TWI822363B - Pick-up and installation devices - Google Patents

Abstract

The present invention provides a pickup device and a mounting device that can pick up electronic components in a non-contact manner and position the electronic components. An embodiment is a pick-up device having a pick-up collet and a direction changing unit, the pick-up collet having a porous member having air permeability, and supplying electronic components via pores on an opposing surface. The gas inside is sprayed out in a planar shape. The porous member is provided with a suction hole and a guide part. The suction hole has an opening on the opposite surface to suck the electronic components through negative pressure. The guide part is arranged along the electron The direction changing unit is arranged in such a manner as to form the outer edge of the component to restrict the movement of the electronic component held by the opposing surface. The direction changing unit has: a rotation unit that rotates the pickup collet in such a manner that the opposing surface is reversed from the supply position of the electronic component; and an angle. The changing part changes the angle of the pickup collet along a surface parallel to the opposing surface.

Description

Pick-up and installation devices

The invention relates to a picking device and a mounting device.

When electronic components, such as logic devices, memories, and image sensors, which are semiconductor elements, are mounted on a substrate, the wafer on which the semiconductor elements are formed is cut into individual wafers. Then, the wafers are picked up one by one by a pick-up device, transferred to the substrate, and mounted using a loading device. Various devices have been proposed as mounting devices used when mounting such semiconductors on a substrate. As one of them, a device including a transfer device for electronic components such as wafers, a supply device, and a substrate stage is known. Furthermore, the transfer device is provided with a pickup device, a loading device, and their control devices. The pick-up device picks up electronic components from the supply device and delivers the picked-up electronic components to the mounting device.

One surface of the wafer becomes a functional surface on which fine circuits are formed. When picking up the wafer from the wafer, if the picked up member comes into direct contact with the functional surface, there is a risk of damage to the circuit, etc., so there is a demand to avoid contact.

Furthermore, the connection terminals on the surface of the wafer and the connection terminals on the substrate are joined to face each other. At this time, in order to ensure and improve the bonding properties between the connection terminals, the surface of the wafer may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the surface condition of the wafer subjected to such processing, there is also a requirement to avoid direct contact between the picked-up member and the surface of the wafer.

In order to cope with the requirement that the member does not come into contact with the surface of the wafer, conventionally, in collets as members for picking up wafers, the surface holding the wafer is made into a tapered surface, so that only the peripheral edge portion of the collet is tapered with the collet, not the surface of the wafer. The state of surface contact is sucked and maintained from the center of the wafer (see Patent Document 1). [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. Sho 63-124746

[Problem to be solved by the invention]

However, in the conventional technology as described above, only the peripheral portion of the wafer comes into contact with the collet, and suction is performed from the center portion of the wafer. Therefore, the wafer is prone to strain, which may lead to chip defects or cracks. Furthermore, the collet is in contact with the peripheral edge portion of the wafer, and the contact portion is used to support the sucked wafer. Therefore, stress is concentrated on the peripheral portion, which easily causes defects and cracks. Furthermore, since the holding position of the wafer is fixed in the suction-holding state, if the wafer is shifted or tilted during the suction-holding, it cannot be corrected when it is subsequently transferred to the mounting device.

Embodiments of the present invention were made to solve the above-described problems, and an object thereof is to provide a pickup device and a mounting device that can pick up electronic components in a non-contact manner and position the electronic components. [Means to solve the problem]

An embodiment of the present invention is a pickup device that has a rectangular outer edge and picks up electronic components. The pickup device has: a pickup collet that suctions and holds the electronic components; and a direction changing portion that changes the direction of the pickup collet. In this direction, the pickup collet is provided with a porous member having air permeability, and the gas supplied to the inside is ejected in a planar shape through the pores on the opposing surface facing the electronic component. The porous member is provided with a suction hole, the suction hole has an opening on the opposing surface, and the electronic component is suctioned by negative pressure, and is provided with a guide portion to follow the electronic components. The direction changing unit is arranged on the outer edge of the component to restrict the movement of the electronic component held by the opposing surface, and the direction changing unit includes a rotation unit that reverses the supply position of the electronic component with the opposing surface. The method of rotating the pickup collet; and the angle changing part changing the angle of the pickup collet along a surface parallel to the opposing surface.

Furthermore, the mounting device according to the embodiment of the present invention includes: the pickup device; a bonding head that is disposed movably relative to the pickup collet and receives the electronic component from the pickup collet; and a mounting device. , the electronic component held by the bonding head is transferred to the substrate and mounted. [Effects of the invention]

According to the pickup device and the mounting device of the embodiment of the present invention, electronic components can be picked up and positioned in a non-contact manner.

Embodiments of the present invention will be described with reference to the drawings. In addition, the drawings are schematic diagrams, and the dimensions, ratios, etc. of each part include exaggerated portions for easy understanding. As shown in FIGS. 1 and 2 , the pickup collet 200 of this embodiment is used in the transfer device 1 of the electronic components 2 . The transfer device 1 includes a pickup device 20 , a mounting device 30 , and a control device 50 , and is a device that transfers the electronic components 2 to the mounting device 30 using the pickup device 20 .

The electronic component 2 is, for example, a rectangular thin chip component. In this embodiment, the electronic component 2 is a semiconductor wafer obtained by dividing a wafer into individual pieces. The semiconductor wafer has a functional surface that functions as a semiconductor element on one of the front and back surfaces. Furthermore, the mounting device 100 is a device that mounts the electronic components 2 supplied from the supply device 10 on the substrate through transfer by the transfer device 1 . That is, the mounting device 100 includes the supply device 10 and the substrate stage 60 that supports the substrate in addition to the structure of the transfer device 1 .

The supply device 10 is a device that supplies the electronic components 2 to the pickup device 20 . The supply device 10 moves the electronic component 2 to be picked up to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 as a pickup target. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic components 2 are attached, and a stage moving mechanism 13 that moves the supply stage 12 . The stage moving mechanism 13 may use, for example, a linear guide that moves a slider on a track using a ball screw mechanism driven by a servo motor.

Here, the sheet 11 on which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). On the sheet 11, the electronic components 2 are arranged in a matrix. In this embodiment, the electronic component 2 is arranged in an upward state with its functional surface exposed upward.

The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 on which the electronic component 2 is attached via the wafer ring. The supply stage 12 is provided movably in the horizontal direction by a stage moving mechanism 13 . Since the sheet 11 is supported horizontally by the supply stage 12 and the stage moving mechanism 13, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided to be movable in the horizontal direction.

In addition, as shown in FIG. 1 , the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Furthermore, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction is the direction with the plane of the sheet 11 as a boundary and the side where the electronic components 2 are placed, and the downward direction is the direction with the plane of the sheet 11 as a boundary and the side where the electronic components 2 are not placed. The θz direction is the direction of rotation on the plane parallel to the XY plane, and the θx direction is the direction of rotation on the plane parallel to the ZY plane.

[pickup device] The pickup device 20 is a device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30 . The pickup device 20 includes a pickup collet 200 , a collet moving mechanism 22 , a direction changing part 23 , and an upper push button 24 .

As shown in FIGS. 3 to 5 , the pick-up collet 200 is a member that suction-holds the electronic components 2 and releases the suction-holding to release the electronic components 2 . The pickup collet 200 has a porous member 201, a base 202, and a guide part 203.

The porous member 201 is a member that has air permeability and supplies gas supplied to the inside through the pores of the opposing surface 201 a facing the electronic component 2 (in addition, in the following description, the gas supplied to the electronic component 2 is denoted by a symbol G (illustrated). The porous member 201 of this embodiment has a rectangular parallelepiped plate shape, and is densely and substantially uniformly formed with interconnected fine spaces as a whole. The porous member 201 has air permeability due to the above-mentioned structure, but its flow conductivity is very small. Either surface of the porous member 201 serves as the opposing surface 201a. If gas is supplied into the interior from the back surface 201b opposite to the opposing surface 201a, the gas will be ejected from the dense and uniform pores of the opposing surface 201a. The discharge is a substantially planar discharge that spreads over the entire surface of the facing surface 201 a where the discharge is directed. The ejection is extremely slow, and it can be said to be an oozing feeling, to the extent that you can feel the airflow slightly when you get close to your finger. In addition, pores on surfaces other than the opposing surface 201a and the back surface 201b may be clogged.

The porous member 201 is a continuous structure in which pores serving as internal microspaces are connected to each other and gas can pass between the pores as described above. As this porous member 201, sintered metal, ceramics, resin, etc. can be used. From the viewpoint that the particles inside are difficult to separate and flow out, it is preferable to use sintered metal.

Furthermore, as shown in FIGS. 3 and 4 , the porous member 201 is provided with a suction hole 201 c , which is a through hole having an opening 201 d on the opposing surface 201 a and sucking the electronic component 2 by negative pressure. The suction hole 201c of this embodiment linearly penetrates from the center of the back surface 201b to the center of the opposing surface 201a.

The base 202 is a member that covers the surfaces of the porous member 201 other than the facing surface 201a. The base 202 of this embodiment is a rectangular parallelepiped box with an open bottom. The outer edge of the rectangle of the pickup collet 200 is formed by the shape of the base 202 . The porous member 201 is inserted from the opening of the base 202 so that the bottom surface becomes the facing surface 201a and is exposed, and is assembled into the base 202 and fixed.

