JP2021016004A - Semiconductor manufacturing device and manufacturing method of semiconductor device - Google Patents

Abstract

To provide a semiconductor manufacturing device that allows a push-up unit to be easily changed according to the product type.SOLUTION: A semiconductor manufacturing device includes a push-up unit that pushes a die from under a dicing tape, a collet that sucks the die, and a control unit. The push-up unit includes a first unit having a plurality of square blocks in contact with the dicing tape, and a second unit having a plurality of blocks that independently transmit vertical movement to each of the plurality of blocks. The first unit is configured to be mounted on top of the second unit. The control unit is configured to perform both push-up and pull-down operations of the plurality of blocks in a mixed manner.SELECTED DRAWING: Figure 5

Description

The present disclosure relates to semiconductor manufacturing equipment and is applicable to, for example, a die bonder including a push-up unit.

Generally, in a die bonder in which a semiconductor chip called a die is mounted on the surface of, for example, a wiring board or a lead frame (hereinafter, collectively referred to as a board), the die is generally used by using a suction nozzle such as a collet. The operation (work) of transporting the bonding material onto the substrate, applying a pressing force, and heating the bonding material to perform bonding is repeated.

Among the die bonding steps by a semiconductor manufacturing apparatus such as a die bonder, there is a peeling step of peeling a die divided from a semiconductor wafer (hereinafter referred to as a wafer). In the peeling step, the die is pushed up from the back surface of the dicing tape by a pushing unit, peeled one by one from the dicing tape held in the die supply unit, and conveyed onto the substrate using a suction nozzle such as a collet.

For example, according to Japanese Patent Application Laid-Open No. 2012-4393 (Patent Document 1), when the die to be peeled is pushed up and peeled from the dicing tape among a plurality of dies attached to the dicing tape, the peripheral portion of the die The dicing tape in the predetermined portion is pushed up to form a peeling starting point, and then the dicing tape in the portion other than the predetermined portion is pushed up to peel the die from the dicing tape.

Japanese Unexamined Patent Publication No. 2012-4393

When picking up a die from a wafer, it is necessary to set a jig according to the type (for example, die size). However, the adjustment at the time of product exchange is complicated and takes time. Since the pickup operation is built in a structure that matches the operation specifications in advance in a multi-stage push-up or the like as in Patent Document 1, the push-up unit cannot be changed later.
An object of the present disclosure is to provide a semiconductor manufacturing apparatus capable of easily changing the push-up unit according to a product type.
Other challenges and novel features will become apparent from the description and accompanying drawings herein.

The following is a brief overview of the representative ones of the present disclosure.
That is, the semiconductor manufacturing apparatus includes a push-up unit that pushes up the die from under the dicing tape, a collet that sucks the die, and a control unit. The push-up unit includes a first unit having a plurality of square blocks in contact with the dicing tape, and a second unit having a plurality of blocks that independently transmit vertical movement to each of the plurality of blocks. The first unit is configured to be mounted on top of the second unit. The control unit is configured to perform both push-up and pull-down operations of a plurality of blocks in a mixed manner.

According to the above-mentioned semiconductor manufacturing apparatus, it is possible to easily change the push-up unit according to the type.

Conceptual diagram of the Die bonder according to the embodiment as viewed from above FIG. 1 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A. The figure which shows the external perspective view of the die supply part of FIG. Schematic cross-sectional view showing the main part of the die supply part of FIG. External perspective view of the push-up unit according to the embodiment Top view of a part of the first unit of FIG. Top view of a part of the second unit of FIG. Top view of a part of the third unit of FIG. Longitudinal sectional view of the push-up unit of FIG. Longitudinal sectional view of the push-up unit of FIG. The figure which showed the structure of the push-up unit and the collet part of the pickup head which concerns on embodiment. Flow chart for explaining the pickup operation of the die bonder according to the embodiment A flowchart for explaining a method of manufacturing a semiconductor device according to an embodiment. External perspective view of the push-up unit according to the modified example External perspective view of the push-up unit according to the modified example Vertical sectional view of the first unit of FIG. 12A. Vertical sectional view of a part of the push-up unit of FIG. 12A. Vertical cross-sectional view of the push-up unit of FIG. 14A with the first unit removed. External perspective view of the push-up unit according to the second modification Vertical sectional view of the third unit of FIG. Top view of a part of the third unit of FIG. Top view of a part of the modified example of the third unit of FIG.

