CN109817532B

CN109817532B - Processing equipment for chip

Info

Publication number: CN109817532B
Application number: CN201910243005.XA
Authority: CN
Inventors: 吴志湘
Original assignee: Huizhou Xiwensi Technology Co Ltd
Current assignee: Huizhou Xiwensi Technology Co Ltd
Priority date: 2019-03-28
Filing date: 2019-03-28
Publication date: 2020-12-15
Anticipated expiration: 2039-03-28
Also published as: CN109817532A

Abstract

The invention relates to a processing device for a chip, which comprises a mechanical hand mechanism, a conveying mechanism, a pushing mechanism, a silicone grease mechanism and a placing mechanism. The manipulator mechanism comprises a frame beam, a transverse driving piece, a connecting plate, a longitudinal driving piece and a clamping piece. The transverse driving part is in driving connection with the longitudinal driving part through the connecting plate, and the longitudinal driving part is in driving connection with the clamping part. The conveying mechanism comprises a conveying track and a vibration motor, the vibration motor is arranged at the bottom of the conveying track, and the conveying track is obliquely arranged. The pushing mechanism comprises a working groove, a push rod and a push rod driving piece, and the push rod driving piece is in driving connection with the push rod. The silicone grease mechanism comprises a silicone grease groove and a belt transmission component; the belt transmission assembly comprises a flexible belt, a driving wheel, a driven wheel and a main wheel driving piece, the driving wheel is in driving connection with the driven wheel through the flexible belt, and the main wheel driving piece is in driving connection with the driving wheel. The process of smearing the silicone grease on the chip and pasting the chip and the radiating fin is finished by the processing equipment for the chip, the processing speed is high, and the qualification rate is high.

Description

Processing equipment for chip

Technical Field

The invention relates to the technical field of chip processing, in particular to a processing device for chips.

Background

Various chips are integrated in the printed circuit board, and the chips are core parts for realizing the functions of the printed circuit board. With the progress of electronic technology, the power of the chip is larger and larger, so that the heat productivity of the chip is greatly increased. Too high an operating temperature of the chip may cause the chip to burn out. The chip is adhered to the radiating fin through the silicone grease, which is a main mode for solving the radiating problem of the chip, and the radiating fin is used for improving the heat transfer speed of the chip, so that the working temperature of the chip is reduced. So, effectively solved the heat dissipation problem of chip.

In order to make the heat sink fully perform its heat dissipation function, silicone grease needs to be applied between the chip and the heat sink. However, the conventional work of applying silicone grease between the chip and the heat sink is still done manually. The manual operation causes problems in several respects: first, labor costs are high. Secondly, the qualification rate of smearing the silicone grease between the chip and the radiating fin cannot be guaranteed by manual operation. In addition, the efficiency of smearing the silicone grease between the chip and the radiating fin by manual operation is low, and the production efficiency of chip processing is seriously influenced.

Disclosure of Invention

Based on this, it is necessary to provide a processing apparatus for chips.

A processing apparatus for a chip comprising: manipulator mechanism, transport mechanism, pushing mechanism, silicone grease mechanism, placement mechanism.

The manipulator mechanism comprises a frame beam, a transverse driving piece, a connecting plate, a longitudinal driving piece and a clamping piece. The frame roof beam with the transverse driving spare is connected, the transverse driving spare pass through the connecting plate with longitudinal driving spare drive connection, longitudinal driving spare with the holder drive connection.

The conveying mechanism comprises a conveying track and a vibrating motor. The shock motor set up in the transfer orbit is kept away from the bottom of pushing mechanism one end, the transfer orbit is the slope setting, the transfer orbit is kept away from pushing mechanism's one end is higher than the transfer orbit is close to pushing mechanism's one end.

The pushing mechanism comprises a working groove, a push rod and a push rod driving piece. The working groove is a cuboid, the push rod driving piece is arranged at the short edge groove wall of the working groove and is in driving connection with the push rod, and the push rod is close to or far away from the short edge groove wall on the other side of the working groove. The long edge groove wall of the working groove close to the push rod is provided with an input opening, and the output end of the conveying track is connected to the input opening of the working groove.

The silicone grease mechanism comprises a silicone grease groove and a belt transmission assembly. The belt transmission assembly comprises a flexible belt, a driving wheel, a driven wheel and a main wheel driving piece, the driving wheel is connected with the driven wheel in a driving mode through the flexible belt, the main wheel driving piece is connected with the driving wheel in a driving mode, and the main wheel driving piece is connected with the silicone grease groove.

The placing mechanism comprises a placing groove.

In one embodiment, the silicone grease mechanism further comprises a silicone grease partition plate, the silicone grease partition plate is connected to the notch of the silicone grease groove, a strip-shaped hole is formed in the silicone grease partition plate, and the flexible belt part is exposed out of the strip-shaped hole.

In one embodiment, the silicone grease partition board is uniformly provided with a plurality of backflow holes.

In one embodiment, the primary wheel drive is a drive motor.

In one embodiment, the outer side surface of the flexible belt is uniformly provided with strip-shaped grains.

In one embodiment, the push rod is provided with a protective layer at a part far away from the push rod driving part.

In one embodiment, the clamping member is a clamping cylinder provided with a pair of clamping arms.

In one embodiment, the opposite surfaces of the pair of clamping arms are provided with buffer layers.

In one embodiment, the working groove is provided with output openings on two side walls far away from the push rod.

In one embodiment, the push rod driver is a drive cylinder.