As shown in FIGS. 3 and 5 , an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c are provided on the top surface of the base 202. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed close to the outer edge of the base 202 by a pipe connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating negative pressure in the opening 201d via the suction hole 201c. The exhaust hole 202b extends downward and is formed in line with the suction hole 201c of the porous member 201. A space in which gas accumulates is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. In addition, the exhaust hole 202b may penetrate the suction hole 201c and reach the opposing surface 201a. In this case, the suction hole 201c and the opening 201d of the porous member 201 are provided in close contact with the outside of the exhaust hole 202b reaching the facing surface 201a of the porous member 201. The mounting holes 202c are a pair of recessed holes for preventing offset when connected to the collet moving mechanism 22 .

The gas supply hole 202a is connected to a gas supply circuit via a pipe (not shown). The supply circuit is composed of a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 201 via the gas supply hole 202a is an inert gas. The exhaust hole 202b is connected to a negative pressure generating circuit including a vacuum pump, a valve, and the like via piping (not shown).

The guide portion 203 is a member arranged along the outer edge of the electronic component 2 and restricting the movement of the electronic component 2 held by the opposing surface 201a. The so-called "along the outer edge of the electronic component 2" only needs to be arranged in the direction along the outer edge, and the guide portion 203 does not necessarily need to be in contact with the electronic component 2. The guide portion 203 of this embodiment is arranged along the four sides of the side surface of the rectangular base 202 . For example, as shown in FIGS. 3 , 4 and 5 , the guide portion 203 is a plurality of plate-shaped bodies provided along the four side surfaces of the base 202 , that is, the four sides of the rectangular facing surface 201 a. In this embodiment, one guide part 203 is provided on each side of the opposing surface 201a, but the guide part 203 is not limited to this.

Each guide portion 203 has a protruding portion protruding from the opposing surface 201a. The distance (protrusion amount) of the guide portion 203 from the opposing surface 201a is sufficient as long as it can restrict the movement of the electronic component 2 held by the opposing surface 201a across the gas layer, and is at least from the opposing surface 201a to the distance held across the gas layer. Electronic parts level 2 or above is enough. However, when the protruding portion of the guide portion 203 exceeds the protruding distance of the electronic component 2 held by the opposing surface 201a across the gas layer, it is necessary to take into account the avoidance of contact with the picked-up part when picking up the wafer. The electronic components 2 around the electronic component 2 come into contact. Therefore, the distance by which the protruding portion of the guide portion 203 protrudes from the facing surface 201a is preferably within the side surface of the electronic component 2 held by the facing surface 201a via the gas layer. However, as described below, by controlling the upper pusher 24 when picking up, it is possible to cope with various protruding amounts and avoid contact with the surrounding electronic components 2 .

In addition, in the following description, one of the orthogonal guide parts 203 is referred to as 203K and 203L, and the other orthogonal guide part 203 is referred to as 203M and 203N. It will be described in the form of introduction 203. The so-called orthogonality here includes the case where two guide parts 203 on adjacent sides are in contact or continuous to form a right angle, and also includes the case where there are multiple guide parts 203 on one side and these guide parts 203 are separated into two sides. The straight lines (planes) along which they are drawn are orthogonal to each other (see Figure 19).

The collet moving mechanism 22 is a mechanism that reciprocates the pickup head 21 equipped with the pickup collet 200 between the supply position P1 and the delivery position P2, and moves the pickup head 21 mounted on the pickup collet 200 up and down between the supply position P1 and the delivery position P2. In addition, the delivery position P2 is a position where the pick-up device 20 delivers the electronic component 2 picked up at the supply position P1 to the bonding head 31 that functions as a receiving portion to be described later. The supply position P1 and the delivery position P2 mainly refer to the positions in the XY direction, and do not necessarily refer to the positions in the Z-axis direction.

Furthermore, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The prescribed width includes the thickness of the electronic component 2, the distance to push the electronic component 2 up, the distance to which the electronic component 2 can be adsorbed, and the like. In particular, when referring to the position (height) in the Z-axis direction, in the supply position P1, let the height at the approach position be H1 and the height at the peeling position be H2 (see FIG. 11 ).

The collet moving mechanism 22 has an arm 222a to which the pickup head 21 is attached, and moves the arm 222a to move the pickup collet 200 attached to the pickup head 21. A detachable portion 222b is provided at the front end of the pickup head 21 . The attachment and detachment portion 222b includes a magnet inside, and uses the suction force of the magnet to attract and hold the base 202 of the pickup collet 200 . As shown in FIGS. 4 and 5 , a pair of pins 222 c is provided on the contact surface of the attachment and detachment portion 222 b with the base 202 . By fitting the pin 222c into the mounting hole 202c provided in the base 202, the pickup collet 200 is prevented from being displaced relative to the attachment and detachment portion 222b. In addition, although not shown in the figure, the pipe connected to the exhaust hole 202b passes through the attachment and detachment part 222b, and the pipe connected to the air supply hole 202a is supported by the attachment and detachment part 222b.

The collet moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222. The sliding mechanism 221 moves the arm 222a on which the pickup head 21 is mounted, thereby causing the pickup collet 200 to reciprocate between the supply position P1 and the delivery position P2. Here, the sliding mechanism 221 has a rail 221b extending parallel to the X-axis direction and fixed to the support frame 221a, and a slider 221c running on the rail 221b.

The lifting mechanism 222 moves the arm 222a on which the pickup head 21 is mounted, thereby moving the pickup collet 200 in the up and down direction. Specifically, the lifting mechanism 222 may use a linear guide that moves a slider on a track through a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the pickup collet 200 moves up and down along the Z-axis direction. In addition, the pickup collet 200 is elastically supported by the pickup head 21 via the attachment and detachment portion 222 b, and is provided so as to be slidable up and down in the Z-axis direction relative to the pickup head 21 . Furthermore, the pickup head 21 has a sensor that detects the sliding movement.

The direction changing unit 23 changes the direction of the pickup collet 200 . The orientation of the pickup collet 200 includes the direction from the base 202 toward the opposing surface 201a and the angle along a surface parallel to the opposing surface 201a. As shown in FIG. 6 , the direction changing unit 23 includes a rotating unit 231 and an angle changing unit 232 . The rotation unit 231 rotates the pickup collet 200 so that the opposing surface 201 a is reversed from the position where the electronic component 2 is picked up from the sheet 11 .

The rotating part 231 has a drive source 231a. The drive source 231a is, for example, a motor provided in the lifting mechanism 222, and the pickup head 21 is rotated in the θx direction by rotating the arm 222a connected to the rotation axis about the X-axis. Thereby, the rotating part 231 can reverse the pickup collet 200 supported by the pickup head 21 .

The angle change part 232 changes the angle of the pickup collet 200 along the surface parallel to the opposing surface 201a. As described below, the changing angle formed by the angle changing portion 232 is an angle at which the electronic component 2 moves toward the corner of the opposing surface 201 a by inversion. Furthermore, the angle changing unit 232 changes the angle at any time after picking up the electronic component 2, but after stopping at the position where the opposing surface 201a is reversed, it returns to the original angle (the angle at the time of picking up). The angle changing part 232 has a drive source 232a and a conductive part not shown in the figure. The drive source 232a is, for example, a motor provided in the pickup head 21 and has a rotation axis in the Z-axis direction. The transmission part transmits the power of the drive source 232a to the attachment and detachment part 222b, thereby rotating the pickup head 21 around the Z-axis. The transmission part is, for example, a belt transmission mechanism built into the pickup head 21 . Thereby, the angle changing part 232 can rotate the pickup collet 200 supported by the pickup head 21 in the θz direction.

For example, as shown in FIG. 7(A) , the pick-up collet 200 with the opposing surface 201 a facing the supply stage 12 attracts and holds the electronic component 2 at the supply position P1. As shown in FIGS. 7(C) and 7(D) , the rotation unit 231 of the direction changing unit 23 changes the direction of the pickup collet 200 from the supply position P1 so that the opposing surface 201 a faces upward. That is, the electronic component 2 held by the pickup collet 200 is reversed from the downward direction of the opposing surface 201a to the upward direction. At this time, the angle of rotation around the X-axis from the supply position P1 is 180°.

Furthermore, for example, as shown in (B) of FIG. 7 , the angle changing unit 232 rotates the pickup collet 200 at the supply position P1 by 45° around the Z axis (indicated by α in the figure). The rotation may be performed immediately after picking up the electronic component 2 , or may be performed while the electronic component 2 is being rotated by the rotating part 231 . However, it is preferable to use the angle changing unit 232 to change the angle before the rotation angle formed by the rotating unit 231 reaches 180°. Then, as shown in (E) of FIG. 7 , after the electronic component 2 is reversed by 180° rotation, the angle changing unit 232 rotates the pickup collet 200 by 45° to restore the original angle.

As shown in FIG. 1 , the push push button 24 is provided below the sheet 11 of the supply device 10 . The upper push pin 24 is a needle-shaped member with a sharp front end. The upper push pin 24 is provided inside the support body 241 so that its length direction is parallel to the Z-axis direction.

