JP4742719B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component on top of the component.

In the field of manufacturing electronic devices, a component mounting operation for mounting a semiconductor chip on a workpiece such as a substrate is performed. In this component mounting operation, a transfer operation in which a semiconductor chip on which connection electrodes such as solder bumps are formed is taken out of the component supply unit and transferred to the substrate, and the connection electrode of the mounted semiconductor chip is used as a circuit on the substrate. A joining operation for joining the electrodes is performed. As an apparatus for performing such component mounting work, a component reversing mechanism that takes a semiconductor chip out of a component supply unit and flips it up and down and a transfer head that mounts a semiconductor chip delivered from the component reversing mechanism on a substrate are conventionally provided. A component mounting apparatus is known (see, for example, Patent Document 1).
Japanese Patent No. 3132353

  Incidentally, in recent years, with the progress of downsizing and higher functionality of electronic devices, it is required to further increase the mounting density of a mounting board incorporated in the electronic device. As a mounting form to cope with such high-density mounting, a semiconductor device having a so-called chip-on-chip structure in which a plurality of semiconductor chips are superposed has been adopted. Such a semiconductor device is manufactured by bonding the bumps formed on the circuit formation surface with the circuit formation surfaces of the two semiconductor chips facing each other.

  However, since the component mounting apparatus shown in the above-mentioned patent document example is configured for the purpose of transferring and mounting a semiconductor chip on a substrate that is large and easy to handle, two semiconductor chips having substantially the same size are used. It was not always suitable for the work of joining the two. Therefore, there has been a demand for a component mounting apparatus and a component mounting method that can efficiently perform a component mounting operation for manufacturing a semiconductor device having a chip-on-chip structure.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that can efficiently perform a component mounting operation for manufacturing a semiconductor device having a chip-on-chip structure.

The component mounting apparatus according to the present invention is a component mounting apparatus that mounts a second component on a first component, and supplies a first component supply unit that supplies the first component and the second component. to the second component supply unit, said a mounting stage in which the first part is placed, mounted on the second of said first component that is mounted on the mounting stage to hold the mounting head part Mounting means, first component delivery means for taking out the first component from the first component supply section and placing it on the mounting stage, and removing the second component from the second component supply section. Second component delivery means that is taken out and held by the mounting head, and the first component delivery means and the second component delivery means are simultaneously moved relative to the mounting stage and the mounting head in a single operation. by, the first component and the second component And a delivery movement means you transport in a single transport operation.

Component bonding method of the present invention is a component mounting method for mounting the second component to the first component, taken from the first component supply unit by the first component to the first component transfer unit the first component delivery step and, second component delivery step of holding the second part of the second component transfer unit mounting head is removed from the second component supply unit by the placing the mounting stage Te And a mounting step of mounting the second component held by the mounting head on the first component placed on the mounting stage, and in the first component delivery step and the second component delivery step The first component delivery means and the second component delivery means are moved simultaneously relative to the mounting stage and the mounting head in a single operation to move the first component and the second component. transport in one of the transport operation.

According to the present invention, the first component delivery step of taking out the first component from the first component supply unit by the first component delivery means and delivering it to the mounting stage, and the second component delivery means as the second component delivery means. In the second component delivery step in which the first component delivery means and the second component delivery means are removed from the second component supply unit and held by the mounting head by a single operation with respect to the mounting stage and the mounting head. are relatively moved at the same time, by conveying the first part and the second part in a single transport operation, be performed component mounting operation for manufacturing a semiconductor device of chip-on-chip structure efficiently it can.

(Embodiment 1)
1 is a perspective view of a component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a front view of the component mounting apparatus according to the first embodiment of the present invention, and FIGS. 3 and 4 are diagrams according to the first embodiment of the present invention. It is process explanatory drawing which shows a component mounting method.

  First, the structure of the component mounting apparatus 1 will be described with reference to FIGS. The component mounting apparatus 1 is used for forming a chip-on-chip mounting body (semiconductor device) in which semiconductor chips having substantially the same size are directly stacked and mounted. In FIG. 1, a component mounting apparatus 1 includes a component storage unit 2 and a component positioning unit 3 arranged in series in the X direction (component transport direction), and a component transfer unit 4 and a component mounting unit 5 disposed in the X direction above the component storage unit 2 and component positioning unit 3. The arrangement is arranged. On the right side of the component positioning unit 3, a component unloading unit 6 for unloading the mounted components is disposed.

