CN113221583B - Intelligent chip burning equipment - Google Patents
Intelligent chip burning equipment Download PDFInfo
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- CN113221583B CN113221583B CN202110618551.4A CN202110618551A CN113221583B CN 113221583 B CN113221583 B CN 113221583B CN 202110618551 A CN202110618551 A CN 202110618551A CN 113221583 B CN113221583 B CN 113221583B
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- 238000001179 sorption measurement Methods 0.000 claims abstract description 48
- 238000009423 ventilation Methods 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 238000007664 blowing Methods 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
- G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides intelligent chip burning equipment, which is characterized in that a first screw motor drives a bearing disc to move, so that a row of bearing grooves are positioned under an adsorption pipe. The second screw motor drives the telescopic assembly to move to the upper part of one receiving groove, and the telescopic cylinder drives the adsorption pipe to be inserted into the receiving groove through the ventilation box. The air extractor sucks air through the air suction pipe, the ventilation box and the adsorption pipe to adsorb the chips in the bearing groove. The telescopic cylinder drives the adsorption tube through the ventilation box to take out the chip from the receiving groove. The second screw motor drives the adsorption tube to move the chip to the upper part of the burning groove through driving the telescopic assembly. The telescopic cylinder drives the adsorption tube through the ventilation box to put the chip into the burning groove. The air extractor stops working, and the telescopic cylinder drives the adsorption tube to be extracted from the burning groove. The third screw rod motor drives the arc-shaped connecting column to rotate, the arc-shaped connecting column rotates to drive the cover plate to cover the burning groove through the connecting plate, and the chip burning machine completes burning work on chips in the burning groove.
Description
Technical Field
The invention relates to the field of tubular profile processing, in particular to intelligent chip burning equipment.
Background
A chip is a generic term for semiconductor device products, and an integrated circuit, also called a thin film integrated circuit, is fabricated on the surface of a semiconductor chip. Another thick film integrated circuit is a miniaturized circuit comprised of separate semiconductor devices and passive components integrated into a substrate or wiring board. After the transistor is invented and mass-produced, various solid semiconductor components such as diodes and transistors are largely used, so that the functions and roles of the vacuum tube in the circuit are replaced. Advances in semiconductor fabrication technology have been made in the middle and late 20 th century. It is a tremendous advancement that integrated circuits can integrate a large number of micro-transistors into a small chip, as opposed to manually assembled circuits using individual discrete electronic components. The modular approach to circuit design ensures that standardized integrated circuits are quickly employed to replace discrete transistors designed for use. .
However, integrated circuits have two major advantages for discrete transistors: cost and performance. The cost is low because the chip prints all the components as a unit by photolithographic techniques rather than just making one transistor at a time. The high performance is due to the fast switching of the components, consuming less energy, because the components are small and close to each other. The chip needs to be burned after leaving the factory, and a specific program is written into the chip, but the traditional chip burning device has low efficiency of burning the chip.
Disclosure of Invention
Based on this, it is necessary to provide an intelligent chip burning device for solving the technical problem that the efficiency of burning chips by the conventional chip burning device is low.
