JP2006013466A - Method of cleaning mounting-nozzle, and its equipment - Google Patents

Method of cleaning mounting-nozzle, and its equipment Download PDF

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JP2006013466A
JP2006013466A JP2005148930A JP2005148930A JP2006013466A JP 2006013466 A JP2006013466 A JP 2006013466A JP 2005148930 A JP2005148930 A JP 2005148930A JP 2005148930 A JP2005148930 A JP 2005148930A JP 2006013466 A JP2006013466 A JP 2006013466A
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mounting
polishing
suction surface
nozzle
cleaning
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JP4236005B2 (en
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Toru Mizuno
亨 水野
Tomomi Asakura
伴視 浅倉
Toshinobu Miyakoshi
敏暢 宮腰
Yuji Saito
雄次 斎藤
Tsuguhiro Hasebe
次博 長谷部
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TDK Corp
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TDK Corp
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Priority to US11/138,302 priority patent/US20050272351A1/en
Priority to KR1020050044716A priority patent/KR100623108B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning equipment, having a polishing component which will not cause peeling of abrasive grain, will not affect a suction surface where contaminants, scrap, etc., involved in polishing will not affect the suction surface accompanying polishing, and the adhesion, of wafer will not adhere to the suction surface, when cleaning the suction surface of a mounting nozzle, and to provide a cleaning method therefor. <P>SOLUTION: The cleaning equipment is used in an electronic component mounting machine, and the mounting machine has a mounting nozzle for mounting an electronic component on a circuit board, and the suction surface which sucks and holds the electronic component is provided at the tip of the mounting nozzle. The cleaning equipment includes a means of polishing for scrubbing the suction surface of the mounting nozzle and a means of driving for making the polishing means move in the predetermined direction. The polishing means is made of a ceramic structure, and the grain size at contact surface of the polishing means which contacts with the suction surface of the mounting nozzle is P1,000 to P5,000. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、電子部品等を基板等に実装するための実装機が有する実装ノズルのクリーニング方法及びその装置、クリーニング装置を組み込んだ実装機に関する。   The present invention relates to a mounting nozzle cleaning method and a mounting apparatus included in a mounting machine for mounting an electronic component or the like on a substrate or the like, and a mounting machine incorporating the cleaning device.

従来より、ウエハより切り出したフリップチップ等の電子部品を回路基板等に装着するための電子部品実装機が使用されている。一般的には、電子部品実装機は、取り上げ部と実装部とを備える。取り上げ部は、ウエハからチップを取り上げ、実装部に移送し、実装部は、取り上げ部から渡されたチップを回路基板等に装着する。   2. Description of the Related Art Conventionally, an electronic component mounting machine for mounting electronic components such as flip chips cut out from a wafer on a circuit board or the like has been used. Generally, an electronic component mounting machine includes a pick-up unit and a mounting unit. The pick-up unit picks up the chip from the wafer and transfers it to the mounting unit, and the mounting unit mounts the chip passed from the pick-up unit on a circuit board or the like.

電子部品実装機は、真空源に連通した吸着ノズルを用いて、チップをウエハから取り上げることや、回路基板へチップを装着することを行っている。従って、チップを吸着保持することを妨げる虞のある加工くず、ごみ、ウエハの糊等が吸着ノズルの吸着面に存在することは好ましくない。そこで従来より、吸着面に付着しているくず、ゴミ、ウエハの糊を研磨部材、ブラシ等により除去することが行われている。   An electronic component mounting machine picks up a chip from a wafer or mounts a chip on a circuit board using a suction nozzle connected to a vacuum source. Accordingly, it is not preferable that processing waste, dust, wafer paste, or the like that may hinder holding the chip by suction is present on the suction surface of the suction nozzle. Therefore, conventionally, scraps adhering to the suction surface, dust, and glue on the wafer are removed with a polishing member, a brush, or the like.

図４は、従来の電子部品実装機の一部を示す斜視図である。実装部８０１は、ｘ軸方向に延在する架台８１１と、ｘ軸方向に移動可能に架台８１１に装着された実装ノズル本体８０９と、を備える。さらに、実装ノズル本体８０９は、下方に吸着面を向けた吸着ノズル８１３を備える。   FIG. 4 is a perspective view showing a part of a conventional electronic component mounting machine. The mounting unit 801 includes a gantry 811 extending in the x-axis direction and a mounting nozzle body 809 mounted on the gantry 811 so as to be movable in the x-axis direction. Further, the mounting nozzle body 809 includes a suction nozzle 813 having a suction surface facing downward.

実装部８０１の下方にはクリーニング部８１５が配置されている。クリーニング部８１５は、ｙ軸方向に延在するｙ軸架台８０７と、ｙ軸架台８０７の上面で、ｙ軸方向に移動可能な研磨ステージ８０５と、を備える。研磨ステージ８０５の上面には、研磨部材８０３が配置されている。   A cleaning unit 815 is disposed below the mounting unit 801. The cleaning unit 815 includes a y-axis gantry 807 extending in the y-axis direction, and a polishing stage 805 movable on the upper surface of the y-axis gantry 807 in the y-axis direction. A polishing member 803 is disposed on the upper surface of the polishing stage 805.

上記構成の電子部品実装機において、吸着ノズル８１３を研磨部材８０３に接触するように下降させた後、吸着ノズル本体８０９をｘ軸方向に移動させるとともに、研磨ステージ８０５をｙ軸方向に移動させることにより、吸着ノズル８１３の吸着面（チップとの接触面）を研磨しクリーニングを行う（特許文献１参照。）。   In the electronic component mounting machine having the above configuration, after the suction nozzle 813 is lowered so as to contact the polishing member 803, the suction nozzle body 809 is moved in the x-axis direction and the polishing stage 805 is moved in the y-axis direction. Thus, the suction surface (contact surface with the chip) of the suction nozzle 813 is polished and cleaned (see Patent Document 1).