Hereinafter, examples and modifications will be described with reference to the drawings. However, in the following description, the same components may be designated by the same reference numerals and repeated description may be omitted. In addition, in order to clarify the description, the drawings may schematically represent the width, thickness, shape, etc. of each part as compared with the actual embodiment, but this is just an example, and the interpretation of the present invention is used. It is not limited.

FIG. 1 is a top view showing an outline of a die bonder according to an embodiment. FIG. 2 is a diagram illustrating the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG.

The die bonder 10 is roughly divided into a die supply unit 1, a pickup unit 2, an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a board supply unit 6, and a board carry-out unit 7, and monitors the operation of each unit. It has a control unit 8 for controlling.

First, the die supply unit 1 supplies the die D to be mounted on the substrate P. The die supply unit 1 includes a wafer holding table 12 for holding the wafer 11, and a pushing unit 13 indicated by a dotted line for pushing the die D from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving means (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

The pickup unit 2 includes a pickup head 21 that picks up the die D, a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction, and drive units (not shown) that move the collet 22 up / down, rotate, and move in the X direction. Have. The pickup head 21 has a collet 22 (see also FIG. 2) that attracts and holds the pushed-up die D to the tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has drive units (not shown) that move the collet 22 up / down, rotate, and move in the X direction.

The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it on the conveyed substrate P, or bonds it in a form of being laminated on the die already bonded on the substrate P. The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) that attracts and holds the die D to the tip like the pickup head 21, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and a substrate. It has a substrate recognition camera 44 that captures a position recognition mark (not shown) of P and recognizes the bonding position.
With such a configuration, the bonding head 41 corrects the pickup position / orientation based on the image data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and bases the board based on the image data of the board recognition camera 44. Bond the die D to P.

The transport unit 5 includes a board transport pallet 51 on which one or a plurality of boards P (4 boards in FIG. 1) are placed, and a pallet rail 52 on which the board transport pallet 51 moves, and is provided in parallel. It also has first and second transport units having the same structure. The substrate transfer pallet 51 moves by driving a nut (not shown) provided on the substrate transfer pallet 51 with a ball screw (not shown) provided along the pallet rail 52.
With such a configuration, the substrate transport pallet 51 mounts the substrate P on the substrate supply unit 6, moves to the bonding position along the pallet rail 52, and after bonding, moves to the substrate carry-out portion 7 to carry out the board. The substrate P is passed to the unit 7. The first and second transport units are driven independently of each other, and while the die D is being bonded to the substrate P mounted on one substrate transport pallet 51, the other substrate transport pallet 51 carries out the substrate P. , Return to the board supply unit 6 and make preparations such as mounting a new board P.

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the die bonder 10, and a central processing unit (CPU) for executing the program stored in the memory.

Next, the configuration of the die supply unit 1 will be described with reference to FIGS. 3 and 4. FIG. 3 is a view showing an external perspective view of the die supply unit. FIG. 4 is a schematic cross-sectional view showing a main part of the die supply part.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction) and a push-up unit 13 that moves in the vertical direction. The wafer holding table 12 has an expanding ring 15 for holding the wafer ring 14 and a support ring 17 for horizontally positioning the dicing tape 16 held on the wafer ring 14 and to which a plurality of dies D are adhered. The push-up unit 13 is arranged inside the support ring 17.

