JP2016058575A - Die bonder and bonding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die bonder capable of cleaning a collet, capable of securely removing foreign matters with strong adhesive force without scattering the foreign matters and a bonding method.SOLUTION: Provided are the die bonder and the bonding method including: picking up a die from a wafer; bonding the die to a substrate; and cleaning a suction surface of the collet that sucks the die by moving a metal brush having a line diameter of ten μm to several hundred μm along the suction surface relative to the suction surface.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a die bonder and a bonding method, and more particularly to a collet foreign matter removing method for picking up a die from a wafer.

A die bonder is a device that bonds (mounts and attaches) a die (a chip of a silicon substrate on which an electronic circuit is built) to a lead frame or wiring board (hereinafter referred to as a substrate) using solder, gold plating, or resin as a bonding material. It is.
For example, in a die bonder that bonds a semiconductor chip called a die to the surface of a substrate, the die is generally picked up from a wafer by using a suction nozzle called a collet, picked up, transported onto the substrate, and a pressing force. And the operation (work) of performing bonding by heating the bonding material is repeatedly performed.
As shown in FIG. 5, the collet is a holder that has suction holes 6 a and sucks air to suck and hold the die.

In the series of operations described above, since it is necessary to attract the die to the collet, for example, foreign matter mainly consisting of wafer chips generated in the dicing process adheres to the gap between the die and the tip (adsorption surface) of the collet. There is a case. If the adhesion amount exceeds a predetermined amount, there is a possibility that the element portion of the die or the protective film is broken or the wiring is disconnected.
Thus, for example, in Patent Document 1, a die is adsorbed to the tip of a collet and mounted on a lead frame. In the middle of the device, whether foreign matter adhered to the tip of the collet is blown away and removed by blowing. Bonding was performed using a method of removing foreign matter with a brush.

JP-A-6-302630

However, a foreign substance having a strong adhesive force cannot be removed (cleaned) by mere brushing, particularly when there is a step in the suction portion of the collet die. Further, even if the air blower can remove the foreign matter, the removed foreign matter may scatter and adhere to the product.
In view of the above problems, an object of the present invention is to provide a die bonder and a bonding method capable of cleaning a collet that can reliably remove foreign matter having strong adhesive force without scattering the foreign matter.

  The present invention for solving the above-described problems is, for example, a pick-up head for picking up a die from a wafer by adsorbing the die to a suction surface of a collet provided at the tip, and bonding the picked-up die to a substrate A bonding head, a cleaning device that removes foreign matter on the suction surface with an ultrafine metal brush in which a plurality of metals having a line width of 10 μm to several hundred μm are bundled, contact means for bringing the ultrafine metal brush into contact with the suction surface, It has a moving means for relatively moving the ultrafine metal brush and the suction surface along the suction surface, and a controller for controlling the contact means and the movement means.

  As another example, a first step of picking up a die from a wafer and bonding the die to a substrate and a collet adsorption surface for adsorbing the die are bundled in a plurality of line widths of 10 μm to several hundred μm. And a second step of cleaning the suction surface by moving the extra fine metal brush relative to the suction surface along the suction surface.

  Therefore, according to the present invention, it is possible to provide a die bonder and a collet bonding method capable of cleaning a collet that can reliably remove foreign matter having strong adhesive force without scattering the foreign matter.

