JP2007035821A - Component-packaging apparatus and component-packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component-packaging apparatus and a component-packaging method capable of efficiently performing component-packaging operation for manufacturing a semiconductor device in a chip-on-chip structure without damaging components. <P>SOLUTION: In the component-packaging apparatus for packaging an upper chip 15 on a lower one 14 for forming a mounting body in a chip-on-chip structure, the upper and lower chips 15, 14 are taken out and supplied to a packaging stage 18 and a packaging head 27 by a first component holding nozzle 22A made of a soft material fitted from a component storage section 2 to a component transfer head 21. The packaging body for packaging the upper chip 15 on the lower one 14 is held by a second heat-resistant component holding nozzle 22B fitted to the component transfer head 21 and stored at a first component tray 13A in the component storage section 2 from the packaging stage 18. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component on top of the component.

In the field of manufacturing electronic devices, a component mounting operation for mounting a semiconductor chip on a workpiece such as a substrate is performed. In this component mounting operation, a transfer operation in which a semiconductor chip on which connection electrodes such as solder bumps are formed is taken out of the component supply unit and transferred to the substrate, and the connection electrode of the mounted semiconductor chip is used as a circuit on the substrate. A joining operation for joining the electrodes is performed. As an apparatus for performing such component mounting work, a component reversing mechanism that takes a semiconductor chip out of a component supply unit and flips it up and down and a transfer head that mounts a semiconductor chip delivered from the component reversing mechanism on a substrate are conventionally provided. A component mounting apparatus is known (see, for example, Patent Document 1).
Japanese Patent No. 3132353

  Incidentally, in recent years, with the progress of downsizing and higher functionality of electronic devices, it is required to further increase the mounting density of a mounting board incorporated in the electronic device. As a mounting form to cope with such high-density mounting, a semiconductor device having a so-called chip-on-chip structure in which a plurality of semiconductor chips are superposed has been adopted. Such a semiconductor device is manufactured by bonding the bumps formed on the circuit formation surface with the circuit formation surfaces of the two semiconductor chips facing each other.

  However, since the component mounting apparatus shown in the above-mentioned patent document example is configured for the purpose of transferring and mounting a semiconductor chip on a substrate that is large in size and easy to carry and position and hold, the sizes are almost equal. It was not necessarily suitable for the operation of joining two semiconductor chips together. Further, when transferring a chip component, component damage such as a scratch may occur due to contact with the component holding nozzle, and there is a limit to speeding up the transfer operation. Therefore, there has been a demand for a component mounting apparatus and a component mounting method that can efficiently perform a component mounting operation for manufacturing a semiconductor device having a chip-on-chip structure without causing component damage.

  Accordingly, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of efficiently performing a component mounting operation for manufacturing a semiconductor device having a chip-on-chip structure with almost no component damage.

The component mounting apparatus of the present invention is a component mounting apparatus that mounts a second component on a first component by thermocompression bonding, a first component supply unit that supplies the first component, and the second component A second component supply unit for supplying components, a mounting stage on which the first components are placed, a first component holding nozzle made of a soft material at least on a contact surface with the components, and heating in the thermocompression bonding A component transfer means comprising a component transfer head mounted with a second component holding nozzle having heat resistance to the temperature of the second component, and the second component held by the mounting head; Mounting means mounted on the first component mounted on the mounting stage and mounted by thermocompression bonding, and the first component is ejected from the first component supply section by the first component holding nozzle. Take out and place on the mounting stage The second component taken out from the second component supply unit by the first component holding nozzle is delivered to and held by the mounting head, and the second component mounted on the first component is It is held by the second component holding nozzle and carried out of the mounting stage together with the first component.

  The component mounting apparatus of the present invention is a component mounting apparatus that mounts a second component on a first component by thermocompression bonding, and includes a first component supply unit that supplies the first component, and the second component. In the second component supply section for supplying the component, the mounting stage on which the first component is placed, the first component holding nozzle in which at least the contact surface with the component is made of a soft material, and the thermocompression bonding Replacing the first component holding nozzle and the second component holding nozzle with a nozzle storage portion that exchangeably stores a second component holding nozzle having heat resistance with respect to the temperature of the heated second component A component transfer means having a component transfer head that can be freely mounted, and the second component is mounted on the first component mounted on the mounting stage while being held by the mounting head and mounted by thermocompression bonding. Mounting means, The first component is taken out from the first component supply unit by the component transfer head having the component holding nozzle mounted thereon and placed on the mounting stage, and the component transfer head having the first component holding nozzle mounted thereon The second component taken out from the second component supply unit by the mounting head is received by the mounting head, and the second component mounted on the first component is mounted on the second component holding nozzle. It is held by the component transfer head and carried out of the mounting stage together with the first component.

  Furthermore, the component mounting apparatus of the present invention is a component mounting apparatus that mounts the second component on the first component by thermocompression bonding, and includes a first component supply unit that supplies the first component, and the second component. A component mounted with a second component supply unit for supplying the component, a mounting stage on which the first component is mounted, and a first component holding nozzle having a contact surface made of a soft material at least with the component The second component is held by the component transfer means having a transfer head and the mounting head on which the second component holding nozzle having heat resistance against the heating temperature in the thermocompression bonding is mounted and placed on the mounting stage. Mounting means mounted on the first component and mounted by thermocompression bonding, the first component being taken out from the first component supply section by the first component holding nozzle, and the mounting stage. Placed on the first The mounting head receives the second component taken out from the second component supply unit by the product holding nozzle, and the second component mounted on the first component is the second component of the mounting head. It is held by the holding nozzle and carried out of the mounting stage together with the first component.

