JP2005166993A - Method and apparatus for cleaning head pressurization surface - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus which realizes the improvement of a mounting quality and the improvement of productivity by the reduction of a mounting time and which has a microvibration means of ultrasonic etc. by reducing flawing of a tool by chipping, and to provide a method for mounting. <P>SOLUTION: The method and apparatus comprises a process of making a recognizing means recognize a first matter to be joined held by a head having the microvibration means and a second matter to be joined held by a stage, and a process of positioning the first matter to be joined and the second matter to be joined. After them, the method and apparatus comprises a joining process and a process of making a cleaning means to clean the holding surface of the first matter to be cleaned of the head having the microvibration means each time of joining the first matter to be joined and the second matter to be joined. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method and an apparatus for cleaning a head pressure surface when bonding a first object to be bonded held on a head pressure surface having fine vibration means and a second object to be bonded held on an upper surface of a stage. It is about.

For example, in a lead bonder, a method of periodically cleaning a tool surface with a grindstone and a brush for the reason that the quality of bonding is deteriorated due to adhesion of oxide or the like to the surface of the tool is generally known. . (See Patent Document 1)
JP, 08-148879, A On the other hand, it is well known that chips are generally cut out from a wafer, but minute burrs may remain on the chip edge portion cut out from the wafer. As a chip cut out from the wafer, FIG. 14 shows a chip 100 in which bumps 101 are provided on the face-up surface 100a and burrs 102 remain on the chip edge portion.

  As shown in FIG. 15, in the mounting apparatus 107 having a fine vibration means such as ultrasonic vibration in the head, when the chip 100 is mounted on the base 103, the tool pressing surface 105a holds the face-down surface 100b of the chip 100. After that, the tool 105 is lowered, and the bumps 101 of the chip 100 and the pads 104 of the substrate 103 held on the substrate holding stage 106 are bonded to each other by the pressure 200 and the fine vibration 201 so as to rub against each other.

  Therefore, as shown in FIG. 16, a chip piece (hereinafter referred to as chipping) separated from the burr 102 at the chip edge portion by the minute vibration 201 adheres to the tool pressing surface 105a. Furthermore, since the fine vibration 201 and the pressurization 200 are continued, the chipping 102 enters the tool 105 and is fixed (adhered) while scraping the tool pressurization surface 105a, so that the chipping only damages the tool. As a result, the tool life is extremely shortened, and the mounting quality is deteriorated.

  Further, since the chipping 102 bites into the tool 105 occurs rapidly, it is difficult to stop the chipping 102 from entering the tool 105 by periodic cleaning as described in Patent Document 1. Cleaning with a harder stone than the material may damage the tool surface.

  The present invention pays attention to such problems, and for example, in a mounting apparatus having a fine vibration means such as ultrasonic vibration, the tool pressing surface is less damaged by chipping, thereby improving the mounting quality and shortening the mounting time. It is an object of the present invention to provide a mounting apparatus and a mounting method capable of improving productivity.

  In order to achieve such an object, the present invention has the following configuration. That is, the invention described in claim 1 has the fine vibration means when the first workpiece held by the head having the fine vibration means and the second workpiece held by the stage are bonded to each other. The first bonded object holding surface of the head is cleaned, and the first bonded object held by the head having the fine vibration means and the second bonded object held by the stage are recognized by the recognition means. A step of aligning the first object to be bonded and the second object to be bonded by the fine vibration means after the alignment step, and a step of bonding the first object to be bonded and the second object to be bonded. A mounting method comprising: a step of cleaning a first bonded object holding surface of the head having the fine vibration means by a cleaning means.

  The invention according to claim 2 is the mounting method according to claim 1, wherein the step of joining by the fine vibration means is a step of joining by ultrasonic vibration.

  The invention described in claim 3 is the mounting method according to claim 1 or 2, wherein the step of cleaning by the cleaning means is a step of cleaning with a brush.