It is a schematic top view of the first embodiment of the die bonder of the present invention. It is a figure explaining operation | movement of the bonding head 41 when it sees from the arrow A direction in FIG. It is a figure which shows the structure of a pick-up apparatus. It is a figure which shows the structure of a pick-up apparatus. (a) is a figure which shows the adsorption surface of the die | dye of a collet, (b) is the figure which showed the actual example of the Si waste adhering to the adsorption surface of a collet. It is a figure which shows 2 types (silica sand) of the test powder 1 of the Japan Powder Industrial Technology Association as test powder which simulates Si waste. It is a test flow figure showing an evaluation method. It is a figure which shows the image of the evaluation position at the time of adhesion of the powder for a test, and after removal when an ultrafine metal brush is used as a tool. It is a figure which shows the image of the evaluation position at the time of adhesion of the test powder when using a toothbrush as a tool, and after removal. It is the figure which showed the change of the foreign material afterimage rate when an ultrafine metal brush is used as a tool. It is the figure which showed the change of the foreign material afterimage rate when using an air blow as a tool. It is the figure which showed the change of each foreign material afterimage rate when DAF, a toothbrush, and an electric toothbrush are used as a tool. It is a figure which shows the 1st Example of a collet cleaning apparatus. It is a figure which shows the operation | movement flow of the bonding operation | movement to the board | substrate by the bonding head in Embodiment 1 of a die bonder, and the cleaning operation | movement of a collet. It is a figure which shows 2nd Embodiment of a die bonder. It is a figure which shows the 2nd Example of a collet cleaning apparatus.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the description of each drawing, the same reference numerals are given to components having the same function, and the description is omitted as much as possible to avoid duplication.
(Embodiment 1)
FIG. 1 is a schematic top view of a first embodiment 10A of a die bonder 10 of the present invention. FIG. 2 is a diagram for explaining the operation of the bonding head 41 when viewed from the direction of arrow A in FIG.
The die bonder 10A is roughly divided into a die supply unit 1 for supplying a die D to be mounted on the substrate P, and a die is picked up from the die supply unit 1, and the picked up die D is placed on the substrate P or an already bonded die. Bonding unit 4 for bonding, collet cleaning device 60A (60) for cleaning foreign matter on the die suction surface of collet 6, transport unit 5 for transporting substrate P to the bonding position, and substrate supply for supplying substrate P to transport unit 5 Part 9K, board unloading part 9H for receiving mounted board P, and control part 7 for monitoring and controlling the operation of each part.

  First, the die supply unit 1 includes a wafer holding table 12 that holds the wafer 11 and a push-up unit 13 indicated by a dotted line that pushes the die D up from the wafer 11. The die supply unit 1 is moved in the XY direction by a driving unit (not shown), and the die D to be picked up is moved to the position of the push-up unit 13.

The bonding unit 4 picks up the die D from the wafer 11 and bonds it to the substrate P that has been conveyed, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and the substrate P that has been conveyed. A substrate recognition camera 44 that picks up an image of a position recognition mark (not shown) and recognizes the bonding position of the die D to be bonded, and a die posture recognition camera 45 that detects the posture of the die D picked up from the wafer 11. .
As shown in FIG. 2, the bonding head 41 has a collet holder 6h that detachably holds the collet 6 at its tip. As shown in FIG. 5, the collet 6 has a suction hole 6a connected to a suction pump (not shown) via the bonding head 41, and holds the die D by suction.

  The collet cleaning device 60A (60) is provided between a pick-up position for picking up the die D from the wafer 11 and a bonding position for mounting and pressing the die for bonding. The foreign matter on the suction surface 6s of the die D of 6 is removed and cleaned.

  With such a configuration, the bonding head 41 corrects the posture of the die D based on the image data of the die posture recognition camera 45, bonds the die to the substrate P based on the image data of the substrate recognition camera 44, and again the wafer. 11, the bonding operation indicated by the thin broken line in FIG.

Further, the bonding head 41 goes to the position of the collet cleaning device 60A at a suitable time, for example, after starting a series of bonding operations, during or after the operation, and performs a cleaning operation indicated by a thick broken line for cleaning the collet 6. .
Accordingly, it is desirable that a suitable installation position of the collet cleaning device 60A (60) is provided at a position that does not hinder the movement route of the bonding head 41 during the bonding operation. However, when the bonding operation is hindered or the installation location is not sufficient, the position may be offset outside the both ends of the normal route or in the substrate transport direction of the normal route. In short, it may be provided within the movable range of the bonding head 41.