In the working process of the processing equipment for the chips, the chips are contained in the conveying track in the conveying mechanism, and the chips are conveyed to the working groove at the input opening under the vibration action of the vibration motor. The vibration frequency of the vibration motor is matched with the pushing frequency of the push rod. The chip at the input opening of the working groove is pushed by the push rod, so that the chip is pushed to the groove wall of the short side at the other side from the output opening of the working groove. At the moment, the transverse driving piece in the mechanical arm mechanism can drive the connecting plate to the position above the chip, the longitudinal driving piece connected with the connecting plate drives the clamping piece to be close to the chip, and the clamping piece can clamp the chip. Then, the longitudinal driving member drives the clamping member to retract, and the transverse driving member drives the chip clamped by the clamping member to be close to the silicone grease mechanism. The silicone grease groove of the silicone grease mechanism stores a certain amount of silicone grease, the amount of the silicone grease at least can submerge the outer side face of the flexible belt close to the groove bottom of the silicone grease groove, the main wheel driving part drives the driving wheel to rotate, and the outer side face of the flexible belt is attached with the silicone grease. The longitudinal driving piece drives the chip to be close to the part of the flexible belt exposed out of the strip-shaped hole until the chip is contacted with the part of the flexible belt exposed out of the strip-shaped hole, and when the chip is contacted with the part of the flexible belt exposed out of the strip-shaped hole, the chip is stained with the silicone attached to the outer side face of the flexible belt. At the moment, the longitudinal driving piece drives the chip to be far away from the flexible belt, the transverse driving piece drives the chip to be close to the placing groove, and the chip is close to the placing groove under the driving of the longitudinal driving piece. The radiating fin is placed to the standing groove, and after the chip attached with the silicone grease is pasted with the radiating fin, the clamping piece does not clamp the chip any more. After the chip stained with the silicone grease is driven by the mechanical hand mechanism to be adhered to the radiating fin, the mechanical hand mechanism finishes a procedure of smearing the silicone grease on the chip and adhering the silicone grease on the radiating fin, and the mechanical hand mechanism can repeat the procedure to finish the processing operation of the subsequent chip to be processed. The process that the chip is smeared with the silicone grease and is pasted with the radiating fin is finished by the processing equipment for the chip, manual operation is not needed, the qualification rate that the chip is smeared with the silicone grease and is pasted with the radiating fin is high, and the processing equipment for the chip greatly improves the production efficiency of processing the chip by enterprises.

Drawings

FIG. 1 is a schematic diagram of the structure of a processing apparatus for chips in one embodiment;

FIG. 2 is an enlarged schematic view of a portion of the processing apparatus M for chips in the embodiment of FIG. 1;

FIG. 3 is an enlarged schematic view of a portion of the processing apparatus N for chips in the embodiment of FIG. 1;

FIG. 4 is another schematic structural view of a processing apparatus for chips in one embodiment;

fig. 5 is an enlarged schematic view of a portion of the processing apparatus P for chips in the embodiment of fig. 4.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 to 5, in one embodiment, a processing apparatus 10 for a chip includes a robot mechanism 100, a transferring mechanism 200, a pushing mechanism 300, a silicone grease mechanism 400, a placing mechanism 500, a feeding mechanism 600, a processing mechanism 700, a frame 800, and a conveying mechanism 900. The feeding mechanism 600 is used for storing chips to be processed and providing the chips to be processed by the processing mechanism 700, the processing mechanism 700 is used for shearing, bending and other processing treatments on the chips to be processed, and the frame body 800 is used for supporting the feeding mechanism 600 and the processing mechanism 700. The conveying mechanism 200 is used for conveying the chips in the feeding mechanism 600 to the pushing mechanism 300, the pushing mechanism 300 performs a switching function on the chips from the conveying mechanism 200 to the silicone grease mechanism 400, the silicone grease mechanism 400 supplies silicone grease for the adhesion of the chips, and the placing mechanism 500 bears the heat sink. In this embodiment, the number of the manipulator mechanisms 100 is two, one of the manipulator mechanisms 100 is used for driving the chip to be attached to the heat sink, and the other manipulator mechanism 100 clamps the heat sink attached with the chip from the placing mechanism 500 to the conveying mechanism 900. The transport mechanism 900 is used to transport the heat sink with the chip attached thereto away from the processing apparatus 10 for chips.