図５は、他の従来の電子部品実装機の一部を示す斜視図である。図中には、実装機の実装部及びクリーニング部が概略的に示されている。実装部９０３は、ｘ軸架台９０５、ｘ軸架台９０５の下部に装着されているｙ軸架台９０７、ｘ軸架台９０５に装着されているノズル支持部９０９と、ノズル支持部９０９から下方に延在し昇降可能な吸着ノズル９１１とを備える。クリーニング部９５１は、ｘ軸方向及びｙ軸方向に移動可能な移動ステージ９５３と、移動ステージ９５３上に配置されている砥石部材９５５と、回転ブラシ９５７と、回転ブラシ９５７を回動させるための駆動部材９５９とを備える。   FIG. 5 is a perspective view showing a part of another conventional electronic component mounting machine. In the figure, a mounting unit and a cleaning unit of the mounting machine are schematically shown. The mounting portion 903 includes an x-axis mount 905, a y-axis mount 907 attached to the lower part of the x-axis mount 905, a nozzle support portion 909 attached to the x-axis mount 905, and a downward extension from the nozzle support portion 909. And a suction nozzle 911 that can be moved up and down. The cleaning unit 951 includes a moving stage 953 movable in the x-axis direction and the y-axis direction, a grindstone member 955 disposed on the moving stage 953, a rotating brush 957, and a drive for rotating the rotating brush 957. A member 959.

上記構成において、吸着ノズル９１１の吸着面９１３を、吸着ノズルをクリーニング部９５１の砥石部材９５５上に移動させ、吸着面９１３を砥石部材９５５で擦ることにより吸着面９１３のクリーニングを行う。さらに、吸着ノズル９１１を回転ブラシ９５７のブラシで吸着面９１３のごみ等を掻き取ることができる位置に移動し、回転ブラシ９５７によりクリーニングを行う（特許文献２参照。）。
特開２００２ー３１３８３７号公報（段落番号〔００３０〕〜段落番号〔００３３〕、図６〜図９） 特開平１０ー６４９５８号公報（段落番号〔００６４〕〜段落番号〔００６５〕、段落番号〔００７６〕〜段落番号〔００８１〕、図１、図３） In the above configuration, the suction surface 913 of the suction nozzle 911 is moved onto the grindstone member 955 of the cleaning unit 951, and the suction surface 913 is cleaned by rubbing the suction surface 913 with the grindstone member 955. Further, the suction nozzle 911 is moved to a position where dust on the suction surface 913 can be scraped with the brush of the rotary brush 957, and cleaning is performed with the rotary brush 957 (see Patent Document 2).
JP 2002-313837 A (paragraph number [0030] to paragraph number [0033], FIGS. 6 to 9) JP-A-10-64958 (paragraph number [0064] to paragraph number [0065], paragraph number [0076] to paragraph number [0081], FIGS. 1 and 3)

実装ノズルの吸着面を良好な状態に保ち、電子部品を確実に吸着保持するために、吸着面をクリーニングするためのクリーニング装置では、クリーニング作業の頻度を多くするなどして対応している。例えば、ノズル吸着面に付着するダイシングテープの糊若しくはゴミ等を除去するために、一の電子部品の実装が終了する毎にクリーニングを行っている。   In order to keep the suction surface of the mounting nozzle in a good state and securely hold the electronic component by suction, a cleaning device for cleaning the suction surface supports this by increasing the frequency of the cleaning work. For example, in order to remove glue or dust from the dicing tape adhering to the nozzle suction surface, cleaning is performed every time mounting of one electronic component is completed.

さらに、一般的に使用されている研磨部材（例えば、ダイヤモンド、酸化クロム、酸化鉄等をコーティングしたラッピングフィルム）を用いると、その研磨部材の砥粒が剥離したり、剥離した砥粒が実装ノズルの吸着面に付着することがあった。研磨部材から砥粒が剥離すると、所定の粒度で吸着面を研磨できず、充分にクリーニングが行われない虞がある。また、剥離した砥粒が吸着面に付着した状態では、電子部品を吸着し損なったり、吸着面の砥粒により電子部品の表面を傷付けたり、電子部品を破損することがある。   Further, when a commonly used polishing member (for example, a wrapping film coated with diamond, chromium oxide, iron oxide, etc.) is used, the abrasive grains of the polishing member are peeled off or the peeled abrasive grains are mounted on the mounting nozzle. May adhere to the adsorption surface. When the abrasive grains peel from the polishing member, the adsorption surface cannot be polished with a predetermined particle size, and there is a possibility that the cleaning is not performed sufficiently. Further, in the state where the peeled abrasive particles are adhered to the suction surface, the electronic component may be unsucked, the surface of the electronic component may be damaged by the abrasive particles on the suction surface, or the electronic component may be damaged.

さらに、近年の電子部品の小型化・薄型化に伴い、電子部品を吸着保持する際にはその実装ノズルの吸着面の面粗度を厳密に制御する必要性が生じてきている。   Furthermore, along with recent downsizing and thinning of electronic components, there is a need to strictly control the surface roughness of the suction surface of the mounting nozzle when holding the electronic component by suction.

そこで本発明は、実装ノズルの吸着面をクリーニングする際に、砥粒の剥離が生じない研磨部材であって、吸着面の面粗度を高精度に制御でき、研磨に伴うごみ、くず等が研磨対象である吸着面に影響を及ぼすことがなく、ウエハの糊が吸着面に付着することのない研磨部材を備えるクリーニング装置を提供することを目的とする。そして、回路基板への電子部品の装着を安定して行うことが可能な実装機を提供することを目的とする。   Therefore, the present invention is a polishing member that does not cause separation of abrasive grains when cleaning the suction surface of the mounting nozzle, and can control the surface roughness of the suction surface with high accuracy, and can generate dust, debris, etc. It is an object of the present invention to provide a cleaning device including a polishing member that does not affect the suction surface to be polished and does not adhere the wafer paste to the suction surface. And it aims at providing the mounting machine which can mount | wear the electronic component to a circuit board stably.

