CN105405774A - Bar chip joining device and joining method - Google Patents
Bar chip joining device and joining method Download PDFInfo
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- CN105405774A CN105405774A CN201510566562.7A CN201510566562A CN105405774A CN 105405774 A CN105405774 A CN 105405774A CN 201510566562 A CN201510566562 A CN 201510566562A CN 105405774 A CN105405774 A CN 105405774A
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- 238000004140 cleaning Methods 0.000 claims description 58
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- 229910001220 stainless steel Inorganic materials 0.000 description 6
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- 101100299500 Caenorhabditis elegans daf-18 gene Proteins 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a bar chip joining device and a joining method which can clean a collet chuck certainly removing foreign matters with strong adhesive force and prevent the foreign matters from flying apart. The invention is characterized in that a bar chip is picked up from a wafer and is joined on a substrate, on an adsorption surface of the collet chuck which adsorbs the bar chip, the bar chip joining device and the joining method enable a metal brush having the wire diameter of ten microns to hundreds of microns move along the adsorption surface relative to the adsorption surface and clean the adsorption surface.
Description
Technical field
The present invention relates to nude film coupling device and joint method, particularly from the foreign matter removing method of the collet chuck of wafer nude film.
Background technology
So-called nude film coupling device nude film (chip of the silicon substrate of implantable electronic circuit) is engaged (carrying also bonding) in the device of lead frame or wiring substrate etc. (hereinafter referred to as substrate) with solder, gold-plated, resin for grafting material.
Be bonded in the nude film coupling device on the surface of such as substrate at the semiconductor chip this being called as nude film, be generally utilize the adsorption nozzle being called as collet chuck repeatedly perform from wafer adsorption pickup nude film and be transported to substrate, apply pressing force and add thermobond materials to carry out the action (operation) engaged.
So-called collet chuck refers to have adsorption hole 6a as shown in Figure 5 and withdrawing air adsorbs the retaining tool keeping nude film.
In above-mentioned a series of action, need to make nude film be adsorbed in collet chuck, therefore adhere to such as based on the foreign matter of the wafer chip produced in cutting technique in the gap of the top ends (adsorption plane) of nude film and collet chuck sometimes.The possibility that broken string occurs for the element portion of nude film or the destruction of diaphragm or distribution is then there is when its adhesion amount reaches more than ormal weight.
For this reason, such as in patent documentation 1, adsorb nude film and the device be equipped on lead frame as on collet chuck top, be used in and carry out air blast in its way and the foreign matter that collet chuck top is adhered to blown off removing or engage by the method for brush by foreign matter removing.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 6-302630 publication
Summary of the invention
Invent problem to be solved
But, the foreign matter that adhesion strength is strong particularly exists step on the nude film adsorption section of collet chuck, then cannot remove by means of only grooming (cleaning).Further, namely air blast allows to remove foreign matter, also there is the scattering foreign matter of removing and is attached to the problem of goods.
The present invention is directed to the problems referred to above, object is to provide a kind of nude film coupling device and joint method, and its collet chuck that can realize positively removing the strong foreign matter of adhesion strength cleans and avoids scattering foreign matter.
For solving the method for problem
For solving the present application of above-mentioned problem, if enumerate an one example, being then a kind of nude film coupling device, it is characterized in that having: make to be located at top collet chuck adsorption plane absorption nude film and from the pick-up head of wafer nude film; Picked up nude film is bonded on the engagement head on substrate; Utilize the superfine metallic brush be bundled into by multiple metal bristle with the live width of ten μm to hundreds of μm by the cleaning device of the foreign matter removing on adsorption plane; Make the osculating element that superfine metallic brush contacts with adsorption plane; The mobile unit of superfine metallic brush and adsorption plane relatively movement is made along adsorption plane; And to the control part that osculating element and mobile unit control.
In addition, if enumerate another example, be then a kind of joint method, it is characterized in that, have: be bonded on the first step substrate from wafer nude film and by nude film; And on the adsorption plane of the collet chuck of absorption nude film, make the superfine metallic brush be bundled into by multiple metal bristle with the live width of ten μm to hundreds of μm carry out the second step of clean adsorption plane along adsorption plane and adsorption plane relatively movement.
The effect of invention
Therefore, according to the present invention, can provide a kind of nude film coupling device and collet chuck joint method, its collet chuck that can realize positively removing the strong foreign matter of adhesion strength cleans and avoids scattering foreign matter.
Accompanying drawing explanation
Fig. 1 is the diagrammatic top view of the first execution mode of nude film coupling device of the present invention.
The figure that Fig. 2 is described the action of engagement head 41 when being and observing from arrow A direction in FIG.
Fig. 3 is the figure of the structure representing pick device.