An intelligent chip burning device, the intelligent chip burning device comprising: the chip burning device comprises a bearing table, a chip bearing mechanism, a chip moving mechanism, a chip burning mechanism and a control mechanism; the chip receiving mechanism, the chip moving mechanism and the chip burning mechanism are all arranged on the bearing table;
the chip receiving mechanism comprises a first screw motor and a receiving disc, the first screw motor is arranged on the bearing table, and the first screw motor is in driving connection with the receiving disc; the bearing disc is provided with a plurality of bearing grooves for bearing chips;
The chip moving mechanism comprises a support frame, a second screw motor, a telescopic assembly and an adsorption assembly; the support frame is connected with the bearing table and arranged above the bearing disc, and the second screw rod motor is arranged on the support frame; the telescopic assembly comprises a connecting cylinder and a telescopic cylinder, the second screw rod motor is in driving connection with the connecting cylinder, and the telescopic cylinder is at least partially accommodated in the connecting cylinder and is connected with the connecting cylinder; the connecting cylinder is provided with an air inlet hole and a telescopic hole; the adsorption component comprises an air extractor, an air exhaust pipe, a ventilation box and an adsorption pipe; the air extractor is communicated with the ventilation box through the air extraction pipe, and the ventilation box is communicated with the adsorption pipe; the ventilation box is accommodated in the connecting cylinder, the telescopic cylinder is in driving connection with the ventilation box, and the exhaust pipe penetrates into the connecting cylinder through the air inlet hole; the telescopic hole is matched with the adsorption tube, and the telescopic cylinder drives the adsorption tube to pass through the telescopic hole to move close to or far away from the bearing disc through the ventilation box;
The chip burning mechanism comprises a chip burning machine, a bearing frame and a cover assembly; the chip burner and the bearing frame are connected with the bearing table; the writing end of the chip writing machine penetrates through the bearing frame, a writing groove is formed in the writing end of the chip writing machine, a chip to be written finishes writing work in the writing groove, and the writing groove is positioned below the adsorption tube; the cover assembly comprises a third screw motor, two driving columns, a connecting column, two springs, an arc-shaped connecting column, a connecting plate and a cover plate; the third screw rod motor is connected with the bearing frame and is in driving connection with the connecting column through two driving columns; one end of the arc-shaped connecting column is rotationally connected with the bearing frame, the other end of the arc-shaped connecting column is connected with the connecting plate, and the cover plate is connected with one surface of the connecting plate, which is opposite to the arc-shaped connecting column; each end of the connecting post is rotationally connected with one spring, and each end of the connecting plate is rotationally connected with one end of one spring far away from the connecting post; the third screw rod motor drives the arc-shaped connecting column to rotate through the two driving columns, the connecting column, the two springs and the connecting plate, and the arc-shaped connecting column rotates to drive the cover plate to cover the recording groove through the connecting plate;
The first screw motor, the second screw motor, the telescopic cylinder, the air extractor, the chip burner and the third screw motor are all electrically connected with the control mechanism.
In one embodiment, the intelligent chip burning device comprises two chip burning mechanisms, and the two chip burning mechanisms are respectively arranged at two sides of the chip receiving mechanism.
In one embodiment, each of the receiving grooves is uniformly formed on the receiving tray.
In one embodiment, the receiving grooves are uniformly arranged on the receiving disc in an array.
In one embodiment, the cover assembly further comprises a bearing plate, the bearing plate is connected with the bearing frame, two sliding holes are formed in the bearing plate, the sliding holes are matched with the driving columns, and each driving column is inserted into one sliding hole and is in sliding connection with the bearing plate.
In one embodiment, the chip writer is provided with a warning lamp, and the warning lamp displays different lights in the writing process and after the writing is completed.
In one embodiment, the control mechanism further comprises a display screen, and the display screen displays the burning condition of the chip in the tray.
In one embodiment, the adsorption assembly further comprises a blower, a blowing end of the blower is communicated with the ventilation box, and the blower is electrically connected with the control mechanism.
In one embodiment, the control mechanism is disposed on the carrier.
In one embodiment, each end of the connecting post is connected to one of the drive posts.
