CN217444352U - Wafer semiconductor curing equipment - Google Patents

Abstract

The utility model provides a wafer semiconductor curing device, which comprises a base and a supply and receiving unit arranged on the base, wherein the supply and receiving unit comprises a wafer supply bin and a wafer receiving bin which are arranged on the base, and the wafer supply bin is used for storing wafers to be detected; the base is provided with a moving mechanism for taking and placing the wafer, and the moving mechanism comprises a wafer reversing disc and a driving unit for driving the wafer reversing disc to move and rotate; still be equipped with the solidification unit that carries out the solidification to the mark on the wafer on the base, the wafer that supplies in the film storehouse is taken to the disc that reverses removes to check out test set, and the disc that reverses takes and detects and mark the wafer that has photosensitive ink in the solidification storehouse through check out test set, shifts to the receipts film storehouse by the disc that reverses after the light source body solidifies the mark. The utility model discloses a wafer semiconductor curing equipment, by moving get the mechanism will supply in the piece storehouse the wafer of mark to transfer to the solidification storehouse in, then will solidify the good wafer and transfer to the piece storehouse in, utilize the characteristic of photosensitive ink to accelerate the solidification of mark, and then improve the production efficiency of wafer.

Description

Wafer semiconductor curing equipment

Technical Field

The utility model relates to the field of semiconductor technology, in particular to wafer semiconductor curing equipment.

Background

China has become the largest GPP process device market worldwide, and the demand of test equipment is rapidly increasing in the range of two digits per year. Meanwhile, with the miniaturization of the size of the chip, the existing testing means and efficiency can not meet the requirements, and the requirement on the knowledge level of testing process personnel is higher and higher.

The high-speed semiconductor wafer transmission robot becomes necessary supporting equipment in the production and manufacturing process of semiconductor chips, the production and manufacturing cost and risk of the wafer chips are reduced to a great extent, the technical innovation of electronic device testing technology can be realized, and the development of electronic information industry in China is promoted. Meanwhile, the manual work is replaced, the production efficiency and the test accuracy are improved, the physical and mental health of workers is protected, and the occupational injury risk is reduced.

The technical indexes of the existing semiconductor wafer transmission robot are difficult to meet the use requirements of related semiconductor detection equipment, the semiconductor wafer transmission robot is a key component of the related semiconductor detection equipment, the performance of the detection equipment is determined, and the performance of the related semiconductor detection equipment is directly influenced by the quality of the semiconductor wafer transmission robot, so that the designed high-speed semiconductor wafer transmission robot with the performance indexes meeting the use requirements of the related semiconductor detection equipment, low cost and high cost performance, which is easy to process, has high application value.

The existing semiconductor wafer transmission robot is short of a drying device, wafers need to be placed into a material box with a partition plate after being tested and marked by conventional ink, after the material box is fully collected, the wafers are conveyed into the drying box manually, the working difficulty of an operator is increased, the manual conveying accumulated time is long, the drying time is also long, the wafers need to be cooled to the room temperature after being dried, and the next procedure can be carried out, so that the labor and the time are wasted.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention is directed to a wafer semiconductor curing apparatus for rapidly drying a wafer, thereby improving the production efficiency of the wafer.

In order to achieve the above purpose, the technical scheme of the utility model is realized like this:

a wafer semiconductor curing device comprises a base and a supply and receiving unit arranged on the base, wherein the supply and receiving unit comprises a wafer supply bin and a wafer receiving bin which are arranged on the base, and the wafer supply bin is used for storing a wafer to be detected; the base is provided with a moving mechanism for taking and placing the wafer, and the moving mechanism comprises a wafer reversing disc and a driving unit for driving the wafer reversing disc to move and rotate; still be equipped with on the base right mark on the wafer carries out the solidification unit of solidification, the solidification unit is including solidification storehouse and locating the light source body in the solidification storehouse, the rewinding dish is taken supply in the piece storehouse the wafer removes to check out test set, the rewinding dish is taken the warp check out test set detects and is marked with photosensitive ink the wafer extremely in the solidification storehouse, the warp the light source body is right after the mark solidification by the rewinding dish shifts to receive the piece storehouse.

