 for positioning and holding the adjustment jig 61 on the suction head 41 is provided.
  • the holding portion 62 of the adjustment jig 61 has the same structure as the holding portion (not shown) at the upper end of the suction nozzle 43, and the adjustment jig 61 can be replaced with the suction nozzle 43 with respect to the suction head 41. It is detachably held by suction or engagement means.
  • the adjustment jig 61 is formed in a nozzle shape having the same height as the suction nozzle 43, and a stamp part 63 for imprinting on the surface of the die 31 is provided in the lower part thereof.
  • the stamp portion 63 is formed in a shape (for example, a taper shape, a spherical shape, etc.) that becomes narrower toward the lower side due to an elastically deformable porous material such as porous rubber or foamed elastic resin material, and the pressing amount to the die 31 is small.
  • the larger the size the larger the size of the stamp mark 66 (see FIG.
  • the stamp mark 66 has a circular shape, and the amount of pressing of the stamp portion 63 against the die 31 (the height of the stop position of the lowering operation of the suction head 41) and the size (for example, diameter) of the stamp mark 66 in advance. Table data or mathematical formulas that define the relationship between and are created by experimental data or the like and stored in the storage device 52.
  • the stamp part 63 is attached to a lower end part of a cylindrical ink tank part 64 protruding downward from the lower surface of the holding part 62, and the ink 65 filled in the ink tank part 64 soaks into the stamp part 63 little by little.
  • the holding unit 62 that closes the upper end opening of the ink tank unit 64 is configured to be detachable so that the user can replenish the ink 65 into the ink tank unit 64 by removing the holding unit 62 from the ink tank unit 64.
  • a disposable configuration in which the user cannot replenish the ink 65 in the ink tank unit 64 may be adopted.
  • the operation of measuring the stop position height and the horizontal position of the lowering operation of the suction head 41 using the adjustment jig 61 configured as described above is controlled by the control device 51 of the die supply device 11 as follows. Is done. First, the adjustment jig 61 is held on the suction head 41 of the die supply apparatus 11. The holding operation of the adjustment jig 61 may be performed manually by the operator, or a nozzle place for storing the replacement suction nozzle 43 and the adjustment jig 61 in the die supply device 11 (see FIG. (Not shown), the suction head 41 may be moved to the nozzle place by the XY moving mechanism 25 so that the adjustment jig 61 is automatically held by the suction head 41.
  • the wafer pallet 32 is pulled out from the magazine of the die supply apparatus 11 onto the pallet pulling table 23 by the pallet pulling mechanism 56. Thereafter, the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the die 31 on the wafer pallet 32 to lower the suction head 41 in the same manner as the die suction operation. As shown in FIG. 8, the adjustment jig 61 is lowered, and the stamp portion 63 of the adjustment jig 61 is pressed against the surface of the die 31, and the pressing amount of the stamp portion 63 is pressed against the surface of the die 31. A stamp mark 66 having a size corresponding to the above is stamped.
  • the push-up operation of the push-up pin 39 may not be performed, or the stamp portion 63 is pressed against the surface of the die 31 while performing the push-up operation of the push-up pin 39 in the same manner as the die suction operation. May be stamped.
  • the pressing amount of the stamp portion 63 (the height of the stop position of the lowering operation of the suction head 41) may be measured in consideration of the pushing height of the die 31 by the pushing operation of the pushing pin 39.
  • the adjustment jig 61 is raised to its original height, and then the camera 42 is moved above the stamp mark 66 by the XY moving mechanism 25 and the stamp mark 66 is imaged by the camera 42.
  • the image signal is transmitted to the control device 51.
  • the control device 51 recognizes the stamp mark 66 by processing the received image signal, measures the size (for example, diameter) of the stamp mark 66, and uses the table data or the mathematical formula stored in the storage device 52. Using the size of the stamp mark 66, the pressing amount of the stamp part 63 and the height of the stop position of the lowering operation of the suction head 41 are calculated and displayed on the display device 54.
  • control device 51 measures the XY coordinate of the center of the recognized stamp mark 66 and displays the XY coordinate on the display device 54 as the XY coordinate of the center of the suction head 41 (the horizontal position of the suction head 41).
