JP2020116665A - Holding surface cleaner - Google Patents

Abstract

To prevent grinding dust from remaining on and re-adhering to a holding surface and prevent reduction of flatness of the holding surface in a holding surface cleaner which cleans a holding surface of a chuck table.SOLUTION: A holding surface cleaner 8 is used to clean a holding surface 300a of a chuck table 30 which holds a workpiece W and includes: a knife 80 having a linear blade edge 800 which is placed in contact with the holding surface 300a; a holding part 81 which holds the knife 80 with the blade edge 800 facing the holding surface 300a; and moving means 82 which places the blade edge 800 in contact with the holding surface 300a or separates the blade edge 800 from the holding surface 300a. The holding surface cleaner 8 places the blade edge 800 in contact with the holding surface 300a and inclines the knife 80 so that the blade edge 800 goes ahead in a moving direction to move the holding surface 300a and the knife 80 relatively and cut and remove deposits adhering to the holding surface 300a with the blade edge 800.SELECTED DRAWING: Figure 2

Description

The present invention relates to a holding surface cleaning device that cleans a holding surface of a chuck table.

BACKGROUND ART A grinding apparatus that grinds and thins a work piece with a grinding wheel holds a work piece by suction on a holding surface such as a porous member of a chuck table. The grinding dust discharged by the grinding process is sucked by the portion of the holding surface that holds the outer peripheral edge of the workpiece, and adheres to the portion of the holding surface. When the workpiece is separated from the holding surface after the grinding process, the grinding dust may remain attached to the portion of the holding surface.

Therefore, the grinding device disclosed in Patent Document 1 or the like is provided with a holding surface cleaning device that brings a cleaning grindstone into contact with the holding surface to scrape off grinding dust adhering to the holding surface.

JP, 2017-140663, A

However, there is a problem that fine grinding dust generated by scraping the attached grinding dust is redeposited on the holding surface. In addition, the grinding dust adhering to the holding surface that the cleaning grindstone scrapes off may be slightly ejected from the holding surface (for example, stuck in the gap of the porous member), and become fine with the protruding grinding dust. There is also a problem that it becomes impossible to grind the work piece sucked and held by the holding surface to a uniform thickness due to the re-attached grinding dust. Further, in the cleaning using the cleaning grindstone, the grinding dust adhering to the holding surface was scraped off together with the holding surface, so that there was uncut residue. If the cleaning time with the cleaning grindstone is increased so that there is no uncut residue, the flatness of the holding surface (parallelism of the holding surface with respect to the grinding surface of the grinding wheel) decreases, and therefore the holding surface of the chuck table is reduced with the grinding wheel. There is a problem in that when the held workpiece is ground, the workpiece does not have a uniform thickness.

Therefore, in the holding surface cleaning device that cleans the holding surface of the chuck table that holds the workpiece, it is possible to prevent leaving grinding debris and re-adhesion of grinding debris on the holding surface and to flatten the holding surface. There is a problem of not reducing the degree.

The present invention for solving the above-mentioned problems is a holding surface cleaning device for cleaning a holding surface of a chuck table for holding a workpiece, and a knife having a linear blade tip that contacts the holding surface, and the holding device. A gripping portion for facing the blade tip to a surface and gripping the knife; and a moving means for bringing the blade tip into contact with the holding surface or moving it away from the holding surface, the blade tip being in contact with the holding surface Is a holding surface cleaning device in which the knife is tilted so as to precede in the moving direction, the holding surface and the knife are moved relative to each other, and the deposits adhering to the holding surface are cut off and removed by the cutting edge.

A holding surface cleaning apparatus according to the present invention includes a two-fluid cleaning unit for injecting a mixed liquid of water and air onto the holding surface, and the two-fluid cleaning unit holds the mixed liquid of water and air. A two-fluid nozzle for ejecting onto the surface, a box that accommodates the two-fluid nozzle and has an opening on the lower surface facing the holding surface, and an elevating means for elevating and lowering the box in a direction perpendicular to the holding surface, The moving means is disposed in the box, the blade edge can be projected from the opening of the box or the blade edge can be stored in the box, and the blade edge projected from the opening adheres to the holding surface. It is preferable to cut off and remove the deposits.