  The configuration of each part will be described. The component storage unit 2 has a configuration in which a component storage table 12 is mounted on a positioning table 11 in which an X-axis table 11X and a Y-axis table 11Y are stacked. A first component tray 13A and a second component tray 13B are held on the upper surface of the component storage table 12, and each of the first component tray 13A and the second component tray 13B includes a first component tray. A certain lower chip 14 and an upper chip 15 which is a second component are accommodated in a lattice-like regular array.

  By driving the positioning table 11, the first component tray 13A and the second component tray 13B on the component storage table 12 move horizontally in the X direction and the Y direction. As a result, the lower chip 14 and the upper chip 15 are aligned with respect to the component transfer unit 4, and the aligned lower chip 14 and upper chip 15 are taken out by the component transfer unit 4 and are respectively positioned to the component positioning units 3 and 3. Supplied to the component mounting unit 5. Therefore, the first component tray 13A is a first component supply unit that supplies the first component, and the second component tray 13B is a second component supply unit that supplies the second component. Yes.

The lower chip 14 and the upper chip 15 are rectangular parts having substantially the same size. As shown in FIG. 2, the connection electrode 14a is provided on the circuit formation surface of the lower chip 14 and the solder is provided on the circuit formation surface of the upper chip 15. Bumps 15a are provided. Both the lower chip 14 and the upper chip 15 are housed in the first component tray 13A and the second component tray 13B in a so-called face-up posture with the circuit formation surface facing upward. The component mounting apparatus 1 performs a component mounting operation in which the lower chip 14 and the upper chip 15 taken out from the first component tray 13A and the second component tray 13B are stacked and mounted. In this component mounting operation, the upper chip 15 is mounted on the lower chip 14, and the solder bump 15
This is performed by soldering a to the connection electrode 14a.

  The component positioning unit 3 has a configuration in which a moving block 17 is mounted on a positioning table 16 in which an X-axis table 16X and a Y-axis table 16Y are stacked. A mounting stage 18 on which the lower chip 14 is placed is provided on the upper surface of the moving block 17. The mounting stage 18 is provided with a suction hole 18a, and the lower chip 14 is sucked and held by the mounting stage 18 by vacuum suction from the suction hole 18a with the lower chip 14 placed on the mounting stage 18. .

  By driving the positioning table 16, the mounting stage 18 moves horizontally in the X direction and the Y direction, whereby the lower chip 14 held on the mounting stage 18 is aligned with the component mounting unit 5. Further, when the lower chip 14 taken out from the component storage unit 2 by the component transfer unit 4 described below is placed on the mounting stage 18, the mounting stage 18 is moved to the left in the X direction by the X-axis table 16X. It is located at the part delivery position [P1] shown in FIG.

  The component transfer unit 4 is configured to reciprocate the component transfer head 21 in the X direction by a moving table 20 disposed in the X direction. The component transfer head 21 is provided with a first component holding nozzle 22A and a second component holding nozzle 22B for holding and taking out the lower chip 14 and the upper chip 15, respectively, in a 180 degree equidistant arrangement. . The first component holding nozzle 22 </ b> A and the second component holding nozzle 22 </ b> B are individually movable up and down by an elevating mechanism built in the component transfer head 21.

  The component transfer head 21 has a built-in reversing mechanism for vertically reversing the first component holding nozzle 22A and the second component holding nozzle 22B, and is 180 degrees around the rotation shaft 21a provided in the Y direction. Rotation is possible. Thereby, it is possible to operate in a state where one of the first component holding nozzle 22A and the second component holding nozzle 22B is in a downward posture and the other is in an upward posture.

  That is, the component transfer head 21 can take out the lower chip 14 and the upper chip 15 from the component storage unit 2 by the first component holding nozzle 22A and the second component holding nozzle 22B in the downward posture, and the second component holding head 22 in the downward posture. By rotating the component transfer head 21 holding the upper chip 15 by 180 degrees by the component holding nozzle 22B, the upper chip 15 can be turned upside down with the second component holding nozzle 22B in an upward posture. .

  When the lower chip 14 is taken out from the first component tray 13A and transferred to the mounting stage 18, the component transfer head 21 holding the lower chip 14 is moved to the component delivery position [P1] shown in FIG. Here, the first component holding nozzle 22A is moved up and down, and the held lower chip 14 is placed on the mounting stage 18 that has been moved to the component delivery position [P1] in advance.