  • the stamp portion 63 of the adjustment jig 61 has the stamp mark 66 that is stamped on the surface of the die 31 as the pressing amount against the die 31 (the descending amount of the stamp portion 63) increases. Since the size is increased, the adjustment head 61 is held by the suction head 41 instead of the suction nozzle 43, and the suction head 41 is moved down in the same manner as the die suction operation. If the jig 61 is lowered and the stamp portion 63 of the adjustment jig 61 is pressed against the surface of the die 31, the stamp mark 66 having a size corresponding to the pressing amount of the stamp portion 63 is pressed against the surface of the die 31. Can be stamped.
  • the size of the stamp mark 66 stamped on the surface of the die 31 increases, that is, the height of the stop position of the lowering operation of the suction head 41 decreases. Therefore, the height of the stop position of the lowering operation of the suction head 41 (suction nozzle 43) can be easily and accurately measured from the size of the stamp mark 66 stamped on the surface of the die 31.
  • the size of the stamp mark 66 stamped on the surface of the die 31 by the operator may be measured visually or with a measuring instrument such as a ruler.
  • the stamp portion 63 is formed in a shape (for example, a taper shape, a spherical shape, etc.) that becomes thinner toward the lower side by a porous material that can be elastically deformed.
  • the rate of change of the size of the stamp mark 66 with respect to the amount (descent amount) is increased, and the measurement accuracy of the height of the stop position of the lowering operation of the suction head 41 (suction nozzle 43) can be improved.
  • the shape of the stamp part 63 is not limited to the tapered shape, and may be any shape such as a columnar shape as long as it can be elastically deformed.
  • the shape of the stamp mark 66 is not limited to a circle, and may be any shape as long as the center position of the stamp mark 66 is uniquely specified, such as a square or a regular polygon.
  • the adjustment jig 61 is provided with the ink tank portion 64 that supplies the ink 65 to the stamp portion 63, so that the operation (operation) for attaching the ink to the stamp portion 63 can be omitted. Can be performed efficiently.
  • the adjustment jig 61 may not be provided with the ink tank portion 64. In this case, the operation of attaching the ink to the stamp portion 63 before the stamping operation is performed automatically or manually. Just do it.
  • the die 31 there may be a die 31 that cannot be stamped with the stamp mark 66, or the die 31 that has stamped the stamp mark 66 may not be mounted.
  • the height of the stop position of the lowering operation of the suction head 41 is measured using the sheet pallet 68 shown in FIG. 9 instead of the wafer pallet 32. ing.
  • substantially the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted or simplified. Mainly, the parts different from the first embodiment are denoted by different reference numerals.
  • the sheet pallet 68 used in the second embodiment is obtained by attaching a sheet stretching body 69 to the pallet main body 35 common to the wafer pallet 32 by screwing or the like.
  • the sheet stretching body 69 is the wafer stretching body 30.
  • the sheet 70 to which the die 31 is not attached is attached to the common dicing frame 33.
  • the sheet 70 may be a dicing sheet 34 or a commercially available sheet (film, paper, or the like).
  • the stamp mark 66 is easily stamped clearly and is stamped by image processing. A sheet that easily recognizes 66 may be used.
  • the operator sets the sheet pallet 68 in the magazine of the die supply device 11, and the magazine Then, the sheet pallet 68 is pulled out onto the pallet pulling table 23 by the pallet pulling mechanism 56. Thereafter, the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the sheet 70 of the sheet tension body 69 of the sheet pallet 68 to move the suction head 41 in the same manner as the die suction operation.
  • the adjustment jig 61 is lowered to press the stamp portion 63 of the adjustment jig 61 against the surface of the sheet 70, and according to the pressing amount of the stamp portion 63 against the surface of the sheet 70.
  • a stamp mark 66 of a certain size is impressed.
  • the push-up pin 39 is not pushed up, and the push-up pin 39 prevents the sheet 70 from being pushed up.
  • the stamp portion 63 is pressed against the surface of the sheet 70
  • the lower surface side of the sheet 70 is reinforced by a plate (not shown) or the like so that the sheet 70 is not recessed downward.
  • the adjustment jig 61 is raised to the original height position, the camera 42 is moved above the stamp mark 66 by the XY movement mechanism 25, and the stamp mark 66 is imaged by the camera 42.
  • the image is processed by the control device 51 to recognize the stamp mark 66, the size (for example, diameter) of the stamp mark 66 is measured, and the table data or mathematical formula stored in the storage device 52 is used. Based on the size of the stamp mark 66, the pressing amount of the stamp portion 63 and the height of the stop position of the lowering operation of the suction head 41 are calculated and displayed on the display device 54.