The die supply unit 1 lowers the expanding ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 is stretched to widen the interval between the dies D, and the push-up unit 13 pushes up the dicing D from below the die D to improve the pick-up property of the die D. The adhesive that adheres the die to the substrate as it becomes thinner changes from a liquid to a film, and a film-like adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. There is. In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. In the following, the peeling step will be described ignoring the presence of the die attach film 18.

Next, the push-up unit 13 will be described with reference to FIGS. 5, 6A to 6D, 7, and 8. FIG. 5 is an external perspective view of the push-up unit according to the embodiment. FIG. 6A is a top view of a part of the first unit of FIG. It is a top view of a part of the second unit of FIG. 5 of FIG. 6B. FIG. 6C is a top view of a part of the third unit of FIG. FIG. 7 is a vertical cross-sectional view of the push-up unit of FIG. FIG. 8 is a vertical cross-sectional view of the push-up unit of FIG.

The push-up unit 13 includes a first unit 13a, a second unit 13b to which the first unit 13a is mounted, and a third unit 13c to which the second unit 13b is mounted. The second unit 13b and the third unit 13c are common parts regardless of the type, and the first unit 13a is a part that can be replaced for each type.

The first unit 13a has a block portion 13a1 having blocks A1 to A6, a dome head 13a2 having a plurality of suction holes, a suction hole 13a3, and a suction hole 13a4 for dome suction, and is a concentric circle of the second unit 13b. The vertical movement of the shaped blocks B1 to B6 is converted into the vertical movement of the six concentric square blocks A1 to A6. The six blocks A1 to A6 can move up and down independently. The planar shape of the concentric square blocks A1 to A6 is configured to match the shape of the die D. If the die size is small, the number of concentric square blocks is less than six. In this case, for example, the output unit of the third unit and the concentric blocks of the second unit are not used. This is made possible by the plurality of output units of the third unit and the concentric blocks of the second unit moving up and down (not moving up and down) independently of each other.

The second unit 13b has a circular tubular block B1 to B6 and an outer peripheral portion 13b2, and has six concentric vertical movements of the output units C1 to C6 arranged on the circumference of the first unit 13a. It is converted into the vertical movement of blocks B1 to B6. The six blocks B1 to B6 can move up and down independently.

The third unit 13c includes a central portion 13c0 and six peripheral portions 13c1 to 13c6. The central portion 13c0 has six output portions C1 to C6 that are arranged at equal intervals on the circumference of the upper surface and move up and down independently. The peripheral portions 13c1 to 13c6 can drive the output portions C1 to C6 independently of each other. The peripheral portions 13c1 to 13c6 are provided with motors M1 to M6, respectively, and the central portion 13c0 is provided with plunger mechanisms P1 to P6 that convert the rotation of the motor into vertical movement by a cam or a link. Plunger mechanisms P1 to P6 give vertical movement to output units C1 to C6. The motors M2 and M5 and the plunger mechanisms P2 and P5 are not shown.

Next, the relationship between the push-up unit and the collet will be described with reference to FIG. FIG. 9 is a diagram showing a configuration of a push-up unit and a collet portion of the pickup head according to the embodiment.

As shown in FIG. 9, the collet portion 20 has a collet 22, a collet holder 23 for holding the collet 22, and suction holes 22v and 23v provided on the collet portion 20 for sucking the die D, respectively.

The first unit 13a has a dome head 13a2 around the upper surface. The dome head 13a2 has a plurality of suction holes HL and a cavity CV, sucks from the suction holes 13a3, and sucks the die Dd around the die D picked up by the collet 22 through the dicing tape 16. In FIG. 9, only one row of suction holes HL is shown around the block portion 13a1, but a plurality of rows are provided in order to stably hold the die Dd that is not the target of pickup. The gaps A1v, A2v, A3v, A4v, A5v between each block of the concentric square blocks A1 to A6 and the suction hole 13a4 of the dome suction through the cavity in the dome of the first unit 13a are sucked from the collet. The die D picked up by 22 is sucked through the dicing tape 16. The suction from the suction hole 13a3 and the suction from the suction hole 13a4 can be performed independently.

