JPH07283249A - Chip push-up unit of die bonding device - Google Patents

Abstract

PURPOSE:To enable a chip push-up unit to push up a semiconductor chip quickly and stably independent of the size of the semiconductor chip and a wafer. CONSTITUTION:A suction drum 17 equipped with a suction surface 18 is arranged on the back of an adhesive sheet 12; a large number of projections 21 and recesses 22 are provided to the suction surface 18, a flow path 19 open to thin surface is provided to the suction drum 17 and has an opening at the suction surface 18; the flow path 19 communicates selectively with a vacuum pump 25 and a compressor 28; and the suction surface 18 is so set in size as to surround semiconductor chips which are provided adjacent to each other and around another semiconductor chip as a center.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip push-up unit of a die bonding apparatus which pushes up a semiconductor chip attached to an adhesive sheet from the back side of the adhesive sheet to separate the semiconductor chip.

[0002]

2. Description of the Related Art A wafer attached to an adhesive sheet is diced to form a large number of semiconductor chips. This semiconductor chip is picked up from the adhesive sheet using a die bonding apparatus and bonded to the island portion of the lead frame. In this bonding process, the chip push-up unit provided in the die bonding device pushes up the semiconductor chip from the back side of the adhesive sheet by using the push-up pin and separates the semiconductor chip from the adhesive sheet, facilitating pickup. Illustrated (first
Conventional example).

Further, as in the invention described in Japanese Patent Publication No. 5-36943, a pressure-sensitive adhesive sheet to which a large number of semiconductor chips are adhered is adsorbed on a suction surface of a vacuum plate in which a large number of grooves are formed, There is also one in which the suction sheet is sucked to reduce the adhesive area between the semiconductor chip and the adhesive sheet to facilitate the pickup of the semiconductor chip (second conventional example).

[0004]

However, the above-mentioned first problem
In the conventional example, when the size of the semiconductor chip is changed, it is necessary to change the number and shape of the push-up pins so that the peeling by the push-up pins can be efficiently performed, which makes the push-up work complicated. Become.

Further, in the second conventional example, since the suction surface of the vacuum plate for sucking the adhesive sheet is formed larger than the wafer, when the wafer is changed to a smaller wafer, the suction surface of the vacuum plate becomes It will come to the wafer ring position fixed to the outer periphery of the adhesive sheet. Therefore, as illustrated in Japanese Patent Publication No. 2-24379, for example, even if an adhesive sheet is stretched by pushing down the wafer ring to form a gap between adjacent semiconductor chips, the wafer ring collides with the vacuum plate. , The adhesive sheet cannot be stretched. Therefore, also in this case, it is necessary to change the vacuum plate according to the size of the wafer.

The present invention has been made in consideration of the above-mentioned circumstances, and a chip protrusion of a die bonding apparatus capable of quickly and stably pushing up a semiconductor chip regardless of the dimensions of the semiconductor chip or wafer. The purpose is to provide a lifting unit.

[0007]

According to a first aspect of the present invention, a large number of semiconductor chips attached to an adhesive sheet and divided from a wafer are pushed up from the back surface side of the adhesive sheet, and a pickup member is used. In a chip push-up unit of a die bonding apparatus that facilitates pickup of a semiconductor chip, a suction cylinder having a suction surface facing the back surface of the adhesive sheet and having a size smaller than the wafer diameter is provided. Arranged, a large number of irregularities are formed on the adsorption surface, a channel that opens to the adsorption surface is formed in the adsorption cylinder, this channel is selectively continuous to the negative pressure source or the atmosphere, Further, the suction cylinder and the pressure sensitive adhesive sheet are configured to be relatively moved in a direction along the surface of the pressure sensitive adhesive sheet.

According to a third aspect of the present invention, a large number of semiconductor chips attached to an adhesive sheet and divided from a wafer are pushed up from the back side of the adhesive sheet, and the semiconductor chip is picked up by a pickup member. In a chip pushing-up unit of a die bonding apparatus for facilitating the above, on the back surface side of the pressure-sensitive adhesive sheet, a suction cylinder having a suction surface facing the back surface and having a size smaller than the wafer diameter is arranged. A large number of irregularities are formed on the suction surface, a flow path that opens to the suction surface is formed in the suction cylinder, and this flow path is selectively connected to a negative pressure supply source or a high pressure supply source, and The suction cylinder and the pressure-sensitive adhesive sheet are configured to be relatively moved in a direction along the pressure-sensitive adhesive sheet surface.

