CN111739833B - Chip crimping joint vacuum hole through hole device - Google Patents
Chip crimping joint vacuum hole through hole device Download PDFInfo
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- CN111739833B CN111739833B CN202010640893.1A CN202010640893A CN111739833B CN 111739833 B CN111739833 B CN 111739833B CN 202010640893 A CN202010640893 A CN 202010640893A CN 111739833 B CN111739833 B CN 111739833B
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- 238000002788 crimping Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 abstract description 10
- 238000004140 cleaning Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a chip crimping connector vacuum hole through hole device, which comprises: the shell is provided with a positioning groove and a thimble perforation which penetrates through the bottom of the positioning groove. The vertical supporting piece is arranged on the shell in an axial sliding manner along the thimble through hole and is provided with a plurality of thimbles arranged corresponding to the thimble through holes; the connecting piece is rotatably installed on the shell through the rotating shaft and is provided with a first connecting rod and a second connecting rod which are obliquely and crosswise arranged. And the driving assembly drives the first connecting rod to rotate around the rotating shaft. The second connecting rod has the stiff end of being connected fixedly with first connecting rod and the free end that sets up with the stiff end relatively, and the free end pushes vertical support piece rebound under the effect of first connecting rod and resets the removal down after the pushing force disappears. Compared with the mode of detaching the chip crimping head in the prior art, the method has the advantage that the cleaning of the vacuum hole is convenient and simpler.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a chip compression joint vacuum hole through hole device.
Background
The semiconductor packaging technology is developed rapidly, and various chips can protect the chips and prevent the chips from being affected with damp by virtue of the packaging technology, and the internal conducting lines of the chips are guided to be electrically connected with the conducting wires of the printed circuit board. However, for the packaged chip, a good heat dissipation technology is further required to protect the internal circuit thereof, so as to prevent the chip from generating excessive heat energy during the operation process to affect the performance of the chip.
In the process of chip packaging technology, a chip needs to be fixed on a substrate, and particularly, a metal bump on the chip needs to be connected and fixed on a pin on the substrate. In the conventional packaging apparatus, a die bonding head 100 is generally disposed on a carrier stage of a substrate, as shown in fig. 1-2. The chip is transferred to the chip crimping head 100 through the carrying claw, a vacuum hole 101 is formed in the chip crimping head 100, negative pressure is connected to the vacuum hole 101, the chip is adsorbed on the chip crimping head 100 through the negative pressure, and the chip moves towards the direction close to the substrate along with the chip crimping head 100. The chip crimping head 100 is a high-temperature device, the temperature on the chip crimping head 100 is transmitted to the chip and melts the metal bumps on the chip, and the melted metal bumps are connected with the pins on the substrate together, so that the chip and the substrate are connected and fixed.
When the die bonding head 100 adsorbs the back surface of the die in the actual production process, the residual glue often remains on the back surface of the wafer, and the residual glue easily enters the vacuum holes 101 of the die bonding head 100 in the adsorption process of negative pressure and melts and adheres to the inner side walls of the vacuum holes 101 under the action of the high-temperature die bonding head 100, so that the vacuum holes 101 are easily blocked after long-term use. Need clear up chip crimping head 100's vacuum hole 101 after blockking up, the clearance mode of prior art is for cooling chip crimping head 100 to the normal atmospheric temperature earlier, then dismantles chip crimping head 100 from crimping head supporting seat 200 and finally clears up vacuum hole 101 with the top. The adoption of the cleaning mode not only causes the complex and repeated disassembly of the cleaning, but also easily causes the damage of the chip crimping connector 100 and the falling of the metal foreign matters, thereby influencing the product quality.
Disclosure of Invention
The invention aims to provide a chip crimping head vacuum hole through hole device, which can be used for solving the defects in the prior art and conveniently cleaning a vacuum hole.