  The component mounting method of the present invention includes a first component supply unit that supplies a first component, a second component supply unit that supplies a second component, and a mounting stage on which the first component is placed. And a first component holding nozzle having at least a contact surface made of a soft material and a second component holding nozzle having heat resistance against the temperature of the second component heated in the thermocompression bonding. And a mounting means for mounting the second component on the first component mounted on the mounting stage by means of thermocompression bonding, with the second component being held by the mounting head. And mounting the second component on the first component by thermocompression bonding. The first component holding nozzle is used to mount the first component on the first component. Take out from the parts supply part before The second component placed on the mounting stage, taken out from the second component supply unit by the first component holding nozzle, is held by the mounting head, and is mounted on the first component. The two components are held by the second component holding nozzle and carried out of the mounting stage together with the first component.

In the component mounting method of the present invention, a first component supply unit that supplies a first component, a second component supply unit that supplies the second component, and the first component are mounted. A first component holding nozzle having a contact surface between the mounting stage and at least a component made of a soft material, and a second component holding nozzle having heat resistance against the temperature of the second component heated in the thermocompression bonding A nozzle storage portion for storing the first component holding nozzle, a component transfer means having a component transfer head capable of replacing the first component holding nozzle and the second component holding nozzle in a replaceable manner, and mounting the second component The second component is mounted on the first component by a component mounting apparatus that includes a mounting means that is mounted on the first component that is held by the head and placed on the mounting stage and mounted by thermocompression bonding. Components mounted by thermocompression bonding The first component is taken out from the first component supply unit by the component transfer head having the first component holding nozzle mounted thereon, and placed on the mounting stage. The mounting part receives the second component taken out from the second component supply unit by a component transfer head on which a holding nozzle is mounted, and receives the second component mounted on the first component. It is carried out of the mounting stage by a component transfer head on which two component holding nozzles are mounted.

  In the component mounting method of the present invention, a first component supply unit that supplies the first component, a second component supply unit that supplies the second component, and the first component are mounted. A component transfer means including a component transfer head having a mounting stage mounted thereon, a component transfer head having at least a first component holding nozzle made of a soft material at a contact surface with the component, and heat resistance against the heating temperature in the thermocompression bonding. Mounting means for holding the second component by a mounting head to which a second component holding nozzle is mounted and mounting the second component on the first component mounted on the mounting stage and mounting by thermocompression bonding. A component mounting method in which the second component is mounted on the first component by thermocompression bonding using the component mounting apparatus, wherein the first component is supplied to the first component supply section by the first component holding nozzle. To remove the mounting The second component mounted on the first component is received by the mounting head and placed on the first component holding nozzle and taken out from the second component supply unit by the first component holding nozzle. The component is held by the second component holding nozzle of the mounting head and is carried out of the mounting stage together with the first component.

  Furthermore, the component mounting method of the present invention is a component mounting method in which the second component is mounted on the first component by thermocompression bonding, and the first component has at least a contact surface with the component made of a soft material. The second component held by the first component holding nozzle is placed on the mounting stage, the second component held by the first component holding nozzle is transferred to and held by the mounting head, and the first held by the mounting head is held. The second component is mounted on the first component placed on the mounting stage and mounted by thermocompression bonding, and the second component mounted on the first component is heated in the thermocompression bonding. It is held by a second component holding nozzle having heat resistance against the temperature of the component, and is carried out of the mounting stage together with the first component.

  According to the present invention, the first component is held by the first component holding nozzle having at least the contact surface with the component made of the soft material and placed on the mounting stage, and is held by the first component holding nozzle. The second component is received by the mounting head, and the second component held by the mounting head is mounted on the first component placed on the mounting stage, mounted by thermocompression bonding, and mounted on the first component. By adopting a configuration in which the second component is held by a second component holding nozzle having heat resistance with respect to the temperature of the second component heated in the thermocompression bonding, and is carried out from the mounting stage. Component mounting for manufacturing a semiconductor device having a structure can be efficiently performed with almost no component damage.

(Embodiment 1)
1 is a perspective view of a component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a front view of the component mounting apparatus according to the first embodiment of the present invention, and FIGS. 3 and 4 are diagrams according to the first embodiment of the present invention. It is process explanatory drawing which shows a component mounting method.

First, the structure of the component mounting apparatus 1 will be described with reference to FIGS. The component mounting apparatus 1 is used for the purpose of forming a chip-on-chip mounting body (semiconductor device) in which semiconductor chips having substantially the same size are directly stacked and mounted. In FIG. 1, a component mounting apparatus 1 includes a component storage unit 2 and a component positioning unit 3 arranged in series in the X direction (component transport direction), and a component transfer unit 4 and a component mounting unit 5 disposed in the X direction above the component storage unit 2 and component positioning unit 3. The arrangement is arranged.

  The configuration of each part will be described. The component storage unit 2 has a configuration in which a component storage table 12 is mounted on a positioning table 11 in which an X-axis table 11X and a Y-axis table 11Y are stacked. A first component tray 13A and a second component tray 13B are held on the upper surface of the component storage table 12, and each of the first component tray 13A and the second component tray 13B includes a first component tray. A certain lower chip 14 and an upper chip 15 which is a second component are accommodated in a lattice-like regular array.

  By driving the positioning table 11, the first component tray 13A and the second component tray 13B on the component storage table 12 move horizontally in the X direction and the Y direction. As a result, the lower chip 14 and the upper chip 15 are aligned with respect to the component transfer unit 4, and the aligned lower chip 14 and upper chip 15 are taken out by the component transfer unit 4 and are respectively positioned to the component positioning units 3 and 3. Supplied to the component mounting unit 5. Therefore, the first component tray 13A is a first component supply unit that supplies the first component, and the second component tray 13B is a second component supply unit that supplies the second component. Yes.