  The invention according to claim 4 is the mounting method according to claim 1, 2 or 3, characterized in that both the step of cleaning by the cleaning means and the step of transporting the first workpiece are performed. .

  The mounting apparatus according to claim 5 is configured such that when the first object to be bonded held by the head having the fine vibration means is bonded to the second object to be bonded held by the stage, the fine vibration means is used. A device for cleaning a first workpiece holding surface of a head having a head, and recognizing a first workpiece held by a head having fine vibration means and a second workpiece held by a stage. Cleaning the first to-be-bonded object holding surface of the head having the means, the first to-be-joined object and the second to-be-joined object by the aligning means and then joining the joining means and the fine vibration means And cleaning the first bonded object holding surface of the head having the fine vibration means by the cleaning means for each bonding of the first bonded object and the second bonded object. It is a mounting apparatus.

  The mounting device according to claim 6 is the mounting device according to claim 5, wherein the fine vibration means provided in the head having the fine vibration means is ultrasonic vibration.

  The mounting device according to claim 7 is the mounting device according to claim 5 or 6, wherein the cleaning means is a brush.

  Moreover, the mounting apparatus of Claim 8 is a mounting apparatus of Claim 5, 6 or 7 with which the said cleaning means is arrange | positioned in the immediate vicinity of the conveyance means.

  According to the mounting apparatus and the mounting method according to the present invention, the tool pressing surface is cleaned by the cleaning means at least once every time one chip is mounted, so that dust such as chipping can always be removed. Therefore, when the tool pressurizing surface is not cleaned, the tool replacement life is reached at the number of times of mounting of about 1 to 1000 chips when converted to the number of times of chip mounting, but at least once or more every time one chip is mounted. By cleaning the pressing surface, it is not necessary to replace the tool up to the number of times of mounting of about 100,000 to 1 million chips or more in terms of the number of times of chip mounting. Therefore, since dust such as chipping is always removed, the running cost can be reduced by extending the tool life.

  Further, if ultrasonic vibration is used for the fine vibration means, the mounting quality is improved. Moreover, if a brush is used for the cleaning means, the tool surface will not be damaged. Further, if the cleaning unit and the chip transport unit are arranged in close proximity to each other and are performed together with the chip transport process, the chip can be adsorbed immediately after the cleaning, thereby improving the productivity by shortening the mounting time.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
1 and 2 show a mounting apparatus, a first object to be bonded, and a second object to be bonded according to an embodiment of the present invention. First, each configuration of the mounting apparatus will be described.

  The mounting apparatus 1 is configured as an apparatus for mounting a first object 11 having a first recognition mark 13 and a second object 14 having a second recognition mark 16 disposed below the first object. Yes.

  The first object 11 (hereinafter referred to as a chip) has bumps 12 and first recognition marks 13 on the face-up surface 11a, and the second object 14 (hereinafter referred to as a substrate) is provided on the mounting surface 14a. A pad 15 and a second recognition mark 16 are provided.

  Note that the first object to be bonded (chip) in the present invention is bonded to the second object to be bonded (substrate) regardless of the type or size, such as an IC chip, a semiconductor chip, an optical element, a surface mount component, or a wafer. The bumps provided on the first object to be bonded (chip) indicate all electrodes on the side to be bonded to the pads of the second object to be bonded (substrate) such as solder bumps and stud bumps.

  Further, the second object to be bonded (substrate) includes all forms on the side to be bonded to the first object to be bonded (chip) such as a resin substrate, a glass substrate, a flexible printed circuit board (FPC), a ceramic substrate, a chip, and a wafer. The pads provided on the second object to be bonded (substrate) indicate all electrodes on the side to be bonded to the bumps of the first object to be bonded (chip).