上記課題を解決するための本発明のクリーニング装置の第１の態様は、電子部品実装機に使用され、前記電子部品実装機は、電子部品を回路基板に実装するための実装ノズルを備え、前記実装ノズルの先端部には電子部品を吸着保持する吸着面が設けられ、前記クリーニング装置は、前記実装ノズルの前記吸着面を擦るための研磨手段と、前記研磨手段を所定の方向に移動させるための駆動手段と、を備え、前記研磨手段は、セラミックス構造体からなり、前記実装ノズルの吸着面と接触する前記研磨手段の接触面の粒度がＰ１，０００〜Ｐ５，０００の範囲内である。   A first aspect of the cleaning device of the present invention for solving the above problems is used in an electronic component mounting machine, and the electronic component mounting machine includes a mounting nozzle for mounting the electronic component on a circuit board, The tip of the mounting nozzle is provided with a suction surface for sucking and holding electronic components, and the cleaning device is configured to rub the suction surface of the mounting nozzle and move the polishing means in a predetermined direction. The polishing means is made of a ceramic structure, and the particle size of the contact surface of the polishing means that contacts the suction surface of the mounting nozzle is in the range of P1,000 to P5,000.

上記態様によれば、研磨部材として使用されるセラミック構造体は、実装ノズルに比べその硬度が高い。よって、砥粒がセラミックス構造体から剥がれることを防止できる。また、ダイシングテープの糊等が吸着面に付いた場合でも、その付着物は、研磨工程により研磨部材の粒子の間に入り込む。よって、仮に研磨工程においてごみが発生しても、そのゴミの量を少なく抑えることが可能となる。   According to the above aspect, the ceramic structure used as the polishing member has a higher hardness than the mounting nozzle. Therefore, it can prevent that an abrasive grain peels from a ceramic structure. Further, even when glue or the like of the dicing tape adheres to the adsorption surface, the adhering matter enters between the particles of the polishing member by the polishing process. Therefore, even if dust is generated in the polishing process, the amount of dust can be reduced.

結果として吸着面にごみ等が付着することを防止することができ、後工程である超音波接合により電子部品を回路基板に確実に固定することができる。   As a result, it is possible to prevent dust and the like from adhering to the suction surface, and it is possible to reliably fix the electronic component to the circuit board by ultrasonic bonding which is a subsequent process.

本発明のクリーニング装置の第２の態様では、前記セラミックス構造体は、アルミナセラミックス、ジルコニアセラミックス、窒化珪素セラミックス、炭化珪素セラミックスの何れかである。   In the second aspect of the cleaning device of the present invention, the ceramic structure is any one of alumina ceramics, zirconia ceramics, silicon nitride ceramics, and silicon carbide ceramics.

本発明の電子部品実装機の一の態様は、上記第１又は第２の態様のクリーニング装置を有する。   One aspect of the electronic component mounting machine of the present invention includes the cleaning device according to the first or second aspect.

本発明のクリーニング方法の一の態様は、電子部品を回路基板等に実装する際に吸着保持するために使用される実装ノズルをクリーニングする方法であって、粒度がＰ１，０００〜Ｐ５，０００のセラミックス構造体からなる研磨部材に前記実装ノズルの吸着面を押し当てる工程と、前記吸着面が前記研磨部材に押し当てられた状態で、前記研磨部材を前記吸着面に対して平行に相対移動させて前記吸着面を研磨する工程を備える。   One aspect of the cleaning method of the present invention is a method for cleaning a mounting nozzle used for sucking and holding an electronic component when mounted on a circuit board or the like, and having a particle size of P1,000 to P5,000. Pressing the suction surface of the mounting nozzle against a polishing member made of a ceramic structure; and moving the polishing member in parallel with the suction surface while the suction surface is pressed against the polishing member. And a step of polishing the adsorption surface.

上記方法によれば、研磨部材として使用されるセラミック構造体は、実装ノズルに比べその硬度が高い。よって、砥粒がセラミックス構造体から剥がれることを防止できる。また、ダイシングテープの糊等が吸着面に付いた場合でも、その付着物は、研磨工程により研磨部材の粒子の間に入り込む。よって、仮に研磨工程においてごみが発生しても、そのゴミの量を少なく抑えることが可能となる。   According to the above method, the ceramic structure used as the polishing member has a higher hardness than the mounting nozzle. Therefore, it can prevent that an abrasive grain peels from a ceramic structure. Further, even when glue or the like of the dicing tape adheres to the adsorption surface, the adhering matter enters between the particles of the polishing member by the polishing process. Therefore, even if dust is generated in the polishing process, the amount of dust can be reduced.

本発明クリーニング装置は、吸着面の面粗度がＰ８００〜Ｐ６，０００の範囲内にある実装ノズルを備える電子部品実装機に用いることが好ましい。   The cleaning device of the present invention is preferably used for an electronic component mounting machine including a mounting nozzle whose surface roughness is in the range of P800 to P6,000.

本発明において実装ノズルのクリーニング部に対する相対速度は、１ｍｍ／ｓ〜１０ｍｍ／ｓであることが好ましい。相対速度が１０ｍｍ／ｓより大きいと、研磨時に実装ノズルのエッジ部分に欠けが発生する虞がある。また、相対速度が１ｍｍ／ｓより小さい場合には、研磨自体が困難になるとともに研磨処理に要する時間が長くなってしまい実用的でない。   In the present invention, the relative speed of the mounting nozzle with respect to the cleaning portion is preferably 1 mm / s to 10 mm / s. If the relative speed is greater than 10 mm / s, there is a possibility that chipping occurs at the edge portion of the mounting nozzle during polishing. On the other hand, when the relative speed is less than 1 mm / s, the polishing itself becomes difficult and the time required for the polishing process becomes long, which is not practical.