  The lower chip 14 and the upper chip 15 are rectangular parts having substantially the same size. As shown in FIG. 2, the connection electrode 14a is provided on the circuit formation surface of the lower chip 14 and the solder is provided on the circuit formation surface of the upper chip 15. Bumps 15a are provided. Both the lower chip 14 and the upper chip 15 are housed in the first component tray 13A and the second component tray 13B in a so-called face-up posture with the circuit formation surface facing upward. The component mounting apparatus 1 performs a component mounting operation in which the lower chip 14 and the upper chip 15 taken out from the first component tray 13A and the second component tray 13B are stacked and mounted. This component mounting operation is performed by mounting the upper chip 15 on the lower chip 14 and soldering the solder bumps 15a to the connection electrodes 14a. The bonding method is not limited to solder bonding in which the solder bump 15a is bonded to the connection electrode 14a, and a method using an adhesive, a resin such as ACF, or the like may be used. Of course, ultrasonic waves may be used. The material of the bump is not limited to solder, and gold, silver, copper, indium or the like can be appropriately selected.

  The component positioning unit 3 has a configuration in which a moving block 17 is mounted on a positioning table 16 in which an X-axis table 16X and a Y-axis table 16Y are stacked. A mounting stage 18 on which the lower chip 14 is placed is provided on the upper surface of the moving block 17. The mounting stage 18 is provided with a suction hole 18a, and the lower chip 14 is sucked and held by the mounting stage 18 by vacuum suction from the suction hole 18a with the lower chip 14 placed on the mounting stage 18. .

  By driving the positioning table 16, the mounting stage 18 moves horizontally in the X direction and the Y direction, whereby the lower chip 14 held on the mounting stage 18 is aligned with the component mounting unit 5. Further, when the lower chip 14 taken out from the component storage unit 2 by the component transfer unit 4 described below is placed on the mounting stage 18, the mounting stage 18 is moved to the left in the X direction by the X-axis table 16X. It is located at the part delivery position [P1] shown in FIG.

  The component transfer unit 4 is configured to reciprocate the component transfer head 21 in the X direction by a moving table 20 disposed in the X direction. The component transfer head 21 is provided with a first component holding nozzle 22A and a second component holding nozzle 22B arranged in an even arrangement of 180 degrees. The first component holding nozzle 22 </ b> A and the second component holding nozzle 22 </ b> B are individually movable up and down by an elevating mechanism built in the component transfer head 21.

  The first component holding nozzle 22A is made of a soft material such as rubber or elastomer that is unlikely to cause damage such as scratches when contacting the chip component, and is used to hold and take out the lower chip 14 and the upper chip 15. The range in which the soft material is used in the first component holding nozzle 22A may be a range including at least a contact surface with the component. The second component holding nozzle 22B is made of metal and has heat resistance against the temperature of the upper chip 15 heated in the thermocompression performed by the component mounting portion 5. Accordingly, the component transfer unit 4 is a component transfer means including a component transfer head 21 on which the first component transfer nozzle 22A and the second component holding nozzle 22B are mounted. The second component holding nozzle 22B may be made of ceramics.

  The component transfer head 21 has a built-in reversing mechanism for vertically reversing the first component holding nozzle 22A and the second component holding nozzle 22B, and is 180 degrees around the rotation shaft 21a provided in the Y direction. Rotation is possible. Thereby, it is possible to operate in a state where one of the first component holding nozzle 22A and the second component holding nozzle 22B is in a downward posture and the other is in an upward posture.

  In other words, the component transfer head 21 can take out the lower chip 14 and the upper chip 15 from the component storage portion 2 by the first component holding nozzle 22A in the downward posture, and the component transfer head 21 holding the upper chip 15 in the downward posture. By rotating 180 degrees, the upper chip 15 can be turned upside down.

  When the lower chip 14 is taken out from the first component tray 13A and transferred to the mounting stage 18, the component transfer head 21 holding the lower chip 14 is moved to the component delivery position [P1] shown in FIG. Here, the first component holding nozzle 22A is moved up and down, and the held lower chip 14 is placed on the mounting stage 18 that has been moved to the component delivery position [P1] in advance.

  The component mounting unit 5 is configured to reciprocate the mounting head 27 in the X direction by the moving table 25 arranged in the X direction. The mounting head 27 includes a component holding nozzle 28 that is moved up and down by a head lifting mechanism 26 and holds the upper chip 15 by suction in a face-down posture. The component transfer head 21 that has taken out the upper chip 15 from the second component tray 13B by the first component holding nozzle 22A is moved to the component delivery position [P1] shown in FIG. 2 to rotate the component transfer head 21. By moving the mounting head 27 to the component delivery position [P1], the upper chip 15 held by the first component holding nozzle 22A can be delivered to the mounting head 27. At this time, in the second component tray 13B, the upper chip 15 having the face-up posture with the solder bumps 15a facing upward is turned upside down by the component transfer head 21 to face down with the solder bumps 15a facing downward. The posture is transferred to the mounting head 27.

  The mounting head 27 after receiving the upper chip 15 moves to the component mounting position [P2], and by performing an elevating operation here, the lower part on the mounting stage 18 that has moved the upper chip 15 to the component mounting position [P2]. Mounted on the chip 14. The mounting head 27 incorporates a heating means as a joining means so that the upper chip 15 can be heated via the component holding nozzle 28. In the mounting operation in which the upper chip 15 held by the mounting head 27 is lowered with respect to the lower chip 14 placed on the mounting stage 18 and the solder bumps 15a are brought into contact with the connection electrodes 14a, the upper chip 15 is mounted by the mounting head 27. Is heated, and the solder bump 15a is melted and soldered to the connection electrode 14a, whereby the upper chip 15 is mounted on the lower chip 14. The component mounting unit 5 is a mounting means for holding the upper chip 15 by the mounting head 27 and mounting it on the lower chip 14 mounted on the mounting stage 18 and mounting it by thermocompression bonding.