  The head 2 is provided with a tool 4 below the fine vibration means 3 and an intake hole 5 for holding the chip 11 on the pressure surface 4a of the tool 4 by air adsorption. Any holding means may be used, such as an electrostatic holding means using a magnet, a magnetic holding means using a magnet or magnetism, or a mechanical means for sandwiching or pressing a chip with one or a plurality of claws.

  The fine vibration means 3 shows all forms for generating fine vibration such as vibration by an ultrasonic oscillator such as ultrasonic vibration and vibration by a piezo element.

  The frequency of the fine vibration means 3 is, for example, 50 kHz in the case of ultrasonic vibration, but may be in the range of 20 kHz to 200 kHz. The amplitude at 50 kHz is in the range of 1 μm to 6 μm, and the bonding strength between the bumps of the chip and the electrodes of the substrate is stable, but may be in the range of 0.1 μm to 10 μm depending on the combination of frequencies.

  Further, the head 2 is provided in a form that can be controlled up and down, but not only in the up and down control, but also in parallel movement control, rotation control, up and down control and parallel movement control, up and down control and rotation control, parallel movement control and rotation control, You may provide in a combination aspect, such as raising / lowering control, parallel movement control, and rotation control.

  Furthermore, although the tool 4 is provided with heating means (not shown) such as a heater, for example, it may be in a form not provided.

  The substrate holding stage 6 is provided with an intake hole (not shown) for air-adsorbing the substrate 14 on the upper surface of the stage. In addition to the air adsorbing means, electrostatic holding means by static electricity, magnetism by magnets, magnetism, etc. Any holding means such as a holding means, a mechanical means for sandwiching or pressing the chip with one or a plurality of claws or the like may be used.

  Further, the substrate holding stage 6 is provided in a form capable of parallel movement control and rotation control, but not only the parallel movement control and rotation control but also the parallel movement control, rotation control, lift control, parallel movement control and lift control, You may provide in the combination mode, such as rotation control and raising / lowering control, raising / lowering control, parallel movement control, and rotation control.

  Further, the substrate holding stage 6 is provided with a heating means (not shown) such as a heater, but may not be provided in some cases.

  The two-field recognition means 7 is a means having two fields of view in the vertical direction. In this embodiment, the first recognition mark 13 of the chip 11 is indicated by the upper optical axis 7a, and the second recognition of the substrate 14 is indicated by the lower optical axis 7b. The recognition mark 16 is read. The two-field recognition means 8 is a CCD camera, but other than the CCD camera, any recognition means can be used as long as the recognition mark can be recognized regardless of the type, such as an infrared camera, an X-ray camera, or a sensor. Also good.

  The two-field recognition means 8 is provided in such a manner that the parallel movement control is possible, but the vertical movement control, rotation control, parallel movement control and vertical movement control, parallel movement control and rotation control, vertical movement control and rotation control, parallel You may provide in a combination mode, such as movement control, raising / lowering control, and rotation control.

  The chip conveying means 9 is parallel to the lower side of the pressing surface 4 a of the tool 4 after the chip 11 (face-down surface 11 b faces upward) is transferred to the chip conveying means 9 from a chip tray or a wafer (both not shown). The movement control is provided.

  The cleaning unit 8 includes a brush 10 and a brush holder 10a, and the cleaning unit 8 including the brush 10 is provided so that the height of the cleaning unit 8 is higher than that of the chip 11 to be conveyed.

  Further, the cleaning means 8 and the chip conveying means 9 are provided in an integrated manner, and are provided in such a manner as to be controlled in parallel with the chip conveying means 9 below the pressing surface 4a of the tool 4, and the cleaning means 8 from the direction side of the tool 4. Since the chip conveying means 9 are arranged in this order, the chip 11 can be reliably cleaned every time the chip 11 is held on the pressing surface 4a of the tool.

  When the tool 4 is provided with heating means (not shown), the surface of the pressing surface 4a of the tool 4 is set to a range of about 100 to 200 ° C., so the brush 10 has a glass transition point exceeding 200 ° C. A heat-resistant material is required. In addition, materials and resistance that do not wear or fall down early are also required.

