CN108054128A - A kind of push pin device of bonder - Google Patents
A kind of push pin device of bonder Download PDFInfo
- Publication number
- CN108054128A CN108054128A CN201711326205.9A CN201711326205A CN108054128A CN 108054128 A CN108054128 A CN 108054128A CN 201711326205 A CN201711326205 A CN 201711326205A CN 108054128 A CN108054128 A CN 108054128A
- Authority
- CN
- China
- Prior art keywords
- thimble
- push pin
- pin device
- hole
- fixed seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a kind of push pin device of bonder.Specifically include push pin device and driving device, the push pin device includes fixed seat, the thimble that can be moved up and down in fixed seat is provided in the fixed seat, the thimble drives its up and down motion by driving device, through hole and centre hole are set in the fixed seat, the through hole connects vacuum equipment, and the centre hole is corresponding with thimble position；The thimble includes the first portion, second portion and the Part III that are sequentially connected, and guide bearing is arranged with outside the Part III, and the second portion diameter is more than the internal diameter of guide bearing.The push pin device of the present invention is simple in structure, by the way that thimble is arranged to the first portion being sequentially connected, second portion and Part III, by guide bearing, prevents thimble from tilting.
Description
Technical field
The present invention relates to a kind of push pin device of bonder, belong to semiconductor patch encapsulation technology field.
Background technology
Bonder is one of critical mechanical equipment of post package process indispensability on LED production lines, and mechanical part includes
Nation's head assembly, ejector pin component, wafer table component, optical system, oxide dispensing component and rotary positioning mechanism component.
The die bond process of bonder is：By manual or feed mechanism the working position for substrate or PCB being transmitted to fixture
It puts, substrate or PCB is first needed to the position dispensing of key box chip by glue applying mechanism, then crystal taking arm is moved to from origin position
The position of chip is inhaled, chip is placed on the expander wafer disk of film support, and rear suction nozzle moves downward crystal taking arm in place, thimble
Jack-up chip is moved upwards, origin position is bonded after chip is picked up, is thus a complete bonding process.
This requires thimble to jack up chip along perpendicular to the direction of workbench mounting surface, it is impossible to have the phenomenon that inclination to go out
It is existing, but conventionally, as the long-time service of thimble causes to wear, easily generation tilts, and causes the drop of work efficiency
It is low.
The content of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of push pin device of bonder.
The present invention is achieved through the following technical solutions：
A kind of push pin device of bonder, including push pin device and driving device, the push pin device includes fixed seat, described solid
The thimble that can be moved up and down in fixed seat is provided in reservation, the thimble drives its up and down motion, institute by driving device
It states and through hole and centre hole is set in fixed seat, the through hole connects vacuum equipment, and the centre hole is corresponding with thimble position；Institute
Stating thimble includes the first portion, second portion and the Part III that are sequentially connected, and guide bearing is arranged with outside the Part III,
The second portion diameter is more than the internal diameter of guide bearing.
A kind of push pin device of bonder, the guide bearing are arranged with elastic washer outside.
A kind of push pin device of bonder, the fixed seat is interior to set finite place piece, and the second portion is set
The corresponding card slot of finite place piece.
A kind of push pin device of bonder, the thimble are integrally formed.
A kind of push pin device of bonder is arranged with spring outside the first portion, and the diameter of the spring is big
In the diameter of centre hole.
A kind of push pin device of bonder, the through hole are provided with multiple, and are uniformly arranged on centre hole
Around.
The advantageous effect that the present invention is reached：
The push pin device of the present invention is simple in structure, and wafer film is adsorbed by the through hole for connecting vacuum equipment, meanwhile, thimble is set
The influence that the vacuum of through hole generates chip is reduced in hole, avoids chip and is adsorbed, so as to improve work efficiency；Pass through
Thimble is arranged to the first portion being sequentially connected, second portion and Part III, by guide bearing, prevents thimble from tilting.
Description of the drawings
Fig. 1 is the structure diagram of the present invention.
Fig. 2 is the top view of thimble.
In figure：1st, driving device, 2, fixed seat, 3, thimble, 31, first portion, 32, second portion, 33, Part III,
4th, through hole, 5, centre hole, 6, vacuum equipment, 7, guide bearing, 8, elastic washer, 9, locating part, 10, card slot, 11, spring.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.Following embodiment is only used for clearly illustrating the present invention
Technical solution, and be not intended to limit the protection scope of the present invention and limit the scope of the invention.
As shown in the figure, a kind of push pin device of bonder of the present invention, including push pin device and driving device 1, the top
Needle device includes fixed seat 2, and the thimble 3 that can be moved up and down in fixed seat 2 is provided in the fixed seat 2, and the thimble 3 is logical
Over-driving device 1 drives its up and down motion, and through hole 4 and centre hole 5 are set in the fixed seat 2, and the through hole 4 connects vacuum and sets
Standby 6, the centre hole 5 is corresponding with 3 position of thimble；The thimble 3 includes the first portion 31 being sequentially connected, second portion 32
With Part III 33, the Part III outer 33 is arranged with guide bearing 7, and 32 diameter of second portion is more than guide bearing 7
Internal diameter.Specifically, the thimble 3 is integrally formed.
Further, it is arranged with elastic washer 8 outside the guide bearing 7.Elastic washer 8 reduces guide bearing 7 with consolidating
Friction between reservation 2 reduces the abrasion to guide bearing 7.