  In addition, although the heating means built in the mounting head 27 was illustrated as a joining means which joins the upper chip 15 which is a 2nd component to the lower chip 14 which is a 1st component, a joining means is not restricted to this. Absent. The vibration may be applied by applying vibration such as ultrasonic vibration by a vibration applying means provided on the mounting head 27, or heating by a heater and vibration application may be used in combination. Further, a joining means such as a heater may be provided on the mounting stage 18 side.

  A recognition unit 30 is disposed obliquely above the component positioning unit 3. The recognition unit 30 includes a two-field optical system capable of capturing an upper imaging field and a lower imaging field by a single imaging operation, and is movable forward and backward in the Y direction by a moving mechanism (not shown). The recognition unit 30 is placed between the mounting stage 18 and the mounting head 27 in a state where the lower chip 14 is placed on the mounting stage 18 and the mounting head 27 that holds the upper chip 15 by suction is positioned immediately above the mounting stage 18. By advancing, the lower chip 14 and the upper chip 15 can be imaged and recognized by the same imaging operation. The recognition unit 30 serves as a recognition means for optically recognizing the lower chip 14 on the mounting stage 18 and the upper chip 15 held by the mounting head 27.

  Next, a component mounting operation by the component mounting apparatus 1 will be described with reference to FIGS. First, as shown in FIG. 3A, the component transfer head 21 with the first component holding nozzle 22 </ b> A facing downward is moved above the first component tray 13 </ b> A of the component storage unit 2. Then, the first component holding nozzle 22A is positioned and lowered on the lower chip 14 to be mounted, and the lower chip 14 is sucked and held from the circuit forming surface side. Next, as shown in FIG. 3B, the component transfer head 21 holding the lower chip 14 on the first component holding nozzle 22A is moved to the component delivery position [P1] of the component positioning unit 3, and the component delivery position in advance. The lower chip 14 is placed on the mounting stage 18 moved to [P1] in a face-up posture with the connection electrode 14a facing upward.

  Next, as shown in FIG. 3C, the component transfer head 21 with the first component holding nozzle 22 </ b> A facing downward is moved above the second component tray 13 </ b> B of the component storage unit 2. Then, the first component holding nozzle 22A is positioned and lowered on the upper chip 15 to be mounted, and the upper chip 15 is sucked and held from the circuit forming surface side. Thereafter, as shown in FIG. 3D, the component transfer head 21 that holds the upper chip 15 on the first component holding nozzle 22 </ b> A is moved to the component delivery position [P <b> 1] of the component positioning unit 3. At this time, the component transfer head 21 is rotated 180 degrees so that the upper chip 15 held by the first component holding nozzle 22A is turned upside down. Then, the component holding nozzle 28 of the mounting head 27 that has been moved to the component delivery position [P1] in advance is held in a face-down posture with the solder bump 15a facing downward.

  Thereafter, when the mounting head 27 holding the upper chip 15 moves to the component mounting position [P2], the recognition unit 30 is moved between the mounting stage 18 and the mounting head 27 as shown in FIG. The lower chip 14 and the upper chip 15 are imaged by the same imaging operation by the two-field optical system provided in the recognition unit 30. The imaging result is recognized by a recognition means (not shown), and the connection electrode 14a of the lower chip 14 and the solder bump 15a of the upper chip 15 are recognized. Based on the recognition result, the positional deviation between the connection electrode 14a and the solder bump 15a is detected. In parallel with this imaging operation, the component transfer head 21 returns to the component storage unit 2, moves above the second component tray 13 </ b> B, and is aligned with the upper chip 15 to be mounted next.

Thereafter, when the recognition unit 30 is retracted from below the mounting head 27, the mounting head 27 is lowered and the upper chip 15 is mounted on the lower chip 14, as shown in FIG. At this time, the solder bump 15a is correctly aligned with the connection electrode 14a by controlling the positioning table 16 in consideration of the positional deviation between the connection electrode 14a and the solder bump 15a obtained by the above recognition process. During this mounting operation, the component transfer head 21 is in a standby state in the component storage unit 2 with the second component holding nozzle 22B facing downward.

  Then, the upper chip 15 is heated by the mounting head 27, the solder bump 15 a is melted and soldered to the connection electrode 14 a, so that the upper chip 15 held by the mounting head 27 is placed on the mounting stage 18. Mounted on the chip 14. Thereby, the mounting body 19 in which the upper chip 15 is mounted on the lower chip 14 is formed. At this time, the height position of the mounting head 27 is controlled to keep the distance between the upper chip 15 and the lower chip 14 proper, thereby preventing problems caused by the flow of molten solder in which the solder bumps 15a are melted. ing.

  After the solder bonding is completed, if the suction holding of the lower chip 14 by the mounting stage 18 is released and the mounting head 27 is raised, the mounting body 19 is carried out. That is, as shown in FIG. 4C, the component transfer head 21 that has been in a standby state in the component storage unit 2 is moved to the component mounting position [P2] and is lowered with respect to the mounting stage 18, and the second component. The upper chip 15 of the mounting body 19 is held by the holding nozzle 22B. Next, as shown in FIG. 4D, the component transfer head 21 is moved to the component storage portion 2, and the upper chip 15 held by the second component holding nozzle 22 </ b> B together with the lower chip 14 is the first component. It is stored in the tray 13A.