  The component mounting unit 5 is configured to reciprocate the mounting head 27 in the X direction by the moving table 25 arranged in the X direction. The mounting head 27 includes a component mounting nozzle 28 that is moved up and down by a head lifting mechanism 26 and holds the upper chip 15 in a face-down posture. The component transfer head 21 that has taken out the upper chip 15 from the second component tray 13B is moved to the component delivery position [P1] shown in FIG. 2 to rotate the component transfer head 21, and the mounting head 27 is moved to the component delivery position. By moving to [P1], the upper chip 15 held by the second component holding nozzle 22B can be transferred to the mounting head 27. At this time, in the second component tray 13B, the upper chip 15 having the face-up posture with the solder bumps 15a facing upward is turned upside down by the component transfer head 21 to face down with the solder bumps 15a facing downward. The posture is transferred to the mounting head 27.

  In the above configuration, the first component holding nozzle 22 </ b> A provided in the component transfer head 21 serves as a first component delivery means for taking out the lower chip 14 from the first component tray 13 </ b> A and placing it on the mounting stage 18. Yes. Further, the reversing mechanism for reversing the second component holding nozzle 22B and the second component holding nozzle 22B provided in the component transfer head 21 takes out the upper chip 15 from the second component tray 13B and flips it upside down. Thus, the second component delivery means is delivered to the mounting head 27.

  In other words, the second component delivery means includes a second component holding nozzle 22B and a reversing mechanism that reverses the second component holding nozzle 22B up and down. The first component holding nozzle 22A is configured to be turned upside down. The lifting mechanism built in the moving table 20 and the component transfer head 21 of the component transfer unit 4 includes a first component holding nozzle 22A that is a first component delivery means and a second component that is a second component delivery means. It is a delivery moving means for moving the holding nozzle 22B relative to the mounting stage 18 and the mounting head 27.

The mounting head 27 after receiving the upper chip 15 moves to the component mounting position [P2], and by performing an elevating operation here, the lower part on the mounting stage 18 that has moved the upper chip 15 to the component mounting position [P2]. Mounted on the chip 14. The mounting head 27 incorporates a heating means as a joining means so that the upper chip 15 can be heated via the component mounting nozzle 28. In the mounting operation in which the upper chip 15 held by the mounting head 27 is lowered with respect to the lower chip 14 placed on the mounting stage 18 and the solder bumps 15a are brought into contact with the connection electrodes 14a, the upper chip 15 is mounted by the mounting head 27. Is heated, and the solder bump 15a is melted and soldered to the connection electrode 14a, whereby the upper chip 15 is mounted on the lower chip 14. The component mounting unit 5 is a mounting means for holding the upper chip 15 by the mounting head 27 and mounting it on the lower chip 14 placed on the mounting stage 18.

  In addition, although the heating means built in the mounting head 27 was illustrated as a joining means which joins the upper chip 15 which is a 2nd component to the lower chip 14 which is a 1st component, a joining means is not restricted to this. Absent. Vibration may be applied by vibration applying means provided on the mounting head 27, or heating by a heater and vibration application may be used in combination. Further, a joining means such as a heater may be provided on the mounting stage 18 side.

  A recognition unit 30 is disposed obliquely above the chip positioning unit 3. The recognition unit 30 includes a two-field optical system capable of capturing an upper imaging field and a lower imaging field by a single imaging operation, and is movable forward and backward in the Y direction by a moving mechanism (not shown). The recognition unit 30 is placed between the mounting stage 18 and the mounting head 27 in a state where the lower chip 14 is placed on the mounting stage 18 and the mounting head 27 that holds the upper chip 15 by suction is positioned immediately above the mounting stage 18. By advancing, the lower chip 14 and the upper chip 15 can be imaged and recognized by the same imaging operation. The recognition unit 30 serves as a recognition means for optically recognizing the lower chip 14 on the mounting stage 18 and the upper chip 15 held by the mounting head 27.