  Therefore, although an aramid fiber is selected as the material of the brush 10, for example, a material other than an aramid fiber such as a metal brush may be used as long as the material has a low hardness that does not damage the pressing surface 4a of the tool 4.

  Further, in order to have resistance to wear and fall of the brush 10 and to satisfy the flexibility as the brush, the wire constituting the brush 10 has a wire diameter of 0.18 mm. As a result of trying the wire diameter, it was found that it was effective in the range of 0.1 to 0.4 mm, so if it was within the effective range, a brush using a wire having a wire diameter other than 0.18 mm There may be.

  Further, as a method for flocking the brush 10, a function for preventing slipping of chipping is required, so that the wires constituting the brush 10 are preferably held together by the brush holder 10a without gaps. For example, the wires are subdivided. Any form may be used as long as chipping can be prevented from passing through such as arranging the bundle in a staggered pattern.

  In addition, although the brush 10 has selected the thing which has the tolerance with respect to abrasion and a fallen hair, since the chip | tip 11 is reliably cleaned whenever it hold | maintains at the pressurization surface 4a of a tool, it is difficult to use semipermanently. . Therefore, the brush 10 and the brush holder 10a are provided in a form that can be freely detached from the cleaning means 8. Moreover, the form which the cleaning means 8 itself can be freely attached or detached with the conveyance means 9 may be sufficient.

  Further, the cleaning means 8 and the chip transport means 9 are disposed in close proximity to each other and are provided in an integral form, but may be in an independent form, and each of them may be an integral form or an independent form. In addition to parallel movement control, it is provided in combination modes such as lifting control, rotation control, parallel movement control and lifting control, parallel movement control and rotation control, lifting control and rotation control, parallel movement control and lifting control and rotation control, etc. Also good.

  3-8 has shown the operation | movement form of the mounting apparatus which concerns on one embodiment of this invention, and demonstrates it in order.

  FIG. 3 shows a state in which the chip 11 is transferred from the chip tray or wafer (both not shown) to the chip conveying means 9 after the face-down surface 11b is turned up. When the chip 11 is transferred to the chip conveying means 9, the chip conveying means 9 and the cleaning means 8 move in parallel from the retracted position to the vicinity immediately below the pressing surface of the tool 4.

  FIG. 4 shows a state in which the chip conveying means 9 and the cleaning means 8 have been translated in the vicinity of just below the pressing surface of the tool 4. Since the chip conveying means 9 and the cleaning means 8 continue to move in parallel, the pressure surface of the tool 4 is cleaned by the brush 10.

  In addition, when the chip conveying means 9 and the cleaning means 8 move in parallel near the pressure surface of the tool 4, the head 2 is lowered in advance from the retracted position to a height where the chip 11 is positioned near the pressure surface of the tool 4. If the chip 11 can be sucked and held after the pressure surface of the tool 4 is cleaned by the cleaning means 8, for example, the head 2 moves in the direction of the cleaning means 8, the head 2, the cleaning means 8, and the chip transport The means 9 may be in any operation mode or any combination of operations.

  Then, as shown in FIG. 5, when the tip 11 reaches just below the pressurizing surface of the tool 4, the tip conveying means 9 and the cleaning means 8 are stopped, and as shown in FIG. The chip 11 is adsorbed and held by air suction through 5. After that, the head 2 moves up to a height position at which the brush 10 does not come into contact with the chip 11 held by suction on the pressure surface of the tool 4, and then the chip conveying means 9 and the cleaning means 8 return to the original retracted position.

