JP2014011416A - Pickup device and method for semiconductor chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide pickup device and method for a semiconductor chip that can exfoliate an adhesive sheet without occurrence of break-down and normally pick up a semiconductor chip as a target even when the semiconductor chip is thin and large in size.SOLUTION: An exfoliating mechanism for promoting exfoliation from an adhesive sheet in a vacuum-suction-based pickup operation of a semiconductor chip is provided with a suction exfoliation area 52c for partially exfoliating an adhesive sheet 8b from a chip lower surface by vacuum-sucking the adhesive sheet 8b from suction recess portions among plural projecting portions brought into contact with the lower surface of the adhesive sheet 8b. The suction exfoliation area 52c is provided at the outside of a push-up member 53 which is freely upwardly and downwardly movably fitted to an opening portion 52d provided inside a chip range set on a suction face 52a in an exfoliating tool 52 and pushes up a semiconductor chip 8a* from the lower side. A predetermined range B in which the suction exfoliation area 52c is provided and an over-hung amount Ba are set to the extent that the semiconductor chip 8a is not broken due to exfoliation of the adhesive sheet 8b.

Description

  The present invention relates to a semiconductor chip pick-up device and a pick-up method for picking up a semiconductor chip that is divided into individual pieces in a wafer state and attached to an adhesive sheet.

  In the manufacturing process of a semiconductor device, a semiconductor chip (hereinafter simply referred to as “chip”) is cut out from a semiconductor wafer composed of a plurality of chips and divided into individual pieces. The divided chips are stuck and held on the adhesive sheet in the wafer state, and when these chips are taken out, they are sucked and held by the suction nozzle and picked up from the adhesive sheet. In this pick-up operation, it is necessary to peel the chip from the adhesive sheet, and as a method of peeling the chip, the wafer in a state of being conventionally attached to the adhesive sheet is placed on a suction stage provided with a suction groove, An adsorption peeling method is known in which the pressure-sensitive adhesive sheet is peeled from the lower surface of the chip by sucking the pressure-sensitive adhesive sheet from the lower surface side (see, for example, Patent Document 1). In the prior art shown in this patent document example, a dicing sheet with chips attached is held in a sheet holding mechanism in a tension state, and a suction stage provided with a plurality of suction grooves corresponding to the chip dimensions is provided as a dicing sheet. The dicing sheet is peeled for each suction groove by abutting against the lower surface of the sheet and vacuum suction from the suction groove.

JP-A-5-335405

  With the recent miniaturization of electronic components, chips tend to be thinner, and ultra-thin chips of 100 μm or less have come into practical use. Such a thinned chip has low rigidity and is easy to bend. In particular, in the case of a large part having a large planar size, it is difficult to handle and very easily damaged. For this reason, when the semiconductor chip is peeled from the adhesive sheet by the adsorption peeling method used in the prior art, the following problems are caused due to the size and shape of the suction groove.

  That is, if the pitch of the suction grooves is set narrow, the contact point between the chip and the adhesive sheet increases, and the range in which the adhesive sheet is actually peeled is narrowed. It cannot be made easy, and it is difficult to pick up the chip normally. On the other hand, if the pitch of the suction grooves is set wide, the bending external force acting on the chip when sucking the adhesive sheet is increased, and the resistance force of the chip can not withstand the bending external force and is damaged. In addition, in order to avoid the above-described damage in suction peeling, even when adopting a method of peeling by ejecting with an ejector pin, a thin and large-sized chip is likely to be similarly damaged by a pushing force. As described above, in the conventional chip pickup, it is difficult to pick up the chip by peeling off the adhesive sheet without causing damage to the chip when the chip is thin and large in size.

  Accordingly, the present invention provides a pick-up device for a semiconductor chip that can normally pick up the semiconductor chip by peeling the adhesive sheet without causing damage to the chip even when the target is a thin and large-sized semiconductor chip. And to provide a pickup method.

  A semiconductor chip pickup device according to the present invention is a pickup device that picks up a semiconductor chip that is divided into individual pieces in a wafer state and attached to an adhesive sheet, the sheet holding unit holding the adhesive sheet, and the sheet holding A pick-up mechanism for picking up the semiconductor chip from a pressure-sensitive adhesive sheet held by the pick-up head with a pick-up nozzle; A suction raising / lowering portion provided with a suction surface on the upper surface, and holding the lower surface of the adhesive sheet by the suction surface in the pickup and pushing up the semiconductor chip from below; Peeling mechanism for promoting peeling, the pickup mechanism and the peeling machine A control unit that controls, and the peeling mechanism is located inside the rectangular chip range set on the suction surface corresponding to the outer edge shape of the semiconductor chip in the suction lifting unit than the chip range. An opening having a small opening size and a push-up in which the upper and lower surfaces protrude from the adsorption surface and push the semiconductor chip from below through the adhesive sheet in a raised state, with a relative lifting operation freely fitted in the opening. A member and a suction recess between the convex portions formed in a predetermined range including an outer edge portion of the chip range outside the opening portion, with a plurality of convex portions contacting the lower surface of the adhesive sheet. A vacuum-sucking area in which the pressure-sensitive adhesive sheet in the range corresponding to the vacuum recess is peeled from the semiconductor chip by vacuum suction, and vacuum suction is vacuumed from the suction surface and vacuum recess. And the predetermined range is a state in which the outer edge portion of the semiconductor chip to be picked up supported by the push-up member on the lower surface side of the central portion extends in a cantilevered state to the suction peeling area. It is set according to the bending strength of the semiconductor chip so that the semiconductor chip to be picked up or the adjacent semiconductor chip does not break due to peeling of the adhesive sheet or pushing up by the pushing-up member, and the control unit By controlling the pickup mechanism and the peeling mechanism, the suction raising / lowering unit is raised with respect to the sheet holding unit, the lower surface of the adhesive sheet is sucked and held by the suction surface, and then vacuum suction is performed from the suction recess. To peel the adhesive sheet from the semiconductor chip in the suction peeling area, and The push-up member is raised to push up the semiconductor chip to be picked up from below and picked up by holding the semiconductor chip from the upper surface by the suction nozzle.