Specifically, the processing mechanism 700 includes a processing assembly and a clamping assembly. The transfer mechanism 200 also includes a feed track 230. The processing assembly includes a first driving member 711, a second driving member 712, a first mold 713, and a second mold 714. The first driving member 711 and the second driving member 712 are respectively connected to the frame body 800, the first driving member 711 is in driving connection with the first mold 713, and the second driving member 712 is in driving connection with the second mold 714. The first mold 713 and the second mold 714 move closer to or away from the feeding rail 230, respectively, the first mold 713 moves closer to or away from the second mold 714, and the second mold 714 moves closer to or away from the first mold 713. The clamping assembly includes a third drive member 721 and a first clamping block 722. The third driving member 721 is connected to the frame body 800, the third driving member 721 is connected to the first clamping block 722 in a driving manner, and the first clamping block 722 moves close to or away from the feeding track 230. A lead opening (not shown) is formed on a surface of the feeding rail 230 facing the frame body 800, and only the lead of the chip to be processed is exposed through the lead opening. The pins of the chip to be processed are cut and bent under the extrusion of the first mold 230 and the second mold 240. In this embodiment, the first mold 713 is provided with an extrusion head 715 and a cutting blade 716, and the second mold 714 is provided with an extrusion groove 717 and a cutting blade groove (not shown). The pins of the chip are bent under the extrusion of the extrusion head 715 and the second die 714 at the extrusion groove 717, and the pins of the chip are cut under the extrusion of the cutting blade 716 and the second die 714 at the cutting groove. A first clamping hole (not shown) is formed on one side of the feeding rail 230 facing the first clamping block 722. The chip to be processed is held in place in the feeding track 230 by the clamping action of the first clamping block 722 to match the operation of the processing assembly. The feeding rail 230 is adjacent to the first mold 713 and the second mold 714 at a portion of the first clamping hole. The processing component and the clamping component act on the same chip to be processed, the processing component processes the pin of the chip to be processed, and the clamping component acts on the body of the chip to be processed so that the chip to be processed is kept stationary in the feeding track 230. The output end of the feeding rail 230 communicates with the input end of the transfer rail 210. The feeding mechanism 600 includes a feeding clamp 610, an output end of the feeding clamp 610 is communicated with an input end of the feeding rail 230, and the chip to be processed is stored in the feeding clamp 610.

The robot mechanism 100 includes a frame beam 110, a transverse driving member (not shown), a connecting plate 120, a longitudinal driving member 130, and a clamping member 140. The frame beam 110 is connected to the transverse driving member, the transverse driving member is in driving connection with the longitudinal driving member 130 through the connecting plate 120, and the longitudinal driving member 130 is in driving connection with the clamping member 140. The transverse driving member drives the connecting plate 120 to move transversely, the longitudinal driving member 130 drives the clamping member 140 to move longitudinally, and the clamping member 140 is used for clamping the chip.

The transfer mechanism 200 includes a transfer rail 210 and a vibration motor 220. The vibration motor 220 is disposed at the bottom of the end of the conveying track 210 far away from the pushing mechanism 300. The conveying track 210 is disposed in an inclined manner, and specifically, an end of the conveying track 210 away from the pushing mechanism 300 is higher than an end of the conveying track 210 close to the pushing mechanism 300. It should be noted that the chip is accommodated in the conveying track 210, a certain friction exists between the chip and the conveying track 210, and the chip is not easy to slide from one end of the conveying track 210 to the other end when the vibration motor 220 is not started. Under the vibration action of the vibration motor 220, the chip will gradually move towards the pushing mechanism 300.

The pushing mechanism 300 includes a working slot 310, a push rod 320, and a push rod driver (not shown). Work groove 310 is the cuboid, the push rod driving piece set up in work groove 310's minor face cell wall department, the push rod driving piece with push rod 320 drive connection, push rod 320 is close to or keeps away from work groove 310 opposite side minor face cell wall motion. An input opening 311 is formed on a long-side groove wall of the working groove 310 close to the push rod 320, and an output end of the conveying track 210 is connected to the input opening 311 of the working groove 310. The vibration frequency of the vibration motor 220 is adapted to the pushing frequency of the push rod 320, that is, each time the conveying track 210 conveys one chip to the working slot 310, the push rod 320 pushes one chip. The chip in the working slot 310 at the input opening 311 is pushed by the push rod 320, so that the chip is moved from the working slot 310 at the output opening to the short-edge slot wall at the other side, so that the manipulator mechanism 100 can clamp the chip.

The silicone grease mechanism 400 includes a silicone grease groove 410 and a belt drive assembly. The belt transmission assembly comprises a flexible belt 421, a driving wheel (not shown), a driven wheel (not shown) and a main wheel driving member (not shown), wherein the driving wheel is in driving connection with the driven wheel through the flexible belt 421, the main wheel driving member is in driving connection with the driving wheel, and the main wheel driving member is connected with the silicone grease groove 410. The placement mechanism 500 includes a placement slot 510. The silicone grease groove 410 of the silicone grease mechanism 400 stores a certain amount of silicone grease, and the amount of silicone grease at least should be capable of flooding the outer side surface of the flexible belt 421 near the groove bottom portion of the silicone grease groove 410, so that when the main wheel driving member drives the driving wheel to rotate, the outer side surface of the flexible belt 421 is attached with the silicone grease.

The number of the manipulator mechanisms 100 is two, and the other manipulator mechanism 100 is disposed at the other side of the placing mechanism 500. The placing mechanism 500 further comprises a seat pile (not shown), a rotary driving member (not shown), a rotary disk 520 and a plurality of placing grooves 510, wherein the seat pile is connected with the rotary driving member, the rotary driving member is connected with the rotary disk 520 in a driving manner, and the rotary driving member is used for driving the rotary disk 520 to rotate. The plurality of placing grooves 510 are connected with the rotary disk 520 around the center of the rotary disk 520. The plurality of placing grooves 510 are used for receiving heat dissipation fins. In this embodiment, the rotary driving member is a driving motor. The operation frequency of the rotary driving member is matched with the operation schedule of the two manipulator mechanisms 100, so that the positions of the plurality of placing grooves 510 in the rotary disk 520 can correspond to the two manipulator mechanisms 100 one by one. With the rotation of the rotary disk 520, one of the robot mechanisms 100 completes the work of attaching the chip to the heat sink in the placement groove 510, and the other robot mechanism 100 drives the heat sink attached with the chip to leave the placement mechanism 500.