A holding surface cleaning device according to the present invention for cleaning a holding surface of a chuck table has a knife having a linear blade tip that contacts the holding surface, a gripping portion that holds the knife with the blade tip facing the holding surface, and holds the blade tip. A moving means for contacting the surface or moving the holding surface away from the holding surface, so that the holding surface is brought into contact with the cutting edge and the knife is inclined so that the cutting edge is advanced in the moving direction. It is possible to remove the adhered matter adhering to the holding surface by cutting with a blade edge. Therefore, it is possible to prevent the adhered matter such as grinding dust from remaining on the holding surface that holds the work piece, and to prevent the reattachment of grinding dust, and also to prevent the holding surface from being ground with a cleaning grindstone. Therefore, the flatness of the holding surface is not reduced. Therefore, it becomes possible to grind the work piece to a uniform thickness by sucking and holding the work piece by the holding surface after cleaning and performing grinding.

Further, the holding surface cleaning apparatus according to the present invention includes a two-fluid cleaning unit for injecting a mixed liquid of water and air onto the holding surface of the chuck table, and the two-fluid cleaning unit includes a mixed liquid of water and air. A two-fluid nozzle for ejecting the two-fluid nozzle on the holding surface, a box that accommodates the two-fluid nozzle and has an opening on the lower surface that faces the holding surface, and an elevating means that elevates and lowers the box in a direction perpendicular to the holding surface. By arranging the moving means in the box, the blade tip can be projected from the opening of the box or the blade tip can be housed in the box, and by removing the adhering matter adhering to the holding surface with the blade tip projected from the opening, two fluids can be formed. By cleaning, it becomes possible to prevent deposits such as grinding debris from remaining on the holding surface that holds the work piece, and to prevent reattachment of grinding debris, and the two fluids used to clean the deposits in a wide range And the holding surface is not ground with a cleaning grindstone, so that the flatness of the holding surface is not lowered. Therefore, it becomes possible to grind the work piece to a more uniform thickness by sucking and holding the work piece by the holding surface after cleaning and performing grinding.

It is a perspective view showing an example of a grinding device provided with a holding surface cleaning device. It is sectional drawing which shows an example of a holding surface cleaning apparatus. It is sectional drawing which shows the holding surface cleaning apparatus provided with the moving means which rotates a holding part.

The grinding device 1 shown in FIG. 1 is a device that grinds a workpiece W held on a chuck table 30 by a grinding means 7, and includes a holding surface cleaning device 8 according to the present invention. The front side (-Y direction side) of the base 10 of the grinding apparatus 1 is a region where the workpiece W is attached to and detached from the chuck table 30, and the rear side (+Y direction side) of the base 10 is a grinding means. This is a region where the workpiece W held on the chuck table 30 by 7 is ground.

The workpiece W is, for example, a circular semiconductor wafer made of a silicon base material or the like, and the surface Wa of the workpiece W facing downward in FIG. 1 has a plurality of devices formed and is not shown. Protective tape is attached and protected. The back surface Wb of the work piece W is a work surface to be ground. The workpiece W may be made of gallium arsenide, sapphire, gallium nitride, silicon carbide, or the like other than silicon, or may be a rectangular package substrate or the like.

The chuck table 30 that holds the workpiece W has, for example, a circular outer shape, and includes a suction portion 300 that is configured by a porous member or the like and that suctions the workpiece W, and a frame body 301 that supports the suction portion 300. Prepare The suction unit 300 communicates with a suction source (not shown), and suction-holds the workpiece W on the holding surface 300a, which is the exposed surface of the suction unit 300. The holding surface 300a may be a flat surface or an extremely gentle conical surface having the center of rotation of the chuck table 30 as its apex.

The chuck table 30 is surrounded by a cover 39, and is rotatable about a Z-axis axis by a rotating unit 33 (see FIG. 2) including a motor or the like arranged below the cover 39. Further, the chuck table 30 can be reciprocated in the Y-axis direction by a moving means (not shown) provided below the cover 39 and the bellows cover 39a connected to the cover 39 shown in FIG.