本明細書中において、実装ノズルとは、真空源に連通する吸引口が備けられ、吸引口から真空引きすることで加工対象物を吸引保持する部材を意味し、取り上げ部に用いられる取り上げノズルや、実装部に用いられる実装ノズル等を含む。
本明細書中において、実装ノズルとは、真空源に連通する吸引口が備けられ、吸引口から真空引きすることで加工対象物を吸引保持する部材を意味し、取り上げ部に用いられる取り上げノズルや、実装部に用いられる実装ノズル等を含む。
また、本明細書中の粒度は、ＩＳＯ（世界標準規格）６３４４−１：１９９８に準じたＪＩＳ（日本工業規格）Ｒ ６０１０：２０００に準拠した数値で記載されている。 In this specification, the mounting nozzle means a member that is provided with a suction port that communicates with a vacuum source, and that sucks and holds a workpiece by vacuuming from the suction port. And a mounting nozzle used in the mounting portion.
In this specification, the mounting nozzle means a member that is provided with a suction port that communicates with a vacuum source, and that sucks and holds a workpiece by vacuuming from the suction port. And a mounting nozzle used in the mounting portion.
Moreover, the particle size in this specification is described by numerical values based on JIS (Japanese Industrial Standards) R 6010: 2000 according to ISO (World Standards) 6344-1: 1998.

本発明のクリーニング装置の研磨部材として、粒度がＰ８００〜Ｐ６０００であるセラミックス構造体を使用することにより、比較的短時間に所定の面粗度を有する吸着面を備える実装ノズルを提供することができる。また、セラミックス構造体の硬度が高いという特質により、研磨粒子が剥離することを防止できる。   By using a ceramic structure having a particle size of P800 to P6000 as the polishing member of the cleaning device of the present invention, it is possible to provide a mounting nozzle having a suction surface having a predetermined surface roughness in a relatively short time. . In addition, due to the high hardness of the ceramic structure, it is possible to prevent the abrasive particles from peeling off.

仮に研磨工程においてセラミックス構造体にごみが発生しても、上記範囲の粒度では、研磨部材を構成するアルミナ粒子間にゴミが取り込まれ、ごみの量を少なく抑えることが可能となる。   Even if dust is generated in the ceramic structure in the polishing step, with the particle size in the above range, dust is taken in between the alumina particles constituting the polishing member, and the amount of dust can be reduced.

結果として吸着面にごみ等が付着することを防止することができ、後工程である超音波接合により電子部品を回路基板に安定して行うことができる。   As a result, it is possible to prevent dust and the like from adhering to the suction surface, and electronic components can be stably applied to the circuit board by ultrasonic bonding as a subsequent process.

以下、図面を参照して本発明の実装ノズルクリーニング装置を適用した電子部品実装機の実施の形態について詳細に説明する。   Embodiments of an electronic component mounting machine to which a mounting nozzle cleaning device of the present invention is applied will be described below in detail with reference to the drawings.

図１は、電子部品実装機の全体を示す斜視図である。電子部品実装機１０１は、略円形状のウエハを切断し形成される個々のチップ（電子部品）を取り上げるための部品取り上げ部２０１と、部品取り上げ部２０１からチップを受け取り、回路基板にチップを実装するための実装部３０１と、実装部３０１の実装ノズル３０９の吸着面をクリーニングをするためのクリーニング部５０１と、チップが実装される回路基板を供給する回路基板供給部４０１と、を備える。   FIG. 1 is a perspective view showing the entire electronic component mounting machine. The electronic component mounting machine 101 receives a chip from the component picking unit 201 for picking up individual chips (electronic components) formed by cutting a substantially circular wafer, and mounts the chip on the circuit board. A mounting unit 301 for cleaning, a cleaning unit 501 for cleaning the suction surface of the mounting nozzle 309 of the mounting unit 301, and a circuit board supply unit 401 for supplying a circuit board on which a chip is mounted.

部品取り上げ部２０１は、個々のチップを吸着保持するための取り上げノズル２１３が移動可能に配置されている第１基台２０３と、第１基台２０３の長手方向に対して横切る方向に延在する部品供給テーブル２１７と、取り上げノズル２１３をｘ軸方向２１５、回転方向２１９等に移動させるための駆動部２０７と、チップの位置を認識するための位置認識カメラ２０９と、を備える。   The component pick-up part 201 extends in a direction transverse to the longitudinal direction of the first base 203 and a first base 203 in which pick-up nozzles 213 for sucking and holding individual chips are movably disposed. A component supply table 217, a drive unit 207 for moving the picking nozzle 213 in the x-axis direction 215, the rotation direction 219, and the like, and a position recognition camera 209 for recognizing the position of the chip are provided.

また、部品供給テーブル２１７上にはウエハテーブル２０５が配置される。ウエハテーブル２０５上には、不図示のウエハが配置される。ウエハテーブル２０５の下側には不図示の突き上げピンが配置され、取り上げノズルが所定チップを吸着保持できるように所定のチップを下方から突き上げる。   A wafer table 205 is disposed on the component supply table 217. A wafer (not shown) is placed on the wafer table 205. A push-up pin (not shown) is arranged below the wafer table 205, and pushes a predetermined chip from below so that the pick-up nozzle can suck and hold the predetermined chip.

また、実装部３０１は、部品取り上げ部２０１の第１基台２０３の長手方向に対して鉛直方向に延在する第２基台３１３と、第２基台に沿って移動可能で実装ノズル３０９を備える実装ユニット３０３と、実装ノズル３０９を上下方向、ｙ方向３１１等に移動させる駆動部３０５、３１５とを備える。   In addition, the mounting unit 301 includes a second base 313 extending in the vertical direction with respect to the longitudinal direction of the first base 203 of the component picking unit 201, and a mounting nozzle 309 that is movable along the second base. And a drive unit 305 and 315 for moving the mounting nozzle 309 in the vertical direction, the y-direction 311 and the like.