  • the component parts of the wafer pallet 32 and the sheet pallet 68 are made common.
  • the sheet pallet is configured such that, for example, the sheet is placed on a plate-like pallet body that can be pulled out by the pallet pulling mechanism 56. It is good also as a structure fixed so that replacement
  • Embodiment 3 of the present invention will be described with reference to FIG.
  • substantially the same parts as those in the first and second embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified.
  • the horizontal position information (XY direction) of the suction head 41 and the push-up pin 39 is measured as follows.
  • the lower surface side of the sheet 70 of the sheet pallet 68 is not reinforced by a plate or the like, and the push-up pin 39 pushes up the sheet 70 so that a push-up mark 71 can be made on the sheet 70.
  • the operator sets the sheet pallet 68 in the magazine of the die supply device 11, and pulls out the sheet pallet 68 from the magazine onto the pallet pulling table 23 by the pallet pulling mechanism 56.
  • the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the sheet 70 of the sheet pallet 68 and the suction head 41 is moved down in the same manner as the die suction operation to perform the adjustment.
  • the jig 61 is lowered, the stamp portion 63 of the adjustment jig 61 is pressed against the surface of the sheet 70, the stamp mark 66 is pressed onto the surface of the sheet 70, and the push-up pin 39 is pushed up.
  • a push-up mark 71 is formed on the sheet 70.
  • the adjustment jig 61 is raised to the original height position, and the camera 42 is moved to a position where both the stamp mark 66 and the push-up mark 71 can be accommodated by the XY moving mechanism 25, and the stamp mark is moved by the camera 42.
  • 66 and the pick-up trace 71 are imaged, and the image is processed by the control device 51 to recognize the stamp mark 66 and the push-up mark 71, so that the horizontal position of the suction head 41 and the horizontal position of the push-up pin 39 are determined.
  • the horizontal displacement amount of the suction head 41 and the horizontal displacement amount of the push pin 39 from the center of the image (the horizontal position of the suction head 41 and the push pin 39 when there is no displacement). Is calculated.
  • control device 51 determines whether or not the horizontal displacement amount of the suction head 41 and the push-up pin 39 is within an allowable range, and the horizontal displacement amount of the suction head 41. Is determined to exceed the permissible range, the horizontal reference position of the XY moving mechanism 25 that moves the suction head 41 in the horizontal direction is corrected based on the amount of positional deviation, and the corrected reference position is determined. The position of the suction head 41 in the horizontal direction is controlled with reference. When it is determined that the horizontal displacement amount of the push-up pin 39 exceeds the allowable range, a moving mechanism (not shown) for moving the push-up unit 28 in the horizontal direction based on the displacement amount. The horizontal reference position is corrected, and the horizontal position of the push-up unit 28 is controlled based on the corrected reference position. In this way, the horizontal displacement between the suction head 41 and the push-up pin 39 can be automatically corrected.
  • an automatic correction mode for automatically correcting a horizontal position shift (reference position shift) between the suction head 41 and the push-up pin 39, and correction of the position shift by the operator operating the input device 53.
  • the manual correction mode for manually setting the amount can be switched, and when the operator selects the manual correction mode, the operator looks at the information on the positional deviation displayed on the display device 54, and the positional deviation is detected. Determine the amount of correction and set manually.
  • the horizontal positional relationship between the suction head 41 and the push-up pin 39 is simplified based on the horizontal positional relationship between the stamp mark 66 stamped on the surface of the sheet 70 and the push-up trace 71. Can be measured accurately.
  • the shape of the stamp mark 66 is not limited to a circle, and may be any shape as long as the center position of the stamp mark 66 is uniquely specified, such as a square or a regular polygon. .
  • the operator may measure the horizontal positional relationship between the stamp mark 66 stamped on the surface of the sheet 70 and the push-up trace 71 with an instrument such as a visual check or a ruler.
  • the stamp portion 63 of the adjustment jig 61 is formed to be an annular stamp mark 72, and this adjustment jig 61 is used to perform the third embodiment.
  • the position information in the horizontal direction (XY direction) of the suction head 41 and the push-up pin 39 is measured by the same method.