[0009]

Therefore, according to the chip pushing-up unit of the die bonding apparatus according to the present invention as defined in claim 1 or 3, the suction is performed with the adhesive sheet having the wafer adhered thereon being arranged above the suction surface of the suction cylinder. When the flow path of the body is connected to the negative pressure source, the adhesive sheet is adsorbed on the uneven suction surface, the adhesive sheet corresponding to the concave portion of this suction surface is peeled off from the semiconductor chip, and this semiconductor chip is convex on the suction surface. It will be in a state of being pushed up to the department. As a result, this semiconductor chip can be easily picked up by the pickup member. In addition, in the present specification, "push-up" means not only the conventional positive push-up using a push-up pin, but also the pressure-sensitive adhesive sheet is adsorbed on the uneven suction surface and corresponds to the concave portion of the suction surface. It is used in the sense that the pressure-sensitive adhesive sheet is peeled off from the semiconductor chip and the semiconductor chip is pushed up by the convex portion of the suction surface.

Further, since the suction surface of the suction cylinder is set to a size smaller than the diameter of the wafer to be used, it is not necessary to change the suction cylinder even if the size of the semiconductor chip or the wafer is changed. Pushing up and picking up can be performed quickly and stably.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 (A) is a configuration diagram showing an embodiment of a chip push-up unit of a bonding apparatus according to the present invention, and FIG. 1 (B) shows the relationship between the suction cylinder and the wafer of FIG. 1 (A). It is a top view of the wafer shown. FIG. 2 is a partially enlarged plan view of FIG. FIG. 3 is a configuration diagram showing a sheet suction process in the chip push-up unit of FIG. FIG. 4 is a configuration diagram showing a sheet floating process in the chip push-up unit of FIG. 1 (A).

First, as shown in FIGS. 1A and 1B, the wafer 11 is attached to an adhesive sheet 12, and the adhesive sheet 12 is fixedly held by a wafer ring 13. The wafer 11 is diced before it is loaded into the sheet stretching device (not shown), and the chip push-up unit 10, and is divided into a large number of semiconductor chips 14.

The sheet stretching device stretches the pressure-sensitive adhesive sheet 12 so that an appropriate gap 1 is formed between the adjacent semiconductor chips 14.
5 to form a suction nozzle 16 as a pickup member.
Is used to facilitate picking up each semiconductor chip 14. In addition, the chip push-up unit 10
Is the adhesive sheet 12 to which the semiconductor chip 14 is attached,
The semiconductor chip 14 pushed up from the back side is peeled off from the adhesive sheet 12, and the suction nozzle 16
To facilitate the pickup of the semiconductor chip 14.

The die bonding apparatus has a chip transfer unit (not shown) having the suction nozzle 16 in addition to the sheet stretching device and the chip push-up unit 10. The suction nozzle 16 of this chip transfer unit
The semiconductor chip 14 picked up by (1) is transferred to the island portion of the lead frame (not shown) directly or via a positioning position as required, and is bonded to this island portion.

Now, as shown in FIG. 1A, the chip push-up unit 10 has a suction cylinder 17 having a suction surface 18.
And an air / vacuum circuit 20 connected to the flow path 19 of the suction cylinder 17.

The suction surface 18 of the suction cylinder 17 has a large number of protrusions 2.
1 and the concave portions 22 are alternately formed in a substantially lattice shape, and the flow path 19 is formed by opening to the suction surface 18. The convex portions 21 and the concave portions 22 may be randomly arranged and formed on the suction surface 18. Further, the area of the suction surface 18 is smaller than the diameter of the wafer 11 used and is set to a size equivalent to that of at least one semiconductor chip 14. In the example shown in FIG. Eight semiconductor chips 14b adjacent to the periphery of the chip 14a,
The size is set to substantially surround 14c, 14d, 14e, 14f, 14g, 14h and 14i.

In the air / vacuum circuit 20, a path 23 is connected via a first electromagnetic valve 24 to a vacuum pump 25 as a negative pressure supply source, and a path 26 is connected via a second electromagnetic valve 27 to a high pressure supply source. Is connected to the compressor 28 as shown in FIG.

One end of the path 23 is connected to the flow path 19 of the suction cylinder 17.
And one end of the path 26 is connected to the first solenoid valve 24. By turning on the first electromagnetic valve 24, the path 23 is connected to the vacuum pump 25, and the vacuum pump 2
5, the flow path 19 of the suction cylinder 17 is set to a negative pressure (FIG. 3). In addition, the first solenoid valve 24 is turned off, and
By turning on the solenoid valve 27, the paths 23 and 26 are connected to the compressor 28, and high-pressure air is supplied into the flow path 19 of the adsorption cylinder 17 (FIG. 4). When both the first solenoid valve 24 and the second solenoid valve 27 are turned off,
The flow path 19 of the suction cylinder 17 is opened to the atmosphere via the paths 23 and 26 (FIG. 1 (A)).