  As described above, in the component mounting apparatus according to the first embodiment, the lower chip 14 is taken out from the first component tray 13A by the first component holding nozzle 22A having at least a contact surface made of a soft material. The upper chip 15 placed on the mounting stage 18 and taken out from the second component tray 13B by the first component holding nozzle 22A is delivered to and held by the mounting head 27. Then, the upper chip 15 held by the mounting head 27 is mounted on the lower chip 14 placed on the mounting stage 18 and mounted by thermocompression bonding, and the upper chip 15 mounted on the lower chip 14 is further heated at the heating temperature in thermocompression bonding. In contrast, a configuration is adopted in which the second component holding nozzle 22 </ b> B having heat resistance is carried out from the mounting stage 18.

  Thereby, in the component transfer operation in which the lower chip 14 and the upper chip 15 are taken out from the component storage unit 2 and supplied, a high-speed transfer operation can be realized with almost no damage to the lower chip 14 and the upper chip 15. In addition, component mounting for manufacturing a semiconductor device having a chip-on-chip structure can be efficiently performed with almost no component damage.

(Embodiment 2)
FIG. 5 is a perspective view of the component mounting apparatus according to the second embodiment of the present invention, FIG. 6 is a front view of the component mounting apparatus according to the second embodiment of the present invention, and FIGS. FIG. 10 is a process explanatory diagram illustrating the component mounting method according to mode 2. 5 and 6, the component mounting apparatus 1A has substantially the same configuration as the component mounting apparatus 1 shown in FIG. That is, in the component storage unit 2, in addition to the first component tray 13A and the second component tray 13B, a nozzle tray 13C that stores two types of component holding nozzles is disposed, and the components in the component transfer unit 4 The configuration of each part is the same as that of the component mounting apparatus 1 except that the arrangement of the holding nozzles is different.

  Hereinafter, only the parts different from those of the first embodiment will be described. In the component storage unit 23, the first component tray 13 </ b> A, the second component tray 13 </ b> B, and the nozzle tray 13 </ b> C are held on the upper surface of the component storage table 12. In the nozzle tray 13C, the same first component holding nozzle 22A and second component holding nozzle 22B as in the first embodiment are stored in a normal rotation posture with the contact surface with the component facing downward.

In the component transfer unit 4, the component transfer head 21 is a single-nozzle type component transfer head that transfers components by one component holding nozzle, and any one of the first component holding nozzle 22A and the second component holding nozzle 22B. Can be installed interchangeably. The first component holding nozzle 2 housed in the nozzle tray 13C by driving the positioning table 11
2A and the second component holding nozzle 22B can be aligned with the mounting position on the component transfer head 21. As a result, either the first component holding nozzle 22A or the second component holding nozzle 22B is selected and mounted on the component transfer head 21 as necessary. Therefore, the nozzle tray 13C serves as a nozzle accommodating portion that accommodates the first component holding nozzle 22A and the second component holding nozzle 22B in a replaceable manner.

  Next, a component mounting operation by the component mounting apparatus 1A will be described with reference to FIG. 7, FIG. 8, and FIG. First, as shown in FIG. 7A, the component transfer head 21 on which the first component holding nozzle 22 </ b> A is mounted is moved above the first component tray 13 </ b> A of the component storage unit 2. Then, the first component holding nozzle 22A is positioned and lowered on the lower chip 14 to be mounted, and the lower chip 14 is sucked and held from the circuit forming surface side. Thereafter, the lower chip 14 is taken out from the first component tray 13A by the component transfer head 21 and moved to the component delivery position [P1] of the component positioning unit 3 as shown in FIG. The lower chip 14 is transferred to the mounting stage 18 that has been moved to the position [P1].

  Thereafter, the component transfer head 21 in which the lower chip 14 is released from being held by the first component holding nozzle 22A is moved upward of the component storage portion 2 as shown in FIG. Then, the first component holding nozzle 22A is positioned and lowered on the upper chip 15 accommodated in the second component tray 13B, and the upper chip 15 is held.

  Thereafter, the component transfer head 21 takes out the upper chip 15 held by the first component holding nozzle 22A from the second component tray 13B and moves to the component delivery position [P1] as shown in FIG. 7D. Then, by rotating the component transfer head 21 by 180 degrees during the movement, the upper chip 15 held by the first component holding nozzle 22A is turned upside down. Then, by raising the component transfer head 21 from the lower surface side of the mounting head 27, the component transfer head 21 is moved upward to the component mounting nozzle 28 of the mounting head 27 that has already been moved from the component mounting position [P2] to the component delivery position [P1]. The chip 15 is held in a face-down posture with the circuit formation surface facing downward. In parallel with this operation, in the component positioning unit 3, the mounting stage 18 on which the lower chip 14 is placed returns to the component mounting position [P2].

  After that, if the mounting head 27 holding the upper chip 15 moves to the component mounting position [P2], the recognition unit 30 is placed between the mounting stage 18 and the mounting head 27 as shown in FIG. The lower chip 14 and the upper chip 15 are imaged by the same imaging operation by the two-field optical system provided in the recognition unit 30. The imaging result is recognized by a recognition means (not shown), and the connection electrode 14a of the lower chip 14 and the solder bump 15a of the upper chip 15 are recognized. Based on the recognition result, the positional deviation between the connection electrode 14a and the solder bump 15a is detected.

  Thereafter, when the recognition unit 30 is retracted from below the mounting head 27, the mounting head 27 is lowered and the upper chip 15 is mounted on the lower chip 14, as shown in FIG. At this time, the solder bump 15a is correctly aligned with the connection electrode 14a by controlling the positioning table 16 in consideration of the positional deviation between the connection electrode 14a and the solder bump 15a obtained by the above recognition process.

