JP2009158876A - Mounting method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting method and device capable of mounting by accurately matching a chip having a recognition mark on the upper face and the relative position of a substrate so as to apply efficient heating-pressurization. <P>SOLUTION: The mounting method and device is provided for mounting the chip having the recognition mark for position alignment on the upper face on the substrate down below having the recognition mark for position alignment, wherein, before mounting the chip to the substrate, the recognition mark on the upper face of the chip placed on a temporary placement table and a marker part of a chip holding tool are aligned by performing an image recognition using a recognition means having 2 viewing fields, then the chip is held by suction by the chip holding tool, and when the chip is mounted on the substrate, the marker part of the chip holding tool and the recognition mark for position alignment on the substrate are aligned by performing an image recognition using the recognition means having 2 view fields. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a mounting apparatus for holding a chip component having a recognition mark on the upper surface from the upper surface side and mounting the chip component on a substrate disposed below, and a mounting method using the mounting apparatus.

  A semiconductor chip (hereinafter referred to as a chip) is formed by cutting out a rectangular shape from a wafer on which an IC circuit is formed. The chip is cut out with the wafer attached to the adhesive tape, and the cut chip is peeled off from the adhesive sheet and picked up. When these chips are attached to the adhesive sheet, the chips are in a face-up state with the active surface (circuit surface) facing upward.

  When mounting the chip on the substrate, it is necessary to bond the chip and the substrate after aligning them in a predetermined relationship. In this alignment, the alignment recognition mark attached to the chip and the alignment recognition mark attached to the substrate have two fields of view, which are composed of a CCD camera and a prism. Reading is performed by a recognizing unit (hereinafter, referred to as a 2-field recognizing unit), and the relative positional relationship between both marks is kept within a predetermined accuracy.

  For example, when a recognition mark for alignment is attached to the lower surface of the chip and a recognition mark for alignment is attached to the chip mounting surface (upper surface) of the substrate, before mounting the chip on the substrate, In the meantime, it is possible to insert a recognition means with two fields of view and read the recognition marks on the chip and the substrate to align the relative positions of the chip and the substrate.

  When a recognition mark for alignment is attached to the upper surface of the chip like a chip cut out from a wafer, the recognition mark for the chip and the substrate is recognized by a two-field recognition means located between the chip and the substrate. Cannot read. As a mounting method in such a case, an optical path changing means (prism or mirror) is provided in the chip holding tool (bonding head) to change the optical path of the recognition mark on the chip and the substrate in the direction of measurement, and the side recognition means. A mounting method is known in which each recognition mark is read to align the relative positions of the chip and the substrate (for example, Patent Document 1).

JP2003-304098A

  A chip with a recognition mark on the upper surface of the chip is mounted on the substrate via a thermosetting adhesive or solder applied to the bonding surface of the substrate. In such a method of mounting a chip on a substrate, when the bonding head that holds the chip by suction presses the chip against the substrate on the substrate stage, the bonding portion of the chip and the substrate is heated to a predetermined temperature along with the pressing, and the chip and the substrate Is implemented. In the mounting apparatus described above, since the optical path changing means (prism or mirror) is built in the bonding head, it is difficult to incorporate a heater or the like as a heating means in the bonding head. For this reason, a heater is incorporated on the substrate stage side, and the bonding portion is heated from the substrate side. However, there has been a problem that heat radiation at the substrate increases with the increase in size of the substrate, and it is difficult to efficiently heat the bonded portion.

  Further, in the case of a process of heating the bonding part at a high temperature when the chip and the substrate are bonded, heating from the substrate side alone cannot cope with the bonding between the chip and the substrate.

  For this reason, the mounting method and mounting apparatus which can join the chip | tip with the recognition mark on the upper surface of a chip | tip with high precision to the board | substrate, and can heat it to high temperature with the heater incorporated in the bonding head became a subject.

