JP2007129132A - Apparatus and method of mounting component - Google Patents
Apparatus and method of mounting component Download PDFInfo
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- JP2007129132A JP2007129132A JP2005321975A JP2005321975A JP2007129132A JP 2007129132 A JP2007129132 A JP 2007129132A JP 2005321975 A JP2005321975 A JP 2005321975A JP 2005321975 A JP2005321975 A JP 2005321975A JP 2007129132 A JP2007129132 A JP 2007129132A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 230000007246 mechanism Effects 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 27
- 230000008685 targeting Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 238000003384 imaging method Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Abstract
Description
本発明は、基板に設けられた部品積層位置に部品を階層毎に順次積層して実装する部品実装装置に関するものである。 The present invention relates to a component mounting apparatus that sequentially stacks and mounts components at respective component stacking positions provided on a board.
電子機器の製造分野においては、半導体チップを基板などのワークに実装する部品実装作業が行われる。この部品実装作業においては、半田バンプなどの接続用電極が形成された半導体チップを部品供給部から取り出して基板に移送搭載する移載動作と、搭載された半導体チップの接続用電極を基板の回路電極と接合する接合動作とが行われる。このような部品実装作業を行う装置として、従来より部品供給部から半導体チップを取り出して上下反転する部品反転機構と、部品反転機構から受け渡された半導体チップを基板に搭載する搭載ヘッドとを備えた部品実装装置が知られている（例えば特許文献１参照）。
ところで近年電子機器の小型化・高機能化の進展に伴い、電子機器に組み込まれる実装基板の実装密度を更に高密度化することが求められている。このような高密度実装に対応するための実装形態として、複数の半導体チップを積層して実装したいわゆるスタック実装が採用されるようになっている。このようなスタック実装においては、基板上に直接実装された半導体チップの上にさらに半導体チップを積み重ねて立体的に実装する３次元実装動作が必要となるため、従来の平面的な実装動作と比較して、作業動作効率の向上や実装品質の確保の面で考慮すべき要因がより複雑になる。 Incidentally, in recent years, with the progress of downsizing and higher functionality of electronic devices, it is required to further increase the mounting density of a mounting board incorporated in the electronic device. As a mounting form to cope with such high-density mounting, so-called stack mounting in which a plurality of semiconductor chips are stacked and mounted is adopted. Such stack mounting requires a three-dimensional mounting operation in which a semiconductor chip is further stacked on a semiconductor chip directly mounted on a substrate and mounted in a three-dimensional manner, so that it is compared with the conventional planar mounting operation. As a result, factors that should be considered in terms of improving work operation efficiency and ensuring mounting quality become more complex.
しかしながら、上述の特許文献例に示す部品実装装置を含めて従来装置による部品実装動作は、基板上に半導体チップを平面的に移送搭載する形態を対象としているため、上述のような３次元実装動作を要するスタック実装を効率よく且つ高い実装品質で行う上では必ずしも適していなかった。このため、スタック実装のための３次元部品実装動作を、効率よく且つ高い実装品質で行うことができる部品実装装置および部品実装方法が望まれていた。 However, since the component mounting operation by the conventional device including the component mounting device shown in the above-mentioned patent document example is intended for a mode in which a semiconductor chip is transferred and mounted on a substrate in a plane, the three-dimensional mounting operation as described above. Therefore, it is not necessarily suitable for performing stack mounting requiring high efficiency with high mounting quality. For this reason, there has been a demand for a component mounting apparatus and a component mounting method capable of performing a three-dimensional component mounting operation for stack mounting efficiently and with high mounting quality.
そこで本発明は、スタック実装のための３次元部品実装動作を、効率よく且つ高い実装品質で行うことができる部品実装装置および部品実装方法を提供することを目的とする。 Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that can perform a three-dimensional component mounting operation for stack mounting efficiently and with high mounting quality.
本発明の部品実装装置は、基板に設けられた部品積層位置に部品を階層毎に順次積層して実装する部品実装装置であって、前記基板を保持する基板保持部と、前記部品を部品保持ノズルによって保持する実装ヘッドと、前記実装ヘッドを前記基板保持部に対して相対的に移動させる実装ヘッド移動機構と、前記実装ヘッド移動機構を制御することにより前記複数の部品積層位置に第１階層から最終階層までの部品を順次積層して実装する部品積層制御部とを備え、前記部品積層制御部は、一の部品積層位置において第１階層から最終階層までの部品を対象とした部品実装動作が完了した後に、前記一の部品積層位置の次の部品積層位置を対象とした部品実装動作を開始するように、前記実装ヘッド移動機構を制御する。 The component mounting apparatus according to the present invention is a component mounting apparatus that sequentially stacks and mounts components for each layer at a component stacking position provided on a substrate, and includes a substrate holding unit that holds the substrate, and the component holding A mounting head held by a nozzle; a mounting head moving mechanism that moves the mounting head relative to the substrate holding portion; and a first layer at the plurality of component stacking positions by controlling the mounting head moving mechanism. Component stacking control unit for sequentially stacking and mounting components from the first layer to the last layer, and the component stacking control unit performs component mounting operation for components from the first layer to the last layer at one component stacking position. Is completed, the mounting head moving mechanism is controlled so as to start a component mounting operation for the component stacking position next to the one component stacking position.