The support body 241 has a driving mechanism for moving the upper push pin 24 in and out of the support body 241 or retracting the support body 241 to the inside thereof. The entry and exit or retraction is performed along the up and down direction. The driving mechanism includes, for example, a slider that is guided to move by an up-and-down rail, and a cylinder or a cam mechanism that drives the slider.

[Mounted device] The mounting device 30 is a device that transfers the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a bonding head 31 and a head moving mechanism 32 .

The bonding head 31 has a function as a receiving portion for receiving the electronic component 2 from the pickup collet 200 at the transfer position P2, and is a device that mounts the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2 .

Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2, releases the holding state, and releases the electronic component 2. The nozzle 31a includes a nozzle hole. The nozzle hole opens on the suction surface of the tip of the nozzle 31a. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and a negative pressure is generated through the circuit to suck and hold the electronic component 2 on the suction surface of the nozzle 31a. Furthermore, by releasing the negative pressure, the electronic component 2 is released from the holding state on the adsorption surface.

The head moving mechanism 32 is a mechanism that reciprocates the bonding head 31 between the delivery position P2 and the mounting position P3, and moves the bonding head 31 up and down between the delivery position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a sliding mechanism 321 and a lifting mechanism 322 .

The sliding mechanism 321 reciprocates the joint head 31 between the transfer position P2 and the installation position P3. Here, the sliding mechanism 321 has two rails 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c running on the rails 321b.

In addition, although not shown in the figure, the sliding mechanism 321 has a sliding mechanism that slides the bonding head 31 along the Y-axis direction. The sliding mechanism may also include a track in the Y-axis direction and a slider traveling on the track. The slider is driven by a ball screw driven by a rotary motor, a linear motor, etc. The lifting mechanism 322 moves the bonding head 31 in the up and down direction. Specifically, the lifting mechanism 322 may use a linear guide that moves a slider on a track through a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the bonding head 31 moves up and down along the Z-axis direction.

The substrate stage 60 is a stage that supports the substrate on which the electronic component 2 is mounted. The substrate stage 60 is provided in the stage moving mechanism 61 . The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane and positions the planned mounting position of the electronic component 2 on the substrate at the mounting position P3. The stage moving mechanism 61 may use, for example, a linear guide that moves a slider on a track using a ball screw mechanism driven by a servo motor.

In addition, the mounting device 30 includes an imaging device, an image processing device, and a position recognition device (not shown). The electronic component 2 held by the bonding head 31 and the substrate supported by the substrate stage 60 are photographed by the imaging device, and based on the image processed by the image processing device, the position recognition device recognizes the positional relationship between the two. Based on the positional relationship, the mounting device 30 mounts the electronic component 2 on the substrate. The imaging device may be an upper-lower dual-view camera inserted between the electronic component 2 and the substrate to capture both simultaneously, or a camera capable of capturing both electronic components separately.

[Control device] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10 , the pickup device 20 , the loading device 30 , and the substrate stage 60 . That is, the control device 50 is a control device of the transfer device 1 and the mounting device 100 . The control device 50 can be implemented by, for example, a dedicated electronic circuit or a computer running a predetermined program. The control device 50 is connected to an input device for the operator to input instructions or information required for control, and an output device for confirming the status of the device. The input device may use a switch, a touch screen, a keyboard, a mouse, etc. The output device may use a display unit such as liquid crystal or organic electroluminescence (EL).

FIG. 9 is a functional block diagram of the control device 50. As shown in FIG. 9 , the control device 50 includes a supply device control unit 51 , an upward push control unit 52 , a pickup control unit 53 , a bonding head control unit 54 , a substrate stage control unit 56 , and a storage unit 57 .

The supply device control unit 51 controls the movement of the supply stage 12 . That is, the movement of the electronic component 2 to be picked up placed on the sheet 11 is controlled. The upper pusher control unit 52 controls the movement of the upper pusher 24 , that is, the operation of the support body 241 .

The pickup control unit 53 controls the movement of the pickup collet 200 . That is, the pickup control unit 53 controls the operations of the collet moving mechanism 22 and the direction changing unit 23. For example, the pickup control unit 53 controls the gas supply circuit connected to the air supply hole 202a, the negative pressure generating circuit connected to the exhaust hole 202b, the drive source 231a of the rotation unit 231, and the drive source 232a of the angle changing unit 232. Thereby, as described below, the pick-up control unit 53 controls the holding, reversal, positioning and release of the electronic component 2 .

The bonding head control unit 54 controls the movement of the bonding head 31 , that is, the operation of the head moving mechanism 32 . Furthermore, the bonding head control unit 54 controls the negative pressure generating circuit connected to the nozzle hole of the bonding head 31 to control holding and releasing of the electronic component 2 . The substrate stage control unit 56 controls the movement of the substrate stage 60 , that is, the operation of the stage moving mechanism 61 .

The storage unit 57 is a storage device including various memories as recording media (hard disk drive (HDD), solid state drive (SSD), etc.) and an interface between the recording medium and the outside. The storage unit 57 stores data and programs required for the operation of the transfer device 1 in advance, and stores data required for the operation of the transfer device 1 . The required data are, for example, the gas supply amount, the exhaust pressure, the position coordinates of the supply position P1, the transfer position P2, the installation position P3, and the position coordinates of each moving mechanism. Each of the moving mechanisms controls the movement of each structure based on these coordinates.

[Principle of suction holding using pick-up collet] Next, the principle of sucking and holding the electronic components 2 using the pickup collet 200 as described above will be described. As shown in FIG. 3(A) , the gas supplied from the gas supply hole 202 a is ejected in a planar shape through the pores on the opposing surface 201 a , and forms a gas layer between the gas and the electronic component 2 . The layer is, for example, 2 μm to 10 μm. Then, with the negative pressure acting on the suction hole 201c through the negative pressure generating circuit, the opposing surface 201a is brought close to the electronic component 2, thereby sucking and holding the electronic component 2. At this time, since a gas layer is formed between the facing surface 201a and the electronic component 2, the facing surface 201a and the electronic component 2 are maintained in a non-contact state. Furthermore, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 201 c, so the electronic component 2 is released from the pickup collet 200 .

[Principle of positioning electronic parts by picking up collet] Furthermore, the principle of positioning the electronic components 2 in the pickup collet 200 as described above will be described with reference to FIG. 7 . In addition, the dotted line in the center of the left figure of FIGS. 7(A) to 7(E) represents the rotating arm 222a (shown as a dotted line), and the dotted circle on the outside and the dotted line of the right figure indicate the pickup collet. Part of the rotation trajectory RT of 200. As shown in (A) of FIG. 7 , when the electronic component 2 is sucked and held by the pickup collet 200 , a pair of opposing guide portions 203K and 203M are parallel to the rotation trajectory RT. As shown in FIG. 7(B) , after the electronic component 2 is picked up, the angle of the pickup collet 200 is changed by 45° by the angle changing unit 232 . At this point in time, the pair of opposing guide portions 203K and 203M are inclined at 45° with respect to the rotation trajectory RT.

Then, as shown in FIG. 7(C) , after the rotation of the pick-up collet 200 starts using the rotating part 231 , the electronic component 2 sucked and held by the opposing surface 201 a is directed toward one of the orthogonal guides due to the inertial force and gravity. The corner of the opposing surface 201a along which the portion 203K and the guide portion 203L moves. As described above, the electronic component 2 is held by the pickup collet 200 in a state that is not in contact with the opposing surface 201a across the gas layer, and can easily move in a direction parallel to the opposing surface 201a. Thereby, the electronic component 2 is positioned so that two orthogonal side surfaces thereof are in contact with the guide portions 203K and 203L. That is, the electronic component 2 is positioned close to one corner of the pickup collet 200 .

Furthermore, as shown in FIG. 7(D) , when the opposing surface 201 a approaches the near side of the reverse position, the rotating part 231 decelerates and then reaches the reverse position, whereupon the rotating part 231 stops. At this time, the inertia of the electronic component 2 to continue moving acts, but as will be described below, separation from the guide portions 203K and 203L can be prevented.

First, since the pick-up collet 200 rotates around the horizontal X-axis, the centrifugal force, gravity, and inertial force act on the electronic component 2 during the rotation process. Therefore, when the rotation is stopped, the centrifugal force and the inertial force act on the electronic component 2 to move away from one of the orthogonal guide portions 203K and 203L. Furthermore, in the reversed state, the inertial force at this time and the gravity force press the electronic component 2 against the pickup collet 200 in the vertical direction (see (D) of FIG. 7 ). The electronic component 2 is held by the gas layer with respect to the pickup collet 200 . However, if a force acts in such a vertical direction, it becomes difficult to move in the horizontal direction. That is, a force that prevents the electronic component 2 from moving away from one of the orthogonal guide portions 203K and 203L acts on the electronic component 2 .