  The transport unit 5 includes a substrate transport pallet 51 on which one or a plurality of substrates (four in FIG. 1) are placed, and a pallet rail 52 on which the substrate transport pallet 51 moves, and is provided in parallel. It has the 1st, 2nd conveyance part of the same structure. The substrate transfer pallet 51 moves by driving a nut (not shown) provided on the substrate transfer pallet 51 with a ball screw (not shown) provided along the pallet rail 52.

  With such a configuration, the substrate transport pallet 51 is loaded with the substrate P by the substrate supply unit 9K, moves to the bonding position along the pallet rail 52, moves to the post-bonding substrate unloading unit 9H, and the substrate unloading unit Pass the substrate P to 9H. The first and second transfer units are driven independently of each other, and while the die D is being bonded to the substrate P placed on one substrate transfer pallet 51, the other substrate transfer pallet 51 carries out the substrate P. Returning to the substrate supply unit 9K, preparations such as mounting a new substrate P are made.

  The control unit 7 captures various information such as the substrate recognition camera 44 and image information from the substrate recognition camera 44 and the position of the bonding head 41, and performs various operations such as bonding operation of the bonding head 41, cleaning operation, and cleaning operation of the collet cleaning device 60. Control each operation of the component.

  Next, the configuration of the pickup device 12 will be described with reference to FIGS. 3 and 4. FIG. 3 is an external perspective view of the pickup device 12. FIG. 4 is a schematic cross-sectional view showing the main part of the pickup device 12. As shown in FIGS. 3 and 4, the pickup device 12 includes an expand ring 15 that holds a wafer ring 14 and a support ring 17 that horizontally positions a dicing tape 16 that is held by the wafer ring 14 and to which a plurality of dies D are bonded. And a push-up unit 13 which is disposed inside the support ring 17 and pushes the die D upward. The push-up unit 13 is moved in the vertical direction by a driving mechanism (not shown), and the pickup device 12 is moved in the horizontal direction.

  The pickup device 12 lowers the expanding ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held on the wafer ring 14 is stretched to widen the distance between the dies D, and the dies D are pushed up from below the dies by the push-up unit 13 to improve the pick-up property of the dies D. As the thickness is reduced, the adhesive is changed from a liquid to a film, and a film-like adhesive material called a die attach film (hereinafter abbreviated as DAF) 18 is pasted between the die D (wafer 11) and the dicing tape 16. ing. In the wafer 11 having the DAF 18, dicing is performed on the wafer (die D) and the DAF. Therefore, in the peeling process, the wafer and the DAF 18 are peeled from the dicing tape 16.

  During dicing, as shown in FIG. 5B, foreign substances such as Si scraps of the wafer (silicon Si) are mainly generated and adhere to the collet 6 during the peeling process. If the adhesion amount exceeds a predetermined amount, there is a possibility that the element portion of the die or the protective film is broken or the wiring is disconnected.

  Therefore, as described in the prior art, the foreign matter has been blown away by air blowing or the foreign matter has been removed with a brush. Recently, the need for a presser collet 6 that presses the die D with a presser part 6p having a step around the periphery as shown in FIG. 5A has increased, and in particular, the cleaning ability at the step part (ii) has become a problem. Various cleaning methods are conceivable, but there is no evaluation standard, and it is not known how much is better. Therefore, the evaluation method was first defined.

  Before describing a specific collet cleaning device 60, a cleaning tool, an evaluation method, and an evaluation result will be described in order.

  Cleaning tools were selected from a total of 3 tools: brush and adhesive tape that can be expected to prevent air blow and scattering. The air blow was performed with 0.15 Mpa dry air. The brush is an ultra-fine metal brush (Nita Tech Brush manufactured by Kita Seisakusho), a bundle of a plurality of SUS wires with a diameter of 30 μm, an ultra-thin hair, a normal nylon toothbrush, and a normal nylon brush. Stroke (reciprocation)) / min was performed with 3 tools of an electric toothbrush having a sonic frequency. The adhesive tape was used using DAF used for die attachment. A metal brush with a wire diameter of about mm was removed from the test candidates because it damages the collet 6.