本発明の部品実装方法は、基板に設けられた部品積層位置に部品を階層毎に順次積層して実装する部品実装方法であって、前記部品を部品保持ノズルによって保持した実装ヘッ
ドを基板保持部に保持された前記基板に対して相対的に移動させ、前記部品積層位置に第１階層から最終階層までの部品を順次積層して実装する部品積層作業において、一の部品積層位置において第１階層から最終階層までの部品を対象とした部品実装動作が完了した後に、前記一の部品積層位置の次の部品積層位置を対象とした部品実装動作を開始する。
The component mounting method of the present invention is a component mounting method in which components are sequentially stacked and mounted at a component stacking position provided on a substrate for each layer, and a mounting head that holds the components by a component holding nozzle is mounted on a substrate holding unit. In a component stacking operation in which components from the first layer to the last layer are sequentially stacked and mounted at the component stacking position in the component stacking position, the first layer is positioned at the first layer stacking position. After the component mounting operation for the components from the first layer to the last layer is completed, the component mounting operation for the component stacking position next to the one component stacking position is started.
本発明によれば、一の部品積層位置において第１階層から最終階層までの部品を対象とした部品実装動作が完了した後に、当該一の部品積層位置の次の部品積層位置を対象とした部品実装動作を開始することにより、１つの部品についての樹脂塗布と部品搭載とをタイムラグなく行って、スタック実装のため３次元部品実装動作を、効率よく且つ高い実装品質で行うことができる。 According to the present invention, after the component mounting operation for the parts from the first layer to the last layer is completed at one component stacking position, the component targeting the component stacking position next to the one component stacking position By starting the mounting operation, it is possible to perform resin application and component mounting for one component without time lag, and to perform a three-dimensional component mounting operation for stack mounting efficiently and with high mounting quality.
次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の部品実装装置の正面図、図２は本発明の一実施の形態の部品実装装置の実装対象となる基板の説明図、図３は本発明の一実施の形態の部品実装装置によって行われるスタック実装の説明図、図４は本発明の一実施の形態の部品実装装置の制御系の構成を示すブロック図、図５は本発明の一実施の形態の部品実装装置によるスタック実装のフロー図、図６、図７は本発明の一実施の形態の部品実装方法の工程説明図である。 Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory view of a substrate to be mounted on the component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a block diagram illustrating a configuration of a control system of the component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is a block diagram illustrating the configuration of the embodiment of the present invention. FIG. 6 and FIG. 7 are process explanatory diagrams of a component mounting method according to an embodiment of the present invention.
まず図１を参照して、部品実装装置の構造を説明する。図１において、Ｘ軸テーブル１Ｘ，Ｙ軸テーブル１Ｙを積層した構成の移動テーブル１上には、保持プレート２が装着されている。保持プレート２の上面には、部品供給部３および基板保持部４が配設されている。移動テーブル１を駆動することにより、部品供給部３および基板保持部４は水平移動する。部品供給部３はトレイ保持部３ａを備えており、トレイ保持部３ａ上には複数の電子部品６（部品）を収納した部品トレイ５が保持される。基板保持部４は保持テーブル４ａを備えており、保持テーブル４ａ上には電子部品６が実装される基板１０が保持されている。 First, the structure of the component mounting apparatus will be described with reference to FIG. In FIG. 1, a holding plate 2 is mounted on a moving table 1 having a configuration in which an X-axis table 1X and a Y-axis table 1Y are stacked. On the upper surface of the holding plate 2, a component supply unit 3 and a substrate holding unit 4 are disposed. By driving the moving table 1, the component supply unit 3 and the substrate holding unit 4 move horizontally. The component supply unit 3 includes a tray holding unit 3a, and a component tray 5 storing a plurality of electronic components 6 (components) is held on the tray holding unit 3a. The substrate holding unit 4 includes a holding table 4a, and a substrate 10 on which the electronic component 6 is mounted is held on the holding table 4a.
移動テーブル１の上方には、縦フレーム１１によって両端を支持されたテーブル機構１２が水平方向に架設されている。テーブル機構１２には、昇降機構１４を備えた実装ヘッド１３が水平移動自在に装着されている。実装ヘッド１３は電子部品６を保持する部品保持ノズル１３ａを備えており、昇降機構１４および水平移動機構（図示省略）より成る実装ヘッド移動機構１５によって、部品供給部３および基板保持部４に対して相対的に移動する。 Above the movable table 1, a table mechanism 12 supported at both ends by a vertical frame 11 is installed in the horizontal direction. A mounting head 13 having a lifting mechanism 14 is mounted on the table mechanism 12 so as to be movable horizontally. The mounting head 13 includes a component holding nozzle 13 a that holds the electronic component 6, and is mounted on the component supply unit 3 and the substrate holding unit 4 by a mounting head moving mechanism 15 including an elevating mechanism 14 and a horizontal moving mechanism (not shown). Move relatively.
これにより、実装ヘッド１３は部品供給部３から電子部品６を取り出し、基板保持部４に保持された基板１０に実装する。実装ヘッド１３は加熱手段を内蔵しており、電子部品６の基板１０への実装に際しては、実装ヘッド１３が部品保持ノズル１３ａを介して電子部品６を加熱することにより、電子部品６は熱圧着などの方法（例えば半田接合）によって、基板１０に実装される。なお、採用する接合工法によっては、電子部品６を加熱する必要がない場合もあり、この場合には、実装ヘッド１３に加熱手段を内蔵する必要はない。 As a result, the mounting head 13 takes out the electronic component 6 from the component supply unit 3 and mounts it on the substrate 10 held by the substrate holding unit 4. The mounting head 13 has a built-in heating means. When the electronic component 6 is mounted on the substrate 10, the mounting head 13 heats the electronic component 6 via the component holding nozzle 13a, so that the electronic component 6 is thermocompression bonded. It is mounted on the substrate 10 by a method such as soldering. Depending on the joining method employed, there is a case where it is not necessary to heat the electronic component 6. In this case, it is not necessary to incorporate heating means in the mounting head 13.