  The present invention has been made in view of such circumstances, and a mounting method capable of efficiently heating and pressurizing and mounting a chip having a recognition mark on the upper surface and the relative position of the substrate with high accuracy. And it aims at providing a mounting apparatus.

In order to solve the above problems, the invention described in claim 1
A method of mounting a chip with an alignment recognition mark on its upper surface on a substrate that is arranged below the alignment recognition mark,
Prior to mounting the chip on the substrate, the recognition mark for alignment placed on the upper surface of the chip placed on the temporary table and the mark serving as the mark of the chip holding tool are image-recognized by the two-field recognition means. After the alignment, the chip is held by suction with the chip holding tool,
When the chip is mounted on the substrate, a mark serving as a mark of the chip holding tool and an alignment recognition mark attached to the substrate are image-recognized and recognized by a two-field recognition unit, and the chip is mounted on the substrate. Implementation method to implement.

The invention described in claim 2
An apparatus for mounting a chip with an alignment recognition mark on its upper surface on a substrate with an alignment recognition mark disposed below the chip,
A temporary stage on which the chip is placed and a movable stage that horizontally moves the substrate stage that holds the substrate integrally;
Driving means for horizontally moving the moving table;
A chip holding tool for holding the chip from the upper surface side;
Two-field recognition means inserted between the chip placed on the temporary placement table and the chip holding tool, and further inserted between the substrate on the moving table horizontally moved by the driving means and the chip holding tool. Is a mounting apparatus.

  According to the first aspect of the present invention, the recognition mark for alignment of the chip placed on the temporary table and the mark serving as the mark of the tool for holding the chip are image-recognized, and the alignment of the chip and the tool for holding the chip is performed. Since the chip is sucked and held by the chip holding tool, the chip is held by the chip holding tool with high accuracy. When the chip is mounted on the substrate, the part that becomes the mark of the chip holding tool and the recognition mark for alignment of the substrate are image-recognized, the chip holding tool and the substrate are aligned, and the chip is mounted on the substrate. The chip can be mounted on the substrate with high accuracy even if the recognition mark for alignment is attached to the upper surface of the chip (the tool holding tool side).

  According to the second aspect of the present invention, the recognition means for the two fields of view reads the external appearance of the chip holding tool and the recognition mark for positioning the substrate, so that the chip holding tool is attached to the upper surface of the chip. There is no need to provide an optical path changing means (prism or mirror) for recognizing the recognition mark, and a heater can be incorporated in the chip holding tool, so that the chip and the substrate can be bonded by high-temperature heating.

  Embodiments of the present invention will be described below with reference to the drawings. In the present embodiment, an LSI will be described as an example of a chip, and a glass substrate will be described as an example of a substrate. As the chip, other forms such as an electronic component, an IC chip, a semiconductor chip, an optical element, a surface mount component, a wafer, and the like on the side to be bonded to the substrate are shown regardless of the type and size. Moreover, as a board | substrate, all the forms by the side to which a chip | tip is joined, such as a resin substrate, a glass substrate, a ceramic substrate, a film substrate, are shown, for example.

  FIG. 1 is a schematic perspective view of a mounting apparatus according to an embodiment of the present invention. The mounting apparatus is roughly divided into an apparatus base 1, a mounting unit 3 disposed on the right side of the apparatus base 1, a chip component supply unit 4 disposed on the left side of the apparatus base 1, and a control unit. 5.

  The mounting unit 3 includes a substrate holding unit 10 that holds the substrate 8, a pressure-bonding unit 12 that holds the chip 11 by suction and mounts it on the substrate 8, and a two-field recognition unit 13.

  The substrate holding unit 10 includes a substrate holding stage 14 and a moving table 15 that can move the substrate holding stage 14 in two horizontal (X, Y) directions and a rotation (θ) direction. A substrate holding stage 14 and a temporary table 34 are provided on the upper side of the moving table 15. The temporary placement table 34 is disposed next to the substrate holding stage 14. By moving the moving table 15, the substrate holding stage 14 and the temporary placement table 34 move together, and the substrate holding stage 14 or the temporary placement table 34 can be arranged below the pressure bonding unit 12. .