The component carry-out unit 6 disposed on the right side of the component positioning unit 3 is a component on which a component storage tray 32 that can be moved in the X direction by the conveyor 31 and a component holding nozzle 34 that can hold the upper chip 15 by suction are mounted. A carry-out head 33 is provided. The component carry-out head 33 can be reciprocated and moved up and down in the X direction by a transfer head moving mechanism (not shown). As a result, the component carry-out head 33 performs a component transfer operation between the mounting stage 18 positioned at the component mounting position [P2] and the component storage tray 32 positioned at the left end of the conveyor 31. That is, the mounting body 19 formed by mounting the upper chip 15 on the lower chip 14 on the mounting stage 18 is held by the component carry-out head 33 and carried to the component storage tray 32. Therefore, the component carry-out head 33 is a component carry-out means for carrying out the upper chip 15 mounted on the lower chip 14 from the mounting stage 18 together with the lower chip 14.

Next, a component mounting operation by the component mounting apparatus 1 will be described with reference to FIGS. First, as shown in FIG. 3A, the component transfer head 21 with the second component holding nozzle 22 </ b> B facing downward is moved above the second component tray 13 </ b> B of the component storage unit 2. Then, the second component holding nozzle 22B is positioned and lowered on the upper chip 15 to be mounted, and the upper chip 15 is sucked and held from the circuit forming surface side. Next, the component transfer head 21 is rotated 180 degrees, the component transfer head 21 with the first component holding nozzle 22A facing downward is moved above the first component tray 13A, and as shown in FIG. The lower chip 14 is sucked and held by the first component holding nozzle 22A.

  Thereafter, an operation of transferring the lower chip 14 and the upper chip 15 to the component positioning unit 3 and the component mounting unit 5 by the component transfer head 21 is executed. That is, as shown in FIG. 3C, the component transfer head 21 holding the lower chip 14 and the upper chip 15 in the first component holding nozzle 22A and the second component holding nozzle 22B, respectively, Face-up with the lower chip 14 held by the first component holding nozzle 22A facing the mounting stage 18 that has been moved to the component delivery position [P1] and previously moved to the component delivery position [P1]. Place in posture. Next, the mounting head 27 is moved to the component delivery position [P1], and the upper chip 15 held by the second component holding nozzle 22B is moved to the component mounting nozzle 28 of the mounting head 27 as shown in FIG. Are held in a face-down posture with the solder bumps 15a facing downward.

  The operations shown in FIGS. 3A to 3D are the first component delivery in which the lower chip 14 is taken out from the first component tray 13A by the first component delivery means and placed on the mounting stage 18. The process and the 2nd component delivery process which takes out upper chip 15 from the 2nd component tray 13B by the above-mentioned 2nd component delivery means, and makes it hold on mounting head 27 are shown. In the first component delivery step and the second component delivery step, the first component delivery means and the second component delivery means are moved simultaneously with respect to the mounting stage 18 and the mounting head 27 by the movement of the component transfer head 21. It is an operation mode in which the lower chip 14 and the upper chip 15 are transported by a single transport operation by relatively moving. Accordingly, it is possible to improve the efficiency of the component conveying operation when the lower chip 14 and the upper chip 15 are taken out from the component storage unit 2 and delivered.

  Thereafter, when the mounting head 27 holding the upper chip 15 moves to the component mounting position [P2], the recognition unit 30 is moved between the mounting stage 18 and the mounting head 27 as shown in FIG. The lower chip 14 and the upper chip 15 are imaged by the same imaging operation by the two-field optical system provided in the recognition unit 30. The imaging result is recognized by a recognition means (not shown), and the connection electrode 14a of the lower chip 14 and the solder bump 15a of the upper chip 15 are recognized. Based on the recognition result, the positional deviation between the connection electrode 14a and the solder bump 15a is detected. In parallel with this imaging operation, the component transfer head 21 returns to the component storage unit 2, moves above the second component tray 13 </ b> B, and is aligned with the upper chip 15 to be mounted next.

Thereafter, when the recognition unit 30 is retracted from below the mounting head 27, the mounting head 27 is lowered and the upper chip 15 is mounted on the lower chip 14, as shown in FIG. At this time, the solder bump 15a is correctly aligned with the connection electrode 14a by controlling the positioning table 16 in consideration of the positional deviation between the connection electrode 14a and the solder bump 15a obtained by the above recognition process. In parallel with this mounting operation, in the component storage unit 2, an operation of holding the upper chip 15 to be mounted next is performed by the second component holding nozzle 22 </ b> B.