The invention provides a chip compression joint vacuum hole through hole device,
the method comprises the following steps: the shell is provided with a positioning groove and a thimble perforation which penetrates through the bottom of the positioning groove;
the vertical supporting piece is arranged on the shell in an axial sliding mode along the thimble through hole and is provided with a plurality of thimbles arranged corresponding to the thimble through holes;
the connecting piece is rotatably arranged on the shell through a rotating shaft and is provided with a first connecting rod and a second connecting rod which are obliquely crossed;
the driving component drives the first connecting rod to rotate around the rotating shaft;
the second connecting rod have with first connecting rod connect fixed stiff end and with the relative free end that sets up of stiff end, the free end is in promote under the effect of first connecting rod vertical support spare rebound and after the driving force disappears to the removal that resets down.
As a further improvement, the driving assembly includes a driving rod having a start end slidably disposed on the housing in a transverse direction or in an arc direction and a tail end rotatably connected to the first link.
As a further improvement, the driving assembly further comprises a handle arranged on the starting end and protruding outwards out of the shell and an adapter plate rotatably connected with the handle, and the adapter plate is rotatably mounted on the shell; the shell is provided with an arc-shaped sliding hole in sliding fit with the handle.
As a further improvement, the housing further has a stroke limiting member capable of being adjusted in a telescopic manner, and the stroke limiting member has a limiting portion for abutting against the driving rod to limit the moving stroke of the driving rod.
As a further improvement, the driving assembly further has a driving reset piece for driving the driving rod to move in a reset mode.
As a further improvement, the driving rod is provided with a rod body, and a first thread part and a second thread part which are arranged in opposite thread directions are arranged on the side wall of the rod body; the driving rod is further provided with a first sleeve in threaded connection with the first threaded portion and a second sleeve in threaded connection with the second threaded portion, and the first connecting rod is rotatably connected with the first sleeve.
As a further improvement, the direction of movement of the drive rod is perpendicular to the vertical support.
As a further improvement, the first connecting rod is rotatably connected with the driving assembly, the second connecting rod is vertically arranged on the first connecting rod, and the rotating shaft is arranged at the intersection position of the first connecting rod and the first connecting rod.
As a further improvement, the vertical supporting piece is provided with a sliding rod, an upper abutting plate and a lower abutting plate which are arranged perpendicular to the sliding rod;
a roller which is movably arranged between the upper abutting plate and the lower abutting plate is rotatably arranged at the free end of the second connecting rod;
when the first connecting rod drives the free end to swing upwards, the roller is abutted against the upper abutting plate and pushes the vertical supporting piece to move upwards;
when the first connecting rod drives the free end to swing downwards, the roller is abutted to the lower abutting plate and pushes the vertical supporting piece to reset downwards.
As a further improvement, a sliding support which is in sliding fit with the sliding rod is arranged on the shell; still be provided with the limiting plate on the lateral wall of slide bar, vertical support piece still has the cover and establishes reset spring on the slide bar, reset spring's one end butt is in on the limiting plate, reset spring's other end butt is in on the sliding support.
Compared with the prior art, the device is provided with the through hole device for cleaning the vacuum hole of the chip crimping head, the positioning groove is arranged on the device and is used for positioning with the chip crimping head so as to realize the butt joint of the ejector pin on the through hole device and the vacuum hole, then the vertical supporting piece is driven by the driving assembly to move up and down in a telescopic manner so as to realize the cleaning of the vacuum hole, and the cleaning of the vacuum hole is more simple compared with the operation of the mode of detaching the chip crimping head in the prior art.