  The crimping unit 12 includes a head 17 that sucks and holds the chip 11, an elevating drive mechanism 19 that moves in the vertical (Z) direction, and a heater 16 that is built in the head 17. FIG. 2 shows a schematic perspective view of the head 17 as viewed from below. A suction hole 23 is formed in the lower portion of the head 17 and is connected to a suction pump through a hose (not shown). An attachment 25 that holds the chip 11 by suction is attached to the lower side of the head 17. The attachment 25 is attached to the head 17 according to the size of the chip 11. The attachment 25 is attached to the head 17 by vacuum suction, and vacuum suction is performed by a suction pump different from the suction pump provided for the suction hole 23 of the chip 11. The attachment 25 is provided with a flat convex portion 26 below the head 17, and an adsorption hole 23 is formed at the center of the convex portion 26. The suction hole 23 of the head 17 is connected to the suction hole 23 of the attachment 25. The area of the flat portion of the convex portion 26 is larger than that of the chip 11 to be sucked and held. For example, in the case of the chip 11 of 5 mm × 5 mm, the area of the flat portion is about 7 mm × 7 mm. The attachment 25 corresponds to the chip holding tool of the present invention. In FIG. 2, the heater 16 is indicated by a dotted line because it is built in the head 17. Further, since the suction hole 23 is a hole provided in the head 17 and the attachment 25, the hole is indicated by a solid line on the convex portion 26, and the hole portion is indicated by a dotted line.

  The two visual field recognition means 13 is a means having two visual fields in the vertical direction, is movable in the horizontal two-axis (X, Y) direction and the vertical (Z) direction, and has a corner portion 27a of the convex portion 26, 27b, the alignment recognition marks 41a and 41b attached to the chip 11 and the alignment recognition marks 43a and 43b of the substrate 8 on the substrate holding stage 14 are recognized. In the present embodiment, corner portions 27a and 27b of the convex portion 26 will be described as an example of portions serving as marks. The mark portion includes a mark attached to the lower surface of the convex portion 26, a step portion of the convex portion 26, and the like. The two visual field recognition means 13 is composed of a CCD camera and a prism. The two-field recognizing means 13 is provided with a CCD camera for each of the upper and lower fields of view, so that an image of two fields of upper and lower fields can be recognized by turning the optical axis of each CCD camera in the vertical direction using a prism. I have to.

  The chip supply unit 4 includes a chip tray 31 in which the chips 11 are stored, a mounting table 32 on which the chip tray 31 is mounted, and a transport mechanism 33 that transports the chips 11. The chip 11 is diced from a semiconductor wafer and is housed in the chip tray 31 in a face-up state with the circuit surface facing upward.

  The transport mechanism 33 is a horizontal (X) direction along a movable frame 37 that can move back and forth on a guide rail 36 that extends in the Y direction of the apparatus base 1 and a guide rail 38 that faces the front surface of the movable frame 37. Further, a movable head 39 is provided, and a suction head 40 capable of sucking and holding the chip 11 is arranged on the movable base 39 so as to be movable up and down. The movable table 39 can move between the temporary table 34 and the chip tray 31. That is, the chip 11 at a predetermined position stored in the chip tray 31 can be sucked and held by the suction head 40 and transferred to the temporary placement table 34.

  The control unit 5 controls the devices of the mounting unit 3 and the chip component supply unit 4. The control unit 5 includes an input / output device such as a display monitor, a keyboard or a touch panel, appropriate hardware mainly including a memory chip (storage unit) and a microprocessor (calculation unit), and a computer program for operating the hardware. And a suitable interface circuit for performing data communication with each component. The image recognition data of the two visual field recognition means 13 is stored in the control unit 5.