Fig. 4 is the figure of the structure representing pick device.
Fig. 5 (a) is the figure of the nude film adsorption plane representing collet chuck, Fig. 5 (b) is the figure representing the actual example that the Si that the adsorption plane of collet chuck adheres to considers to be worth doing.
Fig. 6 is the figure that the test powder of considering to be worth doing as simulation Si illustrates the 2nd kind (silica sand) of the test powder 1 of Japanese powder industry technological associations.
Fig. 7 is the experiment process figure representing evaluation method.
The figure of the image of evaluation position when Fig. 8 is the attachment of the test powder represented when using superfine metallic brush as instrument and after removing.
Fig. 9 is the figure of the image of evaluation position when representing the attachment of test powder when using toothbrush as instrument and after removing.
Figure 10 is the figure of the change of the foreign matter survival rate represented when using superfine metallic brush as instrument.
Figure 11 is the figure of the change represented as foreign matter survival rate during instrument use air blast.
Figure 12 is the figure of the change representing respective foreign matter survival rate when using DAF, toothbrush, electric toothbrush as instrument.
Figure 13 is the figure of the first embodiment representing collet chuck cleaning device.
Figure 14 is the figure of the motion flow of the joint action that carries out on substrate of the engagement head represented in the execution mode 1 of nude film coupling device and collet chuck cleaning action.
Figure 15 is the figure of the second execution mode representing nude film coupling device.
Figure 16 is the figure of the second embodiment representing collet chuck cleaning device.
In figure:
1-nude film supply unit; 2-pickup section; 21-pick-up head; 31-middle microscope carrier; 4-junction surface; 41-engagement head; 44-substrate identification video camera; 45-nude film gesture recognition video camera; 6-collet chuck; The adsorption hole of 6a-collet chuck; The press section of 6p-collet chuck; The nude film adsorption plane of 6s-collet chuck; 7-control part; 10,10A, 10B-nude film coupling device; 11-wafer; 12-pick device; 13-jack-up assembly; 18-nude film adhering film (DAF); 60,60A, 60B-collet chuck cleaning device; 61-superfine metallic brush; 62-movable frame portion; 63-suction section; 65-drive division; 67-lowering or hoisting gear; D-nude film; P-substrate.
Embodiment
Accompanying drawing etc. is below used to be described an embodiment of the invention.Further, in the explanation of each figure, prosign added for the structural element with same function and repeat to omit the description for avoiding as far as possible.
(execution mode 1)
Fig. 1 is the diagrammatic top view of the first execution mode 10A of nude film coupling device 10 of the present invention.The figure that Fig. 2 is described the action of engagement head 41 when being and observing from arrow A direction in FIG.
Nude film coupling device 10A mainly has: the nude film supply unit 1 supplying the nude film D carrying out actual load in substrate P; Nude film is picked up and the junction surface 4 engaged in substrate P or engaged nude film by the nude film D of pickup from nude film supply unit 1; To the collet chuck cleaning device 60A (60) that the foreign matter on the nude film adsorption plane of collet chuck 6 cleans; By the conveying unit 5 that substrate P transports to bonding station; To the substrate supply unit 9K of conveying unit 5 supplying substrate P; And the substrate accepting the substrate P after actual load takes out of portion 9H; Monitor the control part 7 that the action carrying out in each portion controls.
First, nude film supply unit 1 has the maintenance wafer holding station 12 of wafer 11 and the jack-up assembly 13 be illustrated by the broken lines from wafer 11 jack-up nude film D.Nude film supply unit 1 utilizes not shown driver element to move up in XY side, makes the nude film D that will pick up move to the position of jack-up assembly 13.
Junction surface 4 has: pick up nude film D and the engagement head 41 transporting the substrate P of coming and carry out engaging from wafer 11; Make the Y drive division 43 of engagement head 41 movement in the Y direction; The position recognition mark (not shown) of the substrate P in shooting conveyance identifies the substrate identification video camera 44 of the bonding station that will carry out the nude film D engaged; And detection is from the nude film gesture recognition video camera 45 of the attitude of the nude film D of wafer 11 pickup.As shown in Figure 2, engagement head 41 has the collet retainer 6h that can keep collet chuck 6 with installing and removing on its top.As shown in Figure 5, collet chuck 6 has the adsorption hole 6a that is connected with suction pump (not shown) via engagement head 41 and utilizes adsorption hole to adsorb and keeps nude film D.
Collet chuck cleaning device 60A (60) be arranged on from wafer 11 pick up nude film D take-off location and load and press engage nude film bonding station between, utilize superfine metallic brush 61 to carry out as described later clean and by the foreign matter removing on the adsorption plane 6s of the absorption nude film D of collet chuck 6.