Drawings
FIG. 1 is a schematic diagram of a first structure of a chip crimping head in a vacuum hole through hole device of the chip crimping head according to an embodiment of the disclosure;
FIG. 2 is a schematic diagram of a second structure of a chip crimping head in a vacuum hole through hole device of the chip crimping head according to an embodiment of the disclosure;
FIG. 3 is a schematic structural diagram of a vacuum hole through hole device of a chip crimping head according to an embodiment of the disclosure;
FIG. 4 is a partially enlarged schematic view of FIG. 3;
FIG. 5 is a schematic diagram of a first internal structure of a vacuum hole through hole device of a chip crimping head according to an embodiment of the disclosure;
FIG. 6 is a schematic diagram of a second internal structure of the vacuum hole-through-hole device of the chip crimping head disclosed in the embodiment of the invention;
FIG. 7 is a schematic structural diagram of a vertical support in a vacuum hole through hole device of a chip crimping head according to an embodiment of the disclosure;
FIG. 8 is a schematic structural diagram of a driving member in a vacuum hole through hole device of a chip crimping head according to an embodiment of the disclosure;
FIG. 9 is a schematic structural diagram of a connector in a vacuum hole through hole device of a chip crimping head according to an embodiment of the disclosure;
FIG. 10 is a front view of a connector in a vacuum hole through hole arrangement of a die bonder, as disclosed in an embodiment of the present invention;
fig. 11 is a schematic view of an installation structure of a stroke limiter in a vacuum hole through hole device of a chip crimping head disclosed in an embodiment of the invention.
Description of reference numerals: 1-shell, 11-positioning groove, 12-thimble perforation, 13-arc slide hole, 14-stroke limiting piece, 141-limiting part, 15-slide support, 16-vertical split, 17-horizontal split, 2-vertical support, 21-thimble, 22-slide bar, 221-limiting plate, 23-lower abutting plate, 24-upper abutting plate, 25-reset spring, 3-driving component, 31-driving bar, 311-starting end, 312-end, 313-rod body, 314-first sleeve, 315-second sleeve, 32-handle, 33-connecting plate, 34-reset piece, 4-connecting piece, 41-first connecting rod, 42-second connecting rod, fixed end, 422-free end, 423-rollers, 5-shafts,
100-chip crimp head, 101-vacuum hole, 102-body portion, 103-crimp portion, 1031-trapezoidal portion, 1032-square portion, 200-crimp head support seat.
Detailed Description
The embodiments described below with reference to the drawings are illustrative only and should not be construed as limiting the invention.
The embodiment of the invention comprises the following steps: referring to fig. 1-2, a schematic view of a prior art chip crimping head 100 mounted and secured to a head support 200 is shown. The chip crimping head 100 has a body portion 102 and a crimping portion 103 projecting downward from the body portion 102. The crimping part 103 is gradually contracted downward from the body part 102 to finally form a trapezoidal part 1031 on the upper side and a square part 1032 on the lower side, and the vacuum hole 101 is provided on the square part 1032 of the crimping part 103. The chip is sucked to the square portion 1032 of the pressure bonding part 103 by the negative pressure generated from the vacuum hole 101. The condition that jam appears in vacuum hole 101 in long-time use easily among the prior art, need clear up the vacuum hole after the jam, and because the distance of chip crimping head 100 apart from the plummer of the base plate under is limited, hardly realize clearing up the vacuum hole through the thimble in this limited space, because thimble and vacuum hole 101 work difficult operation to the hole, consequently can only dismantle the chip crimping head and clear up after cooling down among the prior art, thereby the comparatively loaded down with trivial details production efficiency of influence and the dismantlement of relapse of such clearance mode cause the production of metal piece easily to influence the quality of product.
The embodiment discloses a chip crimping head vacuum hole through hole device, as shown in fig. 3-11, comprising: casing 1, vertical support piece 2, connecting piece 4 and drive assembly 3, drive assembly 3 drives vertical support piece 2 through connecting piece 4 and slides along axial direction, is provided with the thimble 21 that is used for clearing up crimping head vacuum hole through-hole on vertical support piece 2, thereby thimble 21 reciprocates along with vertical support piece 2 and realizes the clearance to vacuum hole 101.
In the present embodiment, as shown in fig. 3-4, in order to facilitate the alignment of the thimble 21 with the vacuum hole 101, the vertical support 2 has a positioning slot 11 and a thimble through hole 12 penetrating through the bottom of the positioning slot 11. Wherein the positioning slot 11 is adapted to the shape of the crimping part 103. The thimble insertion hole 12 is provided opposite to the square portion 1032.