In the working process of the intelligent chip burning equipment, the first screw motor drives the bearing disc to move, so that a row of bearing grooves are located under the adsorption tube. The second screw motor drives the telescopic assembly to move to the upper part of one receiving groove, and the telescopic cylinder drives the adsorption pipe to be inserted into the receiving groove through the ventilation box. The air extractor sucks air through the air suction pipe, the ventilation box and the adsorption pipe to adsorb the chips in the bearing groove. The telescopic cylinder drives the adsorption tube through the ventilation box to take out the chip from the receiving groove. The second screw motor drives the adsorption tube to move the chip to the upper part of the burning groove through driving the telescopic assembly. The telescopic cylinder drives the adsorption tube through the ventilation box to put the chip into the burning groove. The air extractor stops working, and the telescopic air cylinder drives the adsorption tube to be extracted from the burning groove through the ventilation box. The third screw rod motor drives the arc-shaped connecting column to rotate through the two driving columns, the connecting column, the two springs and the connecting plate, the arc-shaped connecting column rotates to drive the cover plate to cover the burning groove through the connecting plate, and the chip burning machine finishes burning work on chips in the burning groove. After the burning operation is completed, the cover assembly lifts the cover plate from the burning groove. The telescopic cylinder drives the adsorption tube to put the chip into the burning groove through the ventilation box, the air extractor works, and the burnt chip is adsorbed on the adsorption tube. The second screw motor drives the adsorption tube to move the chip to the upper part of an empty receiving groove through driving the telescopic assembly, the telescopic cylinder drives the adsorption tube to put the chip into the burning groove through the ventilation box, the air extractor stops working, and the burnt chip is put back into the receiving groove. All chips in the tray are burned in this cycle. The intelligent chip burning device has high efficiency of burning chips.
Drawings
FIG. 1 is a schematic diagram of a smart chip burning device according to an embodiment;
FIG. 2 is a schematic diagram of a smart chip recording device according to another embodiment;
FIG. 3 is a schematic diagram of a chip burning mechanism according to an embodiment;
fig. 4 is a schematic view of a part of the structure of the chip moving mechanism in one embodiment.
Detailed Description
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Referring to fig. 1 to 4, the present invention provides a smart chip recording apparatus 10, where the smart chip recording apparatus 10 includes: a carrier 100, a chip receiving mechanism 200, a chip moving mechanism 300, a chip burning mechanism 400, and a control mechanism 500. The chip receiving mechanism 200, the chip moving mechanism 300 and the chip burning mechanism 400 are all disposed on the carrier 100.
The chip receiving mechanism 200 includes a first screw motor 210 and a receiving tray 220, the first screw motor 210 is disposed on the carrying platform 100, and the first screw motor 210 is in driving connection with the receiving tray 220. The receiving tray 220 is provided with a plurality of receiving slots 201 for receiving chips. In this embodiment, each receiving groove 201 is uniformly formed on the receiving plate 220. Further, each receiving groove 201 is uniformly formed on the receiving plate 220 in an array.
The chip moving mechanism 300 includes a support frame 310, a second screw motor 320, a telescopic assembly 330, and an adsorption assembly 340. The support frame 310 is connected with the bearing table 100 and is arranged above the bearing plate 220, and the second screw motor 320 is arranged on the support frame 310. The telescopic assembly 330 includes a connecting cylinder 331 and a telescopic cylinder 332, the second screw motor 320 is in driving connection with the connecting cylinder 331, and the telescopic cylinder 332 is at least partially accommodated in the connecting cylinder 331 and is connected with the connecting cylinder 331. The connecting tube 331 is provided with an air inlet 301 and a telescopic hole 302. The suction assembly 340 includes an air pump 341, an air suction pipe 342, a ventilation box 343, and a suction pipe 344. The air extractor 341 communicates with a ventilation box 343 through an air extraction pipe 342, and the ventilation box 343 communicates with an adsorption pipe 344. The ventilation box 343 is accommodated in the connecting cylinder 331, the telescopic cylinder 332 is in driving connection with the ventilation box 343, and the air suction pipe 342 penetrates into the connecting cylinder 331 through the air inlet 301. The telescopic hole 302 is matched with the adsorption pipe 344, and the telescopic cylinder 332 drives the adsorption pipe 344 to move close to or away from the bearing plate 220 through the telescopic hole 302 through the ventilation box 343.
