CN112975148B - Wafer laser invisible cutting equipment and cutting method - Google Patents

Abstract

The application discloses a wafer laser invisible cutting device and a cutting method. The wafer back is absorbed by the material absorbing mechanism of the wafer laser invisible cutting equipment in an adsorption mode, so that the material absorbing mechanism only acts on the wafer back to take up the wafer, the wafer which is cut into a plurality of independent individuals is conveniently transferred together with the protective film, and the wafer is convenient to transfer. When the wafer is switched between the material transferring device and the material loading device, the wafer only moves in the Z-axis direction, and the wafer is borne on the material loading platform and is driven to move along the X-axis direction or the Y-axis direction, so that when the wafer is moved to be in butt joint with the laser emitting device, the back of the wafer can directly face the laser emitting device, the wafer can be conveniently cut, the whole transfer process is smooth and orderly, and automatic transfer of the wafer in the wafer cutting process can be realized. And the adhesive film is adhered to the back surface of the divided wafer, and the position of the divided wafer is fixed through the protective film, so that the protective film on the front surface of the wafer is conveniently removed, and the divided wafer is conveniently taken down from the adhesive film.

Description

Wafer laser invisible cutting equipment and cutting method

Technical Field

The application relates to the technical field of semiconductor processing, in particular to wafer laser invisible cutting equipment and a cutting method.

Background

With the improvement of the functional structure of the wafer, the front surface of the wafer is more and more sensitive to light and dust, so that a protective film can be attached to the front surface of the wafer in the wafer processing process, and the time for exposing the front surface of the wafer is shortened as much as possible. The protective film is tightly attached to the surface of the wafer, and if a one-time cutting mode is adopted, the cutting thickness is difficult to control, so that the protective film is cut by mistake, the cut wafer is inconvenient to transfer, and the protective film is inconvenient to strip. The front surface of the wafer is pre-grooved, the protective film is attached to the front surface of the wafer, and then the wafer is cut from the back surface of the wafer, namely, the front surface of the wafer can be effectively protected by adopting a twice cutting mode. However, due to the fact that the two sides of the wafer are cut, the conveying difficulty of the wafer in the cutting process is increased, and automation of the equipment for cutting and transferring the wafer is difficult to achieve.

Disclosure of Invention

In order to solve the problems, the application provides a wafer laser invisible cutting device and a cutting method.

In a first aspect, an embodiment of the present application provides a laser stealth cutting device for a wafer, the front of which is provided with a predetermined groove and is pasted with a protective film, the laser stealth cutting device comprises a material transferring device, a material loading device, a laser emitting device and a film pasting device. The material transferring device comprises a material sucking mechanism and a material transferring driving mechanism, and the material transferring driving mechanism is used for driving the material sucking mechanism to suck the back of the wafer along the Z-axis direction; the material loading device comprises a material loading platform and a material loading driving mechanism, wherein the material loading platform is used for bearing the wafer which is put down along the Z-axis direction by the material suction mechanism; the laser emitting device is used for emitting laser according to the shape of a preset groove and acting on the back of the wafer on the material loading platform so as to cut the wafer into a plurality of independent wafer grains, and the laser emitting device is set to emit laser which acts on the wafer so as to cut the wafer, wherein the range of a light path of the laser which acts on the wafer is as follows: the thickness of the wafer is smaller than the thickness of the wafer and is greater than or equal to the thickness from the groove bottom of the preset groove to the back of the wafer; the film sticking device is used for sticking an adhesive film to the back of the cut wafer;

the material loading driving mechanism is used for driving the material loading table to move along at least one direction of an X axis or a Y axis so as to drive the wafer to move from the end part of the material sucking mechanism to be in butt joint with the laser emitting device or drive the cut wafer to move from the butt joint part of the laser emitting device to be in butt joint with the material sucking mechanism; the material transferring driving mechanism is also used for driving the material sucking mechanism to suck the cut wafer on the material carrying platform along the Z-axis direction or driving the cut wafer to move to the film sticking device along the Y-axis direction.

In some exemplary embodiments, the laser stealth dicing apparatus further includes a material taking device and a magazine, the magazine is used for storing the wafer with the front surface provided with the predetermined groove and the front surface adhered with the protective film, the material taking device is used for taking out the wafer stored in the magazine and driving the wafer to move along the X-axis direction to be in butt joint with the material suction mechanism, and the wafer is in butt joint with the material suction mechanism in a direction that a panel of the wafer is perpendicular to the Z-axis.

In some exemplary embodiments, the material taking device includes a material taking shovel and a material taking driving mechanism for driving the material taking shovel to move along the direction of the X axis, the material taking shovel is used for receiving the wafer and placing the wafer along the direction perpendicular to the Z axis, a plurality of first air flow channels communicated with the first air pumping mechanism are arranged in the material taking shovel, a first opening is arranged at the end of each first air flow channel, and the first opening is communicated with the surface of the material taking shovel used for receiving the wafer.

In some exemplary embodiments, the material transferring device is arranged opposite to the material box along the X-axis direction; along the Y-axis direction, two opposite sides of the material transferring device are respectively provided with a laser emitting device and a film sticking device, and the laser emitting device is arranged between the material transferring device and the material box along the X-axis direction; along the Z axle direction, change one side of material device and be equipped with and carry material device and extracting device, and extracting device more closes on the material device setting of changeing in carrying the material device relatively.

In some exemplary embodiments, the material loading driving mechanism includes a Y-axis material loading driving component and an X-axis material loading driving component installed at a driving end of the Y-axis material loading driving component, an end of the Y-axis material loading driving component is in butt joint with the laser emission device, an end of the X-axis material loading driving component is in butt joint with the material suction mechanism, the material loading platform is connected with the driving end of the X-axis material loading driving component, the X-axis material loading driving component is used for driving the material loading platform to move along the X-axis direction, and the Y-axis material loading driving component is used for driving the material loading platform and the X-axis material loading driving component to move along the Y-axis direction.

In some exemplary embodiments, the material transferring driving mechanism comprises a Z-axis material transferring driving assembly connected with the material sucking mechanism and a Y-axis material transferring driving assembly connected with the Z-axis material transferring driving assembly, wherein the end, far away from the laser emitting device, of the Y-axis material transferring driving assembly is in butt joint with the film pasting assembly, the Z-axis material transferring driving assembly is used for driving the material sucking mechanism to move along the Z-axis direction, and the Y-axis material transferring driving assembly is used for driving the material sucking mechanism and the Z-axis material transferring driving assembly to move along the Y-axis direction.