  Then, the upper chip 15 is heated by the mounting head 27, the solder bump 15 a is melted and solder-bonded to the connection electrode 14 a, thereby mounting the upper chip 15 on the lower chip 14. Thereby, the mounting body 19 in which the upper chip 15 is mounted on the lower chip 14 is formed. At this time, the height position of the mounting head 27 is controlled to keep the distance between the upper chip 15 and the lower chip 14 proper, thereby preventing problems caused by the flow of molten solder in which the solder bumps 15a are melted. ing.

  During solder bonding or after solder bonding is completed, the component transfer head 21 moves onto the nozzle tray 13C of the component storage unit 2 and performs a nozzle replacement operation here. That is, as shown in FIG. 8C, the first component holding nozzle 22A is aligned with the nozzle tray 13C with the nozzle mounting surface side facing downward. Thereafter, as shown in FIG. 8D, the first component holding nozzle 22A is detached from the component transfer head 21 and placed on the nozzle tray 13C, and then the component transfer is performed as shown in FIG. 9A. The head 21 is aligned with the second component holding nozzle 22B on the nozzle tray 13C, and the second component holding nozzle 22B is mounted on the component transfer head 21.

  Thereafter, the component transfer head 21 moves to the component delivery position [P1], and the mounting body 19 on the mounting stage 18 that has been moved to the component delivery position [P1] in advance is held by the second component holding nozzle 22B. Next, as shown in FIG. 9C, the component transfer head 21 holding the mounting body 19 by the second component holding nozzle 22B is moved to the component storage unit 2 and held by the second component holding nozzle 22B. The upper chip 15 is stored together with the lower chip 14 in the first component tray 13A.

  As described above, in the second embodiment, the lower chip 14 is taken out from the first component tray 13A by the component transfer head 21 to which the first component holding nozzle 22A is mounted and placed on the mounting stage 18. The upper chip 15 taken out from the second component tray 13B by the component transfer head 21 to which the first component holding nozzle 22A is mounted is received by the mounting head 27, and the upper chip 15 mounted on the lower chip 14 is second The component holding nozzle 22 </ b> B is held by the component transfer head 21 and is carried out from the mounting stage 18 together with the lower chip 14. Also in the second embodiment, the same effect as in the first embodiment is obtained by the above configuration.

(Embodiment 3)
10 is a perspective view of the component mounting apparatus according to the third embodiment of the present invention, FIG. 11 is a front view of the component mounting apparatus according to the third embodiment of the present invention, and FIGS. 12 and 13 are diagrams according to the third embodiment of the present invention. It is process explanatory drawing which shows a component mounting method. 10 and 11, the component mounting apparatus 1B has a configuration similar to that of the component mounting apparatus 1 shown in FIG. That is, on the right side of the component positioning unit 3, the component unloading unit 6 that unloads the mounted component is disposed, the component holding nozzle is differently disposed in the component transfer unit 4, and the component holding nozzle is The configuration of each part is the same as that of the component mounting apparatus 1 except that the function of the second component holding nozzle 22B is shared.

  Hereinafter, only the parts different from those of the first embodiment will be described. In the component transfer unit 4, the component transfer head 21 is a single nozzle type component transfer head provided with one component holding nozzle, and by mounting the first component holding nozzle 22A similar to that of the first embodiment, Both the lower chip 14 and the upper chip 15 can be held. In the third embodiment, the component holding nozzle 28 functions as a second component holding nozzle, and the component holding nozzle 28 has heat resistance to the temperature of the upper chip 15 heated in thermocompression bonding. In addition, it is made of a material such as a metal or ceramic that has heat resistance to the heating temperature in thermocompression bonding.

The component carry-out unit 6 disposed on the right side of the component positioning unit 3 includes a component storage tray 32 that can be moved in the X direction by the conveyor 31. In addition, the mounting head 27 performs a component transfer operation between the mounting stage 18 positioned at the component mounting position [P2] and the component storage tray 32 positioned at the left end portion of the transfer conveyor 31, and the lower chip 14 is mounted on the mounting stage 18. Then, the mounting body 19 constituted by mounting the upper chip 15 is carried out to the component storage tray 32. Therefore, the mounting head 27 also serves as a component unloading means for unloading the upper chip 15 mounted on the lower chip 14 from the mounting stage 18 together with the lower chip 14. In addition to the mounting head 27, a component carry-out head on which a component holding nozzle 22B capable of sucking and holding the upper chip 15 is mounted may be provided. In this case, the component carry-out head is configured to be able to reciprocate and move up and down in the X direction by the carrying head moving mechanism.

  Next, a component mounting operation by the component mounting apparatus 1A will be described with reference to FIGS. First, as shown in FIG. 12A, the component transfer head 21 is moved above the first component tray 13A of the component storage unit 2, and the first component holding nozzle 22A is positioned on the lower chip 14 to be mounted. The lower chip 14 is sucked and held from the circuit forming surface side. Thereafter, the lower chip 14 is taken out from the first component tray 13A by the component transfer head 21 and moved to the component delivery position [P1] of the component positioning unit 3 as shown in FIG. The lower chip 14 is transferred to the mounting stage 18 that has been moved to the position [P1].

  Thereafter, the component transfer head 21 that has released the holding of the lower chip 14 by the first component holding nozzle 22A is moved upward of the component storage portion 2 as shown in FIG. Then, the first component holding nozzle 22A is positioned and lowered on the upper chip 15 accommodated in the second component tray 13B, and the upper chip 15 is held.