An opening of a water case (not shown) is located on both sides of the movement path of the chuck table 30. The water case contains the grinding waste discharged by grinding the workpiece W, receives the processing waste liquid flowing down from the chuck table 30, and sends it to a waste liquid processing mechanism (not shown).

A column 11 is provided upright in the grinding region, and a grinding feed means 5 for feeding the grinding means 7 in the Z-axis direction (vertical direction) which is spaced from or close to the chuck table 30 is provided on the front surface of the column 11. It is arranged. The grinding feed means 5 includes a ball screw 50 having a vertical axis, a pair of guide rails 51 arranged parallel to the ball screw 50, a motor 52 connected to the upper end of the ball screw 50 to rotate the ball screw 50, It is provided with an elevating plate 53 whose internal nut is screwed onto the ball screw 50 and whose side portion is in sliding contact with the guide rail 51. When the motor 52 rotates the ball screw 50, the elevating plate 53 is attached to the guide rail 51 accordingly. The reciprocating movement in the Z-axis direction is guided, and the grinding means 7 fixed to the lifting plate 53 is ground and fed in the Z-axis direction.

The grinding means 7 for grinding the workpiece W held on the chuck table 30 includes a spindle 70 whose axial direction is the Z-axis direction, a housing 71 which rotatably supports the spindle 70, and a motor which rotationally drives the spindle 70. 72, an annular mount 73 connected to the lower end of the spindle 70, a grinding wheel 74 removably mounted on the lower surface of the mount 73, and a side surface of the lifting plate 53 of the grinding feed means 5 that supports the housing 71. Is fixed to the holder 75.

The grinding wheel 74 includes a wheel base 741 and a plurality of grinding wheels 740 having a substantially rectangular parallelepiped shape and annularly arranged on the bottom surface of the wheel base 741. The grinding stone 740 is formed by fixing diamond abrasive grains and the like with an appropriate binder (adhesive), and the lower surface thereof mainly serves as a grinding surface.

Inside the spindle 70, a flow path (not shown) communicating with a grinding water supply source and serving as a passage for the grinding water is provided so as to penetrate in the axial direction (Z-axis direction) of the spindle 70. Further, an opening is formed through the mount 73 on the bottom surface of the wheel base 741 so that the grinding water can be ejected toward the grinding wheel 740.

Above the movement path of the chuck table 30, the holding surface cleaning device 8 according to the present invention is arranged. The holding surface cleaning device 8 shown in FIG. 2 includes a knife 80 having a linear cutting edge 800 that contacts the holding surface 300a of the chuck table 30, and a gripping portion 81 that holds the knife 80 with the cutting edge 800 facing the holding surface 300a. And a moving means 82 for bringing the cutting edge 800 into contact with the holding surface 300a or separating it from the holding surface 300a.
Further, the holding surface cleaning device 8 in the present embodiment is provided with a two-fluid cleaning unit 85 for injecting a mixed liquid of water and air onto the holding surface 300a of the chuck table 30 in addition to the above components. The holding surface cleaning device 8 may not include the two-fluid cleaning unit 85.

The two-fluid cleaning unit 85 includes a two-fluid nozzle 850 that sprays a mixed liquid of water and air onto the holding surface 300a of the chuck table 30, and a box 851 that accommodates the two-fluid nozzle 850 and that has a lower surface facing the holding surface 300a. And a raising and lowering means 852 for raising and lowering the box 851 in a direction perpendicular to the holding surface 300a.

The two-fluid nozzle 850 communicates with a water supply source 86 including a pump or the like for supplying pure water as cleaning water and an air supply source 87 including a compressor or the like for supplying compressed air, and ejects toward the chuck table 30. It has a mouth 850a at its lower end. The cleaning water supplied from the water supply source 86 and the air supplied from the air supply source 87 are mixed in the two-fluid nozzle 850 and are jetted downward from the jet port 850a.