  As shown in FIG. 5 (a), the evaluation positions were the presser part 6p shown in (i), the step part shown in (ii), and the periphery of the suction hole shown in (iii). FIG. 5B is a diagram showing an actual example of the Si scrap 8 attached to the suction surface 6 s of the collet 6.

  The evaluation is based on the test flow shown in FIG. 7 by selecting two types of test powder 1 (silica sand) of the Japan Powder Industrial Technology Association shown in FIG. 6 as the test powder simulating the Si scrap 8. went. In FIG. 6, for example, powder having a particle diameter of 5 μm to 10 μm is present as 88−76 = 8% ± 3%.

  First, the adsorbing surface 6s of the collet 6 is pressed against the container containing the test powder to adhere the powder to the entire surface (step S1). FIG. 8A and FIG. 9A show examples of images on the evaluation position surface to which the test powder adheres. Where the powder is attached, it appears white. The black circle at the evaluation position (iii) is the suction hole 6a. The image at each evaluation position is binarized and the area ratio of black and white at the time of attachment is measured (step S2).

Next, the powder was removed by reciprocating the tool on the suction surface 6s of the collet 6 for 5 seconds (step S3). The reciprocation of the tool is for surely cleaning the two step portions (ii) on both sides in the direction of travel of the tool. Thereafter, similarly to step S2, the image at each evaluation position is binarized, and the black and white area ratio after removal is measured (step S4). FIG. 8B shows an example of the ultrafine metal (SUS) brush 61, and FIG. 9B shows an example of a toothbrush. It can be seen that the ultrafine metal brush 61 has a high removal capability between the two examples.
Finally, the ratio of the black and white area ratio at the time of adhesion and after removal is obtained, and the removal rate is evaluated.

  10 to 12 show the evaluation results of each tool. In each figure, the flow shown in FIG. 7 is taken as one measurement, and the change of the foreign matter remaining rate with respect to the number of measurements is shown. The foreign matter residual rate is the residual rate of powder, that is, foreign matter obtained after measurement, assuming that the area ratio of the powder at the time of adhesion is 100%. FIG. 10 shows the results of the ultrafine metal brush, FIG. 11 shows the results of air blow, and FIG. 12 shows the results of DAF, toothbrush, and electric toothbrush.

  As a result, the extra fine metal brush 61 shown in FIG. 10 had a foreign matter afterimage rate of 1%, that is, a removal rate of 99% at the first time regardless of the evaluation position. The air blow shown in FIG. 11 has a slight difference in the evaluation position, but at the first time, the foreign matter remaining rate is 3% in the stepped portion (ii), that is, the removal rate is 97%. When the three tools shown in FIG. 12 are evaluated with the stepped portion (ii) which is particularly problematic, the electric toothbrush is good and the foreign matter remaining rate is 6% at the third time, but the DAF is also the presser portion (i) where the DAF contacts. In the eighth time, the foreign matter remaining rate is poor at 45%.

  As described above, it has been found that the ultrafine metal brush 61 is the best and may be compared with an air blow that blows away foreign matter. Further, as shown in FIG. 10, the extra fine metal brush 61 can be applied to a flat collet without the pressing portion 6p because the foreign matter remaining rate, that is, the removal rate does not depend on the measurement position. Furthermore, as the above experimental results show, the inventor has found that the ultrafine metal brush 61 is highly effective in removing foreign matter even with a collet having a step. In particular, the inventor has found that the ultrafine metal brush 61 is highly effective in removing foreign matter even on a collet having a step in the periphery.

  The measurement time of 5 seconds per time and the number of reciprocations of 5 reciprocations are determined for evaluation. In actual cleaning processing, the dimensions of the collet and the step height of the step portion (ii) are required. The removal rate is taken into consideration. For example, experimental conditions such as measurement time (measurement speed), one-way or reciprocation, and the number of reciprocations if reciprocation are determined.