The processing equipment 10 for the chip further comprises a conveying mechanism 900, wherein the conveying mechanism 900 is a belt conveyor, the belt conveyor comprises a conveying belt 911, a driving roller (not shown), a driven roller (not shown) and a roller driving motor (not shown), the driving roller is in driving connection with the driven roller through the conveying belt 911, and the roller driving motor is in driving connection with the driving roller. The transfer mechanism 900 is disposed near the other robot mechanism 100, the other robot mechanism 100 drives the heat sink with the chip attached thereto to the conveyor 911, and the transfer mechanism 900 carries the heat sink with the chip attached thereto away from the processing apparatus 10 for the chip.

In the working process of the processing apparatus 10 for chips, the chips to be processed are stored in the feeding clamp 610 of the feeding mechanism 600. Under the action of gravity, the chips in the feeding clip 610 slide down into the feeding track 230. The chip to be processed is partially accommodated in the feeding rail 230, the pins of the chip to be processed are exposed through the pin openings, and the chip in the feeding rail 230 continuously slides down under the action of gravity until the feeding rail 230 is located at the first clamping hole. The first clamping block 722 is driven by the third driving member 721 to penetrate through the first clamping hole formed in the feeding rail 230 to abut against a chip to be processed in the feeding rail 230, one side surface of the chip to be processed is pressed by the first clamping block 722, the other side surface of the chip to be processed is urged by the first clamping block 722 to abut against the feeding rail 230, and the chip to be processed is kept stationary at the first clamping hole of the feeding rail 230. At this time, the first mold 713 is driven by the first driving member 711 to be close to the leads of the chip to be processed, and the second mold 714 is driven by the second driving member 712 to be close to the leads of the chip to be processed. And the pins of the chip to be processed are extruded by the first die 713 and the second die 714 to complete the cutting and bending operation of the pins of the chip. A user can replace the first mold 713 and the second mold 714 according to a specific structure of a chip to be processed and a requirement of the user, so that the processing operations such as cutting and bending can be independently completed on one chip, or the processing operations such as cutting and bending can be simultaneously completed on a plurality of chips. After the first die 713 and the second die 714 extrude and process the pins of the chip to be processed, the first die 713 is driven by the first driving member 711 to be away from the processed chip in the feeding track 230, and the second die 714 is driven by the second driving member 712 to be away from the feeding track 230 and the processed chip. At this time, the first clamping block 722 is driven by the third driving member 721 to be separated from the processed chip. All chips in the feeding rail 230 slide downwards under the action of gravity, the processed chips slide downwards to leave the part of the feeding rail 230 where the first clamping holes are located, and the chips to be processed above the processed chips slide downwards to the part of the feeding rail 230 where the first clamping holes are located. At this time, the first clamping block 722 passes through the first clamping hole again to abut against the chip to be processed in the feeding rail 230 under the driving of the third driving member 721. In this way, the processing apparatus 10 for chips completes a complete process for processing one chip, and the processing apparatus 10 for chips repeats this process to complete the processing operation for all chips in the feed collet 610.

In the feeding track 230, the chips with processed pins slide down to the conveying track 210, and the chips in the conveying track 210 are conveyed to the working slot 310 at the input opening 311 under the vibration action of the vibration motor 220. The vibration frequency of the vibration motor 220 is adapted to the pushing frequency of the push rod 320. The chip in the working slot 310 at the input opening 311 is pushed by the push rod 320, so that the chip is pushed from the working slot 310 at the output opening to the short side slot wall on the other side. At this time, the transverse driving member in the robot mechanism 100 drives the connecting plate 120 to the top of the chip, and the longitudinal driving member 130 connected to the connecting plate 120 drives the clamping member 140 to approach the chip, so that the chip is clamped by the clamping member 140. Next, the longitudinal driving member 130 drives the holding member 140 to retract, and the transverse driving member drives the chip held by the holding member 140 to approach the silicone grease mechanism 400. The silicone grease groove 410 of the silicone grease mechanism 400 stores a certain amount of silicone grease, the amount of silicone grease at least can submerge the outer side surface of the flexible belt 421 close to the groove bottom of the silicone grease groove 410, the main wheel driving part drives the driving wheel to rotate, and the silicone grease is attached to the outer side surface of the flexible belt 421. The longitudinal driving member 130 drives the chip to approach the portion of the flexible strip 421 exposed out of the strip-shaped hole until the chip contacts the portion of the flexible strip 421 exposed out of the strip-shaped hole, and when the chip contacts the portion of the flexible strip 421 exposed out of the strip-shaped hole, the chip is stained with silicone attached to the outer side surface of the flexible strip 421. At this time, the longitudinal driving member 130 drives the chip to be away from the flexible strip 421, the transverse driving member drives the chip to be close to the placing slot 510, and the chip is close to the placing slot 510 under the driving of the longitudinal driving member 130. The placement groove 510 is placed with a heat sink, and after the chip attached with silicone grease is adhered to the heat sink, the clamping member 140 will not clamp the chip. After the manipulator mechanism 100 drives the chip stained with silicone grease to be adhered to the heat sink, the manipulator mechanism 100 completes a procedure of smearing the silicone grease on the chip and adhering the chip to the heat sink, and the manipulator mechanism 100 repeats the procedure to complete subsequent chip adhering operations. The placement grooves 510 receive heat dissipation fins, and with the rotation of the rotary disk 520, one of the manipulator mechanisms 100 completes the work of adhering the chip to the heat dissipation fins in the placement grooves 510, the other manipulator mechanism 100 drives the heat dissipation fins with the chip adhered thereon to move from the placement mechanism 500 to the conveying mechanism 900, and the conveying mechanism 900 bears the heat dissipation fins with the chip adhered thereon and leaves the processing equipment 10 for the chip. The process that the chip is smeared with the silicone grease and is pasted with the radiating fin is finished by the processing equipment 10 for the chip, manual operation is not needed, the qualification rate that the chip is smeared with the silicone grease and is pasted with the radiating fin is high, and the processing equipment 10 for the chip greatly improves the production efficiency of processing the chip by enterprises.