Utilize such structure, engagement head 41 carries out the joint action in fig. 2 as shown in fine dotted line: the photographed data based on nude film gesture recognition video camera 45 revises the attitude of nude film D, and in substrate P, engage nude film based on the photographed data of substrate identification video camera 44, and again return the take-off location of wafer 11.
Further, engagement head 41, after the beginning of such as a series of joint action in suitable period, in action or after terminating, goes to the position of collet chuck cleaning device 60A to perform the cleaning action as shown by the thick dashed lines of clean collet chuck 6.
Therefore, the suitable setting position of collet chuck cleaning device 60A (60), is preferably set to the position that the mobile alignment of the engagement head 41 in joint action can not counteract.But, when joint action can be hindered or fully cannot obtain installation space, also can be the position offset outside the two ends of common itinerary or in the substrate conveyance direction of common itinerary.In a word, as long as be located in the movable range of engagement head 41.
Conveying unit 5 possesses: the substrate transport tray 51 loading one or more substrate (being 4 in FIG); With the pallet track 52 of substrate transport tray 51 movement, and there is first, second conveying unit isomorphic arranged concurrently.Substrate transport tray 51 moves upper driving of the ball-screw (not shown) arranged along pallet track 52 by making the nut (not shown) be arranged in substrate transport tray 51.
Utilize such structure, substrate transport tray 51 utilizes substrate supply unit 9K to load substrate P, and moves to bonding station along pallet track 52, moves to substrate upon engagement and takes out of portion 9H and take out of portion 9H payment substrate P to substrate.First, second conveying unit drives independently of each other, substrate P placed by the substrate transport tray 51 of a side engages in the process of nude film D, the substrate transport tray 51 of the opposing party takes out of substrate P and gets back to substrate supply unit 9K, carries out the preparation loading new substrate P etc.
Control part 7 reads from various information such as substrate identification video camera 44 and the image information of nude film gesture recognition video camera 45, the position of engagement head 41 etc., and controls each action of each structural elements such as the cleaning action of the joint action of engagement head 41, cleaning action and collet chuck cleaning device 60.
Next, use Fig. 3 and Fig. 4 that the structure of pick device 12 is described.Fig. 3 is the figure of the stereoscopic figure representing pick device 12.Fig. 4 is the schematic sectional view of the major part representing pick device 12.As shown in Figure 3, Figure 4, pick device 12 has: the tensioner ring 15 keeping wafer central 14; Make to be held in wafer central 14 and the dicing tape 16 the being bonded with multiple nude film D support ring 17 of flatly locating; And be configured in support ring 17 inner side and for the jack-up assembly 13 by nude film D jack-up upward.Jack-up assembly 13 can utilize not shown driving mechanism to move in the vertical direction, and pick device 12 can move in the horizontal direction.
Pick device 12 makes the tensioner ring 15 maintaining wafer central 14 decline when carrying out the jack-up of nude film D.Consequently, the dicing tape 16 remained on wafer central 14 stretches and the interval of nude film D is expanded, and utilizes jack-up assembly 13 pick of nude film D to be improved nude film D jack-up below nude film.In addition, along with thinning tendency, bonding agent becomes membranaceous from aqueous, between nude film D (wafer 11) and dicing tape 16, be pasted with the membranaceous adhesives being called as nude film adhering film (hereinafter referred to as DAF) 18.In the wafer 11 with DAF18, wafer 11 (nude film D) and DAF18 are cut.Therefore, in stripping technology, wafer 11 and DAF18 are peeled off from dicing tape 16.
When cutting, as shown in Fig. 5 (b), mainly produce the foreign matter of the Si bits of wafer (silicon Si), and this foreign matter can be attached to collet chuck 6 in stripping technology.The element portion of nude film or the destruction of diaphragm or distribution then may be caused to break when its adhesion amount reaches more than ormal weight.
For this reason, air blast is adopted to blow down foreign matter or with brushing foreign matter in the prior art.Recently, problem is become to the cleaning capacity utilizing the periphery shown in Fig. 5 (a) to there is the increase in demand, particularly stage portion (ii) of the pressing collet chuck 6 of the press section 6p pressing nude film D of step.Although multiple cleaning mode can be considered, if there is no metewand, quality cannot be differentiated.Specify evaluation method for this reason and first.
Before concrete collet chuck cleaning device 60 is described, burnisher, evaluation method, evaluation result are described successively.