部品供給部３の上方には、水平なノズル交換テーブル１６ａ上に複数種類の部品保持ノズル１３ａを保持させた構成のノズル交換部１６が配設されている。ノズル交換テーブル１６ａは、ノズル交換テーブル移動機構１７によって昇降・水平移動可能となっており、実装ヘッド１３がノズル交換テーブル１６ａに対してアクセスすることにより、実装ヘッド１３に装着された既装着の部品保持ノズル１３ａと、ノズル交換テーブル１６ａに保持された部品保持ノズル１３ａとを交換することができる。 Above the component supply unit 3, a nozzle replacement unit 16 configured to hold a plurality of types of component holding nozzles 13a on a horizontal nozzle replacement table 16a is disposed. The nozzle replacement table 16a can be moved up and down and horizontally moved by the nozzle replacement table moving mechanism 17, and the mounted component mounted on the mounting head 13 when the mounting head 13 accesses the nozzle replacement table 16a. The holding nozzle 13a and the component holding nozzle 13a held on the nozzle exchange table 16a can be exchanged.
テーブル機構１２には、昇降機構１９を備えた塗布ヘッド１８が水平移動自在に装着されている。塗布ヘッド１８は樹脂接着剤（樹脂）を塗布するための塗布ニードル１８ａを下端部に備えており、昇降機構１９および水平移動機構（図示省略）より成る塗布ヘッド移動機構２０によって、基板保持部４に対して相対的に移動する。これにより、実装ヘッド１３による電子部品６の実装に先だって、基板１０もしくは既実装の電子部品に部品固定用の樹脂接着剤を塗布する。そして実装動作においては、加熱手段を備えた実装ヘッド１３によって電子部品６を加熱することにより、バンプの電極への接合と樹脂接着剤の硬化とが並行して進行し電子部品６の実装が完了する。 The table mechanism 12 is provided with a coating head 18 provided with an elevating mechanism 19 so as to be horizontally movable. The coating head 18 includes a coating needle 18a for coating a resin adhesive (resin) at the lower end, and the substrate holding unit 4 is moved by the coating head moving mechanism 20 including a lifting mechanism 19 and a horizontal movement mechanism (not shown). Move relative to. Thereby, prior to mounting the electronic component 6 by the mounting head 13, the resin adhesive for fixing the component is applied to the substrate 10 or the already mounted electronic component. In the mounting operation, the electronic component 6 is heated by the mounting head 13 provided with heating means, so that the bonding of the bump to the electrode and the curing of the resin adhesive proceed in parallel, and the mounting of the electronic component 6 is completed. To do.
基板保持部４の斜め上方には、撮像部２１が配設されている。撮像部２１はカメラ２３をカメラ移動機構２２によって水平方向に進退させ、さらに昇降させる構成となっている。カメラ２３を基板保持部４に保持された基板１０の上方に進出させて撮像することにより、基板１０における部品搭載位置、さらには既実装の電子部品の上面の部品搭載位置を認識することができる。 An imaging unit 21 is disposed obliquely above the substrate holding unit 4. The imaging unit 21 has a configuration in which the camera 23 is moved back and forth in the horizontal direction by the camera moving mechanism 22 and further moved up and down. By moving the camera 23 above the substrate 10 held by the substrate holding unit 4 and taking an image, it is possible to recognize the component mounting position on the substrate 10 and further the component mounting position on the upper surface of the already mounted electronic component. .
次に、図２を参照して、実装対象となる基板１０について説明する。図２（ａ）に示すように、基板１０には電子部品が単体で実装される通常部品実装位置１０ｃと、複数の部品積層位置１０ａが集合した部品積層区画１０ｂが複数設けられている。部品積層位置１０ａには、複数の電子部品６が積層して実装される。図２（ｂ）は１つの部品積層区画１０ｂにおける基板１０の断面を示しており、基板１０には各部品積層位置１０ａ毎に電子部品接続用の電極３０が形成されている。すなわち、この部品実装装置は、基板１０に設けられた部品積層区画１０ｂ内の複数の部品積層位置１０ａに、電子部品６を階層毎に順次積層して実装する機能を有している。 Next, the substrate 10 to be mounted will be described with reference to FIG. As shown in FIG. 2A, the substrate 10 is provided with a plurality of normal component mounting positions 10c where electronic components are mounted alone and a plurality of component stacking sections 10b in which a plurality of component stacking positions 10a are gathered. A plurality of electronic components 6 are stacked and mounted at the component stacking position 10a. FIG. 2B shows a cross section of the substrate 10 in one component stacking section 10b, and an electrode 30 for connecting electronic components is formed on the substrate 10 at each component stacking position 10a. That is, this component mounting apparatus has a function of sequentially stacking and mounting the electronic components 6 for each layer at a plurality of component stacking positions 10 a in a component stacking section 10 b provided on the substrate 10.