The push-up unit 13 of this embodiment can be applied to various dies by changing the shape of the block of the first unit and the number of blocks. For example, when the number of blocks is 6, the die size is 20 mm □ or less. Applicable to dies. By increasing the number of output units of the third unit, the number of concentric blocks of the second unit, and the number of concentric square blocks of the first unit, it can be applied to dies having a die size larger than 20 mm □. ..

Next, the pickup operation by the push-up unit 13 according to the above-described configuration will be described with reference to FIG. FIG. 10 is a flowchart showing a processing flow of the pickup operation.

Step S1: The control unit 8 moves the wafer holding base 12 so that the die D to be picked up is located directly above the push-up unit 13, and the push-up unit 13 brings the upper surface of the third unit into contact with the back surface of the dicing tape 16. To move. At this time, as shown in FIG. 9, the control unit 8 makes sure that each of the blocks A1 to A6 of the block unit 13a1 forms the same plane as the surface of the dome head 13a2, and between the suction hole HL of the dome head 13a2 and the block. The dicing tape 16 is adsorbed by the gaps A1v, A2v, A3v, A4v, and A5v.

Step 2: The control unit 8 lowers the collet unit 20, positions it on the die D to be picked up, and sucks the die D by the suction holes 22v and 23v.

Step 3: The control unit 8 sequentially raises the blocks of the block units 13a1 from the outside to perform a peeling operation. That is, the control unit 8 drives the plunger mechanism P6 by the motor M6, and raises only the outermost block A6 by several tens of μm to several hundreds of μm to stop it. As a result, a raised portion where the dicing tape 16 is raised is formed around the block A6, and a minute space, that is, a peeling starting point is formed between the dicing tape 16 and the die attach film 18. This space significantly reduces the anchor effect, that is, the stress applied to the die D, and the subsequent peeling operation can be reliably performed. Next, the control unit 8 drives the plunger mechanism P5 with the motor M5 to raise only the second outer block A5 higher than the block A6 and stop it. Next, the control unit 8 drives the plunger mechanism P4 by the motor M4 to raise only the third outer block A4 higher than the block A5 and stop it. Next, the control unit 8 drives the plunger mechanism P3 by the motor M3 to raise only the fourth outer block A3 higher than the block A4 and stop it. Next, the control unit 8 drives the plunger mechanism P2 with the motor M2 to raise only the fifth outer block A2 higher than the block A3 and stop it. Finally, the control unit 8 drives the plunger mechanism P1 with the motor M1 to raise only the innermost block A1 higher than the block A2 and stop it.

Step S4: The control unit 8 raises the collet. In the final state of step S3, the contact area between the dicing tape 16 and the die D becomes an area that can be peeled off by raising the collet, and the die D can be peeled off by raising the collet 22.

Step S5: The control unit 8 causes the blocks A1 to A6 of the block unit 13a1 to form the same plane as the surface of the dome head 13a2, and the suction holes HL of the dome head 13a2 and the gaps A1v, A2v, A3v between the blocks. The adsorption of the dicing tape 16 by A4v and A5v is stopped. The control unit 8 moves the push-up unit 13 so that the upper surface of the first unit is separated from the back surface of the dicing tape 16.

The control unit 8 repeats steps S1 to S5 to pick up a good die of the wafer 11.

Next, a method of manufacturing a semiconductor device using a die bonder according to an embodiment will be described with reference to FIG. FIG. 11 is a flowchart showing a manufacturing method of a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 to which the dicing tape 16 divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The control unit 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette filled with the wafer ring 14. Further, the substrate P is prepared and carried into the die bonder 10. The control unit 8 mounts the substrate P on the substrate transfer pallet 51 by the substrate supply unit 6.