  Next, the operation of mounting the chip 11 on the substrate 8 using the above-described embodiment apparatus will be described based on the flowchart shown in FIG. In the present embodiment, a case where the chip 11 with the alignment recognition mark attached on the upper surface aligned with the chip tray 31 is mounted on the substrate 8 in a face-up state will be described as an example. In this case, a thermosetting adhesive material is previously transferred to a predetermined mounting location of the substrate 8.

  First, an attachment 25 matching the size of the chip 11 is attached to the head 17 of the crimping unit 12. Then, in order to determine which of the convex portions 26 is used as a reference, the reference position is registered using the two-field recognition means 13. Specifically, as shown in FIG. 2, the two-field recognition means 13 is moved from the retracted position to the lower side of the head 17, and the corner 27a of the convex portion 26 is image-recognized by the upper optical axis 13a. The operator selects the corner portion 27 a from the image displayed on the display monitor of the control unit 5 and stores it in the storage unit of the control unit 5. The stored data has the shape of the corner 27a. (Step S01).

  Next, the recognition means 13 for two fields of view is moved by a predetermined amount (an amount corresponding to the dimension of the convex portion 26), and the corner portion 27b of the convex portion 26 is image-recognized by the upper optical axis 13a. Similarly to the corner portion 27 a, the operator selects the corner portion 27 b from the image displayed on the display monitor of the control unit 5 and stores it in the storage unit of the control unit 5. Thereafter, unless the attachment 25 is replaced or maintained, the shape of the corners 27a and 27b is used as the reference position of the head 17 (step S02).

  When the registration of the shapes of the corner portions 27a and 27b of the convex portion 26 is completed, the moving table 15 is driven in the horizontal (X, Y) direction to move the temporary table 34 to the lower side of the recognition means 13 for two fields of view. The temporary placement table 34 holds the chips 11 before production starts by suction. Next, the recognition mark 41a for alignment provided on the upper surface of the chip 11 is recognized by the lower optical axis 13b of the recognition means 13 for two fields of view. FIG. 6 shows a schematic positional relationship between the chip 11 and the upper surface alignment recognition marks 41a and 41b and the visual field range 13a of the two visual field recognition means 13. In FIG. 6, a visual field range 13a indicates a range surrounded by a dotted line. Since the visual field range 13a is limited, when the two recognition marks 41a and 41b for alignment are recognized, the recognition means 13 for the two visual fields is moved by a predetermined amount. Next, the operator selects the alignment mark 41 a from the image displayed on the display monitor of the control unit 5 and stores it in the storage unit of the control unit 5. The stored data is the shape of the alignment recognition mark 41a (step S03).

  Next, the recognition means 13 for two fields of view is moved by a predetermined amount (an amount corresponding to the dimension of the chip 11), and the recognition mark 41b for alignment on the chip 11 is image-recognized by the lower optical axis 13b. Similar to the alignment recognition mark 41 a, the operator selects the alignment recognition mark 41 b from the image displayed on the display monitor of the control unit 5 and stores the shape of the alignment mark 41 b in the storage unit of the control unit 5. (Step S04).

  When registration of the shape of the alignment recognition marks 41a and 41b of the chip 11 is completed, the moving table 15 is driven in the horizontal (X, Y) direction to move the substrate holding stage 14 to the lower side of the recognition means 13 for two fields of view. . The substrate 8 is sucked and held on the substrate holding stage 14 by a suction tool (not shown). The substrate 8 is placed on the substrate holding stage 14 by using a substrate transfer tool or manually.

  Next, in the same manner as the procedure for storing the shape of the alignment recognition marks 41a and 41b of the chip 11 in the storage unit of the control unit 5, the alignment recognition marks 43a and 43b attached to the substrate 8 are recognized in two fields of view. The image is recognized by the means 13, and the shape is stored in the control unit 5 (step S05). FIG. 7 shows a schematic positional relationship between the substrate 8 and the alignment recognition marks 43a and 43b and the visual field range 13b of the two visual field recognition means 13. In FIG. 7, a visual field range 13b indicates a range surrounded by a dotted line. A plurality of chips 11 can be mounted on the substrate 8, and alignment recognition marks 43 a and 43 b are attached around the mounting positions of the chips 11 for each mounting position of the chips 11. The mounting location of the chip 11 is indicated by diagonal lines.

