JP6112688B2 - ダイ供給装置調整システム及び調整用治具 - Google Patents

ダイ供給装置調整システム及び調整用治具 Download PDF

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Publication number
JP6112688B2
JP6112688B2 JP2015551304A JP2015551304A JP6112688B2 JP 6112688 B2 JP6112688 B2 JP 6112688B2 JP 2015551304 A JP2015551304 A JP 2015551304A JP 2015551304 A JP2015551304 A JP 2015551304A JP 6112688 B2 JP6112688 B2 JP 6112688B2
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Japan
Prior art keywords
die
stamp
sheet
push
adjustment jig
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JP2015551304A
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Japanese (ja)
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JPWO2015083221A1 (ja
Inventor
早川　昌志
昌志 早川
友則 岩瀬
友則 岩瀬
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Fuji Corp
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Fuji Machine Manufacturing Co Ltd
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Publication of JPWO2015083221A1 publication Critical patent/JPWO2015083221A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015551304A 2013-12-02 2013-12-02 ダイ供給装置調整システム及び調整用治具 Active JP6112688B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/082385 WO2015083221A1 (fr) 2013-12-02 2013-12-02 Système de réglage de dispositif de fourniture de puce et gabarit de réglage

Publications (2)

Publication Number Publication Date
JPWO2015083221A1 JPWO2015083221A1 (ja) 2017-03-16
JP6112688B2 true JP6112688B2 (ja) 2017-04-12

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JP2015551304A Active JP6112688B2 (ja) 2013-12-02 2013-12-02 ダイ供給装置調整システム及び調整用治具

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JP (1) JP6112688B2 (fr)
WO (1) WO2015083221A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6752250B2 (ja) * 2018-03-28 2020-09-09 東レエンジニアリング株式会社 ツール高さ調整装置およびこれを備えたチップ部品転写装置
JP6872261B2 (ja) * 2019-10-11 2021-05-19 上野精機株式会社 電子部品の処理装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2726651B2 (ja) * 1996-04-22 1998-03-11 東京エレクトロン株式会社 不良素子へのマーキング方法
JP2006339211A (ja) * 2005-05-31 2006-12-14 Kawasaki Microelectronics Kk 半導体装置ダイの選別方法及び半導体基板
JP5596929B2 (ja) * 2009-02-12 2014-09-24 富士機械製造株式会社 突き上げピンの位置決め方法およびその方法を用いた電子部品供給装置
JP5892735B2 (ja) * 2011-05-12 2016-03-23 富士機械製造株式会社 突き上げピンの位置補正方法
JP5800383B2 (ja) * 2011-06-21 2015-10-28 富士機械製造株式会社 部品実装機

Also Published As

Publication number Publication date
WO2015083221A1 (fr) 2015-06-11
JPWO2015083221A1 (ja) 2017-03-16

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