各部品積層位置１０ａには、図３に示すように、第１の電子部品６Ａ，第２の電子部品６Ｂが積層して実装される。第１の電子部品６Ａ，第２の電子部品６Ｂには、それぞれ下面にバンプ３１、バンプ３３が、上面に電極３２、電極３４が設けられており、部品供給部３において部品トレイ５に収納された状態で供給される。第１の電子部品６Ａ、第２の電子部品６Ｂを積層して実装するスタック実装においては、基板１０にはまず第１階層の第１の電子部品６Ａがバンプ３１を電極３０に接合することにより実装され、さらに第１の電子部品６Ａの上面の電極３２にバンプ３３を接合することにより、第２の電子部品６Ｂが第１の電子部品６Ａ上に実装される。 As shown in FIG. 3, a first electronic component 6A and a second electronic component 6B are stacked and mounted at each component stacking position 10a. The first electronic component 6A and the second electronic component 6B are each provided with a bump 31 and a bump 33 on the lower surface, and an electrode 32 and an electrode 34 on the upper surface, respectively. Supplied in a dry state. In the stack mounting in which the first electronic component 6A and the second electronic component 6B are stacked and mounted, the first electronic component 6A in the first layer first bonds the bump 31 to the electrode 30 on the substrate 10. The second electronic component 6B is mounted on the first electronic component 6A by bonding the bump 33 to the electrode 32 on the upper surface of the first electronic component 6A.
次に図４を参照して制御系の構成を説明する。図４において、制御部４０はＣＰＵを備えた演算装置であり、記憶部４１に格納された処理プログラムやデータを用いて、以下に説明する各部を制御する。記憶部４１には、一般の部品実装装置の機能を実行するためのプログラム・データの他、基板１０を対象としてスタック実装を実行するための部品積層プログラム４１ａ、部品積層データ４１ｂが格納されている。 Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, a control unit 40 is an arithmetic device including a CPU, and controls each unit described below using a processing program and data stored in the storage unit 41. The storage unit 41 stores, in addition to program data for executing functions of a general component mounting apparatus, a component stacking program 41a and component stacking data 41b for executing stack mounting for the board 10. .
部品積層データ４１ｂには、基板１０における部品積層位置１０ａの配置を示す部品積層位置データや、複数の部品積層位置を対象とする場合の部品搭載順序を示すシーケンスデータ、各階層における部品実装高さを示す実装高さデータなどが含まれる。すなわち、制御部４０が部品積層データ４１ｂを用いて部品積層プログラム４１ａを実行することによって実現される機能は、実装ヘッド移動機構１５を制御することにより複数の部品積層位置１０ａに第１階層から最終階層までの部品を順次積層して実装する部品積層制御部となっている。 The component stacking data 41b includes component stacking position data indicating the arrangement of the component stacking positions 10a on the substrate 10, sequence data indicating the component mounting order when targeting a plurality of component stacking positions, and the component mounting height in each layer. Mounting height data etc. are included. That is, the function realized by the control unit 40 executing the component stacking program 41a using the component stacking data 41b is controlled from the first layer to the plurality of component stacking positions 10a by controlling the mounting head moving mechanism 15. The component stacking control unit is configured to sequentially stack and mount components up to the hierarchy.
認識処理部４２は、カメラ２３による撮像結果を認識処理する。これにより、基板１０が基板保持部４に保持された状態において、基板１０を撮像した撮像データを認識処理部
４２によって認識処理することにより、各部品積層位置１０ａ毎に電極３０の位置を認識することができる。さらに基板１０に第１の電子部品６Ａが実装された状態において、カメラ２３によって部品積層位置１０ａを撮像した撮像データを認識処理部４２によって認識処理することにより、各部品積層位置１０ａ毎に第１の電子部品６Ａの電極３２の位置を認識することができる。したがって、カメラ２３および認識処理部４２は、基板１０もしくは既実装の電子部品において次の階層の電子部品が搭載される部品搭載位置を認識する認識手段となっている。
The recognition processing unit 42 performs recognition processing on the imaging result obtained by the camera 23. As a result, in the state where the substrate 10 is held by the substrate holding unit 4, the recognition processing unit 42 recognizes the imaging data obtained by imaging the substrate 10, thereby recognizing the position of the electrode 30 for each component stacking position 10 a. be able to. Furthermore, in a state where the first electronic component 6A is mounted on the substrate 10, the imaging data obtained by imaging the component stacking position 10a by the camera 23 is subjected to recognition processing by the recognition processing unit 42, whereby the first stacking position 10a is obtained for each component stacking position 10a. The position of the electrode 32 of the electronic component 6A can be recognized. Therefore, the camera 23 and the recognition processing unit 42 serve as recognition means for recognizing a component mounting position where an electronic component of the next layer is mounted on the substrate 10 or an already mounted electronic component.
実装駆動部４３は、制御部４０によって制御され、実装ヘッド１３、実装ヘッド移動機構１５を駆動する。これにより、電子部品６を部品供給部３から取り出して基板１０に実装するスタック実装動作が実行される。このとき、上述の認識手段による位置認識結果が参照される。塗布駆動部４４は制御部４０によって制御され、塗布ヘッド１８、塗布ヘッド移動機構２０を駆動する。これにより、基板１０の各部品積層位置１０ａまたは既実装の電子部品６の上面の部品搭載位置へ部品接着用の樹脂接着剤を塗布する樹脂塗布動作が実行される。すなわち、塗布ヘッド１８、塗布ヘッド移動機構２０は、部品搭載位置に樹脂を塗布する樹脂塗布手段となっている。 The mounting drive unit 43 is controlled by the control unit 40 and drives the mounting head 13 and the mounting head moving mechanism 15. As a result, a stack mounting operation for taking out the electronic component 6 from the component supply unit 3 and mounting it on the substrate 10 is executed. At this time, the position recognition result by the above-mentioned recognition means is referred. The application driving unit 44 is controlled by the control unit 40 and drives the application head 18 and the application head moving mechanism 20. As a result, a resin application operation for applying the resin adhesive for component adhesion to each component stacking position 10a of the substrate 10 or the component mounting position on the upper surface of the mounted electronic component 6 is executed. That is, the coating head 18 and the coating head moving mechanism 20 are resin coating means for coating the resin at the component mounting position.