Burnisher mainly selects air blast, can expect the brush that prevents from dispersing and these two kinds of instruments of adhesive tape i.e. totally three kinds of instruments.Air blast utilizes the dry air of 0.15Mpa to carry out.Brush is the superfine metallic brush (happiness makes made nanometer technology brush) be bundled into the stainless steel wire being 30 μm with multiple diameter, superfine hair and the toothbrush of the ordinary hard of nylon and the ordinary hard of nylon have 16000st (st: stroke (back and forth))/minute these three kinds of instruments of electric toothbrush of frequency of sound wave evaluate.Adhesive tape adopts the DAF in the bonding middle use of nude film.In addition, be the metallic brush of mm degree for wire diameter, rejected by from tested object due to collet chuck 6 can be caused to damage.
Evaluate position as shown in Fig. 5 (a), (i) is press section 6p, (ii) is stage portion, (iii) for around adsorption hole.Fig. 5 (b) is the figure of the actual example representing the Si bits 8 adhered on the adsorption plane 6s of collet chuck 6.
Select the 2nd kind (silica sand) of the test powder 1 of the Japanese powder industry technological associations shown in Fig. 6, as the test powder of simulation Si bits 8, evaluate according to experiment process shown in Fig. 7.In addition, figure 6 illustrates such as particle diameter is that the powder of 5 μm ~ 10 μm exists 88-76=8% ± 3%.
First, the adsorption plane 6s of collet chuck 6 press-in filled the container of test powder and on whole, adhere to powder (step S1).Fig. 8 (a), Fig. 9 (a) illustrate the image example of the evaluation surface of position being attached with test powder.Be attached with the position of powder in white.The black circle evaluating position (iii) represents adsorption hole 6a.Make the image binaryzation of each evaluation position, measure the white black area ratio (step S2) during attachment.
Next, instrument is made back and forth in the adsorption plane 6s of collet chuck 6, powder to be removed (step S3) 5 times within 5 seconds.The reciprocal object of instrument is made to be to positively clean two stage portion (ii) of the direct of travel both sides being positioned at instrument.Thereafter, make the image binaryzation of each evaluation position in the same manner as step S2, measure the white black area ratio (step S4) after removing.In image example after the removing of Fig. 8 (b), Fig. 9 (b), Fig. 8 (b) illustrates the example of superfine metal (stainless steel) brush 61, and Fig. 9 (b) illustrates the example of toothbrush.Obviously can find out that the removing ability of superfine metallic brush 61 is strong by two examples.
Finally, when obtaining attachment with removing after the ratio of white black area ratio to evaluate removal rate.
Figure 10 to Figure 12 illustrates the evaluation result to each instrument.Respectively illustrate foreign matter survival rate when once measuring with the flow process shown in Fig. 7 relative to the change measuring number of times.The area ratio that so-called foreign matter survival rate refers to powder when adhering to is the survival rate of 100% and the powder that obtains after mensuration and foreign matter.Figure 10 illustrates the result of superfine metallic brush, and Figure 11 illustrates the result of air blast, and Figure 12 illustrates each result of DAF, toothbrush, electric toothbrush.
In these results, independently when first time, foreign matter survival rate is 1% to superfine metallic brush shown in Figure 10 61, removal rate is 99% with evaluating position.Although the air blast shown in Figure 11 is how much different because evaluating position, when first time stage portion (ii) foreign matter survival rate be 3%, removal rate is 97%.When debatable especially stage portion (ii) is evaluated kind of the instrument of three shown in Figure 12, then electric toothbrush foreign matter survival rate better and when third time is 6%, but even if DAF in the press section (i) that DAF contacts when the 8th time foreign matter survival rate be 45% and poor.
As mentioned above, known superfine metallic brush 61 is best and be better than the air blast of blowing down foreign matter.Further, as shown in Figure 10, foreign matter survival rate, the i.e. removal rate of superfine metallic brush 61 are not located and are affected, and are therefore applicable to the smooth collet chuck not having press section 6p yet.In addition, as shown in above-mentioned experimental result, the present inventor finds: above-mentioned superfine metallic brush 61 is for the collet chuck having step, and foreign matter removing effect is also higher.Particularly, the present inventor finds: above-mentioned superfine metallic brush 61 exists the collet chuck of step for periphery, and foreign matter removing effect is also higher.
In addition, set the minute of 1 time 5 seconds, 5 reciprocal reciprocal times in order to carry out evaluating, can consider that in the clean of reality the size of collet chuck, the shoulder height of stage portion (ii), required removal rate etc. set.Such as determine minute (finding speed) by experiment, unidirectional or reciprocal, reciprocal time all conditions such as reciprocal time.
Even if the degree that the adsorption plane 6s that superfine metallic brush presses on the absorption nude film D of collet chuck 6 also can not improve removal rate and preferably more lightly contact.As metal then preferably stainless steel (SUS) etc. there is flexible material.Further, the wire diameter of toughness to a certain degree is then preferably possessed as the wire diameter of superfine metallic brush.Experiment with stainless steel and the condition that wire diameter is 30 μm, 50 μm carry out confirming its effect, but as long as have the such flexibility of stainless steel in theory, then wire diameter also can be ten μm to hundreds of μm of degree.If the metal of conductivity then can eliminate electrostatic, therefore preferably.