回路基板供給部４０１は、チップが装着される回路基板４０７を供給する。回路基板供給部４０１は、ｘ軸方向４１１に移動可能なｘ軸テーブル４０４を備えるｘ軸基板４０３と、ｘ軸テーブル４０４上に載置されるとともに、ｙ軸方向４１３に移動可能なｙ軸テーブル４０６を備えるｙ軸基板４０５と、ｙ軸テーブル４０６上に載置された回路基板ホルダ４０９と、を備える。回路基板ホルダ４０９には回路基板４０７が装填されている。   The circuit board supply unit 401 supplies a circuit board 407 to which a chip is mounted. The circuit board supply unit 401 includes an x-axis board 403 including an x-axis table 404 movable in the x-axis direction 411, and a y-axis table mounted on the x-axis table 404 and movable in the y-axis direction 413. And a circuit board holder 409 mounted on the y-axis table 406. A circuit board 407 is loaded in the circuit board holder 409.

なお、ｘ軸基板４０３とｙ軸基板４０５それぞれは、ｘ軸駆動モータ４１５及びｙ軸駆動モータ４１７を連結している。そして、回路基板ホルダ４０９のｘ軸方向４１１移動は、ｘ軸駆動モータ４１５を駆動することによりｘ軸テーブル４０４上のｙ軸基板４０５を移動することで行われる。回路基板ホルダ４０９のｙ軸方向への移動４１３は、ｙ軸駆動モータ４１７によりｙ軸テーブル４０６を駆動することで行う、   Each of the x-axis board 403 and the y-axis board 405 is connected to the x-axis drive motor 415 and the y-axis drive motor 417. The movement of the circuit board holder 409 in the x-axis direction 411 is performed by moving the y-axis board 405 on the x-axis table 404 by driving the x-axis drive motor 415. The movement 413 of the circuit board holder 409 in the y-axis direction is performed by driving the y-axis table 406 by the y-axis drive motor 417.

次に実装部３０１の実装ノズル３０９を洗浄するためのクリーニング部について説明する。クリーニング部５０１は、前述の第２基台３１３に設けられている。クリーニング部５０１は、クリーニングユニット本体部５０３と、研磨ステージ５１３を備える。クリーニングユニット本体部５０３は、第２基台３１３の一側面に装着されている。研磨ステージ５１３は、クリーニングユニット本体部５０３の上面に配置される。   Next, a cleaning unit for cleaning the mounting nozzle 309 of the mounting unit 301 will be described. The cleaning unit 501 is provided on the second base 313 described above. The cleaning unit 501 includes a cleaning unit main body 503 and a polishing stage 513. The cleaning unit main body 503 is attached to one side surface of the second base 313. The polishing stage 513 is disposed on the upper surface of the cleaning unit main body 503.

図２を参照してクリーニング部５０１をさらに説明する。図２は、クリーニング部の要部を示す斜視図である。クリーニングユニット本体部５０３の上面にｘ方向５１１、５１９に移動可能な研磨ステージ５１３が設けられている。クリーニングユニット本体部５０３には、研磨ステージ５１３をｘ軸方向に移動するための駆動手段が設けられ、駆動手段は、駆動モータ５２１とボールねじ（不図示）を備える。研磨ステージ５１３上には、研磨部材５０５が載置される。   The cleaning unit 501 will be further described with reference to FIG. FIG. 2 is a perspective view showing a main part of the cleaning unit. A polishing stage 513 that can move in the x-directions 511 and 519 is provided on the upper surface of the cleaning unit main body 503. The cleaning unit main body 503 is provided with driving means for moving the polishing stage 513 in the x-axis direction, and the driving means includes a driving motor 521 and a ball screw (not shown). A polishing member 505 is mounted on the polishing stage 513.

また、研磨ステージ５１３のｘ方向に対向する両端面の各々には、Ｌ字形状のクリップ５１５、５１７が設けられ、研磨部材５０５の両端部が当該クリップ５１５、５１７により研磨ステージ５１３に固定される。このような構成にすることにより、研磨部材５０５の研磨ステージ５１３に対する取り付け、取り外しが容易となる。よって、実装ノズルやチップの面粗度の変更に合わせて、研磨部材５０５を変える場合であっても研磨部材の取り替えに要する時間を短縮できる。   Further, L-shaped clips 515 and 517 are provided on both end surfaces of the polishing stage 513 facing in the x direction, and both ends of the polishing member 505 are fixed to the polishing stage 513 by the clips 515 and 517. . With this configuration, the polishing member 505 can be easily attached to and detached from the polishing stage 513. Therefore, even when the polishing member 505 is changed in accordance with the change in the surface roughness of the mounting nozzle and the chip, the time required for replacing the polishing member can be shortened.

上記実装機１０１を用いてウエハからチップを取り出し、回路基板に実装する工程について図１を参照して簡単に説明する。   A process of taking out a chip from a wafer using the mounting machine 101 and mounting it on a circuit board will be briefly described with reference to FIG.

位置認識カメラ２０９を用いて実装する対象となるチップの位置を確認した後、ウエハテーブル２０５上の所定位置に取り上げノズル２１３を移動する。ウエハテーブル２０５の下側にある突き上げピンを上昇させて、所定のチップを持ち上げる。そして取り上げノズル２１３の吸着面の吸着孔に連通している不図示の吸引手段を稼動させ所定のチップを下方に向けた状態で吸着保持する。   After confirming the position of the chip to be mounted using the position recognition camera 209, the pick-up nozzle 213 is moved to a predetermined position on the wafer table 205. A push-up pin on the lower side of the wafer table 205 is raised to lift a predetermined chip. Then, a suction means (not shown) communicating with the suction hole of the suction surface of the take-up nozzle 213 is operated to hold the predetermined chip in a state of facing downward.

次に、取り上げノズル２１３を反転（矢印２１９方向）し、チップを上方に向ける。さらに、チップを保持する取り上げノズル２１３は、駆動部２０７により実装ユニット３０１への受け渡し場所へ移動する。他方、実装ノズル３０９は、駆動部３０５、３１３によりチップの受け渡し場所へと移動させる。   Next, the take-up nozzle 213 is reversed (in the direction of the arrow 219), and the tip is directed upward. Further, the pick-up nozzle 213 that holds the chip is moved to the delivery location to the mounting unit 301 by the driving unit 207. On the other hand, the mounting nozzle 309 is moved to the chip delivery location by the drive units 305 and 313.