As shown in fig. 3, the vertical supporting member 2 is axially slidably disposed on the housing 1 along the thimble through hole 12, and has a plurality of thimbles 21 disposed corresponding to the thimble through hole 12. The casing 1 has vertical components of a whole that can function independently 16 that vertical direction extends the setting and the horizontal components of a whole that can function independently 17 that sets up with vertical components of a whole that can function independently 16 is perpendicular, and vertical support piece 2 sets up in vertical components of a whole that can function independently 16, drive assembly 3 installation sets up in the horizontal components of a whole that can function independently 17, set up casing 1 into horizontal components of a whole that can function independently 17 and vertical components of a whole that can function independently 16 and make both perpendicular settings, and the space that utilizes that can be better turns into horizontal direction's manipulation with controlling of vertical direction, can be more convenient the realization to vertical support piece 2 control.
The thimble 21 is slidably disposed in the thimble through hole 12, and the thimble 21 is just opposite to the vacuum hole 101 after the positioning groove 11 is fitted and attached to the press-fitting portion 103. The ejector pin 21 and the vacuum hole 101 in the vacuum hole through-hole device are conveniently aligned by the positioning groove 11, so that the vacuum hole 101 is conveniently cleaned.
In order to facilitate the manipulation of the thimble 21, as shown in fig. 5-10, a connecting member 4 is provided in the present embodiment, and the driving assembly 3 drives the vertical support 2 to move up and down through the connecting member 4. Specifically, the connecting member 4 is rotatably mounted on the housing 1 through a rotating shaft 5 and has a first connecting rod 41 and a second connecting rod 42 which are diagonally crossed. The driving assembly 3 drives the first link 41 to rotate around the rotating shaft 5. The second connecting rod 42 has with the first connecting rod 41 connect fixed end 421 fixed and with the free end 422 that the fixed end 421 set up relatively, the free end 422 is in the effect of first connecting rod 41 pushes vertical support 2 rebound and reset the removal under after the impetus disappears.
The swing of the second link 42 is controlled by the first link 41, in this embodiment, the fixed end 421 of the first link 41 is connected and fixed with the second end of the second link 42, and the position of the connection point between the two is the installation position of the rotating shaft 5. The first link 41 is disposed perpendicular to the second link 42. The second end of the first link 41 is rotatably connected to the drive assembly 3.
In the present embodiment, the driving assembly 3 includes a driving rod 31, and the driving rod 31 has a starting end 311 slidably disposed on the housing 1 in a transverse direction or an arc direction and a terminal end 312 rotatably connected to the first link 41. The driving lever 31 may be slidably disposed in the lateral direction, and at this time, only the start end 311 of the driving lever 31 needs to be slid in the horizontal direction. Of course, for more flexible adjustment of the vertical support 2, the start 311 of the driving rod 31 is arranged to slide in an arc direction in the present embodiment.
Specifically, as shown in fig. 5, the driving assembly 3 further has a handle 32 disposed on the starting end 311 and protruding outward from the housing 1, and an adapter plate 33 rotatably connected to the handle 32, and the adapter plate 33 is rotatably mounted on the housing 1; the housing 1 is provided with an arc-shaped sliding hole 13 which is in sliding fit with the handle 32.
The side walls on both sides of the arc-shaped sliding hole 13 are used for limiting the moving interval of the handle 32, and further limiting the moving space of the starting end 311 of the driving rod 31, so that the slipping between the parts or the damage of the parts caused by the transitional movement of the driving rod 31 is avoided.
In the embodiment, the connecting plate 33 is arranged in parallel with the first link 41, and the length of the connecting plate 33 is matched with the length of the first link 41, so that the driving rod 31 can be kept in the horizontal extending arrangement all the time during the rotation process. The driving rod 31, the connecting plate 33 and the first link 44 form three adjacent sides of a parallelogram, wherein the driving rod 31 as a long side of the parallelogram moves two adjacent short sides synchronously so that the driving rod 31 always moves in a horizontal direction. Since the vertical support 2 is slidably disposed in the vertical direction, the moving direction of the driving rod 31 can be made perpendicular to the vertical support 2. Through the arrangement of the structure, the driving rod 31 moves horizontally to control and stretch the vertical supporting piece 2 vertically, so that the chip crimping head 100 and the bearing table are prevented from being controlled in a narrow space, and the vertical supporting piece 2 can be better controlled to move.