The box 851 has, for example, a substantially rectangular parallelepiped outer shape, and has an opening 851a on the lower surface side thereof. Inside the box 851, the two-fluid nozzle 850, the knife 80, the grip 81, and the moving means 82 are housed. The box 851 is provided to prevent the two fluids sprayed on the holding surface 300a from scattering over a wide range when the holding surface 300a of the chuck table 30 is cleaned. For example, a duct hose that communicates with a suction source (not shown) that suctions the two fluids used for cleaning may communicate with the opening 851a of the box 851.

The knife 80 having a linear cutting edge 800 that contacts the holding surface 300a of the chuck table 30 is made of, for example, an alloy such as SUS, and has a length slightly longer than the radius of the chuck table 30. In the example shown in FIGS. 1 and 2, the chuck table 30 extends in the X-axis direction that is orthogonal to the Y-axis direction that is the moving direction of the chuck table 30 in the horizontal plane. The material and length of the knife 80 are not limited to the above example. The thickness of the knife 80 may be such that the knife 80 can bend when the knife 80 is pressed against the holding surface 300a.
The linear cutting edge 800 of the knife 80 is formed, for example, in an acute angle having a V-shaped cross section.

The gripper 81 that grips the knife 80 with the cutting edge 800 facing the holding surface 300a of the chuck table 30 extends, for example, in the same direction as the extending direction of the knife 80 (X-axis direction in the example shown in FIGS. 1 and 2). An existing substantially rectangular parallelepiped support member 810 is provided, and an insertion hole 810a into which the knife 80 can be tilted and inserted can be formed on the lower surface of the support member 810, for example. In addition, a bolt insertion hole 810b is formed on the side surface of the support member 810 so as to intersect the insertion hole 810a from an obliquely upper side, and the fixing bolt 810c is inserted in the insertion hole 810a with the knife 80 inserted. By screwing the bolt 80 into the bolt insertion hole 810b, the knife 80 can be fixed at the tip of the fixing bolt 810c in a state in which the blade tip 800 is inclined at a predetermined angle from the vertical direction with respect to the holding surface 300a.

A plurality (or one) of elastic members 813 are provided on the upper surface of the support member 810, and a flat plate shape for connecting the moving means 82 to the grip 81 is provided on the upper end side of the elastic members 813. The connecting member 814 is attached. The elastic member 813 absorbs an impact when the cutting edge 800 of the knife 80 comes into contact with the holding surface 300a, and the height of the holding surface 300a is increased while the knife 80 that is cleaning the holding surface 300a is pressed with a predetermined pressing force. It is designed so that it can freely move in the Z-axis direction according to changes.
The elastic member 813 is, for example, a coil spring that tries to return by contracting from its natural length, but the elastic member 813 is not limited to the coil spring and may be a rubber column or the like. For example, the length of the elastic member 813 is a natural length when the knife 80 is not pressed by the holding surface 300a.

The moving means 82 is, for example, an air cylinder, an electric cylinder, a ball screw mechanism, or the like, and can position the cutting edge 800 of the knife 80 at a predetermined height position.
The raising and lowering means 852 for raising and lowering the box 851 in the direction perpendicular to the holding surface 300a is, for example, an air cylinder, an electric cylinder, a ball screw mechanism, or the like.

In the holding surface cleaning device 8, for example, the moving member 88 shown in FIG. 3 may be connected to the connecting member 814. In FIG. 3, the two-fluid cleaning unit 85 is omitted.
The moving means 88 for bringing the cutting edge 800 of the knife 80 into contact with the holding surface 300a or separating it from the holding surface 300a is, for example, a rotating portion 880 for vertically inverting the grip portion 81, and an air cylinder mechanism connected to the rotating portion 880. And 881.

The rotating portion 880 is composed of, for example, a spindle whose axial direction is the same as the extending direction (X-axis direction) of the support member 810, a motor connected to one end of the spindle, and the like, and the gripping portion 81. The cutting edge 800 of the knife 80 can be brought into contact with the holding surface 300a by turning it upside down, or the cutting edge 800 of the knife 80 can be separated from the holding surface 300a.