  Then, the upper chip 15 is heated by the mounting head 27, the solder bump 15 a is melted and soldered to the connection electrode 14 a, so that the upper chip 15 held by the mounting head 27 is placed on the mounting stage 18. Mounting on the chip 14 (mounting process). Thereby, the mounting body 19 in which the upper chip 15 is mounted on the lower chip 14 is formed. At this time, the height position of the mounting head 27 is controlled to keep the distance between the upper chip 15 and the lower chip 14 proper, thereby preventing problems caused by the flow of molten solder in which the solder bumps 15a are melted. ing.

  After the solder bonding is completed, if the suction holding of the lower chip 14 by the mounting stage 18 is released and the mounting head 27 is raised, the mounting body 19 is carried out. That is, as shown in FIG. 4C, the component carry-out head 33 is moved to the component mounting position [P2] and lowered with respect to the mounting stage 18, and the upper chip 15 of the mounting body 19 is held by the component holding nozzle 34. . In parallel with this operation, in the component storage unit 2, as in the operation shown in FIG. 3B, the component holding operation for holding the lower chip 14 of the first component tray 13A by the first component holding nozzle 22A. Is done.

  Then, the component unloading head 33 performs the component unloading operation, and the upper chip 15 held by the component holding nozzle 34 is unloaded from the mounting stage 18 together with the lower chip 14 and stored in the component storage tray 32. Next, the mounting stage 18 that has been unloaded from the mounting body 19 moves to the component delivery position [P1] as shown in FIG. 4D, where the operation shown in FIG. Similarly, a first component delivery process for placing the lower chip 14 held by the first component holding nozzle 22A on the mounting stage 18 is executed, and thereafter the same operation process is repeatedly executed.

  As described above, in the component mounting apparatus of the present invention, when mounting the upper chip 15 on the lower chip 14, the lower chip 14 is taken out from the first component tray 13A by the first component delivery means and mounted. In the first component delivery step of delivering to the stage 18 and the second component delivery step of taking out the upper chip 15 from the second component tray 13B by the second component delivery means and holding it on the mounting head 27, the first component The delivery means and the second component delivery means are simultaneously moved relative to the mounting stage 18 and the mounting head 27. Thereby, a component mounting operation for manufacturing a semiconductor device having a chip-on-chip structure can be efficiently performed.

(Embodiment 2)
5 is a perspective view of the component mounting apparatus according to the second embodiment of the present invention, FIG. 6 is a front view of the component mounting apparatus according to the second embodiment of the present invention, and FIGS. 7 and 8 are diagrams of the second embodiment of the present invention. It is process explanatory drawing which shows a component mounting method.

  The component mounting apparatus 1A shown in FIGS. 5 and 6 has a configuration in which the component unloading unit 6 is excluded from the component mounting apparatus 1 shown in the first embodiment. The configurations of the component storage unit 2, the component positioning unit 3, the component transfer unit 4, and the component mounting unit 5 are the same as those of the component mounting apparatus 1. In the second embodiment, the mounting body 19 formed by mounting the upper chip 15 on the lower chip 14 on the mounting stage 18 is held by the component transfer head 21 of the component transfer section 4 and stored in the component storage section 2. Thus, a configuration for carrying out from the mounting stage 18 is adopted. That is, in the second embodiment, the component delivery means for taking out the upper chip 15 and the lower chip 14 from the component storage unit 2 and delivering them to the component positioning unit 3 places the upper chip 15 mounted on the lower chip 14 on the mounting stage 18. It is the structure which served as the parts carrying-out means to carry out from.

Next, the component mounting operation by the component mounting apparatus 1A will be described with reference to FIGS. 7A to 7D and FIG. 8A show the same operation contents as those in FIGS. 3A to 3D and FIG. 4A in the first embodiment. As shown in FIG. 8B, in the mounting process in which the upper chip 15 held by the mounting head 27 is mounted on the lower chip 14 placed on the mounting stage 18, the component transfer head 21 in the second embodiment. Waits without performing the operation of holding the next component to be mounted in the component storage unit 2.

  When solder bonding is completed in FIG. 8B, as shown in FIG. 8C, the mounting head 27 is first raised, and then the mounting body 19 formed by mounting the upper chip 15 on the lower chip 14 is mounted. The held mounting stage 18 is moved to the component delivery position [P1]. Then, the component transfer head 21 is moved from the component storage unit 2 to the component delivery position [P1], and the mounting body 19 is held by the second component holding nozzle 22B. Then, as shown in FIG. 8D, the component transfer head 21 is moved to the component storage portion 2, and the mounting body 19 held by the second component holding nozzle 22B is stored in the first component tray 13A.