As shown in fig. 11, the housing 1 further has a stroke limiting member 14 capable of being adjusted in an extending and contracting manner, the stroke limiting member 14 is disposed on the transverse split body 17, and the stroke limiting member 14 has a limiting portion 141 for abutting against the driving rod 31 to limit the moving stroke of the driving rod 31. When one end of the driving rod 31 rotates to abut against the limit portion 141 of the stroke limit piece 14, the driving rod 31 reaches the maximum stroke position.
In this embodiment, the stroke limiting member 14 is a bolt screwed on the housing 1, and the stroke limiting member 14 is screwed on the housing 1 to extend and retract the stroke limiting member 14, that is, the position of the limiting portion 141 can be conveniently adjusted to adjust the stroke limitation of the driving rod 31. The position of the travel limit stop 14 can be adjusted according to actual needs to improve the applicability of the device.
The driving assembly 3 further has a driving reset member 34 for driving the driving rod 31 to move in a reset manner. The driving reset piece 34 is an extension spring, one end of the driving reset piece 34 is fixed on the driving rod 31, and the other end of the driving reset piece 34 is fixed on the shell 1. The drive of the drive return element 34 drives the return element 31 in a direction away from the travel limiting element 14.
The handle 32 slides along the arc-shaped sliding hole 13, and drives the start end 311 of the driving rod 31 to move in a direction away from the vertical support member 2, and drives the connecting member 4 to rotate in the moving process, wherein the end of the first connecting rod 41 rotatably connected to the driving rod 31 swings around the rotating shaft 5, the free end 422 of the second rail 42 also swings around the rotating shaft 5 along with the rotation of the first connecting rod 41, and the free end 422 abuts against the vertical support member 2 and drives the vertical support member 2 to move upwards in the swinging process, so that the thimble 21 protrudes out of the thimble through hole 12. The extension range of the thimble 21 is limited, and in order to avoid excessive protrusion of the thimble 21 out of the thimble through hole 12, the housing 1 of the embodiment is provided with the stroke limiting piece 14, so that the maximum stroke of the start end 311 of the driving rod 31 is limited, and the extension length of the thimble 21 is better controlled. After the pushing force applied to the handle 32 is removed, the driving rod 31 is moved away from the stroke limiting member 14 by the driving reset member 34, so as to return to the initial state.
As shown in fig. 8, the driving rod 31 has a rod 313, and a side wall of the rod 313 has a first threaded portion and a second threaded portion with opposite thread directions; the driving rod 31 further has a first sleeve 314 threadedly coupled to the first threaded portion and a second sleeve 315 threadedly coupled to the second threaded portion, and the first link 41 is rotatably coupled to the first sleeve 314. The two ends of the rod body 313 are provided with opposite threads and are in threaded connection with the first sleeve 314 and the second sleeve 315 at the two ends, so that the length of the driving rod 31 can be shortened or lengthened by screwing the rod body 313, the initial height of the free end 422 on the second connecting rod 42 can be changed when the length of the driving rod 31 is adjusted, the telescopic range of the thimble 21 can be adjusted, the applicability of the whole device can be improved through the arrangement of the structure, and the use of various conditions is met.
As shown in fig. 6 to 7, the vertical support 2 in this embodiment has a sliding rod 22 and an upper abutting plate 24 and a lower abutting plate 23 which are perpendicular to the sliding rod 22;
a roller 423 movably disposed between the upper abutting plate 22 and the lower abutting plate 23 is rotatably mounted on a free end 422 of the second link 42. The provision of the roller 423 can reduce the friction of the link 42 during sliding.