  FIG. 7 shows that the recognition means 7 with two fields of view is inserted between the chip 11 held by the tool 4 and the substrate 14 held by the substrate holding stage 6 below the chip 11 from the retracted position. Indicates the state that has been performed. The first recognition mark 13 of the chip 11 is read by the upper optical axis 7a, and the second recognition 16 of the substrate 14 is read by the lower optical axis 7b. It is preferable that at least two or more first recognition marks 13 and second recognition marks 16 are provided. Although not shown, the read mark is stored in the storage unit, and the position and orientation (angle) of the substrate 14 are recognized based on the calculation unit.

  Note that the substrate 14 adsorbed and held by air suction through a suction hole (not shown) opened from the lower surface 14b side to the upper surface of the substrate holding stage 6 from the lower surface 14b side of the substrate mounting surface 14a side in advance, for example, ACF, An adhesive such as NCF, ACP, or NCP is attached or applied, but it may be not applied.

  Thereafter, as shown in FIG. 8, the substrate holding stage 6 is arranged so that the chip 11 is positioned at a predetermined mounting position of the substrate 14 based on the recognized relative position and orientation (relative angle) of the chip 11 and the substrate 14. Is aligned (position adjusted) by parallel movement control and rotation control, and after the two-field recognition means 7 retreats to the retracted position, the head 2 descends, and pressurization, heating, for example, by ultrasonic vibration, etc. Joined by slight vibration. Note that the bonding means may be any combination of mounting modes such as micro vibration, micro vibration and pressurization, micro vibration and heating.

  Even in the alignment (position adjustment) mode, if the chip 11 and the substrate 14 can be aligned (position adjustment) such as rotation control or parallel movement control on the head 2 side, the head 2 and the substrate holding stage 6 can be any type. There may be an operation mode or any combination of operations.

In any alignment (position adjustment) mode, the positions and orientations (angles) of the chip 11 and the substrate 14 are recognized by the two visual field recognition means 7, the storage means, and the calculation means. By controlling the head 2 and / or the substrate holding stage 6 with reference to the position and orientation (angle) of the substrate 11, the chip 11 can be aligned with an arbitrary predetermined position of the substrate 14. It is possible to perform highly accurate mounting at a predetermined mounting position with no positional deviation.
(Embodiment 2)
In the cleaning unit 8, the mode of cleaning the pressure surface of the tool 4 by the brush 10 is described in the first embodiment. However, not only one type of the brush 10 but also a plurality of cleaning modes combining other cleaning units are illustrated. This will be described in 9-13.

  The configuration and operation mode other than the cleaning unit 8 are the same as those in the first embodiment. Therefore, the description will be made from the time when the tip conveying means 9 and the cleaning means 8 approach the vicinity immediately below the pressing surface of the tool 4 until the tip 11 is sucked and held after the cleaning means 8 cleans the pressing surface of the tool 4.

  FIG. 9 is configured in such a manner that air 17 is blown out vigorously between the brush 10 and the chip conveying means 9 from the blowing hole 18 opened on the upper surface of the cleaning means 8.

  First, the pressure conveying surface of the tool 4 is cleaned by the brush 10 by the parallel movement of the chip conveying means 9 and the cleaning means 8, and the chip conveying means 9 and the cleaning means 8 are stopped when the chip 11 reaches just below the pressure surface of the tool 4. Then, the chip 11 is sucked and held by air suction through the suction hole 5 opened in the pressing surface of the tool 4.

  Then, the head 2 rises to a height position at which the brush 10 does not come into contact with the chip 11 held by suction on the pressing surface of the tool 4, and then the blowout hole when the chip transport means 9 and the cleaning means 8 return to the original retracted position. The air 17 is retreated while blowing out the air 17. Therefore, since the pressure surface of the tool 4 and the face-up surface 11a of the chip 11 are cleaned by the air 17, dust such as chipping can be more accurately removed.

  The air 17 is not only in a state where the air 17 is blown out from the blowing hole 18 when the chip conveying means 9 and the cleaning means 8 return to the original retracted position, but also when the brush 10 cleans the pressure surface of the tool 4. The air 17 may be cleaned while being blown out.