  The method for picking up a semiconductor chip according to the present invention includes: a sheet holding unit that holds an adhesive sheet; a pickup mechanism that picks up the semiconductor chip from a pressure-sensitive adhesive sheet held by the sheet holding unit by a pickup head including a suction nozzle; A suction lifting unit disposed below the sheet holding unit and moving up and down relatively with respect to the sheet holding unit and having a suction surface provided on an upper surface thereof; A peeling mechanism for promoting the peeling of the semiconductor chip from the adhesive sheet by pushing up and holding the semiconductor chip from below, and a controller for controlling the pickup mechanism and the peeling mechanism, and the peeling mechanism Corresponding to the outer edge shape of the semiconductor chip in the suction lifting part An opening that opens with a smaller opening size than the chip range inside a rectangular chip range set on the wearing surface, and a relative lifting operation is freely fitted in the opening, and the upper surface is in the raised state. A push-up member that protrudes from the suction surface and pushes up the semiconductor chip from below through an adhesive sheet, and is formed in a predetermined range including an outer edge of the chip range outside the opening, and a plurality of members are formed on the lower surface of the adhesive sheet. A suction peeling area for peeling the pressure-sensitive adhesive sheet in a range corresponding to the suction recess from the semiconductor chip by vacuum suction from the suction recess between the projections in a state where the projections are in contact, and the suction surface and the suction recess From a semiconductor chip pick-up device having a vacuum suction section for vacuum suction from the wafer, the wafer is divided into individual pieces and attached to the adhesive sheet. A pick-up method for picking up a semiconductor chip, wherein the predetermined range is such that an outer edge portion of a pick-up target semiconductor chip supported on the lower surface side of a central portion by the push-up member extends in a cantilever state to the suction peeling area In the state, it is set according to the bending strength of the semiconductor chip so that the semiconductor chip to be picked up or the adjacent semiconductor chip does not break due to peeling of the adhesive sheet or pushing up by the pushing member, The control unit controls the pickup mechanism and the peeling mechanism to raise the suction lifting unit with respect to the sheet holding unit, and suck and hold the lower surface of the adhesive sheet by the suction surface, and then from the suction recess Adhesive sheet in the suction peeling area by vacuum suction Is peeled from the semiconductor chip, and the push-up member is raised to push up the semiconductor chip to be picked up from below, and the semiconductor chip is sucked and held from the upper surface by the suction nozzle and picked up.

  According to the present invention, a rectangular chip range set on the suction surface corresponding to the outer edge shape of the semiconductor chip in the suction lift unit in the peeling mechanism that promotes peeling from the adhesive sheet in the pickup by vacuum suction of the semiconductor chip. An opening having an opening size smaller than the chip range is provided on the inner side of the chip, and a relative raising and lowering operation is freely fitted in the opening. The upper surface protrudes from the suction surface in the raised state, and the semiconductor is interposed via an adhesive sheet. A push-up member that pushes the tip from below, and a suction recess between the projections formed in a predetermined range including the outer edge of the chip range outside the opening, with a plurality of projections contacting the lower surface of the adhesive sheet A vacuum peeling area to peel the adhesive sheet in the range corresponding to the vacuum recess from the semiconductor chip by vacuum suction. In the state where the outer edge portion of the semiconductor chip to be picked up supported by the push-up member on the lower surface side of the center portion extends in a cantilevered state to the suction peeling area, the adhesive sheet is peeled off or pushed up by the push-up member By setting the range so that the semiconductor chip to be picked up or the adjacent semiconductor chip does not break, the adhesive sheet can be used without causing damage to the chip even when targeting a thin and large semiconductor chip. The semiconductor chip can be normally picked up by peeling.

The perspective view of the component mounting apparatus of one embodiment of this invention 1 is a side sectional view of a component mounting apparatus according to an embodiment of the present invention. The perspective view of the peeling mechanism in the pick-up apparatus of the semiconductor chip of one embodiment of this invention Structure explanatory drawing of the peeling tool in the pick-up apparatus of the semiconductor chip of one embodiment of this invention The fragmentary sectional view of the peeling tool in the pick-up device of the semiconductor chip of one embodiment of the present invention Functional explanatory diagram of the peeling tool in the semiconductor chip pickup device of one embodiment of the present invention The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Process explanatory drawing of the pick-up method of the semiconductor chip of one embodiment of the present invention Process explanatory drawing of the pick-up method of the semiconductor chip of one embodiment of the present invention Structure explanatory drawing of the peeling tool in the pick-up apparatus of the semiconductor chip of one embodiment of this invention Process explanatory drawing of the pick-up method of the semiconductor chip of one embodiment of the present invention

  First, an overall configuration of a component mounting apparatus 1 in which a semiconductor chip pickup apparatus according to the present embodiment is incorporated will be described with reference to FIGS. The component mounting apparatus 1 is used in an electronic component mounting line for manufacturing a mounting substrate on which electronic components are mounted, and has a function of mounting a component such as a semiconductor chip on the substrate by bonding. In FIG. 1, a component supply stage 3, a unit assembly stage 4, and a substrate holding stage 7 are arranged on the base 2 in the Y direction, and a substrate transport unit 5 is located upstream of the substrate holding stage 7 in the X direction. Is arranged.

  A holding table 3a provided in the component supply stage 3 holds a semiconductor wafer unit 8 having a configuration in which a plurality of semiconductor chips 8a divided into pieces in a wafer state are bonded and held by an adhesive sheet 8b. The holding table 3a is a sheet holding unit that holds the adhesive sheet 8b. The unit assembly stage 4 has functions such as a tool stocker 17, a relay stage 18, and a component recognition camera 19, which will be described later, on a moving table 4 a that reciprocates in the X direction by a linear movement mechanism (see the X-axis movement mechanism 40 shown in FIG. 2). The unit is collectively arranged. The substrate holding stage 7 is configured to horizontally drive a substrate holding table 7b for receiving and holding the substrate 6 carried by the transport rail 7a by an XY table mechanism 73 (see FIG. 2). 8a is implemented. The substrate 6 is carried into the substrate holding stage 7 from the upstream side by the transport rail 5 a of the substrate transport unit 5.

  Above the component supply stage 3, the unit assembly stage 4 and the substrate holding stage 7, the Y-axis frame 11 is positioned at the end of the base 2 in the X direction, and both ends are supported by the support posts 11a in the Y direction. It is built in. On the front surface of the Y-axis frame 11 is incorporated a head moving mechanism 12 that guides and drives a first head 13 and a second head 14 described below in the Y direction by linear motor driving. A mounting unit 20 having a function of holding the semiconductor chip 8a and mounting it on the substrate 6 is mounted on the first head 13, and a function of applying an adhesive for bonding electronic components to the substrate 6 is mounted on the second head 14. A coating unit 21 having the above is mounted.