Furthermore, the driving unit comprises a rotary table and a first electric cylinder fixed on the rotary table, the rotary table drives the first electric cylinder to rotate, and the film reversing disc is connected with the first electric cylinder to drive the film reversing disc to move.

Furthermore, the inverted disc is U-shaped and is provided with two supporting legs with suspended end parts, and vacuum suction holes are arranged on the supporting legs at intervals.

Furthermore, the driving unit further comprises a third electric cylinder arranged on the base, the rotary table is positioned on the third electric cylinder, and a towline slot for fixing the wiring is arranged beside the third electric cylinder.

Furthermore, a sheet supply tray is arranged in the sheet supply bin, a sheet receiving tray is arranged in the sheet receiving bin, and separation blade columns are arranged on the sheet supply tray and the sheet receiving tray.

Furthermore, the separation blade post is for arranging a plurality ofly on supplying the piece tray with receive the piece tray, the disc of falling the piece inserts between two adjacent separation blade posts, the disc of falling the piece is taken out and is made the wafer fall into supply the piece tray or receive on the piece tray.

Furthermore, a guiding moving unit is arranged on one side of the sheet supplying tray and/or the sheet receiving tray, which deviates from the separation blade column.

Further, the direction mobile unit is including vertical locating mounting panel on the base, and fix second electric jar on the mounting panel, the second electric jar with supply piece tray and/or receive piece tray fixed connection.

Furthermore, the wafer supply bin is provided with a suction unit which can move and suck the wafer.

Further, the sucking unit comprises a sucking disc which is driven to move and arranged at the top of the film supply bin.

Compared with the prior art, the utility model discloses following advantage has:

wafer semiconductor curing equipment, be stored in supplying the film storehouse by the wafer, and send the wafer to the check out test set on and detect the mark by moving to get the mechanism, then by the wafer of mark in the wafer transfers to the solidification storehouse by the rewinding dish, the light source body in the solidification storehouse can shine the photosensitive ink on the wafer, thereby carry out fast curing with the mark on the wafer, then through moving to get the mechanism and shift to the film storehouse with the good wafer of solidification in, move to get the mechanism and can replace artifical the realization to the transfer of wafer, and utilize the characteristic of photosensitive ink to accelerate the solidification of mark, and then improve the production efficiency of wafer.

In addition, vacuum suction holes are formed in the supporting legs of the wafer reversing disc, so that certain adsorption to the wafer can be guaranteed in the wafer moving process, and the wafer is prevented from falling in the moving process to cause damage to the wafer.

In addition, supply the separation blade post on piece tray and the receipts piece tray, can carry on spacingly to the wafer, and make the wafer pile up more stable when supplying the piece tray and receiving on the piece tray.

In this embodiment, utilize the sucking disc that supplies the piece storehouse top, can adsorb the wafer that supplies on the piece tray topmost, then the dish of falling the piece can stretch into the below of wafer in order to lift the wafer, and then can shift the wafer.

Drawings

The accompanying drawings, which form a part of the present disclosure, are provided to provide a further understanding of the present disclosure, and the exemplary embodiments and descriptions thereof are provided to explain the present disclosure, wherein the related terms in the front, back, up, down, and the like are only used to represent relative positional relationships, and do not constitute an undue limitation of the present disclosure. In the drawings:

fig. 1 is a schematic view of an overall structure of a wafer semiconductor curing apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view of portion A of FIG. 1;

fig. 3 is a schematic structural diagram of a wafer semiconductor curing apparatus according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a supply and receiving unit according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a wafer semiconductor curing apparatus according to an embodiment of the present invention.

Description of reference numerals:

1. a base; 10. mounting a plate; 100. a second electric cylinder; 11. an alarm lamp; 20. a sheet supply bin; 200. a sheet supply tray; 201. a catch column; 202. a suction cup; 21. a film collecting bin; 210. a sheet collecting tray; 30. a sheet reversing disc; 300. a support leg; 301. vacuum suction holes; 310. a turntable; 311. a first electric cylinder; 312. a third electric cylinder; 313. a towline slot; 40. a curing bin; 5. and (5) a wafer.