When the first connecting rod 41 drives the free end 422 to swing upwards, the roller 423 abuts against the upper abutting plate 22 and pushes the vertical support 2 to move upwards;
when the first connecting rod 41 drives the free end 422 to swing downwards, the roller 423 abuts against the lower abutting plate 23 and pushes the vertical support 2 to move downwards in a resetting manner.
The movement of the free end 422 is limited by the upper abutting plate 24 and the lower abutting plate 23 which are arranged up and down in the embodiment, and the vertical support 2 is driven to slide up and down under the action of the free end 422. The vertical supports 2 are subjected to a downward restoring force when the free end 422 abuts against the lower abutment plate 23, which action drives the vertical supports 2 to move downward for restoration.
In the present embodiment, the housing 1 is provided with a sliding support 15 which is slidably engaged with the sliding rod 22. The sliding support 15 is fixed on the vertical split body 16, and the sliding support 15 can limit the sliding rod 22 to move smoothly. Still be provided with limiting plate 221 on the lateral wall of slide bar 22, vertical support piece 2 still has the cover and establishes reset spring 25 on slide bar 22, reset spring 25's one end butt is in on the limiting plate 221, reset spring 24's the other end butt is in on the sliding support 15. The retainer plate 221 compresses the return spring 24 when the vertical support 2 moves upward, and the return spring 24 accumulates energy and moves the vertical support 2 to return downward after the upward urging force applied to the vertical support 2 disappears.
Further, in order to better discharge the cleaned impurities from the vacuum hole 101, a connection pipe communicated with the vacuum hole 101 is arranged on the pressure welding head support base 200, and the connection pipe is used for connecting a negative pressure device for adsorbing the impurities cleaned in the vacuum hole 101.
The construction, features and functions of the present invention are described in detail in the embodiments illustrated in the drawings, which are only preferred embodiments of the present invention, but the present invention is not limited by the drawings, and all equivalent embodiments modified or changed according to the idea of the present invention should fall within the protection scope of the present invention without departing from the spirit of the present invention covered by the description and the drawings.
Claims (10)
1. The utility model provides a chip crimping head vacuum hole through-hole device which characterized in that includes:
the shell is provided with a positioning groove and a thimble perforation which penetrates through the bottom of the positioning groove;
the vertical supporting piece is arranged in the shell in an axial sliding mode along the thimble through hole and is provided with a plurality of thimbles arranged corresponding to the thimble through holes;
the connecting piece is rotatably arranged in the shell through a rotating shaft and is provided with a first connecting rod and a second connecting rod which are obliquely crossed;
the driving component drives the first connecting rod to rotate around the rotating shaft;
the second connecting rod is provided with a fixed end fixedly connected with the first connecting rod and a free end arranged opposite to the fixed end, the vertical supporting piece is provided with a sliding rod and an upper abutting plate vertically arranged with the sliding rod, the sliding rod is arranged in the shell in a sliding mode along the vertical direction, and the free end of the second connecting rod is used for abutting against the upper abutting plate;
the free end abuts against the upper abutting plate along with the rotation of the first connecting rod around the rotating shaft and pushes the vertical supporting piece to move upwards, and after the pushing action disappears, the vertical supporting piece resets downwards and moves.
2. The chip crimping head vacuum hole through hole device of claim 1, wherein: the driving assembly comprises a driving rod, and the driving rod is provided with a starting end arranged in the shell in a sliding mode along the transverse direction or along the arc direction and a tail end connected with the first connecting rod in a rotating mode.
3. The chip crimping head vacuum hole through hole device of claim 2, wherein: the driving assembly is also provided with a handle which is arranged on the starting end and protrudes out of the shell and an adapter plate which is rotationally connected with the handle, and the adapter plate is rotationally arranged in the shell; the shell is provided with an arc-shaped sliding hole in sliding fit with the handle.
4. The chip crimping head vacuum hole through hole device of claim 2, wherein: the shell is further provided with a stroke limiting part capable of being adjusted in a telescopic mode, and the stroke limiting part is provided with a limiting part which is used for being abutted to the driving rod to limit the moving stroke of the driving rod.