  Thereafter, the component transfer head 21 takes out the upper chip 15 held by the first component holding nozzle 22A from the second component tray 13B and moves to the component delivery position [P1] as shown in FIG. Then, by rotating the component transfer head 21 by 180 degrees during the movement, the upper chip 15 held by the component holding nozzle 22 is turned upside down. Then, by raising the component transfer head 21 from the lower surface side of the mounting head 27, the second component holding nozzle of the mounting head 27 that has already been moved from the component mounting position [P2] to the component delivery position [P1]. The component holding nozzle 28 holds the upper chip 15 in a face-down posture with the circuit forming surface facing downward. In parallel with this operation, in the component positioning unit 3, the mounting stage 18 on which the lower chip 14 is placed returns to the component mounting position [P2].

  After that, if the mounting head 27 holding the upper chip 15 moves to the component mounting position [P2], the recognition unit 30 is placed between the mounting stage 18 and the mounting head 27 as shown in FIG. The lower chip 14 and the upper chip 15 are imaged by the same imaging operation by the two-field optical system provided in the recognition unit 30. The imaging result is recognized by a recognition means (not shown), and the connection electrode 14a of the lower chip 14 and the solder bump 15a of the upper chip 15 are recognized (recognition process). Based on the recognition result, the positional deviation between the connection electrode 14a and the solder bump 15a is detected.

  Thereafter, when the recognition unit 30 is retracted from below the mounting head 27, the mounting head 27 is lowered and the upper chip 15 is mounted on the lower chip 14, as shown in FIG. 13B. At this time, the solder bump 15a is correctly aligned with the connection electrode 14a by controlling the positioning table 16 in consideration of the positional deviation between the connection electrode 14a and the solder bump 15a obtained by the above recognition process.

  Then, the upper chip 15 is heated by the mounting head 27, the solder bump 15 a is melted and solder-bonded to the connection electrode 14 a, thereby mounting the upper chip 15 on the lower chip 14. Thereby, the mounting body 19 in which the upper chip 15 is mounted on the lower chip 14 is formed. At this time, the height position of the mounting head 27 is controlled to keep the distance between the upper chip 15 and the lower chip 14 proper, thereby preventing problems caused by the flow of molten solder in which the solder bumps 15a are melted. ing.

After the solder bonding is completed, the suction holding of the lower chip 14 by the mounting stage 18 is released, the mounting head 27 is raised, and the mounting body 19 is carried out. That is, the mounting head 27 holding the mounting body 19 by the second component holding nozzle 22B is relatively moved to the component carry-out section 6, and the upper chip 15 held by the component holding nozzle 28 as the second component holding nozzle is moved. The component is stored in the component storage tray 32 together with the lower chip 14 (unloading process).

  As described above, in the component mounting apparatus according to the third embodiment, the lower chip 14 is taken out from the first component tray 13A by the first component holding nozzle 22A and placed on the mounting stage 18, and the first component holding nozzle 22A The upper chip 15 taken out from the second component tray 13B by the component holding nozzle 22A is received by the mounting head 27, and the upper chip 15 mounted on the lower chip 14 is held as a second component holding nozzle of the mounting head 27. It is held by the nozzle 28 and carried out together with the lower chip 14 from the mounting stage 18 to the component carrying-out unit 6. Also in the third embodiment, the same effect as in the first embodiment is obtained by the above configuration.

  As described above, in each of the first, second, and third embodiments, in the component mounting method in which the upper chip 15 is mounted on the lower chip 14 by thermocompression bonding, the first component is formed of a soft material at least in contact with the lower chip 14 It is held by the holding nozzle 22A and placed on the mounting stage 18, and the upper chip 15 held by the first component holding nozzle 22A is transferred and held by the mounting head 27, and the upper chip 15 held by the mounting head 27 is held. A second component holding nozzle which is mounted on the lower chip 14 mounted on the mounting stage 18 and mounted by thermocompression bonding, and the upper chip 15 mounted on the lower chip 14 has heat resistance against the heating temperature in thermocompression bonding. And is carried out from the mounting stage 18 together with the lower chip 14.

  INDUSTRIAL APPLICABILITY The component mounting apparatus and the component mounting method according to the present invention have the effect of being able to efficiently perform component mounting for manufacturing a semiconductor device having a chip-on-chip structure, and have a structure in which two semiconductor chips are stacked. It can be used in the manufacturing field.

The perspective view of the component mounting apparatus of Embodiment 1 of this invention The front view of the component mounting apparatus of Embodiment 1 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 1 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 1 of this invention The perspective view of the component mounting apparatus of Embodiment 2 of this invention The front view of the component mounting apparatus of Embodiment 2 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 2 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 2 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 2 of this invention The perspective view of the component mounting apparatus of Embodiment 3 of this invention The front view of the component mounting apparatus of Embodiment 3 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 3 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 3 of this invention

Explanation of symbols

1, 1A, 1B Component mounting device 2 Component storage unit 3 Component positioning unit 4 Component transfer unit 5 Component mounting unit 6 Component unloading unit 13A First component tray 13B Second component tray 13C Nozzle tray 14 Lower chip 15 Upper chip 18 Mounting stage 19 Mounting body 21 Component transfer head 22A First component holding nozzle 22B Second component holding nozzle 27 Mounting head

Claims (7)