受け渡し場所では、実装ノズル３０９の吸着面がチップの上方から、取り上げノズル２１３の吸着面がチップの下方から接する構成となる。ここで、取り上げノズル２１３の吸引力を解除するとともに、実装ノズル３０９に連通する不図示の吸引手段を稼動させ吸引力を発生させる。そうすると、チップは実装ノズル３０９に吸引保持されることとなる。   At the delivery location, the suction surface of the mounting nozzle 309 is in contact with the chip from above, and the suction surface of the pick-up nozzle 213 is in contact with the chip from below. Here, the suction force of the pick-up nozzle 213 is released, and a suction means (not shown) communicating with the mounting nozzle 309 is operated to generate the suction force. Then, the chip is sucked and held by the mounting nozzle 309.

実装ノズル３０９はチップを所定位置に移動し、不図示の基板取り出し手段により回路基板ホルダ４０９から取り出された回路基板４０７の所定箇所に超音波結合等により固着される。   The mounting nozzle 309 moves the chip to a predetermined position, and is fixed to a predetermined position of the circuit board 407 taken out from the circuit board holder 409 by a board taking-out means (not shown) by ultrasonic coupling or the like.

次に、実装ノズル３０９の吸着面３０９ａをクリーニングする工程について図２を参照しつつ説明する。実装ノズル３０９の吸着面３０９ａが研磨部材５０５の表面に接触するように実装ノズル３０９を降下させる。さらに、吸着面３０９ａが研磨部材５０５を所定圧力で押圧するように降下させる。   Next, a process of cleaning the suction surface 309a of the mounting nozzle 309 will be described with reference to FIG. The mounting nozzle 309 is lowered so that the suction surface 309 a of the mounting nozzle 309 contacts the surface of the polishing member 505. Further, the suction surface 309a is lowered so as to press the polishing member 505 with a predetermined pressure.

実装ノズル３０９をｙ方向３１１に所定速度で往復運動をさせるとともに、研磨ステージ５１３をｘ方向５１１、５１９に所定速度で往復運動させる。そうすると吸着面３０９ａに対して研磨部材５０５が相対的に移動することになり、吸着面３０９ａのクリーニングが行われる。また、吸着面と研磨部材の表面はほぼ平行にした状態で研磨作業が行われる。なお、図２において、ｙ方向３１１に沿って吸着部材３０９の両側に２点鎖線で示されているのは、ｙ方向に移動した吸着ノズルを示す。同様に、研磨ステージ５１３がｘ軸方向５１９に移動した状態を２点鎖線で示す。   The mounting nozzle 309 is reciprocated at a predetermined speed in the y direction 311, and the polishing stage 513 is reciprocated at a predetermined speed in the x directions 511 and 519. Then, the polishing member 505 moves relative to the suction surface 309a, and the suction surface 309a is cleaned. Further, the polishing operation is performed in a state where the suction surface and the surface of the polishing member are substantially parallel. In FIG. 2, the two-dot chain lines on both sides of the suction member 309 along the y direction 311 indicate suction nozzles that have moved in the y direction. Similarly, a state where the polishing stage 513 is moved in the x-axis direction 519 is indicated by a two-dot chain line.

また、上記実施形態では、実装ノズル３０９をｙ方向３１１、３１３、研磨ステージ５１３をｘ方向５１１、５１９に移動させているが、これに限定されることはない。すなわち、実装ノズル３０９をｘ方向５１１、５１９及びｙ方向３１１に移動させ、研磨ステージ５１３を停止させた状態で研磨することや、実装ノズル３０９を停止して、研磨ステージ４１３をｘ方向５１１、５１９及びｙ方向３１１に移動させることも可能である。   In the above embodiment, the mounting nozzle 309 is moved in the y direction 311 and 313 and the polishing stage 513 is moved in the x direction 511 and 519, but the present invention is not limited to this. That is, the mounting nozzle 309 is moved in the x direction 511, 519 and the y direction 311 and polishing is performed with the polishing stage 513 stopped, or the mounting nozzle 309 is stopped and the polishing stage 413 is moved in the x direction 511, 519. It is also possible to move in the y direction 311.

なお、上記実施形態において、実装ノズルの吸着面をクリーニング（研磨）するためのクリーニング装置としたが、取り上げノズルのクリーニング装置としても利用できることは言うまでもない。さらに、真空吸引等により電子部品を吸着保持するような機構の吸着面のクリーニング手段として、本発明のクリーニング装置を適用できる。   In the above embodiment, the cleaning device for cleaning (polishing) the suction surface of the mounting nozzle is used, but it goes without saying that it can also be used as a cleaning device for the picking nozzle. Furthermore, the cleaning device of the present invention can be applied as a means for cleaning the suction surface of a mechanism that sucks and holds electronic components by vacuum suction or the like.

上記構成において研磨部材としてセラミック構造体を用いて実装ノズルの吸着面の面粗度を比較した。その表を以下に示す。   In the above configuration, the surface roughness of the suction surface of the mounting nozzle was compared using a ceramic structure as the polishing member. The table is shown below.

発明者等の知見によると、実装ノズルの吸着面の面粗度は、Ｐ８００〜Ｐ６，０００が好ましいことが判っている。   According to the knowledge of the inventors, it is known that the surface roughness of the suction surface of the mounting nozzle is preferably P800 to P6,000.

吸着面の面粗度をＰ６，０００より高くすると（表面が平坦になる）、吸着面とチップとの摩擦が少なくなり、チップの移送中落下する虞がある。また、吸着面の面粗度をＰ６，０００より高くするためには、少なくとも粒度が同等かそれ以上の粒度を有する研磨部材が必要となるが、クリーニングの際に生じるごみ等は、ごみ等自体の大きさのためセラミック構造体を構成する粒子間に取り込まれずに、ごみが研磨部材の表面に存在する虞がある。   If the surface roughness of the suction surface is higher than P6,000 (the surface becomes flat), the friction between the suction surface and the chip is reduced, and there is a risk of dropping during the transfer of the chip. Moreover, in order to make the surface roughness of the adsorption surface higher than P6,000, a polishing member having at least a particle size equal to or larger than that is required, but the dust generated during cleaning is the dust itself. Therefore, dust may be present on the surface of the polishing member without being taken in between the particles constituting the ceramic structure.