In some exemplary embodiments, the material suction mechanism includes a material suction disc, the material suction disc is provided with a plurality of second air flow channels, the plurality of second air flow channels are communicated with the second air suction mechanism, the end of each second air flow channel is provided with a second opening, the second opening is connected with the surface of the material suction disc, which is used for contacting with the wafer, and the plurality of second openings are circularly distributed on the surface of the material suction disc.

In some exemplary embodiments, in the Z-axis direction, the circular distribution of the plurality of second openings occupies a circular area having a diameter greater than or equal to a diameter of the wafer, and the plurality of second openings are uniformly distributed within the circular area.

In a second aspect, an embodiment of the present application provides a method for stealth laser dicing of a wafer, where the wafer is diced by using the stealth laser dicing apparatus for wafer, including the following steps:

providing a wafer with a preset groove on the front surface and a protective film adhered on the front surface;

controlling a material sucking mechanism to suck the back of the wafer;

controlling the loading driving mechanism to drive the loading platform to move to be in butt joint with the material sucking mechanism;

controlling the material transferring driving mechanism to drive the material sucking mechanism to move towards the material loading platform so as to place the wafer on the material loading platform;

controlling the material loading driving mechanism to drive the material loading platform to move so as to drive the wafer to move to be in butt joint with the laser emitting device;

controlling a laser emitting device to emit laser according to the shape of a preset groove to act on the back of the wafer on the material loading platform so as to cut the wafer;

controlling the material loading driving mechanism to drive the material loading platform to move so as to drive the cut wafer to move to be in butt joint with the material sucking mechanism;

controlling the material transferring driving mechanism to drive the material sucking mechanism to move so as to suck the cut wafer, and transferring the cut wafer to the film sticking device;

and controlling the film sticking device to stick an adhesive film on the back of the wafer.

The application provides a stealthy cutting equipment of wafer laser and cutting method, the wafer back is absorb to inhale material mechanism adoption absorptive mode of the stealthy cutting equipment of wafer laser for inhale the material mechanism and only act on the wafer back and can take the wafer up, after the wafer is cut, adopt absorptive transfer mode can be transferred into a plurality of independent individual's wafer together with the protection film by being cut, be convenient for transport. The wafer only takes place the removal of Z axle direction when changeing between material device and the material carrying device to and the wafer bears and is driven along X axle or Y axle direction removal on the material carrying platform, makes the wafer moved to when butt joint with laser emission device, and the wafer back can directly face laser emission device, and the laser emission device of being convenient for cuts the wafer, and whole transfer process is smooth orderly, can realize the automatic transportation to the wafer in the cutting wafer process. The adhesive film is adhered to the back of the divided wafer, the position of the divided wafer is fixed through the protective film, the protective film on the front of the wafer is convenient to remove, and meanwhile, the adhesive film is convenient to expand so that the divided wafer can be taken down from the adhesive film.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a cross-sectional view of a wafer with a protective film on the front side in one implementation of the present application;

FIG. 2 is a schematic perspective view of a wafer laser stealth dicing apparatus according to an embodiment of the present disclosure;

FIG. 3 is a schematic perspective view of a wafer laser stealth dicing apparatus according to an embodiment of the present application;

FIG. 4 is a top view of a laser stealth dicing apparatus for a wafer in one implementation of the present application;

FIG. 5 is a schematic perspective view of a wafer being adsorbed on a material sucking mechanism according to an embodiment of the present disclosure;

FIG. 6 is a schematic perspective view of a film application device in accordance with one embodiment of the present disclosure;

FIG. 7 is a perspective view of a film cutting structure in one implementation of the present application;

FIG. 8 is a partial perspective view of a film slitting structure in one implementation of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The embodiment of the application provides a laser invisible cutting device for a wafer, which is used for cutting the wafer with a preset groove on the front surface and a protective film attached to the front surface, as shown in fig. 1, is a cross-sectional view of the protective film 103 attached to the front surface of the wafer 100. As shown in fig. 2 to 4, the wafer laser stealth dicing apparatus includes a material transferring device 210, a material loading device 220, a laser emitting device 230, and a film pasting device 300.

The material transferring device 210 includes a material sucking mechanism 211 and a material transferring driving mechanism 212, and the material transferring driving mechanism 212 is used for driving the material sucking mechanism 211 to suck the back of the wafer 100 along the Z-axis direction. The loading device 220 includes a loading platform 221 and a loading driving mechanism 222, and the loading platform 221 is used for receiving the wafer 100 which is placed down along the Z-axis direction by the suction mechanism 211. The laser emitting device 230 is configured to emit laser according to a shape of a predetermined groove to act on the back surface of the wafer 100 on the material loading table 221 so as to cut the wafer 100. The film sticking apparatus 300 sticks a bonding film to the back surface of the diced wafer 100.

The loading driving mechanism 222 is configured to drive the loading platform 221 to move along at least one direction of the X axis or the Y axis, so as to drive the wafer 100 to move from the end of the material suction mechanism 211 to be in butt joint with the laser emitting device 230 or drive the cut wafer 100 to move from the butt joint of the laser emitting device 230 to be in butt joint with the material suction mechanism 211; the material transferring driving mechanism 212 is further configured to drive the material sucking mechanism 211 to suck the cut wafer 100 on the material loading platform 221 along the Z-axis direction or drive the cut wafer 100 to move to the film pasting device 300 along the Y-axis direction.

According to the laser invisible cutting equipment for the wafer, the material sucking mechanism 211 is arranged to suck the back surface of the wafer 100 in an adsorption mode, so that the material sucking mechanism 211 only acts on the back surface of the wafer 100 to take up the wafer 100, and the orientation of the surface of the wafer 100 can be flexibly switched through the material sucking mechanism 211. After the wafer 100 is cut, the wafer 100 cut into a plurality of independent units can be transferred together with the protective film 103 by using an adsorption transfer method, so that the wafer 100 is convenient to transfer. When the wafer 100 is switched between the material transferring device 210 and the material loading device 220, only the Z-axis direction moves, and the wafer 100 is loaded on the material loading platform 221 and is driven to move along the X-axis or Y-axis direction, so that when the wafer 100 is moved to be in butt joint with the laser emitting device 230, the back surface of the wafer 100 can directly face the laser emitting device 230, the laser emitting device 230 can conveniently cut the wafer 100, the transfer process is smooth and orderly, and the automatic transfer of the wafer 100 in the process of cutting the wafer 100 can be realized. The adhesive film is adhered to the back of the divided wafer 100, the positions of the plurality of wafer grains are fixed through the protective film, the protective film 103 on the front surface of the wafer 100 is conveniently removed, then the adhesive film is subjected to film expansion processing, the plurality of independent wafer grains are separated, the distance between every two adjacent wafers 100 is increased, and therefore the plurality of wafer grains can be conveniently taken down from the adhesive film.