Detailed Description

It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.

In the description of the present invention, it should be noted that, if terms indicating orientation or positional relationship such as "upper", "lower", "inner", "outer", etc. appear, they are based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the appearances of the terms first, second, etc. in this specification are not necessarily all referring to the same item, but are to be construed as indicating or implying any particular importance.

In addition, in the description of the present invention, the terms "mounted," "connected," and "connecting" are to be construed broadly unless otherwise specifically limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. To those of ordinary skill in the art, the specific meaning of the above terms in the present invention can be understood in combination with the specific situation.

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

The embodiment relates to a wafer semiconductor curing device, which comprises a base 1 and a supply and receiving unit arranged on the base 1, wherein the supply and receiving unit comprises a wafer supply bin 20 and a wafer receiving bin 21 which are arranged on the base 1, and the wafer supply bin 20 is used for storing a wafer 5 to be detected; the base 1 is provided with a moving mechanism for taking and placing the wafer 5, and the moving mechanism comprises a wafer reversing disc 30 and a driving unit for driving the wafer reversing disc 30 to move and rotate; still be equipped with the solidification unit that carries out the solidification to the mark on the wafer 5 on the base 1, the solidification unit includes solidification storehouse 40 and locates the light source body in the solidification storehouse 40, and the wafer 5 that supplies in the film storehouse 20 is taken to the rewinding dish 30 removes to check out test set, and the rewinding dish 30 takes and detects and mark the wafer 5 that has photosensitive ink in the solidification storehouse 40 through check out test set, shifts to receiving the film storehouse 21 by the rewinding dish 30 after the light source body solidifies the mark.

Like the structure, wafer 5 that awaits measuring is stored in supplying magazine 20, and send wafer 5 to the check out test set by moving the mechanism and carry out the detection mark, then by the wafer 5 of mark transfer to solidification storehouse 40 in by the rewinding dish 30, the light source body in the solidification storehouse 40 can shine the photosensitive ink on wafer 5, thereby carry out fast curing with the mark on wafer 5, then transfer the wafer 5 that the solidification is good to collection storehouse 21 in through moving the mechanism of getting, it can replace artifical realization to transfer wafer 5 to move the mechanism of getting, and utilize the characteristic of photosensitive ink to accelerate the solidification of mark, and then improve wafer 5's production efficiency.

Based on the above overall design, an exemplary structure of the wafer semiconductor curing apparatus of the present embodiment is shown in fig. 1 and fig. 2, it should be noted that the related detecting apparatus is a probe station, the detecting apparatus is disposed on one side of the base, the wafer 5 is sent to the detecting apparatus by the reversing disc 30 for detecting and marking, and then the reversing disc 30 transfers the wafer 5 marked with the photosensitive ink into the curing bin 40. In addition, the light source body in the curing bin 40 can emit light sources with specific wave bands, such as violet light, red light, etc., and the photosensitive ink for marking the wafer 5 can select specific ink corresponding to the light sources of violet light, red light, etc., and the photosensitive ink can be cured quickly through the irradiation of the light source body, so that the drying time of the wafer 5 is reduced, and the production efficiency of the wafer 5 is improved.

Referring to fig. 3, the driving unit includes a rotary table 310, and a first electric cylinder 311 fixed on the rotary table 310, the rotary table 310 drives the first electric cylinder 311 to rotate, and the rewind disk 30 is connected to the first electric cylinder 311 to drive the rewind disk 30 to move. The wafer reversing disc 30 can drive the wafer 5 to move, and the substrate 1 is provided with the wafer feeding bin 20 and the wafer collecting bin 21, and the wafer feeding bin 20 and the wafer collecting bin 21 are respectively arranged at two positions on the substrate 1, so that the turntable 310 is used for adjusting the angle of the wafer reversing disc 30, and the first electric cylinder 311 is used for adjusting the position of the wafer reversing disc 30 so as to move the wafer 5. Wherein, the rotary table 310 only needs to adopt an electric rotary table.