  Next, the two-field recognition means 13 returns to the retracted position, and the moving table 15 is driven in the horizontal (X, Y) direction as shown in FIG. 4 to move the temporary table 34 toward the chip tray 31 (step S06). ).

  Next, processing for delivering the chip 11 of the chip tray 31 onto the temporary placement table 34 using the transport mechanism 33 is performed. Specifically, the movable frame 37 and the movable base 39 on which the suction head 40 is mounted move in the horizontal (X, Y) direction, and hold the predetermined chip 11 in a face-up state. The suction head 40 that sucks and holds the chip 11 moves to the temporary placement table 34 side and delivers the chip 11 to the temporary placement table 34 (step S07).

  Next, when the chip 11 is transferred to the temporary placement table 34, as shown in FIG. 5, the moving table 15 is driven in the horizontal (X, Y) direction to move the temporary placement table 34 to the lower side of the head 17 ( Step S08).

  Next, the two-view recognition means 13 is inserted from the retracted position between the chip 11 placed on the temporary placement table 34 and the head 17 (step S09).

  Next, the image of the chip 11 is recognized by the lower optical axis 13b of the recognition means 13 for two fields of view. The shape of the alignment recognition mark 41a registered in step S03 is searched from the image-recognized data (searches for matching images while comparing the images). If the shapes match as a result of the search, the X and Y coordinates are calculated from the reference position of the shape data (for example, the center position of the shape data), and the XY coordinate values are stored in the storage unit of the control unit 5. In the storage unit, the alignment recognition mark 41a is recognized in a coordinate space as shown in FIG. 3B (step S10). If the images do not match, the recognizing means for the two fields of view is moved by a predetermined amount to shift the field of view of the lower optical axis 13b and search is performed again.

  Simultaneously with step S10, the corner 27a of the convex portion 26 is image-recognized by the upper optical axis 13a of the recognition means 13 for two fields of view. The X and Y coordinates of the corner 27 a are stored in the storage unit of the control unit 5 in the same manner as the procedure for storing the alignment recognition mark 41 a of the chip 11 in the storage unit of the control unit 5. In the storage unit, the corner 27a is recognized in a coordinate space as shown in FIG.

  When the recognition mark 41a for alignment and the corner 27a of the chip 11 cannot be recognized by the lower optical axis 13b and the upper optical axis 13a at the same time due to the stop position of the recognition means 13 for two fields of view, the recognition mark 41a for alignment is image-recognized. Thereafter, the recognition means 13 for two fields of view may be moved by a predetermined amount to recognize the corner 27a. Alternatively, image recognition may be performed in the reverse order.

  Next, the recognition means 13 for two fields of view moves by a predetermined amount (value calculated from the design position of the alignment marks 41a and 41b of the chip 11), and recognizes the image of the chip 11 with the lower optical axis 13b. The shape of the alignment mark 41b registered in step S04 is searched from the image recognized data. If the shapes match as a result of the search, the XY coordinates are calculated from the reference position of the shape data and stored in the storage unit of the control unit 5. In the storage unit, the recognition mark 41b for alignment is recognized in a coordinate space as shown in FIG. 3B (step S11).

  Simultaneously with step S11, the corner 27b of the convex portion 26 is image-recognized by the upper optical axis 13a of the recognition means 13 for two fields of view. Similar to the procedure for storing the alignment recognition mark 41 b of the chip 11 in the storage unit of the control unit 5, the X and Y coordinates of the corner 27 b are stored in the storage unit of the control unit 5. In the storage unit, the corner 27b is recognized in a coordinate space as shown in FIG. When the corner 27b and the alignment recognition mark 41b cannot be recognized simultaneously, the image recognition is performed individually by moving the recognition means 13 of two fields of view as in step S10.