Here, the reverse rotation of the pickup collet 200 does not stop suddenly, but gradually decelerates and stops as described above. Therefore, the centrifugal force gradually decreases toward the stop and no longer acts at the point when the pickup collet 200 stops. When the pick-up collet 200 is stopped, the inertia generated by the deceleration acts. Therefore, the deceleration is set to such an extent that the electronic component 2 does not move away from the guide portion 203K or the guide portion 203L. This prevents the electronic component 2 from moving away from the guide portion 203K and the guide portion 203L. The electronic component 2 is positioned at an appropriate position at the corner of the opposing surface 201 a along which the guide portions 203K and 203L are in the reversed position.

When the reversal is completed, since it is positioned at one of the corners of the opposing surface 201a, the positional deviation of the electronic component 2 caused during picking up and reversal operation can be corrected. Even if the electronic component 2 moves on the facing surface 201a, as mentioned above, the facing surface 201a and the electronic component 2 will maintain a non-contact state, so the surface of the electronic component 2 on the facing surface 201a side will not be damaged. Moreover, in the early stage of the reversing operation, since the speed of acceleration is slow, the impact when approaching the guide portion 203K and the guide portion 203L is small. Therefore, there is almost no risk of chipping or damage. There is also no risk of collision with the opposing guide portions 203M and 203N.

Furthermore, in the above-mentioned form, the deceleration at the time of stopping the reverse rotation is set to such an extent that the electronic component 2 does not move away from the guide portion 203K or the guide portion 203L. However, the deceleration may be set so that the electronic component 2 does not move away from the guide portion 203K. , the extent to which the guide part 203L moves away from the guide part 203L. That is, as shown in (D) of FIG. 8 , the deceleration can be set such that when stopped at the reverse position, the electronic component 2 sucked and held by the opposing surface 201 a is sucked and held toward another orthogonal surface due to the inertial force and gravity. The corner movement of the opposing surface 201a along which the guide portions 203M and 203N move (Fig. 8(A) to Fig. 8(C)) is the same as the above-mentioned Fig. 7(A) to Fig. 7(C) ). Thereby, the electronic component 2 is positioned so that one of the two orthogonal side surfaces is in contact with the guide portion 203M and the guide portion 203N. Then, as shown in (E) of FIG. 8 , after the electronic component 2 is reversed by 180° rotation, the angle changing unit 232 rotates the pickup collet 200 by 45° to restore the original angle.

When the electronic component 2 is positioned on the guide parts 203M and 203N, when the reverse rotation is stopped, the deceleration of the rotation of the rotation part 231 is increased. If it stops at the reverse position in the above manner, the inertia allows the electronic component 2 to move to the corner of the opposing surface 201a along which the guide portions 203M and 203N follow. Since the time required for deceleration is shortened, the time required for reverse rotation is shortened, and the impact of changing the angle of the pickup collet 200 on the takt time can be suppressed, thereby improving productivity. However, there is a possibility that the electronic component 2 may be affected by contact with the guide portion 203M and the guide portion 203N. Therefore, the deceleration of the rotating part 231 is set to a level that allows the movement of the electronic component 2 and allows the influence of contact on the electronic component 2 to be tolerated.

In addition, the electronic component 2 does not necessarily need to be in complete contact with the guide portion 203 to be positioned. It suffices to enter the recognition range of the electronic component 2 while approaching the guide part 203. As long as it is within the recognition range, it does not need to be positioned at a fixed position.

[action] Regarding the operation of picking up the electronic components 2 from the supply device 10 by the pickup device 20 in the above transfer device 1 and transferring the electronic components 2 to the mounting device 30, refer to FIG. 10 in addition to FIGS. 1 to 8 The flow chart and the explanatory diagram of FIG. 11 will be described below.

First, the pickup collet 200 is moved to the supply position P1 where the upper push pin 24 is located by the pickup device 20 and the supply device 10, so that the opposing surface 201a of the pickup collet 200 faces the upper push pin 24 (step S01). At this time, pressurized gas is supplied to the porous member 201 via the gas supply hole 202a, and the gas is blown out from the opposing surface 201a. Moreover, at this time, exhaust is not performed from the exhaust hole 202b, and suction is not performed from the opening 201d.

On the other hand, the supply device 10 moves the supply stage 12 so that the electronic component 2 to be picked up is located at the supply position P1 as shown in (A) of FIG. 11 (step S02 ). Then, the pickup collet 200 to which the gas is supplied to the surface of the opposing surface 201 a descends together with the pickup head 21 and approaches the electronic component 2 . At this time, as shown in FIG. 11(B) , in order to prevent the guide part 203 from colliding with the surrounding electronic components 2 , the pickup collet 200 starts to descend based on the protrusion amount of the guide part 203 from the opposing surface 201 a. At the same time, the push-up pusher 24 rises to push up the electronic component 2 to be picked up, thereby raising the electronic component 2 to be picked up to a height where the guide portion 203 does not collide with the surrounding electronic components 2 .

When the descending pickup collet 200 approaches the electronic component 2 , the gas supplied to the surface of the opposing surface 201 a is sandwiched between the opposing surface 201 a and the electronic component 2 to form a gas layer. The trapped gas layer at this time is considered to be a viscous flow layer. Therefore, the fluidity of the gas G in the gas layer itself is very poor, and the suction caused by the exhaust gas from the exhaust hole 202b described later and the outflow from the outer edge of the gas layer hardly occur. Then, the pickup collet 200 stops descending relative to the electronic component 2 through the gas layer that is not further compressed (step S03 ). At this time, as described above, the electronic components 2 to be picked up are raised compared to the surrounding electronic components 2 , so the guide portion 203 does not come into contact with the electronic components 2 around the pickup target on the sheet 11 .

Even if the pickup collet 200 stops falling relative to the electronic component 2, the pickup head 21 continues to descend because the pickup collet 200 is elastically supported by the pickup head 21, and the pickup head 21 slides relative to the pickup collet 200. When the sensor detects the sliding, the pickup control unit 53 recognizes that the pickup collet 200 has reached the electronic component 2 and stops the descent of the pickup head 21 .

As described above, when the pickup head 21 stops, the pickup collet 200 forms a gas layer between the opposing surface 201a and the electronic component 2 as described above. Through the gas layer, the opposing surface 201a stops and does not come closer to the electronic component 2. . Therefore, the pickup collet 200 is not in direct contact with the electronic component 2 . The height position of the pickup collet 200 at this time becomes the approach position H1 (see FIG. 9 ).

In this way, the pick-up collet 200 stops via the gas layer, and further exhausts air from the exhaust hole 202b while the pickup head 21 is stopped, thereby starting suction using the suction hole 201c (step S04). That is, as shown in FIG. 11(C) , the pick-up collet 200 presses the electronic component 2 against the sheet 11 supported by the support 241 via the gas layer, that is, the pick-up collet 200 holds the sheet between the support 241 and the support 241 . With the material 11 and electronic component 2 in the state, start pumping.

In this state, the pickup collet 200 rises, and in synchronization with this, the push pin 24 further rises, rises by a preset predetermined amount, and then stops (step S05 ). Then, as shown in (D) of FIG. 11 , the electronic components 2 sucked to the pickup collet 200 by the negative pressure are removed from the pickup collet 200 while maintaining the gap formed by the gas layer. The sheet 11 is peeled off and picked up (step S06 ). The height position at which the electronic component 2 is completely peeled off is the peeling position H2.

As shown in (B) of FIG. 7 , the angle changing unit 232 of the direction changing unit 23 changes the angle of the pickup collet 200 (step S07 ). Then, the rotation unit 231 of the direction changing unit 23 reverses the pickup collet 200 (step S08 ). That is, the direction of the pickup collet 200 is rotated 180° in the up-down direction, and the opposing surface 201a of the pickup collet 200 is directed upward. In addition, here, although the reversal operation of step S07 is performed immediately after picking up the electronic component 2, it may be performed at any place between the supply position P1 and the delivery position P2.

In addition, when moving to the transfer position P2 after reversal, the force accompanying the reversal or horizontal movement applied to the electronic component 2 is dispersed, so the risk of falling off from the pickup collet 200 can be reduced. In the case of reversing and moving at the same time, the force of reversal and horizontal movement cooperates, so the possibility of falling off increases, but the cycle time can be shortened and productivity can be improved. The possibility of falling off changes depending on the size (size, thickness, etc.) of the electronic component 2 , so it is preferable to appropriately select the action according to the electronic component 2 .

During the reversal process, as shown in (C) of FIG. 7 , the electronic component 2 moves to the corner of the opposing surface 201 a along which the guide portions 203K and 203L follow. Then, the pickup collet 200 decelerates near the reverse position, and then stops rotating at the reverse position. As shown in (D) of FIG. 7 , the electronic component 2 remains positioned at the corner of the opposing surface 201 a along which the guide portions 203K and 203L lie. Furthermore, as shown in (E) of FIG. 7 , the direction changing unit 23 returns the pickup collet 200 to its original angle (see (A) of FIG. 7 ) (step S09 ).

Next, the pickup device 20 moves the picked-up electronic component 2 to the transfer position P2 using the collet moving mechanism 22 (step S10 ). At the delivery position P2, the bonding head 31 of the mounting device 30 is on standby and faces the facing surface 201a of the pickup collet 200 with the electronic component 2 interposed therebetween.