In the working process of the processing equipment 10 for chips, if external impurities enter the silicone grease groove 410, the silicone grease stored in the silicone grease groove 410 is polluted, and the adhesion of the chips and the radiating fins is further affected. Secondly, when the belt conveying assembly is in operation, the flexible belt 421 rotates at a high speed, and external impurities enter the silicone grease groove 410 to damage the belt conveying assembly. In order to prevent the silicone grease in the silicone grease groove 410 from being contaminated by foreign objects, referring to fig. 2, in one embodiment, the silicone grease mechanism 400 further includes a silicone grease baffle 430, the silicone grease baffle 430 is connected to a notch of the silicone grease groove 410, the silicone grease baffle 430 is provided with a strip-shaped hole (not shown), and the flexible strip 421 is partially exposed out of the strip-shaped hole. The silicone grease baffle 430 can effectively prevent fingers of workers from entering the silicone grease groove 410 by mistake, on one hand, the personal safety of the workers is guaranteed, and on the other hand, the silicone grease in the silicone grease groove 410 is prevented from being polluted. Thus, the silicone grease partition 430 can effectively prevent external impurities from polluting the silicone grease in the silicone grease groove 410, and the safety and stability of the operation of the silicone grease mechanism 400 are improved.

In order to recover the silicone grease dripping from the bottom of the chip, referring to fig. 2, in one embodiment, the silicone grease baffle 430 is uniformly provided with a plurality of reflow holes 431. After the chip is dipped with the silicone grease attached to the flexible tape 421, the manipulator mechanism 100 drives the chip away from the silicone grease mechanism 400, and the silicone grease attached to the bottom of the chip may drip. The dropped silicone grease flows into the silicone grease groove 410 again through the plurality of reflow holes 431 formed in the silicone grease separation plate 430, so that the silicone grease groove 410 can recover the dropped silicone grease. Thus, the backflow hole 431 formed in the silicone grease partition plate 430 is beneficial to the silicone grease groove 410 to recover silicone grease dripped from the bottom of the chip, so that the waste of the silicone grease is avoided, and the production cost of the chip processing equipment 10 is reduced.

To drive the rotation of the flexible strip 421, in one embodiment, the primary wheel drive member is a drive motor. Further, in the present embodiment, the driving motor is a stepping motor. The stepping motor is simple to control, has large torque when rotating at low speed, and is suitable for driving the driving wheel so as to drive the flexible belt 421 to operate. So, the driving wheel driving piece is convenient for drive for driving motor the flexible strip 421 rotates, and convenience of customers is right the driving wheel driving piece controls.

If the amount of silicone grease attached to the flexible tape 421 is not enough, the chip will be stained with only a very small amount of silicone grease when contacting the flexible tape 421, and the sticking effect between the chip and the heat sink will be affected. In order to enable the bottom of the chip to be attached to sufficient silicone grease, in one embodiment, the outer side of the flexible strip 421 is uniformly provided with stripes. In this embodiment, the stripes are staggered. In another embodiment, the stripes are spaced apart in parallel. In the rotation process of the flexible strip 421, the strip-shaped lines arranged on the flexible strip 421 are beneficial to the flexible strip 421 to pick up the silicone grease in the working groove 310. Therefore, the bar-shaped lines uniformly arranged on the outer side surface of the flexible belt 421 increase the amount of the silicone attached to the bottom of the chip, and the good pasting effect of the chip and the radiating fin is guaranteed.

In order to effectively protect the chip during the pushing process of the push rod 320, in one embodiment, a protective layer is disposed on a portion of the push rod 320 away from the push rod driving member. Further, in this embodiment, the protective layer is made of elastic rubber. In another embodiment, the protective layer is a soft plastic. In yet another embodiment, the protective layer is a sponge. In the pushing process, the chip is easily damaged by the push rod 320 due to the fragile structure of the chip, and the protective layer plays a role in buffering protection. Therefore, the chip is prevented from being damaged in the pushing process, and the protective layer plays a role in protecting the chip.

To facilitate the chip clamping by the user, referring to fig. 2, in one embodiment, the clamping member 140 is a clamping cylinder, and the clamping cylinder is provided with a pair of clamping arms 141. The clamping cylinder is also called a pneumatic finger or a finger cylinder and can be divided into a Y-shaped clamping finger and a flat clamping finger according to the style. The clamping cylinder is prior art and the principle thereof is not described herein. In this embodiment, the clamping cylinder is of the type MHZL 2-10D. In the clamping process of the clamping member 140, the clamping cylinder is clamped at two sides of the chip by a pair of clamping walls. The clamping cylinder is easy to control, the working stability is high, and the chip can be prevented from falling off in the clamping process. Thus, a user can conveniently clamp the chip, and the working stability of the processing equipment 10 for the chip is improved.