Step S12: The control unit 8 picks up the die divided by steps S1 to S5 from the wafer.

Step S13: The control unit 8 mounts the picked-up die on the substrate P or stacks the picked-up die on the already bonded die. The control unit 8 places the die D picked up from the wafer 11 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and bonds the die D to the conveyed substrate P.

Step S14: The control unit 8 takes out the substrate P to which the die D is bonded from the substrate transfer pallet 51 at the substrate carry-out unit 7. The substrate P is carried out from the die bonder 10.

<Modification example 1>
Next, a modification 1 of the push-up unit will be described with reference to FIGS. 12A, 12B, 13, 14A, and 14B. FIG. 12A is an external perspective view of the push-up unit according to the first modification. FIG. 12B is an external perspective view of the push-up unit according to the first modification. FIG. 13 is a vertical sectional view of the first unit of FIG. 12A. 14A is a vertical cross-sectional view of a part of the first unit and the second unit of the push-up unit of FIG. 12A. 14B is a vertical cross-sectional view of the first unit of FIG. 12A with the first unit removed.

The push-up unit 13A includes a first unit 13Aa and a second unit 13Ab to which the first unit 13Aa is mounted. The second unit 13Ab is a common part regardless of the type, and the first unit 13Aa is a part that can be replaced for each type.

The first unit 13Aa is the same as the first unit 13a except that the number of blocks is different from that of the first unit 13a of the embodiment. The first unit 13Aa is a block portion 13Aa1 having blocks AA1 to AA4, a dome head 13Aa2 having a plurality of suction holes, a suction hole 13a3, a suction hole 13a4 for dome suction, and a concentric block of the second unit 13Ab. The members aA1 to aA4 for transmitting the vertical movement of BA1 to BA4 to the four concentric blocks A1 to A4 are provided.

The second unit 13Ab is coaxial with the outer peripheral portion 13Ab1, the member 13Ab2 for mounting the first unit 13Aa by covering the outer peripheral portion 13Ab1, and the member 12Ab3 for locking (fixing) the member 13Ab2 to the outer peripheral portion 13Ab1. It includes blocks BA1 to BA4 (pipe-shaped) and drive units CA1 to CA4 for driving blocks BA1 to BA4, respectively. By unlocking the member 12Ab3, the member 13Ab2 can be moved upward, and the first unit 13Aa can be attached to and detached from the second unit 13Ab. The drive units CA1 to CA4 are arranged in the vertical direction, in the order of drive units CA1, CA2, CA3, and CA4 from the top. The four drive units CA1 to CA4 can independently drive the four blocks BA1 to BA4 up and down, and as a result, the four blocks AA1 to AA4 can independently move up and down. Since the drive units CA1 to CA4 are arranged in the vertical direction, the size in the horizontal direction can be made smaller than that in the embodiment.

The pickup operation by the push-up unit 13A is the same as the operation by the push-up unit 13 of the embodiment shown in FIG. The manufacturing method of the semiconductor device using the die bonder including the push-up unit 13A is the same as the manufacturing method of the semiconductor device of the embodiment shown in FIG.

<Modification 2>
Next, the second modification of the push-up unit will be described with reference to FIGS. 15 to 17. FIG. 15 is an external perspective view of the push-up unit according to the second modification. FIG. 16 is a vertical cross-sectional view of the third unit of FIG. FIG. 17 is a top view of a part of the third unit of FIG.

The push-up unit 13B includes a first unit 13Ba, a second unit 13Bb on which the first unit 13Ba is mounted, and a third unit 13Bc on which the second unit 13Bb is mounted. The second unit 13Bb and the third unit 13Bc are common parts regardless of the product type, and the first unit 13Ba is a replaceable part for each product type.

The first unit 13Ba has a structure similar to that of the first unit 13a although the number of blocks is different, and includes a maximum of 12 blocks. The second unit 13Bb has a structure similar to that of the second unit 13b although the number of blocks is different, and includes a maximum of 12 blocks.