The bonding head 31 is lowered toward the pickup collet 200 located at the transfer position P2, and after the electronic component 2 is held by the bonding head 31, the pickup collet 200 releases the negative pressure, thereby transferring the electronic component 2 from the pickup collet 200 to the bonding head 31. (Step S11). Then, the bonding head 31 rises away from the pickup collet 200, moves to the mounting position P3, and mounts the electronic component 2 on the substrate.

[Effect] (1) This embodiment is a pickup device 20 that has a rectangular outer edge and sucks, holds and picks up electronic components 2. The pickup device 20 has a pickup collet 200 that sucks and holds electronic components 2, and a changing pickup collet. The direction changing part 23 of the direction of 200.

The pickup collet 200 is provided with a porous member 201 having air permeability, and the gas supplied to the inside is ejected in a planar shape through the pores of the opposing surface 201 a facing the electronic component 2. The member 201 is provided with a suction hole 201c, which has an opening 201d on the opposing surface 201a, to suck the electronic components 2 through negative pressure, and is provided with a guide portion 203 to follow the electronic components. 2 to restrict the movement of the electronic component 2 held by the opposing surface 201a.

The direction changing unit 23 includes a rotation unit 231 that rotates the pickup collet 200 so that the opposing surface 201 a is reversed from the supply position P1 of the electronic component 2 , and an angle changing unit 232 that changes the pickup along a surface parallel to the opposing surface 201 a. Collet 200° angle.

Furthermore, the pickup collet 200 of this embodiment delivers the electronic component 2 picked up and reversed to the mounting device 30 mounted on the substrate.

Furthermore, the mounting device 100 of this embodiment includes: a pick-up device 20; a bonding head 31 which is disposed movably relative to the pick-up collet 200 and receives the electronic component 2 from the front end of the pick-up collet 200; and a mounting device 30, The electronic component 2 held by the bonding head 31 is transferred to the substrate and mounted thereon.

Therefore, when the electronic component 2 is picked up by suction from the suction hole 201c, the layer of gas discharged from the pores of the porous member 201 can prevent the electronic component 2 from contacting the opposing surface 201a, thereby suppressing damage to the electronic component. 2 cause damage. Furthermore, when the electronic component 2 is transferred, the possibility of damage to the electronic component 2 due to contact with the opposing surface 201a can be reduced, and the electronic component 2 can be held to prevent falling.

Furthermore, even if the inertial force accompanying the movement of the electronic component 2 during reversal causes the electronic component 2 to move horizontally through the gas layer on the opposing surface 201 a held in a non-contact manner, this can be prevented by the guide portion 203 Disengage the pickup collet 200.

Furthermore, at the time of reversal, by changing the angle of the pickup collet 200 using the angle changing part 232, the positioning can be made by the orthogonal guide part 203K, the guide part 203L, or the orthogonal guide part 203M, the guide part The corner formed by the plane along which 203N lies. That is, the position on the XY plane can be determined by two orthogonal sides. Therefore, when the electronic component 2 is picked up, even if the position, angle, etc. in the planar direction of the electronic component 2 held by the facing surface 201a is uneven, it can be handed over to the joint at an appropriate position (including the allowable range described below). The head 31 can reduce the offset during installation. Furthermore, during positioning, the electronic component 2 moves in a direction parallel to the opposing surface 201a. However, as mentioned above, since the electronic component 2 does not come into contact with the opposing surface 201a, damage caused by friction on the electronic component 2 can be prevented. In addition, in the area surrounded by the guide part 203, even if the position of the electronic component 2 is shifted, as long as the suction of the opening 201d is within the projection plane of the electronic component 2, the suction can be performed regardless of the position of the opening 201d. Keep. Assume that without changing the angle of the pickup collet 200 , there is also a case where the electronic component 2 is reversed and brought closer to one side of the pickup collet 200 . However, since there is a high possibility that the position in only one direction on the XY plane is determined, position recognition of the handed over electronic component 2 may take time or may require a large amount of correction, resulting in an increase in errors.

In addition, when the electronic component 2 is temporarily brought close to the corner of the opposing surface 201a along which the guide portions 203K and 203L are positioned and then positioned on the guide portions 203M and 203N, the positioning becomes such that the primary electrons are determined. The posture state of the component 2 constitutes two stages of positioning, so the electronic component 2 can be positioned more reliably. Especially when stopped, the electronic component 2 only needs to move diagonally, so the positioning accuracy is improved.

Here, the reason why the guide portion 203 and positioning as described above are effective when the pickup collet 200 holding the electronic component 2 in a non-contact manner as in this embodiment will be described in further detail. That is, since the electronic component 2 is held by the pickup collet 200 in a non-contact manner via the gas layer, it can be easily moved in the horizontal direction. Therefore, the electronic component 2 may move on the opposing surface 201 a of the pickup collet 200 due to the inertial force acting on the electronic component 2 due to the movement or reversal operation of the pickup collet 200 to the transfer position P2. Even if such movement occurs, the movement of the electronic component 2 can be restricted to a predetermined area by the guide portion 203, so that the electronic component 2 can be prevented from falling off the pickup collet 200.

In addition, in order to avoid contact with the electronic components 2 when picking up the sheet 11 , the opposing distance between the guide portions 203 needs to be set larger than the size of the electronic components 2 . Therefore, a gap is provided between the electronic component 2 sucked and held by the pickup collet 200 and the guide portion 203 . Therefore, when the electronic component 2 moves as described above, the position or angle of the electronic component 2 may be held in a position within the range of the gap amount. This state of maintaining posture is highly uneven. If there is such unevenness in the holding posture, the holding posture of the electronic component 2 delivered to the bonding head 31 will also be uneven with respect to the reference position (appropriate position) that serves as the positioning reference. When photographing using an imaging device not shown, etc. When the position of the electronic component 2 is held and the position is recognized, it takes time or the amount of position correction is large, resulting in a large movement error during correction. In this embodiment, as described above, it is possible to always position the device at an appropriate position with respect to the opposing surface 201a. Therefore, unevenness in the holding posture can be suppressed, and the amount of correction of the position or the movement error during correction can be reduced.

In addition, the appropriate position is a holding posture in which the electronic component 2 is almost directly transferred to the bonding head 31 while being held by the pickup collet 200 , and is also equivalent to the reference position for mounting the electronic component 2 on the substrate. When the appropriate position is photographed with a camera and the position is recognized, even if the holding posture of the electronic component 2 relative to the reference position is uneven, it is included in the allowable range as long as the allowable recognition time is used and the movement error during movement is corrected. Keep your posture uneven.

Furthermore, it is considered that the gas discharged from the space flows between the electronic component 2 and the surface facing the electronic component 2, thereby generating a suction force using a Bernoulli suction cup using negative pressure generated by a large amount of air flow. To keep electronic parts 2. In this case, the suction force is very weak, and even if the electronic component 2 can be held at a certain distance from the collet, the suction force cannot be obtained to peel off the electronic component 2 adhered to the sheet 11 . Furthermore, in order to obtain the Bernoulli effect, the gas flow rate per unit time needs to be very high, so it is very difficult to adjust the suction force while maintaining non-contact. Furthermore, there is a concern that a large amount of gas is blown out around the pickup site, causing particles to be generated.

Furthermore, a gas ejection hole with the same size as the suction hole is provided on the surface of the collet facing the electronic component 2 instead of a fine hole like the porous member 201, and the gas is sprayed toward the electronic component 2 to levitate the electronic component 2. When the electronic components 2 are suctioned through the suction hole against the levitation force of the electronic components 2 generated by the injection, the same suction force is used to generally maintain the non-contact (floating) side as described above. The adjustment is very difficult, and a large amount of gas is blown out around the pickup part, causing concerns about the generation of particles.

On the other hand, in this embodiment, the flow rate of the gas blown out in a planar shape from the entire opposing surface 201a through the fine holes of the opposing surface 201a is extremely small. Therefore, there is no worry about particles being generated. A layer of gas that does not actively levitate the electronic components 2 but forms a viscous flow when the opposing surface 201 a approaches the electronic components 2 is blown out from the opposing surface 201 a. Therefore, the stronger the suction force is, the easier it is to keep the opposing surface 201a and the electronic component 2 in a non-contact state, even if the suction force caused by the negative pressure from the suction hole 201c is set to be sufficient to remove the electronic component 2 from the sheet. The force of peeling off can also be prevented by the gas layer between the opposing surface 201a and the electronic component 2, so it becomes easy to obtain a strong suction force and adjust the suction force.

For example, under the following conditions, it is possible to obtain a result in which the pickup collet 200 can maintain non-contact with the electronic component 2 and maintain the suction hold. As the porous member 201, a member with a ventilation rate of about 0.7 L/min is used, for example, when the supply pressure is 0.3 MPa. The pressure of the gas (nitrogen) supplied to the porous member 201 can be in the range of about 0.1 MPa to 0.7 MPa. At this time, the flow rate of the gas flowing through the porous member 201 is in the range of about 0.3 L/min to 1.5 L/min. , the non-contact between the pickup collet 200 and the electronic component 2 can be reliably maintained. Furthermore, the suction pressure is in the range of -10 kPa to -90 kPa, and the electronic component 2 can be reliably picked up from the sheet 11 . At this time, the pressure in the gas layer between the electronic component 2 and the opposing surface 201a is 0.1 MPa to 0.5 MPa.