(Embodiment 3)
FIG. 9A is a structural explanatory diagram of the component transfer head in the component mounting apparatus according to the third embodiment of the present invention, and FIG. 9B is an operation description of the component transfer head in the component mounting apparatus according to the third embodiment of the present invention. FIG. The third embodiment has a nozzle change function that automatically attaches / detaches the component mounting nozzle 28 mounted on the mounting head 27 of the component mounting unit 5 to / from the component transfer head 21 provided in the component transfer unit 4. It is what you have.

  In FIG. 9A, the component transfer head 21 is provided with a first component holding nozzle 22A and a second component holding nozzle 22B as in the first and second embodiments. By rotating the transfer head 21, the orientation of the first component holding nozzle 22A and the second component holding nozzle 22B can be changed. On one side surface of the component transfer head 21, a nozzle holding unit 40 as a nozzle holding unit for sucking and holding the component mounting nozzle 28 mounted on the mounting head 27 is advanced and retracted with respect to the component transfer head 21. It is provided freely.

  The nozzle holding portion 40 has a shape in which a concave portion 40a is provided in a block member having a shape corresponding to the outer shape of the component mounting nozzle 28 to allow the convex mounting portion 28a that contacts the component in the component mounting nozzle 28 to be inserted. Thus, vacuum suction is performed from the suction hole 41 provided in the frame portion with the lower surface of the component mounting nozzle 28 (the surface opposite to the mounting surface to the mounting head 27) being in contact with the frame portion of the outer edge. Thus, the component mounting nozzle 28 is held by the nozzle holding unit 40.

  The component mounting nozzle 28 is interchangeably mounted on the mounting head 27 in accordance with the type of the chip component to be processed. In the process of repeatedly executing the component mounting operation for a plurality of types of components, the component type switching is performed. It is necessary to attach and detach the component mounting nozzle 28 each time. In the third embodiment, as shown in FIG. 9B, a plurality of component mounting nozzles 28 corresponding to different types of components are stored in the nozzle tray 42, and the component storage table 12 of the component storage unit 2 is used. The component mounting nozzle 28 is attached to and detached from the mounting head 27 by the component transfer head 21.

  The component mounting nozzles 28 are arranged with the abutting portions 28 a facing upward, and when the component mounting nozzle 28 is mounted on the mounting head 27, the nozzle holding unit 40 is moved above the desired component mounting nozzle 28. Thus, the component mounting nozzle 28 is held by the nozzle holding unit 40. Next, the component transfer head 21 holding the component mounting nozzle 28 is moved to the component delivery position [P1], and the component transfer head 21 is rotated 180 degrees so that the component mounting nozzle 28 held by the nozzle holder 40 is turned upside down. The mounting surface of the component mounting nozzle 28 on the mounting head 27 is directed upward.

  The component mounting nozzle 28 is automatically mounted on the mounting head 27 by moving the mounting head 27 up and down relative to the mounting surface. 9B is executed in the reverse order, the component mounting nozzle 28 already mounted on the mounting head 27 can be removed and stored in the nozzle tray 42 of the component storage unit 2. That is, in the third embodiment, the component mounting nozzle 28 for holding components mounted on the mounting head 18 is held and moved together with the first component delivery means and the second component delivery means by the delivery movement means described above. The nozzle holding part 40 as a nozzle holding means is provided.

(Embodiment 4)
FIG. 10A is an explanatory diagram of the structure of the component transfer head in the component mounting apparatus according to the fourth embodiment of the present invention, and FIG. 10B is an operation description of the component transfer head in the component mounting apparatus according to the fourth embodiment of the present invention. FIG. In the fourth embodiment, instead of providing the first component holding nozzle 22A and the second component holding nozzle 22B in the single component transfer head 21, the first component holding nozzle 22A and the second component holding nozzle 22B are provided. Are provided in individual component transfer heads.

  As shown in FIG. 10A, a first component transfer head 21A and a second component transfer head 21B are mounted on a moving plate 43 provided on the moving table 20 so as to be movable in the X direction. The first component transfer head 21A and the second component transfer head 21B are provided with a first component holding nozzle 22A and a second component holding nozzle 22B, respectively, which can be raised and lowered. The first component transfer head 21A, like the component transfer head 21 of the first and second embodiments, is rotatable by 180 degrees around the rotation shaft 21a, and the first component holding nozzle 22A is directed upward and downward. It can be operated in any posture. The second component transfer head 21B is fixed, and the second component holding nozzle 22B operates only in a downward posture.