  Next, based on the coordinate data of the alignment recognition marks 41 a and 41 b of the chip 11 and the coordinate data of the corners 27 a and 27 b of the convex portion 26 of the head 17, the alignment of the chip 11 and the attachment 25 is performed. Do. Specifically, the control unit 5 compares the coordinate data recognized in FIG. 3A with the coordinate data recognized in FIG. 3B, and moves so that the two are in a predetermined positional relationship. The table 15 is driven in the horizontal (X, Y) and rotation (θ) directions (step S12).

  Next, after the two-field recognition means 13 has moved to the retracted position, the head 17 descends, sucks and holds the chip 11 on the temporary table 34, and transfers the chip 11 to the attachment 25 (step S13). As a result, the chip 11 is attracted and held on the attachment 25 of the head 17 with high accuracy using the alignment recognition marks 41a and 41b as a reference. When the delivery of the chip 11 is completed, the head 17 rises to a predetermined position.

  Next, the moving table 15 is driven in the horizontal (X, Y) direction to place the substrate 8 below the head 17 (step S14).

  Next, the two-field recognition means 13 is inserted from the retracted position between the chip 11 sucked and held by the attachment 25 and the substrate 8 sucked and held by the substrate holding stage 14 (step S15).

  Next, the substrate 8 is image-recognized by the lower optical axis 13b of the recognition means 13 for two fields of view. Similar to the search for the alignment recognition marks 41a and 41b on the chip 11, the shape of the alignment recognition mark 43a registered in step S05 is searched from the image-recognized data. If the shapes match as a result of the search, the XY coordinates are calculated from the reference position of the shape data and stored in the storage unit of the control unit 5 (step S16).

  At the same time, the convex portion 26 is image-recognized by the upper optical axis 13a of the recognition means 13 for two fields of view. The shape of the corner 27a registered in step S01 is searched from the image recognized data. If the shapes match as a result of the search, the XY coordinates are calculated from the reference position of the shape data and stored in the storage unit of the control unit 5 (step S17).

  Next, the recognition means 13 having two fields of view is moved by a predetermined amount, and the substrate 8 is image-recognized by the lower optical axis 13b. Similarly to the search for the alignment recognition mark 43a, the alignment recognition mark 43b is searched, and the XY coordinates are calculated from the reference position of the shape data, and stored in the storage unit of the control unit 5 (step S18).

  At the same time, the convex portion 26 is image-recognized by the upper optical axis 13a of the recognition means 13 for the two fields of view, and the corner portion 27b is searched in the same manner as the search for the corner portion 27a. Calculate and store in the storage unit of the control unit 5 (step S19).

  By the operation from step S16 to S19, the storage 27 of the control unit 5 recognizes the corners 27a and 27b and the alignment recognition marks 43a and 43b in the coordinate space as shown in FIGS.

  Next, alignment (alignment) of the attachment 25 and the substrate 8 is performed based on the coordinate data of the corner portions 27a and 27b of the convex portion 26 and the coordinate data of the alignment recognition marks 43a and 43b of the substrate 8. Specifically, the control unit 5 compares the coordinate data recognized in FIG. 3 (a) with the coordinate data recognized in FIG. 3 (c), and moves so that both are in a predetermined positional relationship. The table 15 is driven in the horizontal (X, Y) and rotation (θ) directions (step S20).

  When the alignment is completed, after the two-field recognition means 13 is retracted to the retracted position, the head 17 is lowered, the chip 11 is pressed against the substrate 8 with a predetermined load, and the heater 16 built in the head 17 is heated. The adhesive material transferred to the substrate 8 is heated to bond the chip 11 and the substrate 8 (step S21).

  When pressurization and heating for a predetermined time are completed, the head 17 is raised to a predetermined position, and the moving stage 15 is driven in the horizontal (X, Y) direction as shown in FIG. 4 to prepare for the next conveyance of the chip 11 ( (Return to step S06).