  • the shape of the stamp mark 72 is an annular shape as in the fourth embodiment, even if the stamp mark 72 is large, the push-up trace 71 does not overlap the stamp mark 72 and the push-up trace 71 can be easily recognized. There is.
  • the adjustment jig 61 used in the fourth embodiment may be used in the first and second embodiments.
  • an annular stamp mark 72 may be stamped across a plurality of dies 31.
  • Embodiment 5 of the present invention will be described with reference to FIG.
  • substantially the same parts as in the first to third embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified.
  • the push-up height of the push-up pin 39 is measured as follows. As in the first embodiment, the wafer pallet 32 is pulled out from the magazine of the die supply apparatus 11 onto the pallet pulling table 23 by the pallet pulling mechanism 56 and is also adjusted by the adjustment jig 61 held on the suction head 41 by the XY moving mechanism 25. Is moved above the die 31 on the wafer pallet 32 and the suction head 41 is moved downward so that the stamp 63 of the adjustment jig 61 is in contact with or close to the surface of the die 31.
  • the push-up pin 39 positioned immediately below the jig 61 is pushed up, the dicing sheet 34 is pushed up by the push-up pin 39, and the die 31 on the push-up portion of the dicing sheet 34 is pressed against the stamp portion 63.
  • a stamp mark 66 is imprinted on the surface of.
  • the camera 42 captures an image of the stamp mark 66, and the captured image is processed by the control device 51 to measure the size (for example, diameter) of the stamp mark 66 and stored in the storage device 52.
  • the pressing amount of the stamp portion 63 and the push-up height of the push-up pin 39 are calculated from the size of the stamp mark 66 and displayed on the display device 54.
  • the operation for measuring the push-up height of the push-up pin 39 is repeated a plurality of times by changing the push-up height of the push-up pin 39 by a predetermined amount so that the size of the stamp mark 66 becomes a predetermined size.
  • An automatic push-up height adjustment mode for automatically adjusting the push-up height of the pin 39 to a target height is set.
  • a manual push-up height adjustment mode in which the operator operates the input device 53 to adjust the push-up height of the push-up pin 39 is set, and the operator selects the manual push-up height adjustment mode, the operator By looking at the measurement value displayed on the display device 54, the push-up height of the push-up pin 39 can be arbitrarily adjusted by operating the input device 53.
  • the push-up height of the push-up pin 39 can be easily and accurately measured.
  • the operator may measure the push-up height of the push-up pin 39 by measuring the size of the stamp mark 66 imprinted on the surface of the die 31 with an instrument such as a visual or ruler.
  • Embodiment 6 of the present invention will be described with reference to FIG.
  • substantially the same parts as those in the first to fifth embodiments are denoted by the same reference numerals, and description thereof is omitted or simplified.
  • the die 31 there may be a die 31 that cannot be stamped with the stamp mark 66, or the die 31 that has stamped the stamp mark 66 may not be mounted. In the case of the die 31 that is easily broken, if the die 31 is pushed up by the push-up pin 39 and pressed too strongly against the stamp part 63, the die 31 may be broken.
  • the push-up height of the push-up pin 39 is measured as follows.
  • the shape of the stamp portion 63 of the adjustment jig 61 is a cylindrical shape, but it may be a tapered shape or a spherical shape similar to that of the first embodiment.
  • the operator sets the sheet pallet 68 in the magazine of the die supply apparatus 11 and pulls out the sheet pallet 68 from the magazine onto the pallet pulling table 23 by the pallet pulling mechanism 56. Thereafter, the adjustment jig 61 held by the suction head 41 by the XY moving mechanism 25 is moved above the sheet 70 of the sheet pallet 68 to move the suction head 41 downward, and the stamp of the adjustment jig 61 is moved.
  • the push-up pin 39 located immediately below the adjustment jig 61 is pushed up to push up the sheet 70 with the push-up pin 39 and The stamped portion is pressed against the stamp portion 63 to stamp the stamp mark 66 on the surface of the sheet 70.
  • the stamp mark 66 is imaged by the camera 42, the captured image is processed by the control device 51, the size (for example, diameter) of the stamp mark 66 is measured, and the table data or formula stored in the storage device 52. Is used to calculate the pressing amount of the stamp portion 63 and the pushing height of the push-up pin 39 from the size of the stamp mark 66 and display it on the display device 54.
  • Example 7 of the present invention will be described with reference to FIGS.
  • substantially the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted or simplified.