  FIG. 10 shows a form in which the rubber blade 19 is provided so as to be higher than the chip 11 that is conveyed instead of the form in which the air 17 is blown out from the blowout hole 18 in FIG. 9. The rubber blade 19 is silicon rubber, but rubber other than silicon may be used as long as it has excellent heat resistance and durability.

  Although the rubber blade 19 is fixed by the rubber holder 19a, it is difficult to use semipermanently because the chip 11 is reliably cleaned every time the chip 11 is held on the pressing surface 4a of the tool 4. Therefore, the rubber blade 19 and the rubber holder 19a are provided in a form that can be freely detached from the cleaning means 8. Moreover, the form which the cleaning means 8 itself can be freely attached or detached with the conveyance means 9 may be sufficient.

  Moreover, as shown in FIG. 11, the form which provided only the rubber blade 19 which excluded the brush 10 and the brush holder 10a part in FIG. 10 may be sufficient.

  FIG. 12 shows a configuration in which the chip 4 is placed between the brush 10 and the blowout hole 18. First, the pressure conveying surface of the tool 4 is cleaned by the brush 10 by the parallel movement of the chip conveying means 9 and the cleaning means 8, and the chip conveying means 9 and the cleaning means 8 are stopped when the chip 11 reaches just below the pressure surface of the tool 4. Then, the chip 11 is sucked and held by air suction through the suction hole 5 opened in the pressing surface of the tool 4. Thereafter, while the air is blown out from the blowing hole 18, the tip conveying means 9 and the cleaning means 9 are further moved in parallel and then stopped, and the head 2 does not come into contact with the tip 11 that the brush 10 sucks and holds on the pressure surface of the tool 4. After rising to the height position, when the chip conveying means 9 and the cleaning means 8 return to the original retracted position, the air 17 is retreated while being blown out from the blowing holes 18.

  FIG. 13 shows a form constituted by a plurality of rollers and a wiping sheet instead of the rubber blade 19 in FIG. The wiping sheet 23 for cleaning the pressing surface 4a of the tool 4 is a silicon sheet, but may be a sheet other than silicon as long as it has excellent heat resistance and durability.

  Further, the wiping sheet 23 is wound from the feed roller 21 via the sponge roller 20 by the take-up roller 22, but the arrangement of the feed roller 21 and the take-up roller 22 may be reversed. . Note that the winding operation may be any operation mode such as periodic, every time the chip 11 is held on the pressing surface 4 a of the tool 4. In addition, the cleaning part 20a in the sponge roller 20 is provided so as to be higher than the chip 11 to be conveyed.

  When cleaning the pressing surface 4a of the tool 4, the rollers 20, 21, and 22 are cleaned in a stopped state (the wiping sheet 23 is also stopped), but the rollers 20, 21, 22, and the wiping sheet 23 are in the winding direction. It may be configured to clean the pressing surface 4a of the tool 4 while operating, or may be configured to clean while operating in the winding direction even when the arrangement of the feeding roller 21 and the winding roller 22 is reversed. good.

  For example, it may be combined with other cleaning means such as a brush or an air outlet, and the cleaning means other than those described in the first and second embodiments as long as dust particles such as chipping can be removed. It may be a configuration and a combination.

  Although not shown in the drawings, the present invention is not limited to the first and second embodiments, and the dust is not applied to the chip conveying means 9 or the cleaning means 8 so that dust such as chipping removed by cleaning by the cleaning means 8 is not scattered. A suction means may be provided. The dust suction means may be provided not only in the form of being integrated with the chip transfer means 9 and the cleaning means 8, but in a form in which the operation can be controlled independently.