  It is preferable that the ultrafine metal brush does not improve the removal rate even when pressed against the adsorption surface 6s of the die D of the collet 6 and is lightly contacted. As the metal, a metal having flexibility such as SUS (stainless steel) is desirable. The diameter of the ultrafine metal brush is preferably a diameter that can maintain a certain degree of waist. The experiment was performed with SUS at wire diameters of 30 μm and 50 μm, and the effect was confirmed. However, logically, the wire diameter may be about 10 μm to several hundreds of μm as long as there is flexibility such as SUS. If it is an electroconductive metal, static elimination can be performed and it is excellent also from this point.

  Next, the collet cleaning device 60A will be described.

(Example 1)
FIG. 13 is a diagram showing a first example 60A of the collet cleaning device 60 according to the first embodiment shown in FIG. FIG. 13A is a view of the collet cleaning device 60A viewed from the direction of arrow A in FIG. FIG. 13B is a view of the collet cleaning device 60A viewed from the direction of arrow B in FIG. FIGS. 13 (c) and 13 (d) are views corresponding to FIGS. 13 (a) and 13 (b), respectively, and the bonding head 41 descends and comes into contact with the ultrafine metal brush 61, and the state of the cleaning operation. FIG.

  The collet cleaning device 60A sucks removed foreign matters such as the ultrafine metal brush 61 that cleans the suction surface 6s of the die D of the collet 6 and the silicon (Si) debris 8 in the ultrafine metal brush provided below the ultrafine metal brush. The suction part 63, the fine metal brush and the suction part 63 to be fixed, a moving frame part 62 having a nut 62n therein, a drive part 65 to move the fine metal brush 61, and the structural parts of the die bonder 10A ( And a fixing portion 66 to be fixed to (not shown).

  The ultrafine metal brush 61 is, for example, a bundle of SUS wires having a wire diameter of 30 μm and a length of 6 mm bundled in a rectangular shape. The rectangular shape has a shape with rounded corners and a width of at least the long side of the collet 6. In short, as described above, the diameter and length of the wire and the length of the short side of the rectangle are determined so as to have a predetermined waist of the wire. The predetermined waist, or the wire diameter, length, and length of the short side of the rectangular shape can be determined by experimentally obtaining in advance.

  If the length of the long side of the rectangular shape cannot be formed to the width of the collet 6 at a time, a divided brush divided into a plurality of pieces in the length direction of the long side may be provided. In that case, for example, they are arranged at the front and back of each other so that the boundary is overlapped and cleaned so that there is no clearance between the divided boundaries. Further, the brush may be rotated by making the shape of the brush circular. In that case, the rotation direction may be reversed.

  The suction part 63 is formed in the moving frame part 62, and is provided with a suction hole part 63a provided on both sides of the driving ball joint 65b, a connecting part 63b for connecting the two suction hole parts 63a, and a suction pump (see FIG. A flexible connection pipe 63h disposed from the connection pipe 63s and a connection plug 63s to which the connection pipe is connected.

  The drive unit 65 engages with a nut 62 n fixed to the moving frame unit 62, and a ball joint 65 b supported by the fixed unit 66, a motor 65 m that rotates the ball joint, and a concave shape formed in the moving frame unit 62. Two guide rails 65g are provided on both sides of the fixed portion 66 on which the portion slides.

  The bonding operation to the substrate P and the cleaning operation of the collet 6 by the bonding head 41 in the first embodiment of the die bonder will be described with reference to FIG. 2 and FIG. 14 showing these operation flows.