The air cylinder mechanism 881 is, for example, an air cylinder 881a that is mechanically connected to the rotating portion 880 and that can adjust the height position of the cutting edge 800 of the knife 80 by moving the rotating portion 880 up and down in the Z-axis direction. By adjusting the pressure of an air source (not shown) that supplies air to the cylinder 881a and the pressure of the air that is supplied from the air source to the air cylinder 881a, the pressing force of the knife 80 against the holding surface 300a of the chuck table 30 by the air cylinder 881a is increased. It is composed of a regulator 881b that can be adjusted to be constant, an air operation valve 881c connected to the regulator 881b, and a speed controller (not shown).

The operation of the holding surface cleaning device 8 when cleaning the holding surface 300a of the chuck table 30 by the holding surface cleaning device 8 shown in FIG. 2 will be described below with reference to FIGS.
First, the chuck table 30 that does not hold the workpiece W shown in FIG. 1 moves in the Y-axis direction to the bottom of the holding surface cleaning device 8. Then, as shown in FIG. 2, the holding surface 300a of the chuck table 30 is positioned below the blade edge 800 of the knife 80 of the holding surface cleaning device 8. In this positioning, for example, the center of the holding surface 300a of the chuck table 30 is located on the cutting edge 800 of the knife 80, and the cutting edge 800 of the knife 80 slightly hangs not only on the holding surface 300a but also on the upper end surface of the frame 301. It is preferable to do so. That is, it is preferable that the cutting edge 800 of the knife 80 is positioned along the radius of the chuck table 30.
Further, for example, the holding surface cleaning device 8 may include X-axis direction moving means 884 for moving the knife 80 in the X-axis direction which is the extending direction thereof. For example, when the holding surface 300a is washed while the knife 80 is reciprocally moved in the X-axis direction by the X-axis direction moving means 884 constituted by an air cylinder, the cutting edge 800 can surely pass through the center of the holding surface 300a. .. Since the grinding dust adheres to the outer peripheral portion of the holding surface 300a, the cutting edge 800 does not have to pass through the center of the holding surface 300a. Further, in FIG. 2, the X-axis direction moving means 884 is connected to the moving means 82, but the connecting position is not limited to this. The X-axis direction moving means 884 may be provided for the same reason as above even when the holding surface cleaning device 8 is provided with the moving means 88 as shown in FIG. 3, and in the rotating portion 880 in FIG. Although connected, the connection position is not limited to this.

Since the holding surface cleaning device 8 according to the present embodiment includes the two-fluid cleaning unit 85, the box 851 is lowered in the −Z direction by the elevating means 852 shown in FIG. 2, and the lower surface of the box 851 and the holding surface 300a are separated. The box 851 is positioned at a height position where a predetermined gap for releasing the two fluids is formed between the boxes.
In this state, the cleaning water is supplied from the water supply source 86 to the two-fluid nozzle 850, the high pressure air is supplied from the air supply source 87 to the two-fluid nozzle 850, and the two fluids are discharged from the ejection port 850a of the two-fluid nozzle 850. It is ejected toward the holding surface 300a. Further, as the chuck table 30 rotates about the axis in the Z-axis direction, the entire holding surface 300a is cleaned by the two fluids, and the fine grinding dust and other adhering matters adhering to the holding surface 300a are washed off. Be done.
The two fluids from which the deposits have been washed off flow into the water case (not shown) through the gap between the box 851 and the holding surface 300a.

After the holding surface 300a is washed with the two fluids or in parallel with the washing, the connecting member 814 is lowered in the −Z direction by the moving means 82 housed in the box 851. The blade edge 800 of the knife 80 projects from the opening 851a of the box 851, and the blade edge 800 of the knife 80 contacts the holding surface 300a. Further, after the blade edge 800 of the knife 80 comes into contact with the holding surface 300a, the knife 80 is further lowered, whereby the elastic member 813 contracts from its natural length, and the urging force accumulated by the elastic member 813 causes the knife 80 to move to the holding surface 300a. It is pressed with a predetermined pressing force in a state of being inclined with respect to it. After that, the knife 80 may be further lowered so that the blade edge 800 of the knife 80 is bent along the holding surface 300a.
In the holding surface cleaning device 8, when the moving member 88 shown in FIG. 3 is connected to the connecting member 814, the gripping portion 81 is rotated by the rotating portion 880 so that the knife 80 faces downward. Further, the air cylinder mechanism 881 of the moving means 88 maintains the cutting edge 800 of the knife 80 pressed against the holding surface 300a with a constant pressing force.