In order to protect the chip during the clamping process, in one embodiment, the opposite surfaces of the pair of clamping arms 141 are provided with buffer layers. Further, in this embodiment, the cushion layer is an elastic rubber. In another embodiment, the cushioning layer is a soft plastic. In yet another embodiment, the cushioning layer is a sponge. In the clamping process, the chip is easily damaged by the pair of clamping arms 141 due to the fragile structure of the chip, and the buffer layer plays a role in buffer protection. Therefore, the chip is prevented from being damaged in the clamping process, and the buffer layer plays a role in protecting the chip.

In order to facilitate the clamping of the chip by the clamping member 140 to leave the working slot 310, referring to fig. 2, in one embodiment, the working slot 310 is provided with output openings 312 on two side walls away from the push rod 320. The opening of the output opening 312 provides an operation space for the pair of holding arms 141, and the pair of holding arms 141 can pass through the working slot 310 at the output opening 312 to hold the chip in the working slot 310. Thus, the opening of the output opening 312 facilitates the chip being held by the holding member 140 to leave the working groove 310, and the efficiency of holding the chip by the holding member 140 is improved.

To facilitate user actuation of the push rod 320, in one embodiment, the push rod driver is a drive cylinder. Further, in the present embodiment, the driving cylinder is a single-acting cylinder. In another embodiment, the drive cylinder is an impact cylinder. The driving cylinder is prior art, and the principle thereof is not described in detail herein. The driving cylinder has simple structure and is easy to control. The user drives the push rod driving member to control the movement of the push rod 320, so that the push rod 320 pushes the chip. Therefore, the user can control the movement of the push rod 320 conveniently, and the user can adjust the frequency of the push rod 320 for pushing the chip conveniently.

In order to enable the feeding mechanism 600 to continuously supply the feeding track 230 with the chips to be processed, referring to fig. 4, in one embodiment, the feeding mechanism 600 further includes a base 620, a rotary driving member (not shown), and a rotating disc 630. The rotary driving member is connected to a central portion of the base 620, and the rotary driving member is drivingly connected to the rotary plate 630. The base 620 has a feeding hole (not shown), the rotating plate 630 has a plurality of receiving holes 631 surrounding the center of the circle, and the receiving holes 631 are respectively matched with the feeding hole. The plurality of feeding clips 610 are provided, a corresponding portion of each feeding clip 610 is inserted into the receiving hole 631 and connected to the rotating disc 630, and a portion of the feeding rail 230 is inserted into the feeding hole and connected to the base 620. When all the chips in the feeding clamp 610 connected to the feeding rail 230 are processed, the rotary driving member is activated. In this embodiment, the rotary drive is a drive motor. In another embodiment, the rotary drive is a rotary cylinder. The rotary driving member drives the rotary plate 630 to rotate, so that the empty feeding clamp 610 leaves, and another feeding clamp 610 loaded with chips to be processed approaches the base 620 at the feeding hole, so as to communicate with the feeding track 230, and continuously provide the chips to be processed to the feeding track 230. In this way, the feeding mechanism 600 can continuously supply the chips to be processed to the feeding rail 230, thereby improving the working efficiency of the processing apparatus 10 for chips.

In order to further stabilize the connection relationship between the feeding clips 610 and the rotating disc 630, referring to fig. 4, in one embodiment, the feeding mechanism 600 further includes a limiting disc 640, a main shaft is disposed at the center of the rotating disc 630, the main shaft is connected to the center of the limiting disc 640, a plurality of limiting openings 641 corresponding to the receiving holes 631 one by one are formed around the center of the limiting disc 640, and the feeding clips 610 are partially received in the limiting openings 641 and are clamped to the limiting disc 640. In the process of rotating the rotating disc 630, the limiting disc 640 rotates synchronously with the rotating disc 630 through the main shaft. The plurality of feeding clips 610 are clamped in the plurality of limiting openings 641 of the limiting disc 640, and when the rotating disc 630 rotates, the limiting disc 640 provides a supporting function for the plurality of feeding clips 610. Therefore, the situation that the feeding clamp 610 inclines or even inclines is avoided, the connection relation between the feeding clamp 610 and the rotating disk 630 is further stabilized, and the working stability of the processing equipment 10 for chips is improved.

In order to improve the durability of the feeding rail 230, referring to fig. 3, in one embodiment, the clamping assembly further includes a fourth driving member 723 and a second clamping block 724, and a second clamping hole (not shown) is formed in the other side surface of the feeding rail 230, which is opposite to the side surface where the first clamping hole is located. The fourth driving member 723 is connected to the frame body 800, the fourth driving member 723 is connected to the second clamping block 724 in a driving manner, and the second clamping block 724 moves close to or away from the feeding rail 230 at the portion where the second clamping hole is located. When the first clamping block 722 passes through the first clamping hole to be close to the chip to be processed in the feeding track 230, the second clamping block 724 is driven by the fourth driving part 723, the second clamping block 724 and the first clamping block 722 are simultaneously close to the chip to be processed in the feeding track 230, and the chip to be processed is kept still under the co-extrusion of the first clamping block 722 and the second clamping block 724. In the process of clamping the chip to be processed, when the first clamping block 722 presses the chip to be processed, the feeding rail 230 does not need to provide a reaction force to the chip to be processed. In this way, the feeding rail 230 is prevented from being damaged during the clamping process, so that the feeding rail 230 is protected, and the durability of the feeding rail 230 is improved.