Next, the operation will be described. The adhesive sheet 12 to which the wafer 11 is diced and a large number of semiconductor chips 14 are attached is installed in a sheet stretching apparatus and stretched as needed to form appropriate gaps 15 between the semiconductor chips 14.

After that, the adhesive sheet 12 is moved in the XY directions to pick up the semiconductor chip 1 first.
4 is positioned almost at the center of the suction surface 18 of the suction cylinder 17, and as shown in FIG.
The first solenoid valve 24 in the air / vacuum circuit 20 is turned on and the second solenoid valve 27 is turned off, and the vacuum pump 25 sets the negative pressure in the flow passage 19 of the suction cylinder 17. Then, the suction surface 18 of the suction cylinder 17 and the adhesive sheet 12
A negative pressure is generated between the pressure sensitive adhesive sheet 12 and the suction surface 1
Adsorbed on 8. In this suction state, the pressure-sensitive adhesive sheet 12 is sucked by the convex portions 21 and the concave portions 22 of the suction surface 18, so that the portion corresponding to the concave portion 22 of the pressure-sensitive adhesive sheet 12 is peeled off from the semiconductor chip 14, and the semiconductor chip 14 is sucked by the suction surface 18. It is in a state of being pushed up by the convex portion 21 of. In this state,
The semiconductor chip 14 is picked up using the suction nozzle 16 of the chip transfer unit and bonded to the lead frame.

After picking up the semiconductor chip 14, FIG.
As shown in, the first solenoid valve 24 is turned off and the second solenoid valve 27 is turned on to supply high pressure air from the compressor 28 to the flow passage 19 of the suction cylinder 17 to suck the adhesive sheet 12. Float above the suction surface 18 of the body 17. After this floating, as shown in FIG. 1 (A), the second electromagnetic valve 27 is also turned off to open the flow path 19 of the suction cylinder 17 to the atmosphere, and the adhesive sheet 12 is moved in the left-right direction of FIG. 1 (A). Then, the next semiconductor chip 14 is positioned at the center position on the suction surface 18 of the suction cylinder 17. After that, the first electromagnetic valve 24 is turned on again and the second electromagnetic valve 27 is turned off again, so that the adhesive sheet 12 is adsorbed to the adsorption surface 18 of the adsorption drum 17 as described above.

According to the above embodiment, the first solenoid valve 24 is turned on and the second solenoid valve is turned on with the adhesive sheet 12 to which the wafer 11 is attached being arranged above the suction surface 18 of the suction cylinder 17. 27 is turned off, and the flow path 19 of the suction cylinder 17 is turned on.
Is connected to the vacuum pump 25, the adhesive sheet 12 is adsorbed to the adsorption surface 18, the adhesive sheet 12 corresponding to the concave portion 22 of the adsorption surface 18 is peeled from the semiconductor chip 14, and the semiconductor chip 14 is attached to the adsorption surface 18. The projection 21 is pushed up. As a result, the semiconductor chip 14 can be easily picked up by the suction nozzle 16.

Since the suction surface 18 of the suction cylinder 17 is set to have a size that substantially surrounds the eight semiconductor chips 14b to 14i adjacent to the periphery of one semiconductor chip 14a, the size of the semiconductor chip 14 is the same. Even if there is a change, it is not necessary to change the number of push-up pins as in the conventional case.
The suction cylinder 17 does not interfere with the wafer ring 13 even if the size is changed. Therefore, the semiconductor chip 1
4 and the size of the wafer 11 do not need to be changed, and the semiconductor chip 14 can be pushed up and picked up quickly and stably.

Further, since only the flow path 19 is formed in the suction cylinder 17, the push-up pin driving mechanism as in the conventional case is not required, so that the chip push-up unit 10 can be easily constructed and miniaturized. Also, the cost can be reduced.

Prior to moving the pressure-sensitive adhesive sheet 12 relative to the suction cylinder 17, the high-pressure air blown from the suction surface 18 of the suction cylinder 17 causes the pressure-sensitive adhesive sheet 12 to float, so that when the semiconductor chip is pushed up. The contact state between the adhesive sheet 12 and the suction surface 18 is completely released, and then the relative movement can be smoothly performed.