When the knife 80 is pressed against the holding surface 300a, the rotating chuck table 30 causes the holding surface 300a and the knife 80 to move relative to each other in a state in which the knife 80 is inclined so that the blade edge 800 of the knife 80 is ahead in the moving direction. The foreign matter that has moved to a desired position and adheres to the holding surface 300a is cut off by the cutting edge 800 and removed. That is, by adhering the adhering matter adhered to the holding surface 300a to the blade tip 800 of the knife 80 which is fixed in the horizontal plane direction, the adhering matter at the blade tip 800 is removed from the vicinity of its root. Cut off. Then, the cut-off deposits are stacked on the upper surface of the cutting edge 800 of the knife 80 and removed from the holding surface 300a.

The deposits cut off from the holding surface 300a by the knife 80 are piled up on the upper surface of the cutting edge 800 of the knife 80 so as not to reattach, but there are also deposits left on the holding surface 300a after being cut off. In order to prevent the remaining adhered substances from re-adhering to the holding surface 300a, two fluids are sprayed from the two-fluid nozzle 850 to the holding surface 300a, and the two fluids flow from the holding surface 300a. Will be removed.
If the holding surface cleaning device 8 does not include the two-fluid cleaning unit 85, the above-described two-fluid cleaning may not be performed.
Then, after the cleaning of the holding surface 300a is completed, the supply of the two fluids to the two-fluid nozzle 850 is stopped, the elevating means 852 pulls the box 851 upward, and the moving means 82 pulls the knife 80 upward and holds it. It is separated from the surface 300a.

Next, a case will be described in which the workpiece W is suction-held by the cleaned holding surface 300a and the back surface Wb of the workpiece W is ground by the grinding means 7 shown in FIG. The workpiece W is suction-held by the holding surface 300a with the back surface Wb facing upward. Next, the chuck table 30 holding the workpiece W moves in the +Y direction to below the grinding means 7. The grinding means 7 is fed in the −Z direction by the grinding feed means 5, and the grinding wheel 740 that rotates with the rotation of the spindle 70 comes into contact with the back surface Wb of the workpiece W to perform grinding. During the grinding, as the chuck table 30 rotates, the workpiece W held on the holding surface 300a also rotates, so the grinding wheel 740 grinds the entire back surface Wb of the workpiece W. .. Further, the grinding water is supplied to the contact portion between the grinding wheel 740 and the workpiece W, and the contact portion is cooled and washed. On the holding surface 300a of the chuck table 30, since the attached surface is washed and removed by the holding surface cleaning device 8 and the flatness is also a good value, the surface Wa of the workpiece W and the holding surface of the chuck table 30 are large. It is possible to grind the workpiece W to a uniform desired thickness without any foreign matter interposed between the workpiece W and 300a.

As described above, the holding surface cleaning device 8 according to the present invention for cleaning the holding surface 300a of the chuck table 30 has the knife 80 having the linear cutting edge 800 that contacts the holding surface 300a, and the cutting edge 800 on the holding surface 300a. The holding surface 300a is provided by including the gripping portion 81 for gripping the knife 80, and the moving means 82 (or the moving means 88) for bringing the cutting edge 800 into contact with the holding surface 300a or separating from the holding surface 300a. The blade 80 is brought into contact with the blade 80, and the knife 80 is tilted so that the blade 800 precedes in the moving direction, and the holding surface 300a and the knife 80 are moved relatively to each other. It becomes possible to do. For this reason, it becomes possible to prevent deposits such as grinding dust from remaining on the holding surface 300a that holds the workpiece W and to prevent reattachment of grinding dust, and grind the holding surface 300a with a cleaning grindstone. Therefore, the flatness of the holding surface 300a is not lowered. Therefore, it becomes possible to grind the work W to a uniform thickness by sucking and holding the work W with the cleaned holding surface 300a and performing grinding.