The wafer laser stealth scribing apparatus may further include a mounting stage 241 and a mounting frame (not shown) mounted on the mounting stage 241, the material transferring device 210, the material loading device 220, and the laser emitting device 230 may be mounted on the mounting stage 241 or the mounting frame, for example, the material loading device 220 may be mounted on the mounting stage 241, the material loading stage 221 may be movable in an X-axis or Y-axis direction with respect to the mounting stage 241, and the material transferring device 210 and the laser emitting device 230 may be mounted on the mounting frame such that the material transferring device 210 may place the wafer 100 on the material loading stage 221 in a Z-axis direction or may grasp the diced wafer 100 from the material loading stage 221 in the Z-axis direction, and such that the laser emitting device 230 may emit laser in the Z-axis direction to scribe the wafer 100. The film pasting device 300 may be disposed at the periphery of the mounting table 241, and the film pasting device 300 may be abutted with the material transferring device 210, and may facilitate transferring the cut wafer 100 together with the protection film into the film pasting device 300.

In the transferring process, the wafer 100 may be turned over by controlling the material suction mechanism 211 during the process of the material suction mechanism 211 sucking the wafer 100, or the wafer 100 may be pre-adjusted to be placed along the direction perpendicular to the Z-axis, so that the material suction mechanism 211 may directly move along the Z-axis to suck the wafer 100.

In some exemplary embodiments, the wafer laser stealth dicing apparatus may further include a material taking device 250 and a magazine 260, the magazine 260 is used for storing the wafer 100 with the preset groove 102 on the front surface and the protective film 103 on the front surface, and the surface of the wafer 100 is placed in a direction perpendicular to the Z axis. The material taking device 250 is used for taking out the wafer 100 stored in the magazine 260 and driving the wafer 100 to move along the X-axis direction to be abutted with the material sucking mechanism 211, the material taking device 250 can maintain the surface of the wafer 100 to be vertical to the Z-axis in the process of driving the wafer 100 to move, so that when the wafer 100 moves to be abutted with the material sucking mechanism 211, the wafer 100 can be abutted with the material sucking mechanism 211 in the direction that the surface of the wafer 100 is vertical to the Z-axis, the material sucking mechanism 211 can move to be close to and suck the wafer 100 along the Z-axis direction, and the wafer 100 can be transferred from the material taking device 250 to the material sucking mechanism 211.

In some exemplary embodiments, the material taking device 250 includes a material taking shovel 251 and a material taking driving mechanism 252 for driving the material taking shovel 251 to move along the X-axis direction, the material taking shovel 251 is used for receiving the wafer 100 and placing the wafer 100 along the direction perpendicular to the Z-axis direction, specifically, a plurality of first air flow channels are arranged in the material taking shovel 251 and are communicated with a first air pumping mechanism (not shown), a first opening is arranged at an end of each first air flow channel, and the first opening is communicated with the surface of the material taking shovel 251 used for receiving the wafer 100. When material is taken, the material taking driving mechanism 252 can be directly controlled to drive the material taking shovel 251 to translate towards the material box 260 along the X-axis direction, the material taking shovel 251 is inserted into the material box 260 to be in contact with the protective film 103 on the front surface of the wafer 100, the first air pumping mechanism is controlled to pump the gas in the first air flow channel, the first air flow channel is in a negative pressure state, the protective film 103 is adsorbed to block the first opening, and the protective film 103 and the wafer 100 are fixed on the material taking shovel 251. Then, the material taking shovel 251 is driven to move away from the magazine 260 in the opposite direction, so that the wafer 100 can be taken out from the magazine 260 with its surface perpendicular to the Z-axis. The material taking driving mechanism 252 may include a motor screw driving assembly, and the material taking shovel 251 is installed at a driving end of the motor screw driving assembly, so that the material taking driving mechanism 252 can drive the material taking shovel 251 and the wafer 100 to move stably.

In some exemplary embodiments, the material transferring device 210 is disposed opposite to the magazine 260 along the X-axis direction, so that the material taking device 250 can directly move along the X-axis direction to bring the wafer 100 into butt joint with the material sucking mechanism 211. The two opposite sides of the material transferring device 210 along the Y-axis direction are respectively provided with a laser emitting device 230 and a film sticking device 300, and the laser emitting device 230 is arranged between the material transferring device 210 and the material box 260 along the X-axis direction; one side of the material transferring device 210 along the Z-axis direction is provided with a loading device 220 and a material taking device 250, and the material taking device 250 is disposed closer to the material transferring device 210 than the loading device 220. According to the installation method, the positions of the structures can be reasonably and orderly installed, the smooth wafer 100 transmission structure is formed, and the installation space occupied by the invisible wafer 100 cutting equipment is saved.

Specifically, according to the above mounting structure, the wafer 100 may be transferred in the following order:

a. the material taking shovel 251 of the material taking device 250 sucks the wafer 100 to fix the surface of the wafer 100 on the material taking shovel 251 along the direction perpendicular to the Z-axis, controls the material taking shovel 251 to move along the X-axis direction to take the wafer 100 out of the magazine 260, and continuously drives the wafer 100 to move along the X-axis direction to be in butt joint with the material sucking mechanism 211.

b. The suction mechanism 211 moves in the Z-axis direction to suck the back surface of the wafer 100, lifts the wafer 100 from the pick blade 251, and controls the pick blade 251 to move in the X-axis direction to return to the cassette 260. The suction mechanism 211 then places the wafer 100 on the loading platform 221 of the loading device 220.

c. The material loading platform 221 is controlled to move along the X-axis direction close to the material box 260 and then along the Y-axis direction close to the laser emitting device 230, the wafer 100 is driven to be in butt joint with the laser emitting device 230 step by step, and the laser emitting device 230 emits laser to cut the wafer 100.

d. The loading platform 221 is controlled to move along the Y-axis direction away from the laser emitting device 230, then move along the X-axis direction away from the magazine 260, and move again to be in butt joint with the material sucking mechanism 211.

e. The suction mechanism 211 sucks the diced wafer 100 on the carrier stage 221 along the Z-axis direction, and then drives the wafer 100 to move along the Y-axis direction, so as to transfer the diced wafer 100 into the film sticking apparatus 300.