Next collet chuck cleaning device 60A is described.
(embodiment 1)
Figure 13 is the figure of the first embodiment 60A of the collet chuck cleaning device 60 representing the execution mode 1 shown in Fig. 1.Figure 13 (a) is the figure observing collet chuck cleaning device 60A in FIG from the direction of arrow A.Figure 13 (b) is the figure observing collet chuck cleaning device 60A in Figure 13 (a) from the direction of arrow B.Figure 13 (c), Figure 13 (d) are figure corresponding with Figure 13 (a), Figure 13 (b) respectively, are to represent that engagement head 41 is fallen and contacts the figure of the state of carrying out cleaning action with superfine metallic brush 61.
Collet chuck cleaning device 60A has: the superfine metallic brush 61 cleaned the adsorption plane 6s of the absorption nude film D of collet chuck 6; Silicon (Si) in the superfine metallic brush of suction that the bottom of superfine metallic brush is arranged considers the suction section 63 of the foreign matter that 8 etc. are removed to be worth doing; Fixing superfine metallic brush and suction section 63 and there is in inside the movable frame portion 62 of nut 62n; Make the drive division 65 of superfine metallic brush 61 movement; And these structural elements are fixed on the fixed part 66 of mechanism part (not shown) of nude film coupling device 10A.
Superfine metallic brush 61 be such as by wire diameter be 30 μm, length is the oblong-shaped that the steel wire of the stainless steel of 6mm is bundled into.Oblong-shaped is with fillet and have the width shape of collet chuck 6 to the youthful and the elderly limit.In a word, the wire diameter of steel wire, length and rectangular bond length is decided according to the requirement making steel wire have the toughness of regulation as mentioned above.The toughness of regulation or the wire diameter of steel wire, length and OBL bond length can solve by experiment in advance and decide.
When OBL long edge lengths cannot be made to be formed as the width of collet chuck 6 once, also can arrange on the length direction on long limit and be divided into multiple segmentation brushes.Now, in order to avoid forming clean dead angle in the boundary line of segmentation, boundary line is cleaned overlappingly, such as front and back configuration each other.Further, the shape of brush also can be made for circle and brush is rotated.Now, direction of rotation also can be made to overturn.
Suction section 63 has: to be formed in movable frame portion 62 and to be located at the SS portion 63a of the both sides of the spherojoint 65b driven; Make the linking part 63b that two SS portion 63a link; From the connecting pipings 63h of the softness that suction pump (not shown) arranges; And the coupling bar 63s of the connecting pipings that continues.
Drive division 65 has: engage with the nut 62n be fixed in movable frame portion 62 and be supported in the spherojoint 65b of fixed part 66; The motor 65m that spherojoint is rotated; And supply the concavity portion be formed in movable frame portion 62 to carry out the two guide rail 65g being located at the both sides of fixed part 66 slided.
For the cleaning action of the joint action in the substrate P that the engagement head 41 utilized in the execution mode 1 of nude film coupling device is carried out and collet chuck 6, with reference to Fig. 2 with represent that Figure 14 of these motion flows is described.
Usually repeatedly carry out when carrying out the joint action in Fig. 2 shown in fine dotted line.In joint action, control part 7 makes to be adsorbed by the collet chuck 6 that jack-up assembly 13 is installed in the top of engagement head 41 from the nude film D of wafer 11 jack-up, pick up (step B1).Shift in the way of bonding station at picked nude film D, control part 7 identifies the attitude of nude film D by nude film gesture recognition video camera 45, and revises the attitude (step B2) of nude film D based on recognition result.The substrate P (step B3) that control part 7 makes nude film D be engaged in transport on pallet track.Control part 7 makes engagement head 41 return the take-off location (step B4) picking up nude film D from wafer 11.
When above-mentioned joint action, after the joint number of times often put rules into practice, in the action way of take-off location returning step B4, control part 7 takes the adsorption plane 6s of collet chuck 6 by nude film gesture recognition video camera 45, judges whether that needs carry out cleaning (step J1, J2).That the quantity or size etc. that Si on region by specifying the part in adsorption plane 6s considers 8 foreign matters such as grade to be worth doing is carried out the need of the judgement carrying out cleaning.The region of so-called regulation refers to the region of the easy contamination that such as there is step.Certainly, also can judge the Zone Full of adsorption plane 6s.When image procossing consuming time more, then can first carry out taking and on after joining process once or after the joining process of lower next time during waiting time carry out image procossing, to judge whether that needs clean.Control part 7 is being judged as not needing then to proceed to step B4 when carrying out clean.