Further, the holding surface cleaning device 8 according to the present invention includes a two-fluid cleaning unit 85 for injecting a mixed liquid of water and air onto the holding surface 300a of the chuck table 30. A two-fluid nozzle 850 that ejects a mixed liquid with air onto the holding surface 300a, a box 851 that accommodates the two-fluid nozzle 850 and has a lower surface facing the holding surface 300a, and a box 851 that is perpendicular to the holding surface 300a. And a moving means 82 disposed in a box 851, so that the cutting edge 800 can be projected from the opening 851a of the box 851 or the cutting edge 800 can be stored in the box 851, The cutting edge 800 cuts off and removes the adhered matter that adheres to the holding surface 300a, thereby leaving the adhered matter such as grinding debris on the holding surface 300a that holds the workpiece W by cleaning with two fluids, and re-adhering the grinding debris. It is possible to prevent the two fluids that have cleaned the deposits by the box 851 from scattering over a wide area, and the holding surface 300a is not ground with a cleaning grindstone so that the holding surface 300a is flat. It will not be reduced. Therefore, the workpiece W can be ground to a more uniform thickness by sucking and holding the workpiece W on the cleaned holding surface 300a and performing grinding.

It is needless to say that the holding surface cleaning device 8 according to the present invention is not limited to the above embodiment and may be implemented in various different forms within the scope of its technical idea. Further, the configuration and the like of the grinding device 1 shown in the accompanying drawings are not limited to this, and can be appropriately changed within the range where the effects of the present invention can be exhibited.

For example, when the holding surface 300a of the chuck table 30 is not an extremely gentle conical surface having the center of rotation as an apex but a flat surface that is flush with the chuck table 30, the chuck table 30 shown in FIG. 1 is moved in the Y-axis direction. Even if the knife 80 extending in the X-axis direction is brought into contact with the holding surface 300a and the blade edge 800 is brought into contact with the holding surface 300a and the knife 80 is inclined so that the blade edge 800 precedes in the moving direction, the attached matter on the holding surface 300a is cut off. Good.

W: Workpiece 1: Grinding device 10: Base 11: Column 30: Chuck table 300: Adsorption part 300a: Holding surface 301: Frame 39: Cover 39a: Bellows cover 5: Grinding feeding means 50: Ball screw 52: Motor 7 : Grinding means 70: Spindle 72: Motor 74: Grinding wheel 740: Grinding grindstone 8: Holding surface cleaning device 80: Knife 800: Blade edge
81: Grasping part 810: Support member 810a: Insertion hole 810b: Bolt insertion hole 810c: Fixing bolt 813: Elastic member 814: Connecting member 82: Moving means 85:2 Fluid cleaning unit 850: Two fluid nozzle 850a: Jet port 851 : Box 851a: Box opening 852: Lifting means 86: Water supply source 87: Air supply source 88: Moving means 880: Rotating part 881: Air cylinder mechanism 881a: Air cylinder 881b: Regulator

Claims (2)

A holding surface cleaning device for cleaning a holding surface of a chuck table for holding a workpiece, comprising:
A knife having a linear cutting edge to be brought into contact with the holding surface,
A grip portion for gripping the knife with the cutting edge facing the holding surface,
A moving means for bringing the blade edge into contact with the holding surface or separating from the holding surface,
The blade tip is brought into contact with the holding surface, the knife is tilted so that the blade tip is ahead in the moving direction, and the holding surface and the knife are moved relatively to each other, and the deposit attached to the holding surface is removed. A holding surface cleaning device that cuts and removes with. A two-fluid cleaning unit for injecting a mixed liquid of water and air onto the holding surface,
The two-fluid cleaning unit includes a two-fluid nozzle for injecting a mixed liquid of water and air onto the holding surface, a box for accommodating the two-fluid nozzle and having an open lower surface facing the holding surface, and the box. Elevating means for moving up and down in a direction perpendicular to the holding surface,
The moving means is arranged in the box, the blade tip can be projected from the opening of the box or the blade tip can be stored in the box, and the blade tip projected from the opening adheres to the holding surface. The holding surface cleaning device according to claim 1, wherein the attached matter is cut off and removed.

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