In this embodiment, referring back to fig. 2, in order to prevent the wafer 5 from falling off during the movement, as a preferred embodiment, the flip-chip tray 30 is U-shaped and has two legs 300 with suspended ends, and vacuum suction holes 301 are disposed on each leg 300 at intervals. The vacuum suction holes 301 can ensure that the wafer 5 is adsorbed to a certain extent in the process of moving the wafer 5, so that the wafer 5 is prevented from falling off in the moving process to cause damage to the wafer 5.

Referring back to fig. 1, in order to enlarge the moving range of the driving unit, the driving unit further includes a third electric cylinder 312 disposed on the base 1, the turntable 310 is disposed on the third electric cylinder 312, and a towing line groove 313 for fixing a wire is disposed beside the third electric cylinder 312. The first electric cylinder 311 and the third electric cylinder 312 are used for adjusting the distance between the rewinding disc 30 and the supply and receiving unit, and the first electric cylinder and the third electric cylinder cooperate with the rotary table 310 to drive the rewinding disc 30.

In addition, as shown in fig. 4, a sheet supply tray 200 is provided in the sheet supply bin 20, a sheet receiving tray 210 is provided in the sheet receiving bin 21, and blocking posts 201 are provided on both the sheet supply tray 200 and the sheet receiving tray 210. It is worth mentioning that both sides of the wafer supply bin 20 and the wafer receiving bin 21 are hollow and penetrate through, and both sides of the wafer supply bin 20 and the wafer receiving bin 21 penetrate through are convenient for a worker to take the wafer 5 to be detected from one side on one hand, and the wafer 5 can be taken from the other side by the wafer rewinding disc 30 on the other hand. In addition, the blocking posts 201 on the wafer supply tray 200 and the wafer receiving tray 210 can limit the position of the wafer 5, so that the wafer 5 can be more stably stacked on the wafer supply tray 200 and the wafer receiving tray 210.

In this embodiment, the plurality of the catch columns 201 are disposed on the sheet supply tray 200 and the sheet collection tray 210, the reversing disc 30 is inserted between two adjacent catch columns 201, and the reversing disc 30 is drawn out to drop the wafer 5 onto the sheet supply tray 200 or the sheet collection tray 210. Specifically, when the reversing disc 30 lifts the wafer 5 to reach above the supply tray 200 or the collection tray 210, the driving unit controls the reversing disc 30 to move downward, and when the wafer 5 enters between the plurality of catch posts 201, the reversing disc 30 is withdrawn to drop the wafer 5 onto the supply tray 200 or the collection tray 210.

In addition, as shown in fig. 4 and 5, a guide moving unit is provided on a side of the sheet supply tray 200 and the sheet receiving tray 210 facing away from the barrier post 201. Specifically, the guiding and moving unit comprises a mounting plate 10 vertically arranged on the base 1, and a second electric cylinder 100 fixed on the mounting plate 10, wherein the second electric cylinder 100 is fixedly connected with a sheet supplying tray 200 and a sheet receiving tray 210. It can be understood that the second electric cylinders 100 are provided in two, and for the two second electric cylinders 100 to be fixed to the wafer supply tray 200 and the wafer receiving tray 210, respectively, the second electric cylinders 100 can move the wafer supply tray 200 and the wafer receiving tray 210 to adjust the position of the wafer 5 better.

To facilitate the movement of the wafer 5 in the reversing disc 30, referring back to fig. 1, the magazine 20 is provided with a suction unit which is movable and sucks the wafer 5. In this embodiment, the suction unit includes a suction cup 202 disposed at the top of the magazine 20 to be driven to move. The wafer 5 to be detected is located in the wafer supply bin 20, the suction cup 202 at the top of the wafer supply bin 20 can adsorb the topmost wafer 5 on the wafer supply tray 200, then the wafer reversing disc 30 can stretch into the lower part of the wafer 5 to lift the wafer 5, the vacuum suction holes 301 are used for adsorbing the wafer 5, and then the wafer 5 can be transferred.