Control part 7 when being judged as that needs carry out clean, then enters the cleaning action in Fig. 2 shown in thick dashed line.Control part 7 makes collet chuck 6 (engagement head 41) move to the top of collet chuck cleaning device 60A and decline, and as shown in Figure 13 (c), contacts (step C1) with superfine metallic brush 61.In this example, the osculating element for carrying out cleaning becomes the unit making collet chuck movement.Thereafter, control part 7 controls motor 65m and makes superfine metallic brush 61 such as shown in arrow C, carry out 1 time back and forth or repeatedly reciprocatingly clean (step C2) the adsorption plane 6s of collet chuck as required with the speed of reciprocal 1 time in such as 1 second.Mobile unit for carrying out cleaning in this example is the unit making the movement of superfine metallic brush 61.Make the unit of superfine metallic brush 61 movement by adopting, thus engagement head need not be made to have locomotive function for carrying out the trickle left and right directions cleaned, therefore, it is possible to realize high accuracy and stable joint.In addition, if only utilize movement in one direction can obtain the cleannes of regulation, also also only movement in one direction can be done.Thereafter, control part 7 makes engagement head 41 rise and gets back to the take-off location (step C3) of nude film D and recover joint action.
Control part 7 repeats above-mentioned flow process until complete the joint (step J3) of predetermined nude film number.
In above-mentioned flow process, after the joint number of times often put rules into practice, in other words often perform after picking up the pickup number of times of the regulation of nude film D from wafer 11, judge whether that needs clean based on photographed data, but clean termly after the pickup number of times that also can not carry out judging and often put rules into practice.And, although based on photographed data and the joint number of times often put rules into practice judged whether that needs cleaned afterwards in above-mentioned flow process, but also can all judge whether that needs clean afterwards at every turn, but from the viewpoint of security standpoint, raising productive temp, the joint number of times that the judgement recycle ratio after making it specifies is short.
In addition, as the opportunity of carrying out cleaning, when can change the row of nude film on the wafer 11 maintaining multirow nude film, or it is clean automatically to perform collet chuck every 2 row ground at every turn.Further, operator also can operate nude film coupling device as required and perform at any time collet chuck clean.
In addition, in the above description, be engagement head 41 is declined clean when cleaning action, but also can be make collet chuck cleaning device 60A increase to clean.
According to the embodiment 1 of collet chuck cleaning device described above, superfine metallic brush 61 can be used positively to remove foreign matter and avoid foreign matter to disperse towards periphery.
In addition, according to the embodiment 1 of collet chuck cleaning device described above, by arranging suction section 63, the recovery of the foreign matter of removing can be engaged nude film safely on substrate.
In addition, according to the embodiment 1 of collet chuck cleaning device described above, superfine metallic brush 61 can be used to carry out destaticing of collet chuck 6 to prevent the electrostatic breakdown of nude film.
(execution mode 2)
Figure 15 is the figure of the second execution mode 10B representing nude film coupling device 10.Nude film coupling device 10B is configured to, and on nude film coupling device 10A except engagement head 41, is also provided with and carries out the pickup section 2 of picking up and the middle microscope carrier 31 temporarily loaded by the nude film D of pickup from wafer 11.Further, nude film coupling device 10B has the second embodiment 60B of collet chuck cleaning device 60 between middle microscope carrier 31 and the take-off location of nude film D.
Pickup section 2 has: pick up nude film D from wafer 11 and carry out the pick-up head 21 that loads to middle microscope carrier 31; And make the Y drive division 23 of pick-up head 21 pick-up head of movement in the Y direction.Pick-up head 21 has the structure identical with engagement head 41, also has not shown each drive division collet chuck 6 being elevated, rotating and carry out X-direction movement except Y drive division 23.
(embodiment 2)
Figure 16 is the figure representing collet chuck cleaning device 60B.Figure 16 (a) is the figure observing collet chuck cleaning device 60B in fig .15 from the direction of arrow G.Figure 16 (b) is the figure observing collet chuck cleaning device 60B in Figure 16 (a) from the direction of arrow E.Figure 16 (c), Figure 16 (d) are figure corresponding with Figure 16 (a), Figure 16 (b) respectively, are to represent to make the body of collet chuck cleaning device 60B rise and contact the figure of the state of carrying out cleaning action with pick-up head 21.
The collet chuck cleaning device 60B of embodiment 2 and the difference of embodiment 1 are following 4 points.
First: because foreign matter etc. can be attached to the collet chuck 6 of pick-up head 21 from wafer 11, therefore collet chuck cleaning device 60B is located between middle microscope carrier 31 and the take-off location of nude film D as mentioned above.In addition, in the nude film coupling device having middle microscope carrier 31, for engagement head need too to carry out collet chuck clean when, also can be located between middle microscope carrier 31 and the bonding station of nude film D.