  Usually, the bonding operation indicated by a thin broken line in FIG. 2 is repeated. In the bonding operation, the die D pushed up from the wafer 11 by the push-up unit 13 is sucked and picked up by the collet 6 attached to the tip of the bonding head 41 (step B1). On the way to the bonding position, the die posture recognition camera 45 recognizes the posture of the die D, and corrects the posture of the die D based on the recognition result (step B2). The die D is bonded to the substrate P conveyed by the pallet rail (step B3). Return to the position where the die D is picked up from the wafer 11 (step B4).

  In the above-described bonding operation, the suction surface 6s of the collet 6 is imaged by the die posture recognition camera 45 in the operation of returning to step S4 every predetermined number of times of bonding to determine whether or not cleaning is necessary (steps J1, J2). ). The necessity determination is performed by determining the number or size of foreign matter such as Si dust 8 in a predetermined region in the suction surface 6s. The predetermined area is, for example, an area that is easily contaminated with a step. Of course, the determination may be made for the entire area of the suction surface 6s. If the image processing takes time, the image may be taken once and image processing may be performed after the next bonding process or after the next next bonding process to determine whether or not cleaning is necessary.

If it is determined that the cleaning is necessary, the cleaning operation indicated by the thick broken line shown in FIG. 2 is started. The collet 6 (bonding head 41) is moved to the upper part of the collet cleaning device 60A and lowered to contact the ultrafine metal brush 61 as shown in FIG. 12C (step C1). In this example, the contact means for cleaning is a means for moving the collet. Thereafter, the motor 65m is controlled to clean the collet suction surface 6s by moving the ultrafine metal brush 61, for example, one reciprocation per second at a speed of one reciprocation per second, and several reciprocations if necessary. (Step C2). The moving means for cleaning in this example is means for moving the ultrafine metal brush 61. By using the means for moving the ultrafine metal brush 61, it is not necessary to provide the bonding head with a fine horizontal movement function for the purpose of cleaning, so that highly accurate and stable bonding can be realized. It should be noted that only a one-way operation may be performed as long as a predetermined clean degree can be obtained only by the one-way operation. Thereafter, the bonding head 41 is raised to return to the position where the die D is picked up (step C3), and the process returns to the bonding operation.
The above flow is repeated until the number of dies scheduled is bonded (step J3). These flow controls are performed by the control unit 7.

In the above flow, whether or not cleaning is necessary is determined based on the imaging data every predetermined number of times of bonding, in other words, every predetermined number of pick-up times of the die D from the wafer 11, but periodically every predetermined number of pick-up times without determination. It may be done automatically. In the above flow, whether or not cleaning is necessary is determined every predetermined number of times based on the imaging data, but after that, it is not determined every time that cleaning is necessary. The cycle may be shorter than a predetermined number of bondings.
Further, as a timing for performing cleaning, collet cleaning may be automatically executed every time a row of dies on the wafer 11 on which the dies are held over a plurality of rows changes or every two rows. Further, the operator may operate the die bonder whenever necessary to execute it.

  Furthermore, in the above description, the bonding head 41 is lowered and cleaned during the cleaning operation. However, the collet cleaning device 60A may be raised for cleaning.

  According to the first embodiment of the collet cleaning device described above, the extraneous metal brush 61 can be used to reliably remove foreign matters without scattering them around.

  Further, according to the first embodiment of the collet cleaning device described above, by providing the suction portion 63, the removed foreign matter can be collected, and the die can be safely bonded to the substrate.

  Furthermore, according to the first embodiment of the collet cleaning device described above, the collet 6 can be neutralized by using the ultrafine metal brush 61, and electrostatic breakdown of the die can be prevented.

(Embodiment 2)
FIG. 15 is a diagram illustrating a second embodiment 10 </ b> B of the die bonder 10. The die bonder 10B has a configuration in which the die bonder 10A is further provided with a pickup unit 2 for picking up from the wafer 11 separately from the bonding head 41, and an intermediate stage 31 for temporarily mounting the picked up die D. Further, the die bonder 10B has the second embodiment 60B of the collet cleaning device 60 between the intermediate stage 31 and the pickup position of the die D.