(2) The angle change performed by the angle changing unit 232 is an angle at which the electronic component 2 is moved toward the corner of the opposing surface 201 a by inversion. Therefore, if it is reversed after picking up, the electronic component 2 will be positioned at the corner of the opposing surface 201a.

(3) The rotating part 231 starts rotating from the position where the electronic component 2 is picked up, and stops at the position where the opposing surface 201 a is reversed. Therefore, when the angle is changed by the angle changing part 232, the electronic component 2 can be positioned at the corner of the orthogonal guide part 203K, the opposing surface 201a along which the guide part 203L is along, or the orthogonal position by the inertia of the electronic component 2 to continue moving. The corners of the opposing surface 201a along which the guide portions 203M and 203N follow. Therefore, there is no need to prepare a separate mechanism for moving the electronic component 2, and a low-cost device that is less prone to abnormality can be configured with a simple structure.

[Modification] The present invention is not limited to the above-described embodiment. The basic structure is the same as that of the above-described embodiment, and the following modifications are also applicable.

(1) As described above, the changing angle of the pickup collet 200 formed by the angle changing portion 232 may be an angle at which the electronic component 2 moves toward the corner of the opposing surface 201 a by inversion. In this way, if the guide part 203 is inclined relative to the rotation trajectory RT, the above-mentioned positioning can be achieved. Therefore, for example, the change angle can be set in the range of 10° to 80°. The easy-to-move angle differs depending on the size of the electronic component 2, the ratio of the vertical and horizontal sides, etc., so it is preferable to select it appropriately according to the electronic component 2. It can also be obtained through experiments if necessary. However, if the change angle of one of the pair of orthogonal guide parts 203 is too large, it will be difficult to move along the guide parts 203 . Therefore, by setting both to the same angle of about 45°, the angles of the pair of orthogonal guide portions 203 with respect to the rotation trajectory RT are equal without deviation, and the electronic component 2 can be smoothly moved toward the corner. action.

(2) When the pickup collet 200 is reversely rotated by the rotation unit 231, it is not necessary to stop when the rotation angle reaches 180° from the start of the rotation. For example, the rotating unit 231 may start rotating from the position where the electronic component 2 is picked up, and then return to the reversed position and stop when the facing surface 201 a exceeds the inverted position (rotation angle 180°). That is, as shown in FIGS. 12(A) to 12(C) , after the rotating part 231 starts the reversing operation in the same manner as in FIGS. 7(A) to 7(C) , as shown in FIG. 12(D ) ), the rotation stops at a position exceeding 180°. In this way, in addition to the inertial force and gravity, the electronic component 2 approaches the corner of the opposing surface 201a along which the guide portions 203M and 203N lie. As shown in FIG. 12(E) , the rotation unit 231 returns the pickup collet 200 to the reverse rotation position at a speed lower than that during the reverse rotation operation from the above state, and stops the pickup collet 200 . Then, as shown in FIG. 12(F) , the angle changing unit 232 rotates the pickup collet 200 so as to return it to the original angle.

Here, when the pickup collet 200 stops when the rotation angle reaches 180° from the start of rotation, it is also considered that the electronic component 2 moves away from the guide portions 203K and 203L and collapses in the positioned state. Furthermore, when the electronic component 2 is moved so as to be actively positioned using the guide portions 203M and 203N, there is also a concern that when the side surface of the electronic component 2 comes into contact with the guide portions 203M and 203N, The electronic component 2 rebounds, or the electronic component 2 moves so little that it cannot reach the guide portion 203M or the guide portion 203N, and is not positioned at the corner. However, in this form, by rotating it beyond the reversed position, the electronic component 2 can be brought closer to the corner of the opposing surface 201a by gravity in addition to the inertial force, thereby increasing the possibility of positioning. In the form shown in FIG. 12 , the electronic component 2 is positioned using the guide portion 203M and the guide portion 203N. Furthermore, as described above, when the pickup collet 200 is returned from a position beyond the reversed position, by reducing the acceleration or deceleration of the return movement, the pickup collet 200 can be stopped after returning to the reversed position. Prevent inertia from causing the electronic component 2 to move away from corners.

In addition, in this case, an overhanging time to temporarily exceed the reverse position and time to return to the reverse position are required, and if the acceleration or deceleration is reduced and the return is made slowly, the takt time becomes longer. Therefore, by performing the angle change while returning from the overhang position, the takt time can be suppressed from becoming longer. In such a case, if the angle change is restored gradually, the occurrence of deviation of the electronic component 2 caused by the angle change being restored can also be suppressed.

Furthermore, when the rotation angle is 180°, that is, when the pickup collet 200 stops rotating at the reversed position, the electronic component 2 becomes a horizontal state, so the inertial force acting on the electronic component 2 is divided into a horizontal direction and a horizontal direction. vertical force. Therefore, the horizontal force toward the guide portion 203M and the guide portion 203N is weakened. Furthermore, the inertial force acting in the vertical direction acts as a resistance to movement in the horizontal direction. Therefore, the inertial force acting in the horizontal direction is further weakened. Therefore, rather than the possibility that the electronic component 2 collides with the guide portions 203M and 203N and rebounds, the possibility that the electronic component 2 does not reach the guide portions 203M and 203N should be considered.

On the other hand, when the electronic component 2 is suspended and temporarily stopped, a component force of centrifugal force or gravity is also applied, so the force for moving the electronic component 2 is compensated. Furthermore, the angle at which the resultant force of inertial force and gravity acts relative to the component force on the collet surface also becomes smaller, so the resistance component also weakens. Therefore, the possibility of being able to locate can be increased.

(3) The timing of starting the angle change and reversal of the pickup collet 200 is not limited to the above-described form. For example, in the forms of FIGS. 7 and 12 , the reverse rotation is started after the angle is changed, but the angle may be changed after the reverse rotation is started. This allows the time of angle change and the time of reverse rotation to overlap, thereby suppressing an increase in the takt time.

In addition, when the angle of the pickup collet 200 is changed, a force that rotates the electronic component 2 is generated in a direction parallel to the opposing surface 201a. That is, when picking up, the electronic component 2 is located substantially in the center between the guide portions 203 . However, due to the change in angle of the pickup collet 200, the guide part 203 rotates even though the electronic component 2 attempts to maintain its posture. Therefore, there is a possibility that the electronic component 2 collides with the guide portion 203 .

Moreover, if rotation is started for reverse direction, the electronic component 2 will collide with the guide part 203 similarly. In addition, during the above process, the electronic component 2 approaches the guide portion 203K and the guide portion 203L.

However, if the rotation for reversal is performed while changing the angle, the resultant force accompanying the movement of the two causes the guide portion 203K, the guide portion 203L to collide with the electronic component 2, so there is an increase in the impact during the collision. Big possibility. Therefore, the risk of chipping, breakage, or falling off also increases. However, this risk is determined by the size and weight of the electronic component 2. Therefore, it is sufficient to appropriately determine whether to overlap and perform angle change and reversal according to the electronic component 2. In addition, as described below, as long as collision is avoided by blowing gas or the like from the guide portion 203, the takt time can be shortened when the operations are overlapped.

(4) The angle changing unit 232 can change the angle of the picked-up electronic component 2 and restore the changed angle in a state where the opposing surface 201 a is rotated for inversion. That is, regardless of whether the overhang is performed or not, the angle can be restored during the reverse rotation operation. Accordingly, by changing the angle of the pickup collet 200 by overlapping the recovery time with the rotation operation, it is possible to suppress an increase in the takt time.

When overhanging is performed, if the angle is restored even during the rotation period when returning to the reverse position, the force acting on the electronic component 2 is reduced, and the electronic component 2 can be suppressed from shifting from the corner or its vicinity.

Without overhang, the angle is restored during deceleration toward stop. When the vehicle is stopped while approaching the corner approached by acceleration during reversal without overhanging, the angle is restored directly during deceleration. When the vehicle approaches and stops from the corner approached by acceleration during reversal without overhanging and by the inertial force generated by deceleration during stop, the angle is restored after approaching the opposite corner.

(5) The action of restoring the pickup collet 200 after being suspended can be repeated multiple times. That is, after the pick-up collet 200 reaches the reverse position, the direction changing portion 23 can be driven in such a way that the pickup collet 200 moves back and forth between a position beyond the reverse position and a position near the reverse position with the reverse position as the center. Rotating part 231. By swinging the pick-up collet 200 back and forth, the pick-up collet 200 tilts in the up-and-down direction, and the inertial force and gravity act on the electronic component 2, so that the electronic component 2 can be brought close to the corner of the pick-up collet 200. In this case, by gradually slowing down the speed of the swing, it can be brought closer to the corner. Furthermore, the swing amplitude can also be gradually reduced. Even if the electronic component 2 is not completely brought close to the corner of the pickup collet 200 by the reversing action or the hanging action, that is, it is not in contact with the orthogonal guide part 203, it can be more reliably achieved by further approaching the corner of the pickup collet 200. Locating electronic parts2.