The laser emitting device 230 is arranged between the material transferring device 210 and the material box 260 along the X-axis direction, and the material loading platform 221 needs to move step by step along the X-axis direction and the Y-axis direction to be respectively butted with the laser emitting device 230 and the material sucking mechanism 211. Specifically, as shown in fig. 4, in some exemplary embodiments, the loading driving mechanism 222 includes a Y-axis loading driving assembly 2222 and an X-axis loading driving assembly 2223 mounted at a driving end of the Y-axis loading driving assembly 2222, an end of the Y-axis loading driving assembly 2222 is connected to the laser emitting device 230, an end of the X-axis loading driving assembly 2223 is connected to the suction mechanism 211, and the loading platform 221 is connected to a driving end of the X-axis loading driving assembly 2223. The X-axis loading driving assembly 2223 is configured to drive the loading platform 221 to move along the X-axis direction, and the Y-axis loading driving assembly 2222 is configured to drive the loading platform 221 and the X-axis loading driving assembly 2223 to move along the Y-axis direction. The X-axis loading driving assembly 2223 and the Y-axis loading driving assembly 2222 may both include a motor lead screw driving assembly, the motor lead screw driving assembly of the Y-axis loading driving assembly 2222 is mounted on the mounting table 241, the motor lead screw driving assembly driving end of the Y-axis loading driving assembly 2222 is provided with a loading plate 2221, the motor lead screw driving assembly of the X-axis loading driving assembly 2223 is mounted on the loading plate 2221, and the loading table 221 is mounted at the driving end of the motor lead screw driving assembly of the X-axis loading driving assembly 2223.

The material transferring driving mechanism 212 is used for driving the wafer 100 to move along the Z-axis direction to pick up or put down the wafer 100, and is also used for driving the cut wafer 100 to move along the Y-axis direction to transfer the wafer 100 to the film pasting device 300. Specifically, as shown in fig. 2 and 4, in some exemplary embodiments, the transfer drive mechanism 212 includes a Z-axis transfer drive assembly 2121 connected to the take-up mechanism 211 and a Y-axis transfer drive assembly 2122 connected to the Z-axis transfer drive assembly 2121, and the end of the Y-axis transfer drive assembly 2122 remote from the laser emitting device 230 interfaces with the decal assembly. The Z-axis material-transferring driving assembly 2121 is configured to drive the material-sucking mechanism 211 to move along the Z-axis direction, and the Y-axis material-transferring driving assembly 2122 is configured to drive the material-sucking mechanism 211 and the Z-axis material-transferring driving assembly 2121 to move along the Y-axis direction. The Z-axis material rotating driving assembly 2121 and the Y-axis material rotating driving assembly 2122 may both include a motor lead screw driving assembly, the Y-axis material rotating driving assembly 2122 may be mounted on the mounting frame, a material rotating mounting element 2122a may be mounted at a driving end of the motor lead screw driving assembly of the Y-axis material rotating driving assembly 2122, a motor lead screw driving assembly of the Z-axis material rotating driving assembly 2121 is mounted on the material rotating mounting element 2122a, and the material sucking mechanism 211 is mounted at a driving end of the motor lead screw driving assembly of the Z-axis material rotating driving assembly 2121.

As shown in fig. 2, in some exemplary embodiments, the material suction mechanism 211 may include a material suction tray 2111, the material suction tray 2111 is provided with a plurality of second air flow channels, the plurality of second air flow channels are communicated with the second air suction mechanism 2112, an end portion of each of the second air flow channels is provided with a second opening 2111a, the second opening 2111a is connected to a surface of the material suction tray 2111 for contacting with the wafer 100, and the plurality of second openings 2111a are circularly distributed on the surface of the material suction tray 2111. The second pumping mechanism 2112 is controlled to pump the gas in the second gas flow channel, so that the second gas flow channel is in a negative pressure state, and the wafer 100 can be fixed on the chuck 2111 by sealing the second opening 2111a on the back surface of the wafer 100.

The wafer 100 is circular, and correspondingly, the second openings are distributed on the surface of the material suction plate 2111 in a circular shape, and the material suction plate 2111 may also be set to be circular correspondingly. In some exemplary embodiments, in the Z-axis direction, the diameter of the circular area occupied by the plurality of second openings 2111a distributed in a circle is greater than or equal to the diameter of the wafer 100, and the plurality of second openings 2111a distributed uniformly in the circular area can uniformly act on the wafer 100 to lift the wafer 100 over the entire surface, so that the wafer 100 can be uniformly and stably adsorbed on the suction pad 2111. Particularly, after the wafer 100 is divided from the back surface, the second openings 2111a are uniformly distributed in the circular area to adsorb the back surface of the wafer 100, and the protective film on the front surface of the wafer 100 is connected with the divided wafer particles, so that the wafer 100 can be protected from the two opposite surfaces of the wafer 100, the wafer particles formed after the cutting are prevented from being dispersed, and the orderliness and smoothness of the wafer 100 after the cutting in the transferring process are ensured.

The laser emitting device 230 may include an infrared nanosecond laser and an infrared camera, the infrared camera observes the back surface of the wafer 100, the shape of the preset groove 102 on the front surface of the wafer 100 is obtained according to the light transmittance condition, the infrared nanosecond laser emits laser according to the shape of the preset groove 102 to act on the back surface of the wafer 100, and the wafer 100 is cut and divided into a plurality of independent wafer grains from the preset groove. In some exemplary embodiments, the laser emitting device 230 is configured to emit laser light to act on the wafer 100 to cut the wafer 100 in an optical path range of: the thickness of the protective film 103 is smaller than the thickness of the wafer 100 and greater than or equal to the thickness from the bottom of the predetermined groove 103 to the back of the wafer 100, so as to ensure that the protective film 103 on the front surface of the wafer 100 is not cut by the laser, and maintain the integrity of the protective film 103, so that the protective film 103 can be connected with the front surface of the cut wafer 100, thereby facilitating the transportation of the cut wafer 100.

The protective film 103 attached to the front surface of the wafer 100 can be used to protect the back surface of the wafer 100, but the distance between two adjacent cut wafer grains is small, which is inconvenient to directly remove the wafer grains from the protective film, and if the distance between two adjacent wafer grains is increased by directly performing film widening treatment on the protective film 103, the front surface structure of the wafer 100 (for example, the dielectric layer on the front surface of the wafer 100) is easily damaged in the process of stretching the protective film 103, and in addition, for convenience of transportation, the blank film (the film not attached to the wafer surface) in which the edge of the protective film 103 is flush with the wafer surface or the edge of the protective film 103 protrudes out of the wafer 100 is small, which is inconvenient to directly perform film widening treatment on the protective film 103. Therefore, the adhesive film can be attached to the back surface of the wafer 100, and after the protective film 103 is removed, the adhesive film can be subjected to a film widening treatment, so that the diced wafer 100 can be easily removed from the adhesive film.

The adhesive film is attached to the back surface of the diced wafer 100 in the film attaching apparatus 300, as shown in fig. 6, the film attaching apparatus 300 may include a film attaching driving mechanism, a first material grabbing mechanism 331, a second material grabbing mechanism 332, and a film dicing mechanism 301.

