JP4345720B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting components on top of each other.

In the field of manufacturing electronic devices, a component mounting operation for mounting a semiconductor chip on a workpiece such as a substrate is performed. In this component mounting operation, a transfer operation in which a semiconductor chip on which connection electrodes such as solder bumps are formed is taken out of the component supply unit and transferred to the substrate, and the connection electrode of the mounted semiconductor chip is used as a circuit on the substrate. A joining operation for joining the electrodes is performed. As a device for performing such component mounting work, a component reversing mechanism for taking a semiconductor chip out of a component supply unit and reversing it upside down and a mounting head for mounting the semiconductor chip delivered from the component reversing mechanism on a substrate are conventionally provided. There is known a component mounting apparatus (see, for example, Patent Document 1).
Japanese Patent No. 3132353

  Incidentally, in recent years, with the progress of downsizing and higher functionality of electronic devices, it is required to further increase the mounting density of a mounting board incorporated in the electronic device. As a mounting form to cope with such high-density mounting, a so-called chip-on-chip mounting body in which a plurality of semiconductor chips are stacked is adopted. Such a mounting body is manufactured by bonding the bumps formed on the circuit formation surface with the circuit formation surfaces of the two semiconductor chips facing each other.

  However, since the component mounting apparatus shown in the above-mentioned patent document example is configured for the purpose of transferring and mounting a semiconductor chip on a substrate that is large and easy to handle, two semiconductor chips having substantially the same size are used. It was not always suitable for the work of joining the two. For this reason, a component mounting apparatus and a component mounting method capable of efficiently performing a component mounting operation for manufacturing a mounted body having a chip-on-chip structure have been desired.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of efficiently performing a component mounting operation for manufacturing a mounted body having a chip-on-chip structure.

  The component mounting apparatus of the present invention is a component mounting apparatus that mounts a second component on a first component, and supplies a first component supply unit that supplies the first component and the second component. A second component supply unit, a mounting stage on which the first component is mounted, a transfer means for transferring the first component from the first component supply unit to the mounting stage, and mounting A mounting means for taking out the second component from the second component supply unit by a head and mounting the second component on the first component; and mounting the second component on the first component. Joining means for joining, holding the second component mounted on the first component by the mounting head and carrying it out of the mounting stage together with the first component.

The component mounting method of the present invention is a component mounting method for mounting a second component on a first component, the transfer step of transferring the first component onto a mounting stage, and the second component. A holding step of holding the first component by the mounting head, a mounting step of mounting the second component held by the mounting head on the first component on the mounting stage, and joining the first component and the second component. A joining step and a carrying-out step of holding the second component joined to the first component by the mounting head and carrying it out of the mounting stage together with the first component.

  According to the present invention, the second component is mounted and bonded to the first component placed on the mounting stage, and the second component bonded to the first component is mounted together with the first component by the mounting head. By adopting a configuration for carrying out from the mounting stage, it is possible to efficiently perform a component mounting operation for manufacturing a chip-on-chip semiconductor device.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the component mounting apparatus according to an embodiment of the present invention, and FIGS. 3, 4, 5, and 6 are the present invention. It is operation | movement explanatory drawing of the component mounting apparatus of one embodiment.

  First, the structure of the component mounting apparatus 1 will be described with reference to FIGS. The component mounting apparatus 1 is used for the purpose of manufacturing a chip-on-chip mounted body in which semiconductor chips of substantially the same size are directly stacked and mounted. In FIG. 1, a component supply unit 3 and a chip positioning unit 4 are arranged in series in the X direction on a base 2. The component supply unit 3 is configured by arranging a first component tray 5A and a second component tray 5B in parallel on the upper surface of the tray holding table 3a. The first component tray 5A and the second component tray 5B store the lower chip 6 as the first component and the upper chip 7 as the second component in a regular lattice arrangement, respectively, and a mounting mechanism unit 13 to be described later. To supply. Therefore, the first component tray 5A and the second component tray 5B are respectively a first component supply unit and a second component that supply the lower chip 6 that is the first component and the upper chip 7 that is the second component. Supply section.

  The chip positioning unit 4 has a configuration in which a mounting stage 9 is mounted on a positioning table 8 formed by stacking an X-axis table 8X and a Y-axis table 8Y. The lower chip 6 is placed on the mounting stage 9, and the lower chip 6 is sucked and held by the mounting stage 9 by vacuum suction from a suction hole 9 a provided in the mounting stage 9.

  A mounting mechanism unit 13 is disposed above the component supply unit 3 chip positioning unit 4. The mounting mechanism unit 13 has a configuration in which a mounting head 16 is connected to a moving block 15 that reciprocates horizontally by a moving table 14 arranged in the X direction. The moving block 15 has a built-in lifting mechanism for moving the mounting head 16 up and down. By driving the moving table 14 and the moving block 15, the mounting head 16 performs horizontal movement in the X direction and lifting operation.