  Thus, even if the alignment recognition marks 41a and 41b are attached to the upper surface (face-up surface) of the chip 11, the provision of the temporary table 34 and the two-field recognition means 13 enables high-precision alignment. This makes it possible to mount the chip 11 and the substrate 8 with high accuracy.

  In addition, the joining portion of the chip 11 and the substrate 8 can be heated at an appropriate temperature by the heater 16 built in the head 17, and can cope with a process having a particularly high joining temperature.

The present invention is not limited to the above-described embodiment, and can be modified as follows.
(1) In the above embodiment, the pressure bonding unit 12 includes the lifting mechanism 19 that moves in the vertical (Z) direction, but the horizontal that moves the head 17 in the two horizontal axes (X, Y). It may be provided with a drive mechanism, an elevating drive mechanism that moves in the vertical (Z) direction, and a rotary drive mechanism that moves in the rotational direction (θ).
(2) In the above embodiment, the thermosetting adhesive material is transferred to the substrate 8 in advance. However, the solder is transferred to the lower surface of the chip 11, and the chip 11 is soldered to the substrate 8. There may be.
(3) In the above embodiment, the chip 11 is transported from the chip tray 31 to the temporary placement table 34 using the transport mechanism 33, but the chip tray 31 may be provided in the temporary placement table 34.

1 is a schematic perspective view of a mounting apparatus according to an embodiment of the present invention. It is a schematic perspective view of the head part in the apparatus of FIG. It is a figure which shows the position recognition of the chip | tip and board | substrate in the control part of the apparatus of FIG. It is a figure explaining operation | movement (chip tray side movement) of the movement table in the apparatus of FIG. It is a figure explaining operation | movement (head side movement) of the movement table in the apparatus of FIG. It is a figure explaining the positional relationship of the external appearance of a chip | tip, and the recognition mark for alignment. It is a figure explaining the positional relationship of the external appearance of a board | substrate, and the recognition mark for alignment. It is a flowchart explaining operation | movement of the apparatus of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Device base 3 Mounting unit 4 Component supply unit 5 Control part 8 Board | substrate 10 Board | substrate holding | maintenance part 11 Chip 12 Crimping unit 13 2 Field-of-view recognition means 14 Substrate holding stage 15 Moving table 16 Heater 17 Head 19 Lifting drive mechanism 23 Adsorption hole 25 Attachment 26 Convex 27a Corner 27b Corner 31 Chip tray 32 Placement table 33 Transport mechanism 34 Temporary table 36 Guide rail 37 Movable frame 38 Guide rail 39 Movable table 40 Adsorption head 41a Positioning recognition mark (chip)
41b Positioning recognition mark (chip)
43a Recognition mark for positioning (substrate)
43b Positioning recognition mark (substrate)
13a Upper optical axis 13b Lower optical axis

Claims (2)

A method of mounting a chip with an alignment recognition mark on its upper surface on a substrate that is arranged below the alignment recognition mark,
Prior to mounting the chip on the substrate, the recognition mark for alignment placed on the upper surface of the chip placed on the temporary table and the mark serving as the mark of the chip holding tool are image-recognized by the two-field recognition means. After the alignment, the chip is held by suction with the chip holding tool,
When the chip is mounted on the substrate, a mark serving as a mark of the chip holding tool and an alignment recognition mark attached to the substrate are image-recognized and recognized by a two-field recognition unit, and the chip is mounted on the substrate. Implementation method to implement. An apparatus for mounting a chip with an alignment recognition mark on its upper surface on a substrate with an alignment recognition mark disposed below the chip,
A temporary stage on which the chip is placed and a movable stage that horizontally moves the substrate stage that holds the substrate integrally;
Driving means for horizontally moving the moving table;
A chip holding tool for holding the chip from the upper surface side;
Two-field recognition means inserted between the chip placed on the temporary placement table and the chip holding tool, and further inserted between the substrate on the moving table horizontally moved by the driving means and the chip holding tool. A mounting apparatus.

Images