As shown in fig. 7-8, the film cutting structure 301 may include a film application station 310, a film distribution assembly, and a film cutting assembly 330. The film pasting table 310 is used for bearing the wafer 100 and the support ring 200 coaxially arranged on the periphery of the wafer 100, so that the distances from the edge of the wafer 100 to the inner side wall surface of the support ring 200 along the radial direction are all equal. The film spreading assembly is used for providing an adhesive film 101 and attaching the adhesive film 101 to the surfaces of the wafer 100 and the support ring 200, and the relative position between the wafer 100 and the support ring 200 is fixed by the adhesive film 101. The width of the adhesive film 101 should be set larger than the diameter of the wafer 100 and the adhesive film 101 can also adhere to the surface of the support ring 200 to ensure that the adhesive film 101 can cover the entire surface of the wafer 100.

Specifically, in some exemplary embodiments, the film dispensing assembly includes an unwinding roller 321 and a winding roller 322 arranged in parallel, and a film pressing roller 323 arranged between the unwinding roller 321 and the winding roller 322, the unwinding roller 321 stores the adhesive film 101 thereon, the winding roller 322 is used for drawing the adhesive film 101 to cover the wafer 100 and the support ring 200, and the film pressing roller 323 abuts against the adhesive film 101 until the adhesive film 101 adheres to the surface of the wafer 100 and the support ring 200. The end parts of the unwinding roller 321 and the winding roller 322 can be respectively connected with a rotary driving motor, the two rotary driving motors are controlled to synchronously operate to drive the unwinding roller 321 and the winding roller 322 to synchronously rotate so as to pull the adhesive film 101 to pass through the upper parts of the wafer 100 and the support ring 200 and then wind the adhesive film 101 on the winding roller 322, and the unwinding roller 321 and the winding roller 322 can ensure that the adhesive film 101 uniformly and flatly passes through the upper parts of the wafer 100 and the support ring 200, so that the adhesive film 101 can be uniformly and flatly pressed and pasted on the surfaces of the wafer 100 and the support ring 200.

The film distribution assembly can further comprise two groups of pressing pieces 325, and the two groups of pressing pieces 325 are respectively arranged corresponding to the unwinding roller 321 and the winding roller 322. The two groups of pressing pieces 325 are respectively provided with a strip-shaped pressing opening 3251 for the adhesive film 101 to pass through, the two strip-shaped pressing openings 3251 are arranged side by side along the conveying direction of the adhesive film 101, the adhesive film 101 sequentially passes through the two strip-shaped openings 3251 along the conveying direction, and the side, not provided with the adhesive layer, of the adhesive film 101 abuts against the strip-shaped opening 3251 to further provide pretightening force for the adhesive layer. The distance between the two pressing members 325 relative to the wafer 100 can be adjusted to adjust the adhesive film 101 to be far away from or close to the wafer 100, and the width between the two pressing members 325 is adjusted to be larger than the outer diameter of the support ring 200, so that a sufficient film pasting space is ensured between the two pressing members 325.

In some exemplary embodiments, the lamination roller 323 is disposed parallel to the unwinding roller 321, and the film distribution assembly further includes a translational driving member for driving the lamination roller 323 to move along a direction parallel to the surface of the wafer 100. The film pressing roller 323 can be disposed between the two pressing members 325, and the unwinding roller 321, the winding roller 322, the film pressing roller 323, the translation driving member and the film cutting assembly 330 can be disposed on a side of the wafer 100 away from the film laminating table 310. The adhesive film 101 led out from the unwinding roller 321 passes through the strip-shaped pressing opening 3251 of the pressing member 325 corresponding to the unwinding roller 321, passes through the corresponding area above the wafer 100 and the support ring 200, winds around one side of the film pressing roller 323, continues to pass through the strip-shaped pressing opening 3251 of the pressing member 325 corresponding to the winding roller 322, and finally winds around the winding roller 322. The translation driving member is controlled to drive the film pressing roller 323 to move back and forth between the two pressing members 325, so as to press the adhesive film 101 against the surfaces of the wafer 100 and the support ring 200.

Further, in the direction perpendicular to the surface of the wafer 100, the outer surface of the squeeze film roller 323 contacts with the surface of the wafer 100, the squeeze film roller 323 can be driven to move back and forth by controlling the translational driving member, and the squeeze film roller 323 can directly press the adhesive film 101 against the surfaces of the wafer 100 and the support ring 200 when passing through the corresponding areas of the wafer 100 and the support ring 200. The translation driving member may be a motor screw driving mechanism or a linear cylinder driving mechanism, so that the translation driving member can drive the film pressing roller 323 to move back and forth along one direction.

The film cutting assembly 330 may include a cutter 331, a mounting arm 332, and a rotary driving member 333, wherein a blade of the cutter 331 contacts the adhesive film 101 attached to the surface of the support ring 200 or located at the periphery of the support ring 200, the cutter 331 is mounted on the mounting arm 332, and the mounting arm 332 is mounted at a driving end of the rotary driving member 333, wherein the rotary driving member 333 is configured to drive the cutter 331 to rotate around an axis of the wafer 100 to be attached as a central axis to cut the adhesive film 101, so as to cut the adhesive film 101 to be adhered to the surface of the wafer 100 and the support ring 200. The rotary driving piece 333 is controlled to drive the cutter 331 to rotate, so that the bonding film 101 suitable for bonding the support ring 200 and the wafer 100 together can be cut, the cutting mode and the cutting structure are simple, the applicability is high, and the processing efficiency of the wafer 100 is improved conveniently. After the adhesive film 101 is cut, the wafer 100 and the support ring 200 are bonded to the adhesive film 101 together, and the support ring 200 provides support for the wafer 100, thereby facilitating the transportation of the wafer 100 and the stability during the transportation process.

To prevent the film cutting assembly 330 and the film pressing roller 323 from interfering with each other during operation, the film cutting assembly 330 is required to drive the cutting blade 331 away from or close to the wafer 100. In some exemplary embodiments, the film cutting assembly 330 further comprises a lifting drive coupled to the rotary drive 333 and configured to move the cutting blade 331 away from or toward the wafer 100. When the translation driving member is controlled to drive the film pressing roller 323 to press and convey the adhesive film 101, the lifting driving member is controlled to be away from the wafer 100, so as to leave a movable space for the film pressing roller 323. After the adhesive film 101 is attached to the surfaces of the wafer 100 and the support ring 101, the translational driving member drives the squeeze film roller 323 to be away from the wafer 100, and then the lifting driving member is controlled to drive the cutter 331 to be close to the adhesive film 101 until the cutter 331 is in contact with the connecting film. The lifting driving member may be a motor screw driving mechanism or a linear cylinder driving mechanism, so that the lifting driving member can drive the components such as the cutting blade 331 and the mounting arm 332 to move away from or close to the wafer 100 along a linear motion.