Second: make superfine metallic brush 61 move to remove the foreign matter on adsorption plane 6s in embodiment 1, be then make engagement head 41 move left and right the foreign matter removed on adsorption plane 6s on the arrow J direction shown in Figure 16 (c) in example 2.That is, the mobile unit in example 2 for carrying out cleaning is the unit making collet chuck movement.Engagement head is when having in order to other object outside cleaning purpose the specific function moved left and right, then tool has the following advantages: this Function implementation can be utilized clean and can realize collet chuck clean without the need to possessing redundancy function.
3rd: be that engagement head 41 declines and the adsorption plane 6s of collet chuck 6 is contacted with superfine metallic brush 61 in embodiment 1, and be utilize the lowering or hoisting gear 67 on H direction with elevating function to make superfine metallic brush 61 rise and superfine metallic brush 61 is contacted with the adsorption plane 6s of collet chuck 6 in example 2.Osculating element now for carrying out cleaning is the unit that superfine metallic brush 61 is elevated.By making superfine metallic brush 61 possess elevating function, thus can move along with the top of engagement head 41 to superfine metallic brush 61, implementing the lifting of superfine metallic brush 61 and contacting with engagement head 41, can boost productivity.In addition, with regard to thirdly, engagement head 41 also can be made similarly to Example 1 to decline to reduce driving shaft in example 2.
4th: use nude film gesture recognition video camera to monitor the degree of foreign matter in embodiment 1, and when loading nude film D to middle microscope carrier 31 in execution mode 2, need not as engaged time obtain correct nude film attitude, therefore not make foreign matter degree form image to monitor in example 2, but pick up the pickup number of times of nude film D to monitor the degree of foreign matter according to pick-up head 21 from wafer 11.Certainly, the unit of the adsorption plane 6s of the collet chuck 6 of shooting pick-up head also can be set similarly to Example 1 and judge whether that needs clean based on shooting results.
According to the embodiment 2 of collet chuck cleaning device described above, superfine metallic brush 61 can be used positively to remove foreign matter and avoid foreign matter to disperse towards periphery.
In the above description, the embodiment 1 of the collet chuck cleaning device illustrated in execution mode 1 execution mode 2 can be applicable to, otherwise also the embodiment 2 of the collet chuck cleaning device illustrated in execution mode 2 execution mode 1 can be applicable to.
Further, according to the embodiment 2 of collet chuck cleaning device described above, by arranging suction section 63, the recovery of the foreign matter of removing can be engaged nude film safely on substrate.
In addition, according to the embodiment 2 of collet chuck cleaning device described above, superfine metallic brush 61 can be used to carry out destaticing of collet chuck 6 and prevent the electrostatic breakdown of nude film.
According to the execution mode 1,2 of nude film coupling device described above, can provide the nude film coupling device that reliability is high, it uses superfine metallic brush 61 positively remove foreign matter and avoid scattering foreign matter to arrive surrounding.
As the execution mode of other nude film coupling device, also can be applicable to the nude film of pickup is overturn and the flip-chip bond device delivered in engagement head.In execution mode 1,2, carry out the adsorption plane that cleans down, therefore cleaning device 60 is located at the downside of the movable range of the head of pickup nude film.But in the execution mode of nude film 3, adsorption plane upward, therefore also can be located at the upside of the movable range carrying out the head picked up.That is, cleaning device 60 is arranged in the mode in the face of adsorption plane.
As mentioned above the execution mode of nude film coupling device of the present invention, collet chuck cleaning device is illustrated, but those skilled in the art can implement various alternative, correction or distortion based on above-mentioned explanation, the present invention comprises above-mentioned various alternative, correction or distortion in the scope not departing from its purport.
Claims (11)
1. a nude film coupling device, is characterized in that, has:
Pick-up head, it makes the adsorption plane absorption nude film and from the above-mentioned nude film of wafer of the collet chuck being located at top;
Engagement head, picked up above-mentioned nude film is bonded on substrate or engaged nude film by it;
Cleaning device, it utilizes the superfine metallic brush be bundled into by multiple metal bristle with the live width of ten μm to hundreds of μm by the foreign matter removing on above-mentioned adsorption plane;
Osculating element, it makes above-mentioned superfine metallic brush contact with above-mentioned adsorption plane;
Mobile unit, it makes above-mentioned superfine metallic brush and above-mentioned adsorption plane relatively move along above-mentioned adsorption plane; And
Control part, it controls above-mentioned osculating element and above-mentioned mobile unit.
2. nude film coupling device according to claim 1, is characterized in that,
Above-mentioned cleaning device is located in the movable range of above-mentioned pick-up head.