The schematic block diagram of the mounting apparatus which concerns on one embodiment of this invention is shown. A schematic diagram of a chip and a substrate is shown. FIG. 3 is a schematic view showing a state in which the chip conveying means and the cleaning means are moving below the tool pressing surface. The schematic state figure which showed the state which the cleaning means is cleaning the tool pressurization surface is shown. FIG. 2 is a schematic view showing a state in which the chip conveying means and the cleaning means are stopped. FIG. 3 is a schematic view showing a state in which the chip conveying means and the cleaning means are moving in the direction of the original retracted position. FIG. 3 is a schematic view showing a state in which each recognition mark on the chip and the substrate is recognized by a recognition means. FIG. 2 is a schematic view showing a state in which the chip and the substrate are bonded together. The schematic block diagram which provided the brush and the air blowing hole in the cleaning means is shown. The schematic block diagram which provided the brush and the rubber blade in the cleaning means is shown. The schematic block diagram which provided the rubber blade in the cleaning means is shown. The schematic block diagram which provided the brush and the air blowing hole in the cleaning means is shown. The schematic block diagram which provided the some roller and the wiping sheet | seat in the cleaning means is shown. A schematic view of a chip having burrs is shown. The general | schematic aspect figure which showed the state which has joined the chip | tip and board | substrate in a prior art is shown. FIG. 3 is a schematic view showing a state in which chipping is attached to the tool.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mounting apparatus 2 Head 3 Fine vibration means 4 Tool 4a Pressurization surface 5 Air intake hole 6 Substrate holding stage 7 2 Field recognition means 7a Upper optical axis 7b Lower optical axis 8 Cleaning means 9 Chip conveying means 10 Brush 10a Brush holder 11 Tip 11a Face-up surface 11b Face-down surface 12 Bump 13 First recognition mark 14 Substrate 14a Mounting surface 14b Lower surface 15 Pad 16 Second recognition mark 17 Air 18 Blowout hole 19 Rubber blade 19a Rubber holder 20 Sponge roller 21 Feed roller 22 Take-up roller 23 Wipe off Sheet 100 Chip 100a Face-up surface 100b Face-down surface 101 Bump 102 Chipping 103 Substrate 104 Pad 105 Tool 105a Tool pressing surface 106 Substrate holding stage 107 Mounting device 2 0 pressure 201 micro-vibration

Claims (8)

When the first workpiece held by the head having the fine vibration means and the second workpiece held by the stage are bonded to each other, the first workpiece holding surface of the head having the fine vibration means is used. A method of cleaning,
A step of recognizing the first object to be bonded held by the head having the fine vibration means and the second object to be bonded held by the stage by the recognition means;
Bonding the first object to be bonded and the second object to be bonded by the fine vibration means after the alignment step;
And a step of cleaning the first bonded object holding surface of the head having the fine vibration means by the cleaning means for each bonding of the first bonded object and the second bonded object. .   The mounting method according to claim 1, wherein the step of bonding by the fine vibration means is a step of bonding by ultrasonic vibration.   The mounting method according to claim 1, wherein the step of cleaning by the cleaning unit is a step of cleaning with a brush.   The mounting method according to claim 1, wherein the cleaning step and the transporting step of the first object are performed together. When the first workpiece held by the head having the fine vibration means and the second workpiece held by the stage are bonded to each other, the first workpiece holding surface of the head having the fine vibration means is used. A device for cleaning,
Recognizing means for recognizing a first object to be joined held by a head having fine vibration means and a second object to be joined held by the stage;
A joining means for joining the first article to be joined and the second article to be joined by aligning means;
A cleaning means for cleaning the first workpiece holding surface of the head having the fine vibration means;
A mounting apparatus, wherein the first bonded object holding surface of the head having the fine vibration means is cleaned by the cleaning means for each bonding of the first bonded object and the second bonded object.   6. The mounting apparatus according to claim 5, wherein the fine vibration means provided in the head having the fine vibration means is ultrasonic vibration.   The mounting apparatus according to claim 5, wherein the cleaning unit is a brush.   The mounting apparatus according to claim 5, wherein the cleaning unit is disposed in the immediate vicinity of the conveying unit.

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