For wafers 100 with different sizes, the support ring 200 with the corresponding size needs to be selected to be placed on the periphery of the wafer 100, and correspondingly, the size of the adhesive film 101 attached to the surfaces of the wafer 100 and the support ring 200 after being cut is also adaptively adjusted. In order to facilitate the cutting assembly 330 to cut adhesive films 101 of different sizes, in some exemplary embodiments, the driving end of the rotary driving member 333 is provided with a mounting block 335, and the mounting arm 332 is adjustably mounted on the mounting block 335 to adjust the distance of the cutting blade 331 relative to the center of the wafer 100.

Specifically, the installation arm 332 can include the shaft-like regulating part 3321, be equipped with the regulation hole that supplies the regulating part 3321 to pass on the installation piece 335, still be equipped with the screw hole on the installation piece 335, the screw hole sets up along the direction perpendicular with regulating part 3321 length direction, threaded hole is equipped with bolt 336, bolt 336 wears to locate behind the screw hole with the wall butt of regulating part 3321, with the position of fixed regulating part 3321 in the regulating hole, thereby conveniently through the position of adjustment regulating part 3321 in the regulating hole in order to adjust the position of cutter 331. The number of the rod-shaped adjusting portions 3321 is two, and the adjusting holes, the threaded holes and the bolts 336 are all arranged to be two corresponding to the two adjusting portions 3321, so that the mounting stability of the cutter 331 on the mounting block 335 is improved.

In some exemplary embodiments, the cutting blade 331 is a circular cutting blade, the axial direction of the circular cutting blade is parallel to the surface of the wafer 100, and the portion of the circular cutting blade contacting the adhesive film 101 can be used for cutting the adhesive film 101, so that the edge of the adhesive film 101 cut by the circular cutting blade is smoother, and burrs are prevented from occurring on the edge of the adhesive film 101. The circular cutter is rotatably mounted on the mounting arm 332 with the axial direction thereof as a central axis, so that the process of driving the circular cutter to rotate and cut the adhesive film by the rotary driving member 333 is smoother, and the film cutting efficiency is improved.

The driving end of the film sticking driving assembly is connected with the film sticking table 310 and used for driving the film sticking table 310 to move between the first station 351 and the second station 352, and the film distributing assembly and the film cutting assembly 330 are arranged between the first station 351 and the second station 352. After the wafer 100 and the support ring 200 move along with the film sticking table 310 to be in butt joint with the film laying assembly and the film cutting assembly 330, the film laying assembly and the film cutting assembly 330 sticks and cuts the adhesive film 101 on the surfaces of the wafer 100 and the support ring 200.

As shown in fig. 4 and 6, the film pasting device 300 may further include a film pasting workbench 321, an opening 3211 is disposed on the film pasting workbench 321, and one end of the film pasting workbench 310 is disposed through the opening 3211 on the film pasting workbench 321 to be connected to the driving end of the film pasting driving component. The film pasting workbench 321 can also be provided with two film pasting guide rails 322 side by side, the film pasting guide rails 322 are arranged along the direction of the first station 351 pointing to the second station 352, the two film pasting guide rails 322 are respectively provided with a sliding block, and the two sliding blocks are connected with the film pasting table 310 so as to ensure the moving stability of the film pasting table 310. The film sticking driving component can be a motor screw rod driving component, and the film sticking table 310 is connected with the driving end of the motor screw rod driving component.

The first material grabbing mechanism 331 is configured to grab the support ring 200 at the periphery of the wafer 100 at the first station 351, so that the support ring 200 is coaxially disposed with the wafer 100. The film sticking driving assembly drives the film sticking table 310 and the wafer 100 and the support ring 200 on the film sticking table 310 to move, the film sticking driving assembly moves from the first station 351 to be in butt joint with the working ends of the film distribution assembly and the film cutting assembly 330, the film distribution assembly and the film cutting assembly 330 stick and cut the adhesive film 101 on the surfaces of the wafer 100 and the support ring 200, and the film sticking driving assembly continues to drive the wafer 100 and the support ring 200, to which the adhesive film 101 is stuck, to move to the second station 352. The second grasping mechanism 332 is used to grasp the support ring 200 to which the adhesive film 101 is attached and the wafer 100 at the second station 352 and transfer the support ring 200 to which the adhesive film 101 is attached and the wafer 100 to the next station.

In some exemplary embodiments, the film sticking apparatus 300 further comprises a placing frame 360, the support ring 200 is stored on the placing frame 360, and the placing frame 360 is disposed adjacent to the first station 351. The placing rack 360 can comprise a placing platform and a plurality of limiting columns 361 arranged on the placing platform, the limiting columns 361 are distributed in an annular array mode, the supporting ring 200 is sleeved on the periphery of the limiting columns 361 distributed in a circular mode, the wall face of the inner side of the supporting ring 200 is in surface contact with the limiting columns 361, or the supporting ring 200 is placed between the limiting columns 361 distributed in a circular mode, the wall face of the outer side of the supporting ring 200 is in surface contact with the limiting columns 361, the position of the supporting ring 200 on the placing rack 360 is limited, and the supporting ring 200 is enabled to be arranged in order.

In some exemplary embodiments, the film laminating apparatus 300 further includes a storage shelf 370 disposed adjacent to the second station 352, the storage shelf 370 being used to store the support ring 200 of the bonded adhesive film 101 and the wafer 100 transferred from the second station 352 by the second grasping mechanism 332. The storage shelf 370 can be provided with a plurality of sets of clamping grooves, each set of clamping grooves comprises two strip-shaped clamping grooves 371 which are oppositely arranged, and the strip-shaped clamping grooves 371 are arranged along the direction parallel to the surface of the wafer 100, so that the second material grabbing mechanism 332 can drive the wafer 100 after film sticking and the support ring 200 to be inserted into the strip-shaped clamping grooves 371 along the direction parallel to the surface of the wafer 100.

In some exemplary embodiments, the direction from the first station 351 to the second station 352 is a predetermined direction, the first material-grasping mechanism 331 is configured to move the support ring 200 on the film-sticking table 310 in a direction perpendicular to the predetermined direction, and the second material-grasping mechanism 332 is configured to move the wafer 100, the support ring 200 and the adhesive film 101 to a next station, i.e. to the storage rack 370, so as to store multiple sets of the filmed wafers 100 and support rings 200 in the storage rack 370, so that the batch of the filmed wafers 100 and support rings 200 can enter a next processing procedure, e.g. a film-expanding processing procedure, to remove the diced wafer 100 from the adhesive film 101.