撮像駆動部４５は制御部４０によって制御され、カメラ移動機構２２を駆動する。これにより、カメラ２３を基板１０上へ移動させて撮像視野を認識対象に合わせる視野移動とともに、認識対象面の高さに応じてカメラ２３を昇降させてカメラ２３の焦点を撮像対象面に合わせる合焦動作が行われる。なお、カメラ２３を昇降させる代わりに、基板保持部４を昇降させるような機構を設けてもよい。 The imaging drive unit 45 is controlled by the control unit 40 and drives the camera moving mechanism 22. Accordingly, the camera 23 is moved onto the substrate 10 to move the field of view to match the imaging field of view with the recognition target, and the camera 23 is moved up and down according to the height of the recognition target surface to adjust the focus of the camera 23 to the imaging target surface. A focusing operation is performed. Instead of raising and lowering the camera 23, a mechanism for raising and lowering the substrate holding unit 4 may be provided.
ノズル交換駆動部４６は制御部４０によって制御され、ノズル交換テーブル移動機構１７を駆動する。これにより、実装ヘッド１３に装着された既装着の部品保持ノズル１３ａを、ノズル交換テーブル１６ａ上に収納された交換用の部品保持ノズル１３ａと交換可能となっており、階層毎に異種の電子部品を実装対象とする必要がある場合には、部品保持ノズル１３ａを部品種類に応じて交換できる。すなわち、ノズル交換駆動部４６、ノズル交換テーブル移動機構１７、ノズル交換部１６は、実装ヘッド１３において部品保持ノズル１３ａを、保持対象とする部品に応じて交換するノズル交換手段となっている。 The nozzle replacement drive unit 46 is controlled by the control unit 40 and drives the nozzle replacement table moving mechanism 17. As a result, the already-mounted component holding nozzle 13a mounted on the mounting head 13 can be replaced with a replacement component holding nozzle 13a stored on the nozzle replacement table 16a. Can be replaced according to the component type. That is, the nozzle replacement drive unit 46, the nozzle replacement table moving mechanism 17, and the nozzle replacement unit 16 serve as nozzle replacement means for replacing the component holding nozzle 13a in the mounting head 13 according to the component to be held.
この部品実装装置は上記のように構成されており、以下この部品実装装置によって実行されるスタック実装について、図５のフローに則して、図６，図７を参照して説明する。図５において、スタック実装が開始されると、まず記憶部４１から部品積層データ４１ｂを読み込む（ＳＴ１）。次いで、基板１０を搬入して基板保持部４に保持させる（ＳＴ２）。そして部品積層データ４１ｂのシーケンスデータを参照して、予め指定された最初の部品積層区画１０ｂを対象としてスタック実装が開始される。ここでは、実装ヘッド１３が既実装部品を回避するために余分な昇降動作を行う必要がないよう、部品供給部３から最も隔てられた位置にある部品積層区画１０ｂから順にスタック実装を開始するようにシーケンスデータが作成される。 This component mounting apparatus is configured as described above. Hereinafter, stack mounting executed by this component mounting apparatus will be described with reference to FIGS. 6 and 7 in accordance with the flow of FIG. In FIG. 5, when stack mounting is started, first, component stacking data 41b is read from the storage unit 41 (ST1). Next, the substrate 10 is loaded and held by the substrate holding unit 4 (ST2). Then, referring to the sequence data of the component stacking data 41b, stack mounting is started for the first component stacking section 10b designated in advance. Here, stack mounting is started in order from the component stacking section 10b that is located farthest from the component supply unit 3 so that the mounting head 13 does not need to perform an extra lifting operation to avoid the mounted components. The sequence data is created.
まず、この最初の部品積層区画１０ｂを対象とした第１階層の部品実装動作が実行される。すなわち図６（ａ）に示すように、当該部品積層区画１０ｂ内の複数の部品積層位置１０ａのうち、シーケンスデータによって指定される最初の部品積層位置１０ａへカメラ２３を移動させて、部品搭載位置（ここでは基板１０表面の電極３０形成位置）を認識する（ＳＴ３）。なお、基板１０上に設けられた認識マークを認識してもよい。 First, the first level component mounting operation for the first component stacking section 10b is executed. That is, as shown in FIG. 6A, the camera 23 is moved to the first component stacking position 10a specified by the sequence data among the plurality of component stacking positions 10a in the component stacking section 10b, and the component mounting position (Here, the position where the electrode 30 is formed on the surface of the substrate 10) is recognized (ST3). A recognition mark provided on the substrate 10 may be recognized.