  The pickup unit 2 includes a pickup head 21 that picks up the die D from the wafer 11 and places the die D on the intermediate stage 31, and a Y drive unit 23 of the pickup head that moves the pickup head 21 in the Y direction. The pickup head 21 has the same structure as that of the bonding head 41, and includes drive units (not shown) that move the collet 6 up and down, rotate, and move in the X direction in addition to the Y drive unit 23.

(Example 2)
FIG. 16 is a view showing the collet cleaning device 60B. 16 (a) is a view of the collet cleaning device 60B as viewed from the direction of arrow G in FIG. FIG. 16B is a view of the collet cleaning device 60B viewed from the direction of arrow E in FIG. FIGS. 16C and 16D are views corresponding to FIGS. 16A and 16B, respectively. The main body of the collet cleaning device 60B is raised and brought into contact with the pickup head 21 to perform a cleaning operation. It is a figure which shows the state of.

The differences between the collet cleaning device 60B of the second embodiment and the first embodiment are the following four points.
First, since foreign matter or the like adheres to the collet 6 of the pickup head 21 from the wafer 11, the collet cleaning device 60B is provided between the intermediate stage 31 and the pickup position of the die D as described above. . In the die bonder in which the intermediate stage 31 exists, the bonding head may also be provided between the bonding position of the intermediate stage 31 and the die D when it is necessary to perform collet cleaning.

  Secondly, in the first embodiment, the extra fine metal brush 61 is moved to remove the foreign matter on the suction surface 6s, whereas in the second embodiment, the bonding head 41 is moved left and right in the direction of arrow J shown in FIG. The foreign matter on the suction surface 6s is removed. That is, in Example 2, the moving means for cleaning is a means for moving the collet. If the bonding head has a special function related to the left and right movements for purposes other than cleaning and purpose, it can be used to perform collet cleaning without having to add extra functions. There are benefits that can be realized.

  Thirdly, in the first embodiment, the bonding head 41 is lowered and the suction surface 6s of the collet 6 is brought into contact with the ultrafine metal brush 61, whereas in the second embodiment, the ultrafine metal is lifted by the lifting device 67 having a lifting function in the H direction. The brush 61 is raised and the ultrafine metal brush 61 is brought into contact with the suction surface 6 s of the collet 6. The contact means for cleaning in this case is a means for moving the ultrafine metal brush 61 up and down. By attaching an elevating function to the ultrafine metal brush 61, the ultrafine metal brush 61 can be raised and lowered to be brought into contact with the bonding head 41 in accordance with the movement of the bonding head 41 above the ultrafine metal brush 61. Throughput can be improved. The third point is that the bonding head 41 may be lowered as in the first embodiment in order to reduce the drive shaft in the second embodiment.

  Fourthly, in Example 1, the degree of foreign matter was monitored using a die attitude recognition camera. However, in Embodiment 2, when the die D is placed on the intermediate stage 31, an accurate die attitude as in bonding is used. In the second embodiment, the degree of foreign matter is not monitored as an image, and the degree of foreign matter is monitored by the number of times of picking up the die D from the wafer 11 by the pickup head 21. Of course, as in the first embodiment, a means for imaging the suction surface 6s of the collet 6 of the pickup head may be provided, and the necessity of cleaning may be determined based on the imaging result.

  According to the second embodiment of the collet cleaning device described above, the extraneous metal brush 61 can be used to reliably remove foreign matters without scattering them around.

  In the above description, Example 1 of the collet cleaning apparatus described in Embodiment 1 can be applied to Embodiment 2, and conversely, Embodiment 2 of the collet cleaning apparatus described in Embodiment 2 can be applied to Embodiment 1.

  In addition, according to the second embodiment of the collet cleaning device described above, by providing the suction portion 63, the removed foreign matter can be collected, and the die can be safely bonded to the substrate.

  Furthermore, according to the second embodiment of the collet cleaning device described above, the collet 6 can be neutralized by using the ultrafine metal brush 61, and electrostatic breakdown of the die can be prevented.