The third unit 13Bc includes a central portion 13Bc0 and twelve peripheral portions 13c1 to 13c6 and 13d1 to 13d6. The central portion 13Bc0 is arranged on the outer circumference of the upper surface at equal intervals and moves up and down independently, and six output units C1 to C6 and six output units arranged on the inner circumference at equal intervals and move up and down independently. It has D1 to D6. The peripheral portions 13c1 to 13c6 are arranged on the peripheral portions 13d1 to 13d6. The peripheral portions 13c1 to 13c6 and 13d1 to 13d6 can drive the output units C1 to C6 and D1 to D6 independently of each other, respectively. The peripheral portions 13c1 to 13c6 and 13d1 to 13d6 are provided with motors M1 to M6 and Md1 to Md6, respectively, and the central portion 13Bc0 is provided with plunger mechanisms P1 to P6 and Pd1 to Pd6 for converting the rotation of the motor into vertical movement by a cam or a link. Be prepared. The plunger mechanisms P1 to P6 and Pd1 to Pd6 give vertical movement to the output units C1 to C6 and D1 to D6. The motors M1, M2, M4, M5, Md1, Md2, Md4, Md5 and the plunger mechanisms P1, P2, P4, P5, Pd1, Pd2, Pd4 and Pd5 are not shown.

By stacking the third units vertically and increasing the number of output units, more blocks can be operated. The third unit arranged in the upper stage requires a space through which the shaft of the plunger for the lower unit penetrates in addition to the output unit. In the second modification, the cams or link positions of the plunger mechanism that converts the rotation of the motors of the upper and lower third units into vertical movements are shifted to the inner and outer circumferences on the concentric circles. As shown in, the space through which the axis of the plunger output unit penetrates is created by shifting the angle of the upper and lower third units (180 ° / number of installation points, for example, 30 ° for the third unit with 6 outputs). You may secure it. As a result, it is possible to handle about 12 points in the output section by stacking two stages. Further, the output unit of the upper unit may be reduced by 1 to 3 places to secure a space.

In the embodiment, the third unit has six operating points on the circumference for vertical movement of the rotation of the motor by a cam or a link. In the second unit, the operating points on the circumference of 6 points are expanded to the operating circles on the 6-fold concentric circle. In the first unit, the operating circles on the concentric circles are connected to each component of the die-sized square block. In the first modification, the four operating points arranged in the vertical direction in the second unit are expanded into quadruple concentric operating circles. In the first unit, the operating circles on the concentric circles are connected to each component of the die-sized square block. In the second modification, a maximum of 12 operating points of the third unit are arranged. By disassembling into up to 12 steps, 6 steps or 4 steps and pushing up, parts and processes can be shared for dies of multiple sizes.

Further, in the embodiment and the modified example, a push-up mechanism that can be freely set in either the push-up direction or the pull-in direction depending on programming is provided by realizing a push-up stroke in which each stage is not affected by each other (no interference occurs). Can be provided. That is, each stage is independent and does not interfere with each other, which facilitates the design. In addition, the push-up height / vertical timing, etc. can be freely selected.

Since the concentric circle structure on the upper surface of the push-up jig can be shared, the product type exchange by die size is completed by exchanging the product type switching part (first unit). Designing product type switching parts will be easy. It is possible to quickly design product type switching parts and reduce delivery time / price. Sharing of parts will also be promoted. In addition, the time required for product type switching can be shortened.

The invention made by the present inventor has been specifically described above based on Examples and Modifications, but the present invention is not limited to the above Examples and Modifications, and can be variously modified. Not to mention.

For example, in the embodiment, the vertical movement of the plunger mechanism is performed by using a motor, but the vertical movement of a shaft such as an air cylinder may be converted into a vertical movement by using a flat cam without using a motor.