次いで図６（ｂ）に示すように、塗布ニードル１８ａをこの部品積層位置１０ａへ移動させて、部品搭載位置へ樹脂３５を塗布する（ＳＴ４）。そして（ＳＴ３）の認識結果に基づいて実装ヘッド１３を移動させ、図６（ｃ）に示すように、樹脂塗布後の部品搭載位
置へ部品保持ノズル１３ａに保持された第１の電子部品６Ａを加熱実装する（ＳＴ５）。この加熱実装においては、実装ヘッド１３によって第１の電子部品６Ａを加熱しながら基板１０に押しつける状態を所定時間保持する。この後、当該部品積層位置１０ａに実装された電子部品が最終階層であるか否かを判断する（ＳＴ６）。ここでＮＯであれば次の階層を対象とした部品実装動作に移行し（ＳＴ７）、以後（ＳＴ３）〜（ＳＴ５）の各ステップを実行する。
Next, as shown in FIG. 6B, the application needle 18a is moved to the component stacking position 10a to apply the resin 35 to the component mounting position (ST4). Then, the mounting head 13 is moved based on the recognition result of (ST3), and as shown in FIG. 6C, the first electronic component 6A held by the component holding nozzle 13a is moved to the component mounting position after resin application. Heat mounting is performed (ST5). In this heat mounting, the state in which the first electronic component 6A is pressed against the substrate 10 while being heated by the mounting head 13 is held for a predetermined time. Thereafter, it is determined whether or not the electronic component mounted at the component stacking position 10a is the last layer (ST6). If “NO” here, the process shifts to a component mounting operation for the next layer (ST7), and thereafter the steps (ST3) to (ST5) are executed.
すなわち、図６（ｄ）に示すように、当該部品積層位置１０ａに既に実装された第１の電子部品６Ａの上方にカメラ２３を移動させ、部品搭載位置（ここでは第１の電子部品６Ａの上面の電極３２形成位置）を認識する（ＳＴ３）。なお、第１の電子部品６Ａの上面に設けられた認識マークを認識してもよい。次いで、図７（ａ）に示すように、塗布ニードル１８ａを第１の電子部品６Ａの上方に移動させて、部品搭載位置へ樹脂３５を塗布する（ＳＴ４）。そして（ＳＴ３）の認識結果に基づいて実装ヘッド１３を移動させ、図７（ｂ）に示すように、樹脂塗布後の部品搭載位置へ部品保持ツール１３ａに保持された第２の電子部品６Ｂを加熱実装する（ＳＴ５）。 That is, as shown in FIG. 6D, the camera 23 is moved above the first electronic component 6A already mounted at the component stacking position 10a, and the component mounting position (here, the first electronic component 6A The position of the upper electrode 32 is recognized (ST3). Note that a recognition mark provided on the upper surface of the first electronic component 6A may be recognized. Next, as shown in FIG. 7A, the application needle 18a is moved above the first electronic component 6A to apply the resin 35 to the component mounting position (ST4). Then, the mounting head 13 is moved based on the recognition result of (ST3), and as shown in FIG. 7B, the second electronic component 6B held by the component holding tool 13a is moved to the component mounting position after resin application. Heat mounting is performed (ST5).
この後（ＳＴ６）において、当該部品積層位置１０ａに実装された電子部品が最終階層であり、この部品積層位置１０ａにおけるスタック実装が完了したと判断されたならば、この部品積層位置１０ａが当該部品積層区画１０ｂ内で最後の部品積層位置であるか否かを判断する（ＳＴ８）。ここでＮＯであれば次の部品積層位置へ移行し（ＳＴ９）、以後（ＳＴ３）〜（ＳＴ６）の各ステップを反復して実行する。すなわち、図７（ｃ）に示すように、同一部品積層区画内の隣接した部品実装位置１０ａ毎に、第１の電子部品６Ａ、第２の電子部品６Ｂを順次積層して実装する。これにより、図７（ｄ）に示すように、当該部品積層区画１０ｂを対象としたスタック実装が完了する。このスタック実装においては、前述のように部品供給部３から隔たった位置からスタック実装を開始するようにしていることから、既実装部品が実装ヘッド１３による部品移送搭載動作の妨げとなることがない。 After this (ST6), if it is determined that the electronic component mounted at the component stacking position 10a is the last layer and the stack mounting at the component stacking position 10a is completed, the component stacking position 10a becomes the component stacking position. It is determined whether or not it is the last component stacking position in the stacking section 10b (ST8). If “NO” here, the process proceeds to the next component stacking position (ST9), and thereafter the steps (ST3) to (ST6) are repeatedly executed. That is, as shown in FIG. 7C, the first electronic component 6A and the second electronic component 6B are sequentially stacked and mounted at each adjacent component mounting position 10a in the same component stacking section. Thereby, as shown in FIG. 7D, the stack mounting for the component stacking section 10b is completed. In this stack mounting, since the stack mounting is started from the position separated from the component supply unit 3 as described above, the already mounted components do not interfere with the component transfer mounting operation by the mounting head 13. .
次いで上述のスタック実装が行われた部品積層区画１０ｂが、当該基板１０で最終の部品積層区画１０ｂであるか否かを判断する（ＳＴ１０）。ここで、ＮＯであるならば、次の部品積層区画１０ｂを対象としたスタック実装動作が行われる。すなわち、（ＳＴ３）〜（ＳＴ９）までの作業動作が当該部品積層区画１０ｂを対象として反復実行される。そして（ＳＴ１０）において、当該部品積層区画１０ｂが当該基板１０で最後の部品積層区画１０ｂであると判断されたならば、この基板１０を対象としたスタック実装動作を終了する。 Next, it is determined whether or not the component stacking section 10b on which the above-described stack mounting is performed is the final component stacking section 10b on the board 10 (ST10). Here, if NO, the stack mounting operation for the next component stacking section 10b is performed. That is, the work operations from (ST3) to (ST9) are repeatedly executed for the component stacking section 10b. In (ST10), if it is determined that the component stacking section 10b is the last component stacking section 10b in the board 10, the stack mounting operation for the board 10 is ended.