  Above the component supply stage 3, the relay stage 18, and the substrate holding stage 7, a first camera 22, a second camera 23, and a third camera 24 are disposed for position recognition. The first camera 22 images the semiconductor chip 8a to be taken out in the component supply stage 3. The second camera 23 takes an image of the semiconductor chip 8 a taken out from the component supply stage 3 and temporarily placed on the relay stage 18 for position correction. The third camera 24 captures an image of the board 6 held on the board holding stage 7 and recognizes the position of the component mounting point. The component recognition camera 19 disposed on the unit assembly stage 4 images the semiconductor chip 8a taken out from the component supply stage 3 from below.

  The component supply stage 3 includes an XY table mechanism 31, and a plurality of support members 33 are erected on a horizontal moving plate 32 mounted on the upper surface of the XY table mechanism 31. The support member 33 supports the holding table 3a on which the semiconductor wafer unit 8 is mounted and held on the upper surface. The semiconductor wafer unit 8 has a configuration in which a plurality of semiconductor chips 8a are bonded in a predetermined arrangement to an adhesive sheet 8b. On the adhesive sheet 8b, a plurality of semiconductor chips 8a that are divided into individual pieces are stuck and held in a face-up posture with the active surface facing upward.

  In the component supply stage 3, a pick-up work position [P1] for picking up the semiconductor chip 8a from the semiconductor wafer unit 8 is set. The position of the first camera 22 corresponds to the pickup work position [P1], and the position of the semiconductor chip 8a to be picked up is detected by recognizing the imaging result obtained by imaging the semiconductor wafer unit 8 by the first camera 22. Is done. A peeling mechanism 34 is disposed at a position corresponding to the pickup work position [P1] inside the holding table 3a.

  The peeling mechanism 34 has a function of promoting the peeling of the semiconductor chip 8a from the adhesive sheet 8b by sucking and holding the lower surface of the adhesive sheet 8b in the pickup and pushing up the semiconductor chip 8a from below. When the semiconductor chip 8a is taken out, the peeling mechanism 34 is moved up and down and brought into contact with the lower surface of the adhesive sheet 8b, whereby the pickup chip 16 described later can easily take out the semiconductor chip 8a from the adhesive sheet 8b. In the component take-out operation, by driving the XY table mechanism 31 and horizontally moving the adhesive sheet 8b in the XY direction, a desired semiconductor to be taken out of the plurality of semiconductor chips 8a attached to the adhesive sheet 8b. The chip 8a is positioned at the pickup work position [P1].

  Above the component supply stage 3, a pickup head 16 including a pickup nozzle 16a that sucks and holds the semiconductor chip 8a is disposed. The pickup head 16 is held by a pickup arm 15a. The pickup arm 15a extends from the pickup head moving mechanism 15 that is suspended from the lower surface of the Y-axis frame 11 and extends above the component supply stage 3. It has been. By driving the pickup head moving mechanism 15, the pickup arm 15 a moves in the XYZ directions and rotates around the axis in the X direction.

  Accordingly, the pickup head 16 performs an operation of picking up the semiconductor chip 8a from the component supply stage 3 and transferring it to the relay stage 18 provided in the unit assembly stage 4. Further, when necessary, the pickup head 16 can be retracted in the X direction from above the pickup operation position [P1]. Further, the pickup head 16 is reversed by rotating the pickup arm 15a, thereby picking up the pickup nozzle 16a. It is possible to reverse the orientation of the semiconductor chip 8a held on the front and back. In the above-described configuration, the pickup head 16 moved by the pickup head moving mechanism 15 and the pickup head moving mechanism 15 and mounted with the pickup nozzle 16a as the suction nozzle is attached to the adhesive sheet 8b held by the holding table 3a as the sheet holding unit. The pickup mechanism 16 picks up the semiconductor chip 8a by the pickup head 16 provided with the pickup nozzle 16a.

  The unit assembly stage 4 and the substrate holding stage 7 are provided on the upper surface of the base plate 72, and the base plate 72 is supported from below by a plurality of support posts 71 erected on the upper surface of the base 2. A moving table 4 a is provided on the plate 41 disposed on the upper surface of the base plate 72 via an X-axis moving mechanism 40 so as to be movable in the X direction. A tool stocker 17, a relay stage 18, and a component recognition camera 19 shown in FIG. 1 are collectively arranged on the moving table 4a. In the tool stocker 17, a plurality of work tools such as a component holding nozzle 20a mounted on the mounting unit 20 are used for each component type that are exchanged according to the component type.

  The relay stage 18 is disposed between the component supply stage 3 and the substrate holding stage 7 and is provided integrally with the tool stocker 17. The relay stage 18 includes a pickup head from the component supply stage 3. The semiconductor chip 8a taken out by 16 is placed for position correction. A relay position [P2] is set on the relay stage 18, and the second camera 23 is arranged corresponding to the relay position [P2]. By moving the relay stage 18 by the X-axis moving mechanism 40, the semiconductor chip 8a placed on the relay stage 18 can be positioned at the relay position [P2] and imaged by the second camera 23. The position of the semiconductor chip 8a placed on the stage 18 is detected. The component recognition camera 19 is disposed adjacent to the relay stage 18, and similarly, by driving the X-axis moving mechanism 40, the imaging position can be positioned at the component recognition position [P3].

  The substrate holding stage 7 has a configuration in which a substrate holding table 7 b for holding the substrate 6 is provided on the XY table mechanism 73. The substrate holding stage 7 is set with a mounting work position [P4] for mounting the semiconductor chip 8a on the substrate 6 received and held by the substrate holding table 7b. The third camera 24 has a mounting work position [P4]. ] Are arranged corresponding to the above. By imaging the board 6 with the third camera 24, the position of the component mounting point 6a set on the board 6 is detected. Then, by driving the XY table mechanism 73, the board holding table 7b moves horizontally in the XY direction together with the board 6, and an arbitrary component mounting point 6a set on the board 6 can be positioned at the mounting work position [P4]. it can.

  Next, the first head 13 and the second head 14 will be described. 2, two guide rails 12a for guiding the first head 13 and the second head 14 in the Y direction are provided on the front surface of the head moving mechanism 12 provided on the Y-axis frame 11. A stator 12b constituting a linear motor for driving a first head 13 and a second head 14 described below in the Y direction is disposed between the guide rails 12a. A slider (not shown) is fitted to the guide rail 12a so as to be slidable in the Y direction, and this slider is fixed to the back of the vertical moving plates 13a and 14a.