In addition, when a large output or stroke is required, the size of the cam or link increases the rotation of the motor, and even if it does not fit in the specified space, the output unit per stage of the 3rd unit is reduced to cope with it. It is also possible to stack and supplement.

Further, the plunger mechanism for raising the block of the second unit from the output unit of the third unit may have a structure in which the wire-shaped core moves back and forth in the flexible guide like the release of the camera shutter. In this case, the drive units of the plunger cams such as motors and air cylinders can be installed at distant positions, and the degree of freedom of arrangement is improved.

Further, although the example in which the number of the plurality of blocks of the first unit is 12, 6, or 4 is described, it may be 3 or more. An example in which the number of blocks of the second unit is 12, 6, or 4 has been described, but it may be the same as the number of blocks of the first unit. An example in which the number of the plurality of drive output units of the third unit is 12 or 6 has been described, but it may be the same as the number of the plurality of blocks of the second unit.

Further, although the plurality of blocks of the first unit have been described as concentric square blocks, the square blocks may be arranged in parallel.

Further, in the embodiment, the pickup target die and the peripheral die are attracted / released at the same timing, but the pickup target die and the peripheral die may be attracted / released at different timings. As a result, more reliable peeling can be performed.

Further, in the embodiment, the blocks of each stage are pushed up in sequence, but since each stage is independent and can perform different operations, both push-up / pull-down operations may be mixed.

Further, in the embodiment, an example in which the die is pushed up by using a block as the first unit has been described, but a pin (needle) may be used instead of the block.

Further, in the examples, the example of using the die attach film has been described, but it is not necessary to provide the preform portion for applying the adhesive to the substrate and not use the die attach film.

Further, in the embodiment, a die bonder in which the die is picked up from the die supply unit by the pickup head and placed on the intermediate stage, and the die placed on the intermediate stage is bonded to the substrate by the bonding head has been described, but the present invention is limited to this. It can be applied to a semiconductor manufacturing apparatus that picks up a die from a die supply unit.
For example, it can be applied to a die bonder that does not have an intermediate stage and a pickup head and bonds a die of a die supply unit to a substrate with a bonding head.
Further, it can be applied to a flip-chip bonder that does not have an intermediate stage, picks up a die from a die supply unit, rotates the die pickup head upward, delivers the die to the bonding head, and bonds the die to the substrate by the bonding head.
Further, it does not have an intermediate stage and a bonding head, and can be applied to a die sorter in which a die picked up by a pickup head from a die supply unit is placed on a tray or the like.

1: Die supply unit 11: Wafer 13: Push-up unit 13a: First unit 13a1: Block unit 13a2: Suction unit 13a3: Suction unit 13a4: Suction unit A1 to A6: Concentric square block 13b: Second unit B1 to B6 : Concentric block 13c: Third unit 13c0: Central part 13c1 to 13c6: Peripheral part C1 to C6: Output part 16: Dicing tape 2: Pickup part 21: Pickup head 3: Intermediate stage part 31: Intermediate stage 4: Bonding Unit 41: Bonding head 7: Control unit 10: Die bonder D: Die P: Substrate

Claims (19)