(6) The angle changing portion 232 may be provided so as to be able to change the angle up and down, and the electronic component 2 may be brought closer to the corner of the opposing surface 201 a by inclining the pickup collet 200 in the up and down direction. For example, the electronic component 2 can be positioned by tilting it in the up-and-down direction in the inverted position rather than overhanging it. Even if the electronic component 2 is not completely brought close to the corner of the pickup collet 200 by the reversing operation, the electronic component 2 can be positioned more reliably by the further approaching operation. Of course, this can also be done with overhanging. Furthermore, the tilting in the up and down direction can be repeated multiple times.

(7) In the above mode, after the electronic components 2 are picked up, the angle of the pickup collet 200 is changed by the angle changing unit 232. Alternatively, the electronic components 2 may be picked up in a state where the angle in the horizontal direction is inclined, and then transferred to the bonding head 31. Previously, the angle changing unit 232 restored the angle.

(8) As shown in FIGS. 13 and 14 , the ventilation part 203 a may be provided in one of the two opposite guide parts 203 among the four guide parts 203 . The guide portion 203 for providing the ventilation portion 203a is provided on both adjacent sides of the opposing surface 201a. As described below, gas can be blown from the ventilation part 203a to the opposite guide part 203. That is, as shown in FIG. 13(A) and FIG. 14(A) , the ventilation part 203a may be provided such that one of the orthogonal guide parts 203M and the guide part are orthogonal to one of the four corners. The 203N side (which is the inner side and hidden in FIGS. 13(A) and 13(B) ) is opposite to the other orthogonal guide part 203K and guide part 203L sides in the diagonal corners. Positive pressure. The ventilation unit 203a is connected to a gas supply circuit via a pipe (not shown) and is controlled by the control device 50 . By making one of the orthogonal guide portions 203M and 203N have a relatively positive pressure compared to the other orthogonal guide portion 203K and guide portion 203L, it is possible to move closer to the guide portions 203K and 203L. The electronic component 2 on the guide portion 203L side remains on the guide portion 203K and guide portion 203L sides to prevent the electronic component 2 from moving to the guide portion 203M and guide portion 203N sides due to the inertial force when the rotation is stopped. Therefore, the deceleration when stopping the rotation can be increased, thereby shortening the time and preventing the electronic component 2 from rebounding due to collision.

Furthermore, as shown in FIG. 13(B) and FIG. 14(B) , the ventilation part 203a may be provided such that one of the orthogonal guide parts 203K and the guide part 203K are orthogonal to one of the four corners. The side 203L (hidden as the inner side in FIG. 13 ) has a relatively positive pressure compared to the other orthogonal guide portion 203M and guide portion 203N sides at the diagonal corners. By causing one of the orthogonal guide portions 203K and 203L to have a relatively positive pressure compared to the other orthogonal guide portion 203M and 203N, the reverse rotation of the pickup collet 200 is stopped. In addition to the centrifugal force, inertial force or gravity, the electronic component 2 is more reliably close to the other orthogonal guide portion 203M and the guide portion 203N that is the negative pressure side, so that the electronic component 2 can be positioned on the other positive side. The corner of the opposing surface 201a along which the guide portion 203M and the guide portion 203N intersect.

The ventilation part 203a is provided inside the guide part 203 so that the outside may communicate with the periphery of the electronic component 2 held by the opposing surface 201a. The ventilation part 203a is connected to a gas supply circuit via a pipe (not shown). The end portion of the ventilation portion 203a serves as an ejection port 203b facing two side surfaces of the electronic component 2. Therefore, the gas can be ejected from the ejection port 203b to the side surface of the electronic component 2 .

As shown in FIGS. 14(A) and 14(B) , when the pickup collet 200 is reversed with respect to two orthogonal side surfaces of the electronic component 2 held by the opposing surface 201 a as described above, , the gas is ejected from the ventilation part 203a of one of the orthogonal guide parts 203 through the ejection port 203b. In this way, the other two orthogonal side surfaces of the electronic component 2 are pressed against the inner wall of the other orthogonal guide portion 203 . Thereby, it is possible to prevent the temporarily positioned electronic component 2 from moving, or from insufficient movement or rebound of the electronic component 2 during inversion, and can position the electronic component 2 at a corner in the opposing surface 201a.

Furthermore, as shown in FIG. 15(A) , not only one of the orthogonal guide parts 203K and 203L, but also the other orthogonal guide part 203M and 203N are connected to the ventilation part. The ejection port 203b communicating with the electronic component 203a ejects gas to the other two orthogonal side surfaces of the electronic component 2, thereby suppressing the shift or deviation of the electronic component 2 during movement or reversal, and the contact with the electronic component 2. The vent part 203a is also connected to a gas supply circuit via a pipe (not shown), and is controlled by the control device 50. In this case, during positioning, as shown in FIG. 15(B) , the gas injection from the other orthogonal guide part 203M and the guide part 203L is stopped, and only one of the orthogonal guide parts is ejected. 203K and the guide part 203L eject gas, so that one of the orthogonal guide parts 203K and 203L has a relatively positive pressure, thereby enabling positioning. In addition, in this case, it is possible to select which side to position by setting the positive pressure on the guide portion 203K and guide portion 203L sides, or setting the positive pressure on the guide portion 203M and guide portion 203N sides. .

(9) As shown in FIG. 16 , the ventilation part 203 a may be provided so that gas can be sucked from the other two orthogonal sides of the guide part 203 . For example, the ventilation part 203a is provided inside the other orthogonal guide part 203M and the guide part 203N so that the outside may communicate with the surroundings of the electronic component 2 held by the opposing surface 201a. The ventilation part 203 a is connected to a gas exhaust circuit (negative pressure generating circuit) via a pipe (not shown), and the exhaust circuit is controlled by the control device 50 . The end portion of the ventilation portion 203a becomes a suction port 203d facing the other two side surfaces of the electronic component 2. Therefore, the side surface of the electronic component 2 can be sucked from the suction port 203d. Therefore, since one of the orthogonal guide portions 203K and 203L has a relatively positive pressure compared to the other orthogonal guide portion 203M and 203N, the electronic component 2 is the same as described above. The ground was positioned in the corners of the appropriate location. In addition, in this case, the ventilation part 203a may be provided in one of the orthogonal guide parts 203K and 203L, or may not be provided. Furthermore, a ventilation part 203a for suction may be provided in one of the orthogonal guide parts 203K and 203L, or may be configured to be positionable in the opposite direction.

(10) As mentioned above, if the electronic component 2 comes into contact with one of the orthogonal guide portions 203K and 203L and the other orthogonal guide portion 203M and 203N, some of the electronic components 2 will be affected. possibility. Therefore, the guide portion 203K, the guide portion 203L, the guide portion 203M, and the guide portion 203N eject gas to avoid contact with the electronic component 2, thereby preventing the electronic component 2 from being detached from the pickup collet 200 and positioning it. Damage to the electronic component 2 caused by contact with the guide portion 203K, the guide portion 203L, the guide portion 203M, and the guide portion 203N no longer occurs. In this case, the guide part 203K and the guide part 203L side may be set to a positive pressure, or the guide part 203M and the guide part 203N side may be set to a positive pressure, and it may be carried out close to either side. position.

(11) Furthermore, for example, as shown in FIG. 17 , the ventilation part 203a may be provided so that gas can be ejected from the other orthogonal guide parts 203M and 203N via the guide porous member 203c. That is, the porous member 203c for the guide is provided at the position where the protruding portion of the other orthogonal guide portion 203M or the guide portion 203N faces the side surface of the electronic component 2 . A ventilation part 203a is provided inside the guide part 203M and the guide part 203N, which connects the outside with the porous member 203c for guide. The ventilation unit 203a is connected to a gas supply circuit via a pipe (not shown) and is controlled by the control device 50 .

The guide portions 203M and 203N eject gas through the porous member 203c for guidance. As a result, a gas layer is formed along the side surfaces of the guide portions 203M and 203N. Therefore, when the electronic component 2 moves to the other orthogonal guide portions 203M and 203N for positioning, Non-contact of the electronic component 2 can also be maintained with respect to the guide portion 203M and the guide portion 203N. Therefore, the electronic components 2 are positioned via the gas layer, defects and cracks of the electronic components 2 are reduced, and the generation of particles due to contact can also be suppressed. Since the amount of gas ejected is only a small amount, the generation of particles caused by the air flow can also be suppressed. Furthermore, it is also possible to reduce shifting or falling of the electronic component 2 during transfer. In addition, as shown in FIG. 18 , the guide portion 203M and the guide portion 203N may be provided so that gas can be ejected through the porous member 203c for the guide. Therefore, even when the electronic component 2 moves to the guide portion 203M or the guide portion 203N side due to gravity during the rotation for reversal, the side surface of the electronic component 2 and the guide portion 203M or the guide portion 203N can be maintained. The guide portion 203N is non-contact and can reduce the influence on the electronic component 2 .