  On the back surface of the moving plates 13a and 14a, a mover (not shown) constituting a linear motor is disposed facing the stator 12b. By driving these linear motors, the first head 13 and the second head 14 are guided by the guide rail 12a and each move in the Y direction. Elevating mechanisms 13b and 14b are disposed on the front surfaces of the moving plates 13a and 14a, respectively, and elevating plates 13c and 14c are disposed on the front surfaces of the elevating mechanisms 13b and 14b so as to be slidable in the vertical direction. Driving the elevating mechanisms 13b and 14b raises and lowers the elevating plates 13c and 14c, respectively. A mounting unit 20 having a component holding nozzle 20a at its lower part is detachably mounted on the elevating plate 13c, and an application unit 21 is detachably mounted on the elevating plate 14c.

  The mounting unit 20 has a function of holding the semiconductor chip 8a, which is a component to be mounted, by the component holding nozzle 20a, and the substrate holding the semiconductor chip 8a supplied from the component supply stage 3 on the substrate holding stage 7 6 is installed. The application unit 21 includes a syringe 21 a that stores an adhesive for component bonding and an application nozzle 21 b that discharges the adhesive, and applies the adhesive discharged from the application nozzle 21 b to the component mounting points 6 a of the substrate 6.

  In the above configuration, the pickup head 16 mounted with the component supply stage 3, the pickup head moving mechanism 15, the pickup nozzle 16a and moved by the pickup head moving mechanism 15 and the peeling mechanism 34 described below are divided into individual pieces in the wafer state. A pickup device is configured to pick up the semiconductor chip 8a attached to the adhesive sheet 8b which is an adhesive sheet.

  FIG. 3 shows the configuration of the peeling mechanism 34 disposed below the holding table 3a in the semiconductor chip pickup device. The peeling mechanism 34 includes a mechanism main body 50, a support shaft portion 51 and a peeling tool 52 that are held up and down by the mechanism main body 50. The peeling tool 52 is prepared separately according to the shape and size of the target semiconductor chip 8a, and is attached to the upper surface of the support shaft portion 51 in a replaceable manner.

  A tool elevating mechanism (not shown) is built in the mechanism main body 50. By driving the tool elevating mechanism, the peeling tool 52 is relative to the adhesive sheet 8b held by the holding table 3a from the lower surface side. Up and down (arrow a). The upper surface of the peeling tool 52 is an adsorption surface 52a that adsorbs the lower surface of the adhesive sheet 8b in the sheet peeling operation. Therefore, the peeling tool 52 is a suction lifting unit that is provided with a suction surface 52a that sucks the lower surface of the adhesive sheet 8b and moves up and down relatively with respect to the holding table 3a.

  The suction surface 52a has a size including a chip range 52g (see FIG. 4A) set corresponding to the outer edge shape of the semiconductor chip 8a to be picked up, and has a rectangular suction peeling in plan view. An area 52c is provided. The suction peeling area 52c has a function of promoting the peeling by sucking the adhesive sheet 8b from the lower surface side when picking up the semiconductor chip 8a. Further, a rectangular opening 52d having an opening size smaller than the chip range 52g is provided inside the suction peeling area 52c in a rectangular shape similar to the chip range 52g, and a push-up member 53 is provided in the opening 52d. Are fitted so that they can move up and down.

  Adsorption holes 52b for adsorbing the lower surface of the adhesive sheet 8b are formed in a predetermined arrangement in the adsorption surface 52a, and the adsorption holes 53b are opened in the upper surface portion 53a of the push-up member 53. Note that the shape of the opening 52d is not necessarily similar to the chip range 52g, and does not cause a problem of peeling from the lower surface of the adhesive sheet 8b when the semiconductor chip 8a is pushed up by the push-up member 53 described later. I just need it.

  FIG. 4A shows a state in which the array of semiconductor chips 8a to be picked up is superimposed on the suction surface 52a of the peeling tool 52, and the semiconductor chip 8a * located in the center is the work target in the pick-up operation. It has become. That is, the peeling tool 52 is aligned so that the push-up member 53 is positioned at the center of the semiconductor chip 8a *. In this state, the outer edge portion of the semiconductor chip 8a * is included in the range of the suction peeling area 52c. .

  Further, the predetermined range of the suction / peeling area 52c includes an outer edge portion of the chip range of the semiconductor chip 8a adjacent to the semiconductor chip 8a * to be picked up. The suction holes 52b opened in the suction surface 52a communicate with a plurality of suction grooves 52h formed circumferentially and radially on the suction surface 52a, and these suction grooves 52h are obtained by vacuum suction from the suction holes 52b. It is possible to adsorb the adhesive sheet 8b over a wide range of the adsorption surface 52a. In FIG. 3, the suction groove 52h is not shown.

  FIG. 4B shows an AA cross section in FIG. The peeling tool 52 and the push-up member 53 are mechanically coupled to a first elevating mechanism 54 and a second elevating mechanism 55 built in the mechanism main body 50, respectively. By driving the first elevating mechanism 54, the entire peeling tool 52 is moved up and down (arrow b). Thereby, the adsorption | suction surface 52a can be made to contact / separate to the lower surface of the adhesive sheet 8b hold | maintained at the holding table 3a.

  Further, by driving the second elevating mechanism 55, the push-up member 53 can be moved up and down relatively with respect to the peeling tool 52 (arrow c), so that the upper surface portion 53a of the push-up member 53 can be moved in the raised state. Projecting from the suction surface 52a, only the semiconductor chip 8a * can be pushed up from below through the adhesive sheet 8b. The suction hole 52b and the suction hole 53b are connected to a vacuum suction part 56, and by driving the vacuum suction part 56, vacuum suction is performed from the suction holes 52b and 53b (see arrows d and e shown in FIG. 5).

  Here, the configurations and functions of the suction peeling area 52c and the push-up member 53 provided in the peeling tool 52 will be described. As shown in FIG. 5A, on the suction surface 52a, outside the opening 52d in which the push-up member 53 is fitted, a suction peeling area 52c having a configuration described below is provided on the semiconductor chip 8a * to be picked up. It is formed in a predetermined range B including both the outer edge E1 of the chip range and the outer edge E2 of the chip range of the semiconductor chip 8a adjacent to the semiconductor chip 8a *. In the suction / peeling area 52c, a plurality of convex portions 52e are provided in a regular arrangement (here, in the form of lattice dots), and a suction concave portion 52f that is open upward is formed between the convex portions 52e. The upper surface 53a of the push-up member 53 is also provided with a convex portion 52e and a suction concave portion 53f similar to the convex portion 52e and the suction concave portion 52f in the suction / peeling area 52c.