3. nude film coupling device according to claim 2, is characterized in that,
Above-mentioned cleaning device is located between the take-off location and the position loading above-mentioned nude film of the above-mentioned nude film of above-mentioned wafer, and when removing the foreign matter of above-mentioned adsorption plane in the face of the position of above-mentioned adsorption plane.
4. nude film coupling device according to claim 1, is characterized in that,
Above-mentioned osculating element is the unit making above-mentioned collet chuck or above-mentioned superfine metallic brush be elevated and contact with above-mentioned adsorption plane.
5. nude film coupling device according to claim 1, is characterized in that,
Above-mentioned mobile unit is the unit making above-mentioned collet chuck or above-mentioned superfine metallic brush movement.
6. nude film coupling device according to claim 1, is characterized in that,
Above-mentioned superfine metallic brush has with the brush portion of the length on one side of above-mentioned adsorption plane for long limit, or has and make above-mentioned length be divided into multiple segmentation brush portions, and adjacent above-mentioned segmentation brush portion is overlapped on clean position.
7. nude film coupling device according to claim 1, is characterized in that,
Above-mentioned engagement head doubles as above-mentioned pick-up head, and above-mentioned nude film is directly engaged in aforesaid substrate from above-mentioned wafer.
8. nude film coupling device according to claim 1, is characterized in that,
Above-mentioned pick-up head temporarily loads above-mentioned nude film on middle microscope carrier, and above-mentioned engagement head is picked up this nude film from above-mentioned middle microscope carrier and is engaged in aforesaid substrate.
9. a joint method, is characterized in that, has:
First step, is bonded on substrate or engaged nude film from wafer nude film and by above-mentioned nude film; And
Second step, on the adsorption plane of the collet chuck of the above-mentioned nude film of absorption, makes the superfine metallic brush be bundled into by multiple metal bristle with the live width of ten μm to hundreds of μm carry out clean above-mentioned adsorption plane along above-mentioned adsorption plane and the relatively movement of above-mentioned adsorption plane.
10. joint method according to claim 9, is characterized in that,
Take the above-mentioned adsorption plane after above-mentioned joint, and perform above-mentioned second step based on the result of above-mentioned shooting.
11. joint methods according to claim 9, is characterized in that,
Often put rules into practice number of times above-mentioned first step after perform above-mentioned second step.
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| JP2014-184214 | 2014-09-10 | ||
| JP2014184214A JP6391378B2 (en) | 2014-09-10 | 2014-09-10 | Die bonder and bonding method |
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| JP (1) | JP6391378B2 (en) |
| KR (2) | KR20160030451A (en) |
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| CN108630564A (en) * | 2017-03-23 | 2018-10-09 | 捷进科技有限公司 | The manufacturing method of chip attachment device and semiconductor devices |
| CN109196628A (en) * | 2016-03-22 | 2019-01-11 | 株式会社新川 | Engagement device and joint method |
| CN113113336A (en) * | 2021-04-21 | 2021-07-13 | 莆田学院 | Anodic bonding equipment |
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| JP6705727B2 (en) | 2016-09-26 | 2020-06-03 | ファスフォードテクノロジ株式会社 | Flip chip bonder and method for manufacturing semiconductor device |
| JP6827836B2 (en) * | 2017-02-13 | 2021-02-10 | 株式会社Ｓｃｒｅｅｎホールディングス | Foreign matter removal processing evaluation method |
| JP6846958B2 (en) * | 2017-03-09 | 2021-03-24 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
| JP6694404B2 (en) * | 2017-03-17 | 2020-05-13 | ファスフォードテクノロジ株式会社 | Die bonding apparatus and semiconductor device manufacturing method |
| KR102042268B1 (en) * | 2018-03-19 | 2019-11-27 | 주식회사 아이플렉스 | Picker unit |
| JP2022034171A (en) * | 2020-08-18 | 2022-03-03 | ファスフォードテクノロジ株式会社 | Die-bonding device, cleaning head, and method of manufacturing semiconductor device |
| JP7039675B2 (en) * | 2020-11-18 | 2022-03-22 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and methods for manufacturing semiconductor equipment |
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| TWI575613B (en) | 2017-03-21 |
| TW201628102A (en) | 2016-08-01 |
| TWI626696B (en) | 2018-06-11 |
| KR20170054371A (en) | 2017-05-17 |
| KR20160030451A (en) | 2016-03-18 |
| KR101938476B1 (en) | 2019-01-14 |
| JP6391378B2 (en) | 2018-09-19 |
| TW201719774A (en) | 2017-06-01 |
| JP2016058575A (en) | 2016-04-21 |
| CN105405774B (en) | 2019-06-21 |
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