The wafer semiconductor curing equipment described in this embodiment, during the use, sucking disc 202 adsorbs the wafer 5 that awaits measuring, and take out wafer 5 from supplying in the magazine 20 by the inversion dish 30 and transfer to check out test set, detect and mark wafer 5 through check out test set, transfer wafer 5 to solidification storehouse 40 in by the inversion dish 30 again, the light source body in the solidification storehouse 40 can shine the photosensitive ink on wafer 5, thereby carry out fast curing with the mark on wafer 5, then transfer the wafer 5 that solidifies to in the magazine 21 through the plate of taking off, the mechanism of taking off can replace the manual work to realize the transfer to wafer 5, and utilize the characteristic of photosensitive ink to accelerate the solidification of mark, and then improve wafer 5's production efficiency.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A wafer semiconductor solidification equipment, includes base (1), and locate supply and receive the unit on base (1), its characterized in that:

the feeding and receiving unit comprises a feeding bin (20) and a receiving bin (21) which are arranged on the base (1), and the feeding bin (20) is used for storing the wafer (5) to be detected;

the base (1) is provided with a moving mechanism for taking and placing the wafer (5), the moving mechanism comprises a wafer reversing disc (30) and a driving unit for driving the wafer reversing disc (30) to move and rotate;

still be equipped with on base (1) right mark on wafer (5) carries out the solidification unit that solidifies, the solidification unit is including solidification storehouse (40) and locate the light source body in solidification storehouse (40), wafer reversing disc (30) are taken supply in the magazine (20) wafer (5) remove to check out test set, wafer reversing disc (30) are taken the warp check out test set detects and is marked with photosensitive ink wafer (5) extremely in solidification storehouse (40), the warp the light source body is right after the mark solidification by wafer reversing disc (30) shift to receive a storehouse (21).

2. The wafer semiconductor curing apparatus of claim 1, wherein: the driving unit comprises a rotary table (310) and a first electric cylinder (311) fixed on the rotary table (310), the rotary table (310) drives the first electric cylinder (311) to rotate, and the film backing plate (30) is connected with the first electric cylinder (311) to drive the film backing plate (30) to move.

3. The wafer semiconductor curing apparatus of claim 2, wherein: the inverted sheet tray (30) is U-shaped and is provided with two supporting legs (300) with suspended end parts, and vacuum suction holes (301) which are arranged at intervals are arranged on each supporting leg (300).

4. The wafer semiconductor curing apparatus of claim 2, wherein: the driving unit further comprises a third electric cylinder (312) arranged on the base (1), the rotary table (310) is located on the third electric cylinder (312), and a towline groove (313) used for fixing wiring is arranged beside the third electric cylinder (312).

5. The wafer semiconductor curing apparatus of claim 1, wherein: the film feeding device is characterized in that a film feeding tray (200) is arranged in the film feeding bin (20), a film collecting tray (210) is arranged in the film collecting bin (21), and separation blade columns (201) are arranged on the film feeding tray (200) and the film collecting tray (210).

6. The wafer semiconductor curing apparatus of claim 5, wherein: the separation blade post (201) for arrange supply piece tray (200) with receive a plurality ofly on piece tray (210), the disc of falling the piece (30) insert adjacent two between separation blade post (201), the disc of falling the piece (30) is taken out and is made wafer (5) fall into supply piece tray (200) or receive on the piece tray (210).

7. The wafer semiconductor curing apparatus of claim 5, wherein: and a guiding and moving unit is arranged on one side of the sheet supply tray (200) and/or the sheet collecting tray (210) departing from the separation blade column (201).

8. The wafer semiconductor curing apparatus of claim 7, wherein: the direction mobile unit is including vertical locating mounting panel (10) on base (1), and fix second electric jar (100) on mounting panel (10), second electric jar (100) with supply piece tray (200) and/or receive piece tray (210) fixed connection.

9. The wafer semiconductor curing apparatus of any one of claims 1-8, wherein: the wafer supply bin (20) is provided with a suction unit which can move and suck the wafer (5).

10. The wafer semiconductor curing apparatus of claim 9, wherein: the sucking unit comprises a sucking disc (202) which is driven to move and is arranged at the top of the tablet supply bin (20).

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