  The convex portions 52e and 53e and the suction concave portions 52f and 53f are formed by processing a lattice-like groove on the suction surface 52a and the upper surface portion 53a. In addition, although the example which formed the convex part 53e and the suction recessed part 53f not only on the suction peeling area 52c but on the upper surface part 53a of the pushing-up member 53 is shown, such a protruding part 53e, The suction recess 53f is not necessarily essential, and a simple protrusion may be provided.

  FIG. 5B shows a state where the peeling tool 52 is raised and the suction surface 52a is brought into contact with the lower surface of the adhesive sheet 8b. In this state, the vacuum suction section 56 (see FIG. 4) is driven to perform vacuum suction from the suction holes 52b and 53b (arrows d and e), so that the suction recesses 52f and 53f in the suction separation area 52c and the upper surface section 53a Vacuum sucked. As a result, as shown in FIG. 5C, the pressure-sensitive adhesive sheet 8b in the range corresponding to the suction recesses 52f and 53f in the suction / peeling area 52c and the upper surface portion 53a is sucked downward and peeled from the semiconductor chips 8a * and 8a. The

  At this time, the predetermined range B in which the suction peeling area 52c is formed includes the outer edge E1 of the chip range of the semiconductor chip 8a * to be picked up and the outer edge E2 of the chip range of the semiconductor chip 8a adjacent to the semiconductor chip 8a *. Therefore, not only the outer edge of the semiconductor chip 8a * taken out by the pickup operation but also the vicinity of the outer edge of the adjacent semiconductor chip 8a, the adhesive sheet 8b is arranged from the lower surface of the chip to the suction recesses 52f and 53f. Depending on the condition, it can be partially peeled off. Since the peeling by the suction peeling area 52c is performed prior to the pickup operation, the adhesive force of the pressure-sensitive adhesive sheet 8b in a range where defects such as chip breakage are likely to occur during the pickup operation can be greatly weakened. Therefore, even when the target is a semiconductor chip that is thin, has a large planar size, is low in rigidity, and is easily damaged, it is possible to easily peel off the adhesive sheet 8b during pickup.

  As described above, in order to employ a method in which the peeling tool 52 is provided with the suction peeling area 52c so as to facilitate the peeling of the adhesive sheet 8b in advance, a predetermined range B in which the suction peeling area 52c is formed is used as a target semiconductor chip. It is necessary to set appropriately according to the characteristics of 8a. That is, the breakage characteristic of the semiconductor chip at the time of pick-up depends on the distance (overhang amount) from the end face of the semiconductor chip 8a * to the end face of the push-up member 53. This overhang amount depends on the setting of the predetermined range B. It is prescribed by.

  Here, with reference to FIG. 6, the relationship between the appropriateness of the setting of the predetermined range B and the overhang amount and defects such as chip breakage occurring during the pickup operation will be described. Here, the semiconductor in the pickup operation in which the semiconductor chip 8a * adsorbed and held by the pickup nozzle 16a is raised while being pushed up by the push-up member 53 after the pressure-sensitive adhesive sheet 8b in the predetermined range B is partially peeled in advance by the suction peel area 52c. The behavior of the chips 8a *, 8a and the adhesive sheet 8b is shown.

  First, FIG. 6A shows a predetermined range B1 of the suction peeling area 52c and the pickup target semiconductor chip 8a * on the suction peeling area 52c with respect to the bending characteristics such as the planar size and thickness of the semiconductor chip 8a to be worked. In this example, the overhang amount B1a extending in a cantilever state is appropriately set. That is, here, the adhesive sheet 8b that is peeled off from the semiconductor chip 8a in the suction peeling area 52c and then sucked and held in the suction peeling area 52c is pushed up by the push-up member 53 and displaced upward. The predetermined range B1 and the overhang amount B1a are set so that the separation point F1 that is separated from the suction / peeling area 52c and rises obliquely upward is located below the semiconductor chip 8a * in a state of being connected to the lower surface. . As a result, chip breakage that occurs in the following two examples can be effectively prevented.

  That is, FIG. 6B shows the predetermined range B2 of the suction peeling area 52c and the overhang amount B2a of the semiconductor chip 8a * to be picked up with respect to the bending characteristics such as the planar size and thickness of the semiconductor chip 8a. The example set too small rather than the appropriate example shown to (a) is shown. Here, the predetermined range B2 and the overhang amount B2a are small, and the distance from the end surface of the push-up member 53 to the end surface of the adjacent semiconductor chip 8a is small. Accordingly, the separation point F2 that separates from the suction / peeling area 52c and rises upward is located below the adjacent semiconductor chip 8a, not the semiconductor chip 8a *. For this reason, in the process in which the pressure-sensitive adhesive sheet 8b is pushed upward by the push-up member 53, the vicinity of the end of the semiconductor chip 8a is lifted by the pressure-sensitive adhesive sheet 8b, resulting in a problem that a broken portion (8a) is partially formed. .

  On the other hand, FIG. 6C shows a predetermined range B3 of the suction peeling area 52c and an overhang amount B3a of the semiconductor chip 8a * with respect to the bending characteristics such as the planar size and thickness of the semiconductor chip 8a * to be picked up. However, the example which was set more excessively than the appropriate example shown to Fig.6 (a) is shown. Here, since the predetermined range B3 is large and the overhang amount B3a can be increased, a sufficient range for the adhesive sheet 8b to be peeled from the semiconductor chip 8a is secured by the suction peeling area 52c, and the peeled adhesive sheet 8b is sucked. It is adsorbed and held in a wide range in the peeling area 52c. When the semiconductor chip 8a * is pushed up by the push-up member 53 in this state, the adhesive force of the pressure-sensitive adhesive sheet 8b remaining on the unpeeled portion is near the end of the semiconductor chip 8a * that is in a cantilever state with a large overhang amount B3a. A downward external force acts on the semiconductor chip 8a * due to the external force, and a broken portion (8a *) is partially generated in the semiconductor chip 8a * having poor bending rigidity.