  • the stamp portion 82 of the adjustment jig 61 is formed in a shape in which the direction of the stamp mark 83 to be stamped on the surface of the die 31 is specified.
  • two stamp portions 82 are provided at predetermined intervals in the X direction or Y direction below the ink tank portion 64 of the adjustment jig 61, and the ink in the ink tank portion 64 is provided to each stamp portion 82. It is configured to supply.
  • the two stamp portions 82 are formed in the same shape by an elastically deformable porous material, and have the same downward projecting dimensions.
  • the shape of each stamp portion 82 may be any shape such as a columnar shape, a tapered shape, a spherical shape, or the like.
  • stamps to be imprinted on the surface of the die 31 by the two stamp portions 82 are used. Any shape that can identify the orientation of the mark 83 may be used. Accordingly, the present invention is not limited to the configuration in which the two stamp portions 82 are provided, and even if the adjustment jig 61 has only one stamp portion, the stamp mark to be stamped on the surface of the die 31 is not limited. What is necessary is just to form in the shape (for example, elongate rectangle) which can specify direction.
  • the orientation of the wafer pallet 32 may be slightly inclined in the horizontal direction. In this case, there is a possibility that the relationship between the suction position of the suction nozzle 43 and the position of each die 31 on the dicing sheet 34 is shifted, and the die 31 cannot be stably suctioned to the suction nozzle 43.
  • the horizontal tilt angle of each die 31 on the wafer pallet 32 is measured using the adjustment jig 61 shown in FIG. 14 as follows.
  • the wafer pallet 32 is pulled out from the magazine of the die supply apparatus 11 onto the pallet pull-out table 23 by the pallet pull-out mechanism 56, and the adjustment jig 61 held by the suction head 41 is moved onto the wafer pallet 32.
  • the suction head 41 is moved downward in the same manner as the die suction operation by lowering the adjustment jig 61 and pressing the two stamp portions 82 against the surface of the die 31. Then, two stamp marks 83 are imprinted on the surface of the die 82.
  • the two dies 31 on which the two stamp marks 83 are impressed are captured by the camera 42, and the captured image is processed by the control device 51 to recognize the two stamp marks 83 and the two dies 31. Then, the horizontal inclination angle of the line connecting the centers of the two dies 31 is calculated with reference to the line connecting the centers of the two stamp marks 83.
  • control device 51 determines whether or not the horizontal inclination angle is within the allowable range, and determines that the horizontal inclination angle exceeds the allowable range. Calculates the amount of horizontal displacement of each die 31 on the dicing sheet 34 based on the horizontal inclination angle, and corrects the displacement of the suction position of each die 31 on the dicing sheet 34 based on the calculation result. To do. In this way, it is possible to automatically correct the deviation of the suction position of each die 31 on the dicing sheet 34 due to the inclination of the wafer pallet 32.
  • the measured horizontal tilt angle and information on the positional deviation are displayed on the display device 54.
  • the manual correction mode for manually setting the amount can be switched, and when the operator selects the manual correction mode, the operator looks at the information displayed on the display device 54 and determines the correction amount of the suction position. It can be set manually.
  • the direction of the stamp 31 is changed from the direction of the stamp mark 83 (horizontal inclination angle).
  • the tilt angle in the horizontal direction can be measured easily and accurately.
  • the operator may measure the direction (inclination angle in the horizontal direction) of the stamp mark 83 visually or with a meter such as a protractor.
  • the die supply apparatus 11 used in each of the first to seventh embodiments is configured such that the suction head 41 and the camera 42 are integrally moved in the XY directions by the XY moving mechanism 25.
  • the suction head 41 and the camera 42 are Even if the wafer pallet 32 is moved only in the X direction and the wafer pallet 32 is moved in the Y direction on the pallet drawing table 23, the position of the die 31 to be imaged / sucked may be moved in the XY direction. good.
  • the present invention can be implemented with various modifications within a range not departing from the gist, such as the structure of the die supply apparatus 11 and the structure of the wafer pallet 32 may be appropriately changed.
  • Pallet drawer mechanism 61 ... Adjustment jig, 62 ... Holding section, 63 ... Stamp part, 64 ... Ink tank part, 65 ... Ink, 66 ... Stamp mark, 68 ... Sheet pallet, 69 ... Sheet stretched body, 7 ... seat, 71 ... push-up marks, 72 ... stamp mark, 82 ... stamp unit, 83 ... stamp mark