すなわち上述の部品実装方法におけるスタック実装動作は、部品積層区画１０ｂ内において一の部品積層位置１０ａにおいて第１階層から最終階層までの部品を対象とした一連の部品実装動作が完了した後に、当該一の部品積層位置１０ａの次の部品積層位置１０ａを対象とした部品実装動作を開始するよう、実装ヘッド移動機構１５を制御する構成を採用している。これにより、１つの部品積層位置１０ａでのスタック実装において、１つの階層を対象とした部品実装動作と、次の階層を対象とした部品実装動作との間に大きなタイムラグが生じない。したがって、実装ヘッド１３によって電子部品を加熱しながら熱圧着によって実装する加熱実装において、１つの階層の電子部品の温度が低下する前に次の階層の電子部品の実装動作を開始することができることから、加熱所要時間を短縮して効率的な実装作業が実現される。また、電子部品６の加熱と自然冷却が繰り返されることによる電子部品６へのダメージを極力軽減することができる。 That is, the stack mounting operation in the above-described component mounting method is performed after a series of component mounting operations for components from the first layer to the last layer are completed at one component stacking position 10a in the component stacking section 10b. A configuration is adopted in which the mounting head moving mechanism 15 is controlled so as to start the component mounting operation for the component stacking position 10a next to the component stacking position 10a. Thereby, in stack mounting at one component stacking position 10a, a large time lag does not occur between the component mounting operation for one layer and the component mounting operation for the next layer. Therefore, in the heat mounting in which the electronic component is mounted by thermocompression bonding while heating the electronic component by the mounting head 13, the mounting operation of the electronic component of the next layer can be started before the temperature of the electronic component of one layer is lowered. The time required for heating is shortened, and an efficient mounting operation is realized. Moreover, the damage to the electronic component 6 by repeating heating and natural cooling of the electronic component 6 can be reduced as much as possible.
そしてスタック実装における部品実装動作は、部品搭載動作に加えて、認識手段によって部品搭載位置を認識する認識動作と、樹脂塗布手段によって部品搭載位置に樹脂を塗布
する樹脂塗布動作と、ノズル交換手段によって部品保持ノズルを次の階層の部品に応じて交換するノズル交換動作のうちの少なくともいずれかを含む形態となっている。ここで樹脂塗布動作を実行する場合において、上述のような実装動作順序を採用することにより、樹脂塗布後に直ちに電子部品を実装することができる。したがって樹脂塗布後にタイムラグをおいて電子部品を実装する場合に生じやすい実装品質の低下、すなわち樹脂がある時間以上大気暴露されることによる樹脂の変質に起因する接合不良を招くことなく、高い実装品質を確保することができる。
In addition to the component mounting operation, the component mounting operation in stack mounting includes a recognition operation for recognizing the component mounting position by the recognition unit, a resin coating operation for applying resin to the component mounting position by the resin coating unit, and a nozzle replacement unit. It has a form including at least one of nozzle replacement operations in which the component holding nozzle is replaced in accordance with the component in the next hierarchy. Here, when the resin coating operation is executed, the electronic component can be mounted immediately after the resin coating by adopting the mounting operation sequence as described above. Therefore, high mounting quality without incurring poor bonding quality due to deterioration of mounting quality that tends to occur when electronic components are mounted with a time lag after resin application, that is, resin deterioration due to exposure to the air for a certain period of time or longer. Can be secured.
さらに、１つの部品積層位置１０ａ毎にスタック実装を完了させる方式を採用することにより、製品歩留まり向上の面で次のような利点がある。すなわち、１つの階層についての部品実装動作が完了した後に次の階層についての部品実装動作を行う方式においては、樹脂塗布実行後に装置停止となりそのまま時間が経過する事態が発生した場合には、多くの電子部品が樹脂塗布状態のまま不良部品として廃棄される。これに対し、本実施の形態においては、１つの部品積層位置１０ａ毎にスタック実装を完了させることから、実装作業中に部品実装装置が何らかの原因によって停止したような場合にあっても、スタック実装作業が未完であることにより不良とされる部品個数を最小限に抑えることができる。 Furthermore, by adopting a method of completing stack mounting for each component stacking position 10a, there are the following advantages in terms of improving the product yield. That is, in the method of performing the component mounting operation for the next layer after the component mounting operation for one layer is completed, there are many cases where a situation occurs in which the device is stopped after the resin coating is performed and the time passes as it is. Electronic parts are discarded as defective parts in a resin-coated state. On the other hand, in the present embodiment, stack mounting is completed for each component stacking position 10a. Therefore, even if the component mounting apparatus stops for some reason during the mounting operation, stack mounting is performed. It is possible to minimize the number of parts regarded as defective due to incomplete work.