5. The chip crimping head vacuum hole through hole device of claim 2, wherein: the driving assembly is also provided with a driving reset piece for driving the driving rod to reset.
6. The chip crimping head vacuum hole through hole device of claim 2, wherein: the driving rod is provided with a rod body, and a first thread part and a second thread part which are arranged in opposite thread directions are arranged on the side wall of the rod body; the driving rod is further provided with a first sleeve in threaded connection with the first threaded portion and a second sleeve in threaded connection with the second threaded portion, and the first connecting rod is rotatably connected with the first sleeve.
7. The chip crimping head vacuum hole through hole device of claim 2, wherein: the moving direction of the driving rod is perpendicular to the vertical supporting piece.
8. The chip crimping head vacuum hole through hole device of claim 1, wherein: the first connecting rod is connected with the driving assembly in a rotating mode, the second connecting rod is vertically arranged on the first connecting rod, and the rotating shaft is arranged at the intersection position of the first connecting rod and the first connecting rod.
9. The chip crimping head vacuum hole through hole device of claim 1, wherein: the vertical supporting piece is also provided with a lower abutting plate which is arranged along the vertical direction at an interval opposite to the upper abutting plate;
a roller which is movably arranged between the upper abutting plate and the lower abutting plate is rotatably arranged at the free end of the second connecting rod;
when the first connecting rod drives the free end to swing upwards, the roller is abutted against the upper abutting plate and pushes the vertical supporting piece to move upwards;
when the first connecting rod drives the free end to swing downwards, the roller is abutted to the lower abutting plate and pushes the vertical supporting piece to reset downwards.
10. The chip crimping head vacuum hole through hole device of claim 1, wherein: the shell is provided with a sliding support which is in sliding fit with the sliding rod; still be provided with the limiting plate on the lateral wall of slide bar, vertical support piece still has the cover and establishes reset spring on the slide bar, reset spring's one end butt is in on the limiting plate, reset spring's other end butt is in on the sliding support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010640893.1A CN111739833B (en) | 2020-07-06 | 2020-07-06 | Chip crimping joint vacuum hole through hole device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010640893.1A CN111739833B (en) | 2020-07-06 | 2020-07-06 | Chip crimping joint vacuum hole through hole device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111739833A CN111739833A (en) | 2020-10-02 |
| CN111739833B true CN111739833B (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010640893.1A Active CN111739833B (en) | 2020-07-06 | 2020-07-06 | Chip crimping joint vacuum hole through hole device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114733807B (en) * | 2022-04-01 | 2023-07-21 | 颀中科技（苏州）有限公司 | Chip press joint vacuum hole cleaning device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005166993A (en) * | 2003-12-03 | 2005-06-23 | Toray Eng Co Ltd | Method and apparatus for cleaning head pressurization surface |
| CN102683236A (en) * | 2012-04-24 | 2012-09-19 | 华中科技大学 | Hot pressing head comprising multiple groups of heating cores |
| CN104550062A (en) * | 2015-01-09 | 2015-04-29 | 合肥京东方光电科技有限公司 | Cleaning device and false pressing device |
| CN210816353U (en) * | 2019-07-25 | 2020-06-23 | 深圳市集银科技有限公司 | Backlight unit FPC welding pressure head cleaning device |
-
2020
- 2020-07-06 CN CN202010640893.1A patent/CN111739833B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005166993A (en) * | 2003-12-03 | 2005-06-23 | Toray Eng Co Ltd | Method and apparatus for cleaning head pressurization surface |
| CN102683236A (en) * | 2012-04-24 | 2012-09-19 | 华中科技大学 | Hot pressing head comprising multiple groups of heating cores |
| CN104550062A (en) * | 2015-01-09 | 2015-04-29 | 合肥京东方光电科技有限公司 | Cleaning device and false pressing device |
| CN210816353U (en) * | 2019-07-25 | 2020-06-23 | 深圳市集银科技有限公司 | Backlight unit FPC welding pressure head cleaning device |
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| CN111739833A (en) | 2020-10-02 |
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