A push-up unit that pushes the die from under the dicing tape,
A collet that adsorbs the die and
Control unit and
With
The push-up unit is
A first unit having a plurality of square first blocks in contact with the dicing tape and a dome head for sucking the dicing tape.
A second unit having a plurality of second blocks that independently transmit vertical movements to each of the plurality of first blocks, and an outer peripheral portion.
A central portion having a plurality of drive output units arranged on a circumference that independently gives vertical movement to each of the plurality of second blocks, and a central portion.
A plurality of peripheral portions arranged on the side portion of the central portion and having a plurality of drive units that independently give vertical movement to each of the plurality of drive output units.
With
The first unit is configured to be mounted on top of the second unit.
The control unit is a semiconductor manufacturing apparatus configured to perform both push-up and pull-down operations of the plurality of first blocks in a mixed manner. A push-up unit that pushes the die from under the dicing tape,
A collet that adsorbs the die and
With
The push-up unit is
A first unit having a plurality of square first blocks in contact with the dicing tape and a dome head for sucking the dicing tape.
A second unit having a plurality of second blocks that independently transmit vertical movements to each of the plurality of first blocks, and an outer peripheral portion.
A central portion having a plurality of drive output units arranged on a circumference that independently gives vertical movement to each of the plurality of second blocks, and a central portion.
A plurality of peripheral portions arranged on the side portion of the central portion and having a plurality of drive units that independently give vertical movement to each of the plurality of drive output units.
With
The first unit is configured to be mounted on top of the second unit.
A semiconductor manufacturing apparatus in which each of the plurality of blocks can be set in both a push-up direction and a pull-in direction. In the semiconductor manufacturing apparatus of claim 2,
A semiconductor manufacturing apparatus in which the push-up height and the vertical timing can be freely set for each of the plurality of blocks. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3,
The first unit is a semiconductor manufacturing apparatus configured to convert the vertical movement of the plurality of second blocks into the vertical movement of the plurality of square blocks. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3,
The first unit further
A first suction portion provided on the dome head located outside the plurality of blocks and sucking peripheral dies outside the die via the dicing tape.
A second suction portion formed of gaps between the plurality of blocks for sucking the die, and a second suction portion.
A semiconductor manufacturing apparatus including. In the semiconductor manufacturing apparatus of claim 5,
A semiconductor manufacturing apparatus capable of setting the suction timing independently of the first suction part and the second suction part. In the semiconductor manufacturing apparatus of claim 6,
A semiconductor manufacturing apparatus in which the number of a plurality of blocks of the first unit is 3 or more. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3,
A semiconductor manufacturing apparatus in which the plurality of square blocks are concentrically configured. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3,
The first unit is a semiconductor manufacturing apparatus including a plurality of needles arranged in a square shape in place of the plurality of square blocks. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3, further
A semiconductor manufacturing apparatus including a wafer holding table for holding the dicing tape. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3,
The second unit is a semiconductor manufacturing apparatus configured to convert the vertical movement of a plurality of drive output units arranged on the circumference into the vertical movement of the plurality of second blocks. In the semiconductor manufacturing apparatus of claim 1 or 2,
A semiconductor manufacturing apparatus in which the number of the plurality of second blocks and the number of the plurality of drive output units are the same, and the number of the first blocks is smaller than the number of the second blocks. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3,
A semiconductor manufacturing apparatus in which the number of a plurality of blocks of the second unit and the number of the plurality of drive output units are 3 or more, respectively. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3,
The die is a semiconductor manufacturing apparatus further provided with a die attach film between the die and the dicing tape. In the semiconductor manufacturing apparatus according to any one of claims 1 to 3, further
A semiconductor manufacturing apparatus including a pickup head to which the collet is mounted. In the semiconductor manufacturing apparatus of claim 15, further
An intermediate stage on which the die picked up by the pickup head is placed, and
A bonding head that bonds a die mounted on the intermediate stage onto a substrate or a die that has already been bonded.
A semiconductor manufacturing apparatus including. (A) The step of preparing the semiconductor manufacturing apparatus according to any one of claims 1 to 16.
(B) A step of preparing a wafer ring for holding a dicing tape having a die, and
(C) The process of preparing the substrate and
(D) A step of pushing up the die with the push-up unit and picking up the die with the collet.
A method for manufacturing a semiconductor device. In the method for manufacturing a semiconductor device according to claim 16, further
(E) A method for manufacturing a semiconductor device including a step of bonding the die onto a substrate or a die that has already been bonded. In the method for manufacturing a semiconductor device according to claim 17,
The step (d) further includes a step of placing the picked-up die on an intermediate stage.
The step (e) is a method for manufacturing a semiconductor device, further comprising a step of picking up the die from the intermediate stage.

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