  As described above, in order to effectively function the suction peeling area 52c provided in the peeling tool 52, the predetermined range B in which the suction peeling area 52c is formed is appropriately set, and the semiconductor chip 8a * is sucked in the pickup operation. It is required that an overhang amount extending on the peeling area 52c can be appropriately secured. That is, the adhesive sheet 8b is peeled off or pushed up in a state where the outer edge portion of the semiconductor chip 8a * to be picked up supported by the push-up member 53 on the lower surface side of the central portion extends in a cantilevered state to the suction peeling area 52c. The predetermined range B is set according to the bending strength of the semiconductor chip so that no breakage occurs in either the semiconductor chip 8a * to be picked up or the adjacent semiconductor chip 8a by pushing up. In this setting, a plurality of trials are performed using a plurality of types of peeling tools 52 in which the size of the suction peeling area 52c is changed for a semiconductor chip that is actually a work target. A predetermined range is obtained.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 7, the control unit 60 controls the following mechanism units via the mechanism driving unit 61 based on the control program stored in the storage unit 64. Thereby, the semiconductor chip 8 a is taken out from the component supply stage 3, and each operation for mounting the taken semiconductor chip 8 a on the substrate 6 held on the substrate holding stage 7 is executed. First, by controlling the component supply stage 3, the unit assembly stage 4, and the substrate holding stage 7, the component supply operation by the XY table mechanism 31 and the peeling mechanism 34 in the component supply stage 3 is controlled, and the X in the unit assembly stage 4 is controlled. The operation of the axis moving mechanism 40 is controlled, and further, the operation of the XY table mechanism 73 in the substrate holding stage 7 is controlled.

  Next, by controlling the head moving mechanism 12, the first head 13, the second head 14, and the pickup head moving mechanism 15, the pick-up operation for taking out the semiconductor chip 8 a from the component supply stage 3, and the pressure-sensitive adhesive sheet 8 b by the peeling mechanism 34. A peeling operation is performed, and a mounting operation is performed in which the semiconductor chip 8a taken out is transferred and mounted on the substrate 6 and bonded. That is, the pickup operation is executed by controlling the pickup head moving mechanism 15, and the semiconductor chip 8 a is transferred to the substrate 6 by controlling the first head 13 mounted with the mounting unit 20 together with the head moving mechanism 12. The mounting operation to be mounted is executed.

  Further, by controlling the second head 14 to which the coating unit 21 is mounted together with the head moving mechanism 12, a paste coating function for discharging a component bonding paste from the coating nozzle 21b and supplying it to the substrate is executed. In the above-described various operation controls, the control unit 60 controls the recognition processing unit 62 so that the following recognition processing of imaging results by each camera is performed. The position of the semiconductor chip 8a in the semiconductor wafer unit 8 held on the component supply stage 3 is detected by performing recognition processing on the imaging result of the first camera 22, and the control unit 60 uses the XY table mechanism 31 based on the detection result. The semiconductor chip 8a to be picked up can be correctly aligned with the pick-up work position [P1]. The position of the semiconductor chip 8a in the state of being placed on the relay stage 18 is detected by performing recognition processing on the imaging result obtained by the second camera 23, and the control unit 60 detects the position of the first head 11 and X on the basis of the detection result. By controlling the shaft moving mechanism 40, the component holding nozzle 20a can be correctly aligned with the semiconductor chip 8a to be picked up. Further, by imaging the work tool stored in the storage recess of the tool stocker 17 by the second camera 23, the type of the work tool can be identified as described above.

  Further, by recognizing the imaging result of the third camera 24, the position of the component mounting point 6a of the board 6 in the state of being held on the board holding stage 7 is detected, and based on this detection result, the control unit 60 performs the XY table. By controlling the mechanism 73, the component mounting point 6a is aligned with the mounting work position [P4], and the semiconductor chip 8a held by the component holding nozzle 20a can be correctly mounted on the component mounting point 6a. . The position of the semiconductor chip 8a in the state of being held by the component holding nozzle 20a is detected by recognizing the imaging result of the component recognition camera 19, and in the mounting operation by the mounting unit 20, this detection result is taken into account. Position correction at the time of mounting is performed.

  In the above configuration, the control unit 60 controls the pickup mechanism and the peeling mechanism 34, whereby the semiconductor chip pickup operation is executed. That is, by lifting the peeling tool 52 that is a suction raising / lowering unit with respect to the holding table 3a that is a sheet holding unit, the lower surface of the adhesive sheet 8b is sucked and held by the suction surface 52a, and then vacuum sucked from the suction recess 52f. In the suction peeling area 52c, the adhesive sheet 8b is peeled from the semiconductor chip 8a, and the push-up member 53 is raised to push up the semiconductor chip 8a * to be picked up from below, and the semiconductor chip 8a * is sucked from the upper surface by the pickup nozzle 16a. Hold and pick up.

  This semiconductor chip pickup device is configured as described above. Next, the flow of the pickup operation by this pickup device will be described with reference to FIGS. FIG. 8A shows a state where the semiconductor wafer unit 8 held on the holding table 3a is moved and the semiconductor chip 8a * to be picked up is aligned with the peeling tool 52 of the peeling mechanism. In this state, the push-up member 53 is located below the center portion of the semiconductor chip 8a *. Thereafter, as shown in FIG. 8B, the peeling tool 52 is raised (arrow f), and the suction surface 52a is brought into contact with the lower surface of the adhesive sheet 8b. Thereby, the convex parts 52e and 53e will be in the state which contacted the lower surface of the adhesive sheet 8b. Next, as shown in FIG. 8C, the pickup nozzle 16a is positioned and lowered with respect to the semiconductor chip 8a * to be picked up (arrow g).

  Thereafter, prior to picking up the semiconductor chip 8a *, the adhesive sheet 8b is peeled off by the suction peeling area 52c and the upper surface portion 53a of the push-up member 53. That is, the vacuum suction part 56 is driven and vacuum suction is performed from the suction holes 52b and 53b (arrows d and e) as shown in FIG. As a result, the pressure-sensitive adhesive sheet 8 b corresponding to the suction recesses 52 f and 53 f in the suction separation area 52 c and the upper surface portion 53 a of the push-up member 53 is peeled from the lower surface of the semiconductor chip 8 a *. Adsorbed and held. Prior to this, vacuum suction is performed from the pickup nozzle 16a (arrow h), whereby the semiconductor chip 8a * is attracted and held on the lower surface of the pickup nozzle 16a. Thereby, the effect of suppressing wave-like deformation due to the semiconductor chip 8a * being sucked downward during vacuum suction by the suction holes 52b and 53b is obtained.

  Next, by driving the second elevating mechanism 55 (see FIG. 4), as shown in FIG. 9B, the push-up member 53 is raised (arrow i), and the adhesive sheet 8b is moved by the upper surface portion 53a. The semiconductor chip 8a * is pushed up from below. At this time, the adhesive sheet 8b is sucked and held at the bottom of the suction peeling area 52c, and rises obliquely upward from the separation point F located below the semiconductor chip 8a * and is connected to the upper surface portion 53a. As shown in FIG. 6B, there is no problem that the end of the adjacent semiconductor chip 8a is lifted by the adhesive sheet 8b and broken. Further, since the predetermined range B1 and the overhang amount B1a of the suction / peeling area 52c are set in advance in consideration of the bending characteristics of the semiconductor chip 8a to be worked, a pickup as shown in FIG. There is no problem that the end of the target semiconductor chip 8a * breaks due to the adhesive force of the adhesive sheet 8b.