In the above embodiment, after picking up the semiconductor chip 14, the flow path 19 of the suction cylinder 17 is first connected to the compressor 28 before moving the adhesive sheet 12 to the left and right, and then opened to the atmosphere. However, while moving,
Alternatively, the connection between the flow path 19 and the compressor 28 may be maintained for a predetermined period after the movement is started. Furthermore, for example, when the tension applied to the pressure-sensitive adhesive sheet 12 is large and the flow path 19 of the suction cylinder 17 is not connected to the compressor 28 but only opened to the atmosphere, the close contact state can be released.
The compressor 28 may be moved after the connection state of the flow path 19 and the vacuum pump 25 is directly switched to the state of being opened to the atmosphere without specially providing the compressor 28.

In the above embodiment, the adhesive sheet 12 is moved with respect to the suction cylinder 17, but the suction cylinder 1
You may make it move 7.

Further, in the above embodiment, the size of the suction surface 18 of the suction cylinder 17 is set to the size shown in FIG.
Each time one semiconductor chip 14 to be picked up is pushed up, the pressure-sensitive adhesive sheet 12 and the suction cylinder 17 are moved relative to each other. However, the size of the suction surface 18 is set so as to surround a plurality of semiconductor chips 14. If so, they may be moved relative to each other each time a plurality of them are picked up.

[0029]

As described above, according to the chip pushing-up unit of the die bonding apparatus according to the present invention, the semiconductor chip can be quickly moved regardless of the size of the semiconductor chip or the wafer.
And it is possible to push up stably.

[Brief description of drawings]

1A is a configuration diagram showing an embodiment of a chip push-up unit of a bonding apparatus according to the present invention, and FIG. 1B is a suction cylinder and a wafer of FIG. 1A. It is a top view of a wafer which shows the relationship with.

FIG. 2 is a partially enlarged plan view of FIG. 1 (B).

FIG. 3 is a configuration diagram showing a sheet suction process in the chip push-up unit of FIG. 1 (A).

FIG. 4 is a configuration diagram showing a sheet floating process in the chip push-up unit of FIG. 1 (A).

[Explanation of symbols]

 10 Chip Push-up Unit 11 Wafer 12 Adhesive Sheet 14 Semiconductor Chip 16 Adsorption Nozzle 17 Adsorption Cylinder 18 Adsorption Surface 19 Flow Path 20 Air / Vacuum Circuit 21 Convex Surface of Adsorption Surface 22 Recessed Surface of Adsorption 24 First Solenoid Valve 25 Vacuum Pump 27 Second solenoid valve 28 Compressor

Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01L 21/68 E 21/301

Claims (4)

[Claims] 1. A chip of a die bonding apparatus for facilitating pickup of the semiconductor chip by a pickup member by pushing up a large number of semiconductor chips attached to an adhesive sheet and divided from a wafer from the back surface side of the adhesive sheet. In the push-up unit, on the back surface side of the pressure-sensitive adhesive sheet, a suction cylinder having a suction surface facing the back surface and having a size smaller than the wafer diameter is arranged, and a large number of irregularities are formed on the suction surface. At the same time, a channel opening to the adsorption surface is formed in the adsorption cylinder, the channel is selectively connected to the negative pressure source or the atmosphere, and the adsorption cylinder and the adhesive sheet are adhesive. A chip push-up unit for a die bonding apparatus, which is relatively moved in a direction along a sheet surface. 2. The flow path is connected to a negative pressure supply source when the semiconductor chip is projected, and the flow path is connected to the atmosphere when the suction cylinder and the adhesive sheet are relatively moved.
The chip push-up unit of the die bonding apparatus described in. 3. A chip of a die-bonding device for facilitating pickup of the semiconductor chip by a pickup member by pushing up a large number of semiconductor chips attached to an adhesive sheet and divided from a wafer from the back surface side of the adhesive sheet. In the push-up unit, on the back surface side of the pressure-sensitive adhesive sheet, a suction cylinder having a suction surface facing the back surface and having a size smaller than the wafer diameter is arranged, and a large number of irregularities are formed on the suction surface. At the same time, the suction cylinder is formed with a flow path opening to the suction surface, and this flow path is selectively connected to a negative pressure supply source or a high pressure supply source, and the suction cylinder and the adhesive sheet are , A chip push-up unit of a die bonding apparatus, which is relatively moved in a direction along the surface of the adhesive sheet. 4. The flow path is connected to a negative pressure supply source when the semiconductor chip is pushed up, and the flow path is connected to a high pressure supply source when the suction cylinder and the adhesive sheet are moved relative to each other. The chip push-up unit of the die bonding apparatus according to item 3.