In the present embodiment, the smart chip writing apparatus 10 includes two chip writing mechanisms 400, and the two chip writing mechanisms 400 are respectively disposed on two sides of the chip receiving mechanism 200, so as to further increase the writing efficiency of the smart chip writing apparatus 10. The chip burning mechanism 400 includes a chip burner 410, a carrier 420, and a cover assembly 430. The chip writer 410 and the carrier 420 are both connected to the carrier 100. The writing end of the chip writer 410 passes through the carrier 420, the writing end of the chip writer 410 is provided with a writing groove 401, the chip to be written completes writing work in the writing groove 401, and the writing groove 401 is positioned below the adsorption tube 344. The cover assembly 430 includes a third lead screw motor 431, two drive posts 432, a connecting post 433, two springs 434, an arcuate connecting post 435, a web 436, and a cover 437. The third screw motor 431 is connected to the carrier 420, and the third screw motor 431 is drivingly connected to the connection post 433 through two driving posts 432. In this embodiment, each end of the connection post 433 is connected to a driving post 432. One end of the arc-shaped connecting column 435 is rotatably connected with the bearing frame 420, the other end of the arc-shaped connecting column 435 is connected with the connecting plate 436, and the cover plate 437 is connected with one surface of the connecting plate 436 opposite to the arc-shaped connecting column 435. Each end of the connecting post 433 is rotatably connected to a spring 434, and each end of the connecting plate 436 is rotatably connected to an end of the spring 434 remote from the connecting post 433. The third screw motor 431 drives the arc-shaped connecting column 435 to rotate through the two driving columns 432, the connecting column 433, the two springs 434 and the connecting plate 436, and the arc-shaped connecting column 435 rotates to drive the cover plate 437 to cover the recording groove 401 through the connecting plate 436.
The first screw motor 210, the second screw motor 320, the telescopic cylinder 332, the air pump 341, the chip burner 410, and the third screw motor 431 are electrically connected to the control mechanism 500. The control mechanism 500 coordinates the operation of the first screw motor 210, the second screw motor 320, the telescopic cylinder 332, the air extractor 341, the chip burner 410 and the third screw motor 431, and ensures the stable operation of the intelligent chip burner apparatus 10. In this embodiment, the control mechanism is a lower computer. Specifically, the control mechanism is a PLC, and in other embodiments, the control mechanism is a single chip microcomputer. In yet another embodiment, the control mechanism includes an upper computer and a lower computer, the upper computer being electrically connected to the lower computer.
In order to show the burning status of the chips in the tray 220, in one embodiment, the control mechanism 500 is disposed on the carrying platform 100, the control mechanism 500 further includes a display screen 510, and the display screen 510 displays the burning status of the chips in the tray 220, specifically, the display screen 510 may display which of the receiving slots 201 in the tray 220 have completed burning, and which of the chips in the receiving slots 201 have not yet been burned. Further, in one embodiment, the chip writer 410 is provided with a warning light, and the warning light is different between the light displayed during the writing process and the light displayed after the writing process, so as to observe and determine whether the writing of the chip in the writing slot 401 in the writing end of the chip writer 410 is completed. In this way, the display 510 facilitates displaying the burning status of the chips in the tray 220.
In order to increase the working stability of the capping assembly 430, in one embodiment, the capping assembly 430 further includes a receiving plate 438, the receiving plate 438 is connected to the carrier 420, two sliding holes 402 are formed in the receiving plate 438, the sliding holes 402 are adapted to the driving posts 432, and each driving post 432 is inserted into one sliding hole 402 and is slidably connected to the receiving plate 438. The sliding hole 402 further defines the trajectory of the drive post 432, providing operational stability of the closure assembly 430. Further, the receiving plate 438 is provided with a linear bearing in each sliding hole 402, the linear bearing is matched with the driving post 432, and the driving post 432 is inserted into and slidably connected with the linear bearing. The linear bearings prevent the drive post 432 and the receiving plate 438 from directly making hard contact, prevent the drive post 432 and the receiving plate 438 from wearing away from each other, and reduce friction generated by sliding the drive post 432 relative to the receiving plate 438. In this way, the operational stability of the capping assembly 430 is improved.