  A component holding tool 17 provided with a suction hole 17 a is mounted on the lower surface of the mounting head 16, and vacuum suction is performed from the suction hole 17 a in a state where the component holding tool 17 is in contact with the lower chip 6 and the upper chip 7. As a result, the mounting head 16 sucks and holds the lower chip 6 and the upper chip 7. Further, by releasing the vacuum suction from the suction hole 17a, the suction holding of the lower chip 6 and the upper chip 7 by the mounting head 16 is released. Then, by performing a suction holding / holding release operation by the mounting head 16 and a horizontal movement / lifting operation of the mounting head 16, a component transfer operation described later is executed. The mounting mechanism unit 13 is a transfer means for transferring the upper chip 6 from the first component tray 5A to the mounting stage 9.

A recognition unit 10 is disposed obliquely above the chip positioning unit 4. The recognition unit 10 has a configuration in which an imaging unit 11 including a two-field optical system capable of imaging an upper imaging field and a lower imaging field by a single imaging operation is advanced and retracted in the X direction by a moving mechanism 12. The imaging unit 11 is placed between the mounting stage 9 and the mounting head 16 in a state where the lower chip 6 is placed on the mounting stage 9 and the mounting head 16 that holds the upper chip 7 by suction is positioned immediately above the mounting stage 9. By advancing, the lower chip 6 and the upper chip 7 can be imaged and recognized by the same imaging operation. The recognition unit 10 serves as recognition means for optically recognizing the lower chip 6 on the mounting stage 9 and the upper chip 7 held by the mounting head 16.

  As shown in FIG. 2, the first component tray 5A and the second component tray 5B are provided with recessed portions 5a and 5b for storing components, respectively, and the lower chip 6 and the upper portion are respectively disposed in the recessed portions 5a and 5b. The chip 7 is stored. In the present embodiment, the lower chip 6 is a logic chip on which a logic circuit is formed, and the upper chip 7 is a memory chip. Connection electrodes 6 a are formed on the upper surface of the lower chip 6, and solder bumps 7 a are formed on the lower surface of the upper chip 7.

  The mounting head 16 incorporates a heating means as a joining means so that the upper chip 7 can be heated via a component holding tool 17. In the mounting operation in which the upper chip 7 held by the mounting head 16 is lowered with respect to the lower chip 6 mounted on the mounting stage 9 and the solder bumps 7a are brought into contact with the connection electrodes 6a, the upper chip 7 is moved by the mounting head 16. By heating, the solder bump 7 a is melted and soldered to the connection electrode 6 a, whereby the upper chip 7 is mounted on the lower chip 6.

  Therefore, the mounting mechanism unit 13 takes out the upper chip 7 as the second component from the second component tray 5B as the second component supply unit by the mounting head 16 and places the first chip 7 on the mounting stage 9. This is a mounting means for mounting on the lower chip 6 which is a component. In other words, in the present embodiment, the transfer means for taking out the lower chip 6 from the component supply unit 3 and transferring it to the mounting stage 9 is configured to serve as both the mounting means and the joining means. Of course, each may be provided separately.

  As will be described later in the mounting operation example, in the present embodiment, the mounting mechanism unit 13 including the mounting head 16 unloads the mounting body in which the upper chip 7 is mounted on the lower chip 6 from the mounting stage 9. It also functions as an unloading means. That is, the upper chip 7 mounted on the lower chip 6 is held by the mounting head 16 and carried out of the mounting stage 9 together with the lower chip 6.

  In addition, although the heating means incorporated in the mounting head 16 was illustrated as a joining means which joins a 2nd component to a 1st component, a joining means is not restricted to this. The vibration may be applied by vibration applying means provided on the mounting head 16, or heating by a heater and vibration application may be used in combination. Further, a joining means such as a heater may be provided on the mounting stage 9 side.

  Next, the component mounting operation by the component mounting apparatus 1 will be described with reference to FIGS. First, as shown in FIG. 3A, the mounting head 16 is moved above the first component tray 5A of the component supply unit 3, and the mounting head 16 is aligned with the lower chip 6 to be mounted. Next, as shown in FIG. 3B, the mounting head 16 is lowered to bring the component holding tool 17 into contact with the lower chip 6, and vacuum suction is performed from the suction hole 17a to hold the lower chip 6 by suction. Thereafter, the lower chip 6 is taken out from the first component tray 5A by the mounting head 16 and moved onto the chip positioning portion 4 as shown in FIG. 3C, and the lower chip 6 is transferred to the mounting stage 9. (Transfer process).

  Thereafter, as shown in FIG. 4A, the mounting head 16 whose holding of the lower chip 6 is released is moved above the component supply unit 3 and is positioned on the upper chip 7 accommodated in the second component tray 5B. Match. Next, as shown in FIG. 4B, the mounting head 16 is lowered to bring the component holding tool 17 into contact with the upper chip 7, and the upper chip 7 is held by vacuum suction from the suction hole 17a (holding process). Thereafter, the mounting head 16 takes out the upper chip 7 from the second component tray 5B and moves it above the chip positioning portion 4 as shown in FIG.