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Selon l'invention, la partie de poinçon (63) d'un gabarit de réglage (61) est formée de telle sorte qu'au fur et à mesure que la quantité de pression contre une puce (31) augmente, la taille d'une marque de poinçon (66) imprimée sur la surface de la puce (31) soit plus importante. La tête d'aspiration (41) du dispositif de fourniture de puce (11) maintient le gabarit de réglage (61) à la place d'une buse d'aspiration (43) et est destinée à descendre de la même manière qu'une opération d'aspiration de puce pour permettre au gabarit de réglage (61) de descendre et à la partie de poinçon (63) du gabarit de réglage (61) d'appuyer sur la surface d'une puce (31), ce qui permet d'imprimer une marque de poinçon (66) sur la surface de la puce (31), ladite marque de poinçon (66) présentant une taille dépendant de la quantité de pression de la partie de poinçon (63). Au fur et à mesure que la position de descente de la tête d'aspiration (41) baisse, la quantité de pression de la partie de poinçon (63) devient plus importante et la taille de la marque de poinçon (66) devient plus importante. Par conséquent, sur la base de la taille de la marque de poinçon (66), la hauteur d'une position d'arrêt lors de l'opération de descente de la tête d'aspiration (41) est mesurée.
PCT/JP2013/082385 2013-12-02 2013-12-02 Système de réglage de dispositif de fourniture de puce et gabarit de réglage WO2015083221A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015551304A JP6112688B2 (ja) 2013-12-02 2013-12-02 ダイ供給装置調整システム及び調整用治具
PCT/JP2013/082385 WO2015083221A1 (fr) 2013-12-02 2013-12-02 Système de réglage de dispositif de fourniture de puce et gabarit de réglage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/082385 WO2015083221A1 (fr) 2013-12-02 2013-12-02 Système de réglage de dispositif de fourniture de puce et gabarit de réglage