In order to facilitate a user to observe a processing process of a chip to be processed and to obtain a real-time dynamic condition of chip processing, in one embodiment, the feeding track 230 is made of a transparent material. Further, in this embodiment, the transparent material is transparent plastic. In another embodiment, the transparent material is organic glass. The user can clearly observe the whole processing process of the chip to be processed through the feeding track 230 made of transparent material, and obtain the dynamic information of the chip to be processed in real time. Thus, the feeding rail 230 is made of a transparent material, so that a user can conveniently obtain real-time dynamic conditions of chip processing, and can conveniently and timely adjust the processing equipment 10 for chips according to the processing process.

In order to recover the waste leads cut off during the processing of the chip to be processed, referring to fig. 4, in one embodiment, the processing mechanism 700 further includes a collecting tank 730. The collection trough 730 is placed in a vertically downward orientation with the first mold 713 and the second mold 714 proximate the feed track 230, with the slot of the collection trough 730 facing the first mold 713 and the second mold 714. After the chip to be processed is processed by the processing mechanism 700, redundant pins of the chip are cut, and the cut waste pins fall into the collecting tank 730 under the action of gravity. The collecting groove 730 plays a role in recovering the pins of the dropped chip, and the influence of the sheared waste pins on the normal operation of the processing equipment 10 for the chip is avoided. Thus, the collecting groove 730 recovers the sheared waste pins, and the normal operation of the chip processing equipment 10 is guaranteed.

To facilitate the user to actuate the first mold 713, referring to fig. 3, in one embodiment, the first actuating member 711 is an actuating cylinder. The driving cylinder is prior art, and the principle thereof is not described in detail herein. The first mold 713 is driven by a driving cylinder to approach the pins of the chip to be processed, and a user controls the driving cylinder to drive the first mold 713 to move. Further, in another embodiment, the second driving member 712, the third driving member 721 and the fourth driving member 723 are all driving cylinders, and a user controls the movement of the second mold 714, the first clamping block 722 and the second clamping block 724 through each driving cylinder. This facilitates user actuation of the first mold 713, the second mold 714, the first clamp block 722, and the second clamp block 724.

To control the movement of the first mold 713, in one embodiment, the first drive 711 is a lead screw stepper motor. The screw rod stepping motor is the prior art, and the principle of the screw rod stepping motor is not described in detail herein. The first mold 713 is driven by a lead screw stepping motor to approach the leads of the chip to be processed, and a user controls the lead screw stepping motor to drive the first mold 713 to move. Further, in another embodiment, the second driving element 712, the third driving element 721 and the fourth driving element 723 are lead screw stepping motors, and a user controls the movement of the second mold 714, the first clamping block 722 and the second clamping block 724 through each lead screw stepping motor. This facilitates user control of the movement of the first mold 713, the second mold 714, the first clamp block 722, and the second clamp block 724.

In order to facilitate the other clamping member 140 of the robot mechanism 100 to take out the heat sink with the chip attached thereon from the placing slot 510, referring to fig. 2, in one embodiment, two side walls of the placing slot 510 are correspondingly provided with clamping openings 511. The opening of the clamping opening 511 provides a clamping space for the pair of clamping arms 141, and the pair of clamping arms 141 can pass through the clamping opening 511 to clamp the heat sink attached with the chip placed in the placing groove 510. Thus, the opening of the clamping opening 511 facilitates the clamping member 140 to take out the heat sink attached with the chip from the placing groove 510, thereby improving the efficiency of clamping the heat sink by the clamping member 140.

In order to facilitate the replacement of the placing groove 510 by the user, please refer to fig. 4, in one embodiment, a plurality of mounting holes 521 are uniformly formed around the center of the circle on the rotary disc 520, a mounting base 620 is disposed outside the bottom of the placing groove 510, and the mounting base 620 is inserted into the mounting holes 521 and connected to the rotary disc 520. The sizes of the heat dissipation fins are different, and the placement grooves 510 have different sizes in order to adapt to the heat dissipation fins with different sizes. The connection between the placement groove 510 and the rotary disk 520 is detachable, so that the placement groove 510 can be easily replaced by a user. Secondly, when the user needs to repair or replace the placing groove 510, the detachable connection relationship between the placing groove 510 and the rotary disk 520 provides convenience for the user to repair or replace. Thus, the placement groove 510 is convenient for a user to replace, and the application range of the processing device 10 for chips is increased.

To facilitate the actuation of the linkage plate 120 by the user, in one embodiment the transverse drive member is a rodless cylinder. Further, in the present embodiment, the rodless cylinder is a magnetically coupled rodless cylinder. In another embodiment, the rodless cylinder is a mechanical rodless cylinder. Both the magnetically coupled rodless cylinder and the mechanically rodless cylinder are in the prior art, and the principle thereof is not described herein again. In this embodiment, the rodless cylinder is of the type CDY1S 15H-300B. The rodless cylinder has a simple structure and is easy to control. The user controls the lateral movement of the link plate 120 by actuating the lateral drive member. In this manner, the user is facilitated to actuate the connecting plate 120, which in turn facilitates the user to adjust the lateral position of the clamping member 140.