  Then, with the mounting head 16 waiting at this position, as shown in FIG. 5A, the moving unit 12 is driven to advance the imaging unit 11 between the mounting stage 9 and the mounting head 16 to perform imaging. The lower chip 6 and the upper chip 7 are imaged by the same imaging operation by the two-field optical system provided in the unit 11. The imaging result is recognized by a recognition means (not shown), and the connection electrodes 6a of the lower chip 6 and the solder bumps 7a of the upper chip 7 are recognized (recognition process). Based on the recognition result, the positional deviation between the connection electrode 6a and the solder bump 7a is detected.

  Thereafter, when the imaging unit 11 is retracted from below the mounting head 16, the mounting head 16 is lowered and the upper chip 7 is mounted on the lower chip 6 (mounting process) as shown in FIG. At this time, the solder bumps 7a are correctly aligned with the connection electrodes 6a by controlling the positioning table 8 in consideration of the positional deviation between the connection electrodes 6a and the solder bumps 7a obtained by the above recognition process.

  Then, the upper chip 7 is heated by the mounting head 16, the solder bumps 7a are melted and solder-bonded to the connection electrodes 6a, thereby mounting the upper chip 7 on the lower chip 6 (bonding step). At this time, the height position of the mounting head 16 is controlled to keep the distance between the upper chip 7 and the lower chip 6 appropriately, thereby preventing problems caused by the flow of molten solder in which the solder bumps 7a are melted. ing.

  When the solder bonding is completed, after the suction holding of the lower chip 6 by the mounting stage 9 is released, the mounting head 16 is raised as shown in FIG. Thereby, the upper chip 7 held by the component holding tool 17 is unloaded from the mounting stage 9 together with the lower chip 6 (unloading step). Then, the mounting head 16 holding the mounting body in which the upper chip 7 is mounted on the lower chip 6 moves above the first component tray 5A and is aligned with the concave portion 5a in which the lower chip 6 was originally stored.

  Next, as shown in FIG. 6A, the mounting head 16 is lowered to house the mounting body in which the upper chip 7 is mounted on the lower chip 6 in the recess 5a. Thereafter, as shown in FIG. 6 (b), the mounting head 16 that has released the holding of the mounting body rises and moves above the next lower chip 6 accommodated in the first component tray 5A. Implementation operation is started.

  As described above, in the present embodiment, the upper chip 6 is mounted and bonded to the lower chip 6 placed on the mounting stage 9, and the mounting body in which the lower chip 6 and the upper chip 7 are bonded is mounted. A configuration in which the head 16 is carried out from the mounting stage 9 is adopted. Accordingly, a component mounting operation for manufacturing a semiconductor device having a chip-on-chip structure in which two semiconductor chips having substantially the same size are stacked can be efficiently performed by a component mounting device having a simple configuration.

  The component mounting apparatus and the component mounting method of the present invention have an effect that a component mounting operation for manufacturing a semiconductor device having a chip-on-chip structure can be efficiently performed, and a semiconductor having a structure in which two semiconductor chips are stacked. It can be used for the purpose of manufacturing the device.

The front view of the component mounting apparatus of one embodiment of this invention The top view of the component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the component mounting apparatus of one embodiment of this invention Operation | movement explanatory drawing of the component mounting apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Component supply part 4 Chip positioning part 5A 1st component tray 5B 2nd component tray 6 Lower chip 6a Connection electrode 7 Upper chip 7a Solder bump 9 Mounting stage 10 Recognition unit 13 Mounting mechanism part 16 Mounting head

Claims (4)

A component mounting apparatus for mounting a second component on a first component,
A first component supply unit for supplying the first component; a second component supply unit for supplying the second component; a mounting stage on which the first component is placed; and the first component Transfer means for transferring a component from the first component supply unit to the mounting stage, and the second component taken out from the second component supply unit by a mounting head and placed on the mounting stage A mounting means for mounting on the first component; and a joining means for joining the second component to the first component;
The component mounting apparatus, wherein the second component mounted on the first component is held by the mounting head and is carried out of the mounting stage together with the first component.   The component mounting apparatus according to claim 1, further comprising a recognition unit configured to recognize the first component on the mounting stage and the second component held by the mounting head. A component mounting method for mounting a second component on a first component,
A transfer step of transferring the first component onto the mounting stage; a holding step of holding the second component by the mounting head; and a second component held by the mounting head on the mounting stage. A mounting step of mounting on one component, a bonding step of bonding the first component and the second component, and the second component bonded to the first component held by the mounting head A component mounting method comprising: a step of unloading from the mounting stage together with one component. 4. The component mounting method according to claim 3, further comprising a recognition step of recognizing the first component on the mounting stage and the second component held by the mounting head by a recognition unit.

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