A component mounting apparatus for mounting a second component on a first component by thermocompression bonding,
A first component supply unit that supplies the first component; a second component supply unit that supplies the second component; a mounting stage on which the first component is placed; and at least a component A component transfer head mounted with a first component holding nozzle having a contact surface made of a soft material and a second component holding nozzle having heat resistance against the temperature of the second component heated in the thermocompression bonding. A component transfer means provided; and a mounting means for holding the second component by a mounting head and mounting the component on the first component placed on the mounting stage and mounting by thermocompression bonding,
The first component holding nozzle removes the first component from the first component supply unit and places it on the mounting stage, and the first component holding nozzle removes the first component from the second component supply unit. The second component is transferred to and held by the mounting head, the second component mounted on the first component is held by the second component holding nozzle, and the mounting stage together with the first component. A component mounting apparatus characterized by being carried out from a machine. A component mounting apparatus for mounting a second component on a first component by thermocompression bonding,
A first component supply unit that supplies the first component; a second component supply unit that supplies the second component; a mounting stage on which the first component is placed; and at least a component Nozzle housing for exchangeably storing a first component holding nozzle having a contact surface made of a soft material and a second component holding nozzle having heat resistance with respect to the temperature of the second component heated in the thermocompression bonding. A component transfer means including a component transfer head capable of detachably mounting the first component holding nozzle and the second component holding nozzle, and the mounting stage by holding the second component by a mounting head. Mounting means for mounting on the first component mounted on and mounted by thermocompression bonding,
The first component is taken out from the first component supply unit by the component transfer head to which the first component holding nozzle is mounted and placed on the mounting stage, and the first component holding nozzle is mounted. The second component picked up from the second component supply unit by the component transfer head is received by the mounting head, and the second component holding nozzle receives the second component mounted on the first component. A component mounting apparatus which is held by a mounted component transfer head and is carried out of the mounting stage together with the first component. A component mounting apparatus for mounting a second component on a first component by thermocompression bonding,
A first component supply unit that supplies the first component; a second component supply unit that supplies the second component; a mounting stage on which the first component is placed; and at least a component A component transfer means having a component transfer head mounted with a first component holding nozzle having a contact surface made of a soft material, and a second component holding nozzle having heat resistance against the heating temperature in the thermocompression bonding are mounted. Mounting means for holding the second component by the mounted head and mounting on the first component mounted on the mounting stage and mounting by thermocompression bonding,
The first component holding nozzle removes the first component from the first component supply unit and places it on the mounting stage, and the first component holding nozzle removes the first component from the second component supply unit. The second component is received by the mounting head, and the second component mounted on the first component is held by the second component holding nozzle of the mounting head, together with the first component, the mounting stage. A component mounting apparatus characterized by being carried out from a machine. A first component supply unit that supplies a first component, a second component supply unit that supplies a second component, a mounting stage on which the first component is placed, and at least contact with the component A first component holding nozzle having a surface made of a soft material, and a component transfer head mounted with a second component holding nozzle having heat resistance against the temperature of the second component heated in the thermocompression bonding. By a component mounting apparatus comprising component transfer means and mounting means for holding the second component by a mounting head and mounting the second component on the first component mounted on the mounting stage and mounting by thermocompression bonding A component mounting method for mounting the second component on the first component by thermocompression bonding,
The first component holding nozzle removes the first component from the first component supply unit and places it on the mounting stage, and the first component holding nozzle removes the first component from the second component supply unit. The second component is held by the mounting head, and the second component mounted on the first component is held by the second component holding nozzle and carried out of the mounting stage together with the first component. A component mounting method characterized by: A first component supply unit that supplies a first component, a second component supply unit that supplies the second component, a mounting stage on which the first component is placed, and at least a component Nozzle storage section for exchangeably storing a first component holding nozzle whose contact surface is made of a soft material and a second component holding nozzle having heat resistance against the temperature of the second component heated in the thermocompression bonding A component transfer means having a component transfer head capable of mounting the first component holding nozzle and the second component holding nozzle in a replaceable manner, and holding the second component by a mounting head on the mounting stage. A component mounting method in which the second component is mounted on the first component by thermocompression bonding using a component mounting apparatus including a mounting unit that is mounted on the mounted first component and mounted by thermocompression bonding. There,
The first component is taken out from the first component supply unit by the component transfer head to which the first component holding nozzle is mounted and placed on the mounting stage, and the first component holding nozzle is mounted. The second component picked up from the second component supply unit by the component transfer head is received by the mounting head, and the second component holding nozzle receives the second component mounted on the first component. A component mounting method, wherein the component is unloaded from the mounting stage by a mounted component transfer head. A first component supply unit that supplies the first component; a second component supply unit that supplies the second component; a mounting stage on which the first component is placed; and at least a component A component transfer means having a component transfer head mounted with a first component holding nozzle having a contact surface made of a soft material, and a second component holding nozzle having heat resistance against the heating temperature in the thermocompression bonding are mounted. The first component is mounted by a component mounting apparatus that includes a mounting unit that holds the second component by the mounted mounting head, mounts the second component on the first component mounted on the mounting stage, and mounts the first component by thermocompression bonding. A component mounting method for mounting the second component on a component by thermocompression bonding,
The first component holding nozzle removes the first component from the first component supply unit and places it on the mounting stage, and the first component holding nozzle removes the first component from the second component supply unit. The second component is received by the mounting head, and the second component mounted on the first component is held by the second component holding nozzle of the mounting head, together with the first component, the mounting stage. A component mounting method characterized by being carried out from a machine. A component mounting method for mounting a second component on a first component by thermocompression bonding,
The first component is held by a first component holding nozzle having at least a contact surface with the component made of a soft material, placed on a mounting stage, and the second component held by the first component holding nozzle. The component is delivered to and held by a mounting head, the second component held by the mounting head is mounted on the first component placed on the mounting stage, and is mounted by thermocompression bonding. The first component The second component mounted on the second component is held by a second component holding nozzle having heat resistance to the temperature of the second component heated in the thermocompression bonding, and is carried out from the mounting stage together with the first component. A component mounting method characterized by:

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