  In this manner, the adhesive sheet 8b in a range corresponding to the suction peeling area 52c is partially peeled from the lower surface of the chip prior to the operation of taking out the semiconductor chip 8a * by the pickup nozzle 16a, and then the pickup nozzle 16a is raised. (Arrow j) The semiconductor chip 8a * is completely peeled off from the adhesive sheet 8b held on the upper surface portion 53a of the push-up member 53 and taken out from the semiconductor wafer unit 8 held on the holding table 3a.

  FIG. 10 shows an example in which the configuration and shape of the push-up member 53 are changed in the peeling tool 52 shown in FIG. That is, in the push-up member 53 shown in FIG. 4, the configuration example in which the convex portion 53e and the suction concave portion 53f are formed on the upper surface portion 53a is shown, but here, instead of the push-up member 53 having such a configuration, the following The push-up member 53A having the configuration is used. That is, the push-up member 53 </ b> A is fitted in the opening 52 d so as to be movable up and down like the push-up member 53, and is lifted and lowered by the second lift mechanism 55. Inside the push-up member 53A, a projecting member 57 is further fitted by a third elevating mechanism 58 so as to be raised and lowered. Similarly to the embodiment shown in FIG. 4, the suction peeling area 52c is provided with a convex portion 52e and a suction concave portion 52f having the same function.

  As shown in FIG. 10A, the projecting member 57 has an X shape in plan view, and as shown in FIG. 10B, an abutment convex portion 57b is formed on the upper surface portion 57a. By driving the first lifting / lowering mechanism 54, the entire peeling tool 52 is lifted / lowered (arrow k), whereby the suction surface 52a can be brought into and out of contact with the lower surface of the adhesive sheet 8b held by the holding table 3a.

  Further, by driving the second elevating mechanism 55, the push-up member 53A can be moved up and down relatively with respect to the peeling tool 52 (arrow l), whereby the upper surface portion 57a of the projecting member 57 is raised in the raised state. Projecting from the suction surface 52a, only the semiconductor chip 8a * can be pushed up from below through the adhesive sheet 8b. The suction hole 52b is connected to a vacuum suction part 56 (see FIG. 4), and vacuum suction is performed from the suction hole 52b by driving the vacuum suction part 56 (see arrow d shown in FIG. 11A).

  Next, with reference to FIG. 11, an example in which a peeling operation at the time of a pickup operation is performed by the peeling tool 52 to which the push-up member 53A shown in FIG. 10 is attached will be described. FIG. 11A shows a state in which the semiconductor chip 8a * to be picked up is aligned with the peeling tool 52, the peeling tool 52 is raised, and the suction surface 52a is brought into contact with the lower surface of the adhesive sheet 8b. Yes.

  Here, with the pickup nozzle 16a positioned and lowered with respect to the semiconductor chip 8a * to be picked up, the second lifting mechanism 55 is driven to raise the push-up member 53A together with the protrusion member 57 (arrow n). ), The semiconductor chip 8a * is pushed up from below through the adhesive sheet 8b. Prior to this, the vacuum suction section 56 (FIG. 4) is driven to perform vacuum suction from the suction hole 52b (arrow d). As a result, as in the state shown in FIG. 9B, the adhesive sheet 8b corresponding to the suction recesses 52f and 53f in the suction peeling area 52c is peeled from the lower surface of the semiconductor chip 8a *, and the suction peeling area 52c Adsorbed and held. At this time, by vacuum suction from the pickup nozzle 16a (arrow h), the semiconductor chip 8a * is held by suction on the lower surface of the pickup nozzle 16a.

  Next, by driving the second elevating mechanism 55 (see FIG. 4), as shown in FIG. 11B, the projecting member 57 is raised with respect to the push-up member 53A (arrow o) and contacted. The protrusion 57b pushes up the semiconductor chip 8a * from below through the adhesive sheet 8b and raises the pickup nozzle 16a (arrow p), thereby holding the semiconductor chip 8a * on the upper surface 53a of the push-up member 53. The sheet 8b is completely peeled off and taken out from the semiconductor wafer unit 8 held on the holding table 3a.

  Also in this configuration, the adhesive sheet 8b is adsorbed and held at the bottom of the suction peeling area 52c, rises obliquely upward from the separation point F located below the semiconductor chip 8a *, and is connected to the upper surface of the push-up member 53A. Therefore, there is no problem that the end portions of the adjacent semiconductor chips 8a are lifted by the adhesive sheet 8b and broken as shown in FIG. Further, since the predetermined range B1 and the overhang amount B1a of the suction / peeling area 52c are set in advance in consideration of the bending characteristics of the semiconductor chip 8a to be worked, a pickup as shown in FIG. There is no problem that the end of the target semiconductor chip 8a * breaks due to the adhesive force of the adhesive sheet 8b.

  In the present embodiment, various configurations are possible for the configuration of the push-up member 53, and the configuration of the push-up members 53 and 53A shown in FIGS. 4 and 9 is not limited thereto. For example, as shown in FIG. 11C, a push-up member 53B having a configuration in which an ejector pin 59 that protrudes from the upper surface portion 53a and advances and retreats may be used in the push-up member 53 of FIG. That is, in this example, as shown in FIGS. 9B and 9C, the pick-up nozzle 16a holding the semiconductor chip 8a * is raised (arrow o), and the ejector pin 59 is attached to the sticker during the pick-up operation for taking out the semiconductor chip 8a *. The sheet 8b is lifted through (arrow q), and the lower surface of the semiconductor chip 8a * is pushed up, so that the peeling of the adhesive sheet 8b is more surely promoted.

  As described above, in the semiconductor chip pick-up apparatus and pick-up method shown in the present embodiment, the peeling tool 52 is used as a semiconductor in the peeling tool 52 in the pick-up by vacuum suction of the semiconductor chip 8a to promote the peeling from the adhesive sheet 8b. An opening 52d opening with an opening size smaller than the chip range 52g inside a rectangular chip range 52g set on the suction surface corresponding to the outer edge shape of the chip 8a, and a relative lifting operation can be freely performed in the opening 52d. In the raised state, the upper surface protrudes from the suction surface 52a and pushes up the semiconductor chip 8a * from below through the adhesive sheet 8b, and includes the outer edge of the chip range 52g outside the opening 52d. It is formed in a predetermined range B, and a plurality of convex portions 52e are brought into contact with the lower surface of the adhesive sheet 8b. And a structure in which a suction exfoliation area 52c for peeling the adhesive sheet 8b in the range corresponding to the suction recess 52f from the semiconductor chip by vacuum suction from the suction recess 52f between the convex portion 52e in the state.