To improve the burning efficiency of the smart chip burning apparatus 10, in one embodiment, the adsorption assembly 340 further includes a blower 345, the blowing end of the blower 345 is in communication with the ventilation box 343, and the blower 345 is electrically connected to the control mechanism 500. When the chip is placed in the burn-in tank 401 or the receiving tank 201 by the suction unit 340, the blower 345 is turned on and the chip on the suction pipe 344 is blown off simultaneously with the turning off of the air pump 341. It should be noted that, when the suction assembly 340 places the chip in the recording slot 401 or the receiving slot 201, when the air extractor 341 is just turned off, there is a certain suction force in the suction tube 344, and the time required for the chip on the suction tube 344 to fall into the recording slot 401 or the receiving slot 201 due to the gravity effect may affect the recording efficiency of the intelligent chip recording apparatus 10. The chips on the suction pipe 344 can be quickly dropped into the burning groove 401 or the receiving groove 201 by the blowing force of the blower 345. In this way, the blower 345 improves the burning efficiency of the smart chip burning apparatus 10.
In the operation process of the above-mentioned intelligent chip burning apparatus 10, the first lead screw motor 210 drives the receiving tray 220 to move, so that a row of receiving slots 201 are located right below the adsorption tubes 344. The second screw motor 320 drives the telescopic assembly 330 to move over one of the receiving grooves 201, and the telescopic cylinder 332 drives the suction pipe 344 to be inserted into the receiving groove 201 through the ventilation box 343. The suction pump 341 sucks air through the suction pipe 342, the ventilation box 343, and the suction pipe 344 to suck chips in the receiving tank 201. The telescopic cylinder 332 drives the suction pipe 344 through the ventilation box 343 to take out the chip from the receiving tank 201. The second screw motor 320 drives the adsorption tube 344 to move the chip to the upper part of the burning groove 401 by driving the telescopic assembly 330. The telescopic cylinder 332 drives the adsorption tube 344 to put the chip into the burning groove 401 through the ventilation box 343. The air extractor 341 stops working, and the telescopic air cylinder 332 drives the adsorption pipe 344 to be extracted from the burning groove 401 through the ventilation box 343. The third screw rod motor 431 drives the arc-shaped connecting column 435 to rotate through the two driving columns 432, the connecting column 433, the two springs 434 and the connecting plate 436, the arc-shaped connecting column 435 rotates to drive the cover plate 437 to cover the writing groove 401 through the connecting plate 436, and the chip writing machine 410 finishes writing work on chips in the writing groove 401. After the writing operation is completed, the cover assembly 430 lifts the cover plate 437 from the writing slot 401. The telescopic cylinder 332 drives the adsorption tube 344 through the ventilation box 343 to put the chip into the burning groove 401, and the air extractor 341 works to adsorb the burned chip on the adsorption tube 344. The second screw motor 320 drives the adsorption tube 344 to move the chip to a position above the empty receiving groove 201 by driving the telescopic assembly 330, the telescopic air cylinder 332 drives the adsorption tube 344 to place the chip into the burning groove 401 by the ventilation box 343, the air extractor 341 stops working, and the burnt chip is placed back into the receiving groove 201. With this cycle, all chips in the tray 220 are burned. The intelligent chip burning device 10 has high efficiency of burning chips.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (7)
1. An intelligent chip burning device, comprising: the chip burning device comprises a bearing table, a chip bearing mechanism, a chip moving mechanism, a chip burning mechanism and a control mechanism; the chip receiving mechanism, the chip moving mechanism and the chip burning mechanism are all arranged on the bearing table;
the chip receiving mechanism comprises a first screw motor and a receiving disc, the first screw motor is arranged on the bearing table, and the first screw motor is in driving connection with the receiving disc; the bearing disc is provided with a plurality of bearing grooves for bearing chips;