  According to the first and second embodiments of the die bonder described above, a highly reliable die bonder can be provided by using the ultrafine metal brush 61 and reliably removing the foreign matter without scattering the foreign matter around.

  As another embodiment of the die bonder, it is also applicable to a flip chip bonder that reverses a picked-up die and delivers it to a bonding head. In the first and second embodiments, since the suction surface to be cleaned faces downward, the cleaning device 60 is provided below the movable range of the head for picking up the die. However, in the embodiment of the die 3, since the suction surface may face upward, it may be provided above the movable range of the head to be picked up. That is, the cleaning device 60 is provided so as to face the suction surface.

  As described above, the embodiments of the die bonder and the collet cleaning device of the present invention have been described. However, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention does not depart from the spirit thereof. It is intended to cover the various alternatives, modifications or variations described above in scope.

1: Die supply unit 2: Pickup unit 21: Pickup head 31: Intermediate stage 4: Bonding unit 41: Bonding head 44: Substrate recognition camera 45: Die attitude recognition camera 6: Collet 6a: Collet suction hole 6p: Press of collet Part 6s: Collet die adsorption surface 7: Control part 10, 10A, 10B: Die bonder 11: Wafer 12: Pickup device 13: Push-up unit 18: Die attach film (DAF)
60, 60A, 60B: Collet cleaning device 61: Extra fine metal brush 62: Moving frame portion 63: Suction portion 65: Driving portion 67: Lifting device D: Die P: Substrate

Claims (11)

A pickup head that picks up the die from the wafer by sucking the die onto the suction surface of the collet provided at the tip;
A bonding head for bonding the picked-up die to a substrate;
A cleaning device for removing foreign matter on the suction surface with an ultrafine metal brush in which a plurality of metal brushes having a line width of 10 μm to several hundred μm are bundled;
Contact means for bringing the ultrafine metal brush into contact with the suction surface;
Moving means for relatively moving the ultrafine metal brush and the suction surface along the suction surface;
A controller for controlling the contact means and the moving means;
A die bonder characterized by comprising: The die bonder according to claim 1,
The cleaning device is provided in a movable range of the pickup head;
A die bonder characterized by that. The die bonder according to claim 2,
The cleaning device is provided between a pickup position of the die to be picked up from the wafer and a position on which the die is placed, at a position facing the suction surface when the removal is performed.
A die bonder characterized by that. The die bonder according to claim 1,
The contact means is means for raising and lowering the collet or the ultrafine metal brush to make contact.
A die bonder characterized by that. The die bonder according to claim 1,
The moving means is means for moving the collet or the ultrafine metal brush.
A die bonder characterized by that. The die bonder according to claim 1,
The ultrafine metal brush has a brush part having a long side on one side of the suction surface, or has a divided brush part obtained by dividing the length of one side into a plurality of parts, and the adjacent divided brush parts are The cleaning points overlap each other,
A die bonder characterized by that. The die bonder according to claim 1,
The bonding head also serves as the pickup head, and bonds the die directly from the wafer to the substrate.
A die bonder characterized by that. The die bonder according to claim 1,
The pickup head once places the die on an intermediate stage, and the bonding head picks up the die from the intermediate stage and bonds it to the substrate.
A die bonder characterized by that. A first step of picking up a die from a wafer and bonding the die to a substrate;
The adsorption surface of the collet that adsorbs the die is moved by moving an ultrafine metal brush in which a plurality of metals having a line width of 10 μm to several hundred μm are bundled relative to the adsorption surface along the adsorption surface. A second step for cleaning,
A bonding method characterized by comprising: The die bonder according to claim 9, wherein
The second step is performed based on the imaged result of imaging the suction surface after the bonding.
A bonding method characterized by the above. The die bonder according to claim 9, wherein
The second step is performed every predetermined number of times of the first step.
A bonding method characterized by the above.

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