  Then, the outer edge portion of the semiconductor chip 8a * to be picked up supported by the push-up member 53 on the lower surface side of the central portion extends in a cantilevered state to the suction peeling area 52c in a predetermined range B where the suction peeling area 52c is formed. In the state, the semiconductor chip 8a, 8a * is set in a range in which the semiconductor sheet 8a, 8a * does not break due to the peeling of the adhesive sheet 8b. Without removing the adhesive sheet 8b, the semiconductor chip 8a can be picked up normally.

  The semiconductor chip pick-up apparatus and pick-up method of the present invention normally picks up a semiconductor chip by peeling off the adhesive sheet without causing damage to the chip even when targeting a thin and large-sized semiconductor chip. This is effective in the field where a thin semiconductor chip is taken out from an adhesive sheet as a pickup target and mounted on a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Component supply stage 6 Substrate 8 Semiconductor wafer unit 8a, 8a * Semiconductor chip 8b Adhesive sheet 15 Pickup head moving mechanism 16 Pickup head 16a Pickup nozzle 34 Peeling mechanism 52 Peeling tool 52a Suction surface 52b, 53b Suction hole 52c Suction Peeling area 52d Opening 52e, 53e Protrusion 52f, 53f Suction recess 52g Tip range 53, 53A, 53B Push-up member

Claims (3)

A pickup device that picks up a semiconductor chip divided into individual pieces in a wafer state and attached to an adhesive sheet,
A sheet holding unit for holding the adhesive sheet;
A pickup mechanism that picks up the semiconductor chip from a pressure-sensitive adhesive sheet held by the sheet holding unit by a pickup head having a suction nozzle;
A suction raising / lowering portion disposed below the sheet holding portion and moving up and down relatively with respect to the sheet holding portion, and having an adsorption surface provided on an upper surface thereof; A peeling mechanism that promotes the peeling of the semiconductor chip from the adhesive sheet by adhering and holding by the surface and pushing up the semiconductor chip from below,
A control unit for controlling the pickup mechanism and the peeling mechanism;
The peeling mechanism has an opening that opens with an opening size smaller than the chip range inside a rectangular chip range set on the suction surface corresponding to the outer edge shape of the semiconductor chip in the suction lifting unit,
A push-up member that is provided by freely fitting and moving up and down relative to the opening, and in the raised state, the upper surface protrudes from the suction surface and pushes the semiconductor chip from below through an adhesive sheet;
Formed in a predetermined range including the outer edge of the chip range outside the opening, and vacuum suction is performed from a suction recess between the protrusions with a plurality of protrusions contacting the lower surface of the adhesive sheet. A suction peeling area for peeling the adhesive sheet in a range corresponding to the suction recess from the semiconductor chip,
A vacuum suction part for vacuum suction from the suction surface and the suction recess,
Further, the predetermined range may be the separation of the pressure-sensitive adhesive sheet in the state where the outer edge portion of the semiconductor chip to be picked up supported by the push-up member on the lower surface side of the central portion extends in a cantilevered state to the suction peeling area. It is set according to the bending strength of the semiconductor chip so that the semiconductor chip to be picked up or the adjacent semiconductor chip is not broken by the push-up by the push-up member,
The control unit controls the pickup mechanism and the peeling mechanism to raise the suction raising / lowering unit with respect to the sheet holding unit, and suction and hold the lower surface of the adhesive sheet by the suction surface, and then the suction recess The adhesive sheet is peeled from the semiconductor chip in the suction peeling area by vacuum suction from the semiconductor chip, and the push-up member is lifted to push up the semiconductor chip to be picked up from below, and the semiconductor nozzle is sucked from the upper surface by the suction nozzle. A pick-up device for a semiconductor chip, characterized by holding and picking up.   2. The semiconductor chip pickup device according to claim 1, wherein the predetermined range is set including an outer edge portion of a chip range of a semiconductor chip adjacent to a semiconductor chip to be picked up. A sheet holding unit for holding the adhesive sheet; a pickup mechanism for picking up the semiconductor chip from the adhesive sheet held by the sheet holding unit by a pickup head provided with a suction nozzle; and a lower part of the sheet holding unit. It has a suction raising / lowering part which is moved up and down relatively with respect to the sheet holding part and provided with a suction surface on the upper surface. In the pickup, the lower surface of the adhesive sheet is sucked and held by the suction surface and the semiconductor chip is lowered A peeling mechanism that promotes peeling from the adhesive sheet of this semiconductor chip by pushing up from,
A control unit for controlling the pickup mechanism and the peeling mechanism;
The peeling mechanism has an opening that opens with an opening size smaller than the chip range inside a rectangular chip range set on the suction surface corresponding to the outer edge shape of the semiconductor chip in the suction lifting unit, Relative raising and lowering operations are freely fitted in the opening, and in the raised state, the upper surface protrudes from the suction surface and pushes up the semiconductor chip from below through an adhesive sheet, and the outside of the opening It is formed in a predetermined range including the outer edge of the chip range, and corresponds to the suction recess by vacuum suction from the suction recess between the protrusions with a plurality of protrusions contacting the lower surface of the adhesive sheet. A semiconductor chip having a suction peeling area for peeling the adhesive sheet in the range from the semiconductor chip, and a vacuum suction part for vacuum suction from the suction surface and the suction recess The pickup device, a pickup method for picking up a semiconductor chip adhered to the adhesive sheet is divided into pieces in a wafer state,
The predetermined range is the separation of the pressure-sensitive adhesive sheet or the push-up in a state where the outer edge portion of the semiconductor chip to be picked up supported by the push-up member on the lower surface side of the central portion extends in a cantilevered state to the suction peel area. It is set according to the bending strength of the semiconductor chip so as not to cause breakage of the semiconductor chip to be picked up or the adjacent semiconductor chip by pushing up by the member,
The control unit controls the pickup mechanism and the peeling mechanism to raise the suction raising / lowering unit with respect to the sheet holding unit, and suction and hold the lower surface of the adhesive sheet by the suction surface, and then the suction recess The adhesive sheet is peeled from the semiconductor chip in the suction peeling area by vacuum suction from the semiconductor chip, and the push-up member is lifted to push up the semiconductor chip to be picked up from below, and the semiconductor nozzle is sucked from the upper surface by the suction nozzle. A method of picking up a semiconductor chip, characterized by holding and picking up.

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