Publications (1)

Publication Number Publication Date
WO2015083221A1 true WO2015083221A1 (fr) 2015-06-11

Family

ID=53273019

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/082385 WO2015083221A1 (fr) 2013-12-02 2013-12-02 Système de réglage de dispositif de fourniture de puce et gabarit de réglage

Country Status (2)

Country Link
JP (1) JP6112688B2 (fr)
WO (1) WO2015083221A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111868901A (zh) * 2018-03-28 2020-10-30 东丽工程株式会社 工具高度调整装置以及具有该装置的芯片部件转印装置
WO2021070782A1 (fr) * 2019-10-11 2021-04-15 上野精機株式会社 Dispositif de traitement de composant électronique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274134A (ja) * 1996-04-22 1996-10-18 Tokyo Electron Ltd 不良素子へのマーキング方法
JP2006339211A (ja) * 2005-05-31 2006-12-14 Kawasaki Microelectronics Kk 半導体装置ダイの選別方法及び半導体基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5596929B2 (ja) * 2009-02-12 2014-09-24 富士機械製造株式会社 突き上げピンの位置決め方法およびその方法を用いた電子部品供給装置
JP5892735B2 (ja) * 2011-05-12 2016-03-23 富士機械製造株式会社 突き上げピンの位置補正方法
JP5800383B2 (ja) * 2011-06-21 2015-10-28 富士機械製造株式会社 部品実装機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274134A (ja) * 1996-04-22 1996-10-18 Tokyo Electron Ltd 不良素子へのマーキング方法
JP2006339211A (ja) * 2005-05-31 2006-12-14 Kawasaki Microelectronics Kk 半導体装置ダイの選別方法及び半導体基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111868901A (zh) * 2018-03-28 2020-10-30 东丽工程株式会社 工具高度调整装置以及具有该装置的芯片部件转印装置
KR20200136906A (ko) * 2018-03-28 2020-12-08 토레이 엔지니어링 컴퍼니, 리미티드 툴 높이 조정 장치 및 이것을 구비한 칩 부품 전사 장치
KR102633517B1 (ko) 2018-03-28 2024-02-06 토레이 엔지니어링 컴퍼니, 리미티드 툴 높이 조정 장치 및 이것을 구비한 칩 부품 전사 장치
CN111868901B (zh) * 2018-03-28 2024-06-21 东丽工程株式会社 工具高度调整装置以及具有该装置的芯片部件转印装置
WO2021070782A1 (fr) * 2019-10-11 2021-04-15 上野精機株式会社 Dispositif de traitement de composant électronique
JP2021064658A (ja) * 2019-10-11 2021-04-22 上野精機株式会社 電子部品の処理装置

Also Published As

Publication number Publication date
JP6112688B2 (ja) 2017-04-12
JPWO2015083221A1 (ja) 2017-03-16

Similar Documents

Publication Publication Date Title
JP6290912B2 (ja) 吸着ノズル及び部品装着機
WO2017029750A1 (fr) Dispositifs de montage de composants
JP5800383B2 (ja) 部品実装機
WO2016147331A1 (fr) Dispositif d'alimentation en composants
US10477748B2 (en) Component mounting device and component mounting method
JP6280817B2 (ja) 部品装着装置
JP2013110182A (ja) ウエハ関連データ管理方法及びウエハ関連データ作成装置
JP6112688B2 (ja) ダイ供給装置調整システム及び調整用治具
JP6103745B2 (ja) 突き上げ高さ計測システム
WO2014083606A1 (fr) Dispositif de distribution pour filière
JP2013105773A (ja) ダイ突き上げ動作管理システム
US20150258776A1 (en) Screen printing machine and screen printing method
JP6967696B2 (ja) 部品搭載装置および部品搭載方法
JP6886981B2 (ja) 部品実装機
US9393775B2 (en) Screen printing machine and screen printing method
JP6546697B2 (ja) 基板サポート装置、スクリーン印刷装置、塗布装置、表面実装機、及び、バックアップピン段取り方法
JPWO2014097463A1 (ja) ダイ供給装置
JP6956316B2 (ja) 部品搭載システムおよび搬送用パレットの評価方法
JP7410826B2 (ja) ピンの位置ずれ測定装置およびダイ供給装置
JP6891281B2 (ja) 部品実装装置
WO2018061151A1 (fr) Appareil de montage de composant
JP2012064752A (ja) ダイ供給装置
JP2018041880A (ja) 部品供給装置
JP2022080401A (ja) 部品装着機およびノズルメンテナンス装置
JPWO2017006461A1 (ja) 部品実装機、および部品実装ライン

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13898791

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2015551304

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13898791

Country of ref document: EP

Kind code of ref document: A1