(12) The guide portion 203 as described above only needs to be provided along the outer edge of the facing surface 201 a so as to restrict the movement of the electronic component 2 . Therefore, it may be provided on the entire circumference of the facing surface 201a, or it may be provided on a part. For example, the guide portions 203 are continuously arranged across the corners as shown in FIG. 19(A) or along the corners as shown in FIG. 19(B) so that one of the orthogonal guide portions 203 side has a relatively positive pressure. This enables the electronic component 2 to be positioned. In addition, as shown in (B) of FIG. 19 , one of the orthogonal guide portions 203 may be continuous with the other orthogonal guide portion 203 .

(13) The number or size of the suction holes 201c, the opening 201d, the ejection port 203b, and the suction port 203d are not limited to the above-mentioned forms. The suction holding state and the non-contact state can be maintained by balancing the area of the facing surface 201a of the porous member 201 where the electronic component 2 is supported by the gas layer and the total area of the opening 201d. Furthermore, the number or size of the ejection ports 203b or the suction ports 203d may be determined so that they can be positioned on the other orthogonal guide part 203.

(14) The positions and shapes of the suction hole 201c, the opening 201d, the discharge port 203b, and the suction port 203d are not limited to the above-mentioned forms. For example, the shape of the opening 201d may be circular or rectangular as mentioned above, or may be other ellipse, polygon, rounded polygon, star, etc. shapes.

(15) By making the pickup collet 200 replaceable, it can be replaced according to the shape and size of the electronic component 2 . As the replaceable structure, the structure that can be sucked and held by magnets is simple, and the replacement operation is also easy. However, it only needs to be a structure in which the pickup collet 200 can be replaced. For example, it may be adsorption holding using negative pressure or a mechanical holding structure.

(16) The outer edge of the pickup collet 200 is not limited to a rectangular shape. Furthermore, the guide portion 203 only needs to be disposed along the outer edge of the electronic component 2 and does not need to be provided on the outer edge of the pickup collet 200 as described above. For example, as shown in FIG. 20 , the pickup collet 200 may have a base 202 with a curved outer edge such as a cylinder shape, and the guide part 203 may be arranged on the bottom surface. In addition, the opposing surface 201a is not limited to a rectangular shape.

[Other embodiments] The present invention is not limited to the above-described embodiments, and at the implementation stage, the structural elements can be modified and embodied within the scope that does not deviate from the gist of the invention. Furthermore, various inventions can be formed by appropriate combinations of the plurality of structural elements disclosed in the embodiments. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, structural elements in different embodiments may be combined appropriately.

1: Transfer device 2: Electronic parts 10: Supply device 11:Sheet 12: Supply carrier 13. 61: Carrier moving mechanism 20: Pickup device 21: Pickup head 22:Collet moving mechanism 23: Direction Change Department 24: Promotion on the Internet 30: Mounted device 31:joint head 31a:Nozzle 32: Head moving mechanism 50:Control device 51: Supply device control department 52: Go to the sales control department 53: Pickup Control Department 54: Joint head control part 56:Substrate stage control section 57:Storage Department 60: Substrate carrier 100: Installation device 200: Pick up collet 201:Porous components 201a: Opposite side 201b: back 201c:Suction hole 201d:Open your mouth 202:Pedestal 202a: Air supply hole 202b:Exhaust hole 202c:Mounting hole 203, 203K～203N: Guidance Department 203a: Ventilation Department 203b: spout 203c: Porous components for guidance 203d: Suction port 221, 321: Sliding mechanism 221a, 321a: Support frame 221b, 321b: Orbit 221c, 321c: slider 222, 322: Lifting mechanism 222a:Arm 222b: Loading and unloading department 222c: pin 231:Rotation part 231a, 232a: driving source 232:Angle change department 241:Support G: gas P1: supply position P2: handover position P3: Installation location RT: rotation trajectory X, Y, Z: axis direction θx, θz: direction

FIG. 1 is a front view showing a transfer device and a mounting device according to the embodiment. FIG. 2 is a plan view showing the transfer device and the mounting device according to the embodiment. FIG. 3(A) is a schematic cross-sectional view showing the principle of holding electronic components using a pickup collet, and FIG. 3(B) is a bottom perspective view of the base. Fig. 4 is a bottom perspective view showing the pickup collet and the attachment and detachment portion. Fig. 5 is an upper surface side perspective view showing the pickup collet and the attachment and detachment portion. FIG. 6 is a perspective view showing the direction changing unit. 7(A) to 7(E) are explanatory diagrams showing the positioning operation of electronic components by changing the orientation of the pickup collet. The left side is a side view and the right side is a bottom view of the pickup collet. 8(A) to 8(E) are explanatory diagrams showing other forms of positioning operations of electronic components by changing the orientation of the pickup collet. The left side is a side view, and the right side is a bottom view of the pickup collet. . FIG. 9 is a block diagram showing a control device of the transfer device and the mounting device. FIG. 10 is a flowchart showing the sequence of the pickup operation according to the embodiment. 11(A) to 11(D) are explanatory diagrams showing the pickup operation according to the embodiment. 12(A) to 12(F) are illustrations showing other examples of the positioning operation of electronic components by changing the orientation of the pickup collet. The left side is a side view and the right side is a bottom view of the pickup collet. 13(A) and 13(B) are schematic cross-sectional views showing a modification in which a guide portion having a discharge port is provided. 14(A) and 14(B) are schematic bottom views showing the principle of positioning electronic components by ejection of gas. 15(A) and 15(B) are schematic cross-sectional views showing another modification in which a guide portion having a discharge port is provided. FIG. 16 is a schematic cross-sectional view showing a modification in which a guide portion having a suction port is provided. FIG. 17 is a schematic cross-sectional view showing a modification in which a guide portion having a guide porous member is provided. 18 is a schematic cross-sectional view showing another modified example of a guide portion provided with a porous member having a guide member. 19(A) and 19(B) are bottom views showing modifications of the arrangement of the guide portion. 20(A) and 20(B) are a bottom perspective view (A) and a bottom view (B) showing a modification of the pickup collet.

21: Pickup head

23: Direction Change Department

200: Pick up collet

202:Pedestal

203K~203N: Guidance Department

221c:Slider

222:Lifting mechanism

222a:Arm

222b: Loading and unloading department

231:Rotation part

231a, 232a: driving source

232:Angle change department

X, Y, Z: axis direction

θx, θz: direction

Claims (13)

A picking device has a rectangular outer edge and picks up electronic parts, The pickup device is characterized by: Pick up the collet and suction and hold the electronic parts; and a direction changing part that changes the direction of the pickup collet, In the pick-up collet, It has a porous member having air permeability, and the gas supplied to the inside is ejected in a planar shape through pores on a surface facing the electronic component, The porous member is provided with a suction hole having an opening on the opposing surface to suck the electronic component by negative pressure. A guide portion is provided along the outer edge of the electronic component to restrict movement of the electronic component held by the opposing surface, The direction changing part has: a rotating part that rotates the pickup collet in such a manner that the opposing surface is reversed from the supply position of the electronic component; and The angle changing unit changes the angle of the pickup collet along a surface parallel to the opposing surface. The pickup device according to claim 1, wherein the changing angle formed by the angle changing unit is an angle at which the electronic component moves toward a corner of the facing surface by inversion. The pick-up device according to claim 1, wherein the rotating portion starts rotating from a position where the electronic component is picked up and stops at a position where the opposing surfaces are reversed. The pickup device according to claim 1, wherein the rotating portion returns to the inverted position after passing the reversed position of the opposing surface before stopping at the position where the opposing surface is reversed. Location. The pick-up device according to claim 1, wherein the angle changing unit changes the angle after picking up the electronic component, and then restores the angle after stopping at a position where the opposing surfaces are reversed. The pick-up device according to claim 1, wherein the angle changing unit changes the angle of the picked-up electronic component and restores the changed angle in a state where the opposing surface is rotated for reversal. The pick-up device according to claim 1, characterized in that a ventilation part is provided in the guide part, and the ventilation part makes one orthogonal side of the guide part better than the other orthogonal side of the guide part. The guide portion side becomes relatively positive pressure. The pickup device according to claim 7, wherein the ventilation part is provided in such a manner that gas can be ejected from one of the orthogonal guide parts. The pickup device according to claim 7, wherein the ventilation part is provided in a manner capable of sucking gas from another orthogonal side of the guide part. The pickup device according to claim 1, wherein the pickup collet is disposed in such a manner that gas can be ejected from at least one of the orthogonal guide portions via the porous member of the guide. The pick-up device according to claim 1, further comprising a collet moving mechanism capable of sucking and holding the pick-up collet close to the sheet to which the electronic component is attached. The position of the electronic component allows the suctioned and held electronic component to be peeled off from the sheet and transferred. The pickup device according to claim 1, characterized in that it has a control device, The control device causing the pick-up collet to suction-hold the electronic part, causing the angle changing unit to change the angle at which the pickup collet holding the electronic component is sucked, The rotation part rotates to reverse the pickup collet holding the electronic component by suction. A mounting device for mounting electronic components on a substrate, characterized by: The pickup device according to any one of claims 1 to 12; a bonding head, disposed movably relative to the pickup collet, and receiving the electronic component from the pickup collet; and A mounting device transfers the electronic component held by the bonding head to the substrate and mounts it.

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