なお上記実施例においては、基板に設けられた複数の部品積層位置を対象としてスタック実装を行う例を示しているが、本発明はこれに限定されるものではなく、部品積層対象となるワークは、複数の個片基板が作り込まれた半導体ウェハや、複数の単位基板をキャリアに保持させた基板集合体を対象とする場合においても、本発明を適用することができる。 In the above embodiment, an example in which stack mounting is performed for a plurality of component stacking positions provided on a substrate is shown, but the present invention is not limited to this, and a workpiece that is a component stacking target is The present invention can also be applied to a semiconductor wafer in which a plurality of individual substrates are formed or a substrate assembly in which a plurality of unit substrates are held by a carrier.
本発明の部品実装装置および部品実装方法は、スタック実装のため３次元部品実装動作を効率よく行うことができるという効果を有し、基板に設けられた複数の部品積層位置に部品を階層毎に順次積層して実装する用途に利用可能である。 The component mounting apparatus and the component mounting method according to the present invention have an effect that a three-dimensional component mounting operation can be efficiently performed for stack mounting, and components are arranged at a plurality of component stacking positions provided on the board for each layer. It can be used for applications that are sequentially stacked and mounted.
３ 部品供給部
４ 基板保持部
６ 電子部品
６Ａ 第１の電子部品
６Ｂ 第２の電子部品
１０ 基板
１０ａ 部品積層位置
１０ｂ 部品積層区画
１３ 実装ヘッド
１３ａ 部品保持ノズル
１６ ノズル交換部
１８ 塗布ヘッド
１８ａ 塗布ニードル
２１ 撮像部
DESCRIPTION OF SYMBOLS 3 Component supply part 4 Board | substrate holding | maintenance part 6 Electronic component 6A 1st electronic component 6B 2nd electronic component 10 Board | substrate 10a Component lamination position 10b Component lamination | stacking division 13 Mounting head 13a Component holding nozzle 16 Nozzle exchange part 18 Application | coating head 18a Application needle 21 Imaging unit
Claims (6)
前記基板を保持する基板保持部と、前記部品を部品保持ノズルによって保持する実装ヘッドと、前記実装ヘッドを前記基板保持部に対して相対的に移動させる実装ヘッド移動機構と、前記実装ヘッド移動機構を制御することにより前記複数の部品積層位置に第１階層から最終階層までの部品を順次積層して実装する部品積層制御部とを備え、
前記部品積層制御部は、一の部品積層位置において第１階層から最終階層までの部品を対象とした部品実装動作が完了した後に、前記一の部品積層位置の次の部品積層位置を対象とした部品実装動作を開始するように、前記実装ヘッド移動機構を制御することを特徴とする部品実装装置。 A component mounting apparatus that sequentially stacks and mounts components for each layer at a component stacking position provided on a board,
A substrate holding portion for holding the substrate; a mounting head for holding the component by a component holding nozzle; a mounting head moving mechanism for moving the mounting head relative to the substrate holding portion; and the mounting head moving mechanism. A component stacking control unit for sequentially stacking and mounting components from the first layer to the last layer at the plurality of component stacking positions by controlling
The component stacking control unit targets a component stacking position next to the one component stacking position after completing a component mounting operation for components from the first layer to the last layer at one component stacking position. A component mounting apparatus that controls the mounting head moving mechanism so as to start a component mounting operation.
前記部品実装動作は、前記部品搭載位置に部品を搭載する部品搭載動作に加えて、前記部品搭載位置を認識する認識動作と、前記部品搭載位置に樹脂を塗布する樹脂塗布動作と、前記部品保持ノズルを次の階層の部品に応じて交換するノズル交換動作のうちの少なくともいずれかを含むことを特徴とする請求項１または２記載の部品実装装置。 Recognizing means for recognizing a component mounting position where a component of the next layer is mounted on the substrate or the already mounted component, resin applying means for applying resin to the component mounting position, and the component holding nozzle in the mounting head Comprising at least one of nozzle replacement means for replacement according to the part to be held;
In addition to the component mounting operation for mounting a component at the component mounting position, the component mounting operation includes a recognition operation for recognizing the component mounting position, a resin application operation for applying resin to the component mounting position, and the component holding 3. The component mounting apparatus according to claim 1, comprising at least one of nozzle replacement operations for replacing the nozzle in accordance with a component in the next hierarchy.
前記部品を部品保持ノズルによって保持した実装ヘッドを基板保持部に保持された前記基板に対して相対的に移動させ、前記部品積層位置に第１階層から最終階層までの部品を順次積層して実装する部品積層作業において、一の部品積層位置において第１階層から最終階層までの部品を対象とした部品実装動作が完了した後に、前記一の部品積層位置の次の部品積層位置を対象とした部品実装動作を開始することを特徴とする部品実装方法。 A component mounting method for sequentially stacking and mounting components at each component stacking position provided on a board,
The mounting head that holds the component by the component holding nozzle is moved relative to the substrate held by the substrate holding unit, and the components from the first layer to the last layer are sequentially stacked and mounted at the component stacking position. In the component stacking operation to be performed, after the component mounting operation for the components from the first layer to the last layer is completed at one component stacking position, the component targeting the component stacking position next to the one component stacking position A component mounting method characterized by starting a mounting operation.
The component mounting operation includes a recognition operation for recognizing the component mounting position in addition to a component mounting operation for mounting a component at a component mounting position where a component of the next layer is mounted on the substrate or the already mounted component, 6. The method according to claim 4, comprising at least one of a resin application operation for applying a resin to a component mounting position and a nozzle replacement operation for replacing the component holding nozzle in accordance with a component in a next hierarchy. Component mounting method.
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