Specifically, the first material grabbing mechanism 331 and the second material grabbing mechanism 332 may each include a material claw 3301, a film pasting lifting component 3302 that drives the material claw 3301 to move along a preset lifting direction away from or close to the film pasting table 310, and a film pasting translation driving component 3303 that drives the material claw 3301 and the film pasting lifting component 3302 to move along a preset translation direction, where the preset direction, the preset lifting direction, and the preset translation direction are mutually perpendicular to each other, for example, the preset direction may be a Y-axis direction, the preset translation direction may be an X-axis direction, and the preset lifting direction may be a Z-axis direction. The film lifting unit 3302 and the film translation driving unit 3303 may be motor screw driving units, and the film translation driving units 3303 of the first material grabbing mechanism 331 and the second material grabbing mechanism 332 may be mounted on a film mounting rack (not shown).

The Y-axis material-turning driving assembly 2122 of the material-transferring device 210 may be abutted against the film-coating working table 321, the first station 351 or the second station 351 may be disposed adjacent to the Y-axis material-turning driving assembly 2122, as shown in fig. 4, the second station 351 is adjacent to the Y-axis material-turning driving assembly 2122, the cut wafer 100 transferred from the material-transferring device 210 is placed on the film-coating table 360 at the second station 352, and the cut wafer 100 moves together with the film-coating table 360 to the first station 351, and then the first material-grasping mechanism 331 grasps the support ring 200 and places the support ring 200 at the periphery of the wafer 100.

The placing frame 360 and the storage frame 370 may be disposed on the same side of the film-coating workbench 321 so as to be respectively abutted with the first material-grasping mechanism 331 and the second material-grasping mechanism 332, thereby forming a smooth wafer 100 conveying channel. The film distribution assembly and the film cutting assembly 330 can be arranged between the placing frame 360 and the storage frame 370, and installation space is saved. The translation driving member of the film distribution assembly can drive the film pressing roller 323 to move along a direction parallel to the preset direction or the preset translation direction, so as to lay the adhesive film 101 on the surfaces of the wafer 100 and the support ring 200.

The application also provides a wafer laser invisible cutting method, which adopts the wafer laser invisible cutting equipment to cut the wafer, and comprises the following steps:

s101, providing a wafer with a preset groove on the front surface and a protective film adhered on the front surface.

And S102, controlling the suction mechanism 211 to suck the back of the wafer 100.

And S103, controlling the loading driving mechanism 222 to drive the loading platform 221 to move to be in butt joint with the material sucking mechanism 211.

And S104, controlling the material transferring driving mechanism 212 to drive the material sucking mechanism 211 to move towards the material loading platform 221, and placing the wafer 100 on the material loading platform 221.

S105, controlling the loading driving mechanism 222 to drive the loading stage 221 to move, so as to drive the wafer 100 to move to be in butt joint with the laser emitting device 230.

And S106, controlling the laser emitting device 230 to emit laser according to the shape of the preset groove 102 to act on the back of the wafer 100 on the material loading table 221 so as to cut the wafer 100.

And S107, controlling the loading driving mechanism 222 to drive the loading table 221 to move so as to drive the cut wafer 100 to move to be in butt joint with the material sucking mechanism 211.

S108, controlling the material transferring driving mechanism 212 to drive the material sucking mechanism 211 to move so as to suck the cut wafer 100, and transferring the cut wafer 100 to the film pasting device 300.

S109, the film sticking device 300 is controlled to stick the adhesive film 101 to the back surface of the wafer 100.

The method for laser stealth dicing of a wafer according to the present application will be described with reference to an embodiment, which specifically includes the following steps:

s201, storing a plurality of wafers 100 with preset grooves 102 on the front surfaces and protective films 103 on the front surfaces in a material box 260, and enabling the surfaces of the wafers 100 to be perpendicular to the Z axis.

S202, controlling the material taking driving mechanism 252 to drive the material taking shovel 251 to be inserted into the material box 260, and controlling the first air pumping mechanism to pump the gas in the first air flow channel, so that the protective film 103 blocks the first opening, and the wafer 100 is fixed on the material taking shovel 251. The material taking driving mechanism 252 is controlled to drive the material taking shovel 251 to move along the direction of the X axis far away from the material box 260 until the wafer on the material taking shovel 251 is in butt joint with the material sucking disc 2111 of the material sucking mechanism 211.

And S203, controlling the Z-axis material rotating driving assembly 2121 to drive the material sucking disc 2111 to move along the direction close to the mounting table 241 until the surface of the material sucking disc 2111 contacts with the back surface of the wafer 100. The first air-extracting mechanism is controlled to release the fixing of the material-taking shovel 251 to the wafer 100, meanwhile, the second air-extracting mechanism 2112 is controlled to extract the air in the first air flow channel, so that the back of the wafer 100 blocks the second opening 2111a, the wafer is fixed on the material-taking tray 2111, and the material-taking driving mechanism 252 is controlled to drive the material-taking shovel 251 to move along the X-axis direction to be butted with the material box 260.

And S204, controlling the Z-axis material rotating driving assembly 2121 to drive the material sucking disc 2111 to move along the direction close to the mounting table 241, and after the wafer 100 on the material sucking disc 2111 is placed on the material loading table 221, controlling the Z-axis material rotating driving assembly 2121 to drive the material sucking disc 2111 to return to a waiting position away from the mounting table 241.

S205, the X-axis loading driving assembly 2223 is controlled to drive the loading table 221 to move along the X-axis direction close to the magazine 260, the Y-axis loading driving assembly 2222 is controlled to drive the loading table 221 to move along the Y-axis direction close to the laser emitting device 230, the wafer 100 is driven to be in butt joint with the laser emitting device 230 step by step, and the laser emitting device 230 emits laser to cut the wafer 100.

S206, the Y-axis loading driving component 2222 is controlled to drive the loading platform 221 to move along the Y-axis direction away from the laser emitting device 230, and then the X-axis loading driving component 2223 is controlled to drive the loading platform 221 to move along the X-axis direction away from the magazine 260 until the cut wafer 100 is butted with the material sucking mechanism 211.

S207, the Z-axis material rotation driving assembly 2121 is controlled to move along the Z-axis direction close to the mounting stage until the material suction plate 2111 contacts the back surface of the diced wafer 100, and the material suction mechanism 211 is controlled to make the diced wafer 100 be sucked onto the material suction plate 2111.

S208, first, the Z-axis material-transferring driving assembly 2121 is controlled to drive the cut wafer 100 to move away from the material-loading platform 221 along the Z-axis direction, and then the Y-axis material-transferring driving assembly 2122 is controlled to drive the cut wafer 100 to move along the Y-axis direction until the cut wafer 100 is in butt joint with the film-pasting platform 310 located at the second station 252.