To facilitate user control of the longitudinal movement of the clamp 140, in one embodiment, the longitudinal drive member 130 is a rod cylinder. Further, in this embodiment, the rod cylinder is a single-acting cylinder. In another embodiment, the rod cylinder is an impact cylinder. The rod cylinder is prior art and the principle is not described in detail here. In this embodiment, the Qigong with rod is SCJ-50X 50-50-S. The rod cylinder has simple structure and easy control. The user controls the longitudinal movement of the clamping member 140 by driving the longitudinal driving member 130, so that the clamping member 140 is close to or far away from the heat sink or the chip. In this manner, user control of the longitudinal movement of the clamp 140 is facilitated, which in turn facilitates user adjustment of the longitudinal position of the clamp 140.

In order to facilitate the chip being held by the holding member 140, in one embodiment, the holding member 140 is a vacuum generator provided with a vacuum nozzle. The vacuum generator is a small vacuum component which utilizes a positive pressure air source to generate negative pressure, and the vacuum generator is the prior art, and the principle of the vacuum generator is not described in detail herein. In this embodiment, the vacuum generator is model ZX 1-W05. The vacuum generator has small volume and light weight, and is suitable for being matched with the vacuum suction nozzle to adsorb the chip, thereby playing the role of clamping the chip. The vacuum generator has simple structure and convenient installation. Therefore, the clamping piece 140 is convenient to clamp the chip, and the installation convenience of the clamping piece 140 is improved.

In order to firmly seat the heat sink in the placement groove 510, in one embodiment, a vacuum chuck clamp is disposed on the bottom of the placement groove 510. The vacuum chuck clamp is communicated with the vacuum pump through the air duct, the vacuum pump is started to generate negative air pressure in the vacuum chuck clamp, and an external workpiece is pressed on the vacuum chuck clamp under the action of the atmospheric pressure, so that the external workpiece is adsorbed and fixed. Vacuum chuck clamps are prior art and the principle is not described herein. When the rotary disk 520 rotates at a high speed, the fins placed in the placing groove 510 may be centrifuged and may be thrown off the rotary disk 520. The vacuum chuck clamp plays a role in absorbing the heat dissipation fins, so that the heat dissipation fins can be tightly attached to the bottom of the placing groove 510, and the heat dissipation fins are prevented from being thrown out when the rotary disc 520 rotates at a high speed. The position of the heat sink can be maintained during rotation of the turntable disk 520. In this way, the heat sink can be stably seated in the placement groove 510, so that the accuracy of clamping the heat sink by the clamping member 140 is ensured, and the working stability of the processing apparatus 10 for chips is improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A processing apparatus for chips, comprising: the device comprises a mechanical arm mechanism, a conveying mechanism, a pushing mechanism, a silicone grease mechanism and a placing mechanism;

the manipulator mechanism comprises a frame beam, a transverse driving piece, a connecting plate, a longitudinal driving piece and a clamping piece; the frame beam is connected with the transverse driving piece, the transverse driving piece is in driving connection with the longitudinal driving piece through the connecting plate, and the longitudinal driving piece is in driving connection with the clamping piece;

the conveying mechanism comprises a conveying track and a vibration motor; the vibration motor is arranged at the bottom of one end, far away from the pushing mechanism, of the conveying track, the conveying track is arranged in an inclined mode, and one end, far away from the pushing mechanism, of the conveying track is higher than one end, close to the pushing mechanism, of the conveying track;

the pushing mechanism comprises a working groove, a push rod and a push rod driving piece; the working groove is cuboid, the push rod driving piece is arranged at the short edge groove wall of the working groove and is in driving connection with the push rod, and the push rod moves close to or far away from the short edge groove wall at the other side of the working groove; an input opening is formed in the long-edge groove wall of the working groove close to the push rod, and the output end of the conveying track is connected to the input opening of the working groove;

the silicone grease mechanism comprises a silicone grease groove and a belt transmission assembly; the belt transmission assembly comprises a flexible belt, a driving wheel, a driven wheel and a main wheel driving piece, the driving wheel is in driving connection with the driven wheel through the flexible belt, the main wheel driving piece is in driving connection with the driving wheel, and the main wheel driving piece is connected with the silicone grease groove;

the placing mechanism comprises a placing groove;

the conveying mechanism is used for conveying the chip to the working groove; the manipulator mechanism is used for grabbing the chip, driving the chip to the silicone grease mechanism to stick silicone grease, and then driving the chip to the placing mechanism so as to stick the chip stuck with the silicone grease and the radiating fins arranged in the placing groove.

2. The processing equipment for the chip as claimed in claim 1, wherein the silicone grease mechanism further comprises a silicone grease partition plate, the silicone grease partition plate is connected to the notch of the silicone grease groove, the silicone grease partition plate is provided with a strip-shaped hole, and the flexible belt portion is exposed out of the strip-shaped hole.

3. The processing equipment for the chip as claimed in claim 2, wherein the silicone grease partition plate is uniformly provided with a plurality of reflow holes.

4. The apparatus of claim 1, wherein the primary wheel drive is a drive motor.

5. The processing equipment for the chip as claimed in claim 1, wherein the outer side surface of the flexible belt is uniformly provided with stripe patterns.

6. The processing apparatus for chips as defined in claim 1, wherein said push rod is provided with a protective layer at a portion remote from said push rod driving member.

7. The processing apparatus for chips as defined in claim 1, wherein said clamping member is a clamping cylinder provided with a pair of clamping arms.

8. The processing apparatus for chips as claimed in claim 7, wherein the opposing surfaces of the pair of holding arms are provided with buffer layers.

9. The processing apparatus of claim 7, wherein the working groove has two opposite side walls away from the push rod and an output opening.

10. The processing tool for chips of claim 1, wherein said push rod driver is a drive cylinder.