Further, finite place piece 9 is set in the fixed seat 2, and the second portion 32 sets finite place piece to correspond to
Card slot 10.By setting locating part 9 and card slot 10, thimble 3 when moving, can be limited in the range of locating part 9 and move,
It will not shift, so as to further reduce the inclination of thimble 3.
Further, spring 11 is arranged with outside the first portion 31, the diameter of the spring 11 is more than centre hole 5
Diameter.By setting spring 11, thimble 3 compresses spring 11 when through centre hole 5, slows down the speed of the rising of thimble 3, avoids
The damage of thimble 3.
Further, the through hole 4 is provided with multiple, and is uniformly arranged on around centre hole 5.Through hole 4 is set
It is multiple, to the excellent adsorption of film.
The push pin device of the present invention when in use, is vacuumized by vacuum equipment 6, so as to 4 adsorbent thin film of through hole, driving dress
It puts 1 driving thimble 3 to move up, jacks up chip, so as to separate chip and film, prevent thimble 3 from tilting by guide bearing 7.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvement and deformation can also be made, these are improved and deformation
Also it should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of push pin device of bonder, including push pin device and driving device, it is characterized in that, the push pin device includes solid
Reservation is provided with the thimble that can be moved up and down in fixed seat in the fixed seat, and the thimble drives it by driving device
It moves up and down, through hole and centre hole is set in the fixed seat, the through hole connects vacuum equipment, the centre hole and thimble position
It puts corresponding；The thimble includes the first portion, second portion and the Part III that are sequentially connected, is arranged outside the Part III
There is guide bearing, the second portion diameter is more than the internal diameter of guide bearing.
2. a kind of push pin device of bonder according to claim 1, it is characterized in that, it is arranged with bullet outside the guide bearing
Property washer.
3. a kind of push pin device of bonder according to claim 1, it is characterized in that, it is provided with /V in the fixed seat
Part, the second portion set the corresponding card slot of finite place piece.
4. a kind of push pin device of bonder according to claim 1, it is characterized in that, the thimble is integrally formed.
5. a kind of push pin device of bonder according to claim 1, it is characterized in that, it is arranged with bullet outside the first portion
Spring, the diameter of the spring are more than the diameter of centre hole.
6. a kind of push pin device of bonder according to claim 1, it is characterized in that, the through hole be provided with it is multiple, and
And it is uniformly arranged on around centre hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711326205.9A CN108054128A (en) | 2017-12-13 | 2017-12-13 | A kind of push pin device of bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711326205.9A CN108054128A (en) | 2017-12-13 | 2017-12-13 | A kind of push pin device of bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108054128A true CN108054128A (en) | 2018-05-18 |
Family
ID=62132046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711326205.9A Pending CN108054128A (en) | 2017-12-13 | 2017-12-13 | A kind of push pin device of bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108054128A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111570301A (en) * | 2019-02-15 | 2020-08-25 | 万润科技股份有限公司 | Driving method, mechanism and module and sorting machine using driving mechanism and module |
| CN117832129A (en) * | 2024-01-03 | 2024-04-05 | 深圳市锐扬创科技术股份有限公司 | Wafer ejection device of semiconductor die bonder |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201311928Y (en) * | 2008-10-14 | 2009-09-16 | 南昌慧翔自控科技有限公司 | Suction head device for thimble of die bonder |
| CN202003972U (en) * | 2010-07-13 | 2011-10-05 | 江门市新侨光电科技有限公司 | Wafer pushing device used for die bonder |
| CN203721691U (en) * | 2014-01-14 | 2014-07-16 | 深圳鼎晶光电有限公司 | Solid crystal machine thimble mechanism |
| KR20170030336A (en) * | 2015-09-09 | 2017-03-17 | 세메스 주식회사 | Apparatus for ejecting dies |
| CN207542226U (en) * | 2017-12-13 | 2018-06-26 | 苏州聚进顺自动化科技有限公司 | A kind of push pin device of bonder |
-
2017
- 2017-12-13 CN CN201711326205.9A patent/CN108054128A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201311928Y (en) * | 2008-10-14 | 2009-09-16 | 南昌慧翔自控科技有限公司 | Suction head device for thimble of die bonder |
| CN202003972U (en) * | 2010-07-13 | 2011-10-05 | 江门市新侨光电科技有限公司 | Wafer pushing device used for die bonder |
| CN203721691U (en) * | 2014-01-14 | 2014-07-16 | 深圳鼎晶光电有限公司 | Solid crystal machine thimble mechanism |
| KR20170030336A (en) * | 2015-09-09 | 2017-03-17 | 세메스 주식회사 | Apparatus for ejecting dies |
| CN207542226U (en) * | 2017-12-13 | 2018-06-26 | 苏州聚进顺自动化科技有限公司 | A kind of push pin device of bonder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111570301A (en) * | 2019-02-15 | 2020-08-25 | 万润科技股份有限公司 | Driving method, mechanism and module and sorting machine using driving mechanism and module |
| CN111570301B (en) * | 2019-02-15 | 2021-09-21 | 万润科技股份有限公司 | Driving method, mechanism and module and sorting machine using driving mechanism and module |
| CN117832129A (en) * | 2024-01-03 | 2024-04-05 | 深圳市锐扬创科技术股份有限公司 | Wafer ejection device of semiconductor die bonder |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180518 |
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| WD01 | Invention patent application deemed withdrawn after publication |