And S209, controlling the film sticking driving mechanism to drive the film sticking table 310 at the second station 252 and the cut wafer 100 to move to the first station 252 along the Y-axis direction far away from the Y-axis material rotating driving assembly 2122, and controlling the first material grabbing assembly 331 to grab the support ring 200 on the placing frame 360 and place the support ring on the periphery of the cut wafer 100.

And S210, controlling the Y-axis material rotating driving assembly 2122 to drive the film pasting table 310 at the first station 251 and the cut wafer 100 to move along the Y-axis direction close to the Y-axis material rotating driving assembly 2122 until the cut wafer 100 is in butt joint with the film distributing assembly and the film cutting assembly 330.

S211, controlling the film laying assembly to attach the adhesive film 101 to the surfaces of the wafer 100 and the support ring 200, and controlling the film cutting assembly 330 to cut the adhesive film 101 on the surfaces of the wafer 100 and the support ring 200.

And S212, controlling the Y-axis material-rotating driving assembly 2122 to drive the filmed wafer 100 and the support ring 200 to move to the second station 252 along the Y-axis direction close to the Y-axis material-rotating driving assembly 2122. And controlling the second material grabbing assembly 332 to grab the support ring 200, and storing the filmed wafer 100 and the support ring 200 in the storage rack 370.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (2)

1. The utility model provides a stealthy cutting equipment of wafer laser for openly be equipped with predetermine groove and openly paste the wafer of protection film and cut, its characterized in that includes:

the material box is used for storing the wafer with the front surface provided with the preset groove and the front surface stuck with the protective film;

the material transferring device is arranged opposite to the material box along the X-axis direction and comprises a material sucking mechanism and a material transferring driving mechanism, the material transferring driving mechanism comprises a Z-axis material transferring driving assembly connected with the material sucking mechanism and a Y-axis material transferring driving assembly connected with the Z-axis material transferring driving assembly, the Z-axis material transferring driving assembly is used for driving the material sucking mechanism to move along the Z-axis direction, and the Y-axis material transferring driving assembly is used for driving the material sucking mechanism and the Z-axis material transferring driving assembly to move along the Y-axis direction; the material sucking mechanism comprises a material sucking disc, a plurality of second air flow channels are arranged on the material sucking disc and communicated with a second air pumping mechanism, second openings are formed in the end parts of the second air flow channels and connected with the surface of the material sucking disc, which is used for being in contact with the wafer, and the second openings are circularly distributed on the surface of the material sucking disc; in the Z-axis direction, the diameter of a circular area occupied by the plurality of second openings which are distributed in a circular manner is larger than or equal to the diameter of the wafer, and the plurality of second openings are uniformly distributed in the circular area;

the material taking device comprises a material taking shovel and a material taking driving mechanism; the material taking shovel is used for receiving the wafers stored in the material box and enabling the surfaces of the wafers to be placed along the direction perpendicular to the Z axis, a plurality of first air flow channels communicated with the first air pumping mechanism are arranged in the material taking shovel, a first opening is formed in the end portion of each first air flow channel, and the first opening is communicated with the surface, used for receiving the wafers, of the material taking shovel; the material taking driving mechanism is used for driving the material taking shovel to move along the X-axis direction to be in butt joint with the material sucking mechanism, and the material sucking mechanism moves along the Z-axis direction to suck the back of the wafer;

the material loading device comprises a material loading platform and a material loading driving mechanism; the material loading table is used for bearing the wafer which is put down along the Z-axis direction by the material suction mechanism; the material loading driving mechanism comprises a Y-axis material loading driving assembly and an X-axis material loading driving assembly arranged at the driving end of the Y-axis material loading driving assembly, the end part of the X-axis material loading driving assembly is butted with the material sucking mechanism, the material loading table is connected with the driving end of the X-axis material loading driving assembly, and the X-axis material loading driving assembly is used for driving the material loading table to move along the X-axis direction;

the laser emission device is in butt joint with the end part of the Y-axis loading driving component, the Y-axis loading driving component is used for driving the loading platform and the X-axis loading driving component to move along the Y-axis direction to be in butt joint with the laser emission device, the laser emission device is used for emitting laser to act on the back surface of the wafer on the loading platform according to the shape of the preset groove so as to cut the wafer into a plurality of independent wafer particles, and the laser emission device is set to emit laser to act on the wafer to cut the wafer, wherein the light path range of the wafer is as follows: the thickness of the wafer is smaller than the thickness of the wafer and is greater than or equal to the thickness from the groove bottom of the preset groove to the back of the wafer;

the film sticking device is used for sticking an adhesive film to the back of the cut wafer; along the Y-axis direction, the film sticking device and the laser emitting device are arranged on two opposite sides of the Y-axis material rotating driving component, and the laser emitting device is arranged between the material rotating device and the material box along the X-axis direction; the material loading device and the material taking device are arranged on one side of the material transferring device along the Z-axis direction, and the material taking device is arranged closer to the material transferring device than the material loading device;

the material transferring device, the material loading device and the laser emitting device are arranged on the mounting table, the film sticking device is arranged on the periphery of the mounting table, and the film sticking device is in butt joint with the material transferring device;

the material loading driving mechanism is used for driving the material loading table to move along at least one direction of an X axis or a Y axis so as to drive the wafer to move from the end part of the material sucking mechanism to be in butt joint with the laser emitting device or drive the cut wafer to move from the butt joint part of the laser emitting device to be in butt joint with the material sucking mechanism; the material transferring driving mechanism is further used for driving the material sucking mechanism to suck the cut wafer on the material carrying table along the Z-axis direction or driving the cut wafer to move to the film pasting device along the Y-axis direction.

2. A wafer laser stealth dicing method, characterized in that the wafer is diced using the wafer laser stealth dicing apparatus as claimed in claim 1, comprising the steps of:

providing a wafer with a preset groove on the front surface and a protective film adhered on the front surface;

controlling a material sucking mechanism to suck the back of the wafer;

controlling a loading driving mechanism to drive a loading platform to move to be in butt joint with the material sucking mechanism;

controlling the material transferring driving mechanism to drive the material sucking mechanism to move towards the material loading platform, and placing the wafer on the material loading platform;

controlling the material loading driving mechanism to drive the material loading platform to move so as to drive the wafer to move to be in butt joint with the laser emitting device;

controlling the laser emitting device to emit laser according to the shape of the preset groove to act on the back of the wafer on the material loading platform so as to cut the wafer;

controlling the material loading driving mechanism to drive the material loading platform to move so as to drive the cut wafer to move to be in butt joint with the material sucking mechanism;

controlling the material transferring driving mechanism to drive the material sucking mechanism to move so as to suck the cut wafer, and transferring the cut wafer to the film sticking device;

and controlling the film sticking device to stick an adhesive film on the back of the wafer.

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