また、実装ノズルの吸着面の面粗度をＰ８００より小さく（表面が粗くなる）すると、チップを吸着する際等にチップ表面に傷を付ける虞が生じてしまう。また、表面の凹凸が大きくなると、チップ表面と吸着面との接触面積が充分に取れず、チップの移送中にチップが実装ノズルから落下する虞れがある。   Further, if the surface roughness of the suction surface of the mounting nozzle is smaller than P800 (the surface becomes rough), the chip surface may be damaged when the chip is sucked. In addition, when the unevenness of the surface becomes large, a sufficient contact area between the chip surface and the suction surface cannot be obtained, and the chip may fall from the mounting nozzle during the transfer of the chip.

本実施例で用いた研磨部材は、アルミナセラミックスであるが、ジルコニアセラミックス、窒化珪素セラミックス、炭化珪素セラミックスを使用してもアルミナセラミックスと同様な結果が期待できる。また、粒度がＰ１，０００、５，０００、８，０００のアルミナセラミックスを研磨部材として用いた。   The polishing member used in this example is alumina ceramics, but even if zirconia ceramics, silicon nitride ceramics, or silicon carbide ceramics are used, the same result as alumina ceramics can be expected. In addition, alumina ceramics having a particle size of P1,000, 5,000, and 8,000 were used as polishing members.

実装ノズルの材質はＳＵＳ３０３を用いた。また、実装ノズルの吸着面の形状は、一辺が１ｍｍの略正方形であり、吸着面のほぼ中心には直径が略０．５ｍｍの吸引孔が設けられている。   The material of the mounting nozzle was SUS303. Further, the suction surface of the mounting nozzle has a substantially square shape with a side of 1 mm, and a suction hole having a diameter of approximately 0.5 mm is provided at the approximate center of the suction surface.

さらに、実装ノズルの研磨部材に対する加圧力を３Ｎとした。なお、発明者等は、加圧力を０．５〜２０Ｎの範囲内にすることが好ましいことの知見を得ている。２０Ｎより大きい加圧力を加えると、吸着部材の吸着面に加わる負荷が大き過ぎるため吸着面の変形が生じることがある。また、加圧力が０．５Ｎより小さい場合には、吸着面と研磨部材との間の研磨が十分に行われない虞がある。   Further, the pressure applied to the polishing member of the mounting nozzle was 3N. In addition, the inventors have found that it is preferable to set the applied pressure within the range of 0.5 to 20N. When a pressure greater than 20N is applied, the load applied to the suction surface of the suction member is too large, and the suction surface may be deformed. Further, when the applied pressure is smaller than 0.5 N, there is a possibility that the polishing between the suction surface and the polishing member is not sufficiently performed.

研磨時間に費やされる時間は、短いことに越したことはないが、クリーニング工程を３０秒以内に終了することが実際の電子部品の実装工程を鑑みた場合に要求される。   Although the time spent for the polishing time is not short, it is required to finish the cleaning process within 30 seconds in view of the actual electronic component mounting process.

実装ノズルの研磨部材に対する相対速度は、２ｍｍ／ｓとした。なお、発明者等の知見によれば、相対速度を１ｍｍ／ｓ〜１０ｍｍ／ｓの範囲で適宜設定できることが判っている。すなわち、クリーニング作業を所定時間内に終わらせるために、所定実装ノズルに付与される加圧力に対応させて相対速度を適宜変更することができる。また、研磨ステージ５１３をｘ方向５１１、５１９に直線往復運動させ、実装ノズルを固定状態とし吸着面を研磨した。   The relative speed of the mounting nozzle with respect to the polishing member was 2 mm / s. According to the knowledge of the inventors, it has been found that the relative speed can be appropriately set in the range of 1 mm / s to 10 mm / s. That is, in order to finish the cleaning operation within a predetermined time, the relative speed can be appropriately changed in accordance with the pressure applied to the predetermined mounting nozzle. Further, the polishing stage 513 was linearly reciprocated in the x direction 511, 519, the mounting nozzle was fixed, and the suction surface was polished.

図３は、以上の条件におけるクリーニング作業による吸着面の面粗度を示すグラフである。横軸は研磨時間（秒）、縦軸は研磨品質（面粗度）である。
上記グラフからわかるように、粒度がＰ１，０００のアルミセラミックスを使用した場合には、１０秒前後で実装ノズルの吸着面の面粗度が下限であるＰ８００を超え、定常状態に入っている。また、粒度がＰ５，０００のセラミックス構造体を使用した場合には、３０秒前後で実装ノズルの面粗度がＰ５，０００近傍に到達し定常状態となっている。よって、Ｐ８００〜Ｐ５，０００の範囲内の粒度を有するアルミセラミックスを使用すれば、研磨時間３０秒前後でほぼ所定の面粗度を備える吸着面のクリーニングを行えることがわかる。 FIG. 3 is a graph showing the surface roughness of the suction surface by the cleaning operation under the above conditions. The horizontal axis represents polishing time (seconds), and the vertical axis represents polishing quality (surface roughness).
As can be seen from the graph, when aluminum ceramics with a particle size of P1,000 is used, the surface roughness of the suction surface of the mounting nozzle exceeds the lower limit of P800 in about 10 seconds, and a steady state is entered. When a ceramic structure having a particle size of P5,000 is used, the surface roughness of the mounting nozzle reaches the vicinity of P5,000 in about 30 seconds and is in a steady state. Therefore, it can be seen that if an aluminum ceramic having a particle size in the range of P800 to P5,000 is used, it is possible to clean the suction surface having a substantially predetermined surface roughness in a polishing time of about 30 seconds.