The chip moving mechanism comprises a support frame, a second screw motor, a telescopic assembly and an adsorption assembly; the support frame is connected with the bearing table and arranged above the bearing disc, and the second screw rod motor is arranged on the support frame; the telescopic assembly comprises a connecting cylinder and a telescopic cylinder, the second screw rod motor is in driving connection with the connecting cylinder, and the telescopic cylinder is at least partially accommodated in the connecting cylinder and is connected with the connecting cylinder; the connecting cylinder is provided with an air inlet hole and a telescopic hole; the adsorption component comprises an air extractor, an air exhaust pipe, a ventilation box and an adsorption pipe; the air extractor is communicated with the ventilation box through the air extraction pipe, and the ventilation box is communicated with the adsorption pipe; the ventilation box is accommodated in the connecting cylinder, the telescopic cylinder is in driving connection with the ventilation box, and the exhaust pipe penetrates into the connecting cylinder through the air inlet hole; the telescopic hole is matched with the adsorption tube, and the telescopic cylinder drives the adsorption tube to pass through the telescopic hole to move close to or far away from the bearing disc through the ventilation box;
The chip burning mechanism comprises a chip burning machine, a bearing frame and a cover assembly; the chip burner and the bearing frame are connected with the bearing table; the writing end of the chip writing machine penetrates through the bearing frame, a writing groove is formed in the writing end of the chip writing machine, a chip to be written finishes writing work in the writing groove, and the writing groove is positioned below the adsorption tube; the cover assembly comprises a third screw motor, two driving columns, a connecting column, two springs, an arc-shaped connecting column, a connecting plate and a cover plate; the third screw rod motor is connected with the bearing frame and is in driving connection with the connecting column through two driving columns; one end of the arc-shaped connecting column is rotationally connected with the bearing frame, the other end of the arc-shaped connecting column is connected with the connecting plate, and the cover plate is connected with one surface of the connecting plate, which is opposite to the arc-shaped connecting column; each end of the connecting post is rotationally connected with one spring, and each end of the connecting plate is rotationally connected with one end of one spring far away from the connecting post; the third screw rod motor drives the arc-shaped connecting column to rotate through the two driving columns, the connecting column, the two springs and the connecting plate, and the arc-shaped connecting column rotates to drive the cover plate to cover the recording groove through the connecting plate;
the first screw motor, the second screw motor, the telescopic cylinder, the air extractor, the chip burner and the third screw motor are all electrically connected with the control mechanism;
The chip burner is provided with a warning lamp, and the warning lamp displays different lights in the burning process and after the burning is completed;
the control mechanism also comprises a display screen, wherein the display screen displays the burning condition of the chip in the tray;
The adsorption component further comprises a blower, the blowing end of the blower is communicated with the ventilation box, and the blower is electrically connected with the control mechanism.
2. The intelligent chip burning apparatus according to claim 1, wherein the intelligent chip burning apparatus comprises two chip burning mechanisms, and the two chip burning mechanisms are respectively arranged at two sides of the chip receiving mechanism.
3. The smart chip burning apparatus of claim 1, wherein each of the receiving grooves is uniformly formed on the receiving tray.
4. The smart chip burning apparatus of claim 3, wherein each of the receiving slots is uniformly arranged on the receiving tray in an array.
5. The smart chip burning apparatus as claimed in claim 1, wherein the cover assembly further comprises a receiving plate, the receiving plate is connected to the carrier, two sliding holes are formed in the receiving plate, the sliding holes are adapted to the driving columns, and each driving column is inserted into one of the sliding holes and is slidably connected to the receiving plate.
6. The smart chip burning apparatus of claim 1 wherein the control mechanism is disposed on the carrier.
7. The smart chip burning apparatus of claim 1, wherein each end of the connection post is connected to one of the driving posts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110618551.4A CN113221583B (en) | 2021-06-03 | 2021-06-03 | Intelligent chip burning equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110618551.4A CN113221583B (en) | 2021-06-03 | 2021-06-03 | Intelligent chip burning equipment |
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| Publication Number | Publication Date |
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| CN113221583A CN113221583A (en) | 2021-08-06 |
| CN113221583B true CN113221583B (en) | 2024-05-24 |
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| CN202110618551.4A Active CN113221583B (en) | 2021-06-03 | 2021-06-03 | Intelligent chip burning equipment |
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| CN114153470A (en) * | 2021-11-27 | 2022-03-08 | 徐州中科电子科技有限公司 | IC chip burner |
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