  When the lower chip 14 and the upper chip 15 are taken out from the component storage unit 2, as shown in FIG. 10B, the first component holding nozzle 22A is used with the first component holding nozzle 22A facing downward. 15 and the second chip 14 are held by the second component holding nozzle 22B. When the upper chip 15 is delivered to the mounting head 27, the upper part 15 is turned upside down with the first component holding nozzle 22A facing upward, and delivered to the mounting head 27 in this state. Also with this configuration, the lower chip 14 and the upper chip 15 can be simultaneously transported in a single operation.

  The material of the component holding nozzle can be selected as appropriate. For example, the material of the first component holding nozzle 22A may be an elastic body such as rubber, and the material of the second component holding nozzle 22B may be a heat resistant material such as metal or ceramic.

  INDUSTRIAL APPLICABILITY The component mounting apparatus and the component mounting method according to the present invention have the effect of being able to efficiently perform component mounting for manufacturing a semiconductor device having a chip-on-chip structure, and have a structure in which two semiconductor chips are stacked. It can be used in the manufacturing field.

The perspective view of the component mounting apparatus of Embodiment 1 of this invention The front view of the component mounting apparatus of Embodiment 1 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 1 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 1 of this invention The perspective view of the component mounting apparatus of Embodiment 2 of this invention The front view of the component mounting apparatus of Embodiment 2 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 2 of this invention Process explanatory drawing which shows the component mounting method of Embodiment 2 of this invention (A) Structure explanatory drawing of the component transfer head in the component mounting apparatus of Embodiment 3 of this invention (b) Operation | movement explanatory drawing of the component transfer head in the component mounting apparatus of Embodiment 3 of this invention (A) Structure explanatory drawing of the component transfer head in the component mounting apparatus of Embodiment 4 of this invention (b) Operation | movement explanatory drawing of the component transfer head in the component mounting apparatus of Embodiment 4 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1A Component mounting apparatus 2 Component storage part 3 Component positioning part 4 Component transfer part 5 Component mounting part 6 Component unloading part 13A 1st component tray 13B 2nd component tray 14 Lower chip 15 Upper chip 18 Mounting stage 19 Mounting body 21 component transfer head 21A first component transfer head 21B second component transfer head 22A first component holding nozzle 22B second component holding nozzle 27 mounting head 33 component carry-out head

Claims (5)

A component mounting apparatus for mounting a second component on a first component,
A first component supply unit that supplies the first component; a second component supply unit that supplies the second component; a mounting stage on which the first component is placed; and the second component a mounting means for mounting to the placed first component to the mounting stage and holding the component by the mounting head, mounted on the mounting stage the first part is removed from said first component supply unit First component delivery means, and second component delivery means for taking out the second component from the second component supply unit and holding it on the mounting head;
The first component delivery means and the second component delivery means are simultaneously moved relative to the mounting stage and the mounting head in a single operation at the same time , so that the first component and the second component are single component mounting apparatus characterized by comprising a delivery movement means you conveyed by the conveying operation of the.   The second component delivery means includes a second component holding nozzle that takes out the second component from the second component supply unit, and a reversing mechanism that vertically flips the second component holding nozzle. The component mounting apparatus according to claim 1.   The first component delivery means includes a first component holding nozzle for taking out the first component from the first component supply unit, and the first component holding nozzle is inverted upside down by the inversion mechanism. The component mounting apparatus according to claim 2, wherein:   A nozzle holding unit that holds a component holding nozzle to be mounted on the mounting head and moves with the first component delivery unit and the second component delivery unit by the delivery moving unit is provided. Item mounting apparatus according to Item 1. A component mounting method for mounting a second component on a first component,
The first component delivery step and, the second part of the second component transfer unit for placing the first component in the first component transfer unit mounting stage is removed from the first component supply unit by the the first part of the second component is mounted on the mounting stage and a second component delivery step of holding the mounting head is removed from the second component supply unit, which is held on the mounting head by the A mounting process for mounting,
In the first component delivery step and the second component delivery step, the first component delivery means and the second component delivery means are simultaneously moved relatively in a single operation with respect to the mounting stage and the mounting head. is allowed, the component mounting method which is characterized that you conveying the first component and the second component in a single transport operation.

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