一方、粒度がＰ８，０００のセラミックス構造体を使用した場合には、３０秒を超えると、研磨品質に要求される最低限のＰ８００を超えているが、クリーニング開始から６０秒を過ぎても定常状態に到達しない。すなわち、クリーニング時間を３０秒程度にした場合、その吸着面の面粗度を一定に保つための制御機構が複雑となってしまうため研磨部材には不適である。   On the other hand, when a ceramic structure having a particle size of P8,000 is used, if it exceeds 30 seconds, the minimum P800 required for polishing quality is exceeded, but it remains steady even after 60 seconds from the start of cleaning. The state is not reached. That is, when the cleaning time is set to about 30 seconds, the control mechanism for keeping the surface roughness of the attracting surface constant is complicated, which is not suitable for the polishing member.

この発明は、その本質的特性から逸脱することなく数多くの形式のものとして具体化することができる。よって、上述した実施形態及び実施例は専ら説明上のものであり、本発明を制限するものではないことは言うまでもない。   The present invention can be embodied in many forms without departing from its essential characteristics. Therefore, it is needless to say that the above-described embodiments and examples are merely illustrative and do not limit the present invention.

本発明のクリーニング装置が適用された実装機の斜視図である。It is a perspective view of the mounting machine to which the cleaning apparatus of this invention was applied. クリーニング装置の要部を示す斜視図である。It is a perspective view which shows the principal part of a cleaning apparatus. 本発明のクリーニング装置を用いてクリーニングを行った吸着面の面粗度を示すグラフである。It is a graph which shows the surface roughness of the adsorption | suction surface which cleaned using the cleaning apparatus of this invention. 従来のクリーニング装置が適用された実装機の要部図を示す斜視図である。It is a perspective view which shows the principal part figure of the mounting machine with which the conventional cleaning apparatus was applied. 他の従来のクリーニング装置が適用された実装機の要部を示す斜視図である。It is a perspective view which shows the principal part of the mounting machine with which the other conventional cleaning apparatus was applied.

符号の説明Explanation of symbols

１０１ 電子部品実装機
２０１ 部品取り上げ部
２０３ 第１基台
２０５ ウエハテーブル
２１３ 取り上げノズル
３０１ 実装部
３０９ 実装ノズル
３０９ａ 吸着面
３１３ 吸引口
５０１ クリーニング部
５０３ クリーニングユニット本体部
５０５ 研磨部材
５１３ 研磨ステージ
DESCRIPTION OF SYMBOLS 101 Electronic component mounting machine 201 Component pick-up part 203 1st base 205 Wafer table 213 Pick-up nozzle 301 Mounting part 309 Mounting nozzle 309a Suction surface 313 Suction port 501 Cleaning part 503 Cleaning unit main-body part 505 Polishing member 513 Polishing stage

Claims (4)

電子部品実装機に使用されるクリーニング装置であって、前記電子部品実装機は、電子部品を回路基板に実装するための実装ノズルを備え、前記実装ノズルの先端部には電子部品を吸着保持する吸着面が設けられ、前記クリーニング装置は、
前記実装ノズルの前記吸着面を擦るための研磨手段と、
前記研磨手段を所定の方向に移動させるための駆動手段と、を備え、
前記研磨手段は、セラミックス構造体からなり、前記実装ノズルの吸着面と接触する前記研磨手段の接触面の粒度がＰ１，０００〜Ｐ５，０００（ＪＩＳ Ｒ６０１０：２０００）の範囲内であることを特徴とするクリーニング装置。 A cleaning device used in an electronic component mounting machine, wherein the electronic component mounting machine includes a mounting nozzle for mounting the electronic component on a circuit board, and sucks and holds the electronic component at a tip portion of the mounting nozzle. An adsorption surface is provided, and the cleaning device includes:
A polishing means for rubbing the suction surface of the mounting nozzle;
Driving means for moving the polishing means in a predetermined direction,
The polishing means is made of a ceramic structure, and the particle size of the contact surface of the polishing means that contacts the suction surface of the mounting nozzle is in the range of P1,000 to P5,000 (JIS R6010: 2000). And a cleaning device. 前記セラミックス構造体は、アルミナセラミックス、ジルコニアセラミックス、窒化珪素セラミックス、炭化珪素セラミックスの何れかであることを特徴とする請求項１に記載のクリーニング装置。 The cleaning apparatus according to claim 1, wherein the ceramic structure is any one of alumina ceramics, zirconia ceramics, silicon nitride ceramics, and silicon carbide ceramics. 請求項１又は２に記載のクリーニング装置を有する電子部品実装機。   An electronic component mounting machine having the cleaning device according to claim 1. 電子チップ部品を回路基板等に実装する際に吸着保持するために使用される実装ノズルをクリーニングする方法であって、
粒度がＰ１，０００〜Ｐ５，０００（ＪＩＳ Ｒ６０１０：２０００）のセラミックス構造体からなる研磨部材に前記実装ノズルの吸着面を押し当てる工程と、
前記吸着面が前記研磨部材に押し当てられた状態で、前記研磨部材を前記吸着面に対して平行に相対移動させて前記吸着面を研磨する工程を備えるクリーニング方法。
A method of cleaning a mounting nozzle used for adsorbing and holding an electronic chip component when mounted on a circuit board or the like,
Pressing the suction surface of the mounting nozzle against an abrasive member made of a ceramic structure having a particle size of P1,000 to P5,000 (JIS R6010: 2000);
A cleaning method comprising a step of polishing the suction surface by moving the polishing member in parallel with respect to the suction surface in a state where the suction surface is pressed against the polishing member.
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CN117047616A (en) * 2023-10-09 2023-11-14 内蒙金属材料研究所 Positioning and polishing equipment based on rare earth high-strength and high-toughness steel processing
CN117047616B (en) * 2023-10-09 2023-12-08 内蒙金属材料研究所 Positioning and polishing equipment based